CN114798534A - Probe cleaning device - Google Patents
Probe cleaning device Download PDFInfo
- Publication number
- CN114798534A CN114798534A CN202210324199.8A CN202210324199A CN114798534A CN 114798534 A CN114798534 A CN 114798534A CN 202210324199 A CN202210324199 A CN 202210324199A CN 114798534 A CN114798534 A CN 114798534A
- Authority
- CN
- China
- Prior art keywords
- needle
- cleaning
- probe
- needle cleaning
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 221
- 239000000523 sample Substances 0.000 title claims abstract description 129
- 239000011538 cleaning material Substances 0.000 claims abstract description 83
- 238000001514 detection method Methods 0.000 claims abstract description 26
- 230000009471 action Effects 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 39
- 239000010410 layer Substances 0.000 claims description 37
- 238000003780 insertion Methods 0.000 claims description 19
- 230000037431 insertion Effects 0.000 claims description 19
- 238000005498 polishing Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 244000137852 Petrea volubilis Species 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 8
- 238000012360 testing method Methods 0.000 description 5
- 239000000428 dust Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000003670 easy-to-clean Effects 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 244000144992 flock Species 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
An embodiment of the present invention provides a probe cleaning apparatus, including: needle cleaning table; the needle cleaning pad is arranged on the needle cleaning table and is provided with at least two needle cleaning areas, and different needle cleaning areas are provided with needle cleaning materials with different hardness; the detection device is arranged at the position, which is not provided with the probe cleaning pad, on the probe cleaning table or on a probe card loaded with the probe to be cleaned and is used for detecting an attachment at the tip of the probe to be cleaned; and the control device is used for enabling the probe to be cleaned to execute corresponding needle cleaning action in the selected needle cleaning area according to the detection result of the detection device.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to probe cleaning equipment.
Background
In a wafer test flow, a die (die) on a wafer needs to be electrically tested by a probe to ensure that the die is a qualified product before packaging. In order to ensure the accuracy of the wafer test result, after a certain number of tests, the probe needs to be cleaned to remove impurities adhered to the surface of the probe, so that the test result is prevented from generating errors due to the impurities, and the accuracy of the wafer test result is reduced.
The existing scheme for cleaning the probe is to prick the polishing sand paper, but the friction between the sand paper and the probe generates tiny fragments, the needle needs to be pricked repeatedly back and forth for many times to achieve the needle cleaning effect, the effect is not good enough, and the probe may be damaged and increased by the repeated friction on the sand paper. Another prior art solution for cleaning the Probe is to prick the Probe cleaning pad as shown in FIG. 1, the Probe cleaning pad may include a ceramic substrate 11 and a Probe cleaning layer 13, the ceramic substrate 11 and the Probe cleaning layer 13 are bonded together by an adhesive layer, and the Probe cleaning layer 13 is made of a specific material, such as Probe Clean TM A material; however, when the dirt which can be removed by rubbing the needle back and forth is encountered, the needle can be removed by repeatedly pricking the needle back and forth for multiple times, and the cleaning effect and efficiency of the dirt are not good as those of polishing abrasive paper.
Disclosure of Invention
In view of this, embodiments of the present invention provide a probe cleaning apparatus to solve the problem of poor cleaning effect or low cleaning efficiency of the conventional probe.
To this end, an embodiment of the present invention provides a probe cleaning apparatus, including: needle cleaning table; the needle cleaning pad is arranged on the needle cleaning table and is provided with at least two needle cleaning areas, and different needle cleaning areas are provided with needle cleaning materials with different hardness; the detection device is arranged at the position, which is not provided with the probe cleaning pad, on the probe cleaning table or on a probe card loaded with the probe to be cleaned and is used for detecting an attachment at the tip of the probe to be cleaned; and the control device is used for enabling the probe to be cleaned to execute corresponding needle cleaning action in the selected needle cleaning area according to the detection result of the detection device.
Optionally, the needle cleaning pad comprises a first needle cleaning area and a second needle cleaning area, the first needle cleaning area is formed by a first needle cleaning material, the second needle cleaning area is formed by a second needle cleaning material, and the hardness of the first needle cleaning material is smaller than that of the second needle cleaning material.
Optionally, the needle cleaning pad comprises: a substrate; the first needle cleaning area and the second needle cleaning area are arranged on the substrate.
Optionally, the needle cleaning pad further comprises a third needle cleaning area formed by a third needle cleaning material, and the hardness of the third needle cleaning material is greater than that of the first needle cleaning material and less than that of the second needle cleaning material.
Optionally, the needle cleaning pad comprises: a substrate; the third needle cleaning material layer is arranged on the substrate; the first needle cleaning material layer is arranged on the third needle cleaning material layer to form the first needle cleaning area; the second needle cleaning material layer is arranged on the third needle cleaning material layer to form a second needle cleaning area; and the third needle cleaning area is formed in the area, on the third needle cleaning material layer, where the first needle cleaning material layer and the second needle cleaning material layer are not arranged.
Optionally, the needle cleaning pad comprises: a substrate; the first needle cleaning area and the second needle cleaning area are arranged on the substrate; and the third needle cleaning area is arranged on the substrate and comprises a gasket arranged on the substrate and the third needle cleaning material arranged on the gasket.
Optionally, an adhesive layer is further disposed between the substrate and the needle cleaning region.
Optionally, the first needle cleaning material comprises a high molecular polymer, and the second needle cleaning material comprises polishing sand paper.
Optionally, the high molecular polymer comprises a hydrogel-like polymer and a silica gel; and/or the polishing sandpaper is 4000 to 7000 mesh polishing sandpaper.
Optionally, the third needle cleaning material comprises gold or gold-plated material.
Optionally, the substrate is a silicon wafer or ceramic.
Optionally, the liner is a silicon wafer or ceramic.
Optionally, the control device is configured to determine a selected needle cleaning region according to the detected material of the attachment, and when the attachment is easily cleaned and dirty, align the probe to be cleaned with the needle cleaning region corresponding to the needle cleaning material with the lowest hardness and perform needle insertion; or when the attachment is sticky and dirty, the probe to be cleaned is aligned with the needle cleaning area corresponding to the needle cleaning material with higher hardness and is pricked, and then the probe to be cleaned is aligned with the needle cleaning area corresponding to the needle cleaning material with the lowest hardness and is pricked.
Optionally, the control device is further configured to determine the number of needle insertions according to the detected particle size of the attachment.
Optionally, the control device is further configured to count needle insertion times of each needle clearing area on the needle clearing pad, and send a prompt message to replace the needle clearing pad or the corresponding needle clearing area when the needle insertion times of a certain needle clearing area exceed a predetermined threshold value.
Optionally, the detection device is further configured to detect an attachment on the tip of the probe to be cleaned in real time, and when the attachment is not detected, the control device stops the needle cleaning operation; or the detection device is also used for detecting the attachments on the needle point of the probe to be cleaned after each needle insertion or the needle insertion for a preset number of times, and when the attachments are not detected, the control device stops the needle cleaning action.
In the probe cleaning device provided by the embodiment of the invention, at least two probe cleaning areas are arranged through the probe cleaning pad, different probe cleaning areas are formed by probe cleaning materials with different hardness, the attachment of the probe tip to be cleaned is detected through the detection device, and the corresponding probe cleaning area is selected according to the detection result of the detection device to clean the probe, so that the full-automatic probe cleaning process is realized without human intervention, the probe cleaning efficiency can be improved, and unnecessary probe loss caused by excessive probe cleaning is avoided.
Drawings
The features and advantages of the present invention will be more clearly understood by reference to the accompanying drawings, which are illustrative and not to be construed as limiting the invention in any way, and in which:
FIG. 1 shows a schematic view of a prior art needle cleaning pad;
FIG. 2 shows a schematic view of a probe cleaning device according to an embodiment of the invention;
FIG. 3A shows a top view of a needle clearing pad according to an embodiment of the invention;
FIG. 3B shows a cross-sectional view of the needle clearing pad shown in FIG. 3A along the dashed line A-A;
FIG. 4A shows a top view of a needle clearing pad according to another embodiment of the invention;
FIG. 4B shows a cross-sectional view of the needle clearing pad shown in FIG. 4A along the dashed line B-B;
FIG. 5 shows a schematic view of a needle clearing pad according to another embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 2 shows a probe cleaning apparatus according to an embodiment of the present invention, which may include a needle cleaning stage 23, a needle cleaning pad 24, a detection device 25, and a control device (not shown in the drawings), as shown in fig. 2. In an alternative embodiment, the needle cleaning pad 24 is disposed on the needle cleaning table 23, the detecting device 25 is disposed at a position on the needle cleaning table 23 where the needle cleaning pad 24 is not disposed, for example, the detecting device may be disposed at the periphery of the needle cleaning pad 24 or at the outer side of the needle cleaning table 23 to save the detecting time, and is used for detecting the attachments on the needle tips of the probes 24 to be cleaned, and the detecting device 25 may be one, two or more, without any limitation. The detection device 25 may be an additional device, or may be implemented by using an existing microscope (imaging system) on the machine, and the function of the detection device 25 is implemented by modifying the microscope on the machine, so as to reduce the cost of the probe cleaning device. In the example of fig. 2, probes 22 are loaded on probe card 21, and probe card 21 may be loaded with a plurality of probes 22. In another alternative embodiment, the detecting device 25 can be disposed on the probe card 21 carrying the probe 22 to be cleaned, and can also perform the function of detecting the attachments on the tip of the probe 22 to be cleaned.
As an alternative to the embodiment of the present invention, the detecting device 25 may be an infrared sensor, which can detect the material of the attachments on the tip of the probe 24 to be cleaned and the size of the particles. The energy and wavelength of the infrared radiation from the objects made of different materials to the outside are different, so that the infrared sensor can judge the material of the attachment according to the energy and wavelength of the infrared radiation from the attachment at the needle point of the probe 24 to be cleaned to the outside, for example, the attachment can be judged to be sticky dirt such as metal chips or silicon chips, or easily cleaned dirt such as flocks, films or dust. And the infrared sensor can also acquire the particle size of the attachment according to the size of the imaging image of the attachment of the needle point, so that different needle cleaning schemes can be adopted according to the material of the attachment and the particle size subsequently.
The needle cleaning pad 24 comprises at least two needle cleaning areas, and different needle cleaning areas are formed by needle cleaning materials with different hardness. In the example of fig. 3A and 3B, the needle cleaning pad 24 may include 2 needle cleaning regions, namely a first needle cleaning region 31 and a second needle cleaning region 32, the first needle cleaning region 31 being formed of a first needle cleaning material, the second needle cleaning region 32 being formed of a second needle cleaning material, and those skilled in the art will appreciate that many more needle cleaning regions are possible.
The control device (not shown in the figure) is in communication connection with the detection device 25, and the communication connection can be realized in a wired or wireless manner, so that the probe 22 to be cleaned performs a corresponding needle cleaning action on the selected needle cleaning area according to the detection result of the detection device 25. Specifically, the control device changes the relative position between the needle cleaning table 23 and the probe 22 to be cleaned so that the probe 22 to be cleaned is aligned with the selected needle cleaning region. The control device may control the probe card 21 to move toward the probe cleaning stage 23, may control the probe cleaning stage 23 to move toward the probe card 21, or may change the relative position between the probe cleaning stage 23 and the probe 22 to be cleaned by moving both the probe cleaning stage 23 and the probe card 21, for example. After the probe 22 to be cleaned is aligned with the selected needle cleaning area, the control device controls the probe 22 to be cleaned to move towards the selected needle cleaning area, and needles are inserted in the selected needle cleaning area for a plurality of times, so as to achieve the purpose of needle cleaning.
It should be noted that the needle cleaning pad 24 has a certain service life, and after excessive use, the needle cleaning effect thereof will decrease, so that when the number of needle insertions exceeds a predetermined threshold, the needle cleaning effect needs to be timely replaced to ensure the needle cleaning effect. In an optional implementation manner of the embodiment of the present invention, the control device is further configured to count needle inserting times of each needle clearing zone on the needle clearing mat 24, and send a prompt message to replace the needle clearing mat 24 when the needle inserting times of a certain needle clearing zone exceed a predetermined threshold. Of course, for cost reasons, it is also possible to replace only the needle clearing zone with the number of needle insertions exceeding the predetermined threshold value without replacing the entire needle clearing pad.
More specifically, when the detecting device 25 detects that the attachment at the tip of the probe is a lint, a film, or dust, which is easy to clean, the first needle cleaning region 31 may be punctured several times, for example, the needle cleaning is completed 1-3 times according to the particle size of the attachment, so as to avoid unnecessary probe loss caused by excessive needle cleaning on a high-hardness needle cleaning material for a long time. When the detecting device 25 detects that the attachment at the probe tip is sticky dirt such as metal chips or silicon chips, the needle inserting operation may be performed on the second needle cleaning region 32 for several times, and then the needle inserting operation may be performed on the first needle cleaning region 31 for several times to thoroughly clean the fine dirt, and the needle inserting operation may also be performed for 1 to 3 times according to the size of the particles attached to the attachment, so as to improve the needle cleaning efficiency.
In order to reduce the probe loss by reducing the number of needle insertions as much as possible while ensuring the needle cleaning effect, in an optional implementation manner of the embodiment of the present invention, the detecting device 25 is further configured to detect an attachment on the tip of the probe 22 to be cleaned in real time, and when the attachment is not detected, the control device stops the needle cleaning operation.
It should be understood by those skilled in the art that, in order to improve the needle cleaning efficiency, the detecting device 25 may not detect the attachment on the tip of the probe 22 to be cleaned in real time, but detect the attachment on the tip of the probe after each needle insertion or after a predetermined number of needle insertions, and cause the control device to stop the needle cleaning operation when the attachment is not detected. The predetermined number of needle insertions may be set by the user, for example, 2 or 3 times, etc. Of course, the predetermined number of times can also be determined by the control device according to the size of the particles of the currently detected attachments, for example, the particles of the currently detected attachments are larger, the control device performs needle insertion 2 times in the corresponding needle clearing area, the particles are already small, and the control device performs needle insertion 1 time in the corresponding needle clearing area, and thus the needle clearing efficiency is improved as much as possible.
In the probe cleaning device provided by the embodiment of the invention, at least two probe cleaning areas are arranged through the probe cleaning pad, different probe cleaning areas are formed by probe cleaning materials with different hardness, the attachment of the probe tip to be cleaned is detected through the detection device, and the corresponding probe cleaning area is selected according to the detection result of the detection device to clean the probe, so that the full-automatic probe cleaning process is realized without human intervention, the probe cleaning efficiency can be improved, and unnecessary probe loss caused by excessive probe cleaning is avoided.
As an alternative to the embodiment of the present invention, as shown in fig. 3A and 3B, the needle cleaning pad 24 may include a substrate 33, a first needle cleaning region 31 and a second needle cleaning region 32, wherein the first needle cleaning region 31 and the second needle cleaning region 32 are disposed on the substrate 33. The substrate 33 may be a ceramic substrate or a silicon wafer, for example. In an alternative embodiment, the first needle cleaning area 31 is made of a needle cleaning material with lower hardness, and the second needle cleaning area 32 is made of a needle cleaning material with higher hardness. Specifically, the first needle cleaning region 31 may be formed of a high molecular polymer, such as hydrogel-like or silicone gel, and the second needle cleaning region 32 may be formed of polishing sandpaper, such as 4000-7000 mesh polishing sandpaper, so that different needle cleaning schemes may be adopted according to the detection result of the detection device 25. It should be noted that, the mesh number of the polishing sand paper can be selected by those skilled in the art according to the specific situation. Further, as shown in fig. 3B, an adhesive layer 34 is further disposed between the substrate 33 and the first and second needle cleaning regions 31 and 32.
As another alternative to the embodiment of the present invention, as shown in fig. 4A and 4B, the needle cleaning pad 24 may further include a first needle cleaning region 41, a second needle cleaning region 42, and a third needle cleaning region 43, the first needle cleaning region 41 is formed of a first needle cleaning material, the second needle cleaning region 42 is formed of a second needle cleaning material, the third needle cleaning region 43 is formed of a third needle cleaning material, and the hardness of the third needle cleaning material is greater than the hardness of the first needle cleaning material and less than the hardness of the second needle cleaning material. Alternatively, the first needle cleaning material may be a high molecular polymer, the second needle cleaning material may be polishing sandpaper, and the third needle cleaning material may be gold or a gold-plated material. As shown in fig. 4B, the needle cleaning pad may include a substrate 44, a third needle cleaning material layer 43, a first needle cleaning material layer 41, and a second needle cleaning material layer 42. Wherein the substrate 44 may be a silicon wafer or a ceramic substrate, the third needle-cleaning material layer 43 may be a gold layer plated on the substrate 44, the first needle-cleaning material layer 41 and the second needle-cleaning material layer 42 are disposed on the third needle-cleaning material layer 43, for example, adhered to the third needle-cleaning material layer 43, the first needle-cleaning material layer 41 forms a first needle-cleaning region, the second needle-cleaning material layer 42 forms a second needle-cleaning region, and a region of the third needle-cleaning material layer 43 where the first needle-cleaning material layer 41 and the second needle-cleaning material layer 42 are not disposed forms a third needle-cleaning region. The hardness of gold is between polishing abrasive paper and high molecular polymer, and when treating that clean probe is dirty not serious, can make the probe prick on third clear needle material layer 43, golden layer promptly, because the hardness of gold is soft a lot than polishing abrasive paper, can be in the better protection probe under the prerequisite of guaranteeing to clear the needle. Since the polishing sandpaper and the high molecular polymer are adhered to the gold layer and are easily removed, the gold layer plated on the substrate 44 is easily recovered when the needle cleaning pad is discarded.
As another alternative to the embodiment of the present invention, as shown in fig. 5, the needle cleaning pad may include a substrate 55, a first needle cleaning region 51, a second needle cleaning region 52, and a third needle cleaning region. The first needle cleaning region 51, the second needle cleaning region 52 and the third needle cleaning region are disposed on a substrate 55, wherein the third needle cleaning region includes a pad 54 disposed on the substrate 55 and a third needle cleaning material 53 disposed on the pad 54. Further, the first needle cleaning region 51, the second needle cleaning region 52 and the third needle cleaning region are further provided with an adhesive layer 56 with the substrate 55. In this embodiment, the first needle cleaning region 51 may be formed of a high molecular polymer, such as hydrogel-like or silicone gel, the second needle cleaning region 52 may be formed of polishing sandpaper, such as 4000-7000 mesh polishing sandpaper, the third needle cleaning material 53 may be gold or gold-plated material, the substrate 55 may be a ceramic substrate or a silicon wafer, and the pad 54 may also be a ceramic substrate or a silicon wafer.
In the probe cleaning apparatus according to the embodiment of the present invention, the control device determines the selected needle cleaning region according to the material of the detected attachment, and when the attachment is easy to clean and dirty, such as lint, film, or dust, the probe to be cleaned is aligned with the needle cleaning region corresponding to the needle cleaning material with the lowest hardness, and needle insertion is performed, for example, the first needle cleaning region formed by a polymer may be selected. When the attachment is sticky dirt such as metal chips or silicon chips, the probe to be cleaned is aligned with the needle cleaning area corresponding to the needle cleaning material with higher hardness and is pricked, for example, a second needle cleaning area formed by polishing sand paper or a third needle cleaning area formed by gold or gold-plated material can be selected according to the strength of the stickiness, and then the needle cleaning area corresponding to the needle cleaning material with the lowest hardness is aligned and is pricked, for example, the first needle cleaning area is formed by high molecular polymer.
Furthermore, the control device is also used for determining the times of pricking according to the size of the particles of the detected attachments, when the particles are detected to be large, the control device can increase the times of pricking, when the particles are detected to be small, the control device can reduce the times of pricking, and generally, the times of pricking can be controlled to be 1-3 times, so that the abrasion of the probe can be reduced on the premise of ensuring the needle cleaning.
Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations fall within the scope defined by the appended claims.
Claims (16)
1. A probe cleaning apparatus, comprising:
needle cleaning table;
the needle cleaning pad is arranged on the needle cleaning table and is provided with at least two needle cleaning areas, and different needle cleaning areas are provided with needle cleaning materials with different hardness;
the detection device is arranged at the position, which is not provided with the probe cleaning pad, on the probe cleaning table or on a probe card loaded with the probe to be cleaned and is used for detecting an attachment at the tip of the probe to be cleaned;
and the control device is used for enabling the probe to be cleaned to execute corresponding needle cleaning action in the selected needle cleaning area according to the detection result of the detection device.
2. The probe cleaning apparatus of claim 1, wherein the needle cleaning pad comprises a first needle cleaning region and a second needle cleaning region, the first needle cleaning region is formed of a first needle cleaning material, the second needle cleaning region is formed of a second needle cleaning material, and a hardness of the first needle cleaning material is less than a hardness of the second needle cleaning material.
3. The probe cleaning apparatus of claim 2, wherein the needle cleaning pad comprises:
a substrate;
the first needle cleaning area and the second needle cleaning area are arranged on the substrate.
4. The probe cleaning apparatus of claim 2, wherein the needle cleaning pad further comprises a third needle cleaning region formed of a third needle cleaning material having a hardness greater than the hardness of the first needle cleaning material and less than the hardness of the second needle cleaning material.
5. The probe cleaning apparatus of claim 4, wherein the needle cleaning pad comprises:
a substrate;
the third needle cleaning material layer is arranged on the substrate;
the first needle cleaning material layer is arranged on the third needle cleaning material layer to form the first needle cleaning area;
the second needle cleaning material layer is arranged on the third needle cleaning material layer to form a second needle cleaning area;
and the third needle cleaning area is formed in the area, on the third needle cleaning material layer, where the first needle cleaning material layer and the second needle cleaning material layer are not arranged.
6. The probe cleaning apparatus according to claim 4, wherein the cleaning pad comprises:
a substrate;
the first needle cleaning area and the second needle cleaning area are arranged on the substrate;
and the third needle cleaning area is arranged on the substrate and comprises a gasket arranged on the substrate and the third needle cleaning material arranged on the gasket.
7. The probe cleaning apparatus according to claim 3 or 6, wherein an adhesive layer is further disposed between the substrate and the needle cleaning region.
8. The probe cleaning apparatus according to any of claims 2-7, wherein the first needle cleaning material comprises a polymer and the second needle cleaning material comprises polished sandpaper.
9. The probe cleaning apparatus according to claim 8, wherein the polymer comprises a hydrogel-like polymer and a silicone gel; and/or
The polishing sand paper is 4000 meshes to 7000 meshes.
10. The probe cleaning apparatus according to any one of claims 4 to 7, wherein the third probe cleaning material comprises gold or a gold-plated material.
11. The probe cleaning apparatus according to any one of claims 3, 5 to 7, wherein the substrate is a silicon wafer or ceramic.
12. The probe cleaning apparatus according to claim 11, wherein the pad is a silicon wafer or ceramic.
13. The probe cleaning device according to any one of claims 1 to 12, wherein the control device is configured to determine a selected needle cleaning region according to the detected material of the attachment, and when the attachment is easily cleaned and dirty, align the probe to be cleaned with the needle cleaning region corresponding to the needle cleaning material with the lowest hardness and perform needle insertion; or
When the attachment is sticky and dirty, the probe to be cleaned is aligned with the needle cleaning area corresponding to the needle cleaning material with higher hardness and is pricked, and then the probe is aligned with the needle cleaning area corresponding to the needle cleaning material with the lowest hardness and is pricked.
14. The probe cleaning apparatus according to claim 13, wherein the control means is further configured to determine the number of needle insertions based on the detected particle size of the attachment.
15. The probe cleaning device according to claim 13, wherein the control device is further configured to count needle inserting times of each needle removing area on the needle removing pad, and send a prompt message to replace the needle removing pad or the corresponding needle removing area when the needle inserting times of a certain needle removing area exceed a predetermined threshold.
16. The probe cleaning apparatus according to any one of claims 1 to 15, wherein the detecting means is further configured to detect an attachment of the probe tip to be cleaned in real time, and when the attachment is not detected, the control means is configured to stop the needle cleaning operation; or alternatively
The detection device is also used for detecting the attachments of the needle point of the probe to be cleaned after each needle insertion or the needle insertion for a preset number of times, and when the attachments are not detected, the control device stops the needle cleaning action.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210324199.8A CN114798534B (en) | 2022-03-28 | 2022-03-28 | Probe cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210324199.8A CN114798534B (en) | 2022-03-28 | 2022-03-28 | Probe cleaning device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114798534A true CN114798534A (en) | 2022-07-29 |
| CN114798534B CN114798534B (en) | 2023-08-11 |
Family
ID=82533377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210324199.8A Active CN114798534B (en) | 2022-03-28 | 2022-03-28 | Probe cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114798534B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115656587A (en) * | 2022-11-15 | 2023-01-31 | 广州粤芯半导体技术有限公司 | Probe card monitoring system and method |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001326258A (en) * | 2000-05-17 | 2001-11-22 | Tokyo Seimitsu Co Ltd | How to clean the probe of the probe card |
| US6353221B1 (en) * | 1999-01-29 | 2002-03-05 | Veeco Instruments Inc. | Method and apparatus for cleaning a tip of a probe of a probe-based measuring instrument |
| KR20040004892A (en) * | 2002-07-06 | 2004-01-16 | 삼성전자주식회사 | Apparatus for cleaning test probe of probing system and method for cleaning thereof |
| US20040083568A1 (en) * | 2001-04-09 | 2004-05-06 | Nihon Microcoating Co., Ltd. | Device for cleaning tip and side surfaces of a probe |
| US20050191952A1 (en) * | 2004-03-01 | 2005-09-01 | Kenji Mitarai | Cleaning sheet for probe needles |
| CN202421389U (en) * | 2011-12-22 | 2012-09-05 | 上海华虹Nec电子有限公司 | Probe cleaning piece |
| CN103969267A (en) * | 2014-05-20 | 2014-08-06 | 上海华力微电子有限公司 | Cleaning control method of particulate matters on probes of probe card |
| CN106504977A (en) * | 2015-09-07 | 2017-03-15 | 中芯国际集成电路制造（天津）有限公司 | Probe clean method and probe cleaning device |
| CN107436373A (en) * | 2016-05-26 | 2017-12-05 | 中芯国际集成电路制造(上海)有限公司 | A kind of clear needle system of card grinding and method for being used to test probe oxidation |
| CN110850268A (en) * | 2018-08-21 | 2020-02-28 | 华邦电子股份有限公司 | Test system and method thereof |
| CN112557874A (en) * | 2020-12-04 | 2021-03-26 | 上海华岭集成电路技术股份有限公司 | Method for automatically controlling grinding pin in wafer test process |
| TWM624884U (en) * | 2021-12-01 | 2022-03-21 | 神興科技股份有限公司 | Double-layered probe pin cleaning sheet |
-
2022
- 2022-03-28 CN CN202210324199.8A patent/CN114798534B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6353221B1 (en) * | 1999-01-29 | 2002-03-05 | Veeco Instruments Inc. | Method and apparatus for cleaning a tip of a probe of a probe-based measuring instrument |
| JP2001326258A (en) * | 2000-05-17 | 2001-11-22 | Tokyo Seimitsu Co Ltd | How to clean the probe of the probe card |
| US20040083568A1 (en) * | 2001-04-09 | 2004-05-06 | Nihon Microcoating Co., Ltd. | Device for cleaning tip and side surfaces of a probe |
| KR20040004892A (en) * | 2002-07-06 | 2004-01-16 | 삼성전자주식회사 | Apparatus for cleaning test probe of probing system and method for cleaning thereof |
| US20050191952A1 (en) * | 2004-03-01 | 2005-09-01 | Kenji Mitarai | Cleaning sheet for probe needles |
| CN202421389U (en) * | 2011-12-22 | 2012-09-05 | 上海华虹Nec电子有限公司 | Probe cleaning piece |
| CN103969267A (en) * | 2014-05-20 | 2014-08-06 | 上海华力微电子有限公司 | Cleaning control method of particulate matters on probes of probe card |
| CN106504977A (en) * | 2015-09-07 | 2017-03-15 | 中芯国际集成电路制造（天津）有限公司 | Probe clean method and probe cleaning device |
| CN107436373A (en) * | 2016-05-26 | 2017-12-05 | 中芯国际集成电路制造(上海)有限公司 | A kind of clear needle system of card grinding and method for being used to test probe oxidation |
| CN110850268A (en) * | 2018-08-21 | 2020-02-28 | 华邦电子股份有限公司 | Test system and method thereof |
| CN112557874A (en) * | 2020-12-04 | 2021-03-26 | 上海华岭集成电路技术股份有限公司 | Method for automatically controlling grinding pin in wafer test process |
| TWM624884U (en) * | 2021-12-01 | 2022-03-21 | 神興科技股份有限公司 | Double-layered probe pin cleaning sheet |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115656587A (en) * | 2022-11-15 | 2023-01-31 | 广州粤芯半导体技术有限公司 | Probe card monitoring system and method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114798534B (en) | 2023-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6056627A (en) | Probe cleaning tool, probe cleaning method and semiconductor wafer testing method | |
| JP3188935B2 (en) | Inspection device | |
| US10195648B2 (en) | Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware | |
| US6130104A (en) | Cleaner for inspecting projections, and inspection apparatus and method for integrated circuits | |
| US6908364B2 (en) | Method and apparatus for probe tip cleaning and shaping pad | |
| TW442878B (en) | Mechanism and method for cleaning probe needles | |
| US6960123B2 (en) | Cleaning sheet for probe needles | |
| US20080070481A1 (en) | Probe cleaner and cleaning method | |
| US6170116B1 (en) | Abrasive member and cleaning device for probe needle for probe card | |
| JP2511806B2 (en) | Probe tip cleaning material | |
| CN114798534A (en) | Probe cleaning device | |
| US7254861B2 (en) | Device for cleaning tip and side surfaces of a probe | |
| GB2389303A (en) | Process/apparatus for removing debris from the probe needlde contacts of an IC test card | |
| JP2000332069A (en) | Cleaning member at contact tip | |
| CN106504977A (en) | Probe clean method and probe cleaning device | |
| US7182672B2 (en) | Method of probe tip shaping and cleaning | |
| US20060065290A1 (en) | Working surface cleaning system and method | |
| JP4052966B2 (en) | Wafer inspection apparatus and inspection method thereof | |
| CN117405954B (en) | Method for removing oxide layer of probe card, cleaning and testing system | |
| KR20090004052A (en) | Polishing pad and manufacturing method thereof | |
| JP2001326258A (en) | How to clean the probe of the probe card | |
| JPH1019928A (en) | Cleaning member and cleaning method | |
| JPH1071552A (en) | Fine projection polishing method and apparatus | |
| JPH10209231A (en) | Probe device and inspection method using probe device | |
| JP3818108B2 (en) | Probe tip cleaning member, probe cleaning device, and probe tip cleaning method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240820 Address after: Room 1245-1, Building 3, No. 1366 Hongfeng Road, Kangshan Street, Huzhou City, Zhejiang Province, 313098 Patentee after: Huzhou Hantianxia Electronics Co.,Ltd. Country or region after: China Address before: 215000 building ne-39, Northeast District, Suzhou nano City, No. 99, Jinjihu Avenue, Suzhou Industrial Park, Suzhou City, Jiangsu Province Patentee before: Suzhou hantianxia Electronic Co.,Ltd. Country or region before: China |
|
| TR01 | Transfer of patent right |