CN114798534B - Probe cleaning device - Google Patents
Probe cleaning device Download PDFInfo
- Publication number
- CN114798534B CN114798534B CN202210324199.8A CN202210324199A CN114798534B CN 114798534 B CN114798534 B CN 114798534B CN 202210324199 A CN202210324199 A CN 202210324199A CN 114798534 B CN114798534 B CN 114798534B
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- Prior art keywords
- needle
- cleaning
- probe
- needle cleaning
- area
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- 238000004140 cleaning Methods 0.000 title claims abstract description 211
- 239000000523 sample Substances 0.000 title claims abstract description 97
- 239000011538 cleaning material Substances 0.000 claims abstract description 57
- 238000001514 detection method Methods 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 40
- 239000010410 layer Substances 0.000 claims description 37
- 238000003780 insertion Methods 0.000 claims description 27
- 230000037431 insertion Effects 0.000 claims description 27
- 244000137852 Petrea volubilis Species 0.000 claims description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 11
- 239000010931 gold Substances 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- 239000010703 silicon Substances 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 10
- 238000005498 polishing Methods 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 208000012266 Needlestick injury Diseases 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 8
- 238000012360 testing method Methods 0.000 description 6
- 239000000428 dust Substances 0.000 description 3
- 230000003670 easy-to-clean Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 244000144992 flock Species 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
An embodiment of the present invention provides a probe cleaning apparatus including: a needle cleaning table; the needle cleaning pad is arranged on the needle cleaning table and is provided with at least two needle cleaning areas, and different needle cleaning areas are provided with needle cleaning materials with different hardness; the detection device is arranged at a position on the needle cleaning table, where the needle cleaning pad is not arranged, or on a probe card loaded with a probe to be cleaned, and is used for detecting attachments of the probe tip to be cleaned; and the control device is used for enabling the probe to be cleaned to execute corresponding needle cleaning action in the selected needle cleaning area according to the detection result of the detection device.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to probe cleaning equipment.
Background
In the wafer test process, electrical testing of die (die) on a wafer with probes is required to ensure that the die is a good product prior to packaging. In order to ensure the accuracy of the wafer test result, after a certain number of tests are performed, the probe needs to be cleaned to remove impurities adhered to the surface of the probe, so that errors of the test result caused by the impurities are avoided, and the accuracy of the wafer test result is reduced.
The prior proposal of the cleaning probe is to puncture the polishing sand paper, however, the friction between the sand paper and the probe can generate tiny fragments, the needle cleaning effect can be achieved only by repeated back and forth puncture, the effect is poor, and moreover, the friction on the sand paper can possibly increase the self loss of the probe. Another prior art cleaning Probe is to insert a needle into a needle cleaning pad as shown in FIG. 1, wherein the needle cleaning pad may comprise a ceramic substrate 11 and a needle cleaning layer 13, the ceramic substrate 11 and the needle cleaning layer 13 are bonded together by an adhesive layer, and the needle cleaning layer 13 is made of a specific material, such as Probe Clean TM A material; however, when the dirt which can be removed only by rubbing the needle repeatedly is encountered, the needle removal effect can be achieved only by repeatedly puncturing the needle repeatedlyAs a result, the dirt cleaning effect and efficiency are not as good as those of the polished sand paper.
Disclosure of Invention
In view of the above, the embodiment of the invention provides a probe cleaning device to solve the problems of poor cleaning effect or low cleaning efficiency of the existing probe.
To this end, an embodiment of the present invention provides a probe cleaning apparatus including: a needle cleaning table; the needle cleaning pad is arranged on the needle cleaning table and is provided with at least two needle cleaning areas, and different needle cleaning areas are provided with needle cleaning materials with different hardness; the detection device is arranged at a position on the needle cleaning table, where the needle cleaning pad is not arranged, or on a probe card loaded with a probe to be cleaned, and is used for detecting attachments of the probe tip to be cleaned; and the control device is used for enabling the probe to be cleaned to execute corresponding needle cleaning action in the selected needle cleaning area according to the detection result of the detection device.
Optionally, the needle cleaning pad includes a first needle cleaning region and a second needle cleaning region, the first needle cleaning region is formed of a first needle cleaning material, the second needle cleaning region is formed of a second needle cleaning material, and the hardness of the first needle cleaning material is less than the hardness of the second needle cleaning material.
Optionally, the needle cleaning pad includes: a substrate; the first needle cleaning area and the second needle cleaning area are arranged on the substrate.
Optionally, the needle cleaning pad further includes a third needle cleaning region formed of a third needle cleaning material having a hardness greater than the hardness of the first needle cleaning material and less than the hardness of the second needle cleaning material.
Optionally, the needle cleaning pad includes: a substrate; the third needle cleaning material layer is arranged on the substrate; a first needle-clearing material layer arranged on the third needle-clearing material layer to form the first needle-clearing area; a second needle-clearing material layer arranged on the third needle-clearing material layer to form the second needle-clearing area; and the third needle-cleaning area is formed by the area, on which the first needle-cleaning material layer and the second needle-cleaning material layer are not arranged, of the third needle-cleaning material layer.
Optionally, the needle cleaning pad includes: a substrate; the first needle cleaning area and the second needle cleaning area are arranged on the substrate; and the third needle cleaning area is arranged on the substrate and comprises a liner arranged on the substrate and the third needle cleaning material arranged on the liner.
Optionally, an adhesive layer is further disposed between the substrate and the needle cleaning region.
Optionally, the first needle-clearing material comprises a high molecular polymer, and the second needle-clearing material comprises polished sand paper.
Optionally, the high molecular polymer comprises hydrogel-like and silica gel; and/or the polishing sand paper is 4000 mesh to 7000 mesh polishing sand paper.
Optionally, the third needle cleaning material comprises gold or gold-plated material.
Optionally, the substrate is a silicon wafer or ceramic.
Optionally, the pad is a silicon wafer or ceramic.
Optionally, the control device is configured to determine a selected needle cleaning area according to the detected material of the attachment, and when the attachment is dirty easy to clean, make the probe to be cleaned align with a needle cleaning area corresponding to a needle cleaning material with the lowest hardness and perform needle insertion; or when the attachment is sticky dirt, the probe to be cleaned is aligned with the needle cleaning area corresponding to the needle cleaning material with higher hardness and is subjected to needle insertion, and then the probe to be cleaned is aligned with the needle cleaning area corresponding to the needle cleaning material with lowest hardness and is subjected to needle insertion.
Optionally, the control device is further configured to determine the number of needle sticks according to the detected particle size of the attachment.
Optionally, the control device is further configured to count the number of needle insertion times of each needle clearing area on the needle clearing pad, and send a prompt message to replace the needle clearing pad or the corresponding needle clearing area when the number of needle insertion times of a certain needle clearing area exceeds a predetermined threshold.
Optionally, the detecting device is further configured to detect an attachment of the probe tip to be cleaned in real time, and when the attachment is not detected, the control device stops the needle cleaning action; or the detection device is also used for detecting the attachment of the probe tip to be cleaned after each needle insertion or a preset number of needle insertion, and when the attachment is not detected, the control device stops the needle cleaning action.
In the probe cleaning equipment provided by the embodiment of the invention, at least two needle cleaning areas are arranged through the needle cleaning pad, different needle cleaning areas are formed by needle cleaning materials with different hardness, the attachments of the probe tip to be cleaned are detected through the detection device, and the corresponding needle cleaning areas are selected to clean the probe according to the detection result of the detection device, so that the full automation of the needle cleaning process is realized, the intervention of personnel is not required, the needle cleaning efficiency can be improved, and unnecessary probe loss caused by excessive needle cleaning is avoided.
Drawings
The features and advantages of the present invention will be more clearly understood by reference to the accompanying drawings, which are illustrative and should not be construed as limiting the invention in any way, in which:
FIG. 1 shows a schematic view of a prior art needle cleaning pad;
FIG. 2 shows a schematic view of a probe cleaning apparatus according to an embodiment of the invention;
FIG. 3A shows a top view of a needle cleaning pad according to an embodiment of the present invention;
FIG. 3B shows a cross-sectional view of the needle cleaning pad shown in FIG. 3A along the broken line A-A;
FIG. 4A shows a top view of a needle cleaning pad according to another embodiment of the present invention;
FIG. 4B shows a cross-sectional view of the needle cleaning pad shown in FIG. 4A along the dashed line B-B;
fig. 5 shows a schematic view of a needle cleaning pad according to another embodiment of the invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
Fig. 2 shows a probe cleaning apparatus according to an embodiment of the invention, which may comprise a needle cleaning table 23, a needle cleaning pad 24, a detection device 25 and a control device (not shown in the figures), as shown in fig. 2. In an alternative embodiment, the needle cleaning pad 24 is disposed on the needle cleaning platform 23, the detecting device 25 is disposed on the needle cleaning platform 23 at a position where the needle cleaning pad 24 is not disposed, for example, may be disposed on the periphery of the needle cleaning pad 24 or on the outer side of the needle cleaning platform 23 to save detection time, and may be one, two or more detecting devices 25 for detecting attachments on the tip of the probe 24 to be cleaned, which is not limited herein. The detecting device 25 may be an additional device, or may be implemented by using an existing microscope (imaging system) on the machine, and the function of the detecting device 25 is implemented by changing the microscope on the machine, so as to reduce the cost of the probe cleaning device. In the example of fig. 2, probes 22 are loaded on a probe card 21, and the probe card 21 may load a plurality of probes 22. In another alternative embodiment, the detecting device 25 may also be provided on the probe card 21 loaded with the probes 22 to be cleaned, and the function of detecting the attachment of the tips of the probes 22 to be cleaned may also be achieved.
As an alternative implementation of the embodiment of the present invention, the detecting device 25 may be an infrared sensor, which is capable of detecting the material of the attachment of the tip of the probe 24 to be cleaned and the size of the particles. The energy and wavelength of the infrared radiation of the objects with different materials are different, so that the infrared sensor can judge the material of the attachment according to the energy and wavelength of the attachment of the probe 24 tip to be cleaned to the external infrared radiation, for example, whether the attachment is sticky dirt such as metal chips or silicon chips or easy cleaning dirt such as flock, film or dust can be judged. And the infrared sensor can also acquire the particle size of the attachments according to the size of the imaging image of the attachments of the needle points, so that different needle cleaning schemes can be adopted according to the material and the particle size of the attachments.
The needle cleaning pad 24 includes at least two needle cleaning areas, and different needle cleaning areas are formed by needle cleaning materials with different hardness. In the example of fig. 3A and 3B, the needle cleaning pad 24 may include 2 needle cleaning zones, namely a first needle cleaning zone 31 and a second needle cleaning zone 32, the first needle cleaning zone 31 being formed of a first needle cleaning material and the second needle cleaning zone 32 being formed of a second needle cleaning material, it will be appreciated by those skilled in the art that more needle cleaning zones are possible.
The control device (not shown in the figure) is in communication connection with the detection device 25, and can be in communication connection through a wired or wireless manner, so that the probe 22 to be cleaned can execute corresponding needle cleaning action in the selected needle cleaning area according to the detection result of the detection device 25. Specifically, the control device changes the relative position between the needle cleaning stage 23 and the probe 22 to be cleaned so that the probe 22 to be cleaned is aligned with the selected needle cleaning region. The control device may control the movement of the probe card 21 to the needle cleaning stage 23, may control the movement of the needle cleaning stage 23 to the probe card 21, or may cause both the needle cleaning stage 23 and the probe card 21 to move, thereby changing the relative position between the needle cleaning stage 23 and the probe 22 to be cleaned. After the probe 22 to be cleaned is aligned with the selected needle cleaning area, the control device controls the probe 22 to be cleaned to move towards the selected needle cleaning area, and needles are inserted into the selected needle cleaning area for a plurality of times, so that the aim of cleaning needles is fulfilled.
It should be noted that, the needle cleaning pad 24 has a certain service life, and its needle cleaning effect is reduced after excessive use, so that when the number of needle insertion exceeds a predetermined threshold, the needle cleaning effect needs to be replaced in time. In an alternative implementation of the embodiment of the present invention, the control device is further configured to count the number of needle insertion times of each needle clearing area on the needle clearing pad 24, and send a prompt message to replace the needle clearing pad 24 when the number of needle insertion times of a certain needle clearing area exceeds a predetermined threshold. Of course, for cost reasons, it is also possible to replace the entire needle cleaning pad, but only the needle cleaning zone, which is the number of needle insertions exceeding the predetermined threshold value.
More specifically, when the detecting device 25 detects that the attachment of the probe tip is a flock, a film or dust, which is easy to clean and dirty, the first needle cleaning area 31 may be selected to be punched for several times, for example, 1-3 times according to the particle size of the attachment to complete needle cleaning, so as to avoid unnecessary probe loss caused by excessive needle cleaning on the high-hardness needle cleaning material for a long time. When the detecting device 25 detects that the attachment of the probe tip is sticky dirt such as metal scraps or silicon scraps, the needle can be inserted into the second needle cleaning area 32 for several times, and then the needle can be inserted into the first needle cleaning area 31 for several times to thoroughly remove the tiny dirt, and the number of needle insertion times can be determined according to the particle size of the attachment, for example, 1-3 times, so as to improve the needle cleaning efficiency.
In order to reduce the number of needle insertion times as much as possible to reduce the probe loss while ensuring the needle cleaning effect, in an alternative implementation of the embodiment of the present invention, the detecting device 25 is further configured to detect the attachment of the tip of the probe 22 to be cleaned in real time, and when the attachment is not detected, the control device stops the needle cleaning operation.
It will be appreciated by those skilled in the art that the detection means 25 need not detect in real time in order to increase the needle cleaning efficiency, but rather detects the attachment of the tip of the probe 22 to be cleaned after each needle insertion or a predetermined number of needle insertion, and when no attachment is detected, the control means stops the needle cleaning operation. The predetermined number of needle insertion may be set by the user himself, for example to 2 or 3 times, etc. Of course, the predetermined number of times may also be determined by the control device according to the size of the particulate matters of the attachment detected currently, for example, the particulate matters of the attachment detected currently are larger, the control device detects again after the corresponding needle clearing area is punctured 2 times, at this time, the particulate matters are already small, and the control device detects again after the corresponding needle clearing area is punctured 1 time, so that the needle clearing efficiency is improved as much as possible.
In the probe cleaning equipment provided by the embodiment of the invention, at least two needle cleaning areas are arranged through the needle cleaning pad, different needle cleaning areas are formed by needle cleaning materials with different hardness, the attachments of the probe tip to be cleaned are detected through the detection device, and the corresponding needle cleaning areas are selected to clean the probe according to the detection result of the detection device, so that the full automation of the needle cleaning process is realized, the intervention of personnel is not required, the needle cleaning efficiency can be improved, and unnecessary probe loss caused by excessive needle cleaning is avoided.
As an alternative implementation of the embodiment of the present invention, as shown in fig. 3A and 3B, the needle cleaning pad 24 may include a substrate 33, a first needle cleaning region 31, and a second needle cleaning region 32, where the first needle cleaning region 31 and the second needle cleaning region 32 are disposed on the substrate 33. The substrate 33 may be, for example, a ceramic substrate or a silicon wafer. In an alternative embodiment, the first needle-clearing zone 31 is formed of a lower durometer needle-clearing material and the second needle-clearing zone 32 is formed of a higher durometer needle-clearing material. Specifically, the first needle-removing area 31 may be formed of a polymer such as hydrogel-like and silicone gel, and the second needle-removing area 32 may be formed of a polished sand paper such as 4000 mesh to 7000 mesh polished sand paper, so that different needle-removing schemes may be adopted according to the detection result of the detecting means 25. It should be noted that, the number of the polishing sand paper can be reasonably selected by those skilled in the art according to the specific situation. Further, as shown in fig. 3B, an adhesive layer 34 is further provided between the substrate 33 and the first needle-clearing area 31 and the second needle-clearing area 32.
As another alternative implementation of the embodiment of the present invention, as shown in fig. 4A and 4B, the needle cleaning pad 24 may further include a first needle cleaning region 41, a second needle cleaning region 42, and a third needle cleaning region 43, the first needle cleaning region 41 being formed of a first needle cleaning material, the second needle cleaning region 42 being formed of a second needle cleaning material, the third needle cleaning region 43 being formed of a third needle cleaning material, and the third needle cleaning material having a hardness greater than that of the first needle cleaning material and less than that of the second needle cleaning material. Alternatively, the first needle-cleaning material may be a polymer, the second needle-cleaning material may be polished sand paper, and the third needle-cleaning material may be gold or gold-plating material. As shown in fig. 4B, the needle-clearing pad may include a substrate 44, a third needle-clearing material layer 43, a first needle-clearing material layer 41, and a second needle-clearing material layer 42. Wherein the substrate 44 may be a silicon wafer or a ceramic substrate, the third needle-clearing material layer 43 may be a gold layer plated on the substrate 44, the first needle-clearing material layer 41 and the second needle-clearing material layer 42 are disposed on the third needle-clearing material layer 43, for example, adhered to the third needle-clearing material layer 43, the first needle-clearing material layer 41 forms a first needle-clearing region, the second needle-clearing material layer 42 forms a second needle-clearing region, and a region on the third needle-clearing material layer 43 where the first needle-clearing material layer 41 and the second needle-clearing material layer 42 are not disposed forms a third needle-clearing region. The hardness of gold is between that of the polished sand paper and the high polymer, when the pollution of the probe to be cleaned is not serious, the probe can be inserted into the third needle cleaning material layer 43, namely the gold layer, and the probe can be better protected on the premise of ensuring needle cleaning because the hardness of gold is much softer than that of the polished sand paper. Since the polishing sandpaper and the polymer are adhered to the gold layer, the removal is easy, and when the needle cleaning pad is scrapped, the gold layer plated on the substrate 44 is easily recovered.
As another alternative of the embodiment of the present invention, as shown in fig. 5, the needle cleaning pad may include a base plate 55, a first needle cleaning region 51, a second needle cleaning region 52, and a third needle cleaning region. The first needle-clearing area 51, the second needle-clearing area 52 and the third needle-clearing area are arranged on a substrate 55, wherein the third needle-clearing area comprises a pad 54 arranged on the substrate 55 and a third needle-clearing material 53 arranged on the pad 54. Further, the first needle-clearing area 51, the second needle-clearing area 52, and the third needle-clearing area and the substrate 55 are further provided with an adhesive layer 56. In this embodiment, the first needle-cleaning region 51 may be formed of a polymer such as hydrogel-like and silicone gel, the second needle-cleaning region 52 may be formed of a polishing sand paper such as 4000 mesh to 7000 mesh polishing sand paper, the third needle-cleaning material 53 may be gold or gold-plating material, the substrate 55 may be a ceramic substrate or silicon wafer, and the pad 54 may be a ceramic substrate or silicon wafer as well.
In the probe cleaning device of the embodiment of the invention, the control device determines the selected needle cleaning area according to the detected material of the attachment, and when the attachment is a batting, a film or dust and other dirt which is easy to clean, the probe to be cleaned is aligned with the needle cleaning area corresponding to the needle cleaning material with the lowest hardness and is inserted into the needle cleaning area, for example, the first needle cleaning area formed by a high polymer can be selected. When the attachment is sticky dirt such as metal scraps or silicon scraps, the probe to be cleaned is aligned with a needle cleaning area corresponding to a needle cleaning material with higher hardness and is needled, for example, a second needle cleaning area formed by polished sand paper or a third needle cleaning area formed by gold or gold-plated material can be selected according to the strength of the sticky dirt, and then the needle cleaning area corresponding to the needle cleaning material with the lowest hardness is aligned and needled, for example, a first needle cleaning area is formed by a high polymer.
Further, the control device is further used for determining the number of times of needle insertion according to the size of the detected particles of the attachment, when the detected particles are larger, the control device can increase the number of times of needle insertion, when the detected particles are smaller, the control device can reduce the number of times of needle insertion, and in general, the number of times of needle insertion can be controlled to be 1-3 times, so that abrasion of the probe can be reduced on the premise of ensuring needle cleaning.
Although embodiments of the present invention have been described in connection with the accompanying drawings, various modifications and variations may be made by those skilled in the art without departing from the spirit and scope of the invention, and such modifications and variations are within the scope of the invention as defined by the appended claims.
Claims (17)
1. A probe cleaning apparatus, comprising:
a needle cleaning table;
the needle cleaning pad is arranged on the needle cleaning table and is provided with at least two needle cleaning areas, and different needle cleaning areas are provided with needle cleaning materials with different hardness;
the detection device is arranged at a position on the needle cleaning table, where the needle cleaning pad is not arranged, or on a probe card loaded with a probe to be cleaned, and is used for detecting the material of attachments of the probe tip to be cleaned;
and the control device is used for selecting a corresponding needle cleaning area according to the detected material of the attachment by the detection device, so that the probe to be cleaned executes corresponding needle cleaning action in the selected needle cleaning area.
2. The probe cleaning apparatus of claim 1, wherein the needle cleaning pad comprises a first needle cleaning zone and a second needle cleaning zone, the first needle cleaning zone is formed of a first needle cleaning material, the second needle cleaning zone is formed of a second needle cleaning material, and the first needle cleaning material has a hardness less than a hardness of the second needle cleaning material.
3. The probe cleaning apparatus according to claim 2, wherein the needle cleaning pad comprises:
a substrate;
the first needle cleaning area and the second needle cleaning area are arranged on the substrate.
4. The probe cleaning apparatus of claim 2, wherein the needle cleaning pad further comprises a third needle cleaning zone formed of a third needle cleaning material having a hardness greater than the hardness of the first needle cleaning material and less than the hardness of the second needle cleaning material.
5. The probe cleaning apparatus of claim 4, wherein the needle cleaning pad comprises:
a substrate;
the third needle cleaning material layer is arranged on the substrate;
a first needle-clearing material layer arranged on the third needle-clearing material layer to form the first needle-clearing area;
a second needle-clearing material layer arranged on the third needle-clearing material layer to form the second needle-clearing area;
and the third needle-cleaning area is formed by the area, on which the first needle-cleaning material layer and the second needle-cleaning material layer are not arranged, of the third needle-cleaning material layer.
6. The probe cleaning apparatus of claim 4, wherein the needle cleaning pad comprises:
a substrate;
the first needle cleaning area and the second needle cleaning area are arranged on the substrate;
and the third needle cleaning area is arranged on the substrate and comprises a liner arranged on the substrate and the third needle cleaning material arranged on the liner.
7. A probe cleaning apparatus according to claim 3, wherein an adhesive layer is further provided between the substrate and the needle cleaning zone.
8. The probe cleaning apparatus according to claim 6, wherein an adhesive layer is further provided between the substrate and the needle cleaning region.
9. The probe cleaning apparatus according to any one of claims 2-8, wherein the first needle cleaning material comprises a high molecular polymer and the second needle cleaning material comprises polished sandpaper.
10. The probe cleaning apparatus according to claim 9, wherein the high molecular polymer includes hydrogel-like and silicone gel; and/or
The polishing sand paper is 4000 mesh to 7000 mesh polishing sand paper.
11. The probe cleaning apparatus according to any one of claims 4-6, 8, wherein the third needle cleaning material comprises gold or gold-plated material.
12. The probe cleaning apparatus according to any one of claims 3, 5-8, wherein the substrate is a silicon wafer or a ceramic.
13. The probe cleaning apparatus according to claim 8, wherein the substrate is a silicon wafer or a ceramic, and the pad is a silicon wafer or a ceramic.
14. The probe cleaning apparatus according to any one of claims 1 to 8, 10 and 13, wherein the control device aligns the probe to be cleaned with a needle cleaning area corresponding to a needle cleaning material having the lowest hardness and performs needle insertion when the attachment is easily cleaned dirt; or alternatively
When the attachment is sticky dirt, the probe to be cleaned is aligned with the needle cleaning area corresponding to the needle cleaning material with higher hardness and is subjected to needle insertion, and then the probe to be cleaned is aligned with the needle cleaning area corresponding to the needle cleaning material with lowest hardness and is subjected to needle insertion.
15. The probe cleaning apparatus according to claim 14, wherein the control device is further configured to determine the number of needle sticks based on the detected particle size of the attachment.
16. The probe cleaning apparatus according to claim 14, wherein the control device is further configured to count the number of needle insertion times of each needle clearing area on the needle clearing pad, and send a prompt message to replace the needle clearing pad or the corresponding needle clearing area when the number of needle insertion times of a certain needle clearing area exceeds a predetermined threshold.
17. The probe cleaning apparatus according to any one of claims 1 to 8, 10, 13, 15 to 16, wherein the detecting means is further configured to detect in real time an attached matter of the probe tip to be cleaned, and to stop the needle cleaning action by the control means when the attached matter is not detected; or alternatively
The detection device is also used for detecting attachments of the probe tip to be cleaned after each needle insertion or a preset number of needle insertion, and when the attachments are not detected, the control device stops the needle cleaning action.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210324199.8A CN114798534B (en) | 2022-03-28 | 2022-03-28 | Probe cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210324199.8A CN114798534B (en) | 2022-03-28 | 2022-03-28 | Probe cleaning device |
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| Publication Number | Publication Date |
|---|---|
| CN114798534A CN114798534A (en) | 2022-07-29 |
| CN114798534B true CN114798534B (en) | 2023-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210324199.8A Active CN114798534B (en) | 2022-03-28 | 2022-03-28 | Probe cleaning device |
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| CN (1) | CN114798534B (en) |
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| CN114798534A (en) | 2022-07-29 |
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Effective date of registration: 20240820 Address after: Room 1245-1, Building 3, No. 1366 Hongfeng Road, Kangshan Street, Huzhou City, Zhejiang Province, 313098 Patentee after: Huzhou Hantianxia Electronics Co.,Ltd. Country or region after: China Address before: 215000 building ne-39, Northeast District, Suzhou nano City, No. 99, Jinjihu Avenue, Suzhou Industrial Park, Suzhou City, Jiangsu Province Patentee before: Suzhou hantianxia Electronic Co.,Ltd. Country or region before: China |