CN111050057A - Camera module and electronic product - Google Patents
Camera module and electronic product Download PDFInfo
- Publication number
- CN111050057A CN111050057A CN202010007009.0A CN202010007009A CN111050057A CN 111050057 A CN111050057 A CN 111050057A CN 202010007009 A CN202010007009 A CN 202010007009A CN 111050057 A CN111050057 A CN 111050057A
- Authority
- CN
- China
- Prior art keywords
- reinforcing plate
- camera module
- circuit board
- base
- photosensitive element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 67
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000003292 glue Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000003351 stiffener Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
Abstract
The invention provides a camera module and an electronic product, wherein the camera module comprises a first reinforcing plate, a second reinforcing plate, a circuit board, a photosensitive element, a base and a lens component, the first reinforcing plate and the second reinforcing plate are respectively arranged on the upper side and the lower side of the circuit board, the base is arranged on the second reinforcing plate, a hollow accommodating cavity is arranged in the base, the photosensitive element is arranged in the accommodating cavity, the photosensitive element is electrically connected to the circuit board, and the lens component is arranged on the base. In the camera module and the electronic product provided by the invention, the circuit board is arranged between the first reinforcing plate and the second reinforcing plate, so that the positioning hole is contained in the first reinforcing plate, the circuit board and the second reinforcing plate, and the depth of the positioning hole extends towards the front of the camera module, therefore, the positioning hole can be formed in the camera module and the camera module can be kept thin.
Description
Technical Field
The invention relates to the technical field of imaging, in particular to a camera module and an electronic product.
Background
With the progress of science and technology, various electronic products, such as mobile phones, cameras, tablet computers, etc., have become essential daily necessities for people. In order to record pictures and videos conveniently at any time and any place, the camera module also becomes a standard component of various electronic products. With the thickness of the electronic product becoming thinner and thinner, the screen occupation ratio also becomes higher and higher, and the pixels become higher and higher, so that the requirements for smaller and thinner camera modules are also provided.
As shown in fig. 1 to 3, the current camera module includes a stiffener 11, a circuit board 13, a chip 14, a base 15, and a lens assembly 17, where the stiffener 11 is disposed at the bottom of the circuit board 13, the chip 14 and the base 15 are both disposed on the circuit board 13, and the lens assembly 17 is disposed on the base 15. In one installation method, in order to install the camera module, a positioning hole 112 is opened at the bottom of the reinforcing plate 11 for auxiliary positioning and assembly. However, set up locating hole 112 on stiffening plate 11, can reduce stiffening plate 11's intensity, in order to guarantee intensity, need thicken stiffening plate 11 to can lead to the thickness increase of whole camera module, be unfavorable for the frivolous development requirement of camera module.
The foregoing description is provided for general background information and is not admitted to be prior art.
Disclosure of Invention
The invention aims to provide a camera module with small thickness and an electronic product.
The invention provides a camera module, which comprises a first reinforcing plate, a second reinforcing plate, a circuit board, a photosensitive element, a base and a lens assembly, wherein the first reinforcing plate and the second reinforcing plate are respectively arranged at the upper side and the lower side of the circuit board, the base is arranged on the second reinforcing plate, a hollow accommodating cavity is arranged in the base, the photosensitive element is arranged in the accommodating cavity, the photosensitive element is electrically connected to the circuit board, and the lens assembly is arranged on the base.
In one embodiment, the bottom of the camera module is provided with positioning holes sequentially formed in the first reinforcing plate, the circuit board and the second reinforcing plate.
In one embodiment, the first reinforcing plate is disposed at the bottom of the circuit board, and the second reinforcing plate is disposed at the top of the circuit board.
In one embodiment, the second reinforcing plate has a thickness greater than that of the first reinforcing plate.
In one embodiment, the second reinforcing plate has an opening, and the photosensitive element is disposed on the circuit board and located in the opening of the second reinforcing plate.
In one embodiment, the photosensitive element is electrically connected to the circuit board through a gold wire.
In one embodiment, the photosensitive element and the circuit board are both provided with a bonding pad, two ends of the gold wire are respectively connected to the bonding pad of the photosensitive element and the bonding pad of the circuit board, and the bonding pad on the circuit board is located in the opening of the second reinforcing plate.
In one embodiment, the photosensitive element is disposed on the second reinforcing plate.
In one embodiment, the base is provided with an internal thread, the lens component is provided with an external thread, and the lens component is connected with the base through the thread; the top of the base is arranged between the base and the lens component.
The invention also provides an electronic product comprising the camera module.
In the camera module and the electronic product provided by the invention, the circuit board is arranged between the first reinforcing plate and the second reinforcing plate, so that the positioning hole is contained in the first reinforcing plate, the circuit board and the second reinforcing plate, and the depth of the positioning hole extends towards the front of the camera module, therefore, the positioning hole can be formed in the camera module and the camera module can be kept thin.
Drawings
Fig. 1 is a schematic cross-sectional view of a camera module.
Fig. 2 is a schematic front view of a circuit board and a chip of the camera module shown in fig. 1.
Fig. 3 is a schematic view of a back side angle of the reinforcing plate and the circuit board of the camera module shown in fig. 1.
Fig. 4 is a schematic cross-sectional structure diagram of a camera module according to an embodiment of the invention.
Fig. 5 is a schematic front view of the circuit board and the photosensitive element of the camera module shown in fig. 4.
Fig. 6 is a schematic view of the back angles of the reinforcing plate and the circuit board of the camera module shown in fig. 4.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
Referring to fig. 4 to 6, the camera module according to an embodiment of the present invention includes a first reinforcing plate 21, a second reinforcing plate 23, a circuit board 25, a photosensitive element 27, a base 29, and a lens assembly 31. The first reinforcing plate 21 and the second reinforcing plate 23 are respectively disposed on the upper and lower sides of the circuit board 25, the base 29 is disposed on the second reinforcing plate 23, the hollow accommodating cavity 292 is disposed in the base 29, the photosensitive element 27 is disposed in the accommodating cavity 292, the photosensitive element 27 is electrically connected to the circuit board 25, and the lens assembly 31 is mounted on the base 29. The bottom of the camera module can be provided with positioning holes 33 which are sequentially formed in the first reinforcing plate 21, the circuit board 25 and the second reinforcing plate 23.
In this camera module, because the circuit board 25 is located between first stiffening plate 21 and second stiffening plate 23, make the locating hole contain in three layers of first stiffening plate 21, circuit board 25 and second stiffening plate 23 to, the degree of depth of locating hole 33 extends towards the front of camera module, consequently can make the locating hole and keep the camera module thinner on the camera module.
In this embodiment, the first reinforcing plate 21 is provided on the bottom of the wiring board 25. The second reinforcing plate 23 is provided on the top of the wiring board 25. The first reinforcing plate 21 and the second reinforcing plate 23 are used to reinforce the strength of the circuit board 25. The first reinforcing plate 21 and the second reinforcing plate 23 may be attached to the wiring board 25 by glue.
Specifically, the thickness of the second reinforcing plate 23 may be larger than the first reinforcing plate 21. The first reinforcing plate 21 at the bottom is arranged to be thin, the second reinforcing plate 23 at the top is arranged to be thick, strength can be well guaranteed, the positioning hole 33 can be extended inwards to the greatest extent, and therefore the thickness of the camera module is thinned to the greatest extent.
In this embodiment, the second reinforcing plate 23 is provided with an opening 232, and the photosensitive element 27 is disposed on the circuit board 25 and located in the opening 232 of the second reinforcing plate 23. Thus, the second reinforcing plate 23 and the photosensitive element 27 can be disposed in the same height direction, and the dimensions do not need to be overlapped in the height direction, so that the thickness of the camera module can be further reduced, and the camera module can be made thinner. Specifically, the photosensitive element 27 may be attached to the wiring board 25 by glue. It is to be understood that the photosensitive element 27 may also be provided on the second reinforcing plate 23.
The photosensitive element 27 can be electrically connected to the circuit board 25 by a gold wire 35, so as to realize the electrical signal transmission between the photosensitive element 27 and the circuit board 25. Since the photosensitive element 27 is disposed in the opening 232 of the second reinforcing plate 23, the gold wires 35 do not extend much above the second reinforcing plate 23, and even can be flush with the second reinforcing plate 23 or lower than the second reinforcing plate 23. Specifically, the photosensitive element 27 and the circuit board 25 are each provided with a pad, both ends of the gold wire 35 are respectively soldered to the pads of the photosensitive element 27 and the circuit board 25, and the pads of the circuit board 25 are located in the openings 232 of the second reinforcing plate 23.
The photosensitive element 27 may be a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge-coupled Device) image sensor.
In this embodiment, an internal thread is provided on the base 29, an external thread is provided on the lens assembly 31, and the lens assembly 31 is installed on the base 29 by a threaded connection. The top of the base 29 may also be provided with an adhesive 37 between the base 29 and the lens assembly 31 to further secure the lens assembly 31 to the base 29. During installation, the position of the lens assembly 31 is adjusted through threads, and after the position is adjusted to the optimal height position, the lens assembly is fixed through the adhesive 37. Specifically, the lens assembly 31 includes a lens barrel and a lens group, the lens group is assembled in the lens barrel, and the base 29 is screwed with the lens barrel. It is understood that in other embodiments, the base 29 and the lens barrel may be integrally formed.
The invention also provides an electronic product comprising the camera module.
In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. It will be understood that when an element such as a layer, region or substrate is referred to as being "formed on," "disposed on" or "located on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly formed on" or "directly disposed on" another element, there are no intervening elements present.
In this document, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms can be understood in a specific case to those of ordinary skill in the art.
In this document, the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "vertical", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the purpose of clarity and convenience of description of the technical solutions, and thus, should not be construed as limiting the present invention.
As used herein, the ordinal adjectives "first", "second", etc., used to describe an element are merely to distinguish between similar elements and do not imply that the elements so described must be in a given sequence, either temporally, spatially, in ranking, or in any other manner.
As used herein, the meaning of "a plurality" or "a plurality" is two or more unless otherwise specified.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including not only those elements listed, but also other elements not expressly listed.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. The utility model provides a camera module, its characterized in that includes first stiffening plate (21), second stiffening plate (23), circuit board (25), photosensitive element (27), base (29) and camera lens subassembly (31), first stiffening plate (21) with second stiffening plate (23) are located respectively the upper and lower both sides of circuit board (25), base (29) are located on second stiffening plate (23), just be equipped with hollow chamber (292) that holds in base (29), photosensitive element (27) are located hold in the chamber (292), just photosensitive element (27) electric connection in circuit board (25), camera lens subassembly (31) install in on base (29).
2. The camera module according to claim 1, wherein a positioning hole (33) is formed in a bottom of the camera module, and the first reinforcing plate (21), the circuit board (25) and the second reinforcing plate (23) are sequentially provided with holes.
3. The camera module according to claim 1 or 2, wherein the first reinforcing plate (21) is provided at a bottom of the circuit board (25), and the second reinforcing plate (23) is provided at a top of the circuit board (25).
4. The camera module according to claim 3, wherein the second reinforcing plate (23) has a thickness larger than that of the first reinforcing plate (21).
5. The camera module according to claim 1 or 2, wherein the second reinforcing plate (23) has an opening (232), and the photosensitive element (27) is disposed on the circuit board (25) and located in the opening (232) of the second reinforcing plate (23).
6. The camera module according to claim 5, wherein the photosensitive element (27) is electrically connected to the circuit board (25) by gold wires (35).
7. The camera module according to claim 6, wherein the photosensitive element (27) and the circuit board (25) are each provided with a pad, two ends of the gold wire (35) are respectively connected to the pads of the photosensitive element (27) and the pads of the circuit board (25), and the pads of the circuit board (25) are located in the openings (232) of the second reinforcing plate (23).
8. The camera module according to claim 1 or 2, wherein the photosensitive element (27) is provided on the second reinforcing plate (23).
9. The camera module according to claim 1 or 2, wherein the base (29) is provided with an internal thread, the lens assembly (31) is provided with an external thread, and the lens assembly (31) is connected with the base (29) through a thread; the top of the base (29) is provided with an adhesive (37) between the base (29) and the lens assembly (31).
10. An electronic product, comprising the camera module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010007009.0A CN111050057B (en) | 2020-01-03 | 2020-01-03 | Camera module and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010007009.0A CN111050057B (en) | 2020-01-03 | 2020-01-03 | Camera module and electronic product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111050057A true CN111050057A (en) | 2020-04-21 |
| CN111050057B CN111050057B (en) | 2024-08-06 |
Family
ID=70243645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010007009.0A Active CN111050057B (en) | 2020-01-03 | 2020-01-03 | Camera module and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111050057B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105763780A (en) * | 2016-04-07 | 2016-07-13 | 宁波舜宇光电信息有限公司 | Photosensitive device with reinforcing circuit board, array camera module and manufacturing method thereof |
| WO2018121793A1 (en) * | 2016-12-31 | 2018-07-05 | 宁波舜宇光电信息有限公司 | Separable photographic array module and manufacturing method thereof |
| CN108769495A (en) * | 2018-08-07 | 2018-11-06 | 宁波舜宇光电信息有限公司 | A kind of camera module and assemble method and electronic equipment |
| CN109361834A (en) * | 2018-10-15 | 2019-02-19 | 信利光电股份有限公司 | Camera module structure |
| WO2019137466A1 (en) * | 2018-01-11 | 2019-07-18 | 维沃移动通信有限公司 | Camera module and mobile terminal |
| CN209330220U (en) * | 2018-11-21 | 2019-08-30 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly and mobile terminal |
| CN110262629A (en) * | 2019-07-29 | 2019-09-20 | 无锡睿勤科技有限公司 | A kind of laptop |
| CN211018974U (en) * | 2020-01-03 | 2020-07-14 | 昆山丘钛微电子科技有限公司 | Camera module and electronic product |
-
2020
- 2020-01-03 CN CN202010007009.0A patent/CN111050057B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105763780A (en) * | 2016-04-07 | 2016-07-13 | 宁波舜宇光电信息有限公司 | Photosensitive device with reinforcing circuit board, array camera module and manufacturing method thereof |
| WO2018121793A1 (en) * | 2016-12-31 | 2018-07-05 | 宁波舜宇光电信息有限公司 | Separable photographic array module and manufacturing method thereof |
| WO2019137466A1 (en) * | 2018-01-11 | 2019-07-18 | 维沃移动通信有限公司 | Camera module and mobile terminal |
| CN108769495A (en) * | 2018-08-07 | 2018-11-06 | 宁波舜宇光电信息有限公司 | A kind of camera module and assemble method and electronic equipment |
| CN109361834A (en) * | 2018-10-15 | 2019-02-19 | 信利光电股份有限公司 | Camera module structure |
| CN209330220U (en) * | 2018-11-21 | 2019-08-30 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly and mobile terminal |
| CN110262629A (en) * | 2019-07-29 | 2019-09-20 | 无锡睿勤科技有限公司 | A kind of laptop |
| CN211018974U (en) * | 2020-01-03 | 2020-07-14 | 昆山丘钛微电子科技有限公司 | Camera module and electronic product |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111050057B (en) | 2024-08-06 |
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