CN114690502A - Electronic equipment, electrochromic module and method of making the same - Google Patents

Abstract

The application provides an electronic device, an electrochromic module and a manufacturing method thereof; the electrochromic module comprises a first metal wire, a second metal wire, a first substrate, a first conducting layer, a color-changing material layer, a second conducting layer and a second substrate which are sequentially stacked; the first metal routing wire and the second metal routing wire are respectively connected with the first conductive layer and the second conductive layer; the first conducting layer is provided with a first routing leading-out end connected with the first metal routing and a second routing leading-out end which is adjacent to the first metal routing and is arranged at intervals; the conductive column penetrates through the second substrate and the second conductive layer, one end of the conductive column is electrically connected with the second metal routing, and the other end of the conductive column is electrically connected with the second routing leading-out end through the conductive material. The electrochromic module has the characteristics of relatively simple and feasible structure and process, and easy realization of automatic production, and solves the problems of poor product stability and low yield in manual operation.

Description

Electronic equipment, electrochromic module and method of making the same

technical field

The present invention relates to the technical field of electrochromic module structure and manufacturing process, in particular to an electronic device, an electrochromic module and a manufacturing method thereof.

Background technique

At present, the housings of electronic products such as smart phones are generally composed of protective glass cover plates or plastics with built-in decorative films. The color or pattern of the shell is relatively fixed, the effect of various color changes cannot be achieved, and the appearance expression is not ideal. In addition, the shell has a single function, which only plays the role of protecting the mobile phone, and cannot achieve dynamic effects with the changes of the mobile phone, and lacks interaction with the user.

There are some proposals based on electrochromic technology to propose a color-changing decorative film for mobile phones. However, in the application process, there are problems of poor structural reliability, complicated preparation process and low preparation efficiency.

SUMMARY OF THE INVENTION

A first aspect of the embodiments of the present application provides an electrochromic module. The electrochromic module includes a first metal wiring, a second metal wiring, and a first substrate, a first conductive layer, a first substrate, a first conductive layer, a a color-changing material layer, a second conductive layer, and a second substrate; wherein the first metal wiring and the second metal wiring are respectively connected to the first conductive layer and the second conductive layer;

Wherein, the first conductive layer is provided with a first wire lead-out end connected to the first metal wire and a second wire lead-out end adjacent to the first metal wire and arranged at intervals;

The electrochromic module further includes a conductive column, the conductive column penetrates through the second substrate and the second conductive layer, one end of the conductive column is electrically connected with the second metal wire, and the other end passes through the second conductive layer. The conductive material is electrically connected to the second wire lead-out end.

In a second aspect, an embodiment of the present application provides an electronic device, the electronic device includes a display screen module, a control circuit board, and a casing assembly; the casing assembly includes a casing and any one of the above embodiments The electrochromic module, the display module cooperates with the casing to form an accommodation space, the control circuit board and the electrochromic module are arranged in the accommodation space, the The color-changing module is attached to the inner surface of the casing; the control circuit board is coupled and connected to the first lead-out end and the second lead-out end of the electrochromic module, and is used to control the electrical The chromic module changes color.

In addition, the embodiments of the present application further provide a method for manufacturing an electrochromic module, the manufacturing method comprising:

A first assembly board is provided; wherein, the first assembly board includes a first substrate and a first conductive layer arranged in layers; a first metal wire and a first metal wire are arranged on the first conductive layer and are connected with the first metal wire a connected first wire lead-out end, and a second wire lead-out end adjacent to the first metal wire and arranged at intervals;

A second assembly board is provided; wherein, the second assembly board includes a second substrate and a second conductive layer arranged in layers; a second metal trace is arranged on the second conductive layer;

Punch connection holes on the second assembly board; wherein, the connection holes penetrate through the second substrate and the second conductive layer and communicate with the second metal traces;

Filling the conductive material in the connection hole and curing to form a conductive column;

forming a color-changing material layer between the first assembly plate and the second assembly plate;

One end of the conductive column away from the second metal wiring is electrically connected to the second wiring lead-out end on one side of the first assembly board by using a conductive material.

In the electrochromic module provided by the embodiments of the present application, the conductive layers on the upper and lower sides of the electrochromic module are unified into One side of the substrate (the lead-out end of the lead) is used for lead-out, which can realize the single-sided binding of the electrochromic module, and facilitate the subsequent binding process of the flexible circuit board; in addition, the electrochromic module provided in this application The structure and process of the group are relatively simple and easy to implement, and it is easier to realize automatic production, which overcomes the problems of poor product stability and low yield due to manual operation.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort.

Fig. 1 is a kind of structural representation of the electrochromic module before improvement;

2 is a schematic diagram of the overall structure of an embodiment of the electrochromic module of the present application;

Fig. 3 is the structural cross-sectional schematic diagram at A-A place in the embodiment of Fig. 2;

4 is a schematic view of a partial structure stacking of an embodiment of an electrochromic module;

Fig. 5 is the partial structure disassembly schematic diagram of electrochromic module in Fig. 2;

Fig. 6 is the partial structure enlarged schematic diagram at B in Fig. 2;

Fig. 7 is the structural cross-sectional schematic diagram at C-C place in Fig. 2;

8 is a schematic cross-sectional view of a partial structure of another embodiment of the electrochromic module of the present application;

9 is a schematic front view of the structure of another embodiment of the electrochromic module of the present application;

Fig. 10 is the structural disassembly schematic diagram of the electrochromic module in the embodiment of Fig. 9;

FIG. 11 is an enlarged schematic view of the structure at D in FIG. 9;

Fig. 12 is a schematic cross-sectional view of the structure at E-E in the embodiment of Fig. 9;

13 is a schematic structural diagram of an embodiment of a housing assembly of the present application;

14 is a schematic diagram of a back structure of an embodiment of the electronic device of the present application;

FIG. 15 is a schematic cross-sectional structure diagram of the electronic device at F-F in the embodiment of FIG. 14;

16 is a schematic block diagram of a structural composition of an embodiment of an electronic device of the present application;

17 is a schematic flowchart of an embodiment of a method for manufacturing an electrochromic module of the present application;

18 is a schematic structural diagram of an embodiment of punching connecting holes on the second assembly board;

FIG. 19 is a schematic structural diagram of another embodiment of punching connecting holes on the second assembly board.

Detailed ways

The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is particularly pointed out that the following examples are only used to illustrate the present invention, but do not limit the scope of the present invention. Likewise, the following embodiments are only some rather than all embodiments of the present invention, and all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor a separate or alternative embodiment that is mutually exclusive of other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

"Electronic equipment" (or simply "terminal") as used herein includes, but is not limited to, is configured to be connected via a wired line (eg, via a public switched telephone network (PSTN), digital subscriber line (DSL), digital cable, Direct cable connection, and/or another data connection/network) and/or via (eg, for cellular networks, wireless local area networks (WLAN), digital television networks such as DVB-H networks, satellite networks, AM-FM broadcast transmitters , and/or another communication terminal's) wireless interface to receive/send communication signals. A communication terminal arranged to communicate through a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; Personal Communication System (PCS) terminals that may combine cellular radio telephones with data processing, fax, and data communication capabilities; may include radio telephones, pagers, Internet/Intranet access , a PDA with a web browser, memo pad, calendar, and/or a global positioning system (GPS) receiver; and conventional laptop and/or palm receivers or other electronic devices including radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.

Please refer to FIG. 1. FIG. 1 is a schematic structural diagram of the electrochromic module before the improvement. The technical solution before the improvement is generally a relatively simple two-side dislocation wiring structure in the illustration, and the two-side dislocation wiring is an edge position on the one hand. The invalid area W (the trace area and the edge area are not effective discoloration areas) is wider, on the other hand, two traces need to be drawn out respectively, that is, two FPC connections are required for the electronic equipment, occupying the internal space of the electronic equipment; Set twice, the process is cumbersome, obviously not suitable for use in electronic equipment. The reference numeral 1 in the figure represents the first substrate, the reference numeral 2 represents the first conductive layer, the reference numeral 3 represents the electrochromic material, the reference numeral 4 represents the second conductive layer, the reference numeral 5 represents the second substrate, the reference numeral 6 represents the sealant frame, Reference numeral 7 denotes metal wiring.

In view of the above technical problems, embodiments of the present application provide an electrochromic module structure. Please refer to FIG. 2 and FIG. 3 together, FIG. 2 is a schematic diagram of the overall structure of an embodiment of the electrochromic module of the present application, and FIG. 3 is a schematic cross-sectional view of the structure at A-A in the embodiment of FIG. 2 ; Electronic devices in the application may include mobile phones, tablet computers, laptop computers, wearable devices, etc. The electrochromic module 100 in this embodiment includes a first substrate 110 , a first conductive layer 120 , a color-changing material layer 130 , a second conductive layer 140 , a second substrate 150 , a plastic frame 160 and metal traces 180 . It should be noted that the terms "comprising" and "having" and any modifications thereof in the embodiments of the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally also includes Other steps or components inherent to these processes, methods, products or devices.

Specifically, the first substrate 110 , the first conductive layer 120 , the color-changing material layer 130 , the second conductive layer 140 and the second substrate 150 are stacked in sequence; in this embodiment, The plastic frame 160 is arranged around the color-changing material layer 130 (the structure of the plastic frame is not shown in FIG. 2 , but is schematically shown in FIG. 3 ). The surface of a conductive layer 120 is bonded to the side surfaces of the second substrate 150 , the second conductive layer 140 , and the color-changing material layer 130 . In some other embodiments, the plastic frame 160 may also be connected to the first substrate 110 and the second substrate 110 The two substrates 150 are bonded or provided with the first substrate 110 , the first conductive layer 120 , the color-changing material layer 130 , the second conductive layer 140 and the side circumference of the second substrate 150 , which are not specifically limited here.

Optionally, in this embodiment, the material of the first substrate 110 and the second substrate 150 is a flexible transparent resin material, so that the overall structure of the electrochromic module 100 is a flexible and bendable structure. The first substrate 110 and the second substrate 150 function to support and protect the internal structure. In some embodiments, the material of the first substrate 110 and the second substrate 150 may be PET (Polyethylene terephthalate for short PET or PEIT, commonly known as polyester resin, polycondensate of terephthalic acid and ethylene glycol), PMMA (polymethyl methacrylate) Methyl acrylate (poly(methyl methacrylate), referred to as PMMA), also known as acrylic, acrylic (English Acrylic or plexiglass), PC (Polycarbonate, polycarbonate (English referred to as PC) is a molecular chain containing carbonic acid Ester-based polymer), PI (Polyimide), etc. Regarding more material types of the first substrate 110 and the second substrate 150 , within the understanding of those skilled in the art, they will not be listed and described in detail here. Wherein, the formation method of the first conductive layer 120 and the second conductive layer 140 may be physical vapor deposition (PVD, Physical Vapor Deposition), specifically including vacuum evaporation, sputtering, ion plating (hollow cathode ion plating, hot cathode ion plating) , arc ion plating, reactive reactive ion plating, radio frequency ion plating, DC discharge ion plating) and so on.

The thicknesses of the first conductive layer 120 and the second conductive layer 140 may be respectively between 100 nm and 300 nm, and may specifically be 100 nm, 120 nm, 150 nm, 200 nm, 280 nm, and 300 nm. The materials of the first conductive layer 120 and the second conductive layer 140 are made of transparent conductive materials. The transparent conductive material may be indium tin oxide (ITO), zinc aluminum oxide (AZO), tin oxide doped with fluorine (FTO), or a graphene film.

Please refer to FIG. 4 . FIG. 4 is a schematic view of a partial structure stacking of an embodiment of the electrochromic module, wherein the color-changing material layer 130 further includes a sub-layer structure. As shown in FIG. 4 , the color-changing material layer 130 includes a structure sandwiched between An electrochromic layer (ie EC layer) 131 , a dielectric layer 132 , and an ion storage layer (ie IC layer) 133 are stacked in sequence between the first conductive layer 120 and the second conductive layer 140 . Optionally, the material of the electrochromic layer 131 can be selected from organic polymers (including polyaniline, polythiophene, etc.), inorganic materials (Prussian blue, transition metal oxides, such as tungsten trioxide), and small organic molecules (violet fine) etc. In the embodiments of the present application, the electrochromic layer 131 is an organic polymer as an example for description, and the electrochromic layer 131 may be a solid or gel state material. Optionally, the ion storage layer 133 and the dielectric layer 132 may be formed on the conductive layer by means of blade coating, and the electrochromic layer 131 (wherein the electrochromic layer 131 is the organic polymer or inorganic material) can be formed by scraping or drip irrigation, and the detailed technical features of this part are within the understanding of those skilled in the art, and will not be described in detail here.

Optionally, please continue to refer to FIG. 3, the metal trace 180 specifically includes a first metal trace 181 and a second metal trace 182; the first metal trace 181 is connected to the first conductive layer 120, and the The second metal traces 182 are connected to the second conductive layer 140 . The metal wiring 180 includes, but is not limited to, silver paste wiring, copper plating, aluminum plating, or a multi-layer wiring structure such as molybdenum, aluminum, and molybdenum.

Optionally, please continue to refer to FIG. 2. In this embodiment, the first metal traces 181 are arranged along the edge position close to the surface of the first conductive layer 120, and the second metal traces 182 are located along the edges close to the surface of the first conductive layer 120. The edge position of the surface of the second conductive layer 140 is set. The specific structure of the wiring has various design forms, such as the ring shape in the illustrated embodiment, and in some other embodiments, it can also be an L-shaped wiring, etc., which is not specifically limited here.

In order to make the electrochromic module have a faster discoloration speed, the square resistance of the first conductive layer 120 and the second conductive layer 140 is set to 10-150 ohms, such as 10 ohms, 20 ohms, 40 ohms, 50 ohms , 80 ohms, 100 ohms, 120 ohms, 150 ohms and other specific values; and the square resistance of the first metal trace 181 and the second metal trace 182 can be 0.05-2 ohms, specifically 0.05 ohms, 0.06 ohms, 0.1 ohms Euros, 1.2 Euros, 1.5 Euros, 2 Euros and other values, which are not specifically limited here. The coloring speed of the electrochromic module can be between 3-20s, the fading speed is between 3-15s, or faster.

Among them, the first substrate 110 in the embodiment of the present application, the first conductive layer 120 disposed on the first substrate 110 , and the first conductive layer 120 disposed on the first conductive layer 120 and electrically connected to the first conductive layer 120 The connected first metal traces 181 together form the first assembly board structure; the second substrate 150, the second conductive layer 140 disposed on the second substrate 150, and the second conductive layer 140 and the The second metal traces 182 electrically connected to the second conductive layer 140 together constitute the structure of the second assembly board; in addition, the sub-layer structure of the color-changing material layer 130 can also be divided into the first assembly board and the second assembly board structure, no specific limitation is made here. It should be noted that the terms "first", "second" and "third" in the embodiments of the present application are only used for description purposes, and should not be interpreted as indicating or implying relative importance or implicitly indicating the indicated technology number of features. Thus, a feature defined as "first", "second", "third" may expressly or implicitly include at least one of that feature. In the description of the present invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined.

Optionally, please continue to refer to FIG. 2, the electrochromic module 100 in this embodiment further includes a flexible circuit board 183, the flexible circuit board 183 is connected to the first metal wiring 181 and the second metal wire respectively Trace 182 is connected. The first metal traces 181 and the second metal traces 182 pass through the flexible circuit board 183 and an external driving circuit (specifically, the control circuit board of an electronic device or a self-contained chip structure, not shown in the figure, and also not done here. Specifically defined) connection, the external drive circuit provides power for the electrochromic module and drives the electrochromic material to change color.

Please refer to FIG. 5 and FIG. 6 together. FIG. 5 is a schematic diagram of a partial structure disassembly of the electrochromic module in FIG. 2 , and FIG. 6 is an enlarged schematic diagram of a partial structure at B in FIG. 2 ; The first conductive layer 120 is provided with a first lead terminal 1811 connected to the first metal trace 181 . The first lead terminal 1811 in this embodiment may be an integral structure with the first metal trace 181 (The one-piece structure mentioned here refers to being connected to each other, and may be formed by the same layer or the same molding process), and is disposed on the first conductive layer 120 .

Further, the first conductive layer 120 is further provided with a second wire lead-out end 1812 adjacent to the first metal wire 181 and insulatingly disposed. The electrochromic module further includes conductive pillars 184, wherein the number of the conductive pillars 184 can be multiple. Please refer to FIG. 7 . FIG. 7 is a schematic cross-sectional view of the structure at C-C in FIG. 2 . The conductive column 184 penetrates the second substrate 150 and the second conductive layer 140 , and one end of the conductive column 184 is connected to the second conductive layer 140 . The second metal wiring 182 is electrically connected, and the other end is electrically connected to the second wiring lead-out end 1812 through the conductive material 185 .

Optionally, the number of the conductive pillars 184 may be multiple, and the diameter of each conductive pillar 184 may be 0.1-2 mm, specifically 0.1 mm, 0.5 mm, 0.8 mm, 1 mm, 2 mm, and the like. The material of the conductive pillars 184 may be metals such as silver and copper. The conductive material 185 may include any one of silver, copper, and conductive glue. There is no specific limitation here.

The second metal wiring 182 in the technical solution of this embodiment is electrically connected to the second wiring lead-out end 1812 on the other substrate side (the side of the first conductive layer 120 on the first substrate 110 ) through the conductive pillar 184 and the conductive material 185 . Conductive connection. The flexible circuit board 183 is connected with the second lead-out end 1812 and the first lead-out end 1811 on the same side (the first substrate side) of the electrochromic module, so that the metal lines on both sides can be connected from one side. The purpose of bonding (one-sided bonding) with the flexible circuit board on the substrate. The structure binding process is simple, and the area of the non-color-changing region at the edge position can be minimized.

Please refer to FIG. 8 . FIG. 8 is a schematic cross-sectional view of a partial structure of another embodiment of the electrochromic module of the present application. The difference from the structure in the embodiment in FIG. 7 is that the conductive pillars 184 in this embodiment penetrate through the second embodiment. The substrate 150 , the second conductive layer 140 and the second metal wiring 182 are electrically connected to the second metal wiring 182 . This design structure is mainly considered from the formation method of the conductive pillars 184 (which will be described in detail in the subsequent method). On the side of the traces 182 ) silk-screening or pouring conductive materials into the holes to form the structure of the conductive pillars 184 .

Optionally, please continue to refer to FIG. 8 , the material of the conductive pillars 184 can be silver paste. The flexibility, ductility and good electrical conductivity of silver paste material. However, the silver paste is likely to swell with the color-changing material layer 130, thereby affecting the color-changing effect of the color-changing material layer 130 and the performance of the reinforcing layer 184. Therefore, in the embodiment of the present application, the conductive column 184 is close to one end of the color-changing material layer 130. A protective layer 186 is provided on the surface (ie, the surface exposed at one end of the second metal trace 182 ), and the protective layer 186 may be an insulating material such as an insulating oil layer (insulating varnish) or a resin material layer.

By arranging a protective layer on the surface of the conductive column exposed at one end of the second metal trace, the conductive column 184 can be prevented from contacting with the discoloration material layer, preventing the occurrence of swelling, thereby not affecting the performance of the discoloring material layer, and improving the electrical conductivity. Reliability of photochromic modules.

Please refer to FIG. 9 to FIG. 11 together. FIG. 9 is a schematic front view of the structure of another embodiment of the electrochromic module of the present application. FIG. 10 is a schematic diagram of disassembly of the structure of the electrochromic module in the embodiment of FIG. It is an enlarged schematic view of the structure at D in FIG. 9 . The first conductive layer 120 is further provided with a second wire lead-out end 1812 adjacent to the first metal wire 181 and insulatingly disposed. The second wire leads out The end 1812 is arranged on the island structure 1201 formed on the first conductive layer 120 by the laser engraving or yellow photo-etching process at the position corresponding to the second wire lead-out end 1812 , the second wire lead-out end 1812 and the first substrate 110 The first conductive layer 120 in other regions is isolated by the isolation region 1202 , that is, the island structure 1201 and other regions of the first conductive layer 120 are isolated (non-conductive state).

Different from the previous embodiment, the second conductive layer 140 in this embodiment is provided with a wire connecting end 1821 connected to the second metal wire 182 (wherein, the specific shape of the wire connecting end 1821 may be different. It is limited to the shape shown in this embodiment); wherein, the wire connecting end 1821 may be an integral structure with the second metal wire 182 and disposed on the second conductive layer 140 .

Please also refer to FIG. 12 . FIG. 12 is a schematic cross-sectional view of the structure at E-E in the embodiment of FIG. 9 . In this embodiment, the conductive pillars 184 penetrate through the second substrate 150 and the second conductive layer 140 . One end of the conductive column 184 is electrically connected to the wire connecting end 1821 , and the other end is electrically connected to the second wire lead-out end 1812 through the conductive material 185 .

Optionally, please continue to refer to FIG. 12 , the conductive post 184 penetrates through the second substrate 150 , the second conductive layer 140 and the wire connecting end 1821 and is electrically connected to the wire connecting end 1821 . The specific material selection and other structural features of the conductive pillars 184 and the conductive materials 185 may be similar to those in the foregoing embodiments, which will not be repeated here.

In the electrochromic module of this embodiment, by designing the structure of a wiring connection end, and then electrically conducting connection with the second wiring lead-out end on the other substrate side through the conductive column and the conductive material, it is possible to avoid direct contact between the metal and the metal. Holes are drilled on the traces to prevent penetration or damage to the metal traces and improve the overall reliability of the device. In addition, compared with the structure in the conventional technology that needs to manually lift the wiring connection end, the technical solution in the embodiment of the present application has the characteristics that the structure and process are relatively simple and feasible, and it is easier to realize automatic production, which overcomes the problem of The human operation has the problems of poor product stability and low yield.

In addition, an embodiment of the present application also provides a housing assembly. Please refer to FIG. 13 . FIG. 13 is a schematic structural diagram of an embodiment of the housing assembly of the present application. The housing assembly 10 in this embodiment includes an electrochromic module 100 . and housing 200 . Wherein, the casing 200 is bonded to the first substrate 110 of the electrochromic module 100 , and may be bonded by an optical adhesive layer (not shown in the figure). The material of the casing 200 may be made of transparent materials such as glass or resin. In the embodiment of the present application, the housing 200 generally refers to the back cover of the electronic device, that is, the battery cover. It should be noted that, the structure of the electrochromic module 100 in this embodiment may be any one of the foregoing embodiments, and FIG. 13 only uses a schematic structure for illustration.

Optionally, the electrochromic module 100 may further include a water-oxygen barrier layer 170, wherein the water-oxygen barrier layer 170 in this embodiment is disposed between the second substrate 150 and the second conductive layer 140, and is In some other embodiments, the water and oxygen barrier layer 170 may also be disposed between the first substrate 110 and the first conductive layer 120 , or the water and oxygen barrier layer 170 may be disposed at both positions. The positional deformation of the water-oxygen barrier layer 170 will not be listed and described in detail here. The casing 200 and the water-oxygen barrier layer 170 are respectively protected from water vapor from two sides of the color-changing material layer 130 , and the side peripheries are protected from water vapor by the plastic frame 160 .

Wherein, the material of the water-oxygen barrier layer 170 is selected from any one of a dense metal oxide layer, an inorganic non-metallic layer, or a composite layer in which a material and an inorganic material are superimposed. For example, aluminum oxide, silicon oxide, titanium oxide, synthetic resin material or a laminated composite structure of various materials, etc. The water-oxygen barrier layer 170 may be formed on the surface of the second substrate 150 by spraying, screen printing, physical vapor deposition, etc., and then the second conductive layer 140 is formed on the surface of the water-oxygen barrier layer 170 . The water-oxygen barrier layer 170 is used to isolate external water vapor and air. Because the electrochromic material in the electrochromic module is very sensitive to water and oxygen, it is easy to fail, so the water-oxygen barrier layer is required to protect it. Wherein, the water and oxygen barrier layer 170 in this embodiment has a water vapor transmission rate WVTR<0.02g/square meter/day. Wherein, the water vapor permeation direction of the water and oxygen barrier layer 170 in the embodiment of the present application is a physical representation of permeating through the water and oxygen barrier layer 170 in the thickness direction from one surface of the water and oxygen barrier layer 170 to the opposite surface. The test conditions are that the ambient temperature is 20°C and the relative humidity is 100%.

Optionally, the casing assembly further includes an appearance film layer 190 , wherein the appearance film layer 190 is disposed on a surface of the electrochromic module 100 on one side away from the casing 200 . Specifically, the optical adhesive layer 1509 may be bonded to the outside of the second substrate 150 of the electrochromic module 100 . The appearance film layer 190 may include a carrier plate and at least one of an ink layer, an optical coating layer, a texture layer, and the like stacked on the carrier plate. In addition, in some other embodiments, the appearance film layer 190 may also be a coating structure that does not include a carrier plate but is only plated on the outer surface of the second substrate 150 , which is not specifically limited here. The housing assembly 10 can exhibit a display effect in which the appearance film layer 190 and the electrochromic module 100 are superimposed. In addition, when the appearance film layer 190 itself has a gradient effect, after being superimposed with the electrochromic module 100 , a richer appearance effect can be presented.

In some other embodiments, it may be a composite structure of the water and oxygen barrier layer and the appearance film layer. That is, the water and oxygen barrier layer and the appearance film layer share a unified base material, and the water and oxygen barrier layer and the appearance film layer are respectively formed on the base material. The detailed structural features of this part will not be repeated here.

Further, an embodiment of the present application also provides an electronic device. Please refer to FIG. 14 and FIG. 15 together. FIG. 14 is a schematic diagram of the back structure of an embodiment of the electronic device of the present application. The schematic diagram of the cross-sectional structure at F-F, the electronic device in this embodiment includes a display screen module 30, a housing assembly 10, a control circuit board 20 and a camera module (decoration) 40; wherein, the housing assembly 10 may include electrical The photochromic module 100 , the transparent casing 200 and the middle frame 300 . It should be noted here that the embodiments of the present application are only described with the structure in which the electronic device includes a middle frame. In other embodiments, the electronic device may not include the middle frame structure, that is, the rear cover of the housing assembly (the housing 200 ) is directly matched with the display screen module 30, which is not specifically limited here.

Optionally, the display screen module 30 and the electrochromic module 100 of the casing assembly 10 and the transparent casing 200 are respectively disposed on opposite sides of the middle frame 300 . The display screen module 300 cooperates with the transparent casing 200 to form an accommodating space 1000 . The control circuit board 20 and the electrochromic module 100 are arranged in the accommodating space 1000 . The group 100 is attached to the inner surface of the transparent casing 200 . The camera module (decoration piece) 40 is disposed corresponding to or protruding from the transparent casing 200 . The control circuit board 20 is coupled and connected to the metal wiring 180 (refer to FIG. 2 ) of the electrochromic module 100 through the flexible circuit board 183 , and the control circuit board 20 is used to control the color change of the electrochromic module 100 . The detailed technical features of the structures of other parts of the electronic device are within the understanding of those skilled in the art, and will not be repeated here.

Please refer to FIG. 16 . FIG. 16 is a schematic structural block diagram of an embodiment of an electronic device of the present application. The electronic device can be a mobile phone, a tablet computer, a notebook computer, a wearable device, etc., and a mobile phone is used as an example in this embodiment. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (ie, the display screen module 30 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 ( It can be the control circuit board 20) and the power supply 990 in the foregoing embodiments. The RF circuit 910 , the memory 920 , the input unit 930 , the display unit 940 , the sensor 950 , the audio circuit 960 and the wifi module 970 are respectively connected to the processor 980 ;

Specifically, the RF circuit 910 is used to send and receive signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, which may specifically include a touch panel 931 and other input devices 932 such as operation keys; the display unit 940 is used for The sensor 950 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting user proximity signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960, for connecting The wifi module 970 is used to receive and transmit wifi signals, and the processor 980 is used to process the data information of the electronic device. For specific structural features of the electronic device, please refer to the relevant descriptions of the above-mentioned embodiments, which will not be described in detail here.

The electronic device in this embodiment has a discolored appearance effect. The electrochromic module in the shell assembly structure is realized by punching a connection hole on one side of the assembly board and forming a conductive column in the connection hole to unify the conductive layers on the upper and lower sides of the electrochromic module. To lead out the wiring on one side of the substrate (the lead-out end of the wiring), the single-sided binding of the electrochromic module can be realized, and the subsequent binding process of the flexible circuit board is easy; in addition, the electrochromic module provided in this application The module has the characteristics that the structure and process are relatively simple and easy to implement, and it is easier to realize automatic production, which overcomes the problems of poor product stability and low yield due to manual operation.

Further, an embodiment of the present application also provides a method for manufacturing an electrochromic module, and the manufacturing method is mainly aimed at the introduction of the binding process of the metal wires on the upper and lower sides. Please refer to FIG. 17 . FIG. 17 is a schematic flowchart of an embodiment of a method for fabricating an electrochromic module of the present application. The fabrication method in this embodiment includes but is not limited to the following steps.

Step S101, providing a first assembly board.

In this step, the first assembly board includes a first substrate and a first conductive layer arranged in layers; a first metal wire and a first metal wire connected to the first metal wire are arranged on the first conductive layer. a wire lead-out end, and a second wire lead-out end adjacent to and spaced from the first metal wire; For the detailed structure of the first assembly board, please refer to the relevant descriptions of the foregoing embodiments.

Step S102, providing a second assembly board.

In step S102, the second assembly board includes a stacked second substrate and a second conductive layer; the second conductive layer is provided with a second metal trace.

In step S103, connecting holes are drilled on the second assembly board.

Wherein, the connection hole penetrates through the second substrate, the second conductive layer and the second metal trace. Please refer to FIG. 18 . FIG. 18 is a schematic structural diagram of an embodiment of punching connecting holes on the second assembly board. It should be noted that the structure in the illustration in this embodiment is that the connection hole 1840 penetrates the second substrate, the second conductive layer and the second metal trace. In some other embodiments, the connection hole 1840 may It penetrates the second substrate and the second conductive layer and communicates with the second metal traces. Please refer to FIG. 19 . FIG. 19 is a schematic structural diagram of another embodiment of punching connection holes on the second assembly board.

In addition, as in the embodiments described in the aforementioned structural embodiments, one side of the second assembly board may also be provided with a wiring connection terminal (refer to the aforementioned FIG. 10 to FIG. 12 ), and the connection holes 1840 may be correspondingly punched in the wiring connection At the position of the end, the connection hole can be through the second substrate, the second conductive layer and the wiring connection end (the two ends of the conductive column formed by this method are respectively exposed to one end of the second substrate through the conductive The material is electrically connected to the second lead terminal of the trace), or a structural form in which the connection hole penetrates the second substrate and the second conductive layer and communicates with the trace connection end (the conductive column formed by this method has a structural form). One end is electrically connected to the wiring connection end, and the other end is electrically connected to the second wiring lead-out end through a conductive material). The detailed process of this part will not be described in detail here.

Step S104, filling the connection hole with a conductive material and curing to form a conductive column.

In this step, as shown in the position of the connection hole in FIG. 18 , the connection hole 1840 is filled with conductive material at one end of the connection hole 1840 located at the end of the second substrate 150 and at the end of the second metal trace 182 . After solidification, a conductive pillar structure is formed. Wherein, the conductive material can be silver paste. In order to ensure that the charging material fully fills the connection hole 1840 and achieves sufficient conduction on both sides. Specifically, the method of filling the conductive material may be by printing conductive silver paste (or other liquid conductive materials with fluidity) on both sides (one end of the second substrate 150 and one end of the second metal trace 182 ). The purpose of double-sided screen printing is to allow the conductive silver paste to be fully poured into the connection holes 1840 to achieve reliable conduction. Because the single-sided screen printing silver paste will also flow into the hole, there is still a certain risk of insufficient filling.

Optionally, after the step of step S104, when silver paste is used to make the conductive column, in order to prevent the swelling of the silver paste and the color-changing material layer, the embodiment of the method may also include a conductive column close to one end of the color-changing material layer. The step of coating the protective layer on the surface of the second metal trace (ie, the surface exposed at one end of the second metal trace (or the trace connection end)). The protective layer can prevent the conductive column from contacting the color-changing material layer and prevent the occurrence of swelling, thereby not affecting the performance of the color-changing material layer and improving the reliability of the electrochromic module. The protective layer may be an insulating material such as an insulating oil layer (insulating varnish) or a resin material layer.

Step S105, a color-changing material layer is formed between the first assembly board and the second assembly board.

Among them, the method of forming the color-changing material layer may be by coating, drip irrigation, etc., or a roll-to-roll process, that is, IC, EC layer coating, and electrolyte drip coating and For curing, the detailed process of forming the color-changing material layer will not be described in detail here.

In step S106 , one end of the conductive column away from the second metal trace is electrically connected to the lead end of the second trace on the side of the first assembly board by using a conductive material.

In this step, laser cutting may be used to cut off a piece of the second substrate and the second conductive layer to form an escape groove (not shown in the figure), which is used for spotting silver paste (or conductive glue, etc.) for lap bonding. Specifically, it may be at the position where the second metal trace and the lead end of the second trace overlap, or at the position of the connection end of the trace in the embodiments of FIG. (the second substrate and the second conductive layer) are removed, thereby forming an escape groove for spotting the silver paste for overlapping up and down. The electrochromic material and electrolyte under the overlapping area are then wiped off. After cleaning the metal surface of the lower surface, drip conductive glue, silver paste or paste ACF glue, etc., and connect the second metal trace through the conductive material (located in the lap joint on the outer side of the second substrate and the avoidance groove on the side) To the second wiring lead-out end on the other side of the substrate, and finally bonding the FPC on one side of the lower substrate, the upper and lower substrates can be connected.

In addition, the method embodiment may also include steps such as forming a plastic frame, forming a water-oxygen barrier layer, an appearance film layer, and the like. Regarding these processes, those skilled in the art can implement them on the basis of the aforementioned structural embodiments. Repeat.

The manufacturing method of the electrochromic module in the embodiment of the present application has the characteristics that the technological process is relatively simple and feasible, and it is easier to realize automatic production, and overcomes the problems of poor product stability and low yield due to manual operation.

The above descriptions are only some embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Any equivalent device or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied to other related All technical fields are similarly included in the scope of patent protection of the present invention.

Claims (19)

1. An electrochromic module, characterized in that the electrochromic module comprises a first metal wiring and a second metal wiring and a first substrate, a first conductive layer, and a color-changing material layer that are stacked in sequence , a second conductive layer, and a second substrate; wherein, the first metal wiring and the second metal wiring are respectively connected to the first conductive layer and the second conductive layer; Wherein, the first conductive layer is provided with a first wire lead-out end connected to the first metal wire and a second wire lead-out end adjacent to the first metal wire and arranged at intervals; The electrochromic module further includes a conductive column, the conductive column penetrates through the second substrate and the second conductive layer, one end of the conductive column is electrically connected with the second metal wire, and the other end passes through the second conductive layer. The conductive material is electrically connected to the second wire lead-out end. 2 . The electrochromic module of claim 1 , wherein the conductive column further penetrates the second metal trace and is electrically connected to the second metal trace. 3 . 3 . The electrochromic module according to claim 2 , wherein the number of the conductive columns is plural, and the diameter of each conductive column is 0.1-2 mm. 4 . 4 . The electrochromic module according to claim 2 , wherein the material of the conductive column is silver. 5 . 5 . The electrochromic module according to claim 4 , wherein a protective layer is provided on the surface of the conductive column close to one end of the color-changing material layer. 6 . 6. The electrochromic module according to claim 5, wherein the protective layer comprises an insulating oil layer or a resin material layer. 7 . The electrochromic module according to claim 1 , wherein the second conductive layer is provided with a wiring connection end connected to the second metal wiring; one end of the conductive column is connected to the The wiring connection end is electrically connected, and the other end is electrically connected with the second wiring lead-out end through a conductive material. 8 . The electrochromic module according to claim 7 , wherein the conductive column further penetrates the wire connecting end and is electrically connected with the wire connecting end. 9 . 9 . The electrochromic module according to claim 1 , wherein the conductive material comprises any one of silver, copper, and conductive glue. 10 . 10. The electrochromic module according to any one of claims 1-9, wherein the electrochromic module further comprises a water-oxygen barrier layer, and the water-oxygen barrier layer is provided on the first between the substrate and the first conductive layer or between the second substrate and the second conductive layer. 11. An electronic device, characterized in that, the electronic device comprises a display screen module, a control circuit board, and a housing assembly; the housing assembly comprises a housing and the electronic device according to any one of claims 1-10. an electrochromic module, the display screen module cooperates with the casing to form an accommodating space, the control circuit board and the electrochromic module are arranged in the accommodating space, and the electrochromic module The group is attached to the inner surface of the casing; the control circuit board is coupled and connected to the first lead-out end and the second lead-out end of the electrochromic module, and is used to control the electrochromic Mods are discolored. 12 . The electronic device according to claim 11 , wherein the electronic device further comprises an appearance film layer, and the appearance film layer is disposed on a surface of the electrochromic module on a side away from the casing. 13 . 13. A manufacturing method of an electrochromic module, wherein the manufacturing method comprises: A first assembly board is provided; wherein, the first assembly board includes a first substrate and a first conductive layer arranged in layers; a first metal wire and a first metal wire are arranged on the first conductive layer and are connected with the first metal wire a connected first wire lead-out end, and a second wire lead-out end adjacent to the first metal wire and arranged at intervals; A second assembly board is provided; wherein, the second assembly board includes a second substrate and a second conductive layer arranged in layers; a second metal trace is arranged on the second conductive layer; Punch connection holes on the second assembly board; wherein, the connection holes penetrate through the second substrate and the second conductive layer and communicate with the second metal traces; Filling the conductive material in the connection hole and curing to form a conductive column; forming a color-changing material layer between the first assembly plate and the second assembly plate; One end of the conductive column away from the second metal wiring is electrically connected to the second wiring lead-out end on one side of the first assembly board by using a conductive material. 14 . The manufacturing method according to claim 13 , wherein the connection hole further penetrates the second metal trace; the step of filling the connection hole with a conductive material and curing to form a conductive pillar structure comprises the following steps: 14 . : Fill conductive material at one end of the connection hole located at the second substrate and at the end located at the second metal trace respectively. 15 . The manufacturing method according to claim 14 , wherein the conductive material is silver paste. 16 . 16 . The manufacturing method according to claim 15 , wherein the filling method of the conductive material is screen printing. 17 . 17 . The manufacturing method according to claim 15 , wherein before the step of forming a color-changing material layer between the first assembly board and the second assembly board, the method further comprises the step of: discoloring the conductive column close to the color-changing material. 18 . The surface of one end of the material layer is coated with a protective layer. 18 . The manufacturing method according to claim 13 , wherein the second conductive layer of the second assembly board is provided with a wiring connection end connected to the second metal wiring; wherein, in the In the step of punching connection holes on the second assembly board, one end of the formed conductive column is electrically connected to the wiring connection end, and the other end is electrically connected to the second wiring lead-out end through a conductive material. 19 . The manufacturing method according to claim 18 , wherein in the step of punching a connection hole on the second assembly board, the connection hole further penetrates the wiring connection end; the formed conductive column is 19 . The two ends of the wire are respectively exposed to the second substrate and the wire connection terminal.

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