CN115046578A - Circuit structure integrating multiple sensing assemblies and terminal comprising circuit structure - Google Patents

Abstract

The invention relates to a circuit structure fusing multiple sensing assemblies and a terminal comprising the circuit structure. Under the condition that the collected data exceed a preset threshold value, the first acceleration sensing assembly can generate interruption to awaken the processing module in a dormant state, and the processing module responds to the awakening interruption of the first acceleration sensing assembly and opens the second acceleration sensing assembly to collect the data.

Description

A circuit structure of a fusion multi-sensing component and a terminal including the circuit structure

technical field

The invention belongs to the field of circuit structures of sensors, and in particular relates to a circuit structure integrating multiple sensors, in particular to a circuit structure integrating a vibration sensor and a terminal including the circuit structure. The terminal can be used to sense vibration and/or trajectory and/or gesture, etc.

Background technique

Vibration sensors can collect vibration data analysis of the measured object, especially high-frequency vibration. By passing these data through the cloud or local computer, many operations can be realized, including but not limited to: industrial equipment fault diagnosis. When the vibration of the measured target exceeds the set threshold, these abnormal data will be collected by the vibration sensor, and an alarm signal will be issued, so as to notify the relevant personnel to conduct inspection and avoid property damage.

Trajectory sensors are used to measure the real-time running and swinging trajectories of objects. By passing these data through the cloud or local computer, many operations can be realized, including but not limited to: power line detection, geological disasters such as landslide alarms, etc. The sensor will send the running trajectory of the target on the side to the server in real time. When abnormal data is detected, it will notify the relevant personnel to take corresponding measures, such as evacuating the masses.

The attitude sensor is used to analyze the static inclination of the target. By passing these data through the cloud or local computer, many operations can be realized, including but not limited to: dangerous wall detection. When the sensor detects that the inclination angle of the measured target exceeds the threshold, it will determine The target may be in danger, so the relevant personnel are notified to take appropriate measures.

The existing sensor technology has a single function and can only measure one of vibration, trajectory, and attitude, which cannot meet the needs of many scenarios.

In a scenario where many measurement parameters are required, the prior art meets the measurement requirements by combining a variety of different sensors. However, this method leads to high system power consumption and cost, which is labor-intensive and cannot be managed in a unified manner. What's more, there will be a sensor equipped with a dedicated data acquisition terminal, which greatly increases the cost of time, manpower and financial resources.

The patent publication number CN106840095A is a method for improving the measurement accuracy of inclinometers by paralleling multiple inclination sensor chips. First, a plurality of MEMS inclination sensor chips are used to measure the gravitational acceleration inclination data, and the white noise superposition principle is used to improve the system signal-to-noise ratio, and then the The gravitational acceleration value of each axis is converted into an angle value to obtain a high-precision inclination value. In order to ensure the measurement accuracy, a positioning silk screen is drawn on the PCB board to ensure the axis alignment of each MEMS inclination sensor chip. The invention patent is only designed for multiple inclination sensor chips, which belong to the same sensor configuration and can only collect one parameter, which improves the accuracy. This invention cannot collect multiple parameters simultaneously.

The invention with the patent publication number CN103479361B discloses smart glasses provided with an inertial sensor and a method for monitoring movement, preventing myopia and correcting sitting posture by using the smart glasses. The inertial sensor adopts an accelerometer or an angular velocity sensor, or an inertial measurement unit or an attitude reference system combined with a single, dual, and three-axis combination of an accelerometer or an angular velocity sensor. This invention can only measure attitude data.

Patent Publication No. CN205506187U discloses a dynamic weighing system for forklift trucks. Both attitude sensors and pressure sensors are used. In this patent, multiple attitude sensors and pressure sensors are independently installed in different positions, and the collected data is processed by the control unit. This patent can collect a variety of data but cannot install all sensors in a unified way, it needs to be installed separately and cannot be deployed quickly.

The patent publication number CN209625014U relates to a track image and inertial information collection device of a subway vehicle. The device includes a CCD camera, an acceleration sensor, an inclination sensor, a gyroscope, a host module, a pulse module, an ADC board, a DAC board, a hard disk, and a power supply module for power supply. The acceleration sensor and the inclination sensor are respectively connected with the host module through the ADC board card. The DAC board is respectively connected with the ADC board and the host module. The CCD camera, gyroscope and hard disk are respectively connected with the host module. The pulse module is respectively connected with the CCD camera and the host module. The patent handles a wide variety of data signals. Different data conversion boards need to be set for different sensors. Using a host to process data and using a hard disk to store data results in time-consuming and labor-intensive installation of the device, high operating costs, and difficulty in unified management of data.

References [1] Ji Dahai. The measurement method of underwater trajectory and attitude of training vehicle [J]. Ship Science and Technology, 2014, 36(01): 147-151. This document uses inertia to measure the trajectory and attitude of objects. In this document, the measurement component is installed on the measured target, and the movement trajectory and attitude of the target are measured through mathematical calculation.

In summary, the prior art has the following disadvantages:

1. The existing technology uses a single acceleration sensor, which cannot meet the application of object vibration, high-precision trajectory analysis, high-precision attitude analysis, and three different occasions.

2. The existing technology adopts a method of combining a variety of different sensors, which leads to high system power consumption and cost. When the object is moving, there is a certain installation deviation between the sensor and the sensor due to physical factors, and the axial direction of the data. Difficult to align.

3. The prior art adopts a method of combining a variety of different sensors, which is time-consuming and labor-intensive in installation, high in operating cost, and difficult to manage in a unified manner due to the wide variety of collected data.

In addition, on the one hand, there are differences in the understanding of those skilled in the art; on the other hand, because the applicant has studied a large number of documents and patents when making the present invention, but due to space limitations, all details and contents are not listed in detail, but this is by no means The present invention does not possess the features of the prior art, on the contrary, the present invention already possesses all the features of the prior art, and the applicant reserves the right to add relevant prior art to the background art.

SUMMARY OF THE INVENTION

Aiming at the deficiencies of the prior art, the present invention provides a terminal that integrates multi-sensing components. The terminal provided by the present invention may include a first acceleration sensing component, a second acceleration sensing component and a processing module. The first acceleration sensing component and the second acceleration sensing component are connected with the processing module through a communication protocol interface. The first acceleration sensing assembly and the second acceleration sensing assembly are arranged on the same plate body in a manner that is axially flush with each other so that the collected data are aligned, so that the processing module can sense the first acceleration. The component and the data collected by the second acceleration sensing component are processed. Preferably, after the first acceleration sensing assembly and the second acceleration sensing assembly are arranged on the same plate body in a shaft-aligned manner, the first acceleration sensing assembly and the second acceleration sensing assembly During data collection, at least one reference parameter is the same, which is convenient for the processing module of the terminal to perform fusion processing on data from different sensing components. Preferably, a variety of sensing components including a first acceleration sensing component, a second acceleration sensing component, an inertial measurement sensing component, and an inclination angle sensing component can be fused on the terminal. Preferably, the core components of the first acceleration sensing assembly, the second acceleration sensing assembly, the inertial measurement sensing assembly, and the inclination sensing assembly all include accelerometers. In the terminal of the present invention, a plurality of sensing assemblies with accelerometers as the core device are arranged on the board body of the same circuit structure in an axis-aligned manner, so that at least one parameter of the sensing assemblies (such as position height, relative coordinates, etc.) In the same way, the processing module of the terminal can reduce the parameters that need to be processed when the processing module of the terminal performs fusion processing on the data collected by the multi-sensing components, so as to realize fast processing.

According to a preferred embodiment, when the collected data exceeds a preset threshold, the first acceleration sensing component can generate an interrupt to wake up the processing module in a dormant state, and the processing module responds to the first The wake-up of an acceleration sensing component is interrupted, and the second acceleration sensing component is turned on for data collection. Preferably, the processing module of the terminal can also wake up other sensing components fused on the terminal including the inertial measurement sensing component and the inclination sensing component.

According to a preferred embodiment, the first acceleration sensing component includes at least a first acceleration sensor, and the first acceleration sensor can directly transmit the collected DC multi-axial data to the processing module for processing through a communication protocol interface . Preferably, the first acceleration sensor of the first acceleration sensing assembly will not enter a sleep state. The first acceleration sensor keeps real-time data collection of the target object. Preferably, the first acceleration sensor is provided with at least two data acquisition thresholds including a first threshold and a second threshold greater than the first threshold. When the data collected by the first acceleration sensor is lower than the first threshold, the first acceleration sensor keeps real-time data collection of the target object, but does not send a wakeup interrupt to the processing module, and the processing module maintains a sleep state. When the data collected by the first acceleration sensor is higher than the first threshold but lower than the second threshold, the first acceleration sensor sends a "first wake-up interrupt" to the processing module while maintaining real-time data collection of the target object, and the said The processing module enters the working state from the sleep state in response to the "reception of the first wake-up interrupt", and the processing module entering the working state processes the data collected by the first acceleration sensor received through the communication protocol interface. When the data collected by the first acceleration sensor is higher than the second threshold, the first acceleration sensor sends a "second wake-up interrupt" to the processing module while maintaining real-time data collection on the target object, and the processing module responds to the "second wake-up interrupt". 2. "Receipt of wake-up interrupt" enters the working state from the dormant state, and the processing module entering the working state wakes up the second acceleration sensing component among the various sensing components integrated by the terminal by running the preset program, which is compared with the first acceleration sensing component. The component (ie, the first acceleration sensor) has a higher bandwidth and is capable of collecting higher frequency data. The second acceleration sensor component collects data on the target object.

According to a preferred embodiment, the second acceleration sensing component includes at least a second acceleration sensor, a filter, a voltage follower and a high-speed ADC, and the second acceleration sensor will collect the collected AC uniaxial data which needs to be After passing through the filter, the voltage follower and the high-speed ADC in sequence, it is transmitted to the processing module through a communication protocol interface for processing. Preferably, the second acceleration sensing assembly is in a dormant state when the terminal that integrates multiple sensing assemblies is initially installed to collect data on the target object. If and only when the first acceleration sensing component set in the terminal of multiple sensing components sends an instruction to wake up the second acceleration sensing component to the processing module of the terminal, the processing module will wake up the second acceleration sensing component for data processing. Collect and process the collected data of the second acceleration sensing component received through the communication protocol interface.

According to a preferred embodiment, the first acceleration sensing assembly and the second acceleration sensing assembly are disposed on the board at positions away from the surrounding mechanical mounting holes, so as to prevent external stress from being transmitted to the sensor. In the terminal that integrates various sensing components provided by the present invention, each sensing component is placed on the circuit board in the center, so as to avoid the stress generated by the circuit board being transmitted to the circuit board due to encapsulation of the terminal. The data collected by the sensor component is inaccurate.

According to a preferred embodiment, the first acceleration sensing component and the second acceleration sensing component are configured to be driven by the current of the I/O port of the processing module to control on/off. The processing module of the terminal integrating multiple sensing components can run a preset program after being awakened by the first acceleration sensing component so that the processing module communicates with the second acceleration sensing component through the I/O port of the second acceleration sensing component. The acceleration sensing assembly is powered, so that the second acceleration sensing assembly is turned on so that the second acceleration sensing assembly performs data collection.

According to a preferred embodiment, the processing module includes a processing chip, a random access memory and a read-only memory. The processing module completes the processing of the data collected by the various sensors fused on the terminal through the processing chip, the random access memory and the read-only memory.

According to a preferred embodiment, the terminal can also integrate a temperature sensing component, an inertial measurement sensing component, and an inclination sensing component to collect the temperature, trajectory and attitude data of the measured object. Preferably, the processing module of the terminal that integrates multiple sensing components provided by the present invention can receive data collected by the temperature sensing component, the inertial measurement sensing component, and the inclination sensing component through a communication protocol interface. The processing module can also wake up/close the temperature sensing component, the inertial measurement sensing component, and the inclination sensing component by setting an interrupt through the I/O port.

According to a preferred embodiment, the frequency of data that can be collected by the first acceleration sensing assembly is lower than the frequency of data that can be collected by the second acceleration sensing assembly. Preferably, the terminal of the present invention realizes a wider spectrum acquisition range than a single sensing component by fusing the first acceleration sensing component and the second acceleration sensing component capable of collecting higher frequency data. The terminal of the present invention integrates the complementarity of the first acceleration sensing component and the second acceleration sensing component, so that the measurement data accuracy is higher.

The invention also provides a circuit structure for fusing the multi-sensing components. The circuit structure includes at least a first acceleration sensing component, a second acceleration sensing component and a processing module. The first acceleration sensing component and the second acceleration sensing component are connected with the processing module through a communication protocol interface. The first acceleration sensing assembly and the second acceleration sensing assembly are arranged on the same plate body in a manner of being axially aligned with each other so that the collected data are aligned. Preferably, the circuit structure can integrate one or a combination of a first acceleration sensing component, a second acceleration sensing component, a temperature sensing component, an inertial measurement sensing component, and an inclination sensing component.

Description of drawings

Fig. 1 is a schematic diagram of a preferred embodiment of the terminal of the present invention;

2 is a schematic circuit diagram of a processing chip of a preferred processing module of the terminal of the present invention;

3 is a schematic diagram of a preferred first acceleration sensing component circuit of the terminal of the present invention;

4 is a schematic diagram of a preferred temperature sensing component circuit of the terminal of the present invention;

5 is a schematic diagram of a preferred inertial measurement sensing component circuit of the terminal of the present invention;

FIG. 6 is a schematic circuit diagram of a preferred tilt angle sensing component of the terminal of the present invention;

7 is a schematic diagram of a preferred second acceleration sensing component circuit of the terminal of the present invention;

8 is a schematic diagram of a preferred embodiment of the circuit structure of the present invention;

FIG. 9 is a schematic diagram of the circuit structure of a preferred embodiment of Embodiment 3 of the present invention;

FIG. 10 is a schematic diagram of a terminal in a preferred implementation manner of Embodiment 4 of the present invention;

FIG. 11 is a schematic diagram of the circuit structure of a preferred implementation manner of Embodiment 4 of the present invention.

List of reference signs

100: terminal; 110: processing module; 111: processing chip; 112: random access memory; 113: read-only memory; 120: first acceleration sensing component; 130: temperature sensing component; 140: inertial measurement sensing component; 150 : tilt sensor assembly; 160: second acceleration sensor assembly; 161: second acceleration sensor; 162: filter; 163: voltage follower; 164: high-speed ADC.

Detailed ways

A detailed description will be given below in conjunction with FIGS. 1 to 11 .

With the development of sensor technology, more and more sensors are used. But sensor technology has a single function. When multiple kinds of data need to be collected, multiple kinds of data are usually obtained by setting multiple sensors or by mathematically analyzing the data collected by one sensor. In the field of mechanical fault diagnosis and predictive maintenance, sensors with vibration data acquisition function are needed to analyze the high-frequency vibration acceleration data of mechanical equipment. In the field of geological disaster monitoring and early warning, sensors with trajectory data acquisition and vibration data acquisition functions are needed to analyze movements such as debris flows, collapses, and landslides, calculate the vibration amplitude and sliding amplitude of rocks or soil, and analyze hazard data. In the field of marine disaster monitoring and early warning, sensors with trajectory data collection function are needed to analyze ocean wave height data. In the field of civil engineering structural safety monitoring, sensors with vibration data collection, attitude data collection, and trajectory data collection functions are needed to analyze the safety of civil engineering structures, such as bridge vibration analysis, and building dangerous wall tilt monitoring. In the field of power transmission line engineering safety monitoring and early warning, sensors with the functions of attitude data collection and trajectory data collection are needed to analyze the inclination of power towers and elliptical galloping of power lines, and to detect the dangerous situation of power towers and galloping power lines. The invention integrates various sensors into one terminal by designing the circuit structure, so that in the case of needing to collect various data, only one terminal needs to be set to realize the acquisition of various data. The terminal provided by the invention can solve the vibration of objects in industries such as mechanical fault diagnosis and predictive maintenance, geological disaster monitoring and early warning, marine disaster monitoring and early warning, civil engineering structure safety monitoring and early warning, power transmission line engineering safety monitoring and early warning, etc. , trajectory, attitude analysis problems.

The principle of the present invention to realize simultaneous vibration analysis, high-precision trajectory analysis and high-precision attitude analysis is to design a circuit structure that integrates multi-sensing components, which can include a first acceleration sensing component, an inertial measurement sensing component and an inclination sensor. components. Each sensing component is connected to the processing module. When the detected device generates data, such as vibration of the device is detected, the vibration sensor will generate a signal to notify the processing module. The processing module wakes up the corresponding sensor to collect data and sends the collected data to Data terminal detection.

Example 1

In mechanical fault diagnosis and predictive maintenance, geological disaster monitoring and early warning, marine disaster monitoring and early warning, civil engineering structure safety monitoring and early warning, transmission line engineering safety monitoring and early warning and other industries, sensors are needed to solve the vibration, trajectory, attitude of objects. analyse problem. At present, there are two methods for simultaneously measuring the vibration, trajectory, and attitude (static inclination) parameters of an object with a single sensor:

a. One is to use an acceleration sensor, which can calculate the vibration of the object and the inclination of the object (compared to the analysis of gravitational acceleration). At the same time, the acceleration data can be used to calculate the displacement of each axis through mathematical integration.

b. The other is to measure the vibration, trajectory, and attitude (static inclination) parameters of objects at the same time by combining several complete sensor devices, such as combining inertial measurement sensors and acceleration sensors, acceleration sensors Measure the vibration and attitude of the object, and the inertial measurement sensor measures the trajectory motion of the object.

To sum up, the defects existing in the prior art are as follows:

1. The existing technology uses a single acceleration sensor, which cannot meet the application of object vibration, high-precision trajectory analysis, high-precision attitude analysis, and three different occasions.

2. The existing technology adopts a method of combining a variety of different sensors, which leads to high system power consumption and cost. When the object is moving, there is a certain installation deviation between the sensor and the sensor due to physical factors, and the axial direction of the data. Difficult to align.

3. The prior art adopts a method of combining a variety of different sensors, which is time-consuming and labor-intensive in installation, high in operating cost, and difficult to manage in a unified manner.

4. The existing sensor has a single function and can only directly measure one of vibration, trajectory and attitude.

The existing sensor terminal technology has a single function, and can only measure one of the data of vibration, trajectory, attitude, temperature, humidity, air pressure, gas, wind speed, sound wave and light. In view of the above deficiencies, this embodiment discloses a terminal that integrates multi-sensing components. This embodiment can be used for sensors that sense vibration, trajectory, attitude, temperature, humidity, air pressure, gas, wind speed, sound waves, and light. Preferably, the terminal provided by the present invention is provided with a circuit structure integrating multi-sensing components, and the circuit structure can integrate a vibration sensor, a trajectory sensor and an attitude sensor. The present invention can simultaneously measure the parameters of object vibration, trajectory and attitude (static inclination). FIG. 1 is a schematic diagram of a preferred implementation manner of the terminal 100 in this embodiment. The present invention provides a terminal 100 that may include a processing module 110 , a first acceleration sensing component 120 , a temperature sensing component 130 , an inertial measurement sensing component 140 , an inclination sensing component 150 and a second acceleration sensing component 160 .

Preferably, the terminal 100 is configured with a processing module 110 . The processing module 110 is mainly composed of a processing chip 111 , a random access memory 112 and a read-only memory 113 . The processing module 110 receives the data sent by the sensing component through the communication protocol interface, so as to process the received data. FIG. 2 is a schematic diagram of the circuit structure of the processing chip 111 of the processing module 110 . Preferably, the processing chip 111 may be STM32F446ZET6. Preferably, the random access memory 112 may be SDRAM. Preferably, the read-only memory 113 may be FLASH. Preferably, the communication protocol interface may be an SPI communication protocol interface and/or an I/O interface.

Preferably, the terminal 100 is configured with a first acceleration sensing component 120 . The first acceleration sensing component 120 is connected with the processing module 110 through a communication protocol interface. The first acceleration sensing component 120 transmits the measured vibration data to the processing module 110 through a communication protocol interface. Preferably, the communication protocol may be the SPI communication protocol. Preferably, the first acceleration sensing assembly 120 includes at least a first acceleration sensor. Preferably, the first acceleration sensor may be a MEMS high-frequency acceleration sensor. FIG. 3 is a schematic circuit diagram of a preferred first acceleration sensing component 120 . Preferably, the MEMS high-frequency acceleration sensor adopts the high-frequency acceleration sensor KX132. This sensor is specially designed for high-frequency vibration analysis. The output frequency of the sensor is up to 25.6KHz, and the output bandwidth is up to 8.2KHz. Compared with the traditional acceleration sensor, the high-frequency acceleration sensor used in the present invention has a better effect in measuring high-frequency vibration. The accuracy of analyzing the vibration frequency by the acceleration signal of the sensor is higher.

Preferably, the terminal 100 is configured with a temperature sensing assembly 130 . The temperature sensing component 130 is connected with the processing module 110 through a communication protocol interface. The temperature sensing component 130 transmits the measured temperature data to the processing module 110 through the communication protocol interface. Preferably, the communication protocol interface may be an I/F interface. Figure 4 is a schematic circuit diagram of a preferred temperature sensing assembly. Preferably, the temperature sensing component 130 may be a MEMS temperature sensor. Preferably, the MEMS temperature sensor adopts NST1001. The NST1001 features a pulse counting type digital output and high accuracy over a wide temperature range. The NST1001 can be directly connected to the processing module 110 for use, so that the terminal can reduce the overhead while ensuring the measurement accuracy. The NST1001 device supports a maximum measurement accuracy of ±0.5°C over a temperature range of –50°C to 150°C, and at the same time has an extremely high resolution (0.0625°C), without the need for system calibration or hardware and software compensation in use.

角速度噪声低于

本发明使用6轴传感器独立分析物体的运动轨迹，角速度与加速度的轴向在芯片出厂时已校准，运动轨迹分析准确度更高。Preferably, the terminal 100 is configured with an inertial measurement sensing assembly 140 . The inertial measurement sensing assembly 140 is connected with the processing module 110 through a communication protocol interface. The inertial measurement sensing component 140 transmits the measured trajectory data to the processing module 110 through a communication protocol interface. Preferably, the communication protocol may be the SPI communication protocol. Figure 5 is a schematic circuit diagram of a preferred inertial measurement sensing assembly. Preferably, the inertial measurement sensing assembly 140 may be a MEMS inertial measurement sensor. Preferably, the MEMS inertial measurement sensor adopts a 6-axis sensor BMI085. This 6-axis sensor integrates acceleration and angular velocity sensors, and the acceleration noise is lower than

Angular velocity noise is less than

The invention uses the 6-axis sensor to independently analyze the motion trajectory of the object, the axial direction of the angular velocity and the acceleration has been calibrated when the chip leaves the factory, and the motion trajectory analysis accuracy is higher.

Preferably, the terminal 100 is configured with an inclination sensor assembly 150 . The tilt sensor assembly 150 is connected with the processing module 110 through a communication protocol interface. The inclination sensor assembly 150 transmits the measured attitude data to the processing module 110 through the communication protocol interface. Preferably, the communication protocol may be the SPI communication protocol. FIG. 6 is a schematic circuit diagram of a preferred tilt sensor assembly. Preferably, the tilt sensing component 150 may be a MEMS tilt sensor. Preferably, the MEMS tilt sensor adopts the tilt sensor SCL3300-D01. The measured angle is accurate to 0.0055°, the noise is less than 0.001°√Hz, and the sensor is internally calibrated, which is more accurate than that calculated using traditional accelerometers.

Preferably, the terminal 100 is configured with a second acceleration sensing component 160 . The second acceleration sensing component 160 is connected with the processing module 110 through a communication protocol interface. The second acceleration sensing component 160 transmits the measured vibration data to the processing module 110 through a communication protocol interface. Preferably, the communication protocol may be the SPI communication protocol. The second acceleration sensing component 160 is composed of at least a second acceleration sensor 161 , a filter 162 , a voltage follower 163 and a high-speed ADC 164 . Preferably, the second acceleration sensor 161 may be a MEMS-IEPE high-frequency acceleration sensor. Preferably, the MEMS-IEPE high-frequency acceleration sensor adopts the acceleration sensor ADXL100X. The second acceleration sensor 161 outputs an analog signal, which is sampled by the filter 162 , the voltage follower 163 , and the high-speed ADC 164 , and then output to the processing module 110 to process the signal.

FIG. 7 is a schematic circuit diagram of a preferred second acceleration sensing component 160 . Preferably, the circuit of the second acceleration sensing component 160 includes at least a second acceleration sensor 161 , a filter 162 , a voltage follower 163 and a high-speed ADC 164 . As shown in FIG. 7 , after the second acceleration sensor 161 passes through the filter 162 and the voltage follower 163, the voltage signal of the second acceleration sensor 161 is sampled by the high-speed ADC 164, and then connected to the processing module 110 through the SPI bus to realize the second acceleration The sensor 161 collects the voltage signal, and the second acceleration sensing component 160 is highly integrated in the system. Preferably, the second acceleration sensor 161 may be an ADXL100X series MEMS-IEPE chip. Preferably, the filter 162 may be a band-limited filter. Preferably, the band-limit filter circuit is mainly composed of an operational amplifier and at least one resistor and at least one capacitor. Preferably, the voltage follower 163 is composed of at least two operational amplifiers. Preferably, the operational amplifier may be an OPA4325. Preferably, the high-speed ADC chip can be MCP3561. The ADXL100X chip has the lowest noise when the supply voltage is 5V. In order to improve the data collection accuracy of the second acceleration sensing component 160, in this embodiment, the system power supply is converted from DC to DC to 5V, and then the ADXL100X is powered. The MEMS-IEPE chip is connected to a band-limit filter at the rear stage to increase the accuracy of the high-frequency response of the sensor. High-speed ADC164 unit, power supply is 3V3. The output of the amplifier is divided by the resistor and then output to the voltage follower through the band-limit filter circuit, so that the 5V signal is linearly reduced to the 3V3 range. After the voltage follower 163, the impedance of the MEMS-IEPE chip signal is reduced, making the high-speed ADC164 sampling more precise.

Preferably, the first acceleration sensing component 120 , the inertial measurement sensing component 140 , the tilt angle sensing component 150 and the second acceleration sensing component 160 all use SPI ports to transmit data. Sensing components containing accelerometers use the same communication protocol. Preferably, the communication protocol may be an SPI communication protocol.

Preferably, the present invention uses the SPI port to transmit data for the kx132 acceleration sensor. Preferably, the present invention sets the communication speed of the SPI port connected to the kx132 accelerometer to 10MHZ, so as to avoid the situation of data overflow caused by too high sensor sampling rate setting and too low communication speed.

Preferably, in consideration of the power consumption of the terminal 100, each sensing component is configured to work only when it is in use, and is kept off when not in use. This method does not use the conventional MOS tube to control the on-off mode of the power supply, but is driven by the current of the I/O port, which further reduces the size while reducing the power consumption.

Preferably, when the collected data exceeds a preset threshold, the first acceleration sensing component 120 can generate an interrupt to wake up the processing module 110 in a dormant state. The processing module 110 turns on the second acceleration sensing assembly 160 for data collection in response to the wake-up interrupt of the first acceleration sensing assembly 120 . Preferably, the processing module 110 of the terminal 100 can also wake up other sensing components fused on the terminal 100 including the inertial measurement sensing component 140 and the inclination sensing component 150 .

Example 2

This embodiment discloses a circuit structure of a fusion multi-sensing component. The circuit structure of this embodiment at least includes a first acceleration sensing component 120 , an inertial measurement sensing component 140 and an inclination angle sensing component 150 .

FIG. 8 is a schematic diagram of a preferred embodiment of the circuit structure of a fusion multi-sensing assembly provided by the present invention.

As shown in FIG. 8 , the first acceleration sensing assembly 120 , the inertial measurement sensing assembly 140 and the inclination angle sensing assembly 150 are arranged on the same circuit board. The sensing assembly needs to be installed away from the surrounding mechanical mounting holes to avoid external stress being transmitted to the sensing assembly. The three sensing components are arranged in an axis-aligned manner, which is convenient for maintaining data alignment during data processing and achieving high-precision data fusion.

Preferably, only the first acceleration sensing component 120 may be provided on the circuit board when only the vibration analysis of the object is required. The installation position of the first acceleration sensing assembly 120 is away from the surrounding mechanical mounting holes, so as to reduce the transmission of external stress to the first acceleration sensing assembly 120 .

Preferably, only the inertial measurement sensing component 140 may be provided on the circuit board when only the motion trajectory analysis of the object is required. Preferably, in the present invention, in order to reduce the transfer of external stress to the inertial measurement sensing assembly 140, the inertial measurement sensing assembly 140 is placed in the center.

Preferably, only the inclination sensor component 150 may be provided on the circuit board in the case that only the attitude analysis of the object is required. Preferably, the placement position of the inclination sensor assembly 150 is set at a position away from the edge mounting holes of the circuit board, so as to reduce the transmission of external stress to the inclination sensor assembly 150 .

Preferably, in the case where vibration analysis and motion trajectory analysis of the object are required, only the first acceleration sensing component 120 and the inertial measurement sensing component 140 may be provided on the circuit board. The first acceleration sensing assembly 120 and the inertial measurement sensing assembly 140 are placed on the circuit board in a position away from the mounting holes in an axis-aligned manner, so as to avoid the transfer of the stress at the mounting holes to the first acceleration sensing assembly 120 and the inertial measurement sensor assembly 140. The first acceleration sensing component 120 and the inertial measurement sensing component 140 are arranged in an axis-aligned manner, so that the collected data keeps the data alignment, thereby realizing high-precision data fusion.

Preferably, only the first acceleration sensing component 120 may be provided on the circuit board when vibration analysis and motion trajectory analysis of the object are required and the requirements for the accuracy of motion trajectory analysis are low. The first acceleration sensing component 120 can calculate the vibration of the object, and at the same time, through the acceleration data, the displacement of each axis can be calculated through mathematical integration, and then the movement trajectory of the object can be analyzed. The first acceleration sensing assembly 120 is installed in the middle of the circuit board away from the edge to avoid stress at the edge mounting hole.

Preferably, when vibration analysis and attitude analysis of an object are required, at least a first acceleration sensing component 120 and an inclination sensing component 150 are provided on the circuit board. The first acceleration sensing assembly 120 and the inclination sensing assembly 150 are axially aligned on the circuit board. The first acceleration sensing assembly 120 and the inclination sensing assembly 150 are placed in the middle of the circuit board. The first acceleration sensing assembly 120 and the inclination sensing assembly 150 are far away from the mounting holes on the circuit board, so that the stress at the mounting holes can prevent the data collection of the sensing assemblies from being affected. The first acceleration sensing assembly 120 and the inclination sensing assembly 150 are axially aligned on the circuit board. The data collected by the first acceleration sensing component 120 and the inclination sensing component 150 are kept aligned during data processing, so as to achieve high-precision data fusion.

Preferably, only the first acceleration sensing component 120 may be provided on the circuit board when vibration analysis and attitude analysis of the object are required and the accuracy of motion trajectory analysis is low. The first acceleration sensing component 120 can calculate the vibration of the object, and at the same time obtain the posture of the object by comparing the gravitational acceleration analysis. The installation position of the first acceleration sensing assembly 120 is away from the installation hole, so as to avoid the first acceleration sensing assembly 120 from being subjected to the stress at the edge installation hole.

Preferably, in the case where attitude analysis and motion trajectory analysis of an object are required, an inclination sensor component 150 and an inertial measurement sensor component 140 are provided on the circuit board. The positions of the inclination sensor assembly 150 and the inertial measurement sensor assembly 140 are installed away from the surrounding mechanical mounting holes, so as to reduce the transmission of external stress to the inclination angle sensor assembly 150 and the inertial measurement sensor assembly 140 . The inclination sensor component 150 and the inertial measurement sensor component 140 are kept in axis alignment, which is convenient for maintaining data alignment during data processing and realizing high-precision data fusion.

Preferably, in the case where attitude analysis and motion trajectory analysis of the object are required, only the inertial measurement sensing component 140 may be configured on the circuit board. The attitude analysis and motion trajectory analysis of the object are realized through mathematical solution. The inertial measurement sensing assembly 140 is installed at a position away from the mounting hole of the circuit board, and is located in the middle of the circuit board, so that the stress at the mounting hole can prevent the data collection of the sensing assembly from being affected.

Preferably, only the first acceleration sensing component 120 may be configured on the circuit board when vibration analysis, motion trajectory analysis and attitude analysis are required for the object and the requirements for data collection accuracy are low. The first acceleration sensing component 120 is far away from the mounting hole on the circuit board, so that the data collection of the sensing component can be prevented from being affected by the stress at the mounting hole.

Preferably, in the case where vibration analysis, high-precision motion trajectory analysis and high-precision attitude analysis of the object are required, the first acceleration sensing component 120, the inertial measurement sensing component 140 and the inclination sensing component 150 are simultaneously arranged on the circuit board superior. The sensing assembly needs to be installed away from the surrounding mechanical mounting holes to avoid external stress being transmitted to the sensing assembly. The three sensing assemblies are arranged in an axis-aligned manner. At the same time, the sensor is calibrated when leaving the factory to ensure that the axial alignment of the sensor is within a certain error range. The data collected by the sensing components maintains data alignment during data processing to achieve high-precision data fusion.

According to actual use requirements, only one or two of the three sensing components of the first acceleration sensing component 120, the inertial measurement sensing component 140 and the inclination sensing component 150 may be provided on the circuit board, or all of them may be provided on the circuit board. board.

Preferably, the first acceleration sensing component 120 may be a MEMS high-frequency acceleration sensor. Preferably, the inertial measurement sensor assembly 140 may be a MEMS inertial measurement sensor. Preferably, the tilt sensor assembly 150 may be a MEMS tilt sensor. As shown in FIG. 8 , a MEMS high-frequency acceleration sensor (ie, a first acceleration sensor), a MEMS inertial measurement sensor and a MEMS tilt sensor are integrated on one circuit board. The size of the circuit board is smaller. Preferably, the size of the entire circuit board is about 40×27.7mm. The sensor needs to be installed away from the surrounding mechanical mounting holes to avoid external stress being transmitted to the sensor. The three sensors are arranged in an axis-aligned manner, which facilitates data alignment during data processing and achieves high-precision data fusion.

Preferably, the first acceleration sensing assembly 120, the inertial measurement sensing assembly 140 and the inclination sensing assembly 150 can be provided on separate circuit boards. In actual use, install the required circuit board on a circuit board.

Preferably, the first acceleration sensing assembly 120 , the inertial measurement sensing assembly 140 , and the inclination angle sensing assembly 150 used in this embodiment and their connected components are the same as those in Embodiment 1, and will not be repeated here.

Example 3

This embodiment is a further improvement of Embodiments 1 and 2 and their combination, and repeated content will not be repeated.

Preferably, as shown in FIG. 9 , only the circuit board configured with the second acceleration sensing component 160 is installed. The second acceleration sensing component 160 transmits the measured vibration data to the processing module 110 through a communication protocol interface. Preferably, the communication protocol may be the SPI communication protocol. The second acceleration sensor assembly 160 is composed of at least a second acceleration sensor 161 , a filter 162 , a voltage follower 163 and a high-speed ADC 164 . Preferably, the second acceleration sensor 161 may be a MEMS-IEPE high-frequency acceleration sensor. Preferably, the MEMS-IEPE high-frequency acceleration sensor adopts ADXL100X series MEMS IEPE chips. The second acceleration sensor 161 outputs an analog signal, which is sampled by the filter 162 , the voltage follower 163 , and the high-speed ADC 164 , and then output to the processing module 110 to process the signal. The board size is smaller. Preferably, the size of the entire circuit board is about 40×27.7mm. The sensor is mounted away from the surrounding mechanical mounting holes to avoid external stress being transmitted to the sensor. The sensor is placed in the center, and there is no device behind it, which ensures that the sensor is subject to minimal interference from external forces.

Preferably, the second acceleration sensing assembly 160 and its connected components used in this embodiment are the same as those in Embodiment 1 and Embodiment 2, and will not be repeated here.

Example 4

This embodiment is a further improvement to Embodiments 1, 2, 3 and their combinations, and repeated content will not be repeated.

There are two solutions for the measurement of vibration signals in the prior art. One is to use a single ACC accelerometer, but a single ACC accelerometer can only measure vibration signals with a DC frequency within 10KHz. The disadvantage of this solution is that it cannot measure high-frequency vibration. The second is to use the IEPE accelerometer. Due to the limitation of IEPE itself, this solution can only measure the unidirectional vibration of AC and high frequency (not less than 10KHz). Either option has limitations. If you want to measure AC, DC, high frequency, low frequency, and multi-axis acceleration at the same time, it is necessary to install two sensors on the device under test at the same time. This embodiment provides a terminal 100 that can be used for vibration measurement. The terminal 100 of this embodiment realizes the advantages of both the ACC accelerometer and the IEPE accelerometer on only one set of equipment, and realizes that both AC signals and DC signals can be measured, both low frequency and high frequency can be measured, and the measurement direction is not single. . The terminal 100 of this embodiment provides a circuit structure design to fuse a plurality of sensors on a circuit board and protects the sensors from external stress, electromagnetic interference, and the like.

Referring to FIG. 10 , the terminal 100 of this embodiment may include a first acceleration sensing component 120 , a second sensing component 160 and a processing module 110 . The first acceleration sensing component 120 and the second acceleration sensing component 160 of the present invention are connected to the processing module 110 through a communication protocol interface. Preferably, the first acceleration sensing component 120 includes at least a first acceleration sensor, and the first acceleration sensor can directly transmit the collected DC multi-axial data to the processing module 110 for processing through a communication protocol interface. Preferably, the first acceleration sensor of the first acceleration sensing assembly 120 will not enter a sleep state. The first acceleration sensor keeps real-time data collection of the target object. Preferably, the first acceleration sensor is provided with at least two data acquisition thresholds including a first threshold and a second threshold greater than the first threshold. When the data collected by the first acceleration sensor is lower than the first threshold, the first acceleration sensor keeps real-time data collection of the target object, but does not send a wakeup interrupt to the processing module 110, and the processing module 110 maintains a sleep state. When the data collected by the first acceleration sensor is higher than the first threshold but lower than the second threshold, the first acceleration sensor sends a "first wakeup interrupt" to the processing module 110 while maintaining real-time data collection of the target object, and processing The module 110 enters the working state from the sleep state in response to the "reception of the first wake-up interrupt", and the processing module 110 entering the working state processes the data collected by the first acceleration sensor received through the communication protocol interface. When the data collected by the first acceleration sensor is higher than the second threshold, the first acceleration sensor sends a "second wake-up interrupt" to the processing module 110 while maintaining real-time data collection of the target object, and the processing module 110 responds to the "second wake-up interrupt". 2. "Receipt of wake-up interrupt" enters the working state from the dormant state, and the processing module 110 entering the working state wakes up the second acceleration sensing component 160 among the various sensing components fused by the terminal 100 by running a preset program, and the second acceleration sensing component 160 is compared with the first one. The acceleration sensing component 120 (ie, the first acceleration sensor) has a higher bandwidth and is capable of collecting higher frequency data. The second acceleration sensing component 160 collects data on the target object.

Preferably, the second acceleration sensing component 160 includes at least a second acceleration sensor 161 , a filter 162 , a voltage follower 163 and a high-speed ADC 164 . The collected AC uniaxial data collected by the second acceleration sensor 161 needs to pass through the filter 162 , the voltage follower 163 and the high-speed ADC 164 in sequence, and then are transmitted to the processing module 110 through the communication protocol interface for processing. Preferably, the second acceleration sensing assembly 160 is in a dormant state when the terminal 100 incorporating multiple sensing assemblies is initially installed to collect data on the target object. The processing module 110 will wake up the second acceleration sensing component 160 when and only when the first acceleration sensing component 120 provided in the terminal 100 with multiple sensing components sends an instruction to wake up the second acceleration sensing component 160 to the processing module 110 of the terminal 100 The acceleration sensing component 160 performs data collection and processes the collected data of the second acceleration sensing component 160 received through the communication protocol interface.

The first acceleration sensing assembly 120 and the second acceleration sensing assembly 160 are arranged on the same plate body in a manner that is axially flush with each other so that the collected data are aligned, so that the processing module 110 can easily detect the first acceleration sensing assembly 120 and the second acceleration sensing assembly 160 . The data collected by the acceleration sensing component 160 is processed. Specifically, referring to FIG. 11 , the first acceleration sensor of the first acceleration sensing assembly 120 and the second acceleration sensor 161 of the second acceleration sensing assembly 160 are arranged on the same plate body in an axially aligned manner. Preferably, the first acceleration sensor may be a MEMS high-frequency acceleration sensor, and the specific model may be KX132. Preferably, the second acceleration sensor 161 may be an ADXL100X series MEMS-IEPE chip.

Preferably, after the first acceleration sensing assembly 120 and the second acceleration sensing assembly 160 are arranged on the same plate body in an axis-aligned manner, when the first acceleration sensing assembly 120 and the second acceleration sensing assembly 160 perform data collection At least one reference parameter is the same, so that the processing module 110 of the terminal 100 can perform fusion processing on data from different sensing components. Preferably, the core components of the first acceleration sensing assembly 120 and the second acceleration sensing assembly 160 both include accelerometers. In the terminal 100 of the present invention, a plurality of sensing assemblies with an accelerometer as the core device can be arranged on the board body of the same circuit structure in an axis-aligned manner, so that at least one parameter of the sensing assemblies (such as position height, relative coordinate etc.) are the same, so that the processing module 110 of the terminal 100 can reduce the parameters that need to be processed when performing fusion processing on the data collected by the multi-sensing components, thereby realizing fast processing.

Preferably, the first acceleration sensing assembly 120 and the second acceleration sensing assembly 160 are disposed on the plate body at positions away from the surrounding mechanical mounting holes, so as to prevent external stress from being transmitted to the sensor. In the terminal 100 that integrates various sensing components provided by the present invention, each sensing component is placed on the circuit board in the center, so as to avoid the stress generated by the circuit board being transmitted to the circuit board due to the packaging of the terminal 100 to place the sensing components on the circuit board. This leads to inaccurate results of the collected data from the sensing components.

Preferably, the first acceleration sensing component 120 and the second acceleration sensing component 160 are configured to be driven by the current of the I/O port of the processing module 110 to control on/off. After the processing module 110 of the terminal 100 integrating multiple sensing components is woken up by the first acceleration sensing component 120, the processing module 110 may run a preset program so that the processing module 110 communicates with the second acceleration sensing component 160 through the I/O port of the second acceleration sensing component 160. The second acceleration sensing assembly 160 is powered, so that the second acceleration sensing assembly 160 is turned on so that the second acceleration sensing assembly 160 performs data collection.

Preferably, the processing module 110 includes a processing chip 111 , a random access memory 112 and a read-only memory 113 . The processing module 110 completes the processing of the data collected by the various sensors integrated on the terminal 100 through the processing chip 111 , the random access memory 112 and the read-only memory 113 .

Preferably, the frequency of data that can be collected by the first acceleration sensing component 120 is lower than the frequency of data that can be collected by the second acceleration sensing component 160 . Preferably, the terminal 100 of the present invention achieves a wider spectrum acquisition range than a single sensing component by fusing the first acceleration sensing component 120 and the second acceleration sensing component 160 capable of collecting higher frequency data. The terminal of the present invention integrates the complementarity of the first acceleration sensing component 120 and the second acceleration sensing component 160, so that the measurement data accuracy is higher. The first acceleration sensor assembly 120 can measure vibration signals with three axial directions, DC signals, and frequencies within 10KHz by using the first acceleration sensor, but cannot measure vibration signals above 10KHz. The second acceleration sensing component 160 is capable of measuring AC signal, uniaxial vibration, and the frequency is above 10KHz. The invention combines two acceleration sensing components, perfectly combines the advantages of the two, not only has wide application, but also greatly improves the measurable range.

It should be noted that the above-mentioned specific embodiments are exemplary, and those skilled in the art can come up with various solutions inspired by the disclosure of the present invention, and these solutions also belong to the disclosure scope of the present invention and fall within the scope of the present invention. within the scope of protection of the invention. It should be understood by those skilled in the art that the description of the present invention and the accompanying drawings are illustrative rather than limiting to the claims. The protection scope of the present invention is defined by the claims and their equivalents. In the whole text, the features introduced by "preferably" are only an optional way, and should not be construed as a mandatory setting, so the applicant reserves the right to abandon or delete the relevant preferred features at any time. The description of the present invention contains multiple inventive concepts, such as "preferably", "according to a preferred embodiment" or "optionally" all indicate that the corresponding paragraph discloses a separate concept, and the applicant reserves the right to propose divisions according to each inventive concept the right to apply.

Claims (10)

1. The terminal integrating multiple sensing assemblies is characterized by at least comprising a first acceleration sensing assembly (120), a second acceleration sensing assembly (160) and a processing module (110), wherein the first acceleration sensing assembly (120) and the second acceleration sensing assembly (160) are connected with the processing module (110) through a communication protocol interface, the first acceleration sensing assembly (120) and the second acceleration sensing assembly (160) are arranged on the same plate body in a mode that the first acceleration sensing assembly (120) and the second acceleration sensing assembly (160) are axially flush with each other so that collected data are aligned, and the processing module (110) is convenient to process the data collected by the first acceleration sensing assembly (120) and the second acceleration sensing assembly (160).

2. The terminal integrating multiple sensing assemblies according to claim 1, wherein the first acceleration sensing assembly (120) is capable of generating an interrupt to wake up the processing module (110) in the sleep state if the collected data exceeds a preset threshold, and the processing module (110) turns on the second acceleration sensing assembly (160) for data collection in response to the wake-up interrupt of the first acceleration sensing assembly (120).

3. The terminal of claim 1 or 2, wherein the first acceleration sensing component (120) comprises at least a first acceleration sensor capable of directly transmitting the acquired direct current multi-axial data to the processing module (110) for processing via a communication protocol interface.

4. The terminal integrating multiple sensing assemblies according to any one of claims 1 to 3, wherein the second acceleration sensing assembly (160) at least comprises a second acceleration sensor (161), a filter (162), a voltage follower (163) and a high-speed ADC (164), and the second acceleration sensor (161) transmits the acquired data in the single axial direction of the acquired alternating current to the processing module (110) for processing through a communication protocol interface after sequentially passing through the filter (162), the voltage follower (163) and the high-speed ADC (164).

5. The terminal of one of claims 1 to 4, wherein the first acceleration sensing assembly (120) and the second acceleration sensing assembly (160) are disposed on the board body at positions far away from the surrounding mechanical mounting holes, so as to avoid external stress from being transmitted to the sensor.

6. The terminal of any one of claims 1 to 5, wherein the first acceleration sensing component (120) and the second acceleration sensing component (160) are configured to be driven by a current through an I/O port of the processing module (110) to control on/off.

7. The terminal with the multi-sensor assembly fused according to any one of claims 1 to 6, wherein the processing module (110) comprises a processing chip (111), a random access memory (112) and a read only memory (113).

8. The terminal integrating multiple sensing assemblies according to any one of claims 1 to 7, wherein the terminal is further capable of integrating a temperature sensing assembly (130), an inertial measurement sensing assembly (140) and an inclination angle sensing assembly (150) to acquire temperature, track and attitude data of a measured object.

9. The terminal of any of claims 1 to 8, wherein the first acceleration sensing component (120) is capable of collecting data at a lower frequency than the second acceleration sensing component (160).

10. The circuit structure fused with multiple sensing assemblies is characterized by at least comprising a first acceleration sensing assembly (120), a second acceleration sensing assembly (160) and a processing module (110), wherein the first acceleration sensing assembly (120) and the second acceleration sensing assembly (160) are connected with the processing module (110) through a communication protocol interface, and the first acceleration sensing assembly (120) and the second acceleration sensing assembly (160) are arranged on the same plate body in an axial collinear mode.

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