CN109361834A - Camera module structure - Google Patents
Camera module structure Download PDFInfo
- Publication number
- CN109361834A CN109361834A CN201811198085.3A CN201811198085A CN109361834A CN 109361834 A CN109361834 A CN 109361834A CN 201811198085 A CN201811198085 A CN 201811198085A CN 109361834 A CN109361834 A CN 109361834A
- Authority
- CN
- China
- Prior art keywords
- camera module
- wiring board
- fixed
- sensitive chip
- stiffening plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 5
- 229910001294 Reinforcing steel Inorganic materials 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 238000011161 development Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 235000015110 jellies Nutrition 0.000 description 1
- 239000008274 jelly Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 208000017983 photosensitivity disease Diseases 0.000 description 1
- 231100000434 photosensitization Toxicity 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The invention discloses a kind of camera module structures, including lens assembly and the photosensory assembly being fixed at below lens assembly, photosensory assembly includes stiffening plate and the wiring board for being fixed at stiffening plate upper surface, the centre of wiring board is equipped with hollowed out area, is also fixed with sensitive chip in the hollowed out area of the wiring board, the upper surface of the stiffening plate；The wiring board has the First terrace of inside and the second step face in outside, and bracket is fixed on the First terrace, and the bracket makes IR piece be formed in the surface of sensitive chip to fixed IR piece.The reliability of wiring board can be improved in the setting of stiffening plate in the present embodiment, and then improves the reliability of camera module, and the setting of hollowed out area makes sensitive chip and IR piece that camera module can be accommodated among wiring board, and the height of camera module is effectively reduced.
Description
Technical field
The present invention relates to field of camera technology, relate more specifically to a kind of camera module structure.
Background technique
With the continuous development that image sensing is applied, the sensitive chip of camera and the encapsulation form of wiring board have been had occurred
Repeatedly variation, COB encapsulation are increasingly becoming the mainstream packing forms of camera shooting industry.COB packaging technology makes the performance of product and reliable
Property has obtained significant raising.
However, this just exists to the camera module on mobile phone as the consumer products such as mobile phone develop towards lightening direction
More stringent requirements are proposed in size and stability, and traditional camera module has increasingly been not suitable with the development of this trend
Trend, especially in high-end smartphones, such as comprehensive screen mobile phone camera module, thickness be thinned and stability improve become take the photograph
As the prerequisite condition of mould group.
Summary of the invention
In order to solve the deficiencies in the prior art, it is thinned the present invention provides a kind of thickness and stability-enhanced camera shooting
Modular structure.
Present invention technical effect to be achieved is realized by following scheme: a kind of camera module structure, including lens group
Part and the photosensory assembly being fixed at below lens assembly, photosensory assembly include stiffening plate and are fixed at table on stiffening plate
The wiring board in face, the centre of wiring board are equipped with hollowed out area, in the hollowed out area of the wiring board, the upper surface of the stiffening plate
Also it is fixed with sensitive chip；The second step face of First terrace and outside of the wiring board with inside, described first
Bracket is fixed on step surface, the bracket makes IR piece be formed in the surface of sensitive chip to fixed IR piece.
Preferably, the second step face for being fixed as the fixed assist side of lens assembly of the lens assembly and photosensory assembly
On.
Preferably, the frame-type lower end surface of lens assembly and the second step face of wiring board are fixed by AA glue laminating.
Preferably, the camera module further includes electronic component, and electronic component is fixed on the First terrace of assist side,
Make electronic component plastic packaging in the non-photo-sensing area of sensitive chip.
Preferably, the stiffening plate is reinforcement steel disc.
Preferably, it is also formed with escape hole between the sensitive chip and the periphery and wiring board of IR piece, so that photosensitive core
Piece and wiring board interval are arranged, and sensitive chip is connect with wiring board by conductor wire.
Preferably, there are four the brackets, in being symmetrically disposed on First terrace.
Preferably, the stiffening plate with a thickness of 0.1mm.
Preferably, the wiring board is flexible circuit board, with a thickness of 0.25mm.
Preferably, the camera module height is 4.46mm.
The invention has the following advantages that the reliability of wiring board, Jin Erti can be improved in the setting of stiffening plate in the present embodiment
The reliability of high camera module, the setting of hollowed out area make sensitive chip and IR piece that camera module can be accommodated among wiring board,
The height of camera module is effectively reduced；Wiring board is arranged to First terrace and second step face, First terrace use
To fix bracket and electronic component, second step face is to support lens assembly.
Detailed description of the invention
Fig. 1 is the overlooking structure diagram of camera module structure of the present invention；
Fig. 2 is the schematic cross-sectional view in the direction X-X in Fig. 1；
Fig. 3 is the schematic cross-sectional view in the direction Y-Y in Fig. 1；
Fig. 4 is the overlooking structure diagram that wiring board is connect with IR piece, electronic component in camera module structure of the present invention.
Specific embodiment
The present invention will be described in detail with reference to the accompanying drawings and examples, and the examples of the embodiments are shown in the accompanying drawings
Out, in which the same or similar labels are throughly indicated same or similar element or members with the same or similar functions
Part.The embodiments described below with reference to the accompanying drawings are exemplary, it is intended to be used to explain the present invention, and should not be understood as to this
The limitation of invention.
In the description of the present invention, it is to be understood that, term " length ", " width ", "upper", "lower", "front", "rear",
The orientation or positional relationship of the instructions such as "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is based on attached drawing institute
The orientation or positional relationship shown, is merely for convenience of description of the present invention and simplification of the description, rather than the dress of indication or suggestion meaning
It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to limit of the invention
System.
In addition, term " first ", " second ", " third " are used for description purposes only, it is not understood to indicate or imply phase
To importance or implicitly indicate the quantity of indicated technical characteristic." first ", " second ", " third " are defined as a result,
Feature can explicitly or implicitly include one or more this feature.In the description of the present invention, the meaning of " plurality " is
Two or more, unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation ",
Terms such as " settings " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be with
It is mechanical connection, is also possible to be electrically connected；It can be directly connected, can also can also be indirectly connected through an intermediary
The interaction relationship of connection or two elements inside two elements.It for the ordinary skill in the art, can be with
The concrete meaning of above-mentioned term in the present invention is understood as the case may be.
As shown in Figs 1-4, the embodiment of the present invention provides a kind of camera module structure, including lens assembly 10 and fixed setting
Photosensory assembly 20 below lens assembly 10, wherein photosensory assembly 20 includes stiffening plate 21 and is fixed on stiffening plate 21
The centre of the wiring board 22 on surface, wiring board 22 is equipped with hollowed out area.The reliable of wiring board 22 can be improved in the setting of stiffening plate 21
Property, and then improve the reliability of camera module.
Sensitive chip 23, institute are also fixed in the hollowed out area of the wiring board 22, the upper surface of the stiffening plate 21
Sensitive chip 23 is stated to be electrically connected by conductor wire with wiring board 22.The setting of hollowed out area makes that camera shooting can be accommodated among wiring board 22
The following sensitive chips of mould group, are effectively reduced the height of camera module.
Wiring board 22 described in the present embodiment has a First terrace 221 of inside and the second step face 222 in outside, and described the
Bracket 25 is fixed on one step surface 221, the bracket 25 makes IR piece 24 be formed in sensitive chip 23 to fixed IR piece 24
Surface, the assembling mode is more controllable, and IR piece 24 be not easily susceptible to mould group external force influence cause to rupture, mould group whole height
Or outer dimension does not also become larger.Specifically, the lower end surface of the bracket 25 is fixed on First terrace 221, bracket 25
Lower end surface upwardly extend and bent inwards again in same level direction, the IR piece 24 passes through viscous with bracket 25 with wiring board 22
Jelly fitting is fixed in bracket 25.Preferably, there are four the brackets 25, in being symmetrically disposed on First terrace 221,
So that fixation uniform force of the bracket 25 to IR piece.
By by the intermediate hollow out of wiring board 22, the lower surface of wiring board 22 is sticked stiffening plate 21, and photosensitive core the present embodiment
The hollowed out area of the upper surface of stiffening plate 21, wiring board 22 is arranged in piece 23, and IR piece 24 is formed in the top of sensitive chip 23, makes
The height of camera module maximum can reduce 0.69mm on the basis of existing, adapt to the development of screen end product comprehensively.In addition, line
For road plate 22 due to internal layer circuit design requirement, the surface of wiring board 22 has the surface of lines, protrusion etc. namely wiring board 22 flat
Whole degree is poor, and the present embodiment is by the way that by the intermediate hollow out of wiring board 22, sensitive chip 23 is placed on the stiffening plate 21 of surfacing, makes
Obtaining sensitive chip 23 also has preferable flatness, and camera module has preferable image quality.
Escape gas as a further improvement, being also formed between the sensitive chip 23 and the periphery and wiring board 22 of IR piece 24
Hole 26, so that sensitive chip 23 and the interval of wiring board 22 are arranged, sensitive chip 23 is connect with wiring board 22 by conductor wire 27.It leads
Electric wire 27 can be gold thread, and the camber of conductor wire 27 can be controlled in 0.1mm hereinafter, the extreme higher position of conductor wire 27 is not higher than route
The upper surface of plate 22.
As a further improvement, the camera module further includes electronic component 28, the fixed assist side 22 of electronic component 28
First terrace 221 on, make 28 plastic packaging of electronic component in the non-photo-sensing area (MOC technique) of sensitive chip 23, can effectively reduce
Mould group overall dimensions.Wherein electronic component 28 can be the elements such as capacitor, resistance.The electronic component 28 is avoided setting with bracket 25
It sets.It should be understood that sensitive chip 23 has intermediate photosensitive area and peripheral non-photo-sensing area is the prior art, photosensitive area be used for into
Row photosensitization, non-photo-sensing area can be used for connecting conductor wire 27 etc..
In the present embodiment, the stiffening plate 21 is square, and the hollowed out area of the wiring board 22 is also square, and vacancy section
The adjacent two edges line in domain is parallel with the adjacent two edges line of stiffening plate 21 respectively.In this way, can be easily installed rectangular photosensitive
Chip 23, so that the utilization rate of hollowed out area maximizes, and rationally designs the structure of wiring board 22, wiring board 22 is not
The region of hollow out can carry lens assembly 10, electronic component 28 and have the site being electrically connected with elements such as sensitive chips 23.
The lens assembly 10 that is fixed as of lens assembly 10 described in the present embodiment and photosensory assembly 20 fixes assist side 22
Second step face 222 on, specifically can be lens assembly 10 frame-type lower end surface and second step face 222 by AA glue 29 patch
It closes and fixes.
Stiffening plate 21 described in the present embodiment with a thickness of 0.1mm, stiffening plate 21 is reinforcement steel disc.The wiring board 22 is
Flexible circuit board 22, with a thickness of 0.25mm.The IR piece with a thickness of 0.11mm.Specifically, camera module height h is
4.46mm。
For lens assembly 10 including eyeglass etc., lens assembly 10 should be located at the photosensitive of the sensitive chip 23 in the present embodiment
Path, so that the light being reflected by the object can be by the mirror when the camera module is used to acquire the image of object
Further it is suitable for carrying out photoelectric conversion by the sensitive chip 23 receiving after the processing of head assembly 10.The lens assembly 10
Periphery be also provided with motor sub-assembly, the automatic focusing function of lens assembly 10 may be implemented.It should be understood that of the invention
Camera module can be used for cameras with fixed focus mould group and autozoom camera module, with no restriction.
Camera module use scope in the present embodiment includes but is not limited to mobile phone.
When the camera module assembling of the present embodiment, stiffening plate 21 is first bonded fixation with wiring board 22, wiring board 22 can lead to
Overetch forms hollowed out area and First terrace 221；Fixed sensitive chip 23 is bonded on the stiffening plate 21 of hollowed out area again,
Sensitive chip 23 is connect by conductor wire 27 with wiring board 22；Glue is fixed in the non-photo-sensing region coating of sensitive chip 23 again,
The fitting of IR piece 24 is fixed on the First terrace 221 of wiring board 22 on sensitive chip 23 and fixes bracket 25 and IR piece and electricity
Subcomponent；Finally on the second step face 222 by lens assembly 10 by the fixed assist side 22 of AA glue, camera module is completed
Semi-finished product assembling.
Finally, it should be noted that above embodiments be only to illustrate the technical solution of the embodiment of the present invention rather than to its into
Row limitation, although the embodiment of the present invention is described in detail referring to preferred embodiment, those skilled in the art
It should be understood that the technical solution of the embodiment of the present invention can be still modified or replaced equivalently, and these are modified or wait
The range of modified technical solution disengaging technical solution of the embodiment of the present invention cannot also be made with replacement.
Claims (10)
1. a kind of camera module structure, including lens assembly and the photosensory assembly being fixed at below lens assembly, feature
It is, photosensory assembly includes stiffening plate and the wiring board for being fixed at stiffening plate upper surface, and the centre of wiring board is equipped with hollow out
Region is also fixed with sensitive chip in the hollowed out area of the wiring board, the upper surface of the stiffening plate；The wiring board tool
There are the First terrace of inside and the second step face in outside, bracket is fixed on the First terrace, the bracket is used
To fix IR piece, IR piece is made to be formed in the surface of sensitive chip.
2. camera module structure as described in claim 1, which is characterized in that the lens assembly and photosensory assembly are fixed as
On the second step face of the fixed assist side of lens assembly.
3. camera module structure as claimed in claim 2, which is characterized in that the frame-type lower end surface of lens assembly and wiring board
Second step face is fixed by AA glue laminating.
4. camera module structure as described in claim 1, which is characterized in that the camera module further includes electronic component, electricity
On the First terrace of the fixed assist side of subcomponent, make electronic component plastic packaging in the non-photo-sensing area of sensitive chip.
5. camera module structure as described in claim 1, which is characterized in that the stiffening plate is reinforcement steel disc.
6. camera module structure as described in claim 1, which is characterized in that the periphery and route of the sensitive chip and IR piece
Escape hole is also formed between plate, so that sensitive chip and wiring board interval are arranged, sensitive chip and wiring board pass through conductor wire
Connection.
7. camera module structure as described in claim 1, which is characterized in that there are four the brackets, in being symmetrically disposed in
On First terrace.
8. such as the described in any item camera module structures of claim 1-7, which is characterized in that the stiffening plate with a thickness of
0.1mm。
9. such as the described in any item camera module structures of claim 1-7, which is characterized in that the wiring board is flexible circuitry
Plate, with a thickness of 0.25mm.
10. such as the described in any item camera module structures of claim 1-7, which is characterized in that the height of the camera module is
4.46mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811198085.3A CN109361834A (en) | 2018-10-15 | 2018-10-15 | Camera module structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811198085.3A CN109361834A (en) | 2018-10-15 | 2018-10-15 | Camera module structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109361834A true CN109361834A (en) | 2019-02-19 |
Family
ID=65349355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811198085.3A Pending CN109361834A (en) | 2018-10-15 | 2018-10-15 | Camera module structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109361834A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110351460A (en) * | 2019-06-22 | 2019-10-18 | 王之奇 | A kind of camera encapsulation module and its packaging method |
| CN111050057A (en) * | 2020-01-03 | 2020-04-21 | 昆山丘钛微电子科技有限公司 | Camera module and electronic product |
| CN113992835A (en) * | 2021-12-27 | 2022-01-28 | 江西联益光学有限公司 | Camera module, assembling method thereof and electronic module |
| CN114845008A (en) * | 2021-02-01 | 2022-08-02 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module and circuit board manufacturing method |
| WO2023136235A1 (en) * | 2022-01-11 | 2023-07-20 | ソニーセミコンダクタソリューションズ株式会社 | Package |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005229428A (en) * | 2004-02-13 | 2005-08-25 | Fuji Photo Film Co Ltd | Photographing device |
| CN202998272U (en) * | 2012-11-19 | 2013-06-12 | 李东 | Scaffolding type image sensing module and multi-camera device |
| CN105472218A (en) * | 2015-12-01 | 2016-04-06 | 宁波舜宇光电信息有限公司 | Camera module group, electrical support, and assembly method and application of camera module group |
| CN105721749A (en) * | 2016-02-24 | 2016-06-29 | 宁波舜宇光电信息有限公司 | Photographing module and electrical bracket, circuit board assembly and manufacturing method of photographing module |
| CN206294240U (en) * | 2016-03-15 | 2017-06-30 | 宁波舜宇光电信息有限公司 | Array camera module and dual camera module, circuit board assembly and electronic equipment thereof |
| CN106973210A (en) * | 2017-05-16 | 2017-07-21 | 昆山丘钛微电子科技有限公司 | Plastic packaging adds stent-type to minimize cam device and preparation method thereof |
| CN106993123A (en) * | 2017-04-11 | 2017-07-28 | 昆山丘钛微电子科技有限公司 | Minimize cam device and preparation method thereof |
| CN107566691A (en) * | 2016-07-03 | 2018-01-09 | 宁波舜宇光电信息有限公司 | Photosensory assembly and camera module and its manufacture method |
| CN206962938U (en) * | 2017-06-16 | 2018-02-02 | 维沃移动通信有限公司 | A kind of camera module and mobile terminal |
-
2018
- 2018-10-15 CN CN201811198085.3A patent/CN109361834A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005229428A (en) * | 2004-02-13 | 2005-08-25 | Fuji Photo Film Co Ltd | Photographing device |
| CN202998272U (en) * | 2012-11-19 | 2013-06-12 | 李东 | Scaffolding type image sensing module and multi-camera device |
| CN105472218A (en) * | 2015-12-01 | 2016-04-06 | 宁波舜宇光电信息有限公司 | Camera module group, electrical support, and assembly method and application of camera module group |
| CN105721749A (en) * | 2016-02-24 | 2016-06-29 | 宁波舜宇光电信息有限公司 | Photographing module and electrical bracket, circuit board assembly and manufacturing method of photographing module |
| CN206294240U (en) * | 2016-03-15 | 2017-06-30 | 宁波舜宇光电信息有限公司 | Array camera module and dual camera module, circuit board assembly and electronic equipment thereof |
| CN107566691A (en) * | 2016-07-03 | 2018-01-09 | 宁波舜宇光电信息有限公司 | Photosensory assembly and camera module and its manufacture method |
| CN106993123A (en) * | 2017-04-11 | 2017-07-28 | 昆山丘钛微电子科技有限公司 | Minimize cam device and preparation method thereof |
| CN106973210A (en) * | 2017-05-16 | 2017-07-21 | 昆山丘钛微电子科技有限公司 | Plastic packaging adds stent-type to minimize cam device and preparation method thereof |
| CN206962938U (en) * | 2017-06-16 | 2018-02-02 | 维沃移动通信有限公司 | A kind of camera module and mobile terminal |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110351460A (en) * | 2019-06-22 | 2019-10-18 | 王之奇 | A kind of camera encapsulation module and its packaging method |
| CN111050057A (en) * | 2020-01-03 | 2020-04-21 | 昆山丘钛微电子科技有限公司 | Camera module and electronic product |
| CN114845008A (en) * | 2021-02-01 | 2022-08-02 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module and circuit board manufacturing method |
| CN114845008B (en) * | 2021-02-01 | 2024-09-06 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module and preparation method of circuit board |
| CN113992835A (en) * | 2021-12-27 | 2022-01-28 | 江西联益光学有限公司 | Camera module, assembling method thereof and electronic module |
| WO2023136235A1 (en) * | 2022-01-11 | 2023-07-20 | ソニーセミコンダクタソリューションズ株式会社 | Package |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109361834A (en) | Camera module structure | |
| KR102321744B1 (en) | Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic device | |
| CN109510932B (en) | Camera module based on molding process, molded circuit board assembly of camera module and manufacturing method of camera module | |
| KR102613607B1 (en) | System-Level Camera Module with Electrical Support and Manufacturing Method Thereof | |
| TWI302742B (en) | Solid-state image sensing device | |
| CN101303444A (en) | Camera module and assembly method thereof | |
| CN104469106B (en) | Photographing module | |
| TWI484241B (en) | Imaging module and manufacturing method thereof | |
| CN114845014A (en) | Photosensitive assembly, camera module and manufacturing method thereof | |
| CN109451205A (en) | A kind of novel camera module | |
| CN208940069U (en) | A kind of new type superthin camera module | |
| WO2017080526A1 (en) | Camera module, electrical support thereof, and assembling method therefor | |
| CN111163254A (en) | Image sensing module | |
| TWI471626B (en) | Camera module | |
| CN104717412B (en) | Camera module and assembly method thereof | |
| CN111050032B (en) | camera module | |
| US20210321025A1 (en) | Camera module and molded photosensitive assembly and manufacturing methods thereof, and electronic device | |
| JP6465360B2 (en) | Solid-state imaging device, camera module, and electronic device | |
| TWI351539B (en) | Camera module and assemble mehtod thereof | |
| CN206922900U (en) | Camera module | |
| CN107483792B (en) | Camera module and manufacturing method thereof | |
| KR100868052B1 (en) | Camera module package and assembly method | |
| CN110661935A (en) | Lens module | |
| CN211089713U (en) | Sensitization subassembly and module and electronic equipment of making a video recording | |
| CN208836255U (en) | Circuit board module and camera module, intelligent terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190219 |