CN114914205A - Highly integrated motor controller power unit assembly, three-phase full-bridge motor controller and new energy automobile - Google Patents
Highly integrated motor controller power unit assembly, three-phase full-bridge motor controller and new energy automobile Download PDFInfo
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- CN114914205A CN114914205A CN202210545772.8A CN202210545772A CN114914205A CN 114914205 A CN114914205 A CN 114914205A CN 202210545772 A CN202210545772 A CN 202210545772A CN 114914205 A CN114914205 A CN 114914205A
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P27/00—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage
- H02P27/04—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage
- H02P27/06—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage using DC to AC converters or inverters
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Abstract
A highly integrated motor controller power unit assembly, a three-phase full-bridge motor controller and a new energy automobile relate to the technical field of power module packaging and motor controllers. The invention arranges various circuits and sensors in the plastic package module, uniformly dissipates heat, is uniformly connected, finally performs uniform plastic package, has the advantages of small volume and high heat dissipation efficiency, and effectively solves the problems of large volume, poor heat dissipation effect and the like in the prior art. The invention comprises a motor control power circuit, a positive power terminal, a negative power terminal, a signal terminal, a three-phase output power terminal, a double-sided copper-coated ceramic substrate, a radiator and a plastic package shell; the motor control power circuit, the positive power terminal, the negative power terminal, the signal terminal and the three-phase output power terminal are arranged on the front surface of the double-sided copper-clad ceramic substrate, and the back surface of the double-sided copper-clad ceramic substrate is fixedly connected with the radiator; and a plastic package shell is arranged on the radiator, and the radiator and the plastic package shell form a potting cavity and are molded in an integrated plastic package mode. The invention is suitable for motor controller technology.
Description
Technical Field
The invention relates to the technical field of power module packaging and motor controllers.
Background
The demand of the new energy vehicle on an electric drive system is the core driving force of technical innovation, and researches are mainly carried out around high efficiency, high power density, low noise, high EMC (electro magnetic compatibility) grade, high functional safety grade, high reliability and durability, low cost and the like. The power unit is an electric energy conversion core assembly of an electric drive system, determines key attributes such as the dynamic property, economy, comfort and reliability of the whole vehicle, and has the cost of 40% of the super electric drive system. The technologies of deep integration, innovative upgrade of materials and processes, lean design and fine manufacture and the like are the technological development trends of the current power units of the electric drive system and are also key technical paths for improving system indexes in the future.
The existing vehicle motor controller power unit assemblies are generally divided into two categories according to the packaging form of a power semiconductor switching device, namely a power unit based on a standard module form and a power unit based on a discrete device form.
The power unit arrangement structure based on the standard module is influenced by the appearance of the module, and is difficult to realize special-shaped structure, compact and small size, discrete power level, large redundancy, large stray parameter of a power loop and higher cost.
Furthermore, the existing power unit assembly mechanically connects a plurality of independently packaged part structures through bolts, welding and other modes, the later-stage manual assembly mode has the problems of poor installation, poor electrical connection, poor shock resistance and the like, the secondary or multiple packaging mode has poor heat dissipation effect, and the heat radiator has large volume, so that the system is large in volume. In the arrangement mode of assembling a plurality of parts at the later stage, the electric wiring is long and the wiring is hot inevitably, the area of a power loop is large due to limited device arrangement, stray parameters in the power loop are increased, and the system performance is influenced.
In summary, the prior art has the problems of large volume, poor heat dissipation effect, high cost, large stray parameters of a power loop, complex processing technology, difficulty in ensuring production consistency and the like, and is a technical problem which is desired to be solved in the field, but an effective solution is not obtained all the time.
Disclosure of Invention
The invention aims to provide a highly integrated motor controller power unit assembly, which arranges various circuits and sensors inside a plastic package module, uniformly dissipates heat, is uniformly connected, and finally is uniformly packaged.
In order to achieve the purpose, the invention provides the following scheme:
a highly integrated motor controller power unit assembly comprises a motor control power circuit, a positive power terminal, a negative power terminal, a signal terminal, a three-phase output power terminal, a double-sided copper-coated ceramic substrate, a radiator and a plastic package shell;
the motor control power circuit, the positive power terminal, the negative power terminal, the signal terminal and the three-phase output power terminal are all arranged on the front surface of the double-sided copper-clad ceramic substrate, and the back surface of the double-sided copper-clad ceramic substrate is fixedly connected with the radiator;
the plastic package shell is arranged on the radiator, a potting cavity is formed by the radiator and the plastic package shell, and the double-sided copper-clad ceramic substrate, the motor control power circuit, the positive power terminal, the negative power terminal, the signal terminal and the three-phase output power terminal are all arranged in the potting cavity;
the wiring ends of the positive power terminal, the negative power terminal, the signal terminal and the three-phase output power terminal all extend out of the encapsulation cavity.
Further, in a preferred embodiment, the internal signal of the motor control power circuit is connected to the binding line through a copper-clad layout circuit on the ceramic substrate.
Further, in a preferred embodiment, the motor control power circuit includes a power semiconductor switch device, a bus capacitor, a filtering absorption unit and an internal laminated copper bar;
the power semiconductor switch device is connected with the bus capacitor through the internal laminated copper bar, and the filtering absorption unit is arranged near the power semiconductor switch device.
Further, in a preferred embodiment, the motor control power circuit further includes a current detection unit;
the current detection unit is arranged on the double-sided copper-clad ceramic substrate, is connected to the three-phase output power terminal copper row through a copper-clad layout on the ceramic substrate, and leads out a current detection result through the signal terminal.
Further, in a preferred embodiment, the motor control power circuit further includes a temperature detection unit;
the temperature detection unit is arranged near the power semiconductor switch device, arranged on the ceramic substrate and connected through a copper-clad layout on the ceramic substrate, and is used for detecting the temperature of the power unit assembly.
Further, in a preferred embodiment, the motor control power circuit further includes a passive discharge unit;
the passive discharge unit is arranged near the bus capacitor, arranged on the ceramic substrate and connected through a copper-clad layout on the ceramic substrate, and used for passive discharge of the power unit assembly.
Further, in a preferred embodiment, the power semiconductor switching device includes an upper bridge arm power switching device chip and a lower bridge arm power unit switching device chip; the filtering absorption unit comprises an upper bridge arm filtering absorption unit and a lower bridge arm filtering absorption unit;
the upper bridge arm filtering and absorbing unit is arranged near the lower bridge arm power switch device chip, the lower bridge arm filtering and absorbing unit is arranged near the upper bridge arm power switch device chip, and the power semiconductor switch devices are arranged on the ceramic substrate and connected through copper-clad patterns on the ceramic substrate.
Further, in a preferred embodiment, the bus capacitor is formed by connecting a plurality of capacitor cores in series through the laminated copper bars.
The invention also provides a three-phase full-bridge motor controller which is composed of any one of the motor controller power unit assemblies.
The invention further provides a new energy automobile, and an electric driving system of the new energy automobile comprises any three-phase full-bridge motor controller.
Technical effects
The invention aims to solve the problems of large volume, high cost, large stray parameters, difficult guarantee of production consistency and the like in the prior art, and has the following beneficial effects:
1. in the prior art, a plurality of independently packaged part structures are mechanically connected through bolts, welding and other modes, each part has own inherent package, and the parts have design requirements such as electrical safety distance, heat dissipation requirements and a proximity principle, and are difficult to balance, so that the problems of large assembly volume, poor heat dissipation effect and high cost are caused. The power semiconductor switch chip and the resistance-type current sensor are arranged inside the plastic package module shell instead of the Hall current sensor, the bus capacitor core and the temperature detection unit, share one radiator and are packaged, the design is compact, meanwhile, the surface-mounted type resistance-capacitance piece is integrated for filtering, the surface-mounted type passive discharge unit replaces an external independent lead resistor, various circuits and the sensors are arranged inside the plastic package module, all the circuits and the sensors share one radiator and are connected in a unified mode, and the power semiconductor switch chip and the resistance-type current sensor have the advantages of being strong in heat dissipation capacity, small in size, low in cost and the like.
2. The invention arranges various circuits and sensors on a double-sided copper-clad ceramic substrate, and circuit devices welded on the copper-clad substrate all adopt a silver sintering form, thus having smaller thermal resistance and higher reliability. And finally, the double-sided copper-clad ceramic substrate is fixed on the radiator, the plastic package shell is arranged on the radiator, and the radiator and the plastic package shell form a package cavity together, so that the appearance of the radiator is a plastic package whole, the later processing technology of mechanical connection such as bolts in the past is omitted, the process steps are reduced, the process complexity is reduced, the production consistency is improved, and the later installation is facilitated.
3. The invention arranges a plurality of devices on a double-sided copper-clad ceramic substrate, can effectively shorten a transmission path and reduce stray parameters, simultaneously increases a filtering absorption unit and is placed near a power semiconductor switch device, integrates a surface-mounted capacitance-resistance component to replace a filter, and integrates a surface-mounted passive discharge unit to replace an independent lead resistor, thereby effectively reducing the area of a power loop, reducing the stray parameters and improving the EMC performance of a system.
4. According to the highly integrated motor controller power unit assembly, the temperature detection unit is additionally arranged in the plastic package module and is placed near the power semiconductor switch device, so that the temperature of the hottest part of the power unit assembly is detected, the damage of a power chip caused by overhigh temperature is prevented, and the reliability of a product is improved.
5. According to the highly integrated power unit assembly of the motor controller, the passive discharge unit is additionally arranged in the plastic package module and is arranged at the periphery of the bus capacitor so as to discharge residual voltage in the bus capacitor and ensure that no high voltage residue exists in the capacitor after power failure for a certain time.
6. According to the highly integrated motor controller power unit assembly, the number of power semiconductor switching devices of the power unit can be set according to actual needs, and the power semiconductor switching devices are arranged on the double-sided copper-coated ceramic substrate in rows, so that power expandability is good.
7. The highly integrated motor controller power unit assembly provided by the invention can flexibly select the power unit arrangement form according to the arrangement structure of an electric drive system based on the motor controller arrangement form provided by the power unit assembly. The system is miniaturized, high-power, integrated, high-efficient, high EMC. Meanwhile, due to the arrangement of multiple sensors, the safe and reliable work of the system is guaranteed.
The invention is suitable for the motor controller technology of the new energy vehicle.
Drawings
Fig. 1 is a schematic diagram of an external structure of a highly integrated motor controller power unit assembly according to the first embodiment.
Fig. 2 is a schematic diagram of an internal general arrangement of a highly integrated motor controller power cell assembly according to embodiments one to nine.
Fig. 3 is a three-phase full-bridge motor controller arrangement according to the tenth embodiment.
Fig. 4 is an electrical schematic diagram of a highly integrated motor controller power cell assembly according to an eleventh embodiment.
Wherein: 1 is a positive power terminal, 2 is a negative power terminal, 3 is a radiator, 4 is a plastic package shell, 5-13 are signal terminals, 14 is a three-phase output power terminal, 15 is a bus capacitor, 101 is an internal laminated copper bar, 102 is a passive discharge unit, 103 is an upper bridge arm power switch device chip, 104 is a lower bridge arm power switch device chip, 105 is a double-sided copper-clad ceramic substrate, 106 is an upper bridge arm filter absorption unit, 107 is a temperature detection unit, 108 is a current detection unit, 109 is a lower bridge arm filter absorption unit, 110 is a binding line, 111 is other signal terminals, 201 is a positive copper bar, 202 is a negative copper bar, 203 is a power unit, 204 is a driving and control unit, and 205 is a three-phase output copper bar.
Detailed description of the preferred embodiments
The technical scheme of the application is described in the following with the accompanying drawings:
the first embodiment is described with reference to fig. 1 and 2, and the power unit assembly of the highly integrated motor controller in the embodiment comprises a motor control power circuit, a positive power terminal 1, a negative power terminal 2, signal terminals 5-13, a three-phase output power terminal 14, a double-sided copper-coated ceramic substrate 105, a radiator 3 and a plastic package shell 4;
the motor control power circuit, the positive power terminal 1, the negative power terminal 2, the signal terminals 5-13 and the three-phase output power terminal 14 are all arranged on the front surface of the double-sided copper-clad ceramic substrate 105, and the back surface of the double-sided copper-clad ceramic substrate 105 is fixedly connected with the radiator 3;
the plastic package shell 4 is arranged on the radiator 3, a potting cavity is formed by the radiator and the plastic package shell, and the double-sided copper-clad ceramic substrate 105, the motor control power circuit, the positive power terminal 1, the negative power terminal 2, the signal terminals 5-13 and the three-phase output power terminal 14 are all arranged in the potting cavity;
the wiring ends of the positive power terminal 1, the negative power terminal 2, the signal terminals 5-13 and the three-phase output power terminal 14 all extend out of the encapsulation cavity.
In the prior art, a plurality of independently packaged part structures are mechanically connected through bolts, welding and other modes, each part has respective inherent package, and the parts have design requirements such as electrical safety distance, heat dissipation requirements and a proximity principle, are difficult to balance, so that the problems of large assembly volume, poor heat dissipation effect and high cost are caused. According to the highly-integrated motor controller power unit assembly, various circuits are arranged on the front face of the double-sided copper-clad ceramic substrate, so that the design is compact, the size is small, the compact arrangement among devices shortens a transmission path, stray parameters are effectively reduced, and the electrical stress, the efficiency and the electromagnetic compatibility of a system are improved. The circuit devices welded on the copper-clad substrate all adopt a silver sintering form, so that the thermal resistance is lower and the reliability is higher. The positive power terminal, the negative power terminal, the signal terminal and the three-phase output power terminal are all welded on the front surface of the double-sided copper-clad ceramic substrate by adopting laser, and the welding is reliable and has low stray. Meanwhile, the back surface of the double-sided copper-clad ceramic substrate is fixedly connected with the radiator, so that all circuits share one radiator, the radiator has the advantage of strong heat dissipation capacity, the plastic package shell is arranged on the radiator and forms a potting cavity together with the radiator, and the wiring ends of the positive power terminal, the negative power terminal, the signal terminal and the three-phase output power terminal extend out of the potting cavity and are respectively connected with corresponding circuits of a driving circuit board outside the module. The encapsulation cavity is a plastic-encapsulated whole in appearance, so that the later processing process of mechanical connection such as bolts and the like in the prior art is omitted, the process steps are reduced, the process complexity is reduced, the production consistency is improved, and the later installation is convenient.
In the second embodiment, the present embodiment is described with reference to fig. 2, and the internal signals of the motor control power circuit in the highly integrated motor controller power unit assembly described in the first embodiment are connected to each other through the binding line 110.
The present embodiment is further limited to the motor control power circuit in the first embodiment, and it is explained that the internal signals of the motor control power circuit are connected to the binding lines 110 through the copper-clad layout circuit on the ceramic substrate, and the connection manner of the binding lines is more flexible.
The present embodiment is further limited to the motor control power circuit in the first embodiment, and it is explained that the internal signals of the motor control power circuit are connected to each other through the copper-clad layout circuit on the ceramic substrate and the binding line 110, the connection manner of the binding line is more flexible, and the copper-clad layout circuit on the ceramic substrate is connected to carry a large current.
Referring to fig. 2, a third embodiment is described, in which a motor control power circuit in a highly integrated motor controller power unit assembly according to the first embodiment includes a power semiconductor switching device, a bus capacitor 15, a filtering absorption unit, and a laminated copper bar 101;
the power semiconductor switch device is connected with the bus capacitor 105 through the laminated copper bar 101, and the filtering absorption unit is arranged near the power semiconductor switch device.
The motor control power circuit comprises a power semiconductor switch device, a bus capacitor, a filtering absorption unit and an internal laminated copper bar, wherein in the prior art, the bus capacitor and the power module which are independently packaged are connected through an external long copper bar and a bolt, so that the problems of large volume and poor heat dissipation effect exist. The prior art can't install effectual filtering absorption unit additional for power module, external filter not only bulky, the filter effect is also very poor after connecting through heavy copper bar, this embodiment a highly integrated machine controller power unit assembly with integrated paster resistance-capacitance piece replace outside wave filter to arrange near power semiconductor switching device, paster resistance-capacitance piece arranges that the radiating effect is high on two-sided copper-clad ceramic substrate, the volume further reduces, and the circuit need not the lead wire, the lug weld is on the copper sheet of two-sided copper-clad base plate, the stray inductance that the reduction of maximize connection arouses, the absorption effect is better, and can accomplish all to arrange from top to bottom the half-bridge, it is extravagant that no pin does not have copper base plate area.
Referring to fig. 2, the present embodiment is described, and the present embodiment specifically describes a motor control power circuit in a highly integrated motor controller power unit assembly according to the third embodiment, wherein the motor control power circuit further includes a current detection unit 108;
the current and current detecting unit 108 is configured to detect an operating current of the three-phase output power terminal.
The Hall current sensor which is externally connected through a bolt is large in size and occupies a large space in the prior art, the highly integrated power unit assembly of the motor controller in the embodiment is characterized in that the Hall current sensor is replaced by a resistance-type current sensor, the sensor is arranged on a double-sided copper-coated ceramic substrate, the heat dissipation efficiency is high, the size is further reduced, the working current of a three-phase output power terminal can be detected in real time, and the highly integrated power unit assembly of the motor controller and the traditional Hall current sensor save space and are easy to install.
The fifth embodiment is described with reference to fig. 2, and this embodiment specifically describes a motor control power circuit in the highly integrated motor controller power unit assembly described in the third embodiment, where the motor control power circuit further includes a temperature detection unit 107;
the temperature detection unit 107 is arranged in the vicinity of the power semiconductor switching device for detecting the temperature in the vicinity of the power semiconductor switching device.
In the highly integrated motor controller power unit assembly of the present embodiment, the temperature detection unit is disposed near the power semiconductor switching device for detecting the temperature of the power semiconductor switching device, so as to prevent the power semiconductor switching device from being damaged due to an excessive temperature.
The sixth embodiment is described with reference to fig. 2, and this embodiment specifically describes a motor control power circuit in a highly integrated motor controller power unit assembly described in the third embodiment, where the motor control power circuit further includes a passive discharge unit 102;
the passive discharge unit is arranged near the bus capacitor, arranged on the ceramic substrate and connected through a copper-clad layout on the ceramic substrate, and used for passive discharge of the power unit assembly.
The highly integrated power unit assembly of the motor controller is characterized in that an integrated patch type passive discharge unit replaces an external independent lead resistor, the patch type resistor is arranged on the front surface of a double-sided copper-clad ceramic substrate, and the highly integrated power unit assembly has the advantages of high heat dissipation efficiency, small size and the like. The passive discharge unit is arranged near the bus capacitor so as to discharge residual voltage in the bus capacitor, and the capacitor is ensured to have no high voltage residue after a certain time after power failure.
The seventh embodiment is described with reference to fig. 2, and this embodiment specifically describes a power semiconductor switching device in a highly integrated motor controller power cell assembly according to the third embodiment, where the power semiconductor switching device includes an upper bridge arm power switching device chip 103 and a lower bridge arm power cell switching device chip 104; the filtering and absorbing unit comprises an upper bridge arm filtering and absorbing unit 106 and a lower bridge arm filtering and absorbing unit 107;
the upper bridge arm filtering and absorbing unit 106 is arranged near the lower bridge arm power switching device chip 104, the lower bridge arm filtering and absorbing unit 107 is arranged near the upper bridge arm power switching device chip 103, and the power semiconductor switching devices are arranged on the ceramic substrate and connected through copper-clad layouts on the ceramic substrate.
In the highly integrated power unit assembly of the motor controller according to this embodiment, the power semiconductor switch device and the filter absorption unit are further limited, and the power semiconductor switch device includes an upper bridge arm power switch device chip and a lower bridge arm power unit switch device chip. The power semiconductor switching device chip can be formed by connecting a plurality of semiconductor chips in parallel according to the output requirement of power performance. The filtering and absorbing unit comprises an upper bridge arm filtering and absorbing unit and a lower bridge arm filtering and absorbing unit. Meanwhile, the upper bridge arm filtering and absorbing unit is arranged near the lower bridge arm power switch device chip, and the lower bridge arm filtering and absorbing unit is arranged near the upper bridge arm power switch device chip. Clutter in the power circuit can be effectively absorbed, safe and reliable switching action of a power semiconductor switching device is guaranteed, and EMC performance of the system is improved.
In an eighth embodiment, referring to fig. 2, the present embodiment is described, and the present embodiment specifically describes a bus capacitor in a highly integrated power unit assembly of a motor controller according to the third embodiment, where the bus capacitor 15 is formed by connecting a plurality of capacitor cores in series through the laminated copper bars.
The bus capacitor is further limited, and is formed by connecting a plurality of capacitor cores in series through laminated copper bars. The connection mode that many electric capacity cores are established ties conveniently adjusts bus capacitor's capacity according to actual demand to can disperse bus capacitor's total heat dissipation, be favorable to the heat dissipation.
The improvement of the highly integrated motor controller power unit assembly in each embodiment is the position relationship between components, so that the purposes of reducing the volume and improving the heat dissipation efficiency are achieved on the premise of ensuring the electrical performance. The electrical structure of the motor controller power unit assembly is not limited, that is: the motor controller power cell assembly of any electrical configuration may employ the above-described structure.
In a ninth embodiment, referring to fig. 3, the three-phase full-bridge motor controller according to the present embodiment is described, and the three-phase full-bridge motor controller is composed of three motor controller power unit assemblies according to any one of the above embodiments. The device comprises a positive copper bar 201 and a negative copper bar 202 which are connected with a battery, a power unit 203, a driving and controlling unit 204 and a three-phase output copper bar 205 which is connected with a motor. The positive copper bar 201, the negative copper bar 202 and the positive and negative power terminals of the power unit 203 are connected one by one and can be connected through laser welding or bolts. The three-phase output copper bar 205 and the three-phase output terminals of the power unit 203 are connected one by one and can be connected through laser welding or bolts. The signal terminals of the driving and control unit 204 and the power unit 203 are connected one by one, and may be connected by welding and crimping.
The three-phase full-bridge motor controller provided in this embodiment is an arrangement manner of the motor controller provided in the embodiment of the present invention, and three power unit assemblies of the motor controller provided in this embodiment are applied, so that a three-phase full-bridge motor controller can be formed. The power unit arrangement can be flexibly selected according to the electric drive system arrangement structure.
The embodiment mode is described with reference to fig. 4, and the embodiment mode provides an electrical connection schematic diagram of a highly integrated motor controller power unit assembly, in the electrical connection, an upper bridge arm power switch device chip and a lower bridge arm power switch device chip are connected in series, a filter absorption capacitor C1 is connected in parallel with the upper bridge arm power switch device chip Q1, a filter absorption capacitor C2 is connected in parallel with the lower bridge arm power switch device chip Q2, and a bus capacitor C is connected in parallel with the upper bridge arm power switch device chip Q1 and the lower bridge arm power switch device chip Q2 which are connected in series. A current sensor I is connected in the phase output line. The positive power terminal 1 is connected with a collector of the upper bridge arm power switch device chip, the negative power terminal 2 is connected with an emitter of the lower bridge arm power switch device chip, the signal terminal 5 is connected with the collector of the upper bridge arm power switch device chip, the signal terminal 6 is connected with a base of the lower bridge arm power switch device chip, the signal terminal 7 is connected with the base of the upper bridge arm power switch device chip, the signal terminal 8 is connected with the emitter of the lower bridge arm power switch device chip, the signal terminal 9 is connected with the emitter of the upper bridge arm power switch device chip, the signal terminal 10 and the signal terminal 11 are respectively connected with two ends of the temperature detection unit, and the signal terminal 12 and the signal terminal 13 are respectively connected with two ends of the current sensor.
The above-mentioned embodiments are only specific embodiments of the present invention, which are used for illustrating the technical solutions of the present invention and not for limiting the same, and the protection scope of the present invention is not limited thereto, although the present invention is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: any person skilled in the art can modify or easily conceive the technical solutions described in the foregoing embodiments or equivalent substitutes for some technical features within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the embodiments of the present invention, and they should be construed as being included therein. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A highly integrated motor controller power unit assembly is characterized in that the power unit assembly comprises a motor control power circuit, a positive power terminal, a negative power terminal, a signal terminal, a three-phase output power terminal, a double-sided copper-coated ceramic substrate, a radiator and a plastic package shell;
the motor control power circuit, the positive power terminal, the negative power terminal, the signal terminal and the three-phase output power terminal are all arranged on the front surface of the double-sided copper-clad ceramic substrate, and the back surface of the double-sided copper-clad ceramic substrate is fixedly connected with the radiator;
the plastic package shell is arranged on the radiator, a potting cavity is formed by the radiator and the plastic package shell, and the double-sided copper-clad ceramic substrate, the motor control power circuit, the positive power terminal, the negative power terminal, the signal terminal and the three-phase output power terminal are all arranged in the potting cavity;
the wiring ends of the positive power terminal, the negative power terminal, the signal terminal and the three-phase output power terminal all extend out of the encapsulation cavity.
2. The highly integrated motor controller power cell assembly as claimed in claim 1, wherein the internal signals of the motor control power circuit are interconnected through copper-clad layout circuits and bonding wires on a ceramic substrate.
3. The highly integrated motor controller power cell assembly of claim 1, wherein said motor control power circuit comprises power semiconductor switching devices, bus capacitors, filter absorption cells and internal laminated copper bars;
the power semiconductor switch device is connected with the bus capacitor through the internal laminated copper bar, and the filtering absorption unit is arranged near the power semiconductor switch device.
4. The highly integrated motor controller power cell assembly of claim 3, wherein said motor control power circuit further comprises a current detection unit;
the current detection unit is arranged on the double-sided copper-clad ceramic substrate, is connected to the three-phase output power terminal copper row through a copper-clad layout on the ceramic substrate, and leads out a current detection result through the signal terminal.
5. The highly integrated motor controller power cell assembly of claim 3, wherein said motor control power circuit further comprises a temperature sensing unit;
the temperature detection unit is arranged near the power semiconductor switch device, arranged on the ceramic substrate and connected through a copper-clad layout on the ceramic substrate, and is used for detecting the temperature of the power unit assembly.
6. The highly integrated motor controller power cell assembly of claim 3, wherein said motor control power circuit further comprises a passive discharge cell;
the passive discharge unit is arranged near the bus capacitor, arranged on the ceramic substrate and connected through a copper-clad layout on the ceramic substrate, and used for passive discharge of the power unit assembly.
7. The highly integrated motor controller power cell assembly of claim 3, wherein the power semiconductor switching devices comprise upper bridge arm power switching device chips and lower bridge arm power cell switching device chips; the filtering and absorbing unit comprises an upper bridge arm filtering and absorbing unit and a lower bridge arm filtering and absorbing unit;
the upper bridge arm filtering and absorbing unit is arranged near the lower bridge arm power switch device chip, the lower bridge arm filtering and absorbing unit is arranged near the upper bridge arm power switch device chip, and the power semiconductor switch devices are arranged on the ceramic substrate and connected through copper-clad patterns on the ceramic substrate.
8. The highly integrated motor controller power unit assembly of claim 3, wherein said bus capacitors are formed by connecting multiple capacitor cores in series through said stacked copper bars.
9. A three-phase full-bridge motor controller, wherein the three-phase full-bridge motor controller is composed of three motor controller power unit assemblies according to any one of claims 1 to 8.
10. A new energy automobile, characterized in that the new energy automobile comprises the three-phase full-bridge motor controller of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210545772.8A CN114914205A (en) | 2022-05-19 | 2022-05-19 | Highly integrated motor controller power unit assembly, three-phase full-bridge motor controller and new energy automobile |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210545772.8A CN114914205A (en) | 2022-05-19 | 2022-05-19 | Highly integrated motor controller power unit assembly, three-phase full-bridge motor controller and new energy automobile |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114914205A true CN114914205A (en) | 2022-08-16 |
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ID=82768142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210545772.8A Pending CN114914205A (en) | 2022-05-19 | 2022-05-19 | Highly integrated motor controller power unit assembly, three-phase full-bridge motor controller and new energy automobile |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114914205A (en) |
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2022
- 2022-05-19 CN CN202210545772.8A patent/CN114914205A/en active Pending
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