[go: up one dir, main page]

CN115113344A - Contactless connector and assembly thereof - Google Patents

Contactless connector and assembly thereof Download PDF

Info

Publication number
CN115113344A
CN115113344A CN202110291407.4A CN202110291407A CN115113344A CN 115113344 A CN115113344 A CN 115113344A CN 202110291407 A CN202110291407 A CN 202110291407A CN 115113344 A CN115113344 A CN 115113344A
Authority
CN
China
Prior art keywords
light
contactless connector
circuit board
contactless
receiver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110291407.4A
Other languages
Chinese (zh)
Inventor
徐海军
林东楼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Kunshan Computer Connector Co Ltd
Foxconn Interconnect Technology Ltd
Original Assignee
Foxconn Kunshan Computer Connector Co Ltd
Foxconn Interconnect Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Kunshan Computer Connector Co Ltd, Foxconn Interconnect Technology Ltd filed Critical Foxconn Kunshan Computer Connector Co Ltd
Priority to CN202110291407.4A priority Critical patent/CN115113344A/en
Priority to JP2022040660A priority patent/JP2022145624A/en
Priority to US17/696,666 priority patent/US12136953B2/en
Priority to TW111109812A priority patent/TW202243426A/en
Publication of CN115113344A publication Critical patent/CN115113344A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/3897—Connectors fixed to housings, casing, frames or circuit boards
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/30—Collimators
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/11—Arrangements specific to free-space transmission, i.e. transmission through air or vacuum
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/50—Transmitters
    • H04B10/501—Structural aspects
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
    • H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
    • H04B10/803—Free space interconnects, e.g. between circuit boards or chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/07—Hall effect devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/07—Hall effect devices
    • G01R33/072—Constructional adaptation of the sensor to specific applications
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/3873—Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls
    • G02B6/3886—Magnetic means to align ferrule ends
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Optical Communication System (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The invention relates to a contactless connector which can be matched with another contactless connector to transmit signals, and the contactless connector comprises a circuit board, a light receiver which is arranged on the circuit board and can convert electric signals into light signal light emitters or convert light signals into electric signals, a light emitter control chip which is arranged on the circuit board and controls the light emitters to work or an amplifier chip which amplifies the electric signals, and a light-transmitting piece which at least partially coats the circuit board, the light emitters or the light receivers and the light emitter control chip or the amplifier chip.

Description

无接触式连接器及其组件Contactless connectors and their components

【技术领域】【Technical field】

本发明有关一种无接触式连接器及其组件，尤指一种可藉由光学传输来实现信号传输的无接触式连接器及其组件。The present invention relates to a contactless connector and its components, in particular to a contactless connector and its components that can realize signal transmission through optical transmission.

【背景技术】【Background technique】

传统设计的两个连接器之间信号的传输通常是通过电路板上的导电路径或金属线缆或两个连接器之间的端子的相互接触配合来实现。电路板上的导电路径和金属电缆对于高速高频信号传输具有其自身的限制。当高速信号速率越来越高时，高速电信号在电路板和电缆中的损耗也越大，端子间的相互接触也会导致端子之间产生磨损，造成接触不良。The transmission of signals between two connectors of traditional design is usually realized by the conductive paths or metal cables on the circuit board or the mutual contact and mating of the terminals between the two connectors. Conductive paths and metal cables on circuit boards have their own limitations for high-speed, high-frequency signal transmission. When the high-speed signal rate is getting higher and higher, the loss of the high-speed electrical signal in the circuit board and cable is also greater, and the mutual contact between the terminals will also cause wear between the terminals, resulting in poor contact.

所以，有必要提供一种新的无接触连接器，其不通过电路板上的导电路径或线缆或相互接触配合的导电端子传递信号。Therefore, it is necessary to provide a new contactless connector that does not transmit signals through conductive paths or cables on a circuit board or conductive terminals that are in contact with each other.

【发明内容】[Content of the invention]

本发明的主要目的在于：提供一种无接触式连接器其通过光信号传输来实现信号的传输。The main purpose of the present invention is to provide a contactless connector which realizes signal transmission through optical signal transmission.

为解决以上技术问题，本发明采用如下技术方案：一种无接触式连接器，其可与另一无接触式连接器相互配合以传输信号，所述无接触式连接器包括电路板、设置在所述电路板上的可将电信号转换为光信号光发射器或可将光信号转换成电性号的光接收器、设置在所述电路板上的控制所述光发射器工作的光发射器控制芯片或放大所述电信号的放大器芯片及至少部分包覆所述电路板、所述光发射器或所述光接收器及所述光发射器控制芯片或所述放大器芯片的透光件。In order to solve the above technical problems, the present invention adopts the following technical solutions: a contactless connector, which can cooperate with another contactless connector to transmit signals, and the contactless connector includes a circuit board, a an optical transmitter on the circuit board that can convert an electrical signal into an optical signal or an optical receiver that can convert an optical signal into an electrical signal, and an optical transmitter disposed on the circuit board to control the operation of the optical transmitter a controller control chip or an amplifier chip that amplifies the electrical signal, and a light-transmitting member at least partially covering the circuit board, the light transmitter or the light receiver, and the light transmitter control chip or the amplifier chip .

本发明的另一主要目的在于：提供一种无接触式连接器组件其通过光信号传输来实现信号传输。Another main object of the present invention is to provide a contactless connector assembly which realizes signal transmission through optical signal transmission.

为解决以上技术问题，本发明采用如下技术方案：一种无接触式连接器组件，所述无接触式连接器组件包括相互配合以传输信号的第一无接触式连接器及第二无接触式连接器，所述第一无接触式连接器包括第一电路板、设置在所述第一电路板上的可将电信号转换为光信号的光发射器、设置在所述第一电路板上的控制所述光发射器工作的光发射器控制芯片及至少部分包覆所述第一电路板、所述光发射器及所述光发射器控制芯片的第一透光件，所述第二无接触式连接器包括第二电路板、设置在所述第二电路板上的可接收所述光发射器发出的光信号并将所接收的光信号转换成电性号的光接收器、放大所述电信号的放大器芯片及至少部分包覆所述第二电路板、所述光接收器及所述放大器芯片的第二透光件。In order to solve the above technical problems, the present invention adopts the following technical solutions: a contactless connector assembly comprising a first contactless connector and a second contactless connector that cooperate with each other to transmit signals A connector, the first contactless connector includes a first circuit board, a light transmitter disposed on the first circuit board and capable of converting electrical signals into optical signals, and a light transmitter disposed on the first circuit board The light transmitter control chip that controls the work of the light transmitter and the first light-transmitting member at least partially covering the first circuit board, the light transmitter and the light transmitter control chip, the second light-transmitting member The contactless connector includes a second circuit board, an optical receiver arranged on the second circuit board and capable of receiving the optical signal sent by the optical transmitter and converting the received optical signal into an electrical signal, an amplifier The amplifier chip of the electrical signal and the second light-transmitting member at least partially covering the second circuit board, the light receiver and the amplifier chip.

与现有技术相比，本发明具有如下有益效果：本发明的无接触式连接器及其组件通过光发射器和光接收器形成无接触的光传输接口，实现连接器之间的信号传输，损耗小，信号传输稳定，本发明无接触式连接器及其组件用于许多不同的应用领域中。Compared with the prior art, the present invention has the following beneficial effects: the contactless connector and its components of the present invention form a contactless optical transmission interface through the optical transmitter and the optical receiver, so as to realize the signal transmission between the connectors and reduce the loss of loss. Small and stable in signal transmission, the contactless connector of the present invention and its components are used in many different fields of application.

【附图说明】【Description of drawings】

图1是符合本发明的无接触式连接器组件的立体图。1 is a perspective view of a contactless connector assembly in accordance with the present invention.

图2是图1所示的无接触式连接器组件的另一视角的立体图。FIG. 2 is a perspective view of the contactless connector assembly shown in FIG. 1 from another perspective.

图3是图1所示的无接触式连接器组件的部分分解图。FIG. 3 is a partially exploded view of the contactless connector assembly shown in FIG. 1 .

图4是图3所示的无接触式连接器组件另一视角的部分分解图。FIG. 4 is a partially exploded view of the contactless connector assembly shown in FIG. 3 from another perspective.

图5是图1所示的无接触式连接器组件的第一无接触式连接器的分解图。FIG. 5 is an exploded view of a first contactless connector of the contactless connector assembly shown in FIG. 1 .

图6是图5所示的第一无接触式连接器另一视角的分解图。FIG. 6 is an exploded view of the first contactless connector shown in FIG. 5 from another perspective.

图7是图1所示的无接触式连接器组件的第二无接触式连接器的分解图。FIG. 7 is an exploded view of a second contactless connector of the contactless connector assembly shown in FIG. 1 .

图8是图7所示的第一无接触式连接器另一视角的分解图。FIG. 8 is an exploded view of the first contactless connector shown in FIG. 7 from another perspective.

图9是图1所示的无接触式连接器组件配合后沿长度方向的剖视图。FIG. 9 is a cross-sectional view along the length direction of the contactless connector assembly shown in FIG. 1 after mating.

图10是图1所示的无接触式连接器组件配合后沿宽度方向的剖视图。FIG. 10 is a cross-sectional view along the width direction of the contactless connector assembly shown in FIG. 1 after mating.

图11是图1所示的无接触式连接器组件的第一种开启其工作模式的原理图。FIG. 11 is a schematic diagram of the first opening of the working mode of the contactless connector assembly shown in FIG. 1 .

图12是图1所示的无接触式连接器组件的第二种开启其工作模式的原理图。FIG. 12 is a schematic diagram of the second operating mode of the contactless connector assembly shown in FIG. 1 .

图13是图3所示的无接触式连接器组件的第三种开启其工作模式的原理图。FIG. 13 is a schematic diagram of the third operation mode of the contactless connector assembly shown in FIG. 3 which is turned on.

图14是图1所述的无接触式连接器组件的一种应用场景，其分别设置在手机和其对应的底座上的。FIG. 14 is an application scenario of the contactless connector assembly shown in FIG. 1 , which are respectively disposed on a mobile phone and its corresponding base.

图15是图14的手机和其对应的底座上相互分开的立体图。FIG. 15 is a perspective view of the mobile phone of FIG. 14 and its corresponding base separated from each other.

图16是图15去除手机其他外部结构和其对应的底座的其他外部机构的立体图。FIG. 16 is a perspective view of FIG. 15 without other external structures of the mobile phone and other external structures of the corresponding base.

图17是图16去除手机其他外部结构和其对应的底座的其他外部机构的正视图。FIG. 17 is a front view of the other external mechanisms of FIG. 16 without other external structures of the mobile phone and its corresponding base.

【主要组件符号说明】【Description of main component symbols】

无接触式连接器组件 900 第一无接触式连接器 100Contactless Connector Assembly 900 First Contactless Connector 100

第二无接触式连接器 500 第一电路板 10second contactless connector 500 first circuit board 10

光发射器 20 光发射器控制芯片 30Light Emitter 20 Light Emitter Control Chip 30

第一透光件 40 第二电路板 60first light-transmitting member 40 second circuit board 60

光接收器 70 放大器芯片 80Optical Receiver 70 Amplifier Chip 80

第二透光件 90 第二光接收器 21second light transmitting member 90 second light receiver 21

第二放大器芯片 31 单一芯片 301，801Second amplifier chip 31 Single chip 301, 801

第二光发射器 71 第二光发射器控制芯片 81Second Light Emitter 71 Second Light Emitter Control Chip 81

导电片 13，14 导电片 63，64Conductive sheet 13, 14 Conductive sheet 63, 64

软板 18 第一安装座 25Soft board 18 First mounting seat 25

第二安装座 75 磁性元件 11，61Second Mount 75 Magnetics 11, 61

第一透镜 41 第二透镜 42First lens 41 Second lens 42

磁铁 911 霍尔传感器 912Magnet 911 Hall Sensor 912

发射器 921 接收器 922Transmitter 921 Receiver 922

放大器 923 接收器 925Amplifier 923 Receiver 925

发射器 924 反射元件 926Emitter 924 Reflector 926

手机 300 底座 200Phone 300 Base 200

第一外壳 101 第二外壳 501First housing 101 Second housing 501

通孔 43 柱子 44Through hole 43 Post 44

弹簧 45 收容凹槽 47Spring 45 Receiving groove 47

【具体实施方式】【Detailed ways】

请参照图1至图10所示，为符合本发明的无接触式连接器组件900，其包括相互配合以传输信号的第一无接触式连接器100及第二无接触式连接器500。所述第一无接触式连接器100和第二无接触式连接器500之间形成非接触式的光传输接口。Referring to FIGS. 1 to 10 , a contactless connector assembly 900 according to the present invention includes a first contactless connector 100 and a second contactless connector 500 that cooperate with each other to transmit signals. A contactless optical transmission interface is formed between the first contactless connector 100 and the second contactless connector 500 .

所述第一无接触式连接器100包括第一电路板10、设置在所述第一电路板10上的可将电信号转换为光信号的光发射器20、设置在所述第一电路板10上的控制所述光发射器20工作的光发射器控制芯片30及至少部分包覆所述第一电路板10、所述光发射器20及所述光发射器控制芯片30的第一透光件40。所述第二无接触式连接器500包括第二电路板60、设置在所述第二电路板60上的可接收所述光发射器20发出的光信号并将所接收的光信号转化成电性号的光接收器70、放大所述电信号的放大器芯片80及至少部分包覆所述第二电路板60、所述光接收器70及所述放大器芯片80的第二透光件90。所述第一透光件40和第二透光件90均不影响信号的发射和接收。所述第一透光件40和所述第二透光件90可以是PEI(中文全称：聚醚酰亚胺)材质或玻璃材质，或由PEI材质或玻璃材质形成的外壳，内部填充水或空气。The first contactless connector 100 includes a first circuit board 10, an optical transmitter 20 disposed on the first circuit board 10 and capable of converting electrical signals into optical signals, and a light transmitter 20 disposed on the first circuit board The light transmitter control chip 30 on the 10 for controlling the operation of the light transmitter 20 and the first transparent cover at least partially covering the first circuit board 10 , the light transmitter 20 and the light transmitter control chip 30 . Optical element 40 . The second contactless connector 500 includes a second circuit board 60 , and a second circuit board 60 disposed on the second circuit board 60 can receive the optical signal sent by the optical transmitter 20 and convert the received optical signal into electrical signals. An optical receiver 70 of a specific signal, an amplifier chip 80 for amplifying the electrical signal, and a second light-transmitting member 90 at least partially covering the second circuit board 60 , the optical receiver 70 and the amplifier chip 80 . The first light-transmitting member 40 and the second light-transmitting member 90 do not affect the transmission and reception of signals. The first light-transmitting member 40 and the second light-transmitting member 90 can be made of PEI (full name in Chinese: polyetherimide) material or glass material, or a shell formed of PEI material or glass material, filled with water or glass. Air.

本发明中所述第一无接触式连接器100具有将电信号转化为光信号，并发出光信号的功能，第二无接触式连接器500具有接收光信号的功能并将光信号电信号的功能。在本发明中，所述第一无接触式连接器100和所述第二无接触式连接器500根据需要也可均具有发出光信号和接收光信号的功能。具体的通过以下设置来实现，所述第一无接触式连接器100进一步包括可接收光信号并将所接收的光信号转化成电信号的第二光接收器21及放大所述电信号的第二放大器芯片31。所述第二放大器芯片31与所述光发射器控制芯片30集成为单一芯片301。当然第二放大器芯片31与所述光发射器控制芯片30也可分开设置。所述第二无接触式连接器500进一步包括设可将电信号转化为光信号的第二光发射器71及设置在所述第二电路板60上的控制所述第二光发射器71工作的第二光发射器控制芯片81。所述放大器芯片80与所述第二光发射器控制芯片81集成为单一芯片801。放大器芯片80与所述第二光发射器控制芯片81也可分开设置。具体地，本实施例中，所述放大器芯片80和第二放大器芯片31均为后置放大器集成电路控制器，所述光发射器控制芯片30和第二光发射器控制芯片81均为所述为激光二极管驱动控制器。优选地，本发明中，所述光发射器20和所述第二光发射器71发出的光的波长为850nm，光的波长也可以是其他合适的波长。所述第二光接收器21和所述光接收器70均可为砷化镓光电二极管。根据实际需要所述第一无接触式连接器100和所述第二无接触式连接器500之间根据需要可设置一条或多条光路，具体的，通过以下设置来实现，所述光发射器20和第二光接收器21均可设置为一个或多个，对应的光接收器70和第二光发射器71可设置为多个或1个。所述第一电路板10上设有电信号输入的导电片13和电信号输出的导电片14。所述第二电路板60上设有电信号输入的导电片63和电信号输出的导电片64。各导电片可连接到板端基座的弹簧端子(未图示)或软板18。The first contactless connector 100 described in the present invention has the function of converting electrical signals into optical signals and sending out optical signals, and the second contactless connector 500 has the function of receiving optical signals and converting the optical signals to electrical signals. . In the present invention, the first contactless connector 100 and the second contactless connector 500 may both have the functions of sending out optical signals and receiving optical signals as required. Specifically, the first contactless connector 100 further includes a second optical receiver 21 that can receive optical signals and convert the received optical signals into electrical signals, and a second optical receiver 21 that amplifies the electrical signals. Two amplifier chips 31 . The second amplifier chip 31 and the light emitter control chip 30 are integrated into a single chip 301 . Of course, the second amplifier chip 31 and the light transmitter control chip 30 can also be provided separately. The second contactless connector 500 further includes a second light transmitter 71 configured to convert electrical signals into optical signals, and a second light transmitter 71 disposed on the second circuit board 60 to control the operation of the second light transmitter 71 . The second light emitter control chip 81 . The amplifier chip 80 and the second light transmitter control chip 81 are integrated into a single chip 801 . The amplifier chip 80 and the second light emitter control chip 81 can also be provided separately. Specifically, in this embodiment, the amplifier chip 80 and the second amplifier chip 31 are both post-amplifier integrated circuit controllers, and the light transmitter control chip 30 and the second light transmitter control chip 81 are both the For the laser diode drive controller. Preferably, in the present invention, the wavelength of the light emitted by the light emitter 20 and the second light emitter 71 is 850 nm, and the wavelength of the light can also be other suitable wavelengths. Both the second light receiver 21 and the light receiver 70 can be gallium arsenide photodiodes. According to actual needs, one or more optical paths may be set between the first contactless connector 100 and the second contactless connector 500 as required. 20 and the second optical receiver 21 can be set in one or more, and the corresponding optical receiver 70 and the second optical transmitter 71 can be set in multiple or one. The first circuit board 10 is provided with a conductive sheet 13 for inputting electrical signals and a conducting sheet 14 for outputting electrical signals. The second circuit board 60 is provided with a conductive sheet 63 for inputting electrical signals and a conducting sheet 64 for outputting electrical signals. Each conductive piece can be connected to a spring terminal (not shown) of the board end base or to the flexible board 18 .

所述第一无接触式连接器100进一步包括安装在所述第一电路板10上的第一安装座25，所述光发射器20和第二光接收器21可安装在所述第一安装座25上。根据需要安装对应高度的第一安装座25在电路板上。所述第一无接触式连接器100也可不包括第一安装座25，所述光发射器20和第二光接收器21可直接安装在所述第一电路板10上。同样的所述第二无接触式连接器500也可以包括安装在所述第二电路板上的第二安装座75。The first contactless connector 100 further includes a first mount 25 mounted on the first circuit board 10, and the optical transmitter 20 and the second optical receiver 21 can be mounted on the first mount on seat 25. Install the first mounting seat 25 corresponding to the height on the circuit board as required. The first contactless connector 100 may also not include the first mounting seat 25 , and the optical transmitter 20 and the second optical receiver 21 may be directly mounted on the first circuit board 10 . The same second contactless connector 500 may also include a second mounting seat 75 mounted on the second circuit board.

所述第一无接触式连接器100进一步包括设置在所述第一电路板10上的磁性元件11，所述磁性元件11设置在所述第一电路板10上与设置所述光发射器相反的一侧。所述第二无接触式连接器500进一步包括设置在所述第二电路板60上的磁性元件61，所述磁性元件61设置在所述第二电路板60上与设置所述光接收器相反的一侧。所述磁性元件61用于与第一无接触式连接器100的对应的磁性元件11相互吸引，以提供所述第一无接触式连接器100与第二无接触式连接器500之间的配合力。所述磁性元件11和磁性元件61都可为磁铁。The first contactless connector 100 further comprises a magnetic element 11 arranged on the first circuit board 10, the magnetic element 11 being arranged on the first circuit board 10 opposite to the arrangement of the light emitter side. The second contactless connector 500 further comprises a magnetic element 61 arranged on the second circuit board 60, the magnetic element 61 being arranged on the second circuit board 60 opposite to the arrangement of the light receiver side. The magnetic element 61 is used for attracting the corresponding magnetic element 11 of the first contactless connector 100 to provide the cooperation between the first contactless connector 100 and the second contactless connector 500 force. Both the magnetic element 11 and the magnetic element 61 can be magnets.

本发明的无接触式连接器具有较小的尺寸，具体的，本发明中，所述第一无接触式连接器100大致为长方形，其尺寸为长18.5毫米，宽10毫米，高5毫米。根据实际需要也可设计为其他的形状。处于工作状态下所述第一无接触式连接器100和第二无接触式连接器500之间的距离不大于5毫米。所述第一透光件40上设有第一透镜41及第二透镜42，所述第一透镜41将光发射器20发出的光信号转变成相互平行的光，所述第二透镜42将所述平行的光聚焦。所述第二透光件90上设有第三透镜93及第四透镜94，所述第三透镜93将所述第二透镜42聚焦的光变成平行的光，所述第四透镜94将所述平行的光聚焦到光接收器70。The contactless connector of the present invention has a smaller size. Specifically, in the present invention, the first contactless connector 100 is roughly rectangular, and its dimensions are 18.5 mm long, 10 mm wide and 5 mm high. Other shapes can also be designed according to actual needs. In the working state, the distance between the first contactless connector 100 and the second contactless connector 500 is not greater than 5 mm. The first light-transmitting member 40 is provided with a first lens 41 and a second lens 42. The first lens 41 converts the light signal emitted by the light emitter 20 into mutually parallel light. The parallel light is focused. The second light-transmitting member 90 is provided with a third lens 93 and a fourth lens 94. The third lens 93 converts the light focused by the second lens 42 into parallel light, and the fourth lens 94 converts the light into parallel light. The parallel light is focused to the light receiver 70 .

所述第一无接触式连接器100进一步包括将其固定的第一外壳101，所述第二无接触式连接器500进一步包括将其固定的第二外壳501。所述第一透光件40的左右两侧进一步包括一对设有通孔43的凸出部。一对柱子44的一端安装所述通孔43中，一对弹簧45对应的安装在所述柱子44上，所述柱子44和所述第一透光件40也可以是一体成型。所述第一外壳101上设有对应的收容弹簧45和柱子44的收容凹槽47。所述弹簧45可使所述第一透光件40与配合的所述第二透光件90快速对准定位。The first contactless connector 100 further includes a first housing 101 for fixing it, and the second contactless connector 500 further includes a second housing 501 for fixing it. The left and right sides of the first light-transmitting member 40 further include a pair of protruding portions provided with through holes 43 . One end of a pair of pillars 44 is installed in the through hole 43 , and a pair of springs 45 are correspondingly installed on the pillars 44 . The pillars 44 and the first light-transmitting member 40 may also be integrally formed. The first housing 101 is provided with corresponding receiving grooves 47 for receiving the springs 45 and the posts 44 . The spring 45 can quickly align and position the first transparent member 40 and the matched second transparent member 90 .

请参照图11至图13所示，本发明无接触式连接器组件900进一步包括可开启其工作模式的感应装置，如图11示出了所述感应装置的开启其工作模式的第一实施例的原理图，为便于理解，在本实施例中，以下面的连接器为第一无接触式连接器100，上面的连接器为第二无接触式连接器500。所述感应装置包括位于第一无接触式连接器100和所述第二无接触式连接器500上的磁性相对的两个磁铁911及位于磁铁911之间的霍尔传感器912。当第一无接触式连接器100及第二无接触式连接器500相互靠近配合时，霍尔传感器912感应到两个磁铁之间形成的磁场，从而使得所述无接触式连接器组件900处于可工作状态。Referring to FIGS. 11 to 13 , the contactless connector assembly 900 of the present invention further includes a sensing device that can turn on its working mode. FIG. 11 shows a first embodiment of the sensing device turning on its working mode. , for ease of understanding, in this embodiment, the lower connector is the first contactless connector 100 , and the upper connector is the second contactless connector 500 . The sensing device includes two magnetically opposed magnets 911 located on the first contactless connector 100 and the second contactless connector 500 and a Hall sensor 912 located between the magnets 911 . When the first contactless connector 100 and the second contactless connector 500 are close to each other, the Hall sensor 912 senses the magnetic field formed between the two magnets, so that the contactless connector assembly 900 is in the working state.

如图12示出了所述感应装置的开启其工作模式的第二实施例的原理图，与第一个实施例相比，在本实施方式中，所述感应装置包括位于所述第一无接触式连接器100上的可发光的发射器921及位于第二无接触式连接器500上的可接收发射器921发出的光的接收器922。所述发射器921位于所述第一电路板10上，所述接收器922位于所述第二电路板60上。所述感应装置进一步地包括位于第二电路板60上的可将接收器922接收到的信号放大的放大器923。当然所述发射器921也可设置在第一无接触式连接器100上，所述接收器922及放大器设置在第二无接触式连接器500上。所述发射器921可为发光二极管或激光发射器。当所述第一无接触式连接器100及所述第二无接触式连接器500相互靠近配合时，接收器922接收发射器921发出的光，从而使得所述无接触式连接器组件900处于可工作状态。FIG. 12 shows a schematic diagram of a second embodiment of the sensing device in which its working mode is turned on. Compared with the first embodiment, in this embodiment, the sensing device includes a device located in the first A transmitter 921 on the contact connector 100 that can emit light and a receiver 922 on the second contactless connector 500 that can receive light from the transmitter 921 . The transmitter 921 is located on the first circuit board 10 , and the receiver 922 is located on the second circuit board 60 . The sensing device further includes an amplifier 923 on the second circuit board 60 that can amplify the signal received by the receiver 922 . Of course, the transmitter 921 can also be provided on the first contactless connector 100 , and the receiver 922 and the amplifier can be provided on the second contactless connector 500 . The transmitter 921 can be a light emitting diode or a laser transmitter. When the first contactless connector 100 and the second contactless connector 500 are close to each other, the receiver 922 receives the light emitted by the transmitter 921, so that the contactless connector assembly 900 is in the working state.

如图13示出了所述感应装置的开启其工作模式的第三实施例的原理图，与第二实施例相比，在本实施方式中，所述感应装置包括位于所述第一无接触式连接器100上的可发光的发射器924和可接收光的接收器925及位于所述第二无接触式连接器500上的可将所述发射器924发出的光反射回的反射元件926，所述接收器925可接收反射元件926反射回的光。当然也可以是所述发射器924和接收器925位于所述第一无接触式连接器100上，所述反射元件926位于所述第二无接触式连接器500，当所述第一无接触式连接器100及所述第二无接触式连接器500相互靠近配合时，接收器925接收反射元件926反射回的光，从而使得所述无接触式连接器组件900处于可工作状态。FIG. 13 shows a schematic diagram of a third embodiment of the sensing device in which its working mode is turned on. Compared with the second embodiment, in this embodiment, the sensing device includes a non-contact device located in the first non-contact mode. A light-emitting transmitter 924 and a light-receiving receiver 925 on the second contactless connector 100 and a reflective element 926 on the second contactless connector 500 that reflects the light from the transmitter 924 back , the receiver 925 can receive the light reflected back by the reflective element 926 . Of course, the transmitter 924 and the receiver 925 may also be located on the first contactless connector 100, and the reflective element 926 may be located on the second contactless connector 500. When the first contactless connector 500 When the contactless connector 100 and the second contactless connector 500 are close to each other, the receiver 925 receives the light reflected by the reflective element 926 , so that the contactless connector assembly 900 is in an operable state.

本发明的无接触式连接器组件900具有广泛的应用前景，其可应用到需要传输高速数据和视频的接口，比如，数据中心交换器；可应用到对EMI极为敏感的设备，比如医疗和军事；另外从两个无接触式连接器中传输的光信号在空气或液体中都可以传输；因为有芯片和光电转换的功能，它可以传输多种信号，比如LVDS(中文全称：低压差分信号)、TMDS(中文全称：时间最小的差分信号)、CML(中文全称：电流模式逻辑)及其他可以传输的信号。The contactless connector assembly 900 of the present invention has broad application prospects, which can be applied to interfaces that need to transmit high-speed data and video, such as data center switches; and can be applied to equipment that is extremely sensitive to EMI, such as medical and military ; In addition, the optical signal transmitted from the two contactless connectors can be transmitted in air or liquid; because of the function of chip and photoelectric conversion, it can transmit a variety of signals, such as LVDS (full name in Chinese: low voltage differential signal) , TMDS (full name in Chinese: differential signal with the smallest time), CML (full name in Chinese: current mode logic) and other signals that can be transmitted.

同时本发明的无接触式连接器具有极小尺寸，可应用于3C消费产品，例如手机、笔记本或平板电脑，短距离和高速板连接，例如数据中心交换机或服务器，手术台内窥镜等抗电磁干扰的设备。也可以通过光纤将两个连接器连接起来，从而将大面板或电视GPU(显卡)内部传输到控制器。At the same time, the contactless connector of the present invention has a very small size and can be applied to 3C consumer products, such as mobile phones, notebooks or tablet computers, short-distance and high-speed board connections, such as data center switches or servers, operating table endoscopes, etc. EMI equipment. It is also possible to connect the two connectors via optical fiber, allowing a large panel or TV GPU (graphics card) internal transmission to the controller.

图14至图17所示，为本发明无接触式连接器组件900的一种应用场景，在本应用场景中所述第一无接触式连接器100位于底座200内，所述第二无接触式连接器500位于手机300中。14 to 17 show an application scenario of the contactless connector assembly 900 of the present invention. In this application scenario, the first contactless connector 100 is located in the base 200, and the second contactless connector 100 is located in the base 200. The type connector 500 is located in the mobile phone 300 .

本发明无接触式连接器组件可用于无线充电，无线电话间信号传输，双面板之间及可拆卸笔记本电脑，可折迭和可扩展的笔记本电脑的应用，视频墙的应用，大型电视或笔记本电脑内部传输。另外本发明的无接触式连接器及其组件通过光信号实现连接器之间的信号传输，损耗小信号传输稳定，所述无接触式连接器可用于许多不同的应用领域中。The contactless connector assembly of the present invention can be used for wireless charging, signal transmission between wireless phones, between double panels and detachable notebook computers, foldable and expandable notebook computer applications, video wall applications, large TVs or notebook computers transfer within the computer. In addition, the contactless connector and its components of the present invention realize the signal transmission between the connectors through optical signals, and the loss is small and the signal transmission is stable, and the contactless connector can be used in many different application fields.

以上所述仅为本发明的一种实施方式，不是全部或唯一的实施方式，本领域普通技术人员通过阅读本发明说明书而对本发明技术方案采取的任何等效的变化，均为本发明的权利要求所涵盖。The above is only one embodiment of the present invention, not all or the only embodiment. Any equivalent changes to the technical solutions of the present invention that are taken by those of ordinary skill in the art by reading the description of the present invention are the rights of the present invention requirements covered.

Claims (10)

1. A contactless connector that is mateable with another contactless connector to transmit signals, comprising: the contactless connector comprises a circuit board, a light receiver which is arranged on the circuit board and can convert an electric signal into a light signal light emitter or convert a light signal into an electric signal, a light emitter control chip which is arranged on the circuit board and controls the light emitter to work or an amplifier chip which amplifies the electric signal, and a light-transmitting piece which at least partially coats the circuit board, the light emitter or the light receiver, and the light emitter control chip or the amplifier chip.
2. The contactless connector of claim 1, wherein: the light-transmitting piece comprises a first lens and a second lens, the first lens converts the light signals emitted by the light emitters into mutually parallel light, and the second lens focuses the parallel light.
3. The contactless connector of claim 1, wherein: the contactless connector further comprises a magnetic element arranged on the circuit board, and the magnetic element is used for mutually attracting with a corresponding magnetic element of another contactless connector so as to provide the matching force of the contactless connector and the another contactless connector.
4. The contactless connector of claim 1, wherein: the optical receiver can receive optical signals and convert the received optical signals into electrical signals, and the amplifier chip amplifies the electrical signals.
5. The contactless connector of claim 4, wherein: the light emitter control chip and the amplifier chip are integrated into a single chip.
6. A contactless connector assembly, comprising: the contactless connector assembly includes a first contactless connector and a second contactless connector that cooperate to transmit signals, the first contactless connector comprises a first circuit board, a light emitter arranged on the first circuit board and capable of converting an electric signal into an optical signal, a light emitter control chip arranged on the first circuit board and used for controlling the light emitter to work, and a first light-transmitting member at least partially covering the first circuit board, the light emitter and the light emitter control chip, the second contactless connector comprises a second circuit board, an optical receiver arranged on the second circuit board and capable of receiving the optical signal sent by the optical transmitter and converting the received optical signal into an electrical signal, an amplifier chip for amplifying the electrical signal, and a second light-transmitting member at least partially covering the second circuit board, the optical receiver and the amplifier chip.
7. The contactless connector assembly of claim 6, wherein: further comprising magnetically opposing magnetic elements on the first contactless connector and the second contactless connector and a hall sensor between the magnetic elements.
8. The contactless connector assembly of claim 6, wherein: further comprising a light-emitting transmitter on one of the first and second contactless connectors and a receiver on the other that can receive light emitted by the transmitter.
9. The contactless connector assembly of claim 6, wherein: the contactless connector further comprises a transmitter capable of emitting light and a receiver capable of receiving light, which are positioned on one of the first contactless connector and the second contactless connector, and a reflecting element capable of reflecting the light emitted by the transmitter back, which is positioned on the other contactless connector, wherein the receiver can receive the light reflected by the reflecting element.
10. The contactless connector assembly of claim 9, wherein: the device further comprises an amplifier which can amplify the light information received by the receiver, and the transmitter is a light emitting diode or a laser transmitter.
CN202110291407.4A 2021-03-18 2021-03-18 Contactless connector and assembly thereof Pending CN115113344A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN202110291407.4A CN115113344A (en) 2021-03-18 2021-03-18 Contactless connector and assembly thereof
JP2022040660A JP2022145624A (en) 2021-03-18 2022-03-15 Contactless connector and assembly thereof
US17/696,666 US12136953B2 (en) 2021-03-18 2022-03-16 Contactless connector and contactless connector assembly
TW111109812A TW202243426A (en) 2021-03-18 2022-03-17 Contactless connector and assembly thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110291407.4A CN115113344A (en) 2021-03-18 2021-03-18 Contactless connector and assembly thereof

Publications (1)

Publication Number Publication Date
CN115113344A true CN115113344A (en) 2022-09-27

Family

ID=83284534

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110291407.4A Pending CN115113344A (en) 2021-03-18 2021-03-18 Contactless connector and assembly thereof

Country Status (4)

Country Link
US (1) US12136953B2 (en)
JP (1) JP2022145624A (en)
CN (1) CN115113344A (en)
TW (1) TW202243426A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1163028A (en) * 1994-09-26 1997-10-22 西门子公司 Optical data connector between adjacent components
US20140270790A1 (en) * 2013-03-14 2014-09-18 Tyco Electronics Corporation Contactless Fiber Optic Connector Assemblies
US20140314404A1 (en) * 2013-04-18 2014-10-23 Hon Hai Precision Industry Co., Ltd. Optical communication apparatus
CN105095943A (en) * 2014-05-23 2015-11-25 中兴通讯股份有限公司 Reflective type passive optical tag, optical read-write apparatus, and intelligent optical distribution network
CN111130600A (en) * 2018-11-01 2020-05-08 富鼎精密工业（郑州）有限公司 Wireless communication interconnection system
CN115118336A (en) * 2021-03-18 2022-09-27 富士康(昆山)电脑接插件有限公司 Contactless connectors and their components

Family Cites Families (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2091899B (en) * 1980-12-16 1984-04-18 Kokusai Denshin Denwa Co Ltd Rotary joints for optical fibres
CA1258786A (en) * 1985-04-11 1989-08-29 Omur M. Sezerman Tilt adjustable optical fibre connectors
US4903340A (en) * 1988-03-23 1990-02-20 Spacelabs, Inc. Optical data connector having magnetic interconnect sensor
US4915466A (en) * 1988-09-15 1990-04-10 Spacelabs, Inc. Reversible optical or electro-optical connector
US5093879A (en) * 1990-06-22 1992-03-03 International Business Machines Corporation Electro-optical connectors
US5202567A (en) * 1990-09-21 1993-04-13 Nippon Sheet Glass Co., Ltd. Optical information transmitting device and method of manufacturing same
JPH04301810A (en) * 1991-03-29 1992-10-26 Nec Corp Optical semiconductor array module
US5133032A (en) * 1991-04-17 1992-07-21 Salter James R Optical fiber connector
JPH0572444A (en) * 1991-09-17 1993-03-26 Fujitsu Ltd Multifiber optical connector
WO1993021663A1 (en) * 1992-04-08 1993-10-28 Georgia Tech Research Corporation Process for lift-off of thin film materials from a growth substrate
US5280184A (en) * 1992-04-08 1994-01-18 Georgia Tech Research Corporation Three dimensional integrated circuits with lift-off
JPH07200428A (en) * 1993-12-28 1995-08-04 Canon Inc Communication device
US5475215A (en) * 1994-01-03 1995-12-12 Hsu; Winston Optical communicating apparatus for communcating optical signals between electronic circuts
JPH0973041A (en) * 1995-06-26 1997-03-18 Oki Electric Ind Co Ltd Microoptical system for free space optical wiring and its setting
US5999295A (en) * 1996-03-29 1999-12-07 Compaq Computer Corporation Stackable network modules using infrared communications
US5930428A (en) * 1997-08-12 1999-07-27 Rockwell Science Center, Inc. Blind-mate fiber optic connector with integral optoelectronic receiver circuits
JPH11252017A (en) * 1997-12-24 1999-09-17 Fujitsu Ltd Wireless portable terminal with infrared communication function and infrared light emission power control method between wireless portable terminal and device with infrared communication function
KR100301008B1 (en) * 1998-06-15 2001-10-27 윤종용 Computer and Port Replicator Coupling Structure
US7015454B2 (en) * 1998-10-22 2006-03-21 Wavefront Research, Inc. Relaxed tolerance optical interconnect system capable of providing an array of sub-images
EP1050767A3 (en) * 1999-05-04 2003-05-02 Siemens Aktiengesellschaft Optical connector
JP2001320331A (en) * 2000-05-09 2001-11-16 Koito Ind Ltd Optical space transmission device and image monitoring device using the same
JP3735011B2 (en) * 2000-07-03 2006-01-11 矢崎総業株式会社 Assembly method of hybrid connector
GB2364831A (en) * 2000-07-12 2002-02-06 Mitel Semiconductor Ab Optical fibre cable to extend electrical bus
US20040212802A1 (en) * 2001-02-20 2004-10-28 Case Steven K. Optical device with alignment compensation
US20020159725A1 (en) * 2001-04-05 2002-10-31 Analog Devices, Inc. Electrically-terminated, optically-coupled communication cables
US6960161B2 (en) * 2001-12-28 2005-11-01 Karl Storz Imaging Inc. Unified electrical and illumination cable for endoscopic video imaging system
US6863453B2 (en) * 2003-01-28 2005-03-08 Emcore Corporation Method and apparatus for parallel optical transceiver module assembly
US6753726B1 (en) * 2003-01-31 2004-06-22 Sun Microsystems, Inc. Apparatus and method for an offset-correcting sense amplifier
US7369726B2 (en) * 2003-04-02 2008-05-06 Sun Microsystems, Inc. Optical communication between face-to-face semiconductor chips
JP2004325783A (en) * 2003-04-24 2004-11-18 Sony Corp Photoelectric composite connector, photoelectric composite cable and network device using the same
JP2004350155A (en) * 2003-05-23 2004-12-09 Sony Corp Optical communication system, optical communication device, and optical cable
EP1662292A2 (en) * 2003-07-08 2006-05-31 Matsushita Electric Industrial Co., Ltd. Beam shaping optical device, optical head, and optical information medium drive device
US7403715B2 (en) * 2003-08-13 2008-07-22 Northrop Grumman Corporation Free space optical bus
JP2005192037A (en) * 2003-12-26 2005-07-14 Showa Electric Wire & Cable Co Ltd Device and method for adjusting optical axis of transmitter/receiver
JP2005234050A (en) * 2004-02-17 2005-09-02 Sigma Koki Kk Optical component holding unit
US7630631B2 (en) * 2004-04-14 2009-12-08 Finisar Corporation Out-of-band data communication between network transceivers
JP4222568B2 (en) * 2005-05-23 2009-02-12 ローム株式会社 Optical connector
US7564066B2 (en) * 2005-11-09 2009-07-21 Intel Corporation Multi-chip assembly with optically coupled die
WO2007088863A1 (en) * 2006-01-31 2007-08-09 The Furukawa Electric Co., Ltd. Combined optical and electrical connector
US7499616B2 (en) * 2006-04-10 2009-03-03 Finisar Corporation Active optical cable with electrical connector
US8244134B2 (en) * 2007-06-19 2012-08-14 Charles Santori Optical interconnect
US8346087B2 (en) * 2007-09-28 2013-01-01 Oracle America, Inc. Wavelength-division multiplexing for use in multi-chip systems
JP5157393B2 (en) * 2007-11-29 2013-03-06 住友電気工業株式会社 Optical module and cable unit with optical module
US7841776B2 (en) * 2008-09-30 2010-11-30 Apple Inc. Magnetic connector with optical signal path
US9791634B2 (en) * 2008-09-30 2017-10-17 Apple Inc. Magnetic connector with optical signal path
JP5502880B2 (en) * 2008-10-31 2014-05-28 ヒューレット−パッカード デベロップメント カンパニー エル．ピー． Device for optically coupling photonic elements
US7798850B2 (en) * 2008-11-18 2010-09-21 Hon Hai Precision Ind. Co., Ltd. Cable assembly having enhanced interconnection means thereof
JP5158017B2 (en) * 2009-05-25 2013-03-06 富士通株式会社 Portable information terminal
JP5446671B2 (en) * 2009-09-29 2014-03-19 ソニー株式会社 Wireless transmission system and wireless communication method
TWM380482U (en) * 2009-10-22 2010-05-11 Hon Hai Prec Ind Co Ltd Optical-fiber connector
US8577195B2 (en) * 2009-11-19 2013-11-05 Apple Inc. Interface accessories with optical and electrical paths
US20110123158A1 (en) * 2009-11-26 2011-05-26 Hon Hai Precision Industry Co., Ltd. Cable assembly having positioning means securing fiber thereof
JP5560802B2 (en) * 2010-03-18 2014-07-30 ソニー株式会社 Communication device
EP2577372A1 (en) * 2010-06-01 2013-04-10 Apple Inc. Hybrid optical connector
US8571413B2 (en) * 2010-09-24 2013-10-29 Intel Corporation Apparatus, method, and system for improving bandwidth of a plug and a corresponding receptacle
WO2012093431A1 (en) * 2011-01-07 2012-07-12 パナソニック株式会社 Optical transmission system
US9614590B2 (en) * 2011-05-12 2017-04-04 Keyssa, Inc. Scalable high-bandwidth connectivity
US9019033B2 (en) * 2011-12-23 2015-04-28 Tyco Electronics Corporation Contactless connector
US9377594B2 (en) * 2011-12-29 2016-06-28 Intel Corporation Two-dimensional, high-density optical connector
US9559790B2 (en) * 2012-01-30 2017-01-31 Keyssa, Inc. Link emission control
US9354401B2 (en) * 2013-01-30 2016-05-31 Hewlett Packard Enterprise Development Lp Optical connector having a cleaning element
ES2618888T3 (en) * 2013-05-10 2017-06-22 Albert Handtmann Maschinenfabrik Gmbh & Co. Kg Device and procedure for transmitting process data in food production
US9300083B2 (en) * 2013-09-30 2016-03-29 Apple Inc. Stackable magnetically-retained connector interface
US9571202B2 (en) * 2014-02-21 2017-02-14 Optomedia Technology Inc. Optical connector assembly
US9405077B2 (en) * 2014-10-29 2016-08-02 Intel Corporation Optical connector
CA2982956C (en) * 2015-04-15 2023-08-01 Moog Inc. Optical rotary electrical connection
WO2017019099A1 (en) * 2015-07-30 2017-02-02 Hewlett Packard Enterprise Development Lp Transceiver modules
WO2017023275A1 (en) * 2015-07-31 2017-02-09 Hewlett Packard Enterprise Development Lp Electro-optical connectors
US10379293B2 (en) * 2015-10-28 2019-08-13 Kyocera Corporation Optical connector, optical connector system, and active optical cable provided with same
JP2017142419A (en) * 2016-02-12 2017-08-17 ソニー株式会社 OPTICAL TERMINAL DEVICE, ELECTRONIC DEVICE, OPTICAL CONNECTOR PROTECTION SYSTEM, MONITORING METHOD, AND PROGRAM
US10469175B2 (en) * 2016-04-15 2019-11-05 Multidyne Electronics, Inc. Stackable fiber optic transmitter/receiver modules
DE112017004238T5 (en) 2016-08-24 2019-05-16 Keyssa Systems, Inc. Charging connections with integrated contactless communication units
WO2018063230A1 (en) * 2016-09-29 2018-04-05 Intel Corporation Free air optical backplane interconnect
US10707627B2 (en) * 2017-09-29 2020-07-07 Apple Inc. Hybrid connector
US10720689B2 (en) * 2017-11-20 2020-07-21 Keyssa Systems, Inc. Launch assembly for coupling EM signals between a CCU and a waveguide, where the CCU is enclosed by a cover region including transition and waveguide interface regions therein for coupling to the waveguide
JP2020013376A (en) * 2018-07-19 2020-01-23 レノボ・シンガポール・プライベート・リミテッド Electronics
DE202019106231U1 (en) * 2019-11-08 2019-12-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Rotatable short-range optical transceiver

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1163028A (en) * 1994-09-26 1997-10-22 西门子公司 Optical data connector between adjacent components
US20140270790A1 (en) * 2013-03-14 2014-09-18 Tyco Electronics Corporation Contactless Fiber Optic Connector Assemblies
US20140314404A1 (en) * 2013-04-18 2014-10-23 Hon Hai Precision Industry Co., Ltd. Optical communication apparatus
CN105095943A (en) * 2014-05-23 2015-11-25 中兴通讯股份有限公司 Reflective type passive optical tag, optical read-write apparatus, and intelligent optical distribution network
CN111130600A (en) * 2018-11-01 2020-05-08 富鼎精密工业（郑州）有限公司 Wireless communication interconnection system
CN115118336A (en) * 2021-03-18 2022-09-27 富士康(昆山)电脑接插件有限公司 Contactless connectors and their components

Also Published As

Publication number Publication date
JP2022145624A (en) 2022-10-04
TW202243426A (en) 2022-11-01
US20220303015A1 (en) 2022-09-22
US12136953B2 (en) 2024-11-05

Similar Documents

Publication Publication Date Title
CN101268395B (en) Modular optical device package
CN103403956B (en) Electronic installation and the module be arranged in electronic installation
TWI516816B (en) Optical transceiver interface with C-plane alignment and fixed features
US9634728B2 (en) Contactless connector
CN112838139B (en) Optical subassembly
CN110011686B (en) Wireless communication interconnection system and wall-mounted kit thereof
US20150062828A1 (en) Connector, connector Assembly, and Wireless Communication Module
US20220299717A1 (en) Contactless connector and contactless connector assembly
US8488926B2 (en) Photoelectric connector assembly with a lens member having lenses at opposite faces thereof
US9832288B2 (en) Extremely high frequency converter
US9323018B2 (en) HDMI signals transmission device
JP2013162149A (en) Transmission method, and transmission system
CN115113344A (en) Contactless connector and assembly thereof
CN100428649C (en) Omnidirectional radiation wireless communication transmitting device and wireless communication electronic device using same
US20040156598A1 (en) Pluggable optical transceiver module
CN111130600A (en) Wireless communication interconnection system
CN203071346U (en) Connector
CN118200424B (en) Electronic device and signal transmission method
CN101154998A (en) bus system
JP3077165U (en) USB light emitting cable
CN114019618A (en) An Ethernet to wireless optical transmission component
JP2006227607A (en) Communication cable
TW200820001A (en) Bus system
JP2012159940A (en) Electronic apparatus
TW200838175A (en) Optical transceiver module

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination