CN114814513A - Semiconductor electronic component detection device and method - Google Patents

Abstract

The invention provides a semiconductor electronic component testing device and method, which relates to the technical field of testing equipment, including a testing platform, a pressing down testing mechanism and at least one moving pressing rod mechanism; the moving pressing rod mechanism is installed on the testing platform and is used for transporting and pressing Measuring electronic components, the moving pressure rod mechanism has a pressure surface and a first pressure surface for pressure measurement of electronic components, and the first pressure surface is located directly below the pressure surface; the pressure test mechanism is installed on the detection platform and is opposite In the reciprocating motion of the detection platform, the pressing down test mechanism has a second pressing surface, and the pressing down testing mechanism is used to apply downward pressure to the pressing surface of the moving pressing rod mechanism through the second pressing face, so as to move the pressure on the pressing rod mechanism. It is transmitted along the direction of the pressure receiving surface to the first pressing surface. The semiconductor electronic component testing device provided by the present invention can be suitable for high-speed operation testing environment, and the moving pressure rod mechanism is not subjected to bending moment load, which effectively alleviates the problem of low testing yield caused by uneven testing pressure.

Description

Semiconductor electronic component testing device and method

technical field

The present invention relates to the technical field of testing equipment, in particular to a semiconductor electronic component testing device and method.

Background technique

With the increasing complexity of IC (Integrated Circuit Chip, micro electronic components) functional modules, the test pressure and test time of ICs are gradually increasing. With the increase, the overall test cost will be reduced accordingly, so the demand for multi-station large pressure testing machines came into being.

The traditional multi-station test device usually includes two sets of IC test arms with the same mechanism, wherein the test arms are arranged in the center, and each set of test arms has its own independent horizontal and vertical drive system. The vertical drive system of the two sets of test arms takes the test arm as the symmetrical center, and the two sides are symmetrically distributed. The vertical drive system is installed with a horizontal guide rail, and the horizontal guide rail is connected to the test arm. The horizontal drive system is different from the vertical drive system. The horizontal drive systems of the two test arms share two double guide rails. During the whole test process, the horizontal and vertical drive systems work together to drive the test arm to move in parallel in both horizontal and vertical directions, so that ICs can be picked and placed and pressed down for testing.

However, the above-mentioned multi-station testing device has the following disadvantages:

1) The downforce given by the test arm to the IC is directly related to the driving force of the vertical drive system. If a large pressure load of the test arm needs to be achieved, the driver of the vertical drive system is required to have a large power output, which will cause the volume of the drive. , The weight is too large, which increases the load of the horizontal drive system, affects the response speed of the horizontal drive system, and reduces the test efficiency.

2) Since the vertical drive system is located on both sides of the test arm, the test arm is subjected to two forces, the driving force of the side vertical drive system and the reaction force of the test IC, when the test arm is pressed vertically. The bending moment load causes problems such as structural deformation and tilting of the test arm when testing the IC, causing uneven IC test pressure and affecting the key indicators of IC test and test yield.

3) The existing solution has a complex linkage structure between the vertical drive system and the test arm. During installation, it is necessary to first debug the accuracy of the lead screw and guide rail of the individual modules of the vertical drive system; then, the accuracy of the guide rail of the test arm needs to be debugged; finally, it is necessary to connect the test arm with the vertical drive system After the association is connected, the overall accuracy is debugged, the overall structure is complex, and the assembly accuracy is low.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a semiconductor electronic component testing device, which can be used in a high-speed operation test environment, and the moving pressure rod mechanism will not be subjected to bending moment loads, effectively alleviating the problem of low test yield caused by uneven test pressure.

For achieving the above object, the present invention provides the following technical solutions:

In a first aspect, the present invention provides a semiconductor electronic component testing device, comprising a testing platform, a pressing down testing mechanism and at least one moving pressing rod mechanism;

The moving pressure rod mechanism is installed on the detection platform and is used for transporting and pressure testing electronic components, the moving pressure rod mechanism has a pressure receiving surface and a first pressure surface for pressure testing the electronic components, the The first pressing surface is located just below the pressure receiving surface;

The push-down test mechanism is mounted on the detection platform and can reciprocate relative to the test platform, the push-down test mechanism has a second pressing surface, and the push-down test mechanism is used to pass the second pressure test mechanism. The pressing surface applies downward pressure to the pressing surface of the moving pressing rod mechanism, and the pressure on the moving pressing rod mechanism is transmitted along the direction in which the pressing surface faces the first pressing surface.

Further, one of the end of the pressing test mechanism having the second pressing surface and the end of the moving pressing rod mechanism having the pressing surface is provided with an electromagnet, and the other is provided with an electromagnet. on the magnetic element that is attracted to the electromagnetic element.

Further, the pressing test mechanism includes a first bracket assembly, a first driving assembly and a pressing rod, the first bracket assembly is mounted on the detection platform, and the pressing rod is vertically aligned with the first The bracket assembly is slidably connected, the bottom end of the pressing rod has the second pressing surface, the first driving assembly is mounted on the first bracket assembly and is connected with the top end of the pressing rod, the first The driving assembly is used for driving the pressing rod to move relative to the first bracket assembly.

Further, the first drive assembly includes a first power assembly and a first transmission structure;

the first power assembly is mounted on the first bracket assembly;

The first transmission structure includes a first rotation rod that is drivingly connected to the first power assembly, and the first rotation rod is rotatably connected to the first bracket assembly and is threadedly connected to the compression rod.

Further, a channel is formed between the pressing test mechanism and the detection platform, the moving pressure rod mechanisms are arranged in an even number and are divided into two rows, and the two rows of moving pressure rod mechanisms are symmetrically installed on the detection platform. on and through the channel.

Further, the moving and pressing rod mechanism includes a second drive assembly, a second bracket assembly, a third drive assembly and a moving member;

the second drive assembly is mounted on the detection platform;

the second bracket assembly is connected with the second drive assembly, and the second bracket assembly is connected in parallel sliding with the detection platform;

the third drive assembly is mounted on the second bracket assembly and connected with the moving member;

The top end of the moving member has the pressure receiving surface, the bottom end of the moving member has the first pressing surface, the moving member is vertically slidably connected with the second bracket assembly, and the third The driving assembly is used for driving the moving member to slide relative to the second bracket assembly.

Further, the second drive assembly includes a second power assembly and a second transmission structure;

the second power assembly is installed on the detection platform;

The second transmission structure includes a second rotating rod and a second set of components threadedly connected to the second rotating rod, the second rotating rod is rotatably connected to the detection platform, and the second set of components fixedly mounted on the second bracket assembly.

Further, a plurality of sliding rails or sliding grooves are arranged on the detection platform in the longitudinal direction, and the second set of components in each of the moving and pressing rod mechanisms is connected to each of the sliding rails or the sliding rails through the second bracket assembly. The chute is slidably connected.

Further, the third drive assembly includes a third power assembly, a fifth transmission assembly and a sixth transmission assembly;

the third power assembly is mounted on the top end of the second bracket assembly;

The sixth transmission assembly is located at the side of the third power assembly, and the sixth transmission assembly includes a moving rod and a rotating member threadedly connected with the moving rod, and the rotating member rotates with the second bracket assembly connected, the moving rod is fixedly mounted on the moving member;

The fifth transmission assembly is connected between the third power assembly and the rotating member, and is used for transmitting the power of the third power assembly to the rotating member.

Further, the moving member includes an arm body, an adapter block and an adapter plate, the moving rod is fixedly connected with the arm body, the arm body has an installation channel, the sixth transmission assembly and at least part of the The fifth transmission assembly is located in the installation channel, the bottom end of the arm body is connected to the adapter plate through the adapter block, and the bottom surface of the adapter plate is the first pressing surface.

A second aspect of the present invention provides a semiconductor electronic component detection method, which adopts the above-mentioned semiconductor electronic component detection device, and the semiconductor electronic component detection device includes a plurality of the moving pressing rod mechanisms, including:

Each of the mobile pressing rod mechanisms sequentially transports the electronic components to be tested to the test area, and the pressing down testing mechanism presses down one of the mobile pressing rod mechanisms at a time during testing;

Alternatively, each of the moving and pressing rod mechanisms simultaneously transports the electronic components to be tested to the test area, and during the test, the pressing down testing mechanism simultaneously presses down each of the moving and pressing rod mechanisms.

The semiconductor electronic component detection device and method provided by the present invention can produce the following beneficial effects:

When using the above-mentioned semiconductor electronic component testing device, the moving pressing rod mechanism can move, so that the electronic components to be tested are transported to the testing area. The pressure-receiving surfaces are in contact with each other, and then the pressing test mechanism continues to give a downward pressure to the pressure-receiving surface. components are tested.

Compared with the prior art, on the one hand, the device is provided with a downward pressure test mechanism, which can provide a strong downward pressure for the moving pressure rod mechanism, and can also cooperate with the mobile pressure rod mechanism to jointly pressurize the electronic components. , to achieve large pressure detection, and the power requirement of the driver in the moving pressure rod mechanism is low, reducing the load of the moving pressure rod mechanism, which can be suitable for high-speed operation test environment; on the other hand, because the pressure transmission direction on the moving pressure rod mechanism is along The pressure-receiving surface points to the direction of the first pressure-receiving surface. During the test, the pressure exerted by the down-pressing test mechanism on the moving pressure rod mechanism is coaxial and opposite to the electronic component reaction force received by the moving pressure rod mechanism, and the moving pressure rod mechanism will not be affected. Bending moment load, so that the test pressure acts on the electronic components more evenly, effectively alleviating the problem of low test yield caused by uneven test pressure.

The semiconductor electronic component testing method provided by the second aspect of the present invention has two use states. The pressing down test mechanism can pressurize each moving pressure rod mechanism one by one, or simultaneously pressurize each moving pressure rod mechanism, so as to realize electronic components One by one detection and batch detection.

Description of drawings

In order to illustrate the specific embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the specific embodiments or the prior art. Obviously, the accompanying drawings in the following description The drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

1 is a schematic diagram of a three-dimensional structure of a semiconductor electronic component detection device provided by an embodiment of the present invention;

Fig. 2 is a three-dimensional structural schematic diagram of a press-down testing mechanism provided by an embodiment of the present invention;

3 is a cross-sectional view of a pressing rod of a pressing down test mechanism (without a second support frame) provided by an embodiment of the present invention;

FIG. 4 is a schematic three-dimensional structural diagram of a second drive assembly according to an embodiment of the present invention;

5 is a schematic three-dimensional structural diagram of a moving and pressing rod mechanism (without a second driving component) provided by an embodiment of the present invention;

6 is a cross-sectional view of an arm of a moving and pressing rod mechanism (without a second driving component) provided by an embodiment of the present invention;

7 is a top view of an initialization position when two moving and pressing rod mechanisms take turns to test electronic components according to an embodiment of the present invention;

FIG. 8 is a schematic diagram of a three-dimensional structure in the state shown in FIG. 7;

9 is a top view of the first moving lever mechanism carrying the electronic component test and the second moving lever mechanism carrying the electronic component waiting state provided by the embodiment of the present invention;

FIG. 10 is a schematic diagram of a three-dimensional structure in the state shown in FIG. 9;

11 is a top view of the second moving lever mechanism carrying the electronic component test and the first moving lever mechanism carrying the electronic component waiting state provided by the embodiment of the present invention;

Fig. 12 is a schematic diagram of a three-dimensional structure in the state shown in Fig. 11;

13 is a schematic diagram of a three-dimensional structure in a state in which the first moving lever mechanism and the second moving lever mechanism according to an embodiment of the present invention simultaneously take out electronic components;

14 is a schematic diagram of a three-dimensional structure in a state in which the first moving and pressing rod mechanism and the second moving and pressing rod mechanism simultaneously press down the electronic component according to the embodiment of the present invention.

Icons: 1-detection platform; 11-slide rail; 12-motor base; 13-motor sheet metal; 14-first spacer block; 15-second spacer block; 16-limit block; 17-support block; 2- Press down test mechanism; 21-first bracket assembly; 211-first installation plate; 212-first support frame; 213-second installation plate; 214-second support frame; 215-first fixing plate; 216-limit 217-first bearing; 218-installation block; 219-slider; 22-pressing rod; 221-second pressing surface; 222-guide rail; 23-first power assembly; 24-first transmission assembly; 241- the second driving wheel; 242- the second timing belt; 243- the second driven wheel; 25- the first rotating rod; 26- the first set of parts; Mechanism; 3b-Second moving rod mechanism; 31-Second drive assembly; 311-Second power assembly; 312-Third transmission assembly; 313-Second rotating rod; 32-second bracket assembly; 321-fourth mounting plate; 322-slider fixing plate; 323-second fixing plate; 33-third drive assembly; 331-third power assembly; 332-fifth transmission assembly 3321- the first driving wheel; 3322- the first timing belt; 3323- the first driven wheel; 333- moving rod; Installation channel; 342-transfer block; 343-transfer plate; 3431-first pressing surface; 4-electromagnetic part; 5-magnetic part; 6-channel; 7-transverse feeding assembly; Feed assembly; 7b - second transverse feed assembly; 8 - test area.

Detailed ways

The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation or a specific orientation. construction and operation, and therefore should not be construed as limiting the invention. Furthermore, the terms "first", "second", and "third" are used for descriptive purposes only and should not be construed to indicate or imply relative importance.

In the description of the present invention, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense, unless otherwise expressly specified and limited, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.

The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention, but not to limit the present invention.

The embodiment of the first aspect of the present invention is to provide a semiconductor electronic component testing device, as shown in FIG. 1 , comprising a testing platform 1, a pressing test mechanism 2 and at least one moving pressure rod mechanism 3; the moving pressure rod mechanism 3 is installed on the On the detection platform 1 and used for transport and pressure measurement of electronic components, the moving pressure rod mechanism 3 has a pressure surface 3411 and a first pressure surface 3431 for pressure measurement of electronic components, and the first pressure surface 3431 is located on the pressure surface 3411. Directly below; the push-down test mechanism 2 is installed on the detection platform 1 and can reciprocate relative to the test platform 1. The push-down test mechanism 2 has a second pressure surface 221, and the push-down test mechanism 2 is used to pass the second pressure surface. 221 applies downward pressure to the pressure receiving surface 3411 of the moving and pressing rod mechanism 3, and the pressure on the moving and pressing rod mechanism 3 is transmitted along the direction in which the pressure receiving surface 3411 points to the first pressing surface 3431.

When in use, the mobile pressing rod mechanism 3 can realize the picking up, transporting to the test area and placing electronic components of electronic components through horizontal movement and vertical movement, and the pressing test mechanism 2 can press the moving pressing rod mechanism 3 through vertical movement. , to achieve a large pressure test, so that the power requirement of the driver that realizes vertical movement in the moving pressure rod mechanism 3 is low, and it can be configured as a small driver, which is suitable for high-speed operation and test environment. In addition, since the pressure on the moving pressure rod mechanism 3 is transmitted along the direction from the pressure receiving surface 3411 to the first pressure surface 3431, the moving pressure rod mechanism 3 will not bend during the pressing process, and the test pressure can evenly act on the electronic components , to ensure the test accuracy.

In the above process, the push-down test mechanism 2 and the movable push-bar mechanism 3 can jointly pressurize the electronic components, or the movable push-bar mechanism 3 can be in a shutdown state, and only the push-down test mechanism 2 can be used to provide the push-down force.

In some embodiments, one of the end of the pressing test mechanism 2 having the second pressing surface 221 and the end of the moving pressing rod mechanism 3 having the pressing surface 3411 is provided with the electromagnet 4 , and the other is provided with an electromagnet 4 . As for the magnetic element 5 that is attracted to the electromagnetic element 4, when the second pressing surface 221 is in contact with the pressure-receiving surface 3411, the electromagnetic element 4 and the magnetic element 5 can be attracted to each other to ensure that the pressing test mechanism 2 and the moving pressure rod are pressed down. The connection stability of the mechanism 3, especially when there is a certain height difference between the moving and pressing rod mechanism 3 and the test area 8, such as the failure of the moving and pressing rod mechanism 3 causes the drive of the vertical movement to be powered off, the electromagnet 4 and the magnetic element The adsorption force between 5 can effectively prevent the moving and pressing rod mechanism 3 from falling.

The operator can control whether the electromagnet 4 attracts the magnetic attraction 5 by controlling the electrification state of the electromagnet 4, so as to realize the rapid attraction and separation of the pressing test mechanism 2 and the moving pressure rod mechanism 3.

According to the size of the adsorption area and the adsorption strength, one or more electromagnetic parts 4 and 5 can be configured. In order to reduce the space occupied by the electromagnetic parts 4 and 5 Embedded installation.

In at least one embodiment, the electromagnet 4 may be an electromagnet, and the magnetic attraction 5 may be an iron block.

The structure of the pressing test mechanism 2 will be described in detail below:

In some embodiments, as shown in FIG. 2 , the pressing test mechanism 2 includes a first bracket assembly 21 , a first driving assembly and a pressing rod 22 ; the first bracket assembly 21 is installed on the detection platform 1 , and the first bracket assembly 21 It plays the role of supporting and raising the first driving assembly and the pressing rod 22; The second pressing surface 221 ; the first driving component is mounted on the first bracket component 21 and connected with the top end of the pressing rod 22 , and the first driving component is used to drive the pressing rod 22 to move relative to the first bracket component 21 . The above-mentioned downward pressure testing mechanism 2 has a simple structure, and can provide a directional downward pressure for the moving pressure rod mechanism.

The first bracket assembly 21 may include a first mounting plate 211, a first supporting frame 212, a second mounting plate 213 and a second supporting frame 214, the first mounting plate 211 is located above the second mounting plate 213, and the two They are connected by two spaced first support frames 212, the top end of the second support frame 214 is connected to the side of the second mounting plate 213 away from the first support frame 212, and the bottom end of the second support frame 214 is fixed on the side of the second mounting plate 213. On detection platform 1.

Specifically, the first support frame 212 has a plate-like structure, and the first support frame 212 is arranged vertically. In order to reduce its weight, it is provided with a hollow structure; the second support frame 214 has a "ji"-shaped structure, and to ensure Its own structure is stable, and reinforcement plates are installed on both sides.

It should be noted that any structure that can drive the pressing rod 22 to move relative to the first bracket assembly 21 can be the first driving assembly mentioned in the above embodiment. For example: the first drive component is a linear motion unit such as a hydraulic cylinder and a linear motor, and the first drive component can also be a combination of a unit that performs rotational motion such as a motor and a connecting rod or a screw nut, etc. The unit is capable of converting the rotary motion of the motor into linear motion.

In some embodiments, as shown in FIG. 2 , the first drive assembly includes a first power assembly 23 and a first transmission mechanism, the first power assembly 23 is mounted on the first bracket assembly 21 ; the first transmission structure includes a The power assembly 23 is drive-connected to the first rotating rod 25 . The first rotating rod 25 is rotatably connected to the first bracket assembly 21 and is threadedly connected to the pressing rod 22 . During use, the first power assembly 23 can drive the first rotating rod 25 to rotate, thereby driving the pressing rod 22 to move relative to the first bracket assembly 21 .

The first power assembly 23 can be a motor, and can be installed on the first fixing plate 215 on the first mounting plate 211. The first fixing plate 215 is fixed on the top surface of the first mounting plate 211. The first power assembly The housing of 23 extends from the first fixing plate 215 to below the first mounting plate 211 , and the power output shaft of the first power assembly 23 extends through the first fixing plate 215 to above the first mounting plate 211 .

The first transmission mechanism may include a first transmission assembly 24 and a second transmission assembly, wherein:

The second transmission assembly is located at the side of the first power assembly 23. The second transmission assembly includes a first rotating rod 25 and a first sleeve 26 threadedly connected to the first rotating rod 25. The first rotating rod 25 is rotatably connected to the first rotating rod 25. On a bracket assembly 21 , the first set piece 26 is fixedly mounted on or integrally formed on the pressing rod 22 , that is, the first rotating rod 25 is threadedly connected to the pressing rod 22 through the first set piece 26 . When the first rotating rod 25 rotates relative to the first bracket assembly 21 , the first sleeve 26 rotates relative to the first rotating rod 25 and simultaneously moves relative to the first rotating rod 25 in the vertical direction, so as to realize the movement of the pressing rod 22 Moving up and down.

Specifically, as shown in FIG. 3 , a limiting member 216 is installed on the first mounting plate 211 , and the top end of the first rotating rod 25 is connected to the first transmission assembly 24 through the limiting member 216 . A mounting block 218 is fixedly mounted on the second mounting plate 213, and the mounting block 218 penetrates the pressing rod 22 along the sliding direction perpendicular to the pressing rod 22, so that the sliding stroke of the pressing rod 22 can be limited. The bottom end of the first rotating rod 25 can extend into the pressing rod 22 and is rotatably connected with the mounting block 218 through the first bearing 217. Since the mounting block 218 is fixed on the second mounting plate 213, the arrangement of the first bearing 217 can be reduced. The friction between the small first rotating rod 25 and the mounting block 218 when the small first rotating rod 25 rotates, and the above-mentioned mounting block 218 can also cooperate with the limiting member 216 to realize the axial limit of the first rotating rod 25 .

Specifically, the first set piece 26 can be a nut, the first rotating rod 25 can be a screw rod, and the screw rod is centrally arranged on the pressing rod 22.

The first transmission assembly 24 is connected between the first power assembly 23 and the first rotating rod 25 for transmitting the power of the first power assembly 23 to the first rotating rod 25 so that the power output shaft of the first power assembly 23 The first rotating rod 25 and the first rotating rod 25 can be arranged not coaxially, and the installation positions of the first power assembly 23 and the first rotating rod 25 can be arranged more reasonably, such as shown in FIG. , the structure is more compact.

It should be noted that any structure capable of transmitting the power of the first power assembly 23 to the first rotating rod 25 can be the first transmission assembly 24 mentioned in the above embodiment, for example, the first transmission assembly includes a gear transmission unit , belt drive unit, chain drive unit, etc.

Taking FIG. 2 as an example for specific description, the first transmission assembly 24 includes a second driving wheel 241 , a second timing belt 242 and a second driven wheel 243 , and the second driving wheel 241 is fixedly connected to the power output shaft of the first power assembly 23 , the second driven wheel 243 is fixedly connected with the first rotating rod 25, the second timing belt 242 is connected between the second driving wheel 241 and the second driven wheel 243, when the power output shaft of the first power assembly 23 rotates, the first The two driving pulleys 241 rotate accordingly and drive the second driven pulley 243 to rotate through the second synchronous belt 242 , and finally realize the rotation of the first rotating rod 25 .

The pressing rod 22 can be slidably connected to the second supporting frame 214 in various ways. In some embodiments, two symmetrically arranged third mounting plates are fixed on the second supporting frame 214 . The third mounting plate is connected to the pressing rod 22 . One of them is provided with at least one guide rail 222 , and the other is provided with at least one slider 219 .

Taking FIG. 2 as an example for specific description, each third mounting plate is provided with two sliders 219, a total of four sliders 219, and the outer surface of the pressure rod 22 is provided with a one-to-one sliding connection with the four sliders 219 The four guide rails 222 are respectively located on the left and right sides of the pressing rod 22 .

In some embodiments, similar to the pressed state of the moving and pressing rod mechanism 3 , the transmission direction of the pressure on the pressing rod 22 by the first sleeve member 26 acting on the pressing rod 22 is perpendicular to the second pressing surface 221 . , the pressure of the first sleeve 26 acting on the pressure rod 22 is opposite to the reaction force of the pressure receiving surface 3411 , so that the pressure rod 22 will not be subjected to bending moment loads.

Specifically, the second pressing surface 221 has a geometric center, and the axis of the first rotating rod 25 passes through the geometric center of the second pressing surface 221 , so that the second pressing surface 221 uniformly applies force to the pressing surface 3411 from the geometric center .

In addition, as shown in FIG. 3 , the second pressing surface 221 of the pressing rod 22 is embedded with electromagnets 4 , and three electromagnets are arranged. 4 is at the geometric center of the second pressing surface 221 .

In some embodiments, as shown in FIG. 1 , a channel 6 is formed between the pressing test mechanism 2 and the detection platform 1 , the moving pressure rod mechanisms 3 are arranged in an even number and are divided into two rows, and the two rows of mobile pressing rod mechanisms 3 It is symmetrically installed on the detection platform 1 and penetrates the channel 6 . The above arrangement enables the pressing down test mechanism 2 to be erected above the two rows of moving pressure rod mechanisms 3 , so that it can be more stable and more convenient to apply pressure to the moving pressure rod mechanisms 3 .

During operation, the two moving pressure-bar mechanisms 3 can be moved to directly below the pressing-down testing mechanism 2 in turn. At the same time, it moves directly below the push-down test mechanism 2 , and the push-down test mechanism 2 simultaneously pressurizes the two moving pressure-bar mechanisms 3 . When the moving and pressing rod mechanisms 3 are configured as three, four, five, etc., the pressing method is the same as above.

The structure of the moving pressure rod mechanism 3 is described in detail below:

In some embodiments, as shown in FIG. 1 , the moving and pressing rod mechanism 3 includes a second drive assembly 31 , a second bracket assembly 32 , a third drive assembly 33 and a moving member 34 ; the second drive assembly 31 is installed on the detection platform 1 The second bracket assembly 32 is connected with the second drive assembly 31, the second bracket assembly 32 is connected in parallel with the detection platform 1, and the sliding direction can be perpendicular to the pressing direction of the pressing test mechanism 2. The second driving assembly 31 is used for Drive the second bracket assembly 32 to slide relative to the detection platform 1, so that the bottom end of the moving member 34 is facing the test area 8 or the reclaiming area; the third driving assembly 33 is installed on the second bracket assembly 32 and is connected with the moving member 34; The top end of the moving member 34 has a pressing surface 3411, the bottom end of the moving member 34 has a first pressing surface 3431, the moving member 34 is vertically slidably connected with the second bracket assembly 32, and the third driving assembly 33 is used to drive the moving member 34 slides relative to the second bracket assembly 32 to enable the moving member 34 to access electronic components.

In the above-mentioned moving and pressing rod mechanism 3, it can move longitudinally in the horizontal direction, so the electronic components can be loaded laterally through the lateral feeding assembly 7, and there is no need to install a lateral driving mechanism on the detection platform 1, which greatly increases the The simplified device structure improves the response rate and is more suitable for high-speed operation test environment.

In some embodiments, the detection platform 1 is provided with a plurality of sliding rails 11 or sliding grooves in the longitudinal direction, and the second bracket assembly 32 in each moving and pressing rod mechanism 3 is slidably connected with each sliding rail 11 or the sliding grooves, The sliding rail 11 and the sliding groove can guide the movement of the second bracket assembly 32 , thereby ensuring the stability of the moving and pressing rod mechanism 3 when it moves in the longitudinal direction.

In at least one embodiment, the detection platform 1 is provided with two sliding rails 11 in the longitudinal direction, and two moving and pressing rod mechanisms 3 are configured. The rails 11 are slidably connected, and the two sliding rails 11 can stably support the second bracket assembly 32. At the same time, a through hole can be opened on the detection platform 1 between the two sliding rails 11, and the two movable pressing rod mechanisms 3 can pass through. It extends down to the bottom of the detection platform 1 through the through hole.

In addition, since the detection device in the above-mentioned embodiment is provided with the push-down test mechanism 2 , the push-down test mechanism 2 can provide a strong push-down force for the movable push-bar mechanism 3 , so that the pressure of the third driving component 33 in the movable push-bar mechanism 3 is affected. The driving power requirement is relatively low, which reduces the load of the moving and pressing rod mechanism 3. At the same time, since the second bracket assembly 32 in the moving and pressing rod mechanism 3 can be slidably connected with a plurality of slide rails 11 or sliding grooves on the detection platform 1, the second bracket The weight of the third drive assembly 33 and the moving member 34 on the assembly 32 directly acts on the plurality of slide rails 11 or between the sliding grooves, the center of gravity of the moving and pressing rod mechanism 3 is stable, the operation is stable, and the structure of the moving and pressing rod mechanism 3 can be configured. It is simpler and does not require additional configuration of auxiliary mechanisms.

The structure of the second driving assembly 31 will be specifically described below:

It should be noted that any structure that can drive the second bracket assembly 32 to slide relative to the detection platform 1 can be the second drive assembly 31 mentioned in the above embodiment, for example, the second drive assembly 31 is a hydraulic cylinder, a linear motor As a linear motion unit, the second drive assembly 31 can also be a combination of a unit that performs rotational motion such as a motor and a unit such as a connecting rod or a lead screw nut, and the connecting rod or lead screw nut can convert the rotating motion of the motor into linear motion. .

In some embodiments, as shown in FIG. 4 , the second driving assembly 31 includes a second power assembly 311 and a second transmission structure, the second power assembly 311 is installed on the detection platform 1 ; the second transmission structure includes a second rotating rod 313 and a second set of fittings 314 threadedly connected to the second rotating rod 313 , the second rotating rod 313 is rotatably connected to the detection platform 1 , and the second set of fittings 314 is fixedly mounted on the second bracket assembly 32 . In use, the second power assembly 311 drives the second rotating rod 313 to rotate, so that the second sleeve member 314 drives the second bracket assembly 32 to slide relative to the detection platform 1 .

Wherein, the second power component 311 can be a motor, a motor base 12 is fixed on the detection platform 1, a motor sheet metal 13 is fixed on the motor base 12, and the position of the motor sheet metal 13 relative to the motor base 12 is adjustable in the lateral direction. The flange surface of the second power assembly 311 is fixed on the motor sheet metal 13 .

The second transmission structure may include a third transmission assembly 312 and a fourth transmission assembly, wherein:

The fourth transmission assembly is located at the side of the second power assembly 311. The fourth transmission assembly includes a second rotating rod 313 and a second sleeve 314 threadedly connected to the second rotating rod 313. The second rotating rod 313 is rotatably connected to the detection On the platform 1 , the second set of devices 314 is fixedly mounted on the second bracket assembly 32 , and the second set of devices 314 in each moving and pressing rod mechanism 3 can pass through the second bracket assembly 32 and each slide rail 11 or slide. Slot sliding connection. When the second rotating rod 313 rotates relative to the detection platform 1 , the second sleeve member 314 rotates relative to the second rotating rod 313 and simultaneously moves relative to the second rotating rod 313 in the longitudinal direction, thereby realizing the up and down movement of the second bracket assembly 32 .

In at least one embodiment, a plurality of slide rails 11 are fixedly mounted on the inspection platform 1 , and the second bracket assembly 32 may be recessed with a slot for matching with the slide rails 11 , or the second bracket assembly 32 may be fixedly installed with The slider, the slider is concavely provided with a chute which is matched with the sliding rail 11 .

In addition, as shown in FIG. 4 , a first spacer block 14 and a second spacer block 15 are installed on the detection platform 1 , a limit block 16 is fixedly installed on the first spacer block 14 , and a support block is fixedly installed on the second spacer block 15 17. One end of the second rotating rod 313 is inserted into the limiting block 16 and is rotatably connected with the limiting block 16. The limiting block can limit the axial position of the second rotating rod 313, and the other end of the second rotating rod 313 is inserted Installed in the support block 17 and rotatably connected with the support block 17 , the support block 17 mainly plays the role of supporting the second rotating rod 313 , thereby ensuring the rotational stability of the second rotating rod 313 .

The second rotating rod 313 can be a screw rod, and the second set member 314 can be a nut. A connecting plate 3141 can be fixed on the nut, and the nut can be fixedly connected to the second bracket assembly 32 through the connecting plate 3141 .

The third transmission assembly 312 is connected between the second power assembly 311 and the second rotating rod 313, and is used to transmit the power of the second power assembly 311 to the second rotating rod 313. The structure and function of the third transmission assembly 312 are the same as those of the third transmission assembly 312 The structure and function of a transmission assembly 24 are similar, and in order to save space, detailed description is omitted here.

The structure of the second bracket assembly 32 will be specifically described below:

The second bracket assembly 32 includes a fourth mounting plate 321, a slider fixing plate 322 and a second fixing plate 323. The slider fixing plate 322 is fixedly mounted on the bottom surface of the fourth mounting plate 321. The slider fixing plate 322 can be configured as two , the second fixing plate 323 is fixedly mounted on the top surface of the fourth mounting plate 321 . The structure of the third drive assembly 33 will be specifically described below:

The optional structural types of the third driving assembly 33 are similar to the optional structural types of the first driving assembly, and to save space, they will not be illustrated here.

In some embodiments, as shown in FIG. 5 , the third drive assembly 33 includes a third power assembly 331, a fifth transmission assembly 332 and a sixth transmission assembly, wherein:

The third power assembly 331 is mounted on the top of the second bracket assembly 32, and can be specifically mounted on the fourth mounting plate 321 through the second fixing plate 323. The shell of the third power assembly 331 is located above the second fixing plate 323, and the third The power output shaft of the power assembly 331 is connected to the fifth transmission assembly 332 above the fourth mounting plate 321 through the second fixing plate 323 .

As shown in FIG. 6 , the sixth transmission assembly is located at the side of the third power assembly 331 . The sixth transmission assembly includes a moving rod 333 and a rotating member 334 threadedly connected to the moving rod 333 , and the rotating member 334 rotates with the second bracket assembly 32 Connected, the moving rod 333 is fixed on the moving member 34, when the rotating member 334 rotates relative to the second bracket assembly 32, the moving rod 333 rotates relative to the rotating member 334 and moves relative to the rotating member 334 in the vertical direction, thereby realizing Up and down movement of the moving member 34 .

Specifically, the rotating member 334 can be rotatably connected with the fourth mounting plate 321 , the rotating member 334 can be a nut, the moving rod 333 can be a screw rod, and the screw rod is centrally arranged on the moving member 34 .

Both the pressure receiving surface 3411 and the first pressure surface 3431 have geometric centers, and the axis of the moving rod 333 passes through the geometric centers of the pressure receiving surface 3411 and the first pressure surface 3431, so that the first pressure surface 3431 is evenly directed toward the center from the geometric center. The electronic components exert force to overcome the problem of low test yield caused by uneven test pressure.

The fifth transmission assembly 332 is connected between the third power assembly 331 and the rotating member 334 for transmitting the power of the third power assembly 331 to the rotating member 334. The arrangement is more flexible, so that the structure of the moving and pressing rod mechanism 3 is more compact.

The above-mentioned third drive assembly 33 uses the rotating member 334 to be rotatably connected to the second bracket assembly 32, and the moving rod 333 cooperates with the rotating member 334 to move up and down, so that the top end of the moving member 34 can be avoided, so that the top end of the moving member 34 can be connected with the rotating member 34. The test mechanism 2 is pressed down, and the fixed installation surface of the third power assembly 331 is used as the base surface. Since the top of the moving member 34 can be higher than the base surface during the movement of the moving member 34, the installation of the third power assembly 331 on the testing platform 1 The height can be set lower, which is convenient for the arrangement of the upper pressing test mechanism 2 .

The optional structural types of the fifth transmission assembly 332 are similar to the optional structural types of the first transmission assembly 24 , and to save space, they will not be described one by one here.

In some embodiments, as shown in FIGS. 5 and 6 , the fifth transmission assembly 332 includes a first driving pulley 3321 , a first timing belt 3322 and a first driven pulley 3323 , the first driving pulley 3321 and the third power assembly 331 The power output shaft is fixedly connected, the first driven wheel 3323 is fixed with the rotating member 334 and has a through hole for the moving rod 333 to pass through, the first driven wheel 3323 can be located above the rotating member 334, and the first timing belt 3322 is connected to Between the first driving wheel 3321 and the first driven wheel 3323, when the power output shaft of the first power assembly 23 rotates, the first driving wheel 3321 rotates along with it and drives the first driven wheel 3323 to rotate through the second timing belt 242, Finally, the rotation of the rotating member 334 is realized.

The moving member 34 can be slidably connected with the slider fixing plate 322 in the second bracket assembly 32. The sliding connection structure between the moving member 34 and the slider fixing plate 322 is similar to the sliding connection structure between the pressing rod 22 and the first bracket assembly 21, and is To save space, detailed description is omitted here.

In some embodiments, as shown in FIG. 6 , the moving member 34 includes an arm body 341 , an adapter block 342 and an adapter plate 343 , and the bottom end of the arm body 341 is connected to the adapter plate 343 through the adapter block 342 . The bottom surface of the plate 343 is the first pressing surface 3431 , and the magnetic attraction member 5 can be embedded on the pressing surface 3411 .

The adapter block 342 can be located on the side of the arm body 341, the side of the adapter block 342 can be fixed with the arm body 341 through bolts and other connectors, and the top surface of the adapter block 342 can be connected to the adapter plate 343 through bolts and other connectors. Fixed connection, such arrangement can facilitate the connection between the adapter plate 343 and the arm body 341 .

The adapter block 342 may include a main board body and a support plate extending obliquely downward from the main board body in two directions, the two support boards are symmetrically arranged with respect to the rectangular board, and the side surface of the rectangular board is fixed to the arm body 341 through a connecting piece, The top surface of the support plate is fixedly connected with the adapter plate 343 through the connecting piece.

On the basis of the above embodiment, in order to make the structure of the moving and pressing rod mechanism 3 more compact, the sixth transmission assembly is fixedly connected to the arm body 341, the arm body 341 has an installation channel 3412, and the sixth transmission assembly is connected to at least part of the fifth transmission assembly. The drive assembly 332 is located within the mounting channel 3412. Specifically, as shown in FIG. 6 , the movable rod 333 , the rotating member 334 and the first driven wheel 3323 are located in the installation channel 3412 .

Another solution of the semiconductor electronic component testing device is described below:

In some embodiments, as shown in FIG. 1 , at least one set of lateral feeding components 7 is provided below the detection platform 1 , and the lateral feeding components 7 are matched with the moving pressing rod mechanism 3 in one-to-one correspondence. The feeding direction is perpendicular to the longitudinal direction.

The transverse feeding assembly 7 may include a track and a transfer plate for carrying electronic components, and two transfer plates may be slidably connected on the track, so as to realize continuous feeding of the electronic components.

In at least one embodiment, the transverse feed assemblies 7 are configured into two groups, and the two groups of transverse feed assemblies 7 are located on two sides of the test area 8 respectively. During operation, the lateral feeding assembly 7 can move the electronic components to be tested to both sides of the test area 8 or remove the electronic components that have completed the test in time, and the moving pressure rod mechanism 3 can move the electronic components on the lateral feeding assembly 7 The components are transported to the test area 8 or the tested electronic components are transported to the transverse feeding assembly 7, and the two moving and pressing rod mechanisms 3 can take turns to test the electronic components, and can also test the electronic components simultaneously.

To sum up, the semiconductor electronic component testing device provided by the above embodiments has the following advantages:

1), is provided with a pressure test mechanism 2, the pressure test mechanism 2 can provide a strong downward pressure for the mobile pressure rod mechanism 3, and at the same time, it can also cooperate with the mobile pressure rod mechanism 3 to jointly pressurize the electronic components to achieve high pressure detection. , and the power requirement of the driver in the mobile pressing rod mechanism 3 is low, the load of the mobile pressing rod mechanism 3 is reduced, and it is suitable for a high-speed operation test environment;

2) Since the transmission direction of the pressure on the moving pressure rod mechanism 3 is along the direction of the pressure receiving surface 3411 to the first pressure surface 3431, the transmission direction of the pressure acting on the pressure rod 22 by the first set piece 26 on the pressure rod 22 Perpendicular to the second pressing surface 221, during the test, the pressing test mechanism 2 and the moving pressure rod mechanism 3 will not be subjected to bending moment loads, so that the test pressure acts on the electronic components more uniformly and solves the problem caused by the uneven test pressure. The problem of low test yield.

3) The detection platform 1 of the semiconductor electronic component detection device provided by the above-mentioned embodiment is not provided with a fixed side plate structure, the first rotating rod 25 is centrally arranged on the pressing rod 22, and the moving rod 333 is in the middle of the moving member 34. The central layout eliminates the horizontal guide rail connecting the vertical drive system and the test arm in the existing test device, and instead the screw rod is directly connected with the moving member 34 and the pressing rod 22 . In this way, one can reduce the original side plate structure components, reduce the number of guide rails, and reduce the workload; the two existing test devices need to assemble each module separately, and then transport it to the basic frame of the entire test module, and finally continue to debug each module. The matching accuracy between the modules, in the semiconductor electronic component detection device provided by the above embodiment, because the screw rod is directly connected with the moving member 34 and the pressing rod 22, the screw rod is integrated with the moving member 34 and the pressing rod 22, and a single The module can be directly installed on the base frame, which has the advantages of simple structure and easy assembly, which helps to improve the overall assembly accuracy.

An embodiment of the second aspect of the present invention provides a semiconductor electronic component detection method, comprising:

Each mobile pressing rod mechanism 3 transports the electronic components to be tested to the test area in turn, and presses the testing mechanism 2 down one moving pressing rod mechanism 3 each time during the test;

Alternatively, each moving and pressing rod mechanism 3 simultaneously transfers the electronic components to be tested to the test area, and during the test, the testing mechanism 2 is pressed down and each moving and pressing rod mechanism 3 is simultaneously pressed down.

The semiconductor electronic component detection method provided by the embodiment of the second aspect of the present invention has two usage states. The pressing down test mechanism 2 can pressurize each moving pressure rod mechanism 3 one by one, or can simultaneously apply pressure to each moving pressure rod mechanism 3 pressure, so as to realize the one-by-one inspection and batch inspection of electronic components.

The operation process of the semiconductor electronic component testing apparatus will be described in detail below.

The single-arm alternate pressing test process is as follows:

The first step: each component moves to the initialization position.

Before the whole test device is started, the first moving and pressing rod mechanism 3a and the second moving pressing rod mechanism 3b are moved upward to the vertical initialization position, and then the first transverse feed assembly 7a and the second transverse feed assembly 7b are moved horizontally to their respective initialization positions. The positions are respectively referred to as the material feed position of the first transverse feed component and the feed level of the second transverse feed component, and the test mechanism 2 is pressed down to be activated. The initialization position is shown in Figure 7 and Figure 8.

Step 2: The second moving and pressing rod mechanism 3b carries the electronic component to be tested for testing.

The first lateral feeding assembly 7a moves to the discharging position, and then the second moving and pressing rod mechanism 3b moves vertically downward to the second lateral feeding assembly 7b to absorb the electronic components to be tested. Then, after the moving member 34 of the second moving and pressing rod mechanism 3b moves vertically upward to a safe height, the second driving assembly 31 in the second moving and pressing rod mechanism 3b is opened and moved, and the second moving and pressing rod mechanism 3b is moved horizontally to align the test After the zone 8, the second moving and pressing rod mechanism 3b starts to move down to the test zone 8, and the pressing test mechanism 2 moves vertically downward while moving horizontally, until the second moving pressing rod mechanism 3b is in contact with the pressing test mechanism 2. Then start the test. During the process of the horizontal movement of the second moving pressing rod mechanism 3b to align with the test area 8, the second lateral feeding assembly 7b will move to the initial feeding position to be ready for feeding, and at the same time, the first moving pressing rod mechanism 3a will complete the process from the first moving rod mechanism 3a. The action process of picking up the electronic components to be tested in a lateral feeding assembly 7a, and staying above the first lateral feeding assembly 7a to wait for the second moving and pressing rod mechanism 3b to complete the electronic component testing. The schematic diagrams of the testing process are shown in Figure 9 and Figure 10.

Step 3: The first moving pressing rod mechanism 3a carries the electronic component to be tested for testing.

After the test of the second moving and pressing rod mechanism 3b is completed, the pressing and testing mechanism 2 moves vertically upward, and at the same time, the second moving pressing rod mechanism 3b also rises, carries the tested electronic components and leaves the test area 8, and moves horizontally to the second horizontal entrance. The electronic components that have been tested are placed above the feeding component 7b and lowered, and the second lateral feeding component 7b transports the electronic components that have been tested to the discharge position, and at the same time transports the next round of electronic components to be tested to the second moving pressing rod mechanism 3b Directly below. At the same time, the first moving pressing rod mechanism 3a carries the electronic components to be tested and runs to the test area 8 for testing, and the second moving pressing rod mechanism 3b sucks the electronic components to be tested from the second transverse feeding assembly 7b and waits for the first Two rounds of electronic component testing. The test process is shown in Figure 11 and Figure 12.

Step 4: Repeat the second and third steps above, and the cycle test will be performed.

The process of pressing and measuring both arms at the same time is as follows:

The first step: each component moves to the initialization position.

Before the whole test device is started, the first moving and pressing rod mechanism 3a and the second moving pressing rod mechanism 3b are moved upward to the vertical initialization position, and then the first transverse feeding assembly 7a and the second transverse feeding assembly 7b are moved horizontally to their respective initialization positions. The positions are respectively referred to as the first lateral feeding component feeding level and the second lateral feeding component feeding position. At this time, the first moving and pressing rod mechanism 3a is located directly above the first lateral feeding assembly 7a, and the second moving pressing rod mechanism 3b is located directly above the second lateral feeding assembly 7b. The initialization position is shown in Figures 7 and 8. Show.

The second step: the first moving and pressing rod mechanism 3a and the second moving pressing rod mechanism 3b simultaneously take out the electronic components, and simultaneously run to the test area 8 for a pressing test.

The first lateral feeding assembly 7a and the second lateral feeding assembly 7b carry the electronic components to be tested and run to the reclaiming positions of the two sets of moving and pressing rod mechanisms, and the first and second moving and pressing rod mechanisms 3a and 3b descend simultaneously. The electronic components are sucked up, then lifted, and then driven to the pressure measuring position by the two second driving assemblies 31 respectively. The pressing rod mechanism 3b and the first moving pressing rod mechanism 3a begin to descend. When the two sets of moving pressing rod mechanisms reach the pressure measuring position, the pressing test mechanism 2 and the two sets of pressing rod assemblies just complete the docking and press down the test electronic components. At the same time, the first lateral feeding assembly 7a and the second lateral feeding assembly 7b simultaneously return to their respective initial positions to take materials, and receive electronic components waiting for the completion of the test. Schematic diagrams are shown in Figures 13 and 14.

Step 3: The first moving and pressing rod mechanism 3a and the second moving pressing rod mechanism 3b simultaneously transport the tested electronic components to the first and second lateral feeding components 7a and 7b, and absorb new components to be Measuring electronic components.

After that, the steps from the second to the third step are repeated as a whole to perform the cycle test.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features thereof can be equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present invention. scope.

Claims (11)

1. A detection device for semiconductor electronic components, characterized in that it comprises a detection platform (1), a pressing test mechanism (2) and at least one moving pressure rod mechanism (3); The moving pressure rod mechanism (3) is mounted on the detection platform (1) and is used for transport and pressure measurement of electronic components, and the moving pressure rod mechanism (3) has a pressure receiving surface (3411) and is used for pressure measurement. the first pressing surface (3431) of the electronic component, the first pressing surface (3431) is located directly below the pressing surface (3411); The push-down test mechanism (2) is mounted on the detection platform (1) and can reciprocate relative to the test platform (1), and the push-down test mechanism (2) has a second pressing surface (221). ), the downward pressure test mechanism (2) is used to apply downward pressure to the pressure receiving surface (3411) of the moving pressure rod mechanism (3) through the second pressure surface (221), and the movement The pressure on the pressure lever mechanism (3) is transmitted along the direction in which the pressure receiving surface (3411) points to the first pressure surface (3431). 2 . The semiconductor electronic component testing device according to claim 1 , wherein the pressing test mechanism ( 2 ) has an end portion of the second pressing surface ( 221 ) and the moving pressing rod mechanism ( 2 . 3 . 3) One of the ends having the pressure-receiving surface (3411) is provided with an electromagnetic member (4), and the other is provided with a magnetic attraction member (5) for attracting with the electromagnetic member (4). 3 . The semiconductor electronic component testing device according to claim 1 , wherein the pressing test mechanism ( 2 ) comprises a first bracket assembly ( 21 ), a first driving assembly and a pressing rod ( 22 ), and the The first bracket assembly (21) is mounted on the detection platform (1), the pressing rod (22) is slidably connected with the first bracket assembly (21) in the vertical direction, and the pressing rod (22) is The bottom end has the second pressing surface (221), the first driving component is mounted on the first bracket component (21) and is connected with the top end of the pressing rod (22), the first driving component The assembly is used to drive the pressing rod (22) to move relative to the first bracket assembly (21). 4. The semiconductor electronic component testing device according to claim 3, wherein the first drive assembly comprises a first power assembly (23) and a first transmission structure; the first power assembly (23) is mounted on the first bracket assembly (21); The first transmission structure includes a first rotating rod (25) drivingly connected with the first power assembly (23), and the first rotating rod (25) is rotatably connected to the first bracket assembly (21) and is threadedly connected with the pressing rod (22). 5 . The semiconductor electronic component testing device according to claim 1 , wherein a channel ( 6 ) is formed between the pressing test mechanism ( 2 ) and the testing platform ( 1 ), and the moving pressing rod The mechanisms (3) are arranged in an even number and are divided into two columns, and the two columns of moving and pressing rod mechanisms (3) are symmetrically mounted on the detection platform (1) and pass through the channel (6). 6 . The semiconductor electronic component testing device according to claim 1 , wherein the moving and pressing rod mechanism ( 3 ) comprises a second driving component ( 31 ), a second supporting component ( 32 ), and a third driving component ( 6 . 7 . 33) and a moving member (34); the second drive assembly (31) is mounted on the detection platform (1); The second bracket assembly (32) is connected with the second drive assembly (31), and the second bracket assembly (32) is connected in parallel with the detection platform (1) in a sliding manner; the third drive assembly (33) is mounted on the second bracket assembly (32) and connected with the moving member (34); The top end of the moving member (34) has the pressure receiving surface (3411), and the bottom end of the moving member (34) has the first pressing surface (3431). The direction is slidably connected to the second bracket assembly (32), and the third driving assembly (33) is used to drive the moving member (34) to slide relative to the second bracket assembly (32). 7. The semiconductor electronic component testing device according to claim 6, wherein the second driving assembly (31) comprises a second power assembly (311) and a second transmission structure; The second power assembly (311) is mounted on the detection platform (1); The second transmission structure includes a second rotating rod (313) and a second sleeve (314) threadedly connected to the second rotating rod (313), and the second rotating rod (313) is rotatably connected to the second rotating rod (313). On the detection platform (1), the second set piece (314) is fixedly mounted on the second bracket assembly (32). 8 . The semiconductor electronic component testing device according to claim 7 , wherein a plurality of sliding rails ( 11 ) or sliding grooves are longitudinally provided on the testing platform ( 1 ), and each of the moving and pressing rod mechanisms The second set piece (314) in (3) is slidably connected to each of the sliding rails (11) or the sliding grooves through the second bracket assembly (32). 9. The semiconductor electronic component testing device according to claim 6, wherein the third driving assembly (33) comprises a third power assembly (331), a fifth transmission assembly (332) and a sixth transmission assembly; The third power assembly (331) is mounted on the top end of the second bracket assembly (32); The sixth transmission assembly is located at the side of the third power assembly (331), and the sixth transmission assembly includes a moving rod (333) and a rotating member (334) threadedly connected with the moving rod (333), The rotating member (334) is rotatably connected with the second bracket assembly (32), and the moving rod (333) is fixedly mounted on the moving member (34); The fifth transmission assembly (332) is connected between the third power assembly (331) and the rotating member (334) for transmitting the power of the third power assembly (331) to the rotation pieces (334). 10 . The semiconductor electronic component testing device according to claim 9 , wherein the moving member ( 34 ) comprises an arm body ( 341 ), an adapter block ( 342 ) and an adapter plate ( 343 ), the moving member ( 343 ), 10 . The rod (333) is fixedly connected with the arm body (341), the arm body (341) has an installation channel (3412), and the sixth transmission assembly and at least part of the fifth transmission assembly (332) are located at the In the installation channel (3412), the bottom end of the arm body (341) is connected to the adapter plate (343) through the adapter block (342), and the bottom surface of the adapter plate (343) is the Describe the first pressing surface (3431). 11. A semiconductor electronic component detection method, using the semiconductor electronic component detection device according to claims 1-10, the semiconductor electronic component detection device comprising a plurality of the moving pressing rod mechanisms (3), characterized in that: include: Each of the moving pressure-bar mechanisms (3) transports the electronic components to be tested to the test area in turn, and the push-down test mechanism (2) presses down one of the moving pressure-bar mechanisms (3) each time during testing; Alternatively, each of the moving and pressing rod mechanisms (3) simultaneously transports the electronic components to be tested to the test area, and the pressing down testing mechanism (2) simultaneously presses down each of the moving and pressing rod mechanisms (3) during testing.

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