CN114850604A - Method for separating waste mobile phone circuit board or computer memory chip component and recovering soldering tin - Google Patents
Method for separating waste mobile phone circuit board or computer memory chip component and recovering soldering tin Download PDFInfo
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- CN114850604A CN114850604A CN202210381986.6A CN202210381986A CN114850604A CN 114850604 A CN114850604 A CN 114850604A CN 202210381986 A CN202210381986 A CN 202210381986A CN 114850604 A CN114850604 A CN 114850604A
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- Prior art keywords
- sodium chloride
- mobile phone
- circuit board
- computer memory
- phone circuit
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B25/00—Obtaining tin
- C22B25/02—Obtaining tin by dry processes
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B25/00—Obtaining tin
- C22B25/04—Obtaining tin by wet processes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B25/00—Obtaining tin
- C22B25/06—Obtaining tin from scrap, especially tin scrap
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
The invention discloses a method for separating waste mobile phone circuit boards or computer memory chip components and parts and recovering soldering tin, which comprises the following steps: (1) adding materials; (2) heating for detinning; (3) separating; (4) and (6) recovering soldering tin. The method has the advantages of simple operation, high solder recovery rate, low cost and little environmental pollution.
Description
Technical Field
The invention belongs to the technical field of solid waste resource utilization, and particularly relates to a method for separating waste mobile phone circuit boards or computer memory chip components and recovering soldering tin.
Background
The electronic wastes such as the waste circuit boards contain a large amount of valuable metals, are high-quality urban mineral resources, and are important recovery resources of precious metals, wherein the waste mobile phone circuit boards are the most representative one of the precious metals, the precious metals and nonferrous metals account for about 30% of the total mass of the mobile phone, and the precious metals and nonferrous metals mainly comprise metal elements such as gold, palladium, silver, copper, tin, nickel and the like. The method has huge economic benefits, and the key for recycling the precious metals and other valuable metals from the waste water with high efficiency and low pollution is how to recycle the precious metals and other valuable metals.
At present, the high-temperature baking plate is mainly adopted in China to separate the chip components and the base plates on the mobile phone circuit board and the computer memory bank, or the mineral oil with high boiling point is heated to 200-300 ℃, then the base plates and the components on the waste mobile phone circuit board and the computer memory bank are separated, and then the next extraction treatment is carried out, or the waste mobile phone circuit board is directly smelted into a copper ingot by adopting a burning method.
The methods all have some problems, the high-temperature baking plate adopts a heat radiation method to melt soldering tin on the plate and separate components and a substrate, and due to uneven heating, the substrate is over-heated and burnt, and a large amount of toxic gas is generated; mineral oil is adopted as a heating medium, so that the temperature can be accurately controlled, the local over-temperature burning of the substrate is avoided, waste mineral oil which is difficult to treat is generated in the treatment process, and meanwhile, the mineral oil on the surfaces of the substrate and the components needs to be cleaned, cleaning wastewater is generated, so that the secondary pollution is generated, and the production cost is increased; the flame retardant containing halogen elements in the waste copper wire board which is smelted into the copper ingot by directly burning the wire board generates carcinogenic substances in the combustion process, pollutes the atmosphere and poses great threat to the health of human bodies.
Disclosure of Invention
The invention aims to provide a method for separating waste mobile phone circuit boards or computer memory chip components and parts and recovering soldering tin, which has the advantages of simple operation, high soldering tin recovery rate, low cost and small environmental pollution.
The above object of the present invention can be achieved by the following technical solutions: a method for separating and recovering soldering tin of waste mobile phone circuit boards or computer memory chip components comprises the following steps:
(1) feeding: selecting a waste mobile phone circuit board or a computer memory bank, placing the waste mobile phone circuit board or the computer memory bank in a rotatable heating container, and then adding sodium chloride as a heat medium;
(2) heating for detinning: adjusting the temperature, the rotating speed and the heating time of the rotatable heating container to melt the soldering tin between the waste mobile phone circuit board or the computer memory stick and the chip component, separating the waste mobile phone circuit board or the computer memory stick from the chip component, and dispersing the melted soldering tin on the sodium chloride;
(3) separation: placing the separated waste mobile phone circuit board or computer memory strip, the chip component and the sodium chloride into a double-layer vibrating screen, and separating the sodium chloride, the chip component and the waste mobile phone circuit board or the computer memory strip;
(4) and (3) recovering soldering tin: dissolving sodium chloride in water, filtering, recovering soldering tin, and recycling the sodium chloride in the sodium chloride solution.
Preferably, the rotatable heating container in the step (1) is a stainless steel roller, a helical blade for stirring is arranged in the stainless steel roller, one end of a cylinder body of the stainless steel roller is respectively provided with a feeding hole and a discharging hole, and the other end of the cylinder body is closed.
Preferably, the stainless steel roller is driven by a motor and can rotate clockwise and anticlockwise, the stainless steel roller rotates clockwise for feeding, and the stainless steel roller rotates anticlockwise for discharging.
Preferably, the diameter of the stainless steel roller is 280-320 mm, and the length of the stainless steel roller is 380-420 mm.
Preferably, the sodium chloride in the step (1) is industrial sodium chloride, and the particle size of the industrial sodium chloride is 20-30 meshes.
Preferably, the mass part ratio of the sodium chloride to the waste mobile phone circuit board or the computer memory stick in the step (1) is 1: 4-5; the total volume of the waste mobile phone circuit board or the computer memory strip and the sodium chloride is not more than 2/3 of the total volume of the rotatable heating container.
Preferably, the rotatable heating container in the step (2) is electrically heated.
Preferably, in the step (2), the temperature of the rotatable heating container is adjusted to be 200-250 ℃, the rotating speed is 10-20 r/min, and the heating time is 30-60 min.
Preferably, in the step (3), the mesh of the lower layer screen mesh of the double-layer vibrating screen is 5-10 meshes and is used for screening out sodium chloride, the mesh of the upper layer screen mesh is 20-30 mm in diameter and is used for screening out the patch components, and the waste mobile phone circuit board or the computer memory bank is left on the upper layer screen mesh so as to completely separate the waste mobile phone circuit board or the computer memory bank, the patch components and the sodium chloride.
Preferably, in the step (4), the sodium chloride is dissolved by water to form a saturated sodium chloride solution, the saturated sodium chloride solution is crystallized by a salt exposure method or a heating method to separate out the sodium chloride, and then the sodium chloride is crushed and sieved for recycling.
Compared with the prior art, the invention has the following advantages:
(1) according to the method, fine industrial salt sodium chloride is used as a heat transfer medium, a certain amount of industrial salt and a mobile phone circuit board are mixed and placed in a rotatable heating container, the industrial salt is heated to 200-250 ℃ through electric heating, the industrial salt is used as a heat medium, the mobile phone circuit board can be uniformly heated, local over-temperature cannot be generated, toxic gas generated by local overheating and scorching of the circuit board is avoided, meanwhile, soldering tin between a substrate and a component is melted, the component and the substrate are separated, the soldering tin on the component is dispersed on the industrial salt due to friction, the soldering tin reaches a certain amount, the industrial salt sodium chloride is dissolved in water and filtered, the soldering tin and a sodium chloride solution can be separated and recycled, and the saturated sodium chloride solution can be repeatedly used after being crystallized and separated by a salt exposure method or a heating method;
(2) the method has the advantages of simple operation, high soldering tin recovery rate, low cost and small environmental pollution.
Drawings
Fig. 1 is a process flow of separating and recovering solder from the chip components on the circuit boards of the waste mobile phones in embodiment 1-2.
Detailed Description
The following examples are given to further illustrate the present invention and should not be construed as limiting the scope of the invention, which is intended to be covered by the claims appended hereto.
The present invention preferably, but not exclusively, employs the following rotatable heating vessels:
the invention manufactures a 304 stainless steel electric heating roller, the diameter of the roller is 300mm, the length of the roller is 400mm, the volume of the roller is about 28L, a stainless steel helical blade is arranged in the roller, the roller is driven by a motor and can rotate forward and backward, a feed inlet and a discharge outlet are arranged at one end of a cylinder, one end of the cylinder is closed, and the clockwise rotation is feeding and the anticlockwise rotation is discharging.
Example 1
As shown in fig. 1, the method for separating and recovering solder from chip components of a waste mobile phone circuit board provided in this embodiment includes the following steps:
(1) feeding: firstly, putting a 2kg waste functional mobile phone circuit board into an electrically heated stainless steel roller, then adding 10kg of 20-mesh industrial salt sodium chloride, wherein the volume of the sodium chloride and the waste mobile phone is not more than 2/3 of the total volume of the roller, and then closing a feed inlet on the stainless steel roller;
(2) heating for detinning: the production time of the circuit board of the waste mobile phone is relatively short, the tin-lead alloy solder is arranged on the circuit board, the melting point temperature of the common eutectic tin-lead alloy solder is about 183 ℃, so that the detinning temperature is set to be 203 ℃, 20 ℃ higher than the melting point, the circuit board of the waste mobile phone rotates anticlockwise at the rotating speed of 10r/min, the temperature of the roller reaches 203 ℃, the heating time is 30 minutes, the solder on the circuit board of the waste mobile phone is melted after reaching the melting point, the chip component on the circuit board is separated from the substrate through the heating melting effect and the friction effect between the circuit board of the waste mobile phone and sodium chloride salt, most of the melted solder is brought to the surface of sodium chloride, and conditions are created for recovering tin in the next step;
(3) separating the plate device: after the waste mobile phone circuit board and the surface mounted components on the waste mobile phone circuit board are separated, the waste mobile phone circuit board and sodium chloride in the waste mobile phone circuit board are placed into a double-layer vibrating screen together, a lower-layer screen is 10 meshes, so that the sodium chloride with 20 meshes can be smoothly screened out, the diameter of meshes of an upper-layer screen is 30mm, the size of the surface mounted components is not more than 15mm at most, so that the surface mounted components can be smoothly screened out, and the size of a functional mobile phone circuit board is 40mm multiplied by 100mm and is left on the upper-layer screen, so that a mobile phone circuit substrate, the surface mounted components and the sodium chloride are completely separated;
(4) and (3) recovering soldering tin: compared with a wave-soldering plug-in component, the soldering tin on the reflow soldering chip component has low soldering tin content, the soldering tin is brought to the surface of sodium chloride through the friction effect of the sodium chloride, the sodium chloride can be recycled for many times, when the soldering tin on the sodium chloride reaches a certain amount and influences the separation effect, the sodium chloride is dissolved, the soldering tin on the sodium chloride falls off, is enriched and recovered, the weight of the cleaned and dried soldering tin is 98.5g, and 98.5g of the soldering tin can be recovered from a 2kg waste mobile phone circuit board;
(5) dissolving and recycling sodium chloride: determining the water adding amount according to the solubility of sodium chloride at different temperatures, ensuring that the sodium chloride becomes saturated solution at the temperature, ensuring that the solubility of the sodium chloride is not greatly influenced by the temperature, ensuring that the solubility of the sodium chloride is 36g/100g at the normal temperature of 25 ℃, adding 27.78kg of water into 10kg of sodium chloride to form saturated solution, heating, evaporating, cooling, crystallizing and drying the saturated sodium chloride solution separated from soldering tin, crushing the saturated sodium chloride solution to be not less than 20 meshes by using a crusher, and recycling the saturated sodium chloride solution.
Example 2
As shown in fig. 1, the method for separating and recovering solder from chip components of a waste mobile phone circuit board provided in this embodiment includes the following steps:
(1) feeding: firstly, 2kg of waste smart phone circuit boards are placed into an electrically heated stainless steel drum, and then 8kg of 20-mesh industrial salt sodium chloride is added, so that the area of the waste smart phone circuit boards is smaller than that of waste functional phone circuit boards, a plurality of smart phone circuit boards can be divided into two, and the area is smaller, therefore. The adding amount of the sodium chloride can be smaller, the sodium chloride and the waste smart phone circuit board occupy no more than 2/3 of the volume of the roller, and then the feeding hole is closed.
(2) Heating for detinning: the method is characterized in that an electric heating roller is adopted, because the lead-free lead alloy solder is arranged on the circuit board of the waste smart phone, the melting point temperature of the commonly used lead-free alloy solder is about 210 ℃, the detinning temperature is set to be 230 ℃, the melting point temperature is higher than 20 ℃, the electric heating roller rotates anticlockwise, the rotating speed is 15r/min, the temperature of the roller reaches 230 ℃, the heating time is 60 minutes, the solder on the circuit board of the waste smart phone is melted after reaching the melting point, the chip component on the circuit board is separated from the substrate through the heating melting effect and the friction effect between the circuit board of the waste smart phone and the sodium chloride salt, most of the melted solder is brought to the surface of the sodium chloride, and conditions are created for recovering tin in the next step;
(3) separating the plate device: after the waste mobile phone circuit board and the surface mounted components on the waste mobile phone circuit board are separated, the waste mobile phone circuit board and the surface mounted components are placed into a double-layer vibrating screen together with sodium chloride in the waste mobile phone circuit board, the lower layer screen is 10 meshes, the sodium chloride with 20 meshes can be smoothly screened out, the mesh opening of the upper layer screen is 25mm, the maximum size of the surface mounted components is not more than 15mm, the surface mounted components are smoothly screened out, the size of the intelligent mobile phone circuit board is 40mm multiplied by 100mm and is left on the upper layer screen, and the mobile phone circuit board, the surface mounted components and the sodium chloride are completely separated;
(4) and (3) recovering soldering tin: compared with a wave-soldering plug-in component, soldering tin on the reflow soldering chip component has low soldering tin content, the soldering tin is brought to the surface of sodium chloride through the friction effect of the sodium chloride, the sodium chloride can be recycled for many times, the soldering tin on the sodium chloride is dissolved when the separation effect is influenced until the soldering tin reaches a certain amount, the soldering tin on the sodium chloride falls off, is enriched and recovered, the weight of the cleaned and dried soldering tin is 102.5g, and 102.5g of lead-free solder can be recovered from a 2kg waste mobile phone circuit board.
(5) Dissolving and recycling sodium chloride: determining the water adding amount according to the solubility of sodium chloride at different temperatures, ensuring that the sodium chloride becomes saturated solution at the temperature, ensuring that the solubility of the sodium chloride is not greatly influenced by the temperature, ensuring that the solubility of the sodium chloride is 36g/100g at the normal temperature of 25 ℃, adding 22.2kg of water into 8kg of sodium chloride to form saturated solution, heating, evaporating, cooling, crystallizing and drying the saturated sodium chloride solution separated from soldering tin, crushing the saturated sodium chloride solution to be not less than 20 meshes by using a crusher, and recycling the saturated sodium chloride solution.
Example 3
The method for separating and recovering the soldering tin of the computer memory chip component provided by the embodiment comprises the following steps:
(1) feeding: firstly, 1kg of waste desktop computer memory chips are placed in an electromagnetic heating stainless steel roller, 5kg of 20-mesh industrial salt sodium chloride is added, the volume occupied by the sodium chloride and the waste desktop computer memory chips is not more than 2/3 of the volume of the roller, and then a feeding hole is closed;
(2) heating for detinning: an electric heating roller is adopted, because the memory chip is welded on the memory bar of the computer by adopting lead-free lead alloy solder, the melting point temperature of the commonly used lead-free alloy solder is about 210 ℃, the detinning temperature is set to be 230 ℃, the melting point temperature is 20 ℃ higher than the melting point temperature, the anti-clockwise rotation is carried out, the rotating speed is 15r/min, the temperature of the roller reaches 230 ℃, the heating time is 60 minutes, the solder starts to melt after the solder on the memory bar of the desktop computer reaches the melting point, the chip memory chip on the memory bar of the desktop computer is separated from a substrate through the heating melting action and the friction action between the memory bar of the desktop computer and sodium chloride salt, most of the molten solder is brought to the surface of the sodium chloride, and conditions are created for the next step of tin recovery;
(3) separating the plate device: after the memory bank of the desktop computer is separated from the surface mounted device thereon, the memory bank and sodium chloride in the memory bank are put into a double-layer vibrating screen together, a lower-layer screen is 10 meshes to ensure that the sodium chloride with 20 meshes can be smoothly screened out, the mesh diameter of an upper-layer screen is 20mm, the maximum size of a memory chip is not more than 10mm to ensure that the memory chip can be smoothly screened out, the size of the memory bank of the desktop computer is 30mm multiplied by 140mm and is left on the upper-layer screen, and the memory bank of the desktop computer is completely separated from the sodium chloride;
(4) and (3) recovering soldering tin: the soldering tin on the reflow soldering chip component has less soldering tin content compared with a wave-soldering plug-in component, the soldering tin is brought to the surface of sodium chloride through the friction effect of the sodium chloride, the sodium chloride can be recycled for many times, when the soldering tin on the sodium chloride reaches a certain amount and the separation effect is influenced, the sodium chloride is dissolved, the soldering tin on the sodium chloride falls off, is enriched and recovered, the weight of the cleaned and dried soldering tin is 40.5g, and 40.5g of lead-free solder can be recovered from a 1kg desktop computer memory bar;
(5) dissolving and recycling sodium chloride: determining the water adding amount according to the solubility of sodium chloride at different temperatures, ensuring that the sodium chloride becomes saturated solution at the temperature, ensuring that the solubility of the sodium chloride is not greatly influenced by the temperature, ensuring that the solubility of the sodium chloride is 36g/100g at the normal temperature of 25 ℃, adding 14kg of water into 5kg of sodium chloride to form saturated solution, heating, evaporating, cooling, crystallizing and drying the saturated sodium chloride solution separated from soldering tin, crushing the saturated sodium chloride solution to be not less than 20 meshes by using a crusher, and recycling the saturated sodium chloride solution.
The present invention is illustrated by the following examples, which are not intended to limit the scope of the invention. Other insubstantial modifications and adaptations of the present invention can be made without departing from the scope of the present invention.
Claims (9)
1. A method for separating and recovering soldering tin of waste mobile phone circuit boards or computer memory chip components is characterized by comprising the following steps:
(1) feeding: selecting a waste mobile phone circuit board or a computer memory bank, placing the waste mobile phone circuit board or the computer memory bank in a rotatable heating container, and then adding sodium chloride as a heat medium;
(2) heating for detinning: adjusting the temperature, the rotating speed and the heating time of the rotatable heating container to melt the soldering tin between the waste mobile phone circuit board or the computer memory stick and the chip component, separating the waste mobile phone circuit board or the computer memory stick from the chip component, and dispersing the melted soldering tin on the sodium chloride;
(3) separation: placing the separated waste mobile phone circuit board or computer memory strip, the chip component and the sodium chloride into a double-layer vibrating screen, and separating the sodium chloride, the chip component and the waste mobile phone circuit board or the computer memory strip;
(4) and (3) recovering soldering tin: dissolving sodium chloride in water, filtering, recovering soldering tin, and recycling the sodium chloride in the sodium chloride solution.
2. The method for separating and recovering the soldering tin of the waste mobile phone circuit board or the computer memory chip component as claimed in claim 1, which is characterized in that: in the step (1), the rotatable heating container is a stainless steel roller, a helical blade for stirring is arranged in the stainless steel roller, one end of a cylinder body of the stainless steel roller is respectively provided with a feeding hole and a discharging hole, and the other end of the cylinder body is closed.
3. The method for separating and recovering the soldering tin of the waste mobile phone circuit board or the computer memory chip component as claimed in claim 2, wherein the method comprises the following steps: the stainless steel roller is driven by a motor and can rotate clockwise and anticlockwise, the stainless steel roller rotates clockwise to feed, and the stainless steel roller rotates anticlockwise to discharge.
4. The method for separating and recovering the soldering tin of the waste mobile phone circuit board or the computer memory chip component as claimed in claim 1, which is characterized in that: in the step (1), the sodium chloride is industrial sodium chloride, and the particle size of the industrial sodium chloride is 20-30 meshes.
5. The method for separating and recovering the soldering tin of the waste mobile phone circuit board or the computer memory chip component as claimed in claim 1, which is characterized in that: in the step (1), the mass part ratio of the sodium chloride to the waste mobile phone circuit board or the computer memory stick is 1: 4-5; the total volume of the waste mobile phone circuit board or the computer memory strip and the sodium chloride is not more than 2/3 of the total volume of the rotatable heating container.
6. The method for separating and recovering the soldering tin of the waste mobile phone circuit board or the computer memory chip component as claimed in claim 1, which is characterized in that: in the step (2), the rotatable heating container is electrically heated.
7. The method for separating and recovering the soldering tin of the waste mobile phone circuit board or the computer memory chip component as claimed in claim 1, which is characterized in that: in the step (2), the temperature of the rotatable heating container is adjusted to be 200-250 ℃, the rotating speed is 10-20 r/min, and the heating time is 30-60 min.
8. The method for separating and recovering the soldering tin of the waste mobile phone circuit board or the computer memory chip component as claimed in claim 1, which is characterized in that: and (4) in the step (3), the meshes of the lower layer screen mesh of the double-layer vibrating screen are 5-10 meshes and are used for screening out sodium chloride, the meshes of the upper layer screen mesh are 20-30 mm in diameter and are used for screening out the surface mounted devices, and the waste mobile phone circuit board or the computer memory bank is left on the upper layer screen mesh so that the waste mobile phone circuit board or the computer memory bank, the surface mounted devices and the sodium chloride are completely separated.
9. The method for separating and recovering the soldering tin of the waste mobile phone circuit board or the computer memory chip component as claimed in claim 1, which is characterized in that: and (4) dissolving sodium chloride in water to form a saturated sodium chloride solution, crystallizing the saturated sodium chloride solution to separate out sodium chloride by adopting a salt exposure method or a heating method, and then crushing and sieving the sodium chloride for recycling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210381986.6A CN114850604A (en) | 2022-04-12 | 2022-04-12 | Method for separating waste mobile phone circuit board or computer memory chip component and recovering soldering tin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210381986.6A CN114850604A (en) | 2022-04-12 | 2022-04-12 | Method for separating waste mobile phone circuit board or computer memory chip component and recovering soldering tin |
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| Publication Number | Publication Date |
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| CN114850604A true CN114850604A (en) | 2022-08-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210381986.6A Pending CN114850604A (en) | 2022-04-12 | 2022-04-12 | Method for separating waste mobile phone circuit board or computer memory chip component and recovering soldering tin |
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| CN (1) | CN114850604A (en) |
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- 2022-04-12 CN CN202210381986.6A patent/CN114850604A/en active Pending
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