CN114845014B - Photosensitive component and camera module and manufacturing method thereof - Google Patents

Abstract

The invention provides a photosensitive assembly which comprises at least one photosensitive element, a substrate and at least one window circuit board, wherein the window circuit board comprises a circuit board main body, the circuit board main body is provided with at least one window, the photosensitive element is arranged in the window, and the substrate is arranged below the photosensitive element.

Description

Photosensitive assembly, camera module and manufacturing method thereof

Technical Field

The invention relates to the field of camera modules, and further relates to a photosensitive assembly, a camera module and a manufacturing method thereof.

Background

The conventional camera module is generally packaged by COB (Chip On Board) technologies, and COB packaging is a relatively mature packaging technology, which has advantages and disadvantages.

The conventional camera module generally includes a circuit board, a photosensitive chip, a filter, a base, a driver, a lens and a resistor-capacitor device. After the components are packaged in a COB mode, the photosensitive chip is mounted on the circuit board, the base is mounted on the circuit board, the optical filter is mounted on the base and located on a photosensitive path of the photosensitive chip, the driver is mounted on the base, and the lens is mounted on the driver so as to be located on the photosensitive path of the photosensitive chip, and the focal length of the camera module can be adjusted through the driver.

Firstly, in the prior art, the photosensitive chip is attached to the upper surface of the circuit board, in this process, the chip is usually attached to the circuit board by means of glue bonding, and for the camera module, the consistency of the optical axis is an important aspect, so that the respective flatness requirements of the circuit board of the photosensitive chip are relatively high, so that the consistency of the main optical axis of the lens and the central optical axis of the photosensitive chip is convenient. Secondly, the mount is fixed to the circuit board in an adhesive manner, and the filter, the driver and the lens component are based on the mount, so that the flatness of the mount itself and the flatness of the mounted lens component are required to be high.

Third, the sensitization chip pass through gold thread electricity connect in the circuit board, and convex resistance-capacitance device on the circuit board, therefore when the installation the base, need reserve gold thread with the space of resistance-capacitance device for gold thread and resistance-capacitance device can not all be touched in all directions, and this causes unnecessary space occupation. And on the other hand, dust and sundries are easy to be stained on the resistance-capacitance device, and the dust and sundries can influence the imaging of the module to form black spots.

Fourth, it is also a relatively important aspect, and in the development of various intelligent devices, such as smart phones, the requirements for lightening and thinning the camera module are higher and higher, so far, under the condition of extremely miniaturized camera module, almost every micro space is important for the camera module, and in this assembly mode, the photosensitive chip, the circuit board and the container-blocking member occupy the space independently, so that the size of the camera module is not easy to reduce. In this type of attachment, since the photosensitive chip has a certain thickness, it is necessary to mount the base when mounting other components, and the photosensitive chip is provided with a space position protruding from the wiring board.

Fifth, the height of the camera module needs to meet the requirement of optical imaging, in this assembly mode, the chip is attached to the circuit board, and the optical filter is mounted on the base, so that the back focal length of the camera module is larger, and the overall height of the camera module is larger.

Disclosure of Invention

An object of the present invention is to provide a photosensitive assembly and an image capturing module, and a method of manufacturing the same, wherein the photosensitive assembly includes a photosensitive element, a window circuit board, and a package body through which the photosensitive element and the window circuit board are integrally packaged.

Another object of the present invention is to provide a photosensitive assembly and an image pickup module, and a method of manufacturing the same, in which the photosensitive element and the window circuit board are integrally encapsulated by the encapsulation in a spatially overlapping manner, thereby reducing the relative heights of the photosensitive element and the window circuit board.

Another object of the present invention is to provide a photosensitive assembly, an image capturing module and a method for manufacturing the same, wherein the window circuit board has a window for accommodating the photosensitive element, so that the relative height of the photosensitive element and the window circuit board is reduced, and the height of the image capturing module is reduced.

Another object of the present invention is to provide a photosensitive assembly, an image capturing module and a manufacturing method thereof, wherein the window of the window circuit board is a through hole, so that the relative heights of the photosensitive element and the circuit board element are adjustable, and the window circuit board is suitable for circuit boards with different thicknesses.

Another object of the present invention is to provide a photosensitive assembly, an image capturing module and a method for manufacturing the same, wherein the bottom of the photosensitive element is exposed to the outside, so as to increase the heat dissipation performance of the photosensitive element.

Another object of the present invention is to provide a photosensitive assembly, an image capturing module, and a method for manufacturing the same, wherein the photosensitive element and the window circuit board are electrically connected by a connecting wire, and the connecting wire is integrally encapsulated by the encapsulation body.

Another object of the present invention is to provide a photosensitive assembly, an image capturing module and a method for manufacturing the same, wherein the photosensitive assembly includes a filter, the filter is disposed on the photosensitive element, and the filter shields the photosensitive element from being contaminated, and reduces a back focal length of the image capturing module.

Another object of the present invention is to provide a photosensitive assembly, an image capturing module, and a method for manufacturing the same, wherein the package includes a lens portion integrally extending upward and adapted to mount a lens of the image capturing module, thereby providing a smooth and stable mounting condition for the lens.

Another object of the present invention is to provide a photosensitive assembly, an image capturing module, and a method for manufacturing the same, wherein the package body can extend down to the bottom of the photosensitive assembly, and the photosensitive assembly is packaged from the bottom layer.

To achieve the above objects and other objects and advantages and in accordance with the purpose of the invention, as embodied and broadly described herein, there is provided a photosensitive assembly including at least one photosensitive element, at least one window wiring board, and at least one package body through which the photosensitive element and the window wiring board are integrally packaged, the package body forming an optical window corresponding to the photosensitive element, the window wiring board including a wiring board body having at least one window within which the photosensitive element is disposed.

In some embodiments, the window is a recess, and the photosensitive element is disposed in the recess.

In some embodiments, the photosensitive element and the circuit board body are electrically connected by at least one electrical connection element, one end of the electrical connection element is connected to the photosensitive element, the other end is connected to the top surface of the circuit board body, and the top surface of the circuit board body connected to the other end of the photosensitive element is located outside the window.

In some embodiments, the photosensitive element and the circuit board body are electrically connected by at least one electrical connection element, one end of the electrical connection element is connected to the photosensitive element, the other end is connected to the top surface of the circuit board body, and the top surface of the circuit board body connected to the other end of the photosensitive element is located within the window.

In some embodiments, the window is a through hole, and the photosensitive element is disposed in the through hole.

In some embodiments, the photosensitive elements are electrically connected by at least one electrical connection element, one end of the electrical connection element is connected to the photosensitive element, and the other end is connected to the top surface of the circuit board main body.

In some embodiments, the photosensitive assembly includes a substrate disposed below the photosensitive element.

In some embodiments, the photosensitive assembly includes a substrate having a recess shape, the substrate being disposed in the window, and the photosensitive element being accommodated in the substrate.

In some embodiments, the package integrally encapsulates the electrical connection element.

In some embodiments, the photosensitive assembly includes at least one electronic component protruding or partially protruding from the circuit board body, and the package body integrally encapsulates the electronic component.

In some embodiments, the photosensitive element includes a photosensitive region and a non-photosensitive region, and the package integrally encapsulates at least a portion of the non-photosensitive region.

In some embodiments, the photosensitive assembly further comprises an annular barrier disposed about the photosensitive region of the photosensitive element.

In some embodiments, the package surface is a stepped structure.

In some embodiments, the package surface is a planar structure.

In some embodiments, the package includes a holder portion and a lens portion, the lens portion integrally extending along the holder portion, the holder portion being configured to mount a filter, and the lens portion being configured to mount a lens.

In some embodiments, the lens portion is internally flat and adapted to mount a threadless lens.

In some embodiments, the lens has a threaded structure therein adapted to mount a threaded lens.

In some embodiments, the circuit board body has a reinforcement hole into which the package extends.

In some embodiments, the circuit board body has a reinforcing hole, and the package body extends to the bottom of the circuit board body through the reinforcing hole.

In some embodiments, the photosensitive assembly includes a filter that is attached to the photosensitive element.

In some embodiments, the photosensitive assembly includes a filter, and edges of the filter are integrally encapsulated by the encapsulation body.

In some embodiments, the photosensitive assembly includes a back plate, and the back plate is attached to the bottom of the circuit board main body.

In some embodiments, the integral packaging is molded.

According to another aspect of the present invention, an image capturing module is provided, which includes the photosensitive assembly, and at least one lens, which is located in a photosensitive path of the photosensitive element of the photosensitive assembly.

In some embodiments, the camera module includes at least one driver, the lens is mounted to the driver, and the driver is mounted to the photosensitive assembly.

In some embodiments, the camera module includes at least one bracket mounted to the photosensitive assembly.

In some embodiments, the camera module includes a plurality of the photosensitive elements and a plurality of the lenses to form an array camera module.

In some embodiments, the window circuit board of each of the photosensitive assemblies is integrally connected.

According to another aspect of the present invention, there is provided a method for manufacturing a photosensitive assembly, comprising the steps of:

(A) Setting a photosensitive element in a window of a window circuit board;

(B) Electrically connecting the photosensitive element and the window circuit board, and

(C) Forming a package body integrally combined with the photosensitive element and the window circuit board, and enabling the package body to form a light window opposite to the photosensitive element.

In some embodiments, in the step (C), the photosensitive element and the window circuit board are contacted, and the package body integrally connects the photosensitive element and the window circuit board.

In some embodiments, wherein in the step (C), the photosensitive element and the window wiring board are spaced apart, the package is integrally connected and filled between the photosensitive element and the window wiring board to reinforce the photosensitive element and the window wiring board.

In some embodiments, in the step (C), the photosensitive element and the window circuit board are indirectly contacted through a medium, and the package body integrally connects the photosensitive element, the medium and the window circuit board.

Drawings

Fig. 1 is a schematic perspective view of an image capturing module according to a first preferred embodiment of the present invention.

Fig. 2 is an exploded view of an image capturing module according to a first preferred embodiment of the present invention.

Fig. 3 is a schematic cross-sectional view of an image pickup module according to a first preferred embodiment of the present invention.

Fig. 4 is a schematic view of a manufacturing process of a photosensitive assembly of an image capturing module according to a first preferred embodiment of the present invention.

Fig. 5A and 5B are two equivalent implementations of the package of the photosensitive assembly of the image capturing module according to the first preferred embodiment of the present invention.

Fig. 6 is a first modified embodiment of a photosensitive member of an image capturing module according to a first preferred embodiment of the present invention.

Fig. 7 is a second modified embodiment of the photosensitive member of the image capturing module according to the first preferred embodiment of the present invention.

Fig. 8 is a schematic cross-sectional view of an image capturing module according to a second preferred embodiment of the present invention.

Fig. 9 is an exploded view of a photosensitive assembly of an image capturing module according to a second preferred embodiment of the present invention.

Fig. 10 is a modified embodiment of a photosensitive member of an image capturing module according to a second preferred embodiment of the present invention.

Fig. 11 is a schematic cross-sectional view of an image pickup module according to a third preferred embodiment of the present invention.

Fig. 12 is a perspective view of a photosensitive assembly of an image capturing module according to a third preferred embodiment of the present invention.

Fig. 13 is a modified embodiment of a photosensitive assembly of an image capturing module according to a third preferred embodiment of the present invention.

Fig. 14 is a schematic cross-sectional view of an image pickup module according to a fourth preferred embodiment of the present invention.

Fig. 15 is a modified embodiment of an image pickup module according to a fourth preferred embodiment of the present invention.

Fig. 16 is a schematic cross-sectional view of an image pickup module according to a fifth preferred embodiment of the present invention.

Fig. 17 is a modified embodiment of a photosensitive member of an image capturing module according to a fifth preferred embodiment of the present invention.

Fig. 18 is a schematic sectional view of an image pickup module according to a sixth preferred embodiment of the present invention.

Fig. 19 is a modified embodiment of a photosensitive member of an image pickup module according to a sixth preferred embodiment of the present invention.

Fig. 20 is a schematic sectional view of an image pickup module according to a seventh preferred embodiment of the present invention.

Fig. 21 is a schematic cross-sectional view of an image pickup module according to an eighth preferred embodiment of the present invention.

Fig. 22 is a schematic cross-sectional view of an image pickup module according to a ninth preferred embodiment of the present invention.

Fig. 23 is a block diagram of a photosensitive assembly manufacturing method according to the above-described preferred embodiment of the present invention.

Detailed Description

The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the above terms should not be construed as limiting the present invention.

As shown in fig. 1 to 4, an image capturing module according to a first preferred embodiment of the present invention. The camera module comprises at least one photosensitive component 10, at least one lens 20 and at least one optical filter 30.

The optical filter 30 is mounted on the photosensitive assembly 10 and is located in the photosensitive path of the photosensitive assembly 10. The lens 20 is located in the photosensitive path of the photosensitive assembly 10. For example, in the process of image acquisition, the light reflected by the target object enters the camera module through the lens 20, the light reaches the photosensitive assembly 10 after passing through the optical effects of the lens 20 and the optical filter 30, and is subjected to photoelectric conversion by the photosensitive effect of the photosensitive assembly 10 to convert the light signal into an electric signal, so that the electric signal can be transmitted to the electronic equipment applying the camera module through the photosensitive assembly 10 to realize the reproduction of the image, and the image acquisition process of the target object is completed.

Further, the camera module may further include at least one driver 40, the lens 20 is mounted on the driver 40, the driver 40 is mounted on the photosensitive assembly 10, so that the lens 20 is located in a photosensitive path of the photosensitive assembly 10, and a focal length of the camera module can be adjusted by the driver 40. The driver 40 may be implemented as a motor, such as, but not limited to, a voice coil motor, a piezoelectric motor. That is, in this embodiment of the present invention, the camera module is a moving focus camera module AFM (Automatic Focus Model). Of course, in other embodiments of the present invention, the camera module may be of other types, such as a fixed focus camera module FFM (Fix Focus Model). It will be appreciated by those skilled in the art that the type of camera module is not a limitation of the present invention.

The filter 30 may be an infrared cut filter, a wafer level infrared cut filter, or a blue glass filter. It will be appreciated by those skilled in the art that the particular type of filter 30 is not a limitation of the present invention.

The photosensitive assembly 10 includes at least one photosensitive element 11, at least one window circuit board 12, and at least one package 13. The photosensitive element 11 and the window wiring board 12 are arranged to spatially overlap, thereby reducing the relative heights of the photosensitive element 11 and the window wiring board 12. The photosensitive element 11 and the window wiring board 12 are integrally packaged by the package 13.

The package 13 has at least one light window 134 for providing a light path for the photosensitive element 11. That is, the light entering from the lens 20 passes through the light window 134 to reach the photosensitive element 11 for photoelectric conversion.

In this embodiment of the present invention, a stepped structure is formed inside the package 13 to facilitate the installation of the optical filter 30. Of course, the stepped structure may also be used to mount the driver 40 or the lens 20, and those skilled in the art will appreciate that the mounting components of the package 13 are not limitations of the present invention.

The photosensitive element 11 includes a top surface 111 and a bottom surface 112. The top surface 111 is opposite to the lens 10 for photoelectric conversion.

Further, the top surface 111 of the photosensitive element 11 includes a photosensitive area 1111 and a non-photosensitive area 1112, the photosensitive area 1111 is used for performing photosensitive, and the non-photosensitive area 1112 is electrically connected to the window circuit board 12, so as to transmit an electrical signal after photoelectric conversion of the photosensitive area 1111 to the window circuit board 12. In one embodiment, the photosensitive element 11 may be implemented as a square CCD or CMOS chip, and the non-photosensitive region 1112 surrounds the periphery of the photosensitive region 1111. The window circuit board 12 may include an embedded circuit for processing the electrical signal transmitted by the photosensitive element 11.

The package 13 integrally packages at least a portion of the non-photosensitive region 1112 of the photosensitive element 11. That is, the package 13 may encapsulate a partial region of the non-photosensitive region 1112 of the photosensitive element 11, or may encapsulate an entire region of the non-photosensitive region 1112 of the photosensitive element 11.

The photosensitive element 11 is electrically connected to the window circuit board 12 through at least one electrical connection element 14, so as to realize electrical signal transmission between the photosensitive element 11 and the window circuit board 12. The electrical connection element 14 may be a connection element made of one or more of gold, silver, copper, aluminum, conductive non-metal, such as, but not limited to, gold wire, silver wire, copper wire, aluminum wire. In one manufacturing method, the electrical connection element 14 is disposed on the photosensitive element 11 and the window circuit board 12 through a W/B (wire/Bond) process. Further, the electrical connection element 14 connects the non-photosensitive region 1112 of the photosensitive element and the window wiring board 12.

The photosensitive assembly 10 includes at least one electronic component 123, and the electronic component 123 protrudes from the window circuit board 12. The electronic component 123 is electrically connected to the window circuit board 12. The electronic component 123 may be a resistor, a capacitor, a driving element, a signal processing element, a memory element, or the like. The electronic component 123 is the electronic component 123 of the window circuit board 12, so that the transmission of the electrical signal is completed, and in other embodiments, the electronic component 123 may not be protruded or embedded in the window circuit board 12. It will be appreciated by those skilled in the art that the type and arrangement of the electronic components 123 is not a limitation of the present invention.

The electronic component 123 and the electrical connection element 14 are packaged in the package 13, in other words, the electrical connection element 14 and the electronic component 123 are packaged by the package 13 so as not to be exposed to the external environment. In the current mode, connect gold thread and hinder the container and expose in the outside generally, on the one hand gold thread and hinder the dust that is stained with on the container and can influence the imaging quality of module of making a video recording, on the other hand, need reserve gold thread and hinder the installation space of holding the device, consequently cause the space waste of module of making a video recording.

The window circuit board 12 includes a circuit board body 121, and the window circuit board 12 has a window 122. The window 122 is provided to the circuit board body 121, thereby forming a window-shaped circuit board. The photosensitive element 11 is accommodated in the window 122, thereby reducing the space additionally occupied by the photosensitive element.

That is, the photosensitive element 11 is accommodated in the window 122 of the window wiring board 12 such that the position of the photosensitive element 11 relative to the wiring board body 121 is sunk, so that the relative heights of the photosensitive element 11 and the wiring board body 121 are reduced. When the top surface 111 of the photosensitive element 11 is not higher than the top surface 1211 of the wiring board body 121, the wiring board body 11 provides a sufficient space environment for the photosensitive element 11, and the overall height of the photosensitive element 11 and the wiring board body 121 is represented only as the height of the wiring board body 121.

The circuit board body 121 has a top surface 1211 and a bottom surface 1212, and the package 13 is encapsulated on the top surface 1211 of the circuit board body 121 and the non-photosensitive region 1112 of the top surface 111 of the photosensitive element 11. The size of the window 122 of the window circuit board 12 may be set according to the size of the photosensitive element 11, and may be equal to the size of the photosensitive element 11, so that the window 122 may be suitable for accommodating the photosensitive element 11, or may be smaller than the photosensitive element 11, so as to facilitate accommodating the photosensitive element 11 and simultaneously facilitate adjusting the photosensitive element 11. In one implementation, a gap 125 may be reserved between the photosensitive element 11 and the window circuit board 12, so that the installation is convenient, and the photosensitive element 11 is fixed by filling the gap 125 with the package 13. Referring to fig. 3, in one embodiment, the package 13 enters the gap, fills the space between the circuit board body 121 and the photosensitive element 11, and causes the package 13 to extend into the gap 125 to a substantially uniform height with the bottom surface 112 of the photosensitive element 11 and the bottom surface 1212 of the circuit board body 121. In this way, the package 13 can reinforce the photosensitive element 11 and the window wiring board 12.

Referring to fig. 5A, in another embodiment, the package 13 does not enter the gap 125, and the heights of the top surfaces 111 of the package 13 and the photosensitive element 11 and the top surface 1211 of the circuit board body 121 are made to be substantially uniform, and in the process of implementation, the photosensitive element 11 and the circuit board body 121 are bonded by an adhesive such as glue, so that the package 13 is blocked from entering the gap 125. Referring to fig. 5B, in another embodiment, the package 13 extends into the gap and wraps around the bottom of the photosensitive assembly 10 through the gap 125. It will be appreciated by those skilled in the art that the gap and the relationship of the package and the gap may be set as desired, and that the size of the gap and the location in which the package 13 extends within the gap are not limitations of the present invention.

It should be noted that, in another embodiment, the circuit board body 121 may not be spaced from the photosensitive element 11 to form the gap 125, but may be in direct contact. It should be noted that, when the package 13 reinforces the window circuit board 12 and the photosensitive element 11, unlike the prior art in which a reinforcing plate needs to be added at the bottom of the circuit board, the package can play a role in reinforcing the window circuit board. Of course, the back side of the window circuit board 12 of the present invention may further be provided with a reinforcing plate to further enhance the packaging strength of the photosensitive assembly.

In the process of manufacturing the photosensitive assembly 10, a circuit board substrate is windowed to form the window circuit board 12 with the window 122, then the photosensitive element 11 is disposed in the window 122 (the photosensitive element 11 and the window circuit board 12 may also be fixed by glue), then the photosensitive element 11 and the circuit board main body 121 are electrically connected, such as bonded, by the electrical connection element 14, and then the non-photosensitive area 1112 of the photosensitive element 11, the electrical connection element 14, the electronic component 123, and the window circuit board 12 are integrally packaged by an integral packaging method.

The material of the circuit board body 121 may be a flexible printed circuit board RG (Rigid Flex), a flexible printed circuit board FPC (Flex Print Circuit), a rigid printed circuit board PCB (Printed Circuit Board), a ceramic substrate (without a flexible board), or the like.

It should be noted that the package area of the non-photosensitive area 1112 of the photosensitive element 11 may be set according to the requirement, that is, the non-photosensitive area 1112 may be completely packaged, or may be partially packaged, and those skilled in the art should understand that the size and shape of the package area are not limitations of the present invention.

In the present invention, the package body 13 is integrally formed by a Molding (Molding) process, and is adhered to a circuit board, unlike a conventional base. In manufacturing the photosensitive assembly 10, the photosensitive element 11 and the window circuit board 12 are placed in a mold, and then a molding material is applied into the mold, the package 13 having a predetermined shape is formed after curing, and the photosensitive element 11 and the window circuit board 12 are fixed by the package 13. The molding material may be selected from nylon, LCP (Liquid Crystal Polymer ), PP (Polypropylene), epoxy, and other thermoplastic or thermosetting materials.

The integral packaging method reduces the process of bonding the base by traditional glue, and the package body 13 is manufactured by a molding method, so that the shape is easier to control, and the surface flatness is better, thereby providing flat mounting conditions for the optical filter 30, the driver 40 and the lens 20, and helping to ensure the consistency of the optical axes of the camera modules. On the other hand, the traditional glue bonding space is reduced, and the height of the camera module is reduced. Further, in the embodiment of the present invention, the photosensitive element 11 is disposed in the window 122 and then integrally packaged, so that the thickness of the photosensitive element 11 does not need to be considered when forming the package 13, thereby further providing a possible space for reducing the height of the image capturing module.

The package 13 is configured in a ring-shaped structure, such as, but not limited to, square, circular, or triangular, in plan view, so as to provide a mounting position for the optical filter 30, the driver 40, or the lens 20, thereby forming a closed internal environment when the driver 40 or the lens 20 is mounted on the package 13. And by virtue of the integrally molded packaging advantage, the surface of the package 13 can be ensured to be flat, thereby providing a flat mounting condition for the optical filter 30, the lens 20 or the driver 40.

According to this embodiment of the present invention, the window 122 is a through hole, that is, the window 122 is connected to both sides of the circuit board body 121, so that an adjustable space is provided for the photosensitive element 11. In other words, the relative positions of the photosensitive element 11 within the window 122 and the wiring board main body 121 may be set as needed.

It should be noted that, in the present invention, the photosensitive element 11 and the window circuit board 12 are integrally encapsulated by the encapsulation 13, so that when the photosensitive element 11 is disposed in the window 122, no additional supporting component is required to fix the photosensitive element 11, so that the position of the photosensitive element 11 can be selected relatively freely. In other words, the package 13 provides fixing functions for the photosensitive element 11 and the circuit board body 121 from above, respectively, so that the circuit board body 121 or other components are not required to provide supporting and fixing functions for the photosensitive element 11 from other directions, such as from below. And by the integral packaging action of the package body 13, the structural strength of the wiring board main body 121 and the photosensitive element 11 can be enhanced.

Further, according to this embodiment of the present invention, the photosensitive element 11 is disposed at a position close to the lower side of the window 122, one end of the electrical connection element 14 is connected to the non-photosensitive region 1112 of the photosensitive element 11, and the other end of the connection is connected to the wiring board body 121 through the window 122.

Further, the bottom surface 112 of the photosensitive element 11 and the bottom surface 1212 of the circuit board body 121 are relatively uniform in height, so that the bottom of the photosensitive assembly 10 is relatively flat without an obvious step. In other words, the bottom surface 112 of the photosensitive element 11 and the bottom surface 1212 of the wiring board body are substantially flush.

In this way, the bottom surface 112 of the photosensitive element 11 is exposed to the outside space, thus enhancing the heat dissipation function of the photosensitive element 11, unlike the attaching way in which the bottom surface 112 is blocked by the wiring board, the heat dissipation performance is poor.

For example, the present invention provides two manufacturing methods of the window circuit board 12, in one method, the window 122 is formed on a substrate layer, the size of the window 122 is determined according to the photosensitive element 11, then each substrate layer is stacked, and a circuit is embedded between predetermined substrate layers, so as to form the window circuit board 12 with the window 122. In another method, the substrates are arranged in layers, and the circuit is buried between the substrate layers in a predetermined route, and the buried route is determined according to the placement position of the photosensitive element 11, and then the window 122 is opened on the laminated substrate layers, and the window 122 is within the buried circuit, determined according to the shape of the photosensitive element 11, that is, the circuit is not damaged.

As shown in fig. 6, a first variant embodiment of the photosensitive assembly 10 of the image capturing module according to the first preferred embodiment of the present invention is shown. Unlike the above-described embodiment, in this embodiment, the top surface 111 of the photosensitive element 11 and the top surface 1211 of the wiring board body 121 are relatively uniform in height. That is, the top surface 111 of the photosensitive element 11 and the top surface 1211 of the wiring board body 121 are substantially flush, leaving a space in a position below the photosensitive element 11. With the upper surface flush, the photosensitive element 11 and the window wiring board 12 are electrically connected through the electrical connection element 14.

In the process of manufacturing such a photosensitive element 11, a boss-shaped jig may be provided to support the photosensitive element 11 so that the upper surfaces of the photosensitive element 11 and the window wiring board 12 are flush, and then the photosensitive element 11 and the window wiring board 12 are integrally packaged to form the package body 13, so that the relative positions of the photosensitive element 11 and the window wiring board are fixed by the package body 13.

As shown in fig. 7, a second variant embodiment of the photosensitive assembly 10 of the image capturing module according to the first preferred embodiment of the present invention is shown. Unlike the above embodiment, in this embodiment, the photosensitive element 11 includes a blocking member 15, where the blocking member 15 is disposed at a position where the package 13 and the photosensitive element 11 meet, for preventing the package 13 from affecting an inner region of the photosensitive element 11, such as contamination of the photosensitive region 1111, that is, the blocking member 15 is disposed outside the photosensitive region 111, so as to block the molding material in a fluid state from entering the photosensitive region 1111 during the manufacturing process, and to protect the photosensitive element 11 during the molding operation.

The blocking member 15 is in a ring or frame structure and is disposed on the photosensitive element 11. That is, the position where the inner edge of the package 13 and the photosensitive element 11 meet is blocked by the blocking member 15.

The barrier 15 may be formed by a gel or may be a plastic member of a predetermined shape.

In the process of manufacturing the photosensitive assembly 10, before integrally packaging the photosensitive element 11 and the window circuit board 12, the blocking member 15 needs to be disposed on the photosensitive element 11, for example, glue is applied, and the packaging body 13 is formed by taking the blocking member 15 as a boundary, so that the material of the packaging body 13 does not pollute the area of the photosensitive element 11 located inside the blocking member 15.

As shown in fig. 8 and 9, an image pickup module according to a second preferred embodiment of the present invention. Unlike the above preferred embodiment, the window 122A has a groove structure, that is, the photosensitive element 11 is accommodated in the groove structure, so that the relative heights of the photosensitive element 11 and the surface of the window wiring board 12 are reduced. Further, when the depth of the groove structure is equal to or greater than the thickness of the photosensitive element 11, the overall thickness of the photosensitive element 11 and the window circuit board 12 is represented as the thickness of the window circuit board 12.

The window 122A corresponds to a window bottom 124A, and the photosensitive element 11 is disposed on the window bottom 124A. In other words, the window bottom 124A supports the photosensitive element 11. The size of the window 122A may be matched to the size of the photosensitive element 11 so that the surfaces of the photosensitive element 11 and the wiring board body 121 are flush. Of course, a gap may exist between the photosensitive element 11 and the circuit board body 121, and then the photosensitive chip and the circuit board body 121 are fixed by an adhesive.

In this embodiment of the present invention, the electrical connection member 14 is electrically connected to the photosensitive element 11 and the wiring board main body 121. That is, the electrical connection member 14 connects the photosensitive element 11 located in the window 122A and the top surface of the wiring board outside the window 122A.

A modified embodiment of a photosensitive assembly 10 of an image capturing module according to a second preferred embodiment of the present invention is shown in fig. 10. Unlike the preferred embodiment described above, the electrical connection element 14 is disposed within the window 122A of the window circuit board. Further, one end of the electrical connection element 14 is connected to the non-photosensitive area 1112 of the photosensitive element 11, and the other end is connected to the circuit board surface 124A of the window bottom corresponding to the window 122A. In comparison with the above embodiment, the process difficulty is greater than that of the above embodiment because the electrical connection structure is to be provided on the circuit board surface 124A of the window bottom of the circuit board main body 121, and the electrical connection process of the electrical connection element 14 and the photosensitive element 11 is to be completed in a small space.

In comparison with the first preferred embodiment, the recess-shaped window 122 of the second embodiment is more difficult to process than the through-hole-shaped window 122A in terms of manufacturing process. Because the thickness of the circuit board is smaller, and the groove is formed on the circuit board with smaller thickness, the process precision requirement is higher, and if the electric connection element 14 is arranged in the groove, which is equivalent to arranging a circuit on a thinner circuit board, the difficulty is higher, so that the through hole-shaped window 122A and the way that the electric connection element 14 is connected to the outside are more suitable for implementation, more space which can be adjusted by the photosensitive element 11 is provided, and the heat dissipation performance is better.

As shown in fig. 11 and 12, there is an image pickup module according to a third preferred embodiment of the present invention. Unlike the preferred embodiment described above, in this embodiment, the photosensitive assembly 10 includes a filter 30B, the filter 30B being attached to the photosensitive element 11. That is, the optical filter 30B shields the photosensitive element 11, thereby reducing contamination of the photosensitive element 11 and damage of the mold to the photosensitive element 11.

In this embodiment, the upper surface of the package 13 may have a flat planar structure, and it is not necessary to provide a stepped structure for mounting the optical filter 30B. The driver 40 or the lens 20 is mounted to the package 13.

For example, the optical filter 30B may be adhesively connected to the photosensitive element 11. In other embodiments, the optical filter 30B may be further connected to the photosensitive element 11 by adsorption, and those skilled in the art should understand that the specific connection manner of the optical filter 30B and the photosensitive element 11 is not a limitation of the present invention.

In this way, the filter 30B is provided to the photosensitive element 11, so in the image pickup module, it is not necessary to mount the filter 30B on the package 13, and in this way, the distance between the filter 30B and the photosensitive element 11 is reduced, so the back focal length of the image pickup module is reduced, thereby enabling the height of the image pickup module to be further reduced.

In the process of manufacturing the photosensitive assembly 10, the optical filter 30B may be attached to the photosensitive element 11 before the photosensitive element 11 and the window circuit board 12 are integrally packaged, so that the photosensitive element 11, particularly the photosensitive region 1111 of the photosensitive element 11, is shielded by the photosensitive element 11, so that the photosensitive element 11 is shielded and protected by the optical filter 30B in the process of integrally packaging, and the packaging material of the package 13 is prevented from contaminating the photosensitive element 11, thereby improving the imaging quality. Of course, in other embodiments of the present invention, the filter 30B may be disposed after the package 13 is formed, so as to reduce the back focal length of the image capturing module, and those skilled in the art should understand that the order of disposing the filter 30B is not a limitation of the present invention.

As shown in fig. 13, a modified embodiment of the photosensitive assembly 10 of the image capturing module according to the third preferred embodiment of the present invention is shown. Unlike the above-described embodiment, in this embodiment, the light sensing element 11 includes a filter 30B, the filter 30B is attached to the light sensing element 11, and the outer edge of the filter 30B is integrally encapsulated by the encapsulation 13. That is, the photosensitive element 11, the window wiring board 12, and the filter 30B are all integrally packaged by the package 13, thereby fixing the filter element. In manufacturing the photosensitive assembly 10, it is necessary to overlap the optical filter 30B with the photosensitive element 11 before forming the package 13, and the optical filter 30B may be fixed by an integral package without bonding by glue.

As shown in fig. 14, there is an image pickup module according to a fourth preferred embodiment of the present invention. Unlike the above embodiment, the photosensitive assembly 10 includes a package 13C, and the package 13C includes a bracket portion 131C and a lens portion 132C. The bracket 131C is used for mounting the optical filter 30, and the lens 132C is used for mounting the lens 20.

Further, the lens portion 132C integrally extends upward along the holder portion 131C at the outside, and a stepped structure is formed at the inside. The bracket 131C includes a first support table 1311C, and the filter 30 is mounted on the first support table 1311C. The lens portion 132C includes a second support 1321C, and the lens 20 is mounted on the second support 1321C, that is, the first support 1311C and the second support 1321C form a two-stage structure.

The lens part integrally extends so as to provide a stable installation environment for the lens 20. According to this embodiment of the present invention, the depth of the lens portion can be determined according to the height of the lens 20, so that the lens 20 can be stably mounted, and the accuracy of the image pickup module can be improved.

In this way, a mounting environment is provided for the lens 20, a camera module is formed, and a flat and stable mounting environment can be provided for the lens 20 by means of a molded integrated packaging mode.

Further, in this embodiment, the lens portion is internally flat and is adapted to mount an unthreaded lens 20.

As shown in fig. 15, a modified embodiment of the image capturing module according to the fourth preferred embodiment of the present invention is shown. Unlike the preferred embodiment described above, in this embodiment, the interior of the lens portion 132C has a threaded structure 1322C adapted to mount a threaded lens. Of course, in other implementations, the interior of the lens portion may have other different structures to facilitate the installation of different types of lenses.

Fig. 16 is a schematic cross-sectional view of an image capturing module according to a fifth preferred embodiment of the present invention. Unlike the preferred embodiment described above, the photosensitive assembly 10 includes a substrate 16, the substrate 16 being disposed below the photosensitive element 11.

Further, the bottom of the substrate 16 is substantially uniform in height with the bottom surface 1212 of the wiring board body 121, so that the bottom of the photosensitive member 10 is kept flat. In other words, the substrate 16 fills the remaining space of the window 122 under the photosensitive element 11, so that when the thickness of the photosensitive element 11 is smaller than the thickness of the wiring board body 121 and the photosensitive element 11 is disposed at a position close to the top surface 1211 of the wiring board body 121, the bottom of the photosensitive assembly 10 can still be kept flat without a significant step structure.

The substrate 16 may enhance the structural strength and heat dissipation properties of the photosensitive assembly 10. In one embodiment, the substrate 16 may be a metal plate or a plastic plate. In another embodiment, the substrate 16 may be a film, and is attached to the lower surface 112 of the photosensitive element 11, so as to protect the photosensitive element 11 and enhance the heat dissipation performance and structural strength of the photosensitive element. By way of example and not limitation, the film is a metal coating.

The substrate 16 may be attached to the wiring board body 121 by bonding or to the photosensitive element 11 by bonding.

Of course, in other embodiments, the substrate 16 may be disposed under the circuit board body 121, such as when the thickness of the photosensitive element 11 is greater than the thickness of the circuit board body 121, the height difference between the photosensitive element 11 and the circuit board body 121 may be compensated by the substrate 16, so that the bottom of the photosensitive assembly 10 remains flat.

As shown in fig. 17, a variant embodiment of the photosensitive assembly of the image capturing module according to the fifth preferred embodiment of the present invention is shown. Unlike the previous embodiments, the window circuit board 12 includes a substrate 16D, the substrate 16D being received within the window 122 of the window circuit board 12. The substrate 16D has a groove-like structure, and the photosensitive element 11 is accommodated in the substrate 16D. That is, the substrate 16D is a mounting position of the photosensitive element 11 so that the photosensitive element 11 is flush with the upper surface of the circuit board body 121, and the lower surface of the substrate 16D is substantially identical to the bottom surface of the circuit board body 121 in height so that the bottom of the photosensitive assembly 10 is flat.

As shown in fig. 18, there is an image pickup module according to a sixth preferred embodiment of the present invention. Unlike the above embodiment, the circuit board body 121 of the window circuit board 12 has at least one reinforcement hole 1213, and the package 13 extends into the reinforcement hole 1213, thereby enhancing the structural strength of the circuit board body 121. The number and depth of the reinforcement holes 1213 may be set at positions where the window circuit board 12 is not provided with a circuit, according to necessity.

In this embodiment, the reinforcement hole 1213 is a concave hole, that is, both sides of the circuit board body 121 are not communicated through the reinforcement hole 1213.

Fig. 19 is a modified embodiment of the photosensitive member 10 of the image pickup module according to the sixth preferred embodiment of the present invention. Unlike the above embodiment, the circuit board body 121 of the window circuit board 12 has at least one reinforcing hole 1213E, the package 13 extends into the reinforcing hole 1213E, and the reinforcing hole 1213E is a perforation. That is, both sides of the circuit board body 121 may be communicated through the reinforcement hole 1213E.

Further, the package body 13 extends to the bottom of the circuit board body 121 and the photosensitive element 11 through the reinforcement hole 1213E, thereby forming a package layer 133E at the bottom of the photosensitive assembly 10. The encapsulation layer 133E enhances the structural strength of the photosensitive assembly 10.

That is, in this embodiment, the package 13 is provided not only on the upper portion of the wiring board main body 121 and the photosensitive element 11 but also integrally on the photosensitive element 11 and the lower portion of the photosensitive element 11. Of course, in other embodiments, the encapsulation layer 133E may be disposed only under the circuit board body 121, and not under the photosensitive element 11.

As shown in fig. 20, there is an image pickup module according to a seventh preferred embodiment of the present invention. Unlike the above preferred embodiment, the photosensitive assembly 10 includes a back plate 17, and the back plate 17 is disposed at the bottom of the circuit board body 121 to enhance the structural strength of the circuit board body 121, so that the bottom of the photosensitive assembly 10 is flat. In one embodiment, the back plate 17 may be a metal plate, so as to increase the heat dissipation performance of the photosensitive assembly 10 while enhancing the structural strength of the photosensitive assembly 10. In another embodiment, the back plate 17 may be a film layer attached to the lower surface 112 of the photosensitive element 11 and the bottom surface 1212 of the circuit board 121, so as to protect the photosensitive element 11 and the circuit board body 121 and enhance the heat dissipation performance and structural strength of the photosensitive element. By way of example and not limitation, the film is a metal coating.

Fig. 21 shows an imaging module according to an eighth preferred embodiment of the present invention. Unlike the above embodiment, the camera module includes a bracket 50, the bracket 50 is mounted on the package 13, and the filter 30 is mounted on the bracket 50.

Further, the bracket 50 may be formed with a bent structure so that one end is adapted to be mounted to the package 13 and the other end is adapted to support the optical filter 30.

The stand 50 may extend inward and downward to reduce the distance between the optical filter 30 and the photosensitive element 11 and reduce the back focal length of the camera module.

In this embodiment, the support 50 provides a mounting position for the optical filter 30, rather than directly providing a mounting position for the optical filter 30 through the package 13, it should be noted that the structure of the support 50 shown in the drawings is merely illustrative and not a limitation of the present invention. Since the filter 30 has a small structural strength, a large mounting position is required at the time of mounting, and the width requirement for the mounting position of the integral package can be reduced by the bracket 50 having a large structural strength.

The support 50 may have a closed ring or frame structure in a plan view, or may be selectively disposed on one or more sides of the package 13 or the filter 30.

As shown in fig. 22, there is an image pickup module according to a ninth preferred embodiment of the present invention. Unlike the above embodiment, the image capturing module is an array image capturing module, and the array image capturing module includes two photosensitive assemblies 10, two lenses 20, two drivers 40 and two filters 30.

It should be noted that, for convenience of disclosure, in this embodiment of the present invention, a dual-lens module formed by two lenses 20 is taken as an example, but in other embodiments of the present invention, the number of lenses 20 may be more, such as three or more, and it should be understood by those skilled in the art that the number of lenses 20 and the number of corresponding components, such as the driver 40, the bracket 50, and the optical filter 30, are not limitations of the present invention.

More specifically, in this embodiment of the present invention, the window wiring boards 12 of the two photosensitive assemblies 10 are integrally connected so as to form an array structure. The two packages 13 may be integrally formed, that is, two square window structures are formed at a time, so as to provide light paths for the two lenses 20, respectively.

In the description, for the sake of brevity and clarity, only some distinguishing features are described in the embodiments and implementations, but in the implementation, different embodiments and different features in the implementations may be combined to form different image capturing modules or photosensitive assemblies 10 according to needs, and those skilled in the art should understand that the image capturing modules and the photosensitive assemblies 10 are not limited to what is disclosed in the single embodiment or implementation.

Referring to fig. 23, according to the above preferred embodiment of the present invention, the present invention provides a method 1000 for manufacturing a photosensitive assembly 10, wherein the method 1000 steps of the method for manufacturing a photosensitive assembly 10:

1100, disposing at least one photosensitive element 11 in a window 122 of a window circuit board 12;

1200 electrically connecting the photosensitive element 11 and the window wiring board 12, and

1300 Forming a package 13 integrally combined with the photosensitive element and the window wiring board 12, and causing the package 13 to form a light window 131 opposite to the photosensitive element.

In the step 1100, the window 122 may be a recess or a through hole.

The step 1100 may further include the steps of forming a window circuit board 12 having at least one window 122;

In the step 1100, the photosensitive element 11 may be disposed at a side close to the upper surface of the window circuit board 12 such that the photosensitive element 11 is flush with the top surface of the window circuit board 12. The photosensitive element 11 may also be disposed on a side close to the lower surface of the window circuit board 12 such that the photosensitive element 11 is flush with the bottom surface of the window circuit board 12. It will be appreciated that the above-described manner of having the top and bottom surfaces substantially flush is by way of example only and is not limiting of the invention.

In the step 1200, the photosensitive element 11 and the window circuit board 12 are electrically connected by at least one electrical connection element 14. One end of the connecting wire is connected with the photosensitive element 11, and the other end is connected with the top surface of the window circuit board 12.

In the step 1300, the photosensitive element 11, the electrical connection element 14, and the electronic component 123 protruding from the window circuit board 12 are integrally packaged.

The method 1000 may further include the step 1400 of attaching a filter 30 to the photosensitive element 11. The step 1400 may precede the step 1300 or follow the step 1300. The attachment means may be adhesive means.

The method 1000 may further include a step 1500 of forming at least one reinforcement hole 1213 in the body of the window circuit board 12.

The method 1000 may further include the step 1600 of attaching a back plate 17 to the bottom of the window circuit board 12.

In one embodiment, in the step 1300, the photosensitive element is in contact with the window circuit board, and the package body integrally connects the photosensitive element and the window circuit board.

In another embodiment, in the step 1300, the photosensitive element and the window circuit board are spaced apart, and the package is integrally connected and filled between the photosensitive element and the window circuit board to reinforce the photosensitive element and the window circuit board.

In another embodiment, in the step 1300, the photosensitive element and the window circuit board are indirectly contacted through a medium, and the package body integrally connects the photosensitive element, the medium and the window circuit board. For example, at least part of the periphery of the non-photosensitive area of the photosensitive element is cured by glue, so that the photosensitive element and the window circuit board are in indirect contact.

The integral packaging mode is a molding mode, such as an insert molding or compression molding (compression molding) process processing mode through an injection molding machine.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are by way of example only and are not limiting. The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the examples and embodiments of the invention may be modified or practiced without departing from the principles described.

Claims (9)

1. A photosensitive assembly, comprising:

At least one photosensitive element comprising a barrier;

at least one package;

A substrate, and

At least one window circuit board, wherein the window circuit board includes a circuit board main part, and the circuit board main part has at least one window, the photosensitive element is set up in the window, wherein the substrate by set up in photosensitive element below, wherein the photosensitive element with the window circuit board is through the encapsulation body is packaged integrally, wherein the separation piece by set up in the encapsulation body with the position that the photosensitive element meets, be used for preventing the encapsulation body is to the influence of photosensitive element inboard region, wherein the separation piece is annular or frame structure, set up in on the photosensitive element, the bottom of substrate highly with the height of the bottom surface of circuit board main part is unanimous, thereby makes the bottom of photosensitive assembly keeps the level.

2. The photosensitive assembly of claim 1, wherein the substrate is recessed, the substrate is disposed within the window, and the photosensitive element is received in the substrate.

3. The photosensitive assembly of claim 2, wherein the photosensitive element is flush with an upper surface of the circuit board body.

4. A photosensitive assembly according to any one of claims 1 to 3, wherein said window is a through hole, said photosensitive element being disposed in said through hole.

5. A photosensitive assembly according to any one of claims 1 to 3, wherein said window is a recess, and said photosensitive element is disposed in said recess.

6. A photosensitive assembly according to any of claims 1 to 3, wherein said substrate is adhesively attached to said circuit board body.

7. A photosensitive assembly according to any of claims 1 to 3, wherein said substrate is adhesively attached to said photosensitive element.

8. A photosensitive assembly according to any of claims 1 to 3, wherein said substrate is a film layer attached to a lower surface of said photosensitive element.

9. A camera module, its characterized in that includes:

At least one photosensitive assembly according to any one of claims 1 to 8, and

At least one lens, the lens is located on the photosensitive path of the photosensitive element.