CN115101551B - Display device and method for manufacturing the same - Google Patents

Abstract

The present application provides a display device and a preparation method thereof. The display device includes a display substrate and a driving circuit layer disposed on the display substrate, and the display device also includes a first protective layer, a plurality of light-emitting chips, a packaging layer and a second protective layer, wherein the first The protective layer is arranged on the side of the driving circuit layer facing away from the display substrate for protecting the driving circuit layer. The first protective layer is provided with a plurality of first mounting holes arranged at intervals. The light-emitting chips are respectively arranged in the first mounting holes opened in the first protective layer, and are electrically connected with the driving circuit layer. The present invention can improve the anti-scratch and anti-corrosion properties of the display substrate and the driving circuit layer during the manufacturing process, and has the advantages of improving light crosstalk and improving the overall yield.

Description

Display device and manufacturing method thereof

technical field

The present application relates to the field of display technology, in particular to a display device and a method for manufacturing the display device.

Background technique

At present, light emitting diodes (Light Emitting Diode, LED) have been widely used in the display field due to their advantages of high brightness, low heat, long life, energy saving and environmental protection. With the continuous development of display technology, the resolution of images is getting higher and higher, and the dot pitch of LED screens is getting smaller and smaller. Mini LED (submillimeter light-emitting diode) and Micro LED (micron light-emitting diode) display devices are increasingly widely used. . Mini LED and Micro LED display devices usually have a display substrate containing a plurality of light-emitting chips.

However, in the production process of the display substrate, the display substrate is often divided into target substrates of preset sizes according to requirements. Since the display substrate needs to be edged and cleaned when dividing the display substrate into target substrates, this will cause the display Substrate scratches, line corrosion and other issues. At the same time, due to the large number of light-emitting chips on the display substrate, poor soldering is prone to occur, thereby reducing the overall yield of the display substrate.

Contents of the invention

In view of the above-mentioned deficiencies in the prior art, the purpose of this application is to provide a display device that can improve the scratch resistance and corrosion resistance of the circuit during the production process of the display substrate, and can realize accurate identification of light-emitting chips with abnormal soldering. To improve the overall yield of the display panel.

In order to solve the above technical problems, the present application provides a display device, including a display substrate and a driving circuit layer disposed on the display substrate, and the display device also includes a first protective layer, a plurality of light-emitting chips, a packaging layer and a second Two protective layers, wherein, the first protective layer is arranged on the side of the driving circuit layer facing away from the display substrate to protect the driving circuit layer, and the first protective layer is provided with multiple layers arranged at intervals. a first installation hole, a plurality of light-emitting chips are respectively arranged in the first installation holes opened in the first protection layer, and are electrically connected with the driving circuit layer, and the packaging layer is arranged in the said first installation hole The side of the first protective layer facing away from the driving circuit layer is provided with a plurality of second mounting holes aligned with the first mounting holes, the second protective layer is arranged on the light emitting chip and the on the encapsulation layer.

In an exemplary embodiment, the driving circuit layer includes a plurality of pads, the pads correspond to the position of the light emitting chip, and the driving circuit layer is electrically connected to the light emitting chip through the pads .

In an exemplary embodiment, the first protective layer is a colored protective layer, and the first protective layer is formed on the driving circuit layer through an ink plus screen printing process, and the color of the ink is consistent with the color of the solder. discs or the light-emitting chips are different.

In an exemplary embodiment, the light emitting chip is Mini LED or Micro LED.

In an exemplary embodiment, the encapsulation layer is a black encapsulation layer, and the material of the encapsulation layer is black resin glue; the second protective layer is a transparent protective layer, and the material of the second protective layer is polyimide amine.

To sum up, in the display device provided by the embodiment of the present application, the driving circuit layer is provided with the first protective layer, which can prevent the driving circuit layer from being scratched by debris and water vapor during the cleaning process. Corrosion caused by residues occurs, thereby improving the scratch resistance and corrosion resistance of the display substrate and the driving circuit layer during the manufacturing process. At the same time, the first protective layer is used as a colored protective layer, and the pattern formed by it can be used as a detection benchmark for welding of the light-emitting chip, which is beneficial to accurately identify light-emitting chips with abnormal welding and improve the overall yield of the display substrate. Moreover, the light-emitting chip is accommodated in the first mounting hole of the first protective layer and the second mounting hole of the encapsulation layer, the encapsulation layer can prevent light crosstalk between the light-emitting chips, and can protecting the driving circuit layer and the light emitting chip. In addition, the second protective layer is disposed on the light-emitting chip and the encapsulation layer, which can protect the light-emitting surface of the light-emitting chip and improve the appearance of the display device.

Based on the same inventive concept, the present application also provides a method for preparing a display device, which is used to prepare the above-mentioned display device. The preparation method includes: providing a display substrate; manufacturing a driving circuit layer on the display substrate; Make a first protective layer on the driving circuit layer, and open a plurality of first mounting holes on the first protective layer; install a plurality of light-emitting chips in the first mounting holes respectively, and connect with the driving circuit layer electrical connection; on the first protective layer, an encapsulation layer including a plurality of second installation holes is made, and the end of the light-emitting chip facing away from the driving circuit layer is accommodated in the second installation holes; A second protective layer is formed on the light-emitting chip and the encapsulation layer.

In an exemplary embodiment, the forming a first protective layer on the driving circuit layer, and opening a plurality of first installation holes on the first protective layer includes: making the first protective layer on one side of the display substrate; and opening a plurality of first mounting holes arranged at intervals on the first protective layer.

In an exemplary embodiment, after forming a first protective layer on the driving circuit layer and opening a plurality of first installation holes on the first protective layer, the preparation method includes: obtaining the first protective layer A first distance and a second distance between a mounting hole and a first pad and a second pad located in the first mounting hole and disposed on the driving circuit layer respectively.

In an exemplary embodiment, after the plurality of light-emitting chips are respectively mounted in the first mounting holes and electrically connected to the driving circuit layer, the preparation method includes: respectively obtaining the first The third distance and the fourth distance between the mounting hole and the light-emitting chip located in the first mounting hole; the difference between the first distance and the second distance and the third distance and the fourth distance Value processing obtains the first horizontal difference, the second horizontal difference, the first vertical difference and the second vertical difference respectively; the first horizontal difference and the second horizontal difference are offset from the preset horizontal The distances are compared, and the first longitudinal difference and the second longitudinal difference are compared with the preset longitudinal offset distance, and the soldering condition of the light-emitting chip is judged according to the comparison result.

In an exemplary embodiment, the first lateral difference and the second lateral difference are compared with a preset lateral offset distance, and the first longitudinal difference and the second longitudinal difference The difference is compared with the preset longitudinal offset distance, and the welding condition of the light-emitting chip is judged according to the comparison result, including: if the first lateral difference or the second lateral difference is greater than the preset lateral offset distance, or/and, the first longitudinal difference or the second longitudinal difference is greater than the preset longitudinal offset distance, then the soldering of the light-emitting chip is abnormal; if the first transverse difference and the The second lateral difference is less than the preset lateral offset distance, and the first longitudinal difference and the second longitudinal difference are both smaller than the preset longitudinal offset distance, then the light-emitting chip Welding is normal.

To sum up, in the manufacturing method of the display device of the present application, the distance between the first mounting hole opened on the first protective layer and the first pad and the second pad provided on the driving circuit layer respectively is respectively obtained. The first distance and the second distance respectively obtain the third distance and the fourth distance between the first mounting hole and the light-emitting chip located in the first mounting hole, and combine the first distance and the second Perform difference processing on the distance, the third distance and the fourth distance to obtain the first horizontal difference, the second horizontal difference, the first vertical difference and the second vertical difference respectively, and combine the first horizontal difference and The second lateral difference is compared with the preset lateral offset distance, and the first longitudinal difference and the second longitudinal difference are compared with the preset longitudinal offset distance, and the welding condition of the light-emitting chip is judged according to the comparison result, so that it can Realize the precise identification of abnormally welded light-emitting chips to improve the overall yield of the display panel.

Based on the same inventive concept, the present application further provides an electronic device, the electronic device includes a casing and the above-mentioned display device, wherein the display device is mounted to the casing.

To sum up, in the electronic device provided by the embodiment of the present application, the driving circuit layer is provided with the first protective layer, which can prevent the driving circuit layer from being scratched by debris and water vapor during the cleaning process. Corrosion caused by residues occurs, thereby improving the scratch resistance and corrosion resistance of the display substrate and the driving circuit layer during the manufacturing process. At the same time, the first protective layer is used as a colored protective layer, and the pattern formed by it can be used as a detection benchmark for welding of the light-emitting chip, which is beneficial to accurately identify light-emitting chips with abnormal welding and improve the overall yield of the display substrate. Moreover, the light-emitting chip is accommodated in the first mounting hole of the first protective layer and the second mounting hole of the encapsulation layer, the encapsulation layer can prevent light crosstalk between the light-emitting chips, and can protecting the driving circuit layer and the light emitting chip. In addition, the second protective layer is disposed on the light-emitting chip and the encapsulation layer, which can protect the light-emitting surface of the light-emitting chip and improve the appearance of the display device.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the accompanying drawings that need to be used in the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are some embodiments of the present application. Ordinary technicians can also obtain other drawings based on these drawings on the premise of not paying creative work.

FIG. 1 is a schematic structural diagram of a display device provided by an embodiment of the present application;

FIG. 2 is a schematic flowchart of a method for manufacturing a display device provided in Embodiment 1 of the present application;

Fig. 3 is a schematic diagram of the corresponding structure formed in step S10 in the preparation method shown in Fig. 2;

Fig. 4 is a schematic diagram of the corresponding structure formed in step S20 in the preparation method shown in Fig. 2;

5 is a schematic flow diagram of step S30 in the preparation method shown in FIG. 2;

Fig. 6 is a schematic diagram of the corresponding structure formed in step S31 in the preparation method shown in Fig. 5;

Fig. 7 is a schematic diagram of the corresponding structure formed in step S32 in the preparation method shown in Fig. 5;

Fig. 8 is a schematic diagram of the corresponding structure formed in step S40 in the preparation method shown in Fig. 2;

Fig. 9 is a schematic diagram of the corresponding structure formed in step S50 in the preparation method shown in Fig. 2;

Fig. 10 is a schematic diagram of the corresponding structure formed in step S60 in the preparation method shown in Fig. 2;

FIG. 11 is a schematic flowchart of a method for manufacturing a display device provided in Embodiment 2 of the present application;

Fig. 12 is a schematic diagram of the corresponding structure formed in step S400 in the preparation method shown in Fig. 11;

FIG. 13 is a schematic diagram of the corresponding structure formed in step S600 in the preparation method shown in FIG. 11 .

Explanation of reference signs:

100-display device; 110-display substrate; 120-drive circuit layer; 121-pad; 121a-first pad; 121b-second pad; 130-first protective layer; 131-first mounting hole; 140 -light-emitting chip; 150-encapsulation layer; 151-second mounting hole; 160-second protective layer; X1-first lateral distance; X2-second lateral distance; X1'-third lateral distance; X2'-fourth Horizontal distance; Y1-first longitudinal distance; Y2-second longitudinal distance; Y1'-third longitudinal distance; Y2'-fourth longitudinal distance; S10-S60-steps of the manufacturing method of the display device; S31-S32-steps Steps included in S30; S100-S1000—steps of another manufacturing method of a display device.

Detailed ways

In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Preferred embodiments of the application are shown in the accompanying drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the application more thorough and comprehensive.

The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments that the present application can be used to implement. The serial numbers assigned to components in this document, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any sequence or technical meaning. The "connection" and "connection" mentioned in this application all include direct and indirect connection (connection) unless otherwise specified. The directional terms mentioned in this application, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., only is to refer to the direction of the attached drawings. Therefore, the direction terms used are for better and clearer description and understanding of the present application, rather than indicating or implying that the referred device or element must have a specific orientation, and must have a specific orientation. construction and operation, therefore should not be construed as limiting the application.

In the description of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Ground connection, or integral connection; can be mechanical connection; can be directly connected, can also be indirectly connected through an intermediary, and can be internal communication between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application in specific situations. It should be noted that the terms "first" and "second" in the specification, claims and drawings of the present application are used to distinguish different objects, rather than to describe a specific order.

In addition, the term "comprising", "may include", "comprises", or "may include" used in this application indicates the existence of the corresponding disclosed functions, operations, elements, etc., and does not limit other one or more more Functions, operations, components, etc. In addition, the term "comprises" or "comprises" means that there are corresponding features, numbers, steps, operations, elements, components or combinations thereof disclosed in the specification, and does not exclude the existence or addition of one or more other features, numbers, steps, Operations, elements, components, or combinations thereof, are intended to cover non-exclusive inclusions. In addition, when describing the embodiments of the present application, the use of "may" means "one or more embodiments of the present application". Also, the word "exemplary" is intended to mean an example or illustration.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is only for the purpose of describing specific implementations, and is not intended to limit the application.

The embodiment of the present application hopes to provide a technical solution for a display device and its preparation method that can solve the above technical problems, so as to improve the scratch resistance and corrosion resistance of the circuit during the production process of the display substrate, and to realize the protection against abnormal welding. The precise identification of light-emitting chips can improve the overall yield of the display panel, and its details will be described in subsequent embodiments.

Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of a display device provided by an embodiment of the present application. In this embodiment, the display device 100 includes a display substrate 110, a driving circuit layer 120, a first protective layer 130, a plurality of light-emitting chips 140, an encapsulation layer 150 and a second protective layer 160, wherein the driving circuit layer 120 It is arranged on the display substrate 110, the first protective layer 130 is arranged on the side of the driving circuit layer 120 facing away from the display substrate 110, and the first protective layer 130 is provided with A plurality of first installation holes 131 (as shown in FIG. 7 ), the plurality of first installation holes 131 penetrate through the first protective layer 130 to expose the driving circuit layer 120 .

A plurality of light-emitting chips 140 are accommodated in corresponding first mounting holes 131, and are electrically connected to the driving circuit layer 120, and one end of the light-emitting chips 140 facing away from the driving circuit layer 120 is exposed. The first installation hole 131 .

The encapsulation layer 150 is disposed on the side of the first protective layer 130 facing away from the driving circuit layer 120, and is provided with a plurality of second mounting holes 151 aligned with the first mounting holes 131 (as shown in FIG. 9), that is, the first mounting holes 131 correspond to and communicate with the second mounting holes 151 one by one. The end of the light-emitting chip 140 facing away from the driving circuit layer 120 is accommodated in the second mounting hole 151, and is flush with the surface of the packaging layer 150 facing away from the first protective layer 130, that is, the A portion of the light emitting chip 140 exposed from the first mounting hole 131 is accommodated in the second mounting hole 151 .

The second protective layer 160 is covered on the light-emitting chip 140 and the encapsulation layer 150 , specifically, the second protective layer 160 is partially covered on the light-emitting chip 140 facing away from the driving circuit layer 120 One end of the encapsulation layer 150 is partially covered on the side facing away from the first protection layer 130 .

In the implementation manner of the present application, the driving circuit layer 120 is electrically connected to a plurality of the light emitting chips 140 for driving the light emitting chips 140 to emit light. In an exemplary embodiment, the driving circuit layer 120 includes a plurality of pads 121 (as shown in FIG. 12 ), the pads 121 correspond to the positions of the light emitting chips 140, and the driving circuit layer 120 passes through The pad 121 is electrically connected to the light emitting chip 140 . In this embodiment, the driving circuit layer 120 can be formed on the display substrate 110 through a thin film transistor manufacturing process, the material of the pad 121 can be copper, and the surface of the copper is coated with gold or nickel. Gold handling. In exemplary embodiments, the display substrate 110 may be a glass substrate.

The first protection layer 130 and the plurality of light emitting chips 140 are disposed on the same layer, that is, the first protection layer 130 and the plurality of light emitting chips 140 are located on the side of the driving circuit layer 120 facing away from the display substrate 110 . The first protection layer 130 is used to protect the driving circuit layer 120 to prevent debris scratches during cleaning and residual water vapor from causing corrosion. The first protective layer 130 is provided with a plurality of first installation holes 131 arranged at a preset distance, and the size of the first installation holes 131 can be set to be larger than the overall size of the light emitting chip 140 .

In this embodiment, the first protective layer 130 can be a colored protective layer, which can be formed on the driving circuit layer 120 by ink plus screen printing process, and the color of the ink is the same as that of the pad 121 Or the light-emitting chip 140 can form a larger contrast, which is beneficial to setting the boundary of the ink, wherein the color of the ink can be blue. The first protective layer 130 is formed after printing ink on the driving circuit layer 120 and cured, and the display with the first protective layer 130 and the driving circuit layer 120 is arranged according to a preset size. The substrate 110 is cut to form a substrate unit (not shown in the figure). Since the substrate unit needs to be provided with side circuits, the substrate unit is subjected to edging treatment, and the debris generated after edging is cleaned. The first protective layer 130 can prevent the driving circuit layer 120 from being scratched by debris during the cleaning process and corrosion caused by residual water vapor.

The light-emitting chip 140 is disposed in the first installation hole 131 opened by the first protection layer 130, and the end facing away from the driving circuit layer 120 is accommodated in the second installation hole 151, that is, the A portion of the light emitting chip 140 exposed from the first mounting hole 131 is accommodated in the second mounting hole 151 . A plurality of the light emitting chips 140 are electrically connected to the driving circuit layer 120 for emitting light. In the embodiment of the present application, the light emitting chip 140 may be Mini LED or Micro LED. It can be understood that the light emitting chip 140 can be a red light emitting chip, a green light emitting chip or a blue light emitting chip.

The encapsulation layer 150 is disposed on the side of the first protection layer 130 facing away from the driving circuit layer 120, and a plurality of the second mounting holes 151 are opened on the encapsulation layer 150, and the second mounting holes 151 is aligned with and communicated with the first mounting hole 131 , and the part of the light emitting chip 140 exposed from the first mounting hole 131 is accommodated in the second mounting hole 151 . The encapsulation layer 150 is used to prevent light crosstalk between the light emitting chips 140 and protect the driving circuit layer 120 and the light emitting chips 140 . In this embodiment, the encapsulation layer 150 may be a black encapsulation layer, specifically, the material of the encapsulation layer 150 may be black resin glue.

The second protection layer 160 is disposed on the light-emitting chip 140 and the encapsulation layer 150 , that is, a part of the second protection layer 160 is disposed on the light-emitting chip 140 , and another part is disposed on the encapsulation layer 150 , used to protect the light-emitting surface of the light-emitting chip 140 and improve the appearance of the display device 100 . In this embodiment, the second protective layer 160 may be a transparent protective layer, specifically, the material of the second protective layer 160 may be polyimide.

To sum up, in the display device 100 provided by the embodiment of the present application, the driving circuit layer 120 is provided with the first protective layer 130, which can prevent the driving circuit layer 120 from debris during cleaning. Scratches and corrosion caused by residual water vapor occur, thereby improving the scratch resistance and corrosion resistance of the display substrate 110 and the driving circuit layer 120 during the manufacturing process. At the same time, the first protective layer 130 is a colored protective layer, and the pattern formed by it can be used as a detection standard for soldering of the light-emitting chip 140 , which is beneficial to accurately identify light-emitting chips with abnormal soldering and improve the overall yield of the display substrate. Moreover, the light-emitting chip 140 is accommodated in the first mounting hole 131 of the first protective layer 130 and the second mounting hole 151 of the encapsulation layer 150 , and the encapsulation layer 150 can prevent the light-emitting chip 140 from light crosstalk between them, and can protect the driving circuit layer 120 and the light emitting chip 140 . In addition, the second protective layer 160 is disposed on the light-emitting chip 140 and the encapsulation layer 150 , which can protect the light-emitting surface of the light-emitting chip 140 and improve the appearance of the display device 100 .

Please refer to FIG. 2 , which is a schematic flow chart of a method for manufacturing a display device provided in Embodiment 1 of the present application. The method for manufacturing a display device is used to prepare the display device 100 in the embodiment shown in FIG. 1 above, so as to solve the problem of The display substrate is divided into substrate units of a predetermined size and needs to be edged and cleaned to cause scratches and line corrosion on the display substrate, thereby improving the scratch resistance and corrosion resistance of the display substrate during the manufacturing process. As shown in FIG. 2 , the manufacturing method of the display device at least includes the following steps.

S10 , providing a display substrate 110 .

Specifically, please refer to FIG. 3 , in the embodiment of the present application, the display substrate 110 is prepared for subsequent preparation of the layer structure of the display device 100 .

In the embodiment of the present application, the display substrate 110 is used as a carrying substrate, which may be a glass substrate.

S20 , fabricating the driving circuit layer 120 on the display substrate 110 .

Specifically, please refer to FIG. 4 , in the embodiment of the present application, the driving circuit layer 120 is disposed on the display substrate 110, and a plurality of the bonding pads 121 are arranged on the driving circuit layer 120 (refer to Figure 12).

In this embodiment, the driving circuit layer 120 can be formed on the display substrate 110 through a thin film transistor manufacturing process, the material of the pad 121 can be copper, and the surface of the copper is coated with gold or nickel. Gold handling.

S30 , forming a first protective layer 130 on the driving circuit layer 120 , and opening a plurality of first installation holes 131 on the first protective layer 130 .

In this embodiment, please refer to FIG. 5 , the step S30 includes at least the following steps.

S31 , forming a first protective layer 130 on a side of the driving circuit layer 120 facing away from the display substrate 110 .

Specifically, referring to FIG. 6 , in the embodiment of the present application, the first protection layer 130 is formed on the side of the driving circuit layer 120 facing away from the display substrate 110 , and the first protection layer 130 is used for The driving circuit layer 120 is protected to prevent debris from being scratched during the cleaning process and residual water vapor from causing corrosion.

In this embodiment, the first protective layer 130 can be a colored protective layer, which can be formed on the driving circuit layer 120 by ink plus screen printing process, and the color of the ink is the same as that of the pad 121 Or the light-emitting chip 140 can form a larger contrast, which is beneficial to setting the boundary of the ink. Wherein, the color of the ink can be blue.

S32 , opening a plurality of first installation holes 131 arranged at intervals on the first protection layer 130 .

Specifically, please refer to FIG. 7 , in the embodiment of the present application, the first protective layer 130 is provided with a plurality of first installation holes 131 arranged at preset distances, and the plurality of first installation holes 131 pass through the The first protective layer 130 is used to expose the driving circuit layer 120 .

In this embodiment, the size of the first installation hole 131 can be set to be larger than the outer size of the light emitting chip 140 .

S40, install a plurality of light emitting chips 140 in the first installation holes 131 respectively, and electrically connect with the driving circuit layer.

Specifically, please refer to FIG. 8 , in the embodiment of the present application, a plurality of light-emitting chips 140 are respectively accommodated in the corresponding first mounting holes 131, and are connected to the driving circuit layer through the pads 121. 120 is electrically connected to emit light, and at the same time, the end of the light emitting chip 140 facing away from the driving circuit layer 120 exposes the first installation hole 131 .

In the embodiment of the present application, the light emitting chip 140 may be a Mini LED or a Micro LED. It can be understood that the light emitting chip 140 can be a red light emitting chip, a green light emitting chip or a blue light emitting chip.

S50 , fabricating a packaging layer 150 including a plurality of second installation holes 151 on the first protective layer 130 , and the end of the light emitting chip facing away from the driving circuit layer is accommodated in the second installation holes.

Specifically, please refer to FIG. 9. In the embodiment of the present application, the encapsulation layer 150 is disposed on the side of the first protective layer 130 facing away from the driving circuit layer 120, and has a The plurality of second mounting holes 151 aligned with the holes 131 , that is, the first mounting holes 131 correspond to the second mounting holes 151 one by one. The part of the light emitting chip 140 exposed from the first mounting hole 131 is accommodated in the second mounting hole 151, and the encapsulation layer 150 is used to prevent crosstalk between the light emitting chips 140 and protect the light emitting chip 140. The circuit layer 120 and the light emitting chip 140 are driven.

In this embodiment, the encapsulation layer 150 may be a black encapsulation layer, specifically, the material of the encapsulation layer 150 may be black resin glue.

S60 , forming a second protection layer 160 on the light emitting chip 140 and the encapsulation layer 150 .

Specifically, please refer to FIG. 10 , in the embodiment of the present application, the second protective layer 160 covers the light-emitting chip 140 and the encapsulation layer 150 , specifically, the second protective layer 160 partially covers It is arranged on the end of the light-emitting chip 140 facing away from the driving circuit layer 120, and is partially covered on the side of the encapsulation layer 150 facing away from the first protective layer 130 to protect the light output of the light-emitting chip 140. surface, and enhance the appearance of the display device 100 .

In this embodiment, the second protective layer 160 may be a transparent protective layer, specifically, the material of the second protective layer 160 may be polyimide.

In summary, in the manufacturing method of the display device disclosed in the embodiment of the present application, by disposing the first protection layer 130 on the driving circuit layer 120, the driving circuit layer 120 can be protected from Debris scratches and residual water vapor lead to corrosion, thereby improving the scratch resistance and corrosion resistance of the display substrate 110 and the driving circuit layer 120 during the manufacturing process. At the same time, the first protective layer 130 is a colored protective layer, and the pattern formed by it can be used as a detection standard for soldering of the light-emitting chip 140 , which is beneficial to accurately identify light-emitting chips with abnormal soldering and improve the overall yield of the display substrate. Moreover, the light-emitting chip 140 is accommodated in the first mounting hole 131 of the first protective layer 130 and the second mounting hole 151 of the encapsulation layer 150 , and the encapsulation layer 150 can prevent the light-emitting chip 140 from light crosstalk between them, and can protect the driving circuit layer 120 and the light emitting chip 140 . In addition, the second protective layer 160 is disposed on the light-emitting chip 140 and the encapsulation layer 150 , which can protect the light-emitting surface of the light-emitting chip 140 and improve the appearance of the display device 100 .

Please refer to FIG. 11 , which is a schematic flowchart of a method for manufacturing a display device provided in Embodiment 2 of the present application. The method for manufacturing a display device is used to prepare the display device 100 in the embodiment shown in FIG. 1 above, so as to solve the problem of The display substrate is divided into substrate units of a preset size, and the display substrate needs to be ground and cleaned to cause scratches on the display substrate, corrosion of the circuit, and the like. At the same time, the soldering of the light-emitting chip in the display device of the embodiment shown in FIG. The situation is detected to achieve accurate identification of abnormally welded light-emitting chips, thereby improving the overall yield of the display panel. As shown in FIG. 11 , the manufacturing method of the display device at least includes the following steps.

S100 , providing a display substrate 110 .

Specifically, please refer to FIG. 3 together. In the embodiment of the present application, the display substrate 110 is prepared for subsequent preparation of the layer structure of the display device 100 .

In the embodiment of the present application, the display substrate 110 is used as a carrying substrate, which may be a glass substrate.

S200 , fabricating a driving circuit layer 120 on the display substrate 110 .

Specifically, please refer to FIG. 4 together. In the embodiment of the present application, the driving circuit layer 120 is disposed on the display substrate 110, and a plurality of pads 121 are arranged on the driving circuit layer 120 ( See Figure 12).

In this embodiment, the driving circuit layer 120 can be formed on the display substrate 110 through a thin film transistor manufacturing process, the material of the pad 121 can be copper, and the surface of the copper is coated with gold or nickel. Gold handling.

S300 , forming a first protection layer 130 on the driving circuit layer 120 , and opening a plurality of first installation holes 131 on the first protection layer 130 .

In this embodiment, as shown in FIG. 5 , the step S300 includes at least the following steps.

S31 , forming a first protective layer 130 on a side of the driving circuit layer 120 facing away from the display substrate 110 .

Specifically, please refer to FIG. 6 together. In the embodiment of the present application, the first protection layer 130 is formed on the side of the driving circuit layer 120 facing away from the display substrate 110. The first protection layer 130 It is used to protect the driving circuit layer 120 to prevent debris from being scratched during cleaning and residual water vapor from causing corrosion.

In this embodiment, the first protective layer 130 can be a colored protective layer, which can be formed on the driving circuit layer 120 by ink plus screen printing process, and the color of the ink is the same as that of the pad 121 Or the light-emitting chip 140 can form a larger contrast, which is beneficial to setting the boundary of the ink. Wherein, the color of the ink can be blue.

S32 , opening a plurality of first installation holes 131 arranged at intervals on the first protection layer 130 .

Specifically, please refer to FIG. 7 together. In the embodiment of the present application, the first protective layer 130 is provided with a plurality of first installation holes 131 arranged at preset distances, and the plurality of first installation holes 131 pass through The first protective layer 130 exposes the driving circuit layer 120 .

In this embodiment, the size of the first installation hole 131 can be set to be larger than the outer size of the light emitting chip 140 .

S400. Obtain a first distance and a second distance between the first mounting hole 131 and the first pad and the second pad located in the first mounting hole 131 and disposed on the driving circuit layer 120, respectively. .

Specifically, referring to FIG. 12 , in the embodiment of the present application, a plurality of pads 121 are arranged on the driving circuit layer 120 , and one light-emitting chip 140 is installed in each of the first mounting holes 131 . , since each of the light-emitting chips 140 has two electrodes, it is necessary to set the two pads 121 to be electrically connected to the two electrodes of the light-emitting chip 140 respectively. For the convenience of description, the same The two pads 121 disposed in the first mounting hole 131 are respectively defined as a first pad 121a and a second pad 121b. Before the light-emitting chip 140 is installed in the first mounting hole 131 (i.e., before the crystal-bonding process of the light-emitting chip 140), the first mounting hole 131 and the driving circuit opened on the first protective layer 130 are respectively obtained through the camera unit. The relative position data of the first pad 121a and the second pad 121b provided on the layer 120, and based on the relative position data, obtain the edge of the first mounting hole 131 to the first pad 121a and the second pad respectively. The first distance (X1, Y1) and the second distance (X2, Y2) of the edge of the second pad 121b. Wherein, the first distance includes a first transverse distance X1 and a first longitudinal distance between two adjacent sides of the first mounting hole 131 and two adjacent sides of the first pad 121a respectively. Distance Y1, the second distance includes the second lateral distance between two adjacent sides of the other side of the first mounting hole 131 and two adjacent sides of the second pad 121b respectively X2 and the second longitudinal distance Y2. At the same time, the camera unit can also collect position information of the corresponding pad 121 relative to the display substrate 110 .

In this embodiment, the camera unit may be a charge coupled device (Charge Coupled Device, CCD) camera.

S500. Mount a plurality of light emitting chips 140 in the first mounting holes 131 respectively, and electrically connect with the driving circuit layer.

Specifically, please refer to FIG. 8 together. In the embodiment of the present application, a plurality of the light-emitting chips 140 are respectively accommodated in the corresponding first mounting holes 131 , and communicate with the driver through the pads 121 . The circuit layer 120 is electrically connected for emitting light, and at the same time, the end of the light emitting chip 140 facing away from the driving circuit layer 120 exposes the first installation hole 131 .

In the embodiment of the present application, the light emitting chip 140 may be a Mini LED or a Micro LED. It can be understood that the light emitting chip 140 can be a red light emitting chip, a green light emitting chip or a blue light emitting chip.

S600. Obtain a third distance and a fourth distance between the first mounting hole 131 and the light emitting chip 140 located in the first mounting hole 131, respectively.

Specifically, please refer to FIG. 13. In the embodiment of the present application, after the light-emitting chip 140 is installed in the first mounting hole 131 (that is, after the crystal-bonding process of the light-emitting chip 140), the camera unit Respectively acquire relative position data of the first mounting hole 131 and the light emitting chip 140, and obtain a third distance (X1 ', Y1') and the fourth distance (X2', Y2'). Wherein, the third distance includes a third lateral distance X1 ′ and a third longitudinal distance between two adjacent sides of the first mounting hole 131 and two adjacent sides of the light-emitting chip 140 respectively. The distance Y1', the fourth distance includes the fourth lateral distance between two adjacent sides on the other side of the first mounting hole 131 and the two adjacent sides next to the light-emitting chip 140 X2' and a fourth longitudinal distance Y2'.

S700. Perform difference processing on the first distance, the second distance, the third distance, and the fourth distance to obtain a first horizontal difference, a second horizontal difference, a first vertical difference, and Second longitudinal difference.

Specifically, in the embodiment of the present application, the first lateral distance X1 and the third lateral distance X1' are processed to obtain a first lateral difference, and the second lateral distance X2 and the fourth lateral distance The distance X2' is processed to obtain a second transverse difference, the first longitudinal distance Y1 and the third longitudinal distance Y1' are processed to obtain a first longitudinal difference, and the second longitudinal distance Y2 and the first longitudinal distance Y1 are processed to obtain a first longitudinal difference. The fourth longitudinal distance Y2' is processed to obtain the second longitudinal difference. Wherein, the first transverse difference may be (X1-X1'), the second transverse difference may be (X2-X2'), and the first longitudinal difference may be (Y1-Y1'), The second longitudinal difference may be (Y2-Y2').

S800. Comparing the first lateral difference and the second lateral difference with a preset lateral offset distance, and comparing the first longitudinal difference and the second longitudinal difference with a preset longitudinal offset The moving distance is compared, and the welding condition of the light-emitting chip is judged according to the comparison result.

Specifically, in the embodiment of the present application, the first lateral difference and the second lateral difference are respectively compared with the preset lateral offset distance, and the first longitudinal difference and the second longitudinal difference are compared with the preset Compared with the preset vertical offset distance, if the first horizontal difference or the second horizontal difference is greater than the preset horizontal offset distance, or/and, the first vertical difference or the If the second longitudinal difference is greater than the preset longitudinal offset distance, the soldering of the light-emitting chip 140 is abnormal, and the position of the light-emitting chip 140 is subjected to feedback maintenance; if the first transverse difference and the second If the lateral difference is less than the preset lateral offset distance, and the first longitudinal difference and the second longitudinal difference are both smaller than the preset longitudinal offset distance, then the welding of the light-emitting chip 140 is normal. .

S900. Fabricate a package layer 150 including a plurality of second installation holes 151 on the first protection layer 130, and the end of the light emitting chip facing away from the driving circuit layer is accommodated in the second installation holes.

Specifically, please refer to FIG. 9 together. In the embodiment of the present application, the encapsulation layer 150 is disposed on the side of the first protective layer 130 facing away from the driving circuit layer 120, and has a A mounting hole 131 is aligned with a plurality of second mounting holes 151 , that is, the first mounting hole 131 corresponds to the second mounting hole 151 one by one. The part of the light emitting chip 140 exposed from the first mounting hole 131 is accommodated in the second mounting hole 151, and the encapsulation layer 150 is used to prevent crosstalk between the light emitting chips 140 and protect the light emitting chip 140. The circuit layer 120 and the light emitting chip 140 are driven.

In this embodiment, the encapsulation layer 150 may be a black encapsulation layer, specifically, the material of the encapsulation layer 150 may be black resin glue.

S1000, making a second protection layer 160 on the light emitting chip 140 and the encapsulation layer 150.

Specifically, please refer to FIG. 10 together. In the embodiment of the present application, the second protective layer 160 is covered on the light-emitting chip 140 and the encapsulation layer 150, specifically, the second protective layer 160 A part of the light-emitting chip 140 is covered on the end of the driving circuit layer 120, and a part of the packaging layer 150 is covered on the side of the first protective layer 130, so as to protect the light-emitting chip 140. light emitting surface, and enhance the appearance of the display device 100 .

In this embodiment, the second protective layer 160 may be a transparent protective layer, specifically, the material of the second protective layer 160 may be polyimide.

To sum up, in the manufacturing method of the display device of the present application, the first mounting hole 131 opened on the first protection layer 130 is respectively obtained to the first pad and the second pad provided on the driving circuit layer 120 respectively. The first distance and the second distance between the first mounting hole 131 and the light-emitting chip 140 located in the first mounting hole 131 are respectively obtained from the third distance and the fourth distance, and the first The distance, the second distance, the third distance and the fourth distance are subjected to difference processing to obtain the first horizontal difference, the second horizontal difference, the first vertical difference and the second vertical difference respectively, and the The first lateral difference and the second lateral difference are compared with the preset lateral offset distance, and the first vertical difference and the second vertical difference are compared with the preset longitudinal offset distance, and the light-emitting chip is judged according to the comparison result The soldering condition of the display panel can be accurately identified, so as to improve the overall yield of the display panel.

Based on the same inventive concept, the present application also provides an electronic device, the electronic device at least includes a power supply unit, a housing, and the display device 100 shown in the above embodiment, the power supply unit and the display device 100 are installed on the The housing, the power supply unit is electrically connected to the display device 100 , and the power supply unit is used to provide power for the display device 100 . Since the display device 100 has been described in detail in the above embodiment shown in FIG. 1 , its structure and working principle are the same as those in the above embodiment, and will not be repeated here. Wherein, the electronic equipment includes but is not limited to: conventional display equipment, handheld equipment such as mobile communication and PAD, ultra-thin display, and any electronic equipment or components with the display device, which is not specifically limited in this application. Specific examples include: e-paper watches, e-books, e-book readers, e-paper schoolbags, e-paper kanbans, e-paper labels, e-bank cards, e-paper bus cards and other related electronic products.

The flowchart described in this application is only an embodiment, and there may be various modifications and changes to this illustration or the steps in this application without departing from the spirit of this application. For example, the steps may be performed in a different order, or certain steps may be added, deleted or modified. Those skilled in the art can understand that all or part of the processes of the above embodiments are realized, and equivalent changes made according to the claims of the present application still fall within the scope of the invention.

In the description of this specification, reference to the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific examples" or "some examples" etc. The specific features, structures, materials or features described in the manner or example are included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

It should be understood that the application of the present application is not limited to the above examples, and those skilled in the art can make improvements or changes based on the above descriptions, and all these improvements and changes should belong to the protection scope of the appended claims of the present application. Those skilled in the art can understand that all or part of the methods for realizing the above embodiments, and the equivalent changes made according to the claims of the present application, still belong to the scope covered by the application.

Claims (9)

1. The utility model provides a display device, includes the display substrate and set up in drive circuit layer on the display substrate, its characterized in that, drive circuit layer includes a plurality of pads, drive circuit layer passes through pad and light emitting chip electric connection, display device still includes first protection layer, a plurality of light emitting chip, encapsulation layer and second protective layer, wherein, first protection layer set up in drive circuit layer is facing away from one side of display substrate, first protection layer is colored protective layer, through printing ink with silk screen printing process's mode form in on the drive circuit layer, and the colour of printing ink with the pad or light emitting chip is different, first protection layer is used for protecting drive circuit layer, a plurality of first mounting holes that the interval set up are seted up to first protection layer, a plurality of light emitting chip set up respectively in first mounting hole that first protection layer was seted up, and with drive circuit layer electric connection, encapsulation layer set up in first protection layer is facing away from one side of drive circuit layer, and set up with a plurality of second protection layer that align with first mounting hole is mutually with the light emitting chip is located on the encapsulation layer.

2. The display device according to claim 1, wherein the pad corresponds to a position of the light emitting chip.

3. The display device according to any one of claims 1-2, wherein the light emitting chip is a Mini LED or a Micro LED.

4. The display device according to any one of claims 1 to 2, wherein the encapsulation layer is a black encapsulation layer, and a material of the encapsulation layer is black resin paste; the second protective layer is a transparent protective layer, and the material of the second protective layer is polyimide.

5. A method for manufacturing a display device according to any one of claims 1 to 4, characterized in that the manufacturing method comprises:

providing a display substrate;

manufacturing a driving circuit layer on the display substrate;

manufacturing a first protective layer on the driving circuit layer, and forming a plurality of first mounting holes on the first protective layer;

a plurality of light emitting chips are respectively installed in the first installation holes and are electrically connected with the driving circuit layer;

manufacturing a packaging layer comprising a plurality of second mounting holes on the first protective layer, wherein one end of the light-emitting chip, which is opposite to the driving circuit layer, is accommodated in the second mounting holes;

And manufacturing a second protective layer on the light emitting chip and the packaging layer.

6. The method of manufacturing a display device according to claim 5, wherein the fabricating a first protective layer on the driving circuit layer and forming a plurality of first mounting holes on the first protective layer comprises:

manufacturing the first protective layer on one side of the driving circuit layer, which is opposite to the display substrate;

and a plurality of first mounting holes are formed in the first protective layer at intervals.

7. The method of manufacturing a display device according to claim 5, wherein after the first protective layer is formed on the driving wiring layer and the plurality of first mounting holes are formed in the first protective layer, the method comprises:

and acquiring a first distance and a second distance between the first mounting hole and a first bonding pad and a second bonding pad which are positioned in the first mounting hole and arranged on the driving circuit layer respectively.

8. The method of manufacturing a display device according to claim 7, wherein after the plurality of light emitting chips are mounted in the first mounting holes, respectively, and electrically connected to the driving circuit layer, the method of manufacturing includes:

Respectively obtaining a third distance and a fourth distance from the first mounting hole to the light-emitting chip positioned in the first mounting hole;

performing difference processing on the first distance, the second distance, the third distance and the fourth distance to obtain a first transverse difference value, a second transverse difference value, a first longitudinal difference value and a second longitudinal difference value respectively;

comparing the first transverse difference value with the second transverse difference value with a preset transverse offset distance, comparing the first longitudinal difference value with the second longitudinal difference value with the preset longitudinal offset distance, and judging the welding condition of the light-emitting chip according to a comparison result.

9. The method for manufacturing a display device according to claim 8, wherein comparing the first lateral difference and the second lateral difference with a preset lateral offset distance, and comparing the first longitudinal difference and the second longitudinal difference with a preset longitudinal offset distance, and judging the welding condition of the light emitting chip according to the comparison result, comprises:

if the first transverse difference value or the second transverse difference value is greater than the preset transverse offset distance or/and the first longitudinal difference value or the second longitudinal difference value is greater than the preset longitudinal offset distance, the welding of the light-emitting chip is abnormal;

And if the first transverse difference value and the second transverse difference value are smaller than the preset transverse offset distance, and the first longitudinal difference value and the second longitudinal difference value are smaller than the preset longitudinal offset distance, the welding of the light emitting chip is normal.

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