CN214542229U

CN214542229U - Intelligent power module

Info

Publication number: CN214542229U
Application number: CN202120561460.7U
Authority: CN
Inventors: 王敏; 左安超; 谢荣才
Original assignee: Guangdong Huixin Semiconductor Co Ltd
Current assignee: Guangdong Huixin Semiconductor Co Ltd
Priority date: 2021-03-18
Filing date: 2021-03-18
Publication date: 2021-10-29
Anticipated expiration: 2031-03-18

Abstract

The utility model relates to an intelligent power module, including MCU control circuit and rectifier circuit and inverter circuit, and MCU control circuit, rectifier circuit and inverter circuit set up respectively at solitary circuit substrate, make the MCU control circuit of weak current work keep apart with rectifier circuit and inverter circuit's of forceful electric power work circuit substrate, thereby make control signal receive around forceful electric power or electromagnetic signal's influence very reduce, and relative prior art's the IPM modular scheme of not integrated MCU, can shorten the length of control signal line greatly, promote signal transmission efficiency, thereby further make control signal receive around forceful electric power or electromagnetic signal's influence reduce, with this anti-interference EMS ability of IPM work has been strengthened effectively, thereby whole IPM module work's reliability has been promoted.

Description

Intelligent power module

Technical Field

The utility model relates to an intelligent power module belongs to power semiconductor device technical field.

Background

An intelligent Power module, i.e., ipm (intelligent Power module), is a Power driving product combining Power electronics and integrated circuit technology. The intelligent power module integrates a power switch device and a high-voltage driving circuit and is internally provided with fault detection circuits such as overvoltage, overcurrent and overheat. At present, when an internal circuit of an existing IPM module is designed, an inverter circuit composed of a low-voltage control circuit such as an IC driving control circuit, an IPM sampling amplifying circuit, a PFC current protection circuit and the like and a high-voltage power device is generally laid out on the same circuit board, because some of the circuits have low working voltage (for example, below 15V) such as the IC driving control circuit, and some of the circuits have high working voltage (for example, 200V and 300V) such as the inverter circuit, when the circuits are laid out on the same board, the circuits working at high voltage easily interfere with the circuits working at low voltage, and the control of the inverter circuit by the control circuit is seriously influenced to cause disorder, so that the reliability of the operation of the IPM module is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that needs solve is to solve current IPM module because lead to its inside high-pressure working circuit to disturb low pressure working circuit with all circuit layout on same circuit board to influence the operational reliability problem of IPM module.

Specifically, the utility model discloses an intelligent power module, include: the intelligent power module comprises a plurality of unit circuits, the unit circuits comprise at least two of an MCU control circuit, an inverter circuit and a rectification circuit, the MCU control circuit is arranged on the first circuit substrate, the inverter circuit and the rectification circuit are respectively arranged on each second circuit substrate, and the work heat productivity of the first circuit substrate is lower than that of the second circuit substrate.

Optionally, the smart power module further includes a driving circuit for driving the inverter circuit to operate, and the driving circuit is disposed on the first circuit substrate.

Optionally, the intelligent power module is provided with a first pin group for inputting a control signal to the MCU control circuit, and a second pin group for outputting a driving signal for driving the load to operate from the inverter circuit, the first pin group and the second pin group are respectively disposed on two opposite sides of the intelligent power module, wherein the first circuit substrate is disposed near the first pin group, and the plurality of second circuit substrates are disposed near the second pin group side in parallel.

Optionally, the first circuit substrate and the second circuit substrate are made of different materials, the first circuit substrate is a glass fiber board or a flexible copper clad laminate, and the second circuit substrate is a metal substrate or a non-metal substrate.

Optionally, the smart power module further includes a PFC circuit disposed on another second circuit substrate.

Optionally, the smart power module further includes a sealing layer, the first circuit board is disposed to be encapsulated in the sealing layer, and the other surface of each second circuit board opposite to the electronic component is exposed from the sealing layer.

Optionally, the smart power module further comprises a heat sink mounted on the other side of the second circuit substrate.

Optionally, the number of the second circuit substrates of the inverter circuit is plural.

Optionally, the smart power module further includes a plurality of bonding wires connected between the first circuit substrate, the second circuit substrate, and the pins disposed between the first circuit substrate and the second circuit substrate.

The utility model discloses an intelligent power module, including MCU control circuit and rectifier circuit and inverter circuit, and MCU control circuit, rectifier circuit and inverter circuit set up respectively at solitary circuit substrate, make the MCU control circuit of weak current work keep apart with rectifier circuit of forceful current work and inverter circuit's circuit substrate, thereby make control signal receive around forceful current or electromagnetic signal's influence very reduce, and relative prior art's the IPM modular scheme of not integrated MCU, can shorten the length of control signal line greatly, promote signal transmission efficiency, thereby further make control signal receive around forceful current or electromagnetic signal's influence reduce, with this anti-jamming EMS ability of IPM work has been strengthened effectively, thereby whole IPM module work's reliability has been promoted.

Drawings

Fig. 1 is a plan view of an IPM module according to an embodiment of the present invention, with a sealing layer on a side of a circuit board where electronic components are mounted removed;

fig. 2 is a cross-sectional view of an IPM module according to an embodiment of the present invention in the left-right direction;

fig. 3 is a vertical sectional view of an IPM module according to an embodiment of the present invention.

Reference numerals:

the circuit comprises a first circuit substrate 1, an MCU control circuit 11, a driving circuit 12, a first substrate 13, a second circuit substrate 2, a rectifying circuit 21, a PFC circuit 22, a first inverter circuit 23, a second inverter circuit 24, a second substrate 25, pins 3, a pin connecting frame 31, a bonding wire 4, a sealing layer 5, an IGBT61, an MCU62, a driving chip 63, a freewheeling diode 64 and a radiator 7.

Detailed Description

It should be noted that the embodiments and features of the embodiments of the present invention may be combined with each other without conflict in structure or function. The present invention will be described in detail below with reference to examples.

The utility model provides an intelligent power module is IPM module, as shown in fig. 1 to fig. 3, the IPM module includes a plurality of circuit substrate, be first circuit substrate 1 and a plurality of second circuit substrate 2 respectively, wherein first circuit substrate 1 and a plurality of second circuit substrate 2 set up on the same layer, intelligent power module includes a plurality of unit circuit, a plurality of unit circuit include MCU control circuit 11, inverter circuit, at least two among the rectifier circuit 21, wherein MCU control circuit 11 sets up at first circuit substrate 1, inverter circuit, rectifier circuit 21 sets up respectively at every second circuit substrate 2. The MCU control circuit 11 operates in a weak current region such as 5-12V voltage, and mainly includes an MCU62 chip, the inverter circuit is a first inverter circuit 23 shown in fig. 1, and mainly includes switching transistors of 6 upper and lower bridge arms such as IGBT61 (Insulated Gate Bipolar Transistor), and the inverter circuit and the rectifier circuit 21 operate in a strong voltage such as 200-300V. The control circuit in the weak current area and the control circuit in the strong current area are respectively arranged on different circuit substrates, so that the weak current working area and the strong current working area are well isolated. Because the control signal routing of the MCU control circuit 11 is an output PWM signal to control the operating state, such as operating frequency, of the switching tube of the inverter circuit, the control signal line is easily interfered by surrounding strong electrical signals or electromagnetic signals during the operating process, which may cause signal distortion to make the operating assembly of the switching tube disordered and finally make the IPM module operate abnormally, or even cause the module short circuit to cause current surge and damage the IPM module. The circuit substrate where the MCU control circuit 11 is arranged is isolated from the circuit substrate where the inverter circuit and the rectifying circuit 21 are arranged independently, so that the influence of strong electric or electromagnetic signals around on control signals is greatly reduced; and relative IPM module in prior art inside only contains drive circuit 12 and dc-to-ac converter, when the controller that the IPM module was used, its MCU is independent external, and MCU is to controlling the inside control signal of IPM module between the IPM module like this and walk a lot of relatively this application will be long, because it walks the overall arrangement on the PCB board of controller, rather than the utility model discloses an on the wiring layer of IPM module inside, and the utility model discloses an MCU is integrated to be set up inside the IPM module, can shorten the length of control signal line greatly, promotes signal transmission efficiency to further make control signal receive around the influence reduction of forceful electric power or electromagnetic signal, strengthened the anti-jamming EMS ability of IPM work with this effectively, thereby promoted the reliability of whole IPM module work. And because the first circuit substrate 1 mainly sets up the MCU control circuit 11, its work calorific value will be obviously less than the second circuit substrate 2 of work in the strong electric zone, through setting up these two circuit substrates independently, the calorific value that can obvious reduction second circuit substrate 2 transmits to first circuit substrate 1, because the operating temperature of these components and parts of MCU62 is lower than on the inverter of second circuit substrate 2 switch tube such as IGBT61 or MOS (metal oxide semiconductor), consequently can reduce the operating temperature of MCU62 components and parts as far as possible, thereby also promote its operating stability.

In some embodiments of the present invention, as shown in fig. 1 to fig. 3, the second circuit substrate 2 for setting the inverter circuit is plural, that is, the IPM module includes plural inverter circuits, such as the first inverter circuit 23 and the second inverter circuit 24 in fig. 1, and each inverter circuit can drive one load to work, so that plural loads can be driven, such as the compressor and the fan motor can be driven simultaneously to work. Therefore, a plurality of inverter circuits are integrated in the IPM module, the application scenarios of a plurality of loads can be better adapted to the needs of driving simultaneously, and compared with the need of adopting a plurality of IPM modules simultaneously in the prior art, the function can be realized through one IPM module, so that the application scenarios are expanded, and the cost is reduced.

In some embodiments of the present invention, as shown in fig. 1, the IPM module further includes a driving circuit 12 for driving the inverter circuit to operate, and the driving circuit 12 is disposed on the first circuit substrate 1 and mainly composed of a driving chip 63. The control end of the driving circuit 12 is connected to the MCU62, and is disposed on the same circuit substrate as the MCU62, i.e., the first circuit substrate 1. Because the control signal line that sets up on first circuit substrate 1 between MCU62 and the drive circuit 12 is the weak current and walks the line, consequently set up drive circuit 12 in same circuit substrate in MCU62, help further shortening the length of control signal line, promote signal transmission efficiency to further make the control signal receive the influence reduction of strong electricity or electromagnetic signal on every side, propose the interference killing feature who promotes IPM module work. The driving circuit 12 may be a plurality of driving circuits to correspondingly drive a plurality of inverter circuits, such as two driving circuits in fig. 1.

In some embodiments of the present invention, as shown in fig. 1, the IPM module further includes a PFC (power factor correction) circuit, and the PFC circuit 22 is disposed on another second circuit substrate 2. Since the PFC circuit 22 also operates in a strong electric region, it is provided on the second circuit board 2 and isolated from the first circuit board 1.

In some embodiments of the present invention, as shown in fig. 1 to fig. 3, the intelligent power module is provided with a first pin group for inputting the control signal to the MCU control circuit 11, and a second pin group for outputting the driving signal for driving the load to work, the first pin group and the second pin group are respectively disposed on two opposite sides of the intelligent power module, wherein the first circuit substrate 1 is disposed near the first pin group, and the plurality of second circuit substrates 2 are disposed near the second pin group side. As shown in fig. 1, the pins 3 of the IPM module are distributed on the upper and lower sides thereof to form an upper and lower two-way pin set, respectively, the first circuit board 1 provided with the MCU control circuit 11 is disposed above the IPM module, and if the first circuit board 13 is also provided with the driving circuit 12, the occupied area after the MCU control circuit 11 is added is larger, so that a long strip is disposed above the IPM module. The plurality of second circuit boards 2 are provided with a rectifier circuit 21, a plurality of inverter circuits, and the like, respectively, and are arranged in parallel, and each second circuit board 2 is smaller in area than the first circuit board 1, and is square and nearly square. These second circuit boards 2 are arranged below the IPM module in parallel. The pin 3 of the control signal inputted to the MCU62 is connected to the upper pin group, and further, when the first circuit board 1 is further provided with a plurality of driving circuits 12, the weak current pin 3 connected to the driving circuit 12, such as the pin 3 connected to its internal bootstrap circuit, is also provided in the upper pin group, and these pins 3 form a first pin group, and the first pin group mainly transmits weak current signals. The signals outputted from the second circuit boards 2 are mainly strong electric signals, such as high-voltage pulsating direct current (200 + 300V) outputted from the rectifying circuit 21, three-phase high-voltage signals of the driving motor winding outputted from the inverter circuit, and the like, and these signals are connected to the lower pin group, thereby forming the second pin group. Through the layout of the first circuit substrate 1 and the plurality of second circuit substrates 2, the layout of the first circuit substrate and the plurality of second circuit substrates 2 is compact, the occupied area of the whole circuit substrate is reasonably optimized and reduced, weak current control signals input to the MCU62 are placed in the first pin group, strong current output signals of the inverter circuit and the rectifying circuit 21 are placed in the second pin group, and therefore pins 3 of strong current and weak current signals of the IPM module are distributed on two sides of the IPM module, isolation is achieved to the maximum degree, the influence of the strong current on the weak current is further reduced, and the working reliability of the IPM module is further improved.

In some embodiments of the present invention, since the first circuit board 1 mainly works in the weak current region, the second circuit board 2 works in the strong current region, and the heating power of the second circuit board 2 is larger than that of the first circuit board 1, the materials of the two circuit boards can be set to be different, thereby optimizing the cost. For example, the second substrate 25, which is the main body of the plurality of second substrates 25, may be a metal substrate, the main body of which is made of a metal material with good thermal conductivity, such as aluminum, copper, etc., an insulating dielectric layer is attached to the first surface of the metal substrate, a circuit layer is disposed on the insulating dielectric layer, the circuit layer may be formed by etching a copper foil, or may be formed by printing a paste-like conductive medium, and the conductive medium may be a conductive material such as graphene, tin paste, silver paste, etc. The circuit layer is provided with mounting sites, i.e., pads, on which electronic components are mounted. The plurality of second substrates 25 may also be non-metal substrates, the main body of which is made of an insulating material with good thermal conductivity, such as glass, ceramic, etc., and a circuit layer is disposed on the first surface of the non-metal substrate, and the circuit layer process is the same as that of the circuit layer of the metal substrate, and the opposite metal substrate does not include an insulating layer because the main body is made of an insulating material. The first circuit substrate 1 does not need heat dissipation because the heat generation is extremely low, the body, namely the first substrate 13, can adopt a glass fiber board or flexible copper clad plate process, and the cost is low compared with the second circuit substrate 2, so that the cost of the whole circuit substrate is reduced.

In some embodiments of the present invention, as shown in fig. 1 to 3, the IPM module is provided with a sealing layer 5, the first circuit substrate 1 is wrapped in the sealing layer 5, and the other surface of each second circuit substrate 2 opposite to the electronic component is exposed from the sealing layer 5. The first circuit board 1 operates in a weak current region and mainly transmits a control signal of weak current connected to the MCU62, and the second circuit board 2 operates in a strong current region, which transmits a large current and thus has high power consumption, and generates much heat compared to the first circuit, so that the first circuit board 1 is completely enclosed in the sealing layer 5, and the other surface of the second circuit board 2 opposite to the electronic component mounted thereon, i.e., the heat dissipation surface, is exposed from the sealing layer 5, thereby semi-enclosing the second circuit board 2. The first circuit substrate 1 is well protected by the fully-coated sealing layer 5, and if the first circuit substrate 1 can adopt a flexible copper-clad plate, the fully-coated structure can well protect the first circuit substrate from being damaged by external objects when being touched and reduce the influence of the first circuit substrate 1 on an external machine interference signal; the heat dissipation surface of the second circuit substrate 2 is exposed from the sealing layer 5, so that the heat generated by the second circuit substrate can be well transmitted to the outside of the IPM module, and the heat dissipation effect of the second circuit substrate can be improved.

Further, in some embodiments of the present invention, the IPM module further includes a heat sink 7, and the heat sink 7 is mounted on the other side of the second circuit substrate 2. As shown in fig. 2, the heat sink 7 is attached to the heat radiation surface of the second circuit board 2, thereby radiating heat generated by the second circuit board 2.

In some embodiments of the present invention, as shown in fig. 1 to 3, a plurality of bonding wires 4 are further disposed inside the IPM module, and are connected between the electronic component, the circuit layer of the first circuit substrate 1 and the circuit layer of the second circuit substrate 2, and the pins 3 disposed between the first capacitor substrate and the second circuit substrate 2. The electronic components are the MCU62, the IGBT61, the driver chip 63, the freewheeling diode 64, and others such as resistors, capacitors, etc. mentioned in the above embodiments. The bonding wires 4 are typically gold wires, copper wires, hybrid gold-copper wires, 38um or thin aluminum wires below 38 um. Specifically, the bonding wire 4 may connect between the electronic component and the electronic component, may connect between the electronic component and the wiring layer, may connect between the electronic component and the pin 3, and the like, thereby forming a circuit connection of the entire IPM module.

The utility model discloses still provide a manufacturing approach of the intelligent power module that above-mentioned embodiment mentioned, its characterized in that, manufacturing approach includes following step:

step S100, configuring a plurality of substrates, wherein a circuit layer is arranged on the surface of each substrate, and a plurality of bonding pads are arranged on the circuit layer;

step S200, configuring an electronic element and pins 3 on the surface of the circuit wiring layer, so that the electronic element and the pins 3 are fixed on the bonding pad and are electrically connected with the bonding pad, and thus a plurality of substrates respectively form a first circuit substrate 1 and a plurality of second circuit substrates 2, wherein the MCU control circuit 11 is arranged on the first circuit substrate 1, and the inverter circuit and the rectifier circuit 21 are respectively arranged on each second circuit substrate 2;

step S300, connecting bonding wires 4 among a plurality of electronic elements, a circuit layer and pins 3;

step S400, performing injection molding on the first circuit substrate 1 and the plurality of second circuit substrates 2 through a packaging mold to form a sealing layer 5, wherein the sealing layer 5 covers the first circuit substrate 1, the sealing layer 5 covers one surface, where the electronic elements are installed, of the second circuit substrate 2, and the pins 3 are exposed out of the sealing layer 5;

and S500, cutting and molding the pin 3 to form the intelligent power module, and testing the molded intelligent power module.

In step S100, a plurality of different substrates can be designed according to the circuit layout, and the body thereof can be a metal substrate, a non-metal substrate and a flexible copper clad laminate. Different substrates are determined according to the requirements of circuit design, if the circuit relates to electronic elements with high power and the heat productivity is high, the circuit is preferably a metal substrate or a nonmetal substrate, if the circuit does not have electronic elements with high power and is only a control chip such as the MCU62, a glass fiber board or a flexible copper clad plate can be adopted. As shown in fig. 1 to 3, the main body of the metal substrate of the second substrate 25 is made of a metal material with good thermal conductivity, such as aluminum, copper, etc., an insulating dielectric layer is attached to the first surface of the metal substrate, a circuit layer is disposed on the insulating dielectric layer, the circuit layer may be formed by etching a copper foil, or may be formed by printing a paste-like conductive medium, and the conductive medium may be a conductive material such as graphene, tin paste, silver paste, etc. The main body of the non-metal substrate is made of insulating materials with good thermal conductivity, such as glass, ceramics and the like, the circuit layer is arranged on the first surface of the non-metal substrate, the circuit layer process is the same as that of the circuit layer of the metal substrate, and the opposite metal substrate does not comprise the insulating layer because the main body of the non-metal substrate is made of the insulating materials. And the flexible copper clad laminate with the first substrate 13 as the manufacturing body can form an insulating film layer, and then the conductive medium layer is printed on the insulating film layer based on a printing process to complete the process. The specific manufacturing process of the metal substrate, the nonmetal substrate and the glass fiber board or the flexible copper clad laminate is the prior art and is not described herein again. A plurality of bonding pads for mounting electronic elements are arranged on the circuit layer and the flexible copper clad laminate or the glass fiber board, the bonding pads form component mounting positions, and the bonding pads are also used for connecting bonding wires 4.

In step S200, the circuit substrates may be placed in a carrier, wherein the carrier may be made of a material with a high temperature resistance of 200 ℃ or higher, such as synthetic stone, ceramic, PPS, etc. Then the electronic components of the power device are mounted on the component mounting position through automatic die bonding equipment (DA machine) by brushing solder paste or dispensing silver paste, the electronic components of the resistor, the capacitor and the MCU62 are mounted on the component mounting position through automatic SMT equipment, a plurality of pins 3 are placed on the corresponding mounting positions through a mechanical arm or a manual work, and then all the electronic components or the devices are welded on the substrate through a reflow oven. The control circuit where the MCU62 is located is arranged on an independent substrate to form a first circuit substrate 1, the substrate of the first circuit substrate 1 is a glass fiber board or a flexible copper-clad board, the inverter circuit and the rectifier circuit 21 are respectively arranged on different substrates to form a plurality of second circuit substrates 2, and the substrate of the second circuit substrate 2 is a metal substrate or a non-metal substrate.

Further, a plurality of inverter circuits can be further respectively arranged on the second circuit substrates 2, so that a plurality of loads can be driven, and if the compressors and the fan motors can be driven to work simultaneously. One of the plurality of second circuit substrates 2 may further be provided with a PFC circuit 22. The first circuit substrate 1 can also be provided with a driving circuit 12 for driving the inverter circuit to work, wherein the control end of the driving circuit 12 is connected with the MCU62, because the control signal line arranged on the first circuit substrate 1 between the MCU62 and the driving circuit 12 is a weak current line, the driving circuit 12 is arranged on the same circuit substrate at the MCU62, which is helpful to further shorten the length of the control signal line, and improve the signal transmission efficiency, thereby further reducing the influence of strong current around the control signal or electromagnetic signals, and improving the anti-interference capability of the IPM module. The driving circuit 12 may be plural, so as to correspondingly drive plural inverter circuits.

When these circuit boards are mounted in the carrier, as shown in fig. 1, the first circuit board 1 may be disposed above, the second circuit boards 2 may be disposed below the first circuit board 1 in parallel, the pins 3 may be divided into two groups, the first pin group and the second pin group are respectively disposed at upper and lower sides, the first pin group is close to the outer side of the first circuit board 1, the second pin group is close to the outer side of the second circuit boards 2, the first pin group is connected to the weak current control signal input to the MCU62 and some weak current signals output from the driving circuit 12, such as the port of the bootstrap circuit, and the second pin group is connected to the output port of the inverter circuit that outputs the driving signal for driving the load to operate, the PFC circuit 22, and the rectifier circuit 21. The first pin group mainly transmits weak current signals. The signals outputted from the second circuit boards 2 are mainly strong electric signals, such as high-voltage pulsating direct current (200 + 300V) outputted from the rectifying circuit 21, three-phase high-voltage signals of the driving motor winding outputted from the inverter circuit, and the like, and these signals are connected to the lower pin group, thereby forming the second pin group. Through the layout of the first circuit substrate 1 and the plurality of second circuit substrates 2, the layout of the first circuit substrate and the plurality of second circuit substrates 2 is compact, the occupied area of the whole circuit substrate is reasonably optimized and reduced, weak current control signals input to the MCU62 are placed in the first pin group, strong current output signals of the inverter circuit and the rectifying circuit 21 are placed in the second pin group, and therefore pins 3 of strong current and weak current signals of the IPM module are distributed on two sides of the IPM module, isolation is achieved to the maximum degree, the influence of the strong current on the weak current is further reduced, and the working reliability of the IPM module is further improved.

The pins 3 preferably include a first pin group and a second pin group which are transversely connected, and a pin connecting frame 31 which is connected between the first pin group and the second pin group, and the pin connecting frame 31 integrally fixes all the pins 3, so that the whole circuit substrate can be conveniently positioned in the subsequent manufacturing steps.

In step S300, the bonding wires 41 are connected. The bond wires 4 may be connected between a plurality of electronic components such as the IGBT61, the bond wire pads on the surface of the freewheeling diode 64 and the pads of the circuit layer, the bond wires 4 may be connected between the bond wire pads of the surface of the driver chip 63 and the pins 3, and additional bond wire pads on the surface of the driver chip 63 and other bond wire pads on the surface of the IGBT61 may be connected to the bond wires 4, thereby forming a circuit connection of the entire IPM module.

In step S400, this step is a step of realizing the sealing layer 5. The first semi-finished product formed in step S300 may be transferred to a package mold (not shown), wherein the package mold includes an upper film and a lower film disposed above and below, the pins 3 are fixedly disposed between the upper film and the lower film, and the pins 3 fixedly connected to the circuit substrate are in contact with a fixing device located on the lower film to position the circuit substrate. Wherein set up two at least thimbles on last mould, but the free end butt of thimble is in the circuit layer, through these two thimbles, can be used to control each circuit substrate and the distance between the lower mould and realize the location, this distance can not too far away, otherwise can influence the thermal diffusivity, this distance also can not too near, otherwise can cause the injecting glue situation such as not full.

Then, the package mold on which the circuit board is placed is closed, and a sealing resin is injected from the gate. The sealing method may employ transfer mold molding using thermosetting resin or injection mold molding using thermosetting resin. Further, the gas corresponding to the inside of the sealing resin cavity injected from the gate is discharged to the outside through the exhaust port.

Finally, the mold is removed, and after the mold is removed, the sealing resin forms the sealing layer 5, and the free ends of the leads 3 are exposed from the sealing layer 5.

The sealing layer 5 seals the upper and lower surfaces of the first circuit board 1, the sealing layer 5 seals only the upper surface side of the second circuit board 2, i.e., the side on which the electronic components and the leads 3 are mounted, and the bottom surface of the second circuit board 2, i.e., the heat dissipation surface, is exposed from the sealing layer 5, so that the sealing layer 5 of the first circuit board 1 is fully coated and the sealing layer 5 of the second circuit board 2 is semi-coated. Therefore, the first circuit substrate 1 is well protected by the fully-coated sealing layer 5, the first circuit substrate is well protected, external objects are prevented from touching and damaging the first circuit substrate, and the influence of an external machine interference signal on the first circuit substrate 1 is reduced; the heat dissipation surface of the second circuit substrate 2 is exposed from the sealing layer 5, so that the heat generated by the second circuit substrate can be well transmitted to the outside of the IPM module, and the heat dissipation effect of the second circuit substrate can be improved.

In step S500, the step is a step of cutting and shaping the pins 3 of the IPM module forming the second semi-finished product of the sealing layer 5, and the pins 3 may be cut according to the length and shape of the use to cut off the pin connection frame 31 and shape the pins 3; and further testing the IPM module, for example, performing conventional electrical parameter tests, which generally include insulation withstand voltage, static power consumption, delay time and other test items, and performing appearance AOI tests, which generally include test items such as assembly hole size, pin 3 offset and the like, wherein the qualified IPM module is a finished product. Thereby completing the entire IPM module manufacturing process.

The utility model discloses a manufacturing method of IPM module, through disposing a plurality of base plates, wherein the surface of every base plate sets up the circuit layer, the circuit layer sets up a plurality of pads, and dispose electronic component and pin 3 on the surface of circuit wiring layer, so that electronic component and pin 3 are fixed in the pad and are connected with the pad electricity, thereby make a plurality of base plates form first circuit substrate 1 and a plurality of second circuit substrate 2 respectively, wherein MCU control circuit 11 sets up at first circuit substrate 1, inverter circuit, rectifier circuit 21 sets up respectively at every second circuit substrate 2, then with a plurality of electronic component, the circuit layer, connect bonding wire 4 between pin 3, at last to cutting off pin 3, the shaping is with forming intelligent power module, and test intelligent power module after the shaping. Through the circuit substrate and the inverter circuit with MCU control circuit 11 place, the circuit substrate at rectifier circuit 21 place is independently kept apart, thereby make control signal receive around forceful electric power or electromagnetic signal's influence very reduce, and relative not integrated MCU's among the prior art IPM module scheme, can shorten the length of control signal line greatly, promote signal transmission efficiency, thereby further make control signal receive around forceful electric power or electromagnetic signal's influence reduce, with this anti-interference EMS ability of IPM work has been strengthened effectively, thereby whole IPM module work's reliability has been promoted. And because first circuit substrate 1 mainly sets up MCU control circuit 11, its work calorific capacity will be obvious be less than the second circuit substrate 2 of work in the strong electric zone, through setting up these two circuit substrates independently, the calorific capacity that can be obvious reduction second circuit substrate 2 transmits to first circuit substrate 1, consequently can reduce the operating temperature of MCU62 components and parts as far as possible to also promote its job stabilization nature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.

Claims

1. A smart power module, comprising: the intelligent power module comprises a first circuit substrate and a plurality of second circuit substrates, wherein the first circuit substrate and the plurality of second circuit substrates are arranged on the same layer, the intelligent power module comprises a plurality of unit circuits, the plurality of unit circuits comprise at least two of an MCU control circuit, an inverter circuit and a rectifying circuit, the MCU control circuit is arranged on the first circuit substrate, the inverter circuit and the rectifying circuit are respectively arranged on each second circuit substrate, and the work heat productivity of the first circuit substrate is lower than that of the second circuit substrates.

2. The smart power module according to claim 1, further comprising a driving circuit for driving the inverter circuit to operate, wherein the driving circuit is disposed on the first circuit substrate.

3. The intelligent power module according to claim 1 or 2, wherein the intelligent power module is provided with a first pin group for inputting a control signal to the MCU control circuit, and a second pin group for outputting a driving signal for driving a load to operate by the inverter circuit, the first pin group and the second pin group being respectively disposed on two opposite sides of the intelligent power module, wherein a first circuit board is disposed adjacent to the first pin group side, and the plurality of second circuit boards are disposed adjacent to the second pin group side in parallel.

4. The intelligent power module of claim 1, wherein the first circuit substrate and the second circuit substrate are made of different materials, the first circuit substrate is a glass fiber board or a flexible copper clad laminate, and the second circuit substrate is a metal substrate or a non-metal substrate.

5. The smart power module of claim 1 further comprising a PFC circuit disposed on another of the second circuit substrates.

6. The smart power module as claimed in claim 1, further comprising a sealing layer in which the first circuit board is disposed to be encapsulated, and the other surface of each of the second circuit boards opposite to the surface on which the electronic component is mounted is exposed from the sealing layer.

7. The smart power module of claim 6 further comprising a heat sink mounted to the other side of the second circuit substrate.

8. The smart power module according to claim 1, wherein the second circuit substrate of the inverter circuit is provided in plurality.

9. The smart power module of claim 1 further comprising a plurality of wire bonds connected between the first circuit substrate, the second circuit substrate, and pins disposed between the first circuit substrate and the second circuit substrate.