KR101044622B1 - Semiconductor Chip Bonding Device - Google Patents

Abstract

The present invention relates to a semiconductor chip bonding apparatus, comprising: a semiconductor chip bonding apparatus for transferring a semiconductor chip and bonding the semiconductor chip and a printed circuit board, wherein the semiconductor chip is sucked at an initial position and the semiconductor chip is printed; A chip adsorption unit for releasing the adsorption of the semiconductor chip at a mounting position mounted on a circuit board, a substrate support plate spaced apart from an initial position of the chip adsorption unit, and supporting the printed circuit board, and the chip adsorption unit A chip transfer unit for transferring and a substrate driving unit for transferring or rotating the substrate support plate, wherein the chip adsorption unit comprises: an adsorption unit for adsorbing the semiconductor chip; An elevation driving unit for moving the adsorption unit up and down; A rotation driving unit for rotating the adsorption unit; And driving the elevating driver and the rotary driver in a position control mode to control the position of the semiconductor chip before the semiconductor chip and the printed circuit board are compressed in the mounting position, and the semiconductor chip and the And a mode converter configured to convert the lift driver into a torque control mode in order to control torque applied to the semiconductor chip after the printed circuit board is compressed.

Description

Apparatus for bonding semiconductor chip

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip bonding apparatus, and more particularly, to a semiconductor chip bonding apparatus capable of more precisely aligning and mounting semiconductor chips on a printed circuit board.

In order to use a semiconductor device manufactured on a wafer as a real product, the semiconductor device must be cut into chips, separated from the wafer, and then assembled into a package. The semiconductor package not only mechanically supports and secures the semiconductor chip and protects it from the external environment, but also provides an electrical connection path and a heat dissipation path to the semiconductor chip.

Early semiconductor packages commonly used lead frames as package substrates that mechanically and electrically interconnect semiconductor chips and external systems. However, as the number of input / output pins increases and the operating speed gradually increases, the semiconductor package using the lead frame has reached its limit. So an alternative was developed for the ball grid array package.

The ball grid array package uses a printed circuit board instead of a lead frame as a package substrate, and uses a micro bump instead of an external lead of the lead frame as a connection terminal with an external system. These micro bumps, unlike the external leads, are arranged on the surface of the printed circuit board, so that the micro bumps can adequately respond to the increase in the number of input / output pins and the operating speed.

Since then, various types of semiconductor packages have been developed as the demand for light and simple semiconductor packages increases, and the connection terminals of the semiconductor chips are also microscopic in consideration of the size and thickness of the semiconductor chips and the connection density of the semiconductor chips and the printed circuit board. In addition to the bumps, various types of connection terminals such as pillar bumps are employed.

1 illustrates a semiconductor chip and a printed circuit board.

When the bumps 11 of the semiconductor chip 10 and the printed terminals 21 of the printed circuit board 20 are aligned, and then bonded to each other while maintaining the aligned state, the printed circuit is free from intermediate processes such as wire bonding. The process of mounting the semiconductor chip 10 on the substrate 20 is completed.

However, as the degree of integration of the semiconductor package increases, the high pitch and high density between the bumps 11 of the semiconductor chip 10 require a high level of positional accuracy when mounted on a printed circuit board. In the case of a general semiconductor package, a positional accuracy of about 10 mu m is required. In a semiconductor package with an increased degree of integration, a position accuracy of about 5 mu m is even higher.

Conventional semiconductor chip bonding apparatus does not efficiently control the chip adsorption unit that lowers the semiconductor chip and compresses the printed circuit board in the process of mounting the semiconductor chip on the printed circuit board, so that an assembly error between the semiconductor chip and the printed circuit board is increased. There is a problem that the tolerance of the chip scale package semiconductor chip bonding apparatus is exceeded.

Accordingly, an object of the present invention is to solve such a conventional problem, in the process of mounting the semiconductor chip on the printed circuit board before the semiconductor chip and the printed circuit board is pressed and the semiconductor chip and the printed circuit board are pressed By efficiently controlling the chip adsorption unit for elevating or rotating the semiconductor chip so as to be suitable for each subsequent step, it is possible to reduce the weight of the chip adsorption unit and to minimize the assembly error between the semiconductor chip and the printed circuit board. have.

In order to achieve the above object, the semiconductor chip bonding apparatus of the present invention is a semiconductor chip bonding apparatus for transferring a semiconductor chip and bonding the semiconductor chip and a printed circuit board, the suction of the semiconductor chip at an initial position A chip adsorption unit for releasing the adsorption of the semiconductor chip at a mounting position where the semiconductor chip is mounted on the printed circuit board, a substrate support plate disposed to be spaced apart from an initial position of the chip adsorption unit, and to support the printed circuit board; And a chip transfer unit for transferring the chip adsorption unit, and a substrate driving unit for transferring or rotating the substrate support plate, wherein the chip adsorption unit comprises: an adsorption unit for adsorbing the semiconductor chip; An elevation driving unit for moving the adsorption unit up and down; A rotation driving unit for rotating the adsorption unit; And driving the elevating driver and the rotary driver in a position control mode to control the position of the semiconductor chip before the semiconductor chip and the printed circuit board are compressed in the mounting position, and the semiconductor chip and the And a mode converter configured to convert the lift driver into a torque control mode to control torque applied to the semiconductor chip after the printed circuit board is compressed. The board driving unit includes the printed circuit board in the mounting position. A first driving part which transfers the substrate support plate in a horizontal direction so as to transfer the substrate to the substrate; And a position coupled to the first driving unit, having a higher positional accuracy and a shorter stroke than the first driving unit, and adjusting the position of the printed circuit board in an aligned state by using information of an alignment mark of the printed circuit board. And a second driving part which rotates the substrate support plate in a horizontal direction or rotates about a direction crossing the horizontal direction.

In the semiconductor chip bonding apparatus according to the present invention, Preferably, the lift drive unit, the voice coil motor having a stator and a mover which is installed relative to the stator and the adsorption unit is fixed; And an elastic member for elastically returning the stator and the mover in a direction closer to each other.

In the semiconductor chip bonding apparatus according to the present invention, Preferably, the chip adsorption unit, one end is coupled to the adsorption portion and the other end is coupled to the rotational drive portion, it is installed to slide through the stator, And a shaft portion penetrating the mover and fixed to the mover.

In the semiconductor chip bonding apparatus according to the present invention, preferably, in the position control mode, the mode converter controls the stroke of the mover while changing the length and frequency of the waveform of the alternating current supplied to the mover. In the torque control mode, the torque of the mover is controlled while varying the intensity of the DC current supplied to the mover.

In the semiconductor chip bonding apparatus according to the present invention, preferably, the adsorption unit includes: a first member in contact with the semiconductor chip; a second member spaced apart from the first member; and the first member and the And a spacing controller for adjusting a spacing between the first member and the second member at a local position between the second members.

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In the semiconductor chip bonding apparatus according to the present invention, Preferably, the substrate support plate so that the semiconductor chip can be mounted on the printed circuit board in a state where both contact surfaces of the semiconductor chip and the printed circuit board are parallel to each other. Further comprising a tilt control unit for adjusting the inclination of the.

In the semiconductor chip bonding apparatus according to the present invention, Preferably, the inclination control unit, the first inclined member is provided on each of the lower edge portion of the substrate support plate, one surface is inclined; A second inclined member facing one surface of the first inclined member to be inclined to be in contact with the first inclined member and to be coupled to the substrate support plate; A driving part for pushing the first inclined member toward the second inclined member; And a guide member installed in an up and down direction to guide the movement of the second inclined member pushed up by the first inclined member.

According to the semiconductor chip bonding apparatus of the present invention, in the process of mounting a semiconductor chip on a printed circuit board, the semiconductor chip is suitable for the step before the semiconductor chip and the printed circuit board is pressed and the step after the semiconductor chip and the printed circuit board are pressed. By efficiently controlling the chip adsorption unit for elevating or rotating, the mounting error of the semiconductor chip and the printed circuit board can be minimized.

In addition, according to the semiconductor chip bonding apparatus of the present invention, through the weight reduction of the chip adsorption unit for adsorbing and transporting the semiconductor chip, to minimize the transfer of the other components of the bonding apparatus in the overall process, most of the process only by the transfer of the chip adsorption unit By doing this, the overall process time can be reduced, and the productivity can be improved.

In addition, according to the semiconductor chip bonding apparatus of the present invention, by using the voice coil motor as a lift driver for lifting and lowering the semiconductor chip, it is possible to freely switch between modes such as position control mode and torque control mode.

In addition, according to the semiconductor chip bonding apparatus of the present invention, the inclination of the substrate support plate on which the printed circuit board is mounted so that the semiconductor chip can be mounted on the printed circuit board while both contact surfaces of the semiconductor chip and the printed circuit board are parallel to each other. By providing the inclination adjusting unit to adjust, it is possible to eliminate the error caused by mounting in a state in which both contact surfaces of the semiconductor chip and the printed circuit board are inclined mutually.

In addition, according to the semiconductor chip bonding apparatus of the present invention, by separating the substrate driving unit for transporting or rotating the substrate support plate into two driving units based on the stroke and position accuracy, the cost required for the substrate driving unit can be reduced. .

1 illustrates a semiconductor chip and a printed circuit board;
2 is a view schematically showing a configuration of a semiconductor chip bonding apparatus according to an embodiment of the present invention;
3 is a view illustrating a mode conversion operation principle of a chip adsorption unit in the semiconductor chip bonding apparatus of FIG. 2;
4 is a cross-sectional view of the chip adsorption unit in the semiconductor chip bonding apparatus of FIG.
5 and 6 are views showing the operating principle of the semiconductor chip bonding apparatus of FIG.
7 is a view for explaining the use of the first driving unit and the second driving unit in the semiconductor chip bonding apparatus of FIG.
8 is a view illustrating an operation principle of an inclination controller in the semiconductor chip bonding apparatus of FIG. 2.

Hereinafter, embodiments of the semiconductor chip bonding apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

2 is a view schematically showing the configuration of a semiconductor chip bonding apparatus according to an embodiment of the present invention, Figure 3 is a view showing the mode conversion operation principle of the chip adsorption unit in the semiconductor chip bonding apparatus of Figure 2, 4 is a cross-sectional view of the chip adsorption unit in the semiconductor chip bonding apparatus of FIG. 2, and FIGS. 5 and 6 are views illustrating the operating principle of the semiconductor chip bonding apparatus of FIG. 2, and FIG. 7 is a semiconductor chip bonding apparatus of FIG. 2. 2 is a view for explaining the use of the first driving unit and the second driving unit, Figure 8 is a view showing the operation principle of the tilt control unit in the semiconductor chip bonding apparatus of FIG.

2 to 8, in the semiconductor chip bonding apparatus of the present embodiment, the semiconductor chip 10 and the printed circuit board 20 are mounted in a process of mounting the chip scale package semiconductor chip 10 on the printed circuit board 20. In order to minimize the mounting error of the chip adsorption unit 100, the substrate support plate 200, the inclination control unit 210, the chip transfer unit 300, the substrate drive unit 400, The first optical unit 510 and the second optical unit 520 are included.

The chip adsorption unit 100 adsorbs the semiconductor chip 10 at an initial position and releases the adsorption of the semiconductor chip 10 at the mounting position at which the semiconductor chip 10 is mounted on the printed circuit board 20. And an adsorption part 110, a lift driver 120, a mode converter 130, a shaft part 140, and a rotation driver 150.

Referring to FIG. 4, the suction unit 110 sucks the semiconductor chip 10, and a vacuum suction force is applied to hold the semiconductor chip 10. Adsorption unit 110 is a process of loading and moving the semiconductor chip 10, the suction and fixing the semiconductor chip 10 by using a vacuum suction force, and lowering the semiconductor chip 10 on the printed circuit board 20 In the process, the vacuum adsorption force is released and the semiconductor chip 10 is separated and put down.

The adsorption part 110 includes a first member 111 in contact with the semiconductor chip, a second member 112 coupled to the first member 111, and a first member 111 and a second member 112. It is composed of a gap adjusting portion 113 for adjusting the distance between the first member 111 and the second member 112 in the local position between the ().

Unlike the second member 112 fixed to the shaft portion 140, the first member 111 is locally adjusted up and down by the interval adjusting portion 113 to adjust the interval with the second member 112. It is possible. This is to adsorb the semiconductor chip 10 while the contact surface of the first member 111 and the contact surface of the semiconductor chip 10 are parallel to each other. When the inclination of the first member 111 is adjusted to correspond to the surface inclination of the semiconductor chip 10, the compressive force applied to the bonding surface of the semiconductor chip 10 and the printed circuit board 20 may be uniform, and the compressive force may be Since the semiconductor chip 10 and the printed circuit board 20 are uniformly dispersed without being concentrated in any one part, the semiconductor chip 10 and the printed circuit board 20 may be perfectly compressed without fear of damage.

The interval adjusting part 113 of the present embodiment includes a ball member 114 interposed between the first member 111 and the second member 112 at a central portion thereof, and the first member 111 and the second member 112. A bolt (not shown) for coupling and a mood bolt (not shown) for adjusting a distance between the first member 111 and the second member 112.

The first member 111 is inclined back, front, left, and right with respect to the ball member 114, and the distance with the second member 112 is partially adjusted. An interval between the first member 111 and the second member 112 may be finely adjusted and the inclination of the first member 111 may be adjusted as a whole.

The elevating driving unit 120 is coupled to the adsorption unit 110 to move the adsorption unit 110 up and down, in this embodiment, the voice coil motor 121, the elastic member 124, It consists of an encoder (not shown). The voice coil motor 121 has a stator 122 and a mover 123 which is relatively moved with respect to the stator 122 and fixed to the adsorption unit 110. The elastic member 124 has a stator 122. And the mover 123 are elastically returned in a direction closer to each other. The encoder detects the stroke of the mover 123 and transmits the position information to the mode converter 130 to be described later.

When power is supplied to the voice coil motor 121, the mover 123 moves in a direction away from each other with respect to the stator 122, and thus the adsorption unit 110 descends. When the power supply to the voice coil motor 121 is cut off, electromagnetic force no longer occurs between the mover 123 and the stator 122, and the mover 123 is mutually connected to the stator 122 by the elastic member 124. The adsorbing unit 110 is raised by moving in a direction that is approaching.

The mode converter 130 controls the lift driver 120 in two modes. As shown in FIG. 3A, the semiconductor chip 10 adsorbed by the adsorption unit 110 is moved to a mounting position mounted on the printed circuit board 20, and when the mounting position is reached, the adsorption unit ( 110) is lowered. At this time, before the semiconductor chip 10 and the printed circuit board 20 are compressed, a precise position control step of matching the alignment mark of the semiconductor chip 10 with the alignment mark of the printed circuit board 20 must be performed. The unit 130 drives the lift driver 120 in the position control mode.

In the position control mode, the AC current is supplied to the mover 123 while changing the length and frequency of the waveform of the AC current. The length of the waveform of the alternating current supplied is related to the moving length of the mover 123 and the frequency is related to the speed of the mover. As such, the stroke of the mover 123 is controlled while varying the length and frequency of the waveform of the alternating current, and the difference between the actual position and the target position of the mover 123 transmitted from the encoder is compensated for.

As shown in FIG. 3 (b), the semiconductor chip 10 and the printed circuit board 20 are compressed by matching the alignment mark of the semiconductor chip 10 with the alignment mark of the printed circuit board 20. It is necessary to appropriately control the torque applied to the chip 10. When pressing starts, an appropriate pressure must be applied to compress the bump 11, which is a connection terminal of the semiconductor chip 10, and the printing terminal 21 of the printed circuit board 20. At this time, when excessive pressure is applied, sliding occurs between the bump 11 of the semiconductor chip 10 and the printed terminal 21 of the printed circuit board 20 to mount the semiconductor chip 10 and the printed circuit board 20. The problem may arise that the error is outside the tolerance range of the bonding apparatus. Therefore, after the semiconductor chip 10 and the printed circuit board 20 are compressed, the mode converter 130 converts the lift driver 120 into the torque control mode to control the torque applied to the semiconductor chip 10. do.

In the torque control mode, the DC current is changed while supplying a DC current to the mover 123. The strength of the DC current supplied affects the force for pressing the mover 123 semiconductor chip 10 in relation to the torque of the mover 123. In this way, the torque of the mover 123 is controlled while varying the intensity of the direct current.

The shaft portion 140, one end is coupled to the upper portion of the adsorption portion 110, the other end is coupled to the rotary drive unit 150 to be described later. The shaft portion 140 is slidably installed through the stator 122 and at the same time is fixedly installed to the mover 123 while penetrating the mover 123. A through hole is formed in the shaft 140, and air sucked by the adsorption part 110 to adsorb the semiconductor chip 10 is transferred to the outside through the through hole.

The rotation driving unit 150 is coupled to the other end of the shaft portion 140, for rotating the adsorption portion (110). The rotation driving unit 150 is disposed in line with the lifting driving unit 120, and rotates the semiconductor chip 10 in the process of aligning the semiconductor chip 10 using the alignment mark image of the semiconductor chip 10. do.

The rotation driving unit 150 of the present embodiment includes a stepping motor and a harmonic drive. When a general DC motor is used for the rotation driving unit 150, the DC motor does not have a large stop torque, so that the semiconductor chip 10 and the printed circuit board 20 are compressed while being in the torque control mode of the mode converter 130. The problem that the unit 110 is rotated may occur. Therefore, in this embodiment, the above-mentioned problem is solved by using a stepping motor having a relatively large stop torque, and the harmonic drive also helps to improve the position precision and the stop torque.

The angle actually rotated by the rotation driver 150 is also transmitted to the mode converter 130, and the mode converter 130 rotates while compensating the difference between the actual rotation angle and the target rotation angle of the rotation driver 150 in the position control mode. The rotation of the driving unit 150 is controlled.

The substrate support plate 200 is spaced apart from the initial position of the chip adsorption unit 100 and supports the printed circuit board 20. The substrate support plate 200 is further provided with vacuum adsorption means (not shown) for adsorbing and fixing the printed circuit board 20 mounted on the upper surface thereof. The vacuum adsorption means prints from the substrate support plate 200 during the process of photographing the alignment mark of the printed circuit board 20 seated on the substrate support plate 200 or bonding the semiconductor chip 10 to the printed circuit board 20. The circuit board 20 is fixed to be fixed so as not to be separated or changed in position.

The inclination control unit 210 may be mounted on the printed circuit board 20 so that the semiconductor chip 10 may be mounted on the printed circuit board 20 while both contact surfaces of the semiconductor chip 10 and the printed circuit board 20 are parallel to each other. The inclination of the substrate support plate 200 on which the substrate 20 is seated is adjusted. When the semiconductor chip 10 is mounted in a state in which both contact surfaces of the semiconductor chip 10 and the printed circuit board 20 are inclined with each other, an error of several tens of micrometers or more occurs and the tolerance of the bonding apparatus is exceeded. Therefore, in order to minimize the mounting error of the semiconductor chip 10 and the printed circuit board 20, both contact surfaces of the semiconductor chip 10 and the printed circuit board 20 should be kept in parallel with each other.

As shown in FIG. 8, the inclination adjustment unit 210 is installed at three lower or three corner portions of the substrate support plate 200, respectively, and includes a first inclination member 211 and a second inclination member 212. ), A driving unit 213, and a guide member 214. One surface of the first inclined member 211 is formed to be inclined, and one surface of the second inclined member 212 facing one surface of the first inclined member 211 is inclined to contact the first inclined member 211. The other surface is coupled to the substrate support plate 200. In addition, the driving unit 213 pushes the first inclined member 211 toward the second inclined member 212, and the guide member 213 is installed in the vertical direction and is pushed up by the first inclined member 211. Guide the movement of the inclined member 212 in the vertical direction.

As shown in (b) of FIG. 8, the height of the substrate support plate 200 may be adjusted at the position where the second inclined member 212 is installed while repeatedly pushing up or down the second inclined member 212. The semiconductor chip 10 may be formed in a state in which both contact surfaces of the semiconductor chip 10 and the printed circuit board 20 are parallel to each other while performing the above operation at a plurality of positions below the substrate support plate 200. ) May be mounted on the printed circuit board 20.

The chip transfer unit 300 transfers the chip adsorption unit 100 in a horizontal direction. When the semiconductor chip 10 is adsorbed by the adsorption unit 110, the chip transfer unit 300 crosses the semiconductor chips 10 in a planar direction. Transfer to. The chip transfer unit 300 includes a linear motor as a driving source, a base coupled to the linear motor, a linear guide for guiding the linear movement of the base, an encoder for feeding back a stop position of the base to improve position accuracy, and the like. Since the configuration related to the linear transfer unit is a configuration well known to those skilled in the art, a detailed description thereof will be omitted.

The substrate driving unit 400 transfers or rotates the substrate support plate 200, and includes a first driver 410 and a second driver 420. When the chip adsorption unit 100 reaches the upper side of the substrate support plate 200 in the state of adsorbing the semiconductor chip 10, the chip adsorption unit 100 is fixed and the substrate support plate 200 is moved while the semiconductor chip 10 is moved. ) And the mounting position of the printed circuit board 20. The movement of the substrate support plate 200 for adjusting the mounting position may be largely classified into two types.

As shown in FIG. 7A, one movement includes a plurality of mounting positions for mounting the semiconductor chips 10 on the printed circuit board 20, and a plurality of mounting positions for the semiconductor chips 10. In the mounting, the chip adsorption unit 100 is positioned above the mounting position 1 (see FIG. 7) and then transferred to the substrate support plate 200 so as to be positioned above the mounting position 2 (see FIG. 7). A drive having a relatively long stroke is required for this movement, but does not require high positional accuracy because it moves between different mounting positions.

The first driving unit 410 is for performing the above-described movement, and the substrate support plate 200 in a horizontal direction so that the chip adsorption unit 100 can be positioned in a plurality of mounting positions on the printed circuit board 20. Transfer.

The other movement is as shown in (b) of Figure 7, the chip adsorption unit 100 is located above the desired mounting position on the printed circuit board 20, the semiconductor chip 10 and the printed circuit board 20 When the semiconductor chip 10 is lowered to compress the pressure, the substrate support plate 200 is finely conveyed for the alignment of the semiconductor chip 10 and the printed circuit board 20 while the semiconductor chip 10 is lowered. To rotate. This movement can be controlled through the alignment mark image information of the printed circuit board 20, and for this movement, a driving unit having a relatively short stroke and high positional accuracy is required.

The second driving unit 420 is for performing the above-described movement, and is coupled to the upper portion of the first driving unit 410. The second driving unit 420 moves the substrate support plate 200 in the horizontal direction (u, v direction, FIG. 7) to adjust the position of the printed circuit board 20 with respect to the semiconductor chip 10 at the mounting position. Rotation about the direction of transportation or the horizontal direction (refer to the w direction, see FIG. 7).

As described above, in the present embodiment, since the different positional accuracy is required in the process of mounting the semiconductor chip 10 and the printed circuit board 20, the substrate driving unit 400 includes two driving units having different positional accuracy. A single drive having both a long stroke and a high positional precision is inevitably expensive. The substrate driving unit 400 is relatively short with the first drive 410 having a relatively long stroke and a relatively low positional accuracy. By separating the stroke into the second driving unit 420 having a relatively high positional accuracy, it is possible to reduce the cost.

The first driving unit 410 and the second driving unit 420 of the present embodiment include a linear motor as a driving source, a base coupled to the linear motor, a linear guide for guiding linear movement of the base, and a base to improve position accuracy. And an encoder for feeding back the stop position.

The first optical unit 510 is for photographing a pair of alignment marks spaced at regular intervals provided in the semiconductor chip 10, and the chip adsorption unit 100 and the substrate support plate at an initial position in a horizontal direction. It is disposed between the (200) and disposed in the lower side of the chip adsorption unit 100 in the vertical direction. The first optical unit 510 includes a pair of cameras.

The second optical unit 520 is for photographing a pair of alignment marks spaced at regular intervals provided on the printed circuit board 20, and is disposed above the substrate support plate 200. The second optical unit 520 also includes a pair of cameras.

5 and 6, the adsorption unit 110 adsorbs the semiconductor chip 10 using the adsorption unit 110, and the adsorption unit 110 on which the semiconductor chip 10 is adsorbed using the chip transfer unit 300 is substrate. It moves to the support plate 200 without stopping.

Thereafter, as soon as the semiconductor chip 10 passes the upper side of the first optical unit 510, the alignment mark of the semiconductor chip 10 is photographed through the first optical unit 510. Since the semiconductor chip 10 is moved to the substrate support plate 200 without stopping, the semiconductor chip 10 is in the middle of moving toward the substrate support plate 200 even when the alignment mark of the semiconductor chip 10 is photographed.

Meanwhile, the alignment mark of the printed circuit board 20 seated on the substrate support plate 200 is photographed by the second optical unit 520. The process of photographing the alignment mark of the printed circuit board 20 is preferably performed before the chip adsorption unit 100 arrives from the initial position to the substrate support plate 200.

Thereafter, while the chip transfer unit 300 moves from the first optical unit 510 to the substrate support plate 200, the alignment mark of the semiconductor chip 10 and the alignment mark of the printed circuit board 20 coincide with each other. The semiconductor chip 10 and the printed circuit board 20 are aligned. At this time, using the alignment mark image of the semiconductor chip 10 obtained by using the first optical unit 510 and the alignment mark image of the printed circuit board 20 obtained by using the second optical unit 520, The difference between the alignment marks in the θ-axis direction and the difference in the x- and y-axis directions is compensated for, and the semiconductor chip 10 and the printed circuit board 20 are moved or rotated according to the compensated information.

In the semiconductor chip bonding apparatus according to the present embodiment configured as described above, the semiconductor chip and the printed circuit board are compressed before the semiconductor chip and the printed circuit board are compressed in the process of mounting the semiconductor chip on the printed circuit board. By efficiently controlling the chip adsorption unit for elevating or rotating the semiconductor chip so as to be suitable for each, the mounting error of the semiconductor chip and the printed circuit board can be minimized.

In addition, the semiconductor chip bonding apparatus according to the present embodiment uses the driving unit mounted on the chip adsorption unit while converting it into the control mode required for the process step, thereby reducing the quantity of the driving unit mounted on the chip adsorption unit and adsorbing the semiconductor chip. It is possible to reduce the weight of the chip adsorption unit to be transferred. Therefore, the entire process can be carried out by minimizing the transfer of other components of the bonding apparatus and only the transfer of the chip adsorption unit, thereby reducing the overall process time and improving the productivity.

In addition, the semiconductor chip bonding apparatus according to the present embodiment, by using the voice coil motor as the lifting and lowering drive unit for lifting the semiconductor chip, it is possible to obtain the effect that can be freely changed between modes such as position control mode and torque control mode. .

In addition, the semiconductor chip bonding apparatus according to the present embodiment is inclined of the substrate support plate on which the printed circuit board is mounted so that the semiconductor chip can be mounted on the printed circuit board while both contact surfaces of the semiconductor chip and the printed circuit board are parallel to each other. By providing the inclination adjustment unit for controlling the, it is possible to obtain an effect that can eliminate the error caused by being mounted in a state in which both contact surfaces of the semiconductor chip and the printed circuit board are inclined mutually.

In addition, the semiconductor chip bonding apparatus according to the present embodiment can reduce the cost required for the substrate driving unit by separating the substrate driving unit for transferring or rotating the substrate supporting plate into two driving units based on stroke and positional accuracy. You can get the effect.

The scope of the present invention is not limited to the above-described embodiments and modifications, but may be embodied in various forms of embodiments within the scope of the appended claims. Without departing from the gist of the invention claimed in the claims, it is intended that any person skilled in the art to which the present invention pertains falls within the scope of the claims described herein to various extents that can be modified.

100: chip adsorption unit
110: adsorption unit
120: elevating drive unit
130: mode conversion unit
200: substrate support plate
300: chip transfer unit
400: substrate driving unit

Claims (8)

A semiconductor chip bonding apparatus for transferring a semiconductor chip and bonding the semiconductor chip and a printed circuit board,
A chip adsorption unit for adsorbing the semiconductor chip at an initial position and releasing adsorption of the semiconductor chip at a mounting position where the semiconductor chip is mounted on the printed circuit board, and spaced apart from an initial position of the chip adsorption unit A substrate support plate for supporting a circuit board, a chip transfer unit for transferring the chip adsorption unit, and a substrate drive unit for transferring or rotating the substrate support plate,
The chip adsorption unit includes: an adsorption unit for adsorbing the semiconductor chip; An elevation driving unit for moving the adsorption unit up and down; A rotation driving unit for rotating the adsorption unit; And driving the elevating driver and the rotary driver in a position control mode to control the position of the semiconductor chip before the semiconductor chip and the printed circuit board are compressed in the mounting position, and the semiconductor chip and the And a mode converter configured to convert the lift driver into a torque control mode in order to control torque applied to the semiconductor chip after the printed circuit board is compressed.
The substrate driving unit may include: a first driver transferring the substrate support plate in a horizontal direction to transfer the printed circuit board to the mounting position; And a position coupled to the first driving unit, having a higher positional accuracy and a shorter stroke than the first driving unit, and adjusting the position of the printed circuit board in an aligned state by using information of an alignment mark of the printed circuit board. And a second driving part which rotates the substrate support plate in a horizontal direction or rotates about a direction crossing the horizontal direction. The method of claim 1,
The lifting drive unit,
A voice coil motor having a stator and a mover which is relatively moved with respect to the stator, and wherein the adsorption unit is fixedly installed; And
And an elastic member for elastically returning the stator and the mover in a direction closer to each other. The method of claim 2,
The chip adsorption unit,
One end portion is coupled to the adsorption portion and the other end is coupled to the rotational drive portion, the shaft portion is installed to be slidably through the stator, penetrates the mover and is fixed to the mover; A semiconductor chip bonding apparatus. The method of claim 2,
The mode conversion unit,
In the position control mode, the stroke of the mover is controlled while varying the length and frequency of the waveform of the AC current supplied to the mover.
And the torque control mode controls the torque of the mover while varying the strength of the DC current supplied to the mover. The method of claim 1,
The adsorption unit,
A first member in contact with the semiconductor chip, a second member spaced apart from the first member, and a portion of the first member and the second member at a local position between the first member and the second member A semiconductor chip bonding apparatus comprising a gap adjusting unit for adjusting a gap. delete The method of claim 1,
And an inclination controller for adjusting the inclination of the substrate support plate so that the semiconductor chip is mounted on the printed circuit board in a state where both contact surfaces of the semiconductor chip and the printed circuit board are parallel to each other. Semiconductor chip bonding device. The method of claim 7, wherein
The inclination adjustment unit,
Respectively installed at the lower edges of the substrate support plate,
A first inclined member having one surface inclined;
A second inclined member facing one surface of the first inclined member to be inclined to be in contact with the first inclined member and to be coupled to the substrate support plate;
A driving part for pushing the first inclined member toward the second inclined member; And
And a guide member installed in an up and down direction to guide the movement of the second inclined member, which is pushed up by the first inclined member.

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