CN114864537A - Display panel and display device - Google Patents

Abstract

Embodiments of the present invention disclose a display panel and a display device. The display panel includes: a substrate, including a bonding area; an insulating layer, a bonding area on one side of the substrate; a plurality of first bonding connection terminals and a plurality of second bonding connection terminals, a plurality of first bonding The connection terminals are arranged in at least one row, and a plurality of second bonding connection terminals are arranged in at least one row, all of which are located in the bonding area; the first bonding connection terminals are input terminals, and the second bonding connection terminals are output terminals; A plurality of metal wirings are located between the insulating layer and the substrate; the metal wirings extend to the bonding area; wherein, a plurality of metal wirings are arranged on the insulating layer in the area between the first bonding connection terminal and the second bonding connection terminal The opening is arranged on the insulating layer in the area between adjacent metal traces. Accordingly, the stress accumulated in the insulating layer in the bonding area is released, thereby preventing the inorganic insulating layers in the bonding area from peeling off each other after the bonding is completed, and improving the bonding reliability of the display panel.

Description

A display panel and display device

technical field

Embodiments of the present invention relate to the field of display technologies, and in particular, to a display panel and a display device.

Background technique

With the continuous popularization of portable smart terminal devices, the frame of the display panel in the smart terminal device is getting narrower and narrower, and even a full screen with almost no frame can be achieved.

The current display panel generally adopts LCD (Liquid Crystal Display, liquid crystal display) display panel, LED (Light-Emitting Diode, light-emitting diode) display panel or OLED (Organic Light-Emitting Diode, organic light-emitting diode) display panel. Circuit, integrated circuit) bonding (Bonding) mainly uses COG (Chip On Glass), COF (Chip On Film) or COP (Chip On plastic) process for bonding.

However, regardless of the above-mentioned bonding process, after the bonding is completed, when the display panel is in a high temperature or high humidity environment, the inorganic insulating layers located in the bonding area of the display panel will be peeled off from each other (Peeling). ), showing lower bond reliability.

SUMMARY OF THE INVENTION

Embodiments of the present invention provide a display panel and a display device, so as to release the stress accumulated in each inorganic insulating layer in the bonding area of the display panel, thereby avoiding the inorganic insulating layers in the bonding area of the display panel after the bonding is completed They are separated from each other to improve the bonding reliability of the display panel.

In a first aspect, an embodiment of the present invention provides a display panel, the display panel includes: a substrate including a bonding area;

an insulating layer, the bonding region on one side of the substrate;

A plurality of first bonding connection terminals and a plurality of second bonding connection terminals, a plurality of the first bonding connection terminals are arranged in at least one row, and a plurality of the second bonding connection terminals are arranged in at least one row, are located in the bonding area; the first bonding connection terminal is an input terminal, and the second bonding connection terminal is an output terminal;

a plurality of metal traces, located between the insulating layer and the substrate; the metal traces extend to the bonding area;

Wherein, a plurality of openings are arranged on the insulating layer in the area between the first bonding connection terminal and the second bonding connection terminal, and the openings are arranged in the area between the adjacent metal traces. on the insulating layer.

Optionally, the opening includes a first opening; the first opening is arranged adjacent to the first bonding connection terminal, the first opening is arranged in at least one row, and the arrangement direction of the first opening is the same as that of the first opening. The arrangement directions of the first bonding connection terminals are the same.

Optionally, the opening includes a second opening; the second opening is arranged adjacent to the second bonding connection terminal, the second opening is arranged in at least one row, and the arrangement direction of the second opening is the same as that of the second opening. The arrangement directions of the second bonding connection terminals are the same.

Optionally, the substrate further includes a display area;

Compared with the first bonding connection terminal, the second bonding connection terminal is closer to the display area; the metal wire connected to the first bonding connection terminal is a first metal wire, the first metal trace extends from the first bonding connection terminal to the display area via the second bonding connection terminal;

The first opening and/or the second opening are disposed on the insulating layer in the region between the adjacent first metal traces.

Optionally, the metal wiring connected to the second bonding connection terminal is a second metal wiring, and the second metal wiring extends from the second bonding connection terminal to the display area;

The second opening is disposed on the insulating layer in the region between the adjacent second metal traces.

Optionally, at least two of the openings are provided on the insulating layer in the region between two adjacent metal traces.

Optionally, the insulating layer includes a first inorganic insulating layer, and the opening penetrates the first inorganic insulating layer.

Optionally, the insulating layer further includes a second inorganic insulating layer, the second inorganic insulating layer is located on a side of the first inorganic insulating layer away from the substrate; the opening penetrates the second inorganic insulating layer layer, or the opening penetrates the second inorganic insulating layer and the first inorganic insulating layer.

Optionally, the shapes of the first opening and the metal wiring are both rectangular parallelepiped;

Preferably, the shape of the second opening is a rectangular parallelepiped.

In a second aspect, an embodiment of the present invention further provides a display device, the display device includes the display panel according to the above first aspect, the display device further includes a connector; the connector includes a plurality of input pins and A plurality of output pins, the input pins are connected with the corresponding first bonding connection terminals, and the output pins are connected with the corresponding second bonding connection terminals.

In the technical solution of the embodiment of the present invention, the display panel includes a substrate, an insulating layer, a plurality of first bonding connection terminals, a plurality of second bonding connection terminals, and a plurality of metal wirings; wherein, the substrate includes a bonding area, The insulating layer is located in the bonding area on one side of the substrate, a plurality of first bonding connection terminals are arranged in at least one row, a plurality of second bonding connection terminals are arranged in at least one row, a plurality of first bonding connection terminals and A plurality of second bonding connection terminals are disposed in the bonding area, and a plurality of metal traces are located between the insulating layer and the substrate.

By arranging a plurality of openings on the insulating layer in the area between the first bonding connection terminal and the second bonding connection terminal, the stress accumulated in the insulating layer in the bonding area can be released. Based on this, when the insulating layer in the bonding area is formed by stacking multiple inorganic insulating layers, the stress accumulated in each inorganic insulating layer can be released only by setting the depth of the opening so that the opening penetrates through each inorganic insulating layer. According to this embodiment of the present invention, after the bonding is completed, since the stress accumulated in each inorganic insulating layer has been released through the provided opening, there is no more stress accumulated in each inorganic insulating layer, so when the display panel is at a high temperature Or in a high-humidity environment, the inorganic insulating layers will not peel off each other due to stress release in a high-temperature or high-humidity environment, thereby improving the bonding reliability of the display panel. In addition, in the embodiment of the present invention, by disposing openings on the insulating layer in the region between adjacent metal traces, the metal traces located between the insulating layer and the substrate are not exposed by the provided openings, but are still exposed to The insulating layer is covered and protected, so as to avoid the bright line of the metal wiring in the bonding area, to ensure that the metal wiring in the bonding area will not be damaged, and the metal wiring can maintain its good performance.

Description of drawings

FIG. 1 is a partial top-view structural schematic diagram of a display panel in the related art;

Fig. 2 is a cross-sectional structural schematic diagram of the display panel shown in Fig. 1 being cross-sectioned along section line CC';

3 is a partial top-view structural schematic diagram of another display panel in the related art;

4 is a partial top-view structural schematic diagram of another display panel in the related art;

FIG. 5 is a partial top-view structural schematic diagram of a display panel provided by an embodiment of the present invention;

Fig. 6 is the cross-sectional structure schematic diagram of the display panel shown in Fig. 5 being cross-sectioned along section line DD';

7 is a partial top-view structural schematic diagram of another display panel provided by an embodiment of the present invention;

8 is a partial top-view structural schematic diagram of another display panel provided by an embodiment of the present invention;

9 is a partial top-view structural schematic diagram of another display panel provided by an embodiment of the present invention;

10 is a schematic cross-sectional structure diagram of another display panel provided by an embodiment of the present invention, which is cross-sectioned along section line DD';

11 is a schematic cross-sectional structure diagram of another display panel provided in an embodiment of the present invention taken along the section line DD';

FIG. 12 is a schematic cross-sectional structure diagram of another display panel according to an embodiment of the present invention taken along the section line DD'.

Detailed ways

The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, the drawings only show some but not all structures related to the present invention.

As mentioned in the background art, after the IC bonding is completed, when the display panel is in a high temperature or high humidity environment, the inorganic insulating layers located in the bonding area of the display panel will be peeled off from each other, showing Lower bond reliability. The inventor's research found that the reason for this technical problem is:

1 is a schematic top view of a display panel in the related art, FIG. 2 is a schematic cross-sectional structure of the display panel shown in FIG. 1 taken along the section line CC', and FIG. 2 also shows that the IC is bonded to the Figures involved in the process of displaying the panel. Referring to Fig. 2 and Fig. 1, the IC has a plurality of bonding pins (bump), the bump may include Input bump (bonding input pin) and Output bump (bonding output pin), Input bump and Output bump are respectively distributed in both sides of the IC. The display panel includes a substrate 100 and a plurality of metal traces 300 , an insulating layer 200 and a plurality of bonding connection terminals (Pads) located in the bonding area BB of the substrate 100 . The metal wiring 300 is located between the substrate 100 and the insulating layer 200 . The metal wiring 300 can extend from the display area AA of the display panel to the bonding area BB, and is electrically connected to the Pad. The insulating layer 200 is formed by stacking the first inorganic insulating layer 210 and the second inorganic insulating layer 220 . Corresponding to the IC bump, the Pad may include an Input Pad (bonding input connection terminal) and an Output bump (bonding output connection terminal), and the Input Pad and the Output bump are respectively distributed on both sides of the insulating layer 200 .

Based on this, and continuing to refer to FIG. 2 , in the process of bonding the IC bump and the Pad corresponding to the bonding area of the substrate 100 , the IC is subjected to the pressure F toward the substrate 100 , so that the position of the Pad in the bonding area is greatly affected. pressure, thereby causing the insulating layer 200 to deform. After the bonding is completed, the stress caused by the deformation is accumulated in the first inorganic insulating layer 210 and the second inorganic insulating layer 220, so that when the display panel is in a high temperature or high humidity environment, based on environmental factors and its own material factors, the first inorganic insulating layer The insulating layer 210 and the second inorganic insulating layer 220 respectively release stress. In the process of releasing the stress, the stress accumulated in the first inorganic insulating layer 210 and the stress accumulated in the second inorganic insulating layer 220 usually do not match, so that the first inorganic insulating layer 210 and the second inorganic insulating layer 210 do not match. The insulating layers 220 are peeled off from each other, and the display panel exhibits low bonding reliability.

In this regard, FIG. 3 is a partial top-view structure diagram of another display panel in the related art. Referring to FIG. 3 , in order to release the stress accumulated in the insulating layer 200 in the bonding area, in the related art, the adjacent Pad of the insulating layer 200 is A groove 410 is provided at the position, and the groove 410 extends along the arrangement direction x of the Pad, that is, the stress accumulated in the insulating layer 200 is released through the long groove 410 on the insulating layer 200 . However, as shown in FIG. 3 , in this way, the multiple metal traces 300 under the insulating layer 200 are all exposed by the grooves, and the exposed positions of the metal traces 300 by the grooves are no longer covered and protected by the insulating layer 200 , and the bonding is In the area BB, the metal wiring 300 is bright, and the metal wiring 300 is easily damaged.

In addition, FIG. 4 is a partial top-view structural schematic diagram of another display panel in the related art. Referring to FIG. 4 , another way of releasing the stress in the insulating layer 200 in the bonding area in the related art is: A plurality of slits 420 are disposed adjacent to the Pads, and the slits 420 extend along the arrangement direction x of the Pads. The disadvantage of this method is that in the patterning process of the plurality of slits 420, a thin layer of photoresist should be reserved on the insulating layer 200 where the slits 420 need to be arranged, and the photoresist has leveling properties. , so the photoresist remaining on the insulating layer 200 at the position where the slit 420 needs to be arranged will flow, for example, along the arrangement direction x of the Pad, which will cause the photoresist within the distance between the adjacent two metal traces 300 to flow. The thickness of the resist is different, which eventually leads to uneven depths at various positions of the entire slit 420. If the uniformity of the slit 420 itself is not high, it is not easy to release the stress well, and it also exposes the underlying metal to a certain extent. Line 300.

In view of this, an embodiment of the present invention provides a display panel, which can better release the stress accumulated in each inorganic insulating layer in the bonding area of the display panel on the premise of ensuring that the metal traces are not exposed, so as to avoid After the bonding is completed, the inorganic insulating layers in the bonding area of the display panel are peeled off from each other, which improves the bonding reliability of the display panel. FIG. 5 is a partial top-view structural schematic diagram of a display panel according to an embodiment of the present invention, and FIG. 6 is a cross-sectional structural schematic diagram of the display panel shown in FIG. 5 taken along section line DD'.

6 and 5 , the display panel includes: a substrate 100 including a bonding area BB; an insulating layer 200 , a bonding area BB located on one side of the substrate 100 ; a plurality of first bonding connection terminals 510 and a plurality of The second bonding connection terminals 520, the plurality of first bonding connection terminals 510 are arranged in at least one row, and the plurality of second bonding connection terminals 520 are arranged in at least one row, all of which are located in the bonding area BB; The fixed connection terminal 510 is an input terminal, and the second bonding connection terminal 520 is an output terminal; a plurality of metal wires 300 are located between the insulating layer 200 and the substrate 100; the metal wires 300 extend to the bonding area BB; wherein, A plurality of openings 600 are formed on the insulating layer 200 in the area between the first bonding connection terminal 510 and the second bonding connection terminal 520 , and the openings 600 are formed on the insulating layer 200 in the area between adjacent metal traces 300 .

Specifically, the display panel includes a display area AA and a non-display area NAA, and the bonding area BB is located in the non-display area NAA. The display panel may be an LCD display panel, an LED display panel or an OLED display panel. The display panel may be a flexible display panel that can be bent, or a rigid display panel that cannot be bent; correspondingly, the substrate 100 may be a flexible substrate that can be bent, or a rigid substrate that cannot be bent. Flexible substrates can be polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) ), polyarylate (PAR) and/or glass fiber reinforced plastic (FRP) and other polymer materials. The rigid substrate can be made of materials such as glass.

The insulating layer 200 may be formed of resin, silicon oxide, silicon nitride, silicon oxynitride and/or other suitable materials. The insulating layer 200 may be formed in the bonding area BB alone, or may be formed in the same process as part of the film layer in the display area AA of the display panel, that is, formed at the same time as the film layer in the display panel itself. Taking an OLED display panel as an example, the display area of the OLED display panel may include a driving circuit layer, an OLED device layer, and an encapsulation layer stacked on the substrate 100. The encapsulation layer encapsulates the OLED device layer to prevent external water vapor and oxygen. etc. into the OLED device layer. The encapsulation layer is formed by stacking at least one organic layer and at least one inorganic layer, so that when the organic layer or the inorganic layer in the encapsulation layer can be formed on the substrate 100, the organic layer and/or the inorganic layer is not only formed on the substrate 100. The display area AA of the bottom 100 is also formed in the bonding area BB of the substrate 100 , and the organic layer and/or inorganic layer located in the bonding area BB can serve as the insulating layer 200 of the bonding area BB. Certainly, the insulating layer 200 may also be formed by other organic or inorganic film layers in the display area of the display panel other than the encapsulation layer extending to the bonding area BB, which is not specifically limited in this embodiment.

The first bonding connection terminal 510 and the second bonding connection terminal 520 are both located in the bonding area BB, and both are located on the insulating layer 200 . The first bonding connection terminal 510 is an input terminal, which can bond the input pins of the connector, such as the Input bump of an IC, and the second bonding connection terminal 520 is an output terminal, which can bond the output pins of the connector. For example, the Output bump of the bonding IC. According to the size of the area of the bonding area BB, the specific number of bonding connection terminals and the pin distribution of the connectors, etc., it can be determined that a plurality of first bonding connection terminals 510 are arranged in one row or multiple rows, and a plurality of second bonding terminals 510 are arranged in one row or multiple rows. The fixed connection terminals 520 are arranged in one or more rows, and the distance between the first bonding connection terminal 510 and the second bonding connection terminal 520 is determined, and the like. FIG. 5 exemplarily shows a situation where a plurality of first bonding connection terminals 510 are arranged in a row and a plurality of second bonding connection terminals 520 are arranged in a row.

The metal traces 300 can extend from the display area AA to the bonding area BB of the display panel, and are electrically connected to the first bonding connection terminal 510 or the second bonding connection terminal 520 . The metal wiring 300 is located between the insulating layer 200 and the substrate 100 , and the insulating layer 200 covers the metal wiring 300 , so that the insulating layer 200 can protect the metal wiring 300 . A via hole may be provided in the insulating layer 200 , and the metal trace 300 may be electrically connected to the first bonding connection terminal 510 or the second bonding connection terminal 520 through the via hole. The metal wires 300 are, for example, metal connection wires, touch wires, power signal wires, data wires, scan wires, or light-emitting control wires. In addition, the plurality of metal traces 300 located between the insulating layer 200 and the substrate 100 may be located in the same layer or different layers, and the metal traces 300 of different layers may be filled with organic layers for isolation. This embodiment does not specifically limit this.

On this basis, in the embodiment of the present invention, a plurality of openings 600 are provided on the insulating layer 200 in the region between the first bonding connection terminal 510 and the second bonding connection terminal 520 , and the openings 600 are arranged on adjacent metal traces 300 On the insulating layer 200 in the area between the bonding areas, the stress accumulated in the insulating layer 200 in the bonding area can be better relieved on the premise that the metal traces 300 are not exposed. In the process of bonding the input or output pin of the connector with the corresponding first bonding connection terminal 510 or the second bonding connection terminal 520, the connector is located above the bonding area of the substrate 100, and usually a pressure Bonding is performed in a manner of connection, so the connector will be subjected to pressure towards the substrate 100, so that the positions where the first bonding connection terminal 510 and/or the second bonding connection terminal 520 are arranged on the insulating layer 200 are subjected to greater pressure, As a result, the insulating layer 200 is deformed. In the embodiment of the present invention, the stress caused by the deformation will not be continuously accumulated in the insulating layer 200 , but will be released through the provided opening 600 .

Based on this, when the insulating layer 200 in the bonding area BB is formed by stacking multiple layers of inorganic insulating layers, only by setting the depth of the opening 600 so that the opening 600 penetrates through each inorganic insulating layer, the aggregates in each inorganic insulating layer can be collected. stress relief. According to this embodiment of the present invention, after the bonding of the connecting member is completed, since the stress accumulated in each inorganic insulating layer has been released through the provided openings 600 , there is no more stress accumulated in each inorganic insulating layer, so when the display shows When the panel is in a high temperature or high humidity environment, the inorganic insulating layers will not release stress due to environmental factors and their own material factors, and will not be peeled off each other due to stress mismatch, thereby improving the display panel. Bond reliability. At the same time, different from the prior art, in the technical solution of the embodiment of the present invention, the opening 600 is disposed on the insulating layer 200 in the region between the adjacent metal traces 300, so that the metal trace 300 is not exposed by the opening, and It is still covered and protected by the insulating layer 200, so as to avoid the bright line of the metal wiring 300 in the bonding area, ensuring that the metal wiring 300 in the bonding area will not be damaged, and the metal wiring 300 can maintain its good performance.

On the basis of the above embodiment, with continued reference to FIG. 5 , in an embodiment of the present invention, optionally, the opening 600 includes a first opening 610 ; the first opening 610 is disposed adjacent to the first bonding connection terminal 510 , The first openings 610 are arranged in at least one row, and the arrangement direction of the first openings 610 is the same as the arrangement direction of the first bonding connection terminals 510 .

Specifically, during the bonding process, since the input or output pins of the connector and the corresponding first bonding connection terminal 510 or the second bonding connection terminal 520 are crimped and bonded, the insulating layer 200 is provided with a third The position of the first bonding connection terminal 510 and/or the second bonding connection terminal 520 is subjected to greater pressure, and the position where the first bonding connection terminal 510 and/or the second bonding connection terminal 520 is disposed on the insulating layer 200 occurs. Larger deformation. Accordingly, the first openings 610 are disposed adjacent to the first bonding connection terminals 510 , and the arrangement direction of the first openings 610 is the same as the arrangement direction of the first bonding connection terminals 510 , both in the x-direction, so that the insulating layer One end of the 200 provided with the first bonding connection terminal 510 is formed with a mesh structure, so as to better and more targetedly release the stress at the position where the first bonding connection terminal 510 is provided on the insulating layer 200 .

In another embodiment of the present invention, referring to FIG. 7 , FIG. 7 is a partial top-view structural schematic diagram of another display panel provided by an embodiment of the present invention. Optionally, the opening 600 includes a second opening 620 , that is, the opening 600 It includes a first opening 610 and/or a second opening 620, the second opening 620 is disposed adjacent to the second bonding connection terminal 520, the second opening 620 is disposed in at least one row, and the arrangement direction of the second opening 620 is the same as that of the second bonding terminal 520. The arrangement direction of the fixed connection terminals 520 is the same. In the embodiment of the present invention, a second opening 620 is disposed adjacent to the second bonding connection terminal 520 , and the arrangement direction of the second opening 620 is the same as the arrangement direction of the second bonding connection terminal 520 , both in the x-direction, so that the insulation One end of the layer 200 provided with the second bonding connection terminals 520 is formed with a mesh structure, so as to better and more targetedly release the stress on the insulating layer 200 where the second bonding connection terminals 520 are provided.

On the basis of the above embodiments, with continued reference to FIG. 7 , in an embodiment of the present invention, optionally, relative to the first bonding connection terminal 510 , the second bonding connection terminal 520 is further away from the display area AA The second bonding connection terminal 520 is located between the first bonding connection terminal 510 and the display area AA; the metal wiring 300 connected to the first bonding connection terminal 510 is the first metal wiring 310, the first metal The trace 310 extends from the first bonding connection terminal 510 to the display area AA through the second bonding connection terminal 520 , that is, a part of the first metal trace 310 is located between the first bonding connection terminal 510 and the second bonding connection terminal 520 Below the insulating layer 200 in the region between the terminals 520 . In this regard, in this embodiment, the first openings 610 and/or the second openings 620 are located on the insulating layer 200 in the region between the adjacent first metal traces 310, so as to counteract the stress accumulated in the insulating layer 200 in the bonding area On the basis of releasing, it is ensured that the first opening 610 and the second opening 620 will not expose the first metal trace 310, and the first metal trace 310 is still covered and protected by the insulating layer 200, so as to avoid the first metal trace in the bonding area. The bright line of the metal trace 310 ensures that the first metal trace 310 in the bonding area is not damaged and the first metal trace 310 can maintain its good performance.

In still another embodiment of the present invention, referring to FIG. 8 , FIG. 8 is a partial top-view structural schematic diagram of another display panel provided by an embodiment of the present invention. The trace 300 is the second metal trace 320, the second metal trace 320 extends from the second bonding connection terminal 520 to the display area AA, that is, a part of the second metal trace 320 also exists in the first bonding connection terminal The case under the insulating layer 200 in the area between 510 and the second bonding connection terminal 520 . In this regard, in this embodiment, the second opening 620 is disposed on the insulating layer 200 in the region between the adjacent second metal traces 320, so that on the basis of releasing the stress accumulated in the insulating layer 200 in the bonding area, It is ensured that the second opening 620 does not expose the second metal trace 320, the second metal trace 320 is still covered and protected by the insulating layer 200, and the second metal trace 320 can maintain its good performance. In addition, in the case where the second metal wiring 320 and the first metal wiring 310 are alternately arranged between the second bonding connection terminal 520 and the first bonding connection terminal 510, the first opening 610 and the second opening 620 also It can be arranged between the adjacent first metal traces 310 and the second metal traces 320 to ensure that neither the first opening 610 nor the second opening 620 exposes the first metal traces 310 and the second metal traces 320 ie Can.

On the basis of the above-mentioned embodiments, referring to FIG. 9 , FIG. 9 is a partial top-view structural schematic diagram of another display panel provided by an embodiment of the present invention. Optionally, an insulating layer in a region between two adjacent metal traces 300 At least two openings 600 are provided on the 200 .

In this embodiment, openings may be provided on the insulating layer 200 in the region between part of two adjacent metal traces 300 , or openings may be provided on the insulating layer 200 in the region between any two adjacent metal traces 300 , This embodiment does not specifically limit the specific number of openings provided on the insulating layer 200 . One opening 600 or multiple openings 600 may also be provided between two adjacent metal traces 300 . Compared with setting one opening 600 between two adjacent metal traces 300 , disposing at least two openings 600 between two adjacent metal traces 300 can ensure that the metal traces 300 are not exposed on the premise that The number of openings 600 on the insulating layer 200 is larger, so as to achieve a higher efficiency and better effect of stress release, and release the stress in the insulating layer 200 more quickly and thoroughly. Exemplarily, as shown in FIG. 9 , two first openings 610 are provided on the insulating layer 200 in the region between two adjacent first metal traces 310 , and between two adjacent first metal traces 310 . Two second openings 620 are provided on the insulating layer 200 of the region, so as to ensure that the first metal traces 310 are not exposed to the side of the insulating layer 200 corresponding to the first bonding connection terminal 510 and the side corresponding to the second bonding connection terminal 510 The stress on one side of the bonding connection terminal 520 is relieved more quickly and completely.

On the basis of the foregoing embodiments, optionally, the shapes of the first opening 610 and the metal wiring 300 are both rectangular parallelepiped; optionally, the shape of the second opening 620 is a rectangular parallelepiped. Specifically, the shape of the first opening 610 and the second opening 620 is set to be a rectangular parallelepiped, so as to achieve the effect of rationally utilizing the area of the insulating layer 200, which is conducive to setting more openings in the same area, so as to achieve higher efficiency, more Effective stress relief effect. The shape of the opening 600 may also be any other shape such as a trapezoid, a circle, or a rhombus, which is not specifically limited in this embodiment of the present invention.

In addition, along the extending direction of the metal traces 300 (ie, the y direction), the length of the opening 600 can theoretically be substantially equal to the distance between the first bonding connection terminal 510 and the second bonding connection terminal 520 , but it is set in this way. It is easy to affect the performance of the insulating layer 200 in the bonding area, for example, the supporting performance of the insulating layer 200 in the bonding area and the protection performance for the metal lines are decreased. Accordingly, the length of the opening 600 should not be too large nor too small, and if the length is too small, the stress cannot be relieved well. The performance of the insulating layer 200 is adversely affected.

On the basis of the above embodiments, referring to FIG. 10 , FIG. 10 is a schematic cross-sectional structure diagram of another display panel provided in an embodiment of the present invention taken along the section line DD'. In one embodiment of the present invention, the Optionally, the insulating layer 200 includes the first inorganic insulating layer 210 , and the opening 600 penetrates the first inorganic insulating layer 210 . In yet another embodiment of the present invention, referring to FIG. 11 and FIG. 12 , FIG. 11 is a schematic cross-sectional structure diagram of another display panel according to an embodiment of the present invention taken along the section line DD′, and FIG. 12 is an embodiment of the present invention A schematic cross-sectional structure diagram of another display panel along the section line DD' is provided as an example. Optionally, the insulating layer 200 further includes a second inorganic insulating layer 220, and the second inorganic insulating layer 220 is located away from the first inorganic insulating layer 210. One side of the substrate 100 ; as shown in FIG. 11 , the opening 600 penetrates the second inorganic insulating layer 220 , or as shown in FIG. 12 , the opening 600 penetrates the second inorganic insulating layer 220 and the first inorganic insulating layer 210 .

Specifically, when the display panel is a touch display panel, the display area AA of the display panel includes a display driving layer and a touch layer located on the display driving layer. The first inorganic insulating layer 210 may be an inorganic insulating layer extending from a film layer inherent in the display driving layer to the bonding region, and the second inorganic insulating layer 210 may be an inherent film layer extending from the touch layer. Inorganic insulating layer to the bonding area. Exemplarily, the first inorganic insulating layer 210 is formed by the inorganic layer of the encapsulation layer in the display driving layer extending to the bonding region BB, and the second inorganic insulating layer 220 is formed by the inorganic layer in the touch layer used to isolate at least two layers of touch electrode blocks. layer extending to the bonding area BB, wherein, the first inorganic insulating layer 210 and the second inorganic insulating layer 220 can both be formed by stacking at least one film layer. In this embodiment, the first inorganic insulating layer 210 and the second inorganic insulating layer 210 The number of film layers included in the inorganic insulating layer 220 is not particularly limited.

In the embodiment of the present invention, the openings 600 are arranged to penetrate the first inorganic insulating layer 210 and the second inorganic insulating layer 220, so as to ensure that the stress accumulated in each inorganic insulating layer is released, and to better prevent the occurrence of each inorganic insulating layer between each other. stripped. Considering the accuracy of the actual process, when the bonding area BB includes the first inorganic insulating layer 210 and the second inorganic insulating layer 220, the opening 600 may be provided only in the second inorganic insulating layer 220, or the opening 600 may only penetrate the second inorganic insulating layer 220. The inorganic insulating layer 220 and a part of the first inorganic insulating layer 210 can also better avoid peeling between each inorganic insulating layer, because the inorganic insulating layer closer to the substrate 100 is less deformed. Therefore, the stress accumulated therein is also small, and the influence on the peeling of the inorganic insulating layers from each other is also small.

An embodiment of the present invention further provides a display device, the display device may be an LCD display device, an LED display device or an OLED display device, and an IC package in the display device may be a COG, COF or COP package, that is, the display device may be a flexible display device The device may also be a non-flexible display device. The display device includes the display panel in any of the above-mentioned embodiments, and the display device further includes a connector; the connector includes a plurality of input pins and a plurality of output pins, the input pins are connected to the corresponding first bonding connection terminals, and the output pins are connected. The pins are connected to the corresponding second bonding connection terminals; wherein, the connection member is, for example, a driving chip, a touch control chip, a chip that integrates driving and touch functions at the same time, or a flexible circuit board (FPC). The display device provided by the embodiment of the present invention and the display panel of any of the above-mentioned embodiments belong to the same inventive concept, and both can achieve the same technical effect, and repeated content will not be repeated here.

Note that the above are only preferred embodiments of the present invention and applied technical principles. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and can also include more other equivalent embodiments without departing from the concept of the present invention. The scope is determined by the scope of the appended claims.

Claims (10)

1. A display panel, characterized in that, comprising: substrates, including bonding areas; an insulating layer, the bonding region on one side of the substrate; A plurality of first bonding connection terminals and a plurality of second bonding connection terminals, a plurality of the first bonding connection terminals are arranged in at least one row, and a plurality of the second bonding connection terminals are arranged in at least one row, are located in the bonding area; the first bonding connection terminal is an input terminal, and the second bonding connection terminal is an output terminal; a plurality of metal traces, located between the insulating layer and the substrate; the metal traces extend to the bonding area; Wherein, a plurality of openings are arranged on the insulating layer in the area between the first bonding connection terminal and the second bonding connection terminal, and the openings are arranged in the area between the adjacent metal traces. on the insulating layer. 2 . The display panel of claim 1 , wherein the opening comprises a first opening; the first opening is disposed adjacent to the first bonding connection terminal, and the first opening is in at least one row. 3 . The arrangement direction of the first openings is the same as the arrangement direction of the first bonding connection terminals. 3 . The display panel according to claim 1 , wherein the opening comprises a second opening; the second opening is disposed adjacent to the second bonding connection terminal, and the second opening is at least The arrangement is arranged in a row, and the arrangement direction of the second openings is the same as the arrangement direction of the second bonding connection terminals. 4. The display panel according to claim 3, wherein the substrate further comprises a display area; Compared with the first bonding connection terminal, the second bonding connection terminal is closer to the display area; the metal wire connected to the first bonding connection terminal is a first metal wire, the first metal trace extends from the first bonding connection terminal to the display area via the second bonding connection terminal; The first opening and/or the second opening are disposed on the insulating layer in the region between the adjacent first metal traces. 5 . The display panel according to claim 4 , wherein the metal trace connected to the second bonding connection terminal is a second metal trace, and the second metal trace extends from the second metal trace. 6 . Two bonding connection terminals extend to the display area; The second opening is disposed on the insulating layer in the region between the adjacent second metal traces. 6 . The display panel of claim 1 , wherein at least two of the openings are provided on the insulating layer in the region between two adjacent metal traces. 7 . 7 . The display panel of claim 1 , wherein the insulating layer comprises a first inorganic insulating layer, and the opening penetrates through the first inorganic insulating layer. 8 . 8 . The display panel according to claim 7 , wherein the insulating layer further comprises a second inorganic insulating layer, and the second inorganic insulating layer is located at a part of the first inorganic insulating layer away from the substrate. 9 . side; the opening penetrates the second inorganic insulating layer, or the opening penetrates the second inorganic insulating layer and the first inorganic insulating layer. 9 . The display panel according to claim 3 , wherein the shapes of the first opening and the metal wiring are both rectangular parallelepiped; 10 . Preferably, the shape of the second opening is a rectangular parallelepiped. 10. A display device, characterized in that it comprises the display panel according to any one of claims 1-9; the display device further comprises a connector; the connector comprises a plurality of input pins and a plurality of outputs The input pin is connected to the corresponding first bonding connection terminal, and the output pin is connected to the corresponding second bonding connection terminal.

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