CN112147828B - Electronic equipment, housing assemblies, cover assemblies, and electrochromic modules - Google Patents

Abstract

The application provides an electrochromic module, which comprises a first substrate, a first conductive layer, a color-changing material layer, a second conductive layer, a second substrate and a rubber frame; the first substrate, the first conductive layer, the color-changing material layer, the second conductive layer and the second substrate are sequentially stacked; the rubber frame is arranged around the side edge of the color-changing material layer in a surrounding manner, so that the color-changing material layer is sealed around the rubber frame; the water vapor transmittance of the rubber frame is not more than 20g/m < 2 >/day. According to the electrochromic module, the structure and the material of the rubber frame are designed and selected, so that the overall structure of the electrochromic module is guaranteed to have good waterproof performance, the color changing performance of the electrochromic module is further stabilized, and the service life is prolonged.

Description

Electronic equipment, housing assemblies, cover assemblies, and electrochromic modules

technical field

The invention relates to the technical field of electronic equipment with a color-changing function, in particular to an electronic equipment, a casing assembly, a cover plate assembly and an electrochromic module.

Background technique

The electrochromic diaphragm is a kind of color-changing shielding film commonly used in the exterior glass of buildings and automobile rearview mirrors. The structure of the electrochromic diaphragm in conventional technology generally has a relatively large overall thickness. The color-changing material in the electrochromic diaphragm is highly sensitive to water and oxygen. If the packaging of the color-changing material is not reliable, the color-changing material will deteriorate and the life of the electrochromic diaphragm will be reduced.

Contents of the invention

The first aspect of the embodiment of the present application provides an electrochromic module, the electrochromic module includes a first substrate, a first conductive layer, a color-changing material layer, a second conductive layer, a second substrate, and a plastic frame; Wherein, the first substrate, the first conductive layer, the color-changing material layer, the second conductive layer and the second substrate are sequentially stacked; the plastic frame surrounds the color-changing material layer The circumference of the sides realizes the circumference sealing of the color-changing material layer; the water vapor transmission rate of the plastic frame is not greater than 20g/m2/day.

In the second aspect, the embodiment of the present application provides an electrochromic module, the electrochromic module includes a first substrate, a first conductive layer, a color-changing material layer, a second conductive layer, a second substrate, and a plastic frame; Wherein, the first substrate, the first conductive layer, the color-changing material layer, the second conductive layer and the second substrate are sequentially stacked; the plastic frames are all surrounded by the color-changing material layer The circumference of the side edge is realized to seal the circumference of the color-changing material layer; the plastic frame is formed by solidification of epoxy-based glue or acrylic-based glue.

In a third aspect, an embodiment of the present application provides an electrochromic module, the electrochromic module includes a first substrate, a first conductive layer, a color-changing material layer, a second conductive layer, a second substrate, and a plastic frame; Wherein, the first substrate, the first conductive layer, the color-changing material layer, the second conductive layer and the second substrate are sequentially stacked; the plastic frames are all surrounded by the color-changing material layer The circumference of the side of the color-changing material layer is realized; the width of the glue frame is greater than 1 mm, and the glue frame is formed by solidification of epoxy glue or acrylic glue.

In a fourth aspect, an embodiment of the present application provides an electrochromic module, the electrochromic module includes a first substrate, a first conductive layer, a color-changing material layer, a second conductive layer, a second substrate, and a plastic frame; Wherein, the first substrate, the first conductive layer, the color-changing material layer, the second conductive layer and the second substrate are sequentially stacked; the plastic frames are all surrounded by the color-changing material layer The circumference of the side edge realizes the circumference sealing of the color-changing material layer; the water vapor barrier agent is doped in the plastic frame.

In the fifth aspect, the embodiment of the present application provides an electrochromic module, the electrochromic module includes a first substrate, a first conductive layer, a color-changing material layer, a second conductive layer, a second substrate, and a plastic frame;

Wherein, the first substrate, the first conductive layer, the color-changing material layer, the second conductive layer and the second substrate are sequentially stacked;

The plastic frame includes a first plastic frame and a second plastic frame, and the first plastic frame surrounds the side circumference of the color-changing material layer to realize the circumferential sealing of the color-changing material layer; the second rubber frame The second plastic frame surrounds the outer periphery of the first plastic frame.

In the sixth aspect, the embodiment of the present application provides a cover assembly, the cover assembly includes a transparent cover and the electrochromic module described in any one of the above embodiments, the transparent cover and the electrochromic module Bonding of the first substrate of the chromic module.

In the seventh aspect, the embodiment of the present application provides a casing assembly, the casing assembly includes a middle frame and the cover assembly described in any one of the above embodiments; the opposite sides of the electrochromic module are respectively Bond with the transparent cover plate and the middle frame.

In an eighth aspect, an embodiment of the present application provides an electronic device, the electronic device includes a display screen module and the housing assembly described in any one of the above embodiments; the display screen module and the cover assembly They are respectively arranged on opposite sides of the middle frame.

In the ninth aspect, the embodiment of the present application provides an electronic device, the electronic device includes a control circuit and the casing assembly according to any one of the above embodiments, the control circuit and the electrochromic component of the casing assembly The modules are coupled and connected, and the control circuit is used to receive control instructions, and the control instructions are used to control the electrochromic module to change color.

The electrochromic module provided in the embodiment of this application, by designing and selecting the structure and material of the plastic frame, ensures that the overall structure of the electrochromic module has good waterproof performance, thereby stabilizing the discoloration performance of the electrochromic module and prolonging the life of the electrochromic module. service life.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort.

Fig. 1 is a schematic cross-sectional view of an embodiment of the electrochromic module of the present application;

Fig. 2 is a partial structural stacked schematic diagram of an embodiment of an electrochromic module;

Fig. 3 is a schematic cross-sectional view of another embodiment of the electrochromic module of the present application;

Fig. 4 is a schematic cross-sectional view of another embodiment of the electrochromic module of the present application;

Fig. 5 is a schematic cross-sectional view of another embodiment of the electrochromic module of the present application;

Fig. 6 is a schematic cross-sectional view of another embodiment of the electrochromic module of the present application;

Fig. 7 is a schematic cross-sectional view of another embodiment of the electrochromic module of the present application;

Fig. 8 is a schematic cross-sectional view of another embodiment of the electrochromic module of the present application;

Fig. 9 is a schematic cross-sectional view of another embodiment of the electrochromic module of the present application;

Fig. 10 is a schematic cross-sectional view of another embodiment of the electrochromic module of the present application;

Fig. 11 is a schematic top view of the structure of the electrochromic module in Fig. 10;

Fig. 12 is a schematic disassembly diagram of another embodiment of the electrochromic module of the present application;

Fig. 13 is a schematic cross-sectional view of a local structure at the binding position in Fig. 12;

Fig. 14 is a schematic diagram of another flexible circuit board and wiring binding structure of the electrochromic module of the present application;

Fig. 15 is a schematic diagram of another flexible circuit board and wiring binding structure of the electrochromic module of the present application;

Fig. 16 is a schematic disassembly diagram of the structure of the electrochromic module in Fig. 15;

Fig. 17 is an enlarged schematic diagram of the local structure at A in Fig. 15;

Fig. 18 is a schematic cross-sectional view of a partial structure at B-B in Fig. 15;

Fig. 19 is a schematic cross-sectional view of another embodiment of the electrochromic module of the present application;

Fig. 20 is a schematic cross-sectional view of a partial structure of another embodiment of the electrochromic module of the present application;

Fig. 21 is a schematic cross-sectional view of a partial structure of another embodiment of the electrochromic module of the present application;

Fig. 22 is a schematic cross-sectional view of a partial structure of another embodiment of the electrochromic module of the present application;

Fig. 23 is a schematic flow chart of an embodiment of an electrochromic module packaging method of the present application;

Fig. 24 is a structural stacking diagram of the stacked structure (semi-finished product) of the electrochromic module;

Fig. 25 is a schematic diagram of structural lamination after ring grooves are formed on the semi-finished electrochromic module;

Fig. 26 is a schematic top view of the structure of Fig. 25;

Fig. 27 is a schematic diagram of the structure after filling the sealant in the ring groove of the semi-finished electrochromic module;

Fig. 28 is a schematic flow chart of another embodiment of the electrochromic module packaging method of the present application;

Fig. 29 is a schematic flow chart of another embodiment of the electrochromic module packaging method of the present application;

Fig. 30 is a schematic diagram of the structural lamination after forming two ring grooves on the semi-finished electrochromic module;

Figure 31 is a schematic top view of the structure of Figure 30;

Fig. 32 is a schematic structural diagram of another double glue frame of the electrochromic module;

Fig. 33 is a schematic structural view of an embodiment of the cover assembly of the present application;

Fig. 34 is a schematic structural view of another embodiment of the cover assembly of the present application;

Fig. 35 is a schematic structural view of another embodiment of the cover assembly of the present application;

Fig. 36 is a structural schematic diagram of one-side lead wire binding of the cover plate assembly;

Fig. 37 is a schematic cross-sectional view of another embodiment of the cover assembly of the present application;

Fig. 38 is a schematic cross-sectional view of another embodiment of the cover assembly of the present application;

Fig. 39 is a schematic flowchart of an embodiment of the method for assembling the cover assembly in the embodiment of Fig. 38;

Fig. 40 is a schematic diagram of the structure of the electrochromic module and the transparent cover after bonding and dispensing glue;

Fig. 41 is a schematic structural diagram of bonding the back cover and the middle frame of the electronic device in the conventional technology;

Fig. 42 is a schematic cross-sectional view of an embodiment of the shell assembly of the present application;

Fig. 43 is a schematic front view of the structure of the housing assembly in Fig. 42;

Fig. 44 is a block diagram of a partial structure composition of an embodiment of the electronic device of the present application;

Fig. 45 is a structural composition block diagram of another embodiment of the electronic device of the present application;

Fig. 46 is a structural block diagram of another embodiment of the electronic device of the present application;

Fig. 47 is a schematic structural diagram of an embodiment of an electronic device;

Fig. 48 is a schematic diagram of an operating state of an electronic device;

Fig. 49 is a schematic diagram of another operating state of the electronic device;

Fig. 50 is a structural schematic diagram of a reversely colored color block in the case of failure of the electrochromic module;

Fig. 51 is a schematic diagram of insufficient bonding of the plastic frame of the electrochromic module due to insufficient elongation at break.

Detailed ways

The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments. In particular, the following examples are only used to illustrate the present invention, but not to limit the scope of the present invention. Likewise, the following embodiments are only some but not all of the embodiments of the present invention, and all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

The terms "first", "second", and "third" in the present invention are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, features defined as "first", "second", and "third" may explicitly or implicitly include at least one of these features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative positional relationship between the components in a certain posture (as shown in the accompanying drawings) , sports conditions, etc., if the specific posture changes, the directional indication also changes accordingly. The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally further includes For other steps or components inherent in those processes, methods, products, or devices.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present invention. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described herein can be combined with other embodiments.

"Electronic equipment" (or simply "terminal") as used herein includes, but is not limited to, configured to direct cable connection, and/or another data connection/network) and/or via (for example, for cellular networks, wireless local area networks (WLAN), digital television networks such as DVB-H networks, satellite networks, AM-FM broadcast transmitters , and/or a device for receiving/sending communication signals via a wireless interface of another communication terminal. A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; Personal Communications Systems (PCS) terminals that may combine cellular radiotelephones with data processing, facsimile, and data communication capabilities; may include radiotelephones, pagers, Internet/Intranet access , a PDA with a web browser, organizer, calendar, and/or Global Positioning System (GPS) receiver; and a conventional laptop and/or palm-type receiver or other electronic device including a radiotelephone transceiver. A mobile phone is an electronic device equipped with a cellular communication module.

The embodiment of the present application first proposes a structure of an electrochromic module based on electrochromic technology. The electrochromic material in the electrochromic module is based on organic polymers, such as polyaniline and polythiophene.

Electrochromic materials are based on the color-changing effect produced by electrochemical reactions. Electrochemical reactions have very strict requirements on water and oxygen. Once a small amount of water and oxygen invades, electrolysis of water will occur in the material to generate highly active oxygen, which will damage the material. The irreversible damage to the discoloration performance of the material will lead to the problem of oxidative yellowing or even complete failure of the material. Therefore, the sealing condition of the electrochromic material becomes the key to the structure of the electrochromic module.

Please refer to FIG. 1. FIG. 1 is a schematic cross-sectional view of an embodiment of the electrochromic module of the present application; the electrochromic module 100 in this embodiment includes a first substrate 110, a first conductive layer 120, and a color-changing material layer 130 , the second conductive layer 140 , the second substrate 150 and the plastic frame 160 .

Specifically, the first substrate 110, the first conductive layer 120, the color-changing material layer 130, the second conductive layer 140 and the second substrate 150 are sequentially stacked; in this embodiment, The plastic frame 160 is disposed around the color-changing material layer 130 , and two ends of the plastic frame 160 are bonded to the surfaces of the first conductive layer 120 and the second conductive layer 140 respectively.

Optionally, in this embodiment, the material of the first substrate 110 and the second substrate 150 is a flexible transparent resin material, so that the overall structure of the electrochromic module 100 is a flexible and bendable structure. The first substrate 110 and the second substrate 150 function to support and protect internal structures. In some embodiments, the material of the first substrate 110 and the second substrate 150 can be PET (Polyethylene terephthalate referred to as PET or PEIT, commonly known as polyester resin, polycondensate of terephthalic acid and ethylene glycol), PMMA (polymethyl Methyl acrylate (poly(methyl methacrylate), PMMA for short), also known as acrylic, acrylic (English Acrylic) or plexiglass), PC (Polycarbonate, polycarbonate (English abbreviated as PC) is a molecular chain containing carbonic acid Ester-based polymers), PI (Polyimide) and the like. More types of materials for the first substrate 110 and the second substrate 150 are within the comprehension scope of those skilled in the art, and will not be listed and described in detail here. Wherein, the formation method of the first conductive layer 120 and the second conductive layer 140 can be physical vapor deposition (PVD, Physical Vapor Deposition), specifically including vacuum evaporation, sputtering, ion plating (hollow cathode ion plating, hot cathode ion plating) , arc ion plating, active reactive ion plating, radio frequency ion plating, DC discharge ion plating), etc.

Wherein, the thickness of the first conductive layer 120 and the second conductive layer 140 can be between 100nm-300nm, specifically 100nm, 120nm, 150nm, 200nm, 280nm and 300nm. The first conductive layer 120 and the second conductive layer 140 are made of transparent conductive material. The transparent conductive material may be indium tin oxide (ITO), zinc aluminum oxide (AZO), tin oxide doped with fluorine (FTO) or graphene film, etc.

Please refer to FIG. 2. FIG. 2 is a schematic diagram of partial structural lamination of an embodiment of an electrochromic module, wherein the color-changing material layer 130 also includes a sub-layer structure. As shown in FIG. 2, the color-changing material layer 130 includes a Between the first conductive layer 120 and the second conductive layer 140 , an electrochromic layer (ie, EC layer) 131 , a dielectric layer 132 , and an ion storage layer (ie, IC layer) 133 are stacked in sequence. Optionally, the material of the electrochromic layer 131 can be selected from organic polymers (including polyaniline, polythiophene, etc.), inorganic materials (Prussian blue, transition metal oxides, such as tungsten trioxide) and small organic molecules (violet Fine) and so on. In the embodiment of the present application, the electrochromic layer 131 is an organic polymer as an example for illustration, and the electrochromic layer 131 may specifically be a solid or gel state material. Optionally, the ion storage layer 133 and the dielectric layer 132 can be formed by PVD, and the electrochromic layer 131 (wherein, the electrochromic layer 131 is the aforementioned organic polymer or inorganic material) can be It is formed by scraping or drip irrigation, and the detailed technical features of this part are within the understanding of those skilled in the art, and will not be described in detail here.

In addition, the electrochromic layer 131 can also use small organic molecules as electrolyte materials. When the electrochromic layer 131 is an organic small molecule, the specific formation method can be formed between the first conductive layer 120 and the second conductive layer 140 through a vacuum filling process, which will not be described in detail here.

Please refer to Figure 3, Figure 3 is a schematic cross-sectional view of another embodiment of the electrochromic module of the present application; different from the previous embodiment, the electrochromic module in this embodiment is a structure of large and small pieces . Specifically, the plastic frame 160 surrounds the first conductive layer 120 , the color-changing material layer 130 , the second conductive layer 140 and the side circumference of the second substrate 150 and is connected to the The surface of the first substrate 110 facing the first conductive layer 120 is bonded.

Optionally, please refer to FIG. 4. FIG. 4 is a schematic cross-sectional view of another embodiment of the electrochromic module of the present application; the electrochromic module 100 in this embodiment also includes a first substrate 110, a first conductive layer 120 , a color-changing material layer 130 , a second conductive layer 140 , a second substrate 150 and a plastic frame 160 ; different from the previous embodiments, the electrochromic module 100 in this embodiment further includes a water-oxygen barrier unit 170 .

In some embodiments, the water and oxygen barrier unit 170 is attached to the surface of the second substrate 150 away from the second conductive layer 140 . The area of the water-oxygen barrier unit 170 is larger than the area of the second substrate 150, and the water-oxygen barrier unit 170 and the second substrate 150 are away from the surface of the second conductive layer 140 and the plastic frame. 160 is bonded to the end surface away from the first substrate 110 ; that is, opposite ends of the glue frame 160 are bonded to the first substrate 110 and the water-oxygen barrier unit 170 respectively. The water and oxygen barrier unit 170 may be back-bonded to the second substrate 150 through an optical adhesive layer 1701 (OCA (Optically Clear Adhesive)). Specifically, UV or other liquid glue can be used for encapsulation between the second substrate 150 and the water-oxygen barrier unit 170 .

Optionally, the water and oxygen barrier unit 170 includes a substrate 171 and a water and oxygen barrier layer 172 plated on at least one side of the substrate 171 . Wherein, the substrate 171 may be made of flexible transparent resin materials, including polyethylene terephthalate PET, polycarbonate PC, polyimide PI, and the like. The water-oxygen barrier layer 172 can be a dense metal oxide layer or an inorganic non-metallic layer or a composite layer with superimposed materials and inorganic materials. For example, aluminum oxide, silicon oxide, or a laminated composite structure of multiple materials. Wherein, the water and oxygen barrier unit 170 in this embodiment is a flexible substrate coated with a water and oxygen barrier layer 172 , and its water vapor transmission rate WVTR<1×10 −2 g/m 2 /day. Wherein, the water vapor permeation direction of the water and oxygen barrier unit 170 in the embodiment of the present application is a physical characterization of permeating from one side surface of the water and oxygen barrier unit 170 in the thickness direction through the water and oxygen barrier unit 170 to reach the opposite surface.

Please continue to refer to FIG. 4 , structurally, the size of the second substrate 150 in the electrochromic module is smaller than the size of the first substrate 110 and smaller than the size of the water-oxygen barrier unit 170 . In this way, the plastic frame 160 between the first substrate 110 and the water-oxygen barrier unit 170 can be used to form an annular enclosure to protect the electrochromic material in the core layer of the electrochromic unit and prevent the intrusion of water and oxygen.

Please refer to Figure 5, Figure 5 is a schematic cross-sectional view of another embodiment of the electrochromic module of the present application; in this embodiment, there is an optical adhesive layer 1701 between the second substrate 150 and the water-oxygen barrier unit 170 bonding. The optical adhesive layer 1701 can improve the bonding force between the second substrate 150 and the water-oxygen barrier unit 170, and at the same time avoid the formation of an air layer between the two, that is, prevent the sealing of gas into the plastic frame 160, because the sealed gas will increase when the temperature rises. When high, the expansion will affect the reliability of the electrochromic material.

Optionally, in this embodiment, the water vapor transmission rate of the plastic frame 160 is not greater than 20 g/m 2 /day. Water vapor transmission rate actually includes two meanings of water vapor transmission rate and water vapor transmission coefficient. The meanings expressed by these two meanings are also different, but they can both be used to indicate the water vapor transmission rate of a certain material. ability. The water vapor transmission rate indicates the weight of water vapor passing through the material under certain temperature and humidity conditions at a certain time. The water vapor transmission rate is the standard value of the water vapor transmission rate converted by the coefficient, and corresponds to the standard unit, which is used for comparison between different test results. The water vapor transmission rate and water vapor transmission coefficient are measured according to GB/T 1037-1988 "Test Method for Water Vapor Permeability of Plastic Films and Sheets --- Cup Method" (corresponding to ASTM E96-1980 of the American Society for Testing and Testing). The specific measurement conditions and measurement methods are not specifically limited here. Wherein, the water vapor permeation direction of the plastic frame 160 in the embodiment of the present application is a physical characteristic that penetrates from the outer surface of the plastic frame 160 in the thickness T direction through the plastic frame 160 to reach the surface adjacent to the color-changing material layer 130 .

Optionally, the glue frame 160 may be formed by curing epoxy glue or acrylic glue. Among them, epoxy glue has better waterproof performance, while acrylic glue has stronger adhesion. Please refer to the table below (Table 1), which shows the water vapor transmission rate test data of the plastic frame under different conditions.

In order to ensure the reliability and effectiveness of waterproofing, the width T of the plastic frame 160 in this embodiment may be greater than 1 mm. Specifically, it may be 1.1 mm, 1.2 mm, 1.5 mm, 2 mm, 3 mm, etc., and the specific values are not specifically limited, and will not be listed here. It should be noted that the width T of the plastic frame 160 mentioned here is greater than 1mm, which does not mean that the larger the better, when the water vapor barrier performance requirements are met, the overall black border of the electrochromic module (the width of the non-changeable area) must also be considered. Generally speaking, the width T of the plastic frame 160 will also be controlled within 10 mm.

The plastic frame requirement in the present embodiment: be 60 ℃ at ambient temperature, and relative humidity is 90% (referring to the percentage of saturated water vapor pressure in the water vapor pressure in the air and the same temperature. Or the absolute humidity of wet air and the possible reach under the same temperature The ratio of the maximum absolute humidity. It can also be expressed as the ratio of the partial pressure of water vapor in humid air to the saturation pressure of water at the same temperature. The ratio of the saturated absolute humidity, the result is a percentage. (That is to say, the ratio of the mass of water vapor contained in a certain humid air to the mass of water vapor contained in the saturated air at the same temperature and pressure, this ratio is expressed in percentage For example, the humidity mentioned in the experimental conditions in the embodiments of the present application is 90%, which refers to the relative humidity.)) Under the conditions: the water vapor transmission rate of the plastic frame 160 is 1-15g/m2/day. By limiting the water vapor transmission rate of the plastic frame 160, it can ensure that the color-changing material will not be polluted, and the problem of reverse coloring (specifically, what is reverse coloring will be explained in detail later) will not occur, thereby stabilizing the color change of the electrochromic module performance and prolong service life.

Optionally, the elongation at break of the rubber frame 160 in this embodiment (the elongation at break is generally the relative elongation at break, that is, the ratio of the elongation of the rubber frame at breakage to its initial length, expressed in percentage. It It is an index to characterize the soft performance and elastic performance of the plastic frame. The larger the elongation at break, the better the soft performance and elasticity.) It is 2-400%, or the modulus <1Gpa (the modulus mentioned here refers to the modulus Quantity refers to the ratio of stress to strain of a material under stress. The reciprocal of the modulus is called the compliance. Significance: The elastic modulus can be regarded as an index to measure the difficulty of elastic deformation of the material. The larger the value, the better the material The greater the stress at which a certain elastic deformation occurs, that is, the greater the stiffness of the material, that is, the smaller the elastic deformation occurs under a certain stress). The reason why the elongation at break of the plastic frame 160 is required in the embodiment of this application is to ensure that the plastic frame has a stable structural state during the flexible deformation or bending process of the electrochromic module, so that the plastic frame will not be damaged. Seal failure.

Optionally, the adhesive interface between the plastic frame 160 and other structural layers can be treated to a certain extent. For example, the opposite ends of the adhesive frame 160 in the embodiment of FIG. The adhesive contact surface of the unit 170 ; in the embodiment of FIG. 1 , it is the adhesive contact surface between the opposite ends of the glue frame 160 and the first conductive layer 120 and the second conductive layer 140 respectively. The specific treatment methods of the bonding interface include plasma treatment, roughening or printing ink layer, etc., the purpose is to improve the bonding strength between the plastic frame 160 and other structural layers, and the water vapor intrusion is not mainly from the bonding interface, but from The body of the plastic frame 160 is intruded. The glue frame 160 and the lower layer (water-oxygen barrier film) and the upper layer (PET/ITO film) only need to form a firm bond. The specific adhesive force between the glue frame 160 and other structural layers will be introduced later.

Optionally, a moisture barrier agent may also be doped in the glue frame 160 , specifically, it may be added to the glue during the formation of the glue frame 160 . The mass fraction of the moisture barrier agent in the plastic frame 160 is 1-10%. Specifically, it can be 1%, 3%, 5%, 8%, 10%, etc., and the mass fraction ratio of the water vapor barrier agent can be appropriately increased without affecting the strength of the plastic frame 160 . Specifically, some spacers can be added inside the glue, with a mass fraction of about 1-10%, to block the path of water vapor; or a certain amount of molecular sieve can be added to absorb water vapor and prolong life. Among them, the main component of Spacer is SiO2, micron-sized SiO2 microspheres. Molecular sieve is a common concept in chemistry, and its specific composition is hydrated aluminosilicate (zeolite) or natural zeolite. Because Spacer is a SiO2 microsphere, it can block water vapor, and molecular sieve can absorb water vapor. The two can be added and used separately, and can also be added and used together.

Please refer to FIG. 6. FIG. 6 is a schematic cross-sectional view of another embodiment of the electrochromic module of the present application; the electrochromic module 100 in this embodiment also includes a first substrate 110 and a first conductive layer stacked in sequence. 120, a color-changing material layer 130, a second conductive layer 140, a second substrate 150, and a water-oxygen barrier unit 170; different from the previous embodiments, the glue frame 160 in this embodiment includes a first glue frame 161 and a second glue frame Frame 162 , the first plastic frame 161 is set around the side circumference of the color-changing material layer 130 , and the second plastic frame 162 is set around the outer circumference of the first plastic frame 161 . It should be noted that the description of the structure, material and performance of the plastic frame in this application is not limited to the specific positions in the illustrated embodiments. Due to the limitation of the length of this description, the embodiments of this application only use one or several positions of the plastic frame It should be explained that this should not limit the scope of the application. Those skilled in the art can make some structural improvements under the technical ideas of the embodiments of the application (double rubber frame and multi-glue frame), which should be included in the scope of the application. within the scope of protection. In this embodiment, the deformation of the double-glue frame or multi-glue frame structure is done on the basis of the embodiment in Figure 4. Of course, the idea about the double-glue frame or multi-glue frame structure can be combined in the embodiment in Figure 1 and other follow-up In the structure of the embodiment, this description is made here.

Optionally, the first rubber frame 161 is closer to the color-changing material layer 130 , so the water vapor transmission rate of the first rubber frame 161 may be lower than the water vapor transmission rate of the second rubber frame 162 . The adhesiveness of the second rubber frame 162 may be higher than that of the first rubber frame 161 . The adhesiveness mentioned here refers to the bonding interface between the plastic frame and other structural layers (specifically, the bonding interface between the plastic frame and the first substrate 110 and the water and oxygen barrier unit 170 in this illustrated embodiment). The degree of firmness of the bond, that is, the degree to which it is not easy to peel off. This performance reflects the bonding reliability or firmness of the plastic frame and other structural layers.

In the technical solution of this embodiment, a two-layer plastic frame structure is adopted, and the water and oxygen barrier property of the outer plastic frame 162 can be slightly lower. Specifically, the water vapor transmission rate of the plastic frame 162 can be no greater than 20g/m2/day ;The adhesive strength of the outer plastic frame 162 should be higher, and there is a requirement for its elongation at break, which needs to meet the elongation at break of 2-400%; while the inner rubber frame 161 has high water and oxygen barrier requirements, specific requirements The water vapor transmission rate of the inner rubber frame 161 is not greater than 15 g/m 2 /day, and the adhesive force to the inner rubber frame 161 may be relatively low. Optionally, the inner rubber frame 161 may use epoxy system glue with high water resistance, while the outer rubber frame 162 may use acrylic system glue with better adhesion.

The background of the double glue frame solution is: in practical applications, under the requirements of certain narrow frames and 3D surface bonding, the glue frame becomes narrower, and it is difficult to find glue that can block moisture and meet the requirements of 3D bonding. For example, if only epoxy glue is used, the water vapor transmission rate of epoxy glue is better, but the adhesion between epoxy glue and PET and water oxygen barrier film is relatively weak, and the glue is hard, which cannot meet the requirements of 3D bonding. Requirements; if only acrylic glue or other glue with good adhesion and softness is used, the waterproof performance of this kind of glue cannot meet the requirements well when the width of the glue frame is fixed (considering the problem of black borders), In the technical solution of the embodiment of the present application, the double-frame solution of epoxy system glue with better water resistance + acrylic system glue with better adhesion on the outside can well solve the above problems. Please refer to the table below (Table 2). The table below shows the comparison data of the test experiment between the double glue frame scheme and the single glue frame scheme.

Note: For the experimental data in the above table, the water vapor transmission rate of the double rubber frame refers to the water vapor permeating from the outer surface of the outer rubber frame (the second rubber frame 162) through the outer rubber frame and the inner rubber frame (the first rubber frame 161 ) to the physical characterization of the inner surface of the inner rubber frame.

From the above analysis and comparison, it can be seen that in the double-plastic frame scheme, when the widths (T1, T2) of the first plastic frame 161 and the second plastic frame 162 are both 0.3mm, the overall plastic frame (the first plastic frame 161 and the second plastic frame 161) can be satisfied. The water vapor transmission rate of the second rubber frame 162) is not greater than the requirement of 20g/m2/day. When the width of the double rubber frame is 0.5, the waterproof performance is better than that of the single epoxy frame with a width of 0.8.

Optionally, in order to ensure that the double rubber frame solution has good waterproof and adhesive performance, the width T1 of the first rubber frame 161 and the width T2 of the second rubber frame 162 in this embodiment are designed to be greater than 0.3 mm. Wherein, the first rubber frame 161 and the second rubber frame 162 can be arranged at intervals or in contact, and the formation of the rubber frames will be described in detail in subsequent embodiments.

Please refer to FIG. 7. FIG. 7 is a schematic cross-sectional view of another embodiment of the electrochromic module of the present application; the electrochromic module 100 in this embodiment also includes a first substrate 110 and a first conductive layer stacked in sequence. 120, a color-changing material layer 130, a second conductive layer 140, a second substrate 150, and a water-oxygen barrier unit 170; different from the previous embodiments, the glue frame 160 in this embodiment includes a first glue frame 161, a second glue Frame 162 and the third plastic frame 163, the first plastic frame 161 surrounds the side circumference of the color-changing material layer 130, the second plastic frame 162 surrounds the outer periphery of the first plastic frame 161, and The third plastic frame 163 is disposed on the outer periphery of the second plastic frame 162 .

The technical solution of this embodiment may be to add a third plastic frame 163 on the basis of the previous embodiment, specifically, as shown in FIG. The structure in Figure 8, Figure 8 is a schematic cross-sectional view of another embodiment of the electrochromic module of the present application; the structure in Figure 8 is equivalent to adding a layer of plastic frame on the periphery of the overall structure of the electrochromic module ( The third plastic frame 163 ), in this embodiment, by adding the structure of the third plastic frame 163 , the overall waterproof performance of the electrochromic module can be further enhanced. Wherein, the material of the third plastic frame 163 can be formed by solidifying the same epoxy glue as that of the first plastic frame 161 , or it can also be nano-hydrophobic material, such as polytetrafluoroethylene, fluorinated polyethylene, fluorocarbon wax, and the like. The third plastic frame 163 may also be waterproof foam or the like attached on the outer periphery of the second plastic frame 162 . Wherein, it is required that the water vapor transmission rate of the third plastic frame 163 is not greater than 5g/m2/day. Please refer to the following table (Table 3). The following table is the test experiment comparison data of the double glue frame scheme and the three glue frame scheme.

From the above experimental data, it can be known that the waterproof performance of the solution with three rubber frames is obviously better than that of the solution with double rubber frames when the width of the plastic frames is all 0.3mm. In this embodiment, the width of the third plastic frame 163 may also be greater than 0.3 mm, considering the adhesiveness and waterproof performance. Specifically, it may be 0.31 mm, 0.4 mm, 0.5 mm, 0.8 mm, 1 mm, etc., which are not specifically limited here. Regarding other performance parameters of the third rubber frame 163 , reference may be made to the first rubber frame 161 in the foregoing embodiment, and details are not repeated here.

Please refer to Figure 9, Figure 9 is a schematic cross-sectional view of another embodiment of the electrochromic module of the present application; different from the embodiment in Figure 4, the water and oxygen barrier unit 170 in this embodiment includes a substrate 171, water An oxygen barrier layer 172 and an appearance film layer 173 . Optionally, the water and oxygen barrier layer 172 and the appearance film layer 173 are respectively disposed on opposite sides of the substrate 171 . Among them, the appearance film layer 173 is used to achieve different appearance effects, specifically, it can include a texture layer (which can be formed by UV transfer), a color coating layer (which can be obtained by NCVM (abbreviation of Non conductive vacuum metalization, also known as discontinuous coating film) technology or non-conductive electroplating technology), nanoimprint layer, color coating layer, gradient color effect layer, ink layer and varnish protective layer, etc., are not specifically limited here. The overall thickness of the electrochromic module in this embodiment (the first substrate 110, the first conductive layer 120, the color-changing material layer 130, the second conductive layer 140, the second substrate 150 and the water-oxygen barrier unit 170 are stacked together) thickness can be It is 200-300um.

Please refer to FIG. 10. FIG. 10 is a schematic cross-sectional view of another embodiment of the electrochromic module of the present application; the electrochromic module in this embodiment also includes a metal wire 180, and the metal wire 180 specifically includes a first metal Wires 181 and second metal wires 182 ; the first metal wires 181 are connected to the first conductive layer 120 , and the second metal wires 182 are connected to the second conductive layer 140 . Wherein, the metal traces 180 include but are not limited to silver paste wires, copper plating, aluminum plating, or molybdenum-aluminum-molybdenum and other multi-layer wiring structures.

Please also refer to FIG. 11 . FIG. 11 is a schematic top view of the structure of the electrochromic module in FIG. 10 . The first metal wiring 181 is disposed along an edge position close to the surface of the first conductive layer 120 , and the second metal wiring 182 is disposed along an edge position close to the surface of the second conductive layer 150 . There are various design forms for the specific structure of the routing, such as L-shaped routing (the situation shown in the figure in this embodiment), circular routing, etc., which are not specifically limited here.

In order to make the electrochromic module have a faster discoloration speed, the square resistance of the first conductive layer 120 and the second conductive layer 140 is set to 40-150 ohms, such as 40 ohms, 50 ohms, 80 ohms, 100 ohms , 120 ohms, 550 ohms and other specific values; and the square resistance of the first metal trace 181 and the second metal trace 182 can be 0.05-2 ohms, specifically 0.05 ohms, 0.06 ohms, 0.1 ohms, 1.2 ohms, 1.5 ohms Values such as Euro and 2 Euro are not specifically limited here. The coloring speed of the electrochromic module can be between 10-20s, and the fading speed can be between 8-12s, or faster.

Optionally, please continue to refer to FIG. 11, the electrochromic module 100 in this embodiment further includes a flexible circuit board 183, and the flexible circuit board 183 is connected to the first metal trace 181 and the second metal wire respectively. Trace 182 connects. The first metal wiring 181 and the second metal wiring 182 communicate with an external drive circuit (specifically, it may be a control circuit board of an electronic device or a self-contained chip structure, which is not shown in the figure and will not be done here) through the flexible circuit board 183. Specifically defined) connection, the external drive circuit provides power for the electrochromic module and drives the electrochromic material to change color.

Please refer to FIG. 12 and FIG. 13 together. FIG. 12 is a schematic disassembly diagram of another embodiment of the electrochromic module of the present application; FIG. 13 is a schematic cross-sectional schematic diagram of a partial structure at the binding position in FIG. 12 . In this embodiment, the first metal wiring 181 and the second metal wiring 182 are circular wiring, and the flexible circuit board 183 is respectively connected to the first metal wiring 181 and the second metal wiring 182 on both sides (specifically To connect with the first wire lead-out end 1811 of the first metal wire 181 and the second wire lead-out end 1821 of the second metal wire 182), wherein, the shape of the flexible circuit board 183 is not limited to the embodiment of the present application The Y-shaped structure can also be a T-shaped structure, please refer to Figure 14, which is a schematic diagram of another flexible circuit board and wiring binding structure of the electrochromic module of the present application. The flexible circuit board 183 in FIG. 14 is a T-shaped structure. 13 and 14 are both double-sided binding, that is, the first metal wiring 181 and the second metal wiring 182 are respectively located on the conductive layers on both sides and bound to the flexible circuit board 183, That is double-sided binding. The advantage of double-sided bonding is that the bonding conduction is reliable, the process difficulty is low, and the overall structure is compact.

The technical solution of double-sided bonding is introduced above, and the structure of single-sided bonding is introduced below, that is, the metal traces on both sides are bonded to the flexible circuit board from one side of the substrate. Please refer to Figure 15, Figure 16 and Figure 17 together. Figure 15 is a schematic diagram of another flexible circuit board and wiring binding structure of the electrochromic module of this application, and Figure 16 is a schematic diagram of the electrochromic module in Figure 15. Schematic diagram of structural disassembly, Fig. 17 is an enlarged schematic diagram of the partial structure at A in Fig. 15 . The first metal trace 181 and the second metal trace 182 are respectively provided with a first trace lead-out end 1811 and a second trace lead-out end 1821 . The first substrate 110 is also provided with a wire connection end 1801 adjacent to the first metal wire 181 and insulated. The wire connection end 1801 can be cut by laser or yellow The photolithography process forms an island corresponding to the second wire lead-out end 1821 , and the wire connection end 1801 is isolated from the first conductive layer 120 in other areas of the first substrate 110 by the isolation region 1802 . The second metal trace 182 is electrically conductively connected to the trace connection end 1801 on the first substrate 110, and the flexible circuit board 183 is respectively connected to the trace connection end 1801 on one side of the first substrate 110 and The first wire lead-out end 1811 of the first metal wire 181 is connected. Furthermore, the purpose of conducting the flexible circuit board 183 from the substrate on one side to the metal traces on both sides at the same time is achieved.

Optionally, please also refer to FIG. 18 . FIG. 18 is a schematic cross-sectional view of a partial structure at B-B in FIG. The connection method can be realized by using the first conductive silver paste 1803, which can be formed by silk screen printing or spot coating, and the thickness is generally 3-10um.

The one-sided binding structure can make the color-changing invalid area at the edge narrower; because the flexible circuit board is bound on one side, the binding process is simpler.

In the embodiment shown in FIG. 10 , the first metal wiring 181 and the second metal wiring 182 are both disposed in the color-changing material layer 130 . Please refer to FIG. 19. FIG. 19 is a schematic cross-sectional view of another embodiment of the electrochromic module of the present application; the difference between the structure in this embodiment and the embodiment in FIG. The outer circumference of the two metal wires 182 is also provided with an insulating protective layer, specifically, a first insulating protective layer 1810 and a second insulating protective layer 1820 are respectively provided on the outer circumferences of the first metal wire 181 and the second metal wire 182; The first insulating protection layer 1810 and the second insulating protection layer 1820 are used to block the first metal wiring 181 and the second metal wiring 182 from the color-changing material layer 130, so as to prevent the color-changing material layer 130 from affecting the first metal The wire 181 and the second metal wire 182 are corroded. Wherein, the material of the first insulation protection layer 1810 and the second insulation protection layer 1820 may be organic polymer, or inorganic material, such as silicon oxide.

Please refer to FIG. 18 and FIG. 20 in conjunction. FIG. 20 is a schematic cross-sectional view of another embodiment of the electrochromic module of the present application. The outer periphery of the line 182 is provided with an insulating protective layer, so it is inconvenient for the second metal line 182 to be directly connected to the line connection end 1801 on the side of the first substrate 110 through the end face, or to consider the effective contact area of the end face silver paste connection method Small, the problem of conduction reliability, the technical solution in this embodiment is to set the via hole 1401 at the position of the second conductive layer 140 corresponding to the second metal trace 182, and then use the second conductive silver paste 1804 to pass through the The through hole 1401 realizes the conduction connection between the wire connecting end 1801 and the second metal wire 182 . Wherein, the number of through holes 1401 may be multiple, which is not specifically limited here. In this embodiment, the wiring connection end 1801 is connected to the second metal wiring 182 by punching holes and using silver paste, which has the characteristics of high conduction reliability and does not need to damage the insulation protection of the outer circumference of the metal wiring. layer.

The structure of the electrochromic module in the foregoing embodiments is that metal wires are placed in the color-changing material layer 130, please refer to Figure 21 and Figure 22 together, Figure 21 is a partial structure of another embodiment of the electrochromic module of the present application 22 is a schematic cross-sectional view of the local structure of another embodiment of the electrochromic module of the present application; optionally, at least one of the first metal wiring 181 and the second metal wiring 182 is embedded in the plastic frame 160 In this case, the metal wiring embedded in the plastic frame 160 is isolated from the color-changing material layer. Wherein, in the embodiment of FIG. 21, both the first metal trace 181 and the second metal trace 182 are buried in the plastic frame 160, and the first metal trace 181 and the second metal trace buried in the plastic frame 160 Line 182 is isolated from layer 130 of color changing material. On the one hand, it can prevent the first metal wiring 181 and the second metal wiring 182 from being corroded by the color-changing material layer 130; width.

Optionally, in the embodiment of FIG. 22 , the first metal wiring 181 is buried in the plastic frame 160; the second metal wiring 182 is arranged in the color-changing material layer 130, specifically, The second metal wire 182 may be embedded in the ion storage layer (ie, the IC layer) 133 .

The encapsulation method of the electrochromic module based on the large and small single plastic frame structure in the embodiment shown in FIG. 3 is introduced below. Please refer to FIG. 23 . FIG. 23 is a schematic flowchart of an embodiment of an electrochromic module packaging method of the present application. The packaging method includes but is not limited to the following steps.

Step M100, providing a stacked structure of an electrochromic module.

Please refer to FIG. 24 . FIG. 24 is a schematic diagram of the stacked structure of the semi-finished product of the stacked structure of the electrochromic module. In this step, the stacked structure of the electrochromic module (hereinafter referred to as semi-finished product) includes the first substrate 110, the first conductive layer 120, the color-changing material layer 130, the second conductive layer 140 and the second substrate 150, which are sequentially stacked. That is, the semi-finished material formed after the above five-layer structure is laminated.

Step M200, forming a ring groove on the stacked structure of the electrochromic module.

Please refer to FIG. 25 and FIG. 26 together. FIG. 25 is a schematic diagram of the stacked structure after ring grooves are formed on the semi-finished product of the stacked structure of the electrochromic module. FIG. 26 is a schematic top view of the structure of FIG. 25 . Wherein, the annular groove 1001 at least penetrates through the second substrate 150 , the second conductive layer 140 , the color-changing material layer 130 and the first conductive layer 120 . Wherein, the ring groove 1001 can be realized by laser cutting, CNC cutting, etc., and the color-changing material layer 130 can be formed by erasing, pre-printing blue glue protection on the position of the first substrate 110 corresponding to the ring groove 1001, etc. The ring groove is not specifically limited here. Among them, the set blue glue can be an acrylic UV curing system glue, which has solvent resistance and does not react with electrochromic materials. The adhesive surface of the first substrate 110 can be exposed by directly peeling off the blue glue.

Step M300, filling the ring groove with sealant.

Please refer to FIG. 27 . FIG. 27 is a schematic structural diagram of filling the sealant in the annular groove of the semi-finished electrochromic module, wherein the sealant 1600 is solidified to form the structure of the plastic frame 160 in the foregoing embodiment. Among them, before filling the sealing glue, the treatment to improve the bonding strength can also be performed on the bottom bonding surface of the first substrate 110 corresponding to the ring groove 1001. The processing methods include plasma treatment, roughening or printing ink layer, etc., the purpose is to The bonding strength between the glue frame 160 and the first substrate 110 is improved.

The electrochromic module packaging method provided in the embodiment of the present application solves the difficult problems of flexible electrochromic module packaging and module design. The packaging method is simple and feasible in technology, and has high packaging reliability. The color-changing film material (semi-finished product) is compatible with the process. After the completion of the flexible electrochromic module, it can be simply pasted on the glass cover to realize functional application, and the reliability is very good, so it can be applied to electronic products such as mobile phones.

Please refer to Fig. 28, Fig. 28 is a schematic flow chart of another embodiment of the electrochromic module packaging method of the present application. The packaging method is different from the previous embodiment in that it also includes:

Step M400, after the sealant in the ring groove is fixed to form a rubber frame, the remaining material is cut along the periphery of the rubber frame.

Please continue to refer to FIG. 27 , in this step, the parts on both sides of the dotted line in FIG. 27 are cut off to form the structure in FIG. 3 of the previous embodiment.

Please refer to FIG. 29. FIG. 29 is a schematic flow chart of another embodiment of the electrochromic module packaging method of the present application. The difference between this packaging method and the embodiment in FIG. 28 is that this embodiment also includes step M500. A water and oxygen barrier unit is attached to the surface away from the second conductive layer.

In this step, the water and oxygen barrier unit 170 may be bonded to the surface of the second substrate 150 away from the second conductive layer 140 through the optical adhesive layer 1701 to form the structure in FIG. 4 of the aforementioned embodiment. Finally, the electrochromic module is formed by binding the flexible circuit board. For the binding structure of the flexible circuit board, please refer to the related description of the foregoing embodiments, which will not be repeated here.

It should be noted that the methods in the foregoing embodiments are all based on the packaging method of a single plastic frame. When the structure of the double plastic frame is used, two ring grooves (the first ring groove 10011 and the second ring groove 10012) can be formed. , please refer to Fig. 30 and Fig. 31 together. Fig. 30 is a schematic diagram of the stacked structure after forming two ring grooves on the semi-finished electrochromic module; Fig. 31 is a schematic top view of the structure of Fig. 30, wherein the second ring groove 10012 It is sleeved on the outer periphery of the first ring groove 10011, and then filled with glue in the first ring groove 10011 and the second ring groove 10012 to form a double-frame electrochromic module packaging structure. Regarding the glue in the two ring grooves For the selection, please refer to the relevant descriptions in the foregoing embodiments, and details will not be repeated here.

In addition, the solution of the double glue frame can also be to apply a layer of glue on the outer periphery of the first glue frame 161 on the basis of forming a single glue frame structure as shown in FIG. Please refer to 32, Fig. 32 is a schematic structural diagram of another double glue frame of the electrochromic module. In the embodiment of FIG. 32 , the first glue frame 161 and the second glue frame 162 may be in contact with each other. The encapsulation method of the triple-plastic frame or the multi-plastic frame may be similar to that of the double-plastic frame, and will not be repeated here.

Optionally, the embodiment of the present application also provides a cover plate assembly, please refer to FIG. 33 , which is a schematic structural diagram of an embodiment of the cover plate assembly of the present application. The cover plate assembly 10 (also called a housing) includes The electrochromic module 100 and the transparent cover 200 . Wherein, the transparent cover plate 200 is bonded to the first substrate 110 of the electrochromic module 100 , specifically through an optical adhesive layer 1101 . Wherein, the material of the transparent cover plate 200 may be glass or transparent resin. In the embodiment of the present application, the transparent cover 200 generally refers to the back cover of the electronic device, that is, the battery cover. It should be noted that the structure of the electrochromic module 100 in this embodiment can be any one of the foregoing embodiments, and FIG. 33 is only illustrated with a schematic structure. The transparent cover 200 in this embodiment is a planar structure. The transparent cover plate 200 and the water-oxygen barrier unit 170 perform water vapor barrier from both sides respectively, and the water vapor barrier is performed by the plastic frame 160 around the sides. Please refer to Fig. 34, Fig. 34 is a schematic structural diagram of another embodiment of the cover assembly of the present application. The difference from the previous embodiment is that a shielding layer 201 is provided at the edge of the transparent cover 200 in this embodiment, and the shielding The layer 201 is set corresponding to the plastic frame 160 and the metal wiring (the first metal wiring 181 and the second metal wiring 182) of the electrochromic module 100, so as to realize the thickness direction of the electrochromic module 100 ( The shielding of the plastic frame 160 and the metal wiring of the electrochromic module in the direction of the arrow in the figure). Wherein, the shielding layer 201 shields both the plastic frame 160 and the metal wiring in the illustration of this embodiment, and in some other embodiments, the shielding layer 201 can be designed to shield only one of them.

Optionally, the shielding layer 201 includes any one of an ink layer, a yellow light treatment layer, and a matte gradient layer, which is not specifically limited here. Wherein, the color of the shielding layer 201 is the same or similar to the color of the electrochromic module 100 in the color-developing state, so as to achieve the visual effect that the shielding layer 201 and the electrochromic module 100 are integrated in the color-developing state.

Optionally, the color of the shielding layer 201 can also be made to be the same as or similar to the color of the non-color-developing state of the electrochromic module 100, and then the shielding layer 201 can make the electrochromic module 100 non-color-developing. The chromic module 100 and the frame or middle frame form a transitional color area to achieve the visual effect of a complete electronic device.

Optionally, please refer to FIG. 35 . FIG. 35 is a schematic structural view of another embodiment of the cover plate assembly of the present application. The difference from the previous embodiments is that the transparent cover plate 200 in this embodiment includes a bottom wall 210 and the same The side wall 220 of the bottom wall 210 is an integral structure, the side wall 220 is bent relative to the bottom wall 210 , and the electrochromic module 100 is bonded to the bottom wall 210 and the side wall 220 . In this embodiment, according to the setting positions of the side walls 220 (the side walls 220 are set on the opposite sides of the bottom wall 210, generally referred to as 2.5D in the industry, and the side walls 220 are set on the four sides of the bottom wall 210, in the industry Generally referred to as 3D), the adhesive force requirements between the plastic frame of the electrochromic module 100 and other film structures are also different. Optionally, when the bending angle a between the side wall 220 and the bottom wall 210 is greater than 30 degrees, the adhesive force between the glue frame 160 and the first substrate 110 or the second substrate 150 is required to be greater than 20N/inch. The bonding force between the frame 160 and the water and oxygen barrier unit 170 is greater than 20N/inch. Optionally, in the embodiment of the present application, the adhesive force between the glue frame 160 and the first substrate 110 and the water and oxygen barrier unit 170 is about 28N/inch, especially when considering the need to attach a 3D glass cover, the glue The part of the frame will be bent, and our adhesive surface needs to be used as a structural support, so the adhesive force needs to be high. If it is not used as a structural support, it is only from the perspective of waterproofing the device (that is, regardless of the bending In this case, as shown in the embodiment of Figure 34), the adhesive force between the plastic frame and other structural layers only needs to be about 1N/inch, and the requirement for the elongation at break of the plastic frame can also be reduced. If the adhesive force is not enough, it is easy to open the glue.

Optionally, the elongation at break of the rubber frame 160 in the embodiment of the present application is between 17% and 200%. If the elongation at break of the plastic frame 160 is insufficient, or too low, there will be problems of insecure or incomplete bonding, especially the position of the bending area of the 3D transparent cover, please refer to Figure 51, Figure 51 is Schematic diagram of insufficient elongation at break of the plastic frame of the electrochromic module resulting in incomplete bonding. The solid line in the figure represents the structural schematic diagram of bonding the electrochromic module 100 and the transparent cover plate 200 at the bending position, and the dotted line represents that the structure of the electrochromic module 100 is too rigid due to insufficient elongation at break of the plastic frame 160 Schematic diagram of the structure glued in place. A gap 102a is easily formed between the electrochromic module 100 and the transparent cover 200 , and then air bubbles are generated, which affects the lamination effect and display effect. 1101 in the figure represents an optical glue layer.

Please refer to FIG. 36 . FIG. 36 is a schematic structural diagram of one-side lead wire binding of the cover assembly, where the electrochromic module needs to be connected to the control circuit board (not shown) through the flexible circuit board 183 . From the first conductive layer 120 on the side of the upper first substrate 110, a small part of the metal lead (specifically the first metal trace 181 or the trace connection end 1801 provided on the first substrate 110, referring to FIG. 17 ) , so as to bind with the flexible circuit board. Optionally, the bonding process may be a high-temperature pressure-bonding bonding process using ACF glue (Anisotropic Conductive Film (ACF)). Optionally, pressing temperature: 120°C-140°C, pressure: 20-30N; pressing time: 5-15 seconds.

Optionally, the assembly method of the cover plate assembly in the embodiment of the present application may be as follows: the electrochromic module 100 (including the water and oxygen barrier unit 170 ) is attached as a whole with optical glue for bonding the transparent cover plate 200; Then, the electrochromic module 100 bonded with the optical glue is bound to the flexible circuit board 183 , and then the electrochromic module 100 bonded with the flexible circuit board 183 is bonded to the transparent cover 200 .

Optionally, the assembly method of the cover plate assembly can also be: first bind the electrochromic module 100 and the flexible circuit board 183; after binding the flexible circuit board 183, attach the optical glue; finally attach the transparent cover plate 200 on. Compared with the previous bonding process, this solution can solve the impact of optical glue on the ACF bonding process, and it can be bonded according to the normal pressure of 40N, which reduces the resulting poor bonding and conduction.

Optionally, in order to prevent subsequent moisture intrusion from causing ACF conduction failure, a small piece of protective glue 1808 is added to the bonding portion between the flexible circuit board 183 and the metal wire. The protective glue 1808 can be a liquid UV glue, which is covered at this position in the form of dispensing glue. The flexible circuit board 183 can be effectively protected from the corrosion of water vapor and the resulting salt mixture.

Optionally, please refer to Figure 37. Figure 37 is a schematic cross-sectional view of another embodiment of the cover plate assembly of the present application; different from the structure of the electrochromic module with a large and small sheet structure in Figure 33, the electrochromic module in this embodiment The chromic module 100 has a split-chip structure. Specifically, in this embodiment, the relative projections of the first conductive layer 120 and the second conductive layer 140 in the thickness direction partially overlap, and the color-changing material layer 130 is sandwiched between the first conductive layer 120 and the second conductive layer 140 . Between the projection overlapping area of layer 120 and the second conductive layer 140, the first metal trace 181 and the second metal trace 182 are respectively connected with the first conductive layer 120 and the second conductive layer The projected non-overlapping area of 140 is connected; the first metal trace 181 and the second metal trace 182 are buried in the plastic frame 160 . Water vapor barrier is realized around the electrochromic module 100 through the transparent cover plate 200 , the plastic frame 160 and the water and oxygen barrier unit 170 .

The staggered-piece structure provided in this embodiment reduces the risk of short-circuiting of the metal wiring and reduces the difficulty of the metal wiring process (the wiring can be easily realized by dispensing silver paste with a dispenser or silk screen printing, and will not cause damage to the metal wiring. other structural layers of the electrochromic module 100). Moreover, the packaging scheme is carried out independently of other structural layer production processes of the electrochromic module 100, and the smallest packaging unit (the structure of a single electrochromic module 100) can be flexibly designed without affecting the electrochromic function, and can be adapted to multiple application scenarios. design needs.

Please refer to FIG. 38 . FIG. 38 is a schematic cross-sectional view of another embodiment of the cover assembly of the present application; the feature of the cover assembly in this embodiment lies in the packaging position of the plastic frame. In this embodiment, each stacked structure of the electrochromic module 100 is interposed between the transparent cover plate 200 and the water-oxygen barrier unit 170 , and the plastic frame 160 surrounds the electrochromic module 100 , and together with the transparent cover plate 200 and the water and oxygen barrier unit 170 , realize the sealing of the electrochromic module 100 .

The cover plate assembly in this embodiment is characterized in that the upper plane, lower plane and surrounding areas of the electrochromic module 100 are respectively sealed by the transparent cover plate 200, the water and oxygen barrier unit 170 and the plastic frame, which can well prevent the intrusion of water vapor . The water-oxygen barrier unit 170 has good water-oxygen barrier performance, and the water-oxygen barrier unit 170 and the transparent cover 200 (specifically, a glass cover) are well bonded to the encapsulation frame to prevent water and oxygen from intruding from the edge interface. The packaging reliability of this structure is high, the overall device is relatively light and thin, and the packaging frame is narrow, which can meet the application conditions of mobile phones and other electronic products.

Optionally, please refer to FIG. 39 . FIG. 39 is a schematic flowchart of an embodiment of the method for assembling the cover assembly in the embodiment of FIG. 38 ; the method for assembling includes the following steps.

Step M3901, attaching the electrochromic module to the transparent cover.

In this step, the preparation method of the electrochromic module generally includes the following steps. The first step is to prepare a conductive substrate with metal traces. On the upper and lower PET/ITO films (respectively, the first conductive layer 120 is formed on the first substrate 110 and the second conductive layer 140 is formed on the second substrate) by screen printing Ag or metallized film and then etching, etc. The process method is to make metal wiring (the first metal wiring 181 and the second metal wiring 182). In order to prevent corrosion of the metal lines, another layer of insulating protection layer (1810, 1820) is prepared on the surface of the metal lines. The preparation methods of the insulating protective layer include screen printing insulating varnish, exposure and development after coating insulating varnish, or depositing an inorganic insulating protective layer (such as SiO2) and the like. Then on the upper and lower sheets of PET/ITO film, respectively coat the electrochromic layer (i.e. EC layer) 131, the dielectric layer 132, and the ion storage layer (i.e. IC layer) 133 (see Figure 2 for details), and then carry out the upper and lower sheets For a positive fit. Finally, laser cutting is carried out according to the designed shape, and the excess material on the edge is removed. At the same time, the edges of the upper and lower PET/ITO films are even, and then the flexible circuit board is bound. For the detailed structural features of this part, please refer to the relevant description of the previous embodiment. .

Step M3902, dispensing glue around the electrochromic module to form a glue frame.

After this step, an intermediate finished structure as shown in FIG. 40 is formed. Please refer to FIG. 40 . FIG. 40 is a schematic diagram of the structure of the electrochromic module and the transparent cover after bonding and dispensing glue.

Step M3903, affixing the water and oxygen barrier unit on the surface of the electrochromic module facing away from the transparent cover.

In this step, optical glue (such as 1701 in the previous embodiment) can be used to bond the water-oxygen barrier unit 170 and the side surface of the electrochromic module away from the transparent cover (specifically, the second substrate in this embodiment). 150 outer surface) bonding.

The assembly method of the cover plate assembly provided in this embodiment has the characteristics of simple process and good waterproof performance of the formed cover plate assembly.

Please refer to FIG. 41 . FIG. 41 is a schematic structural view of bonding the rear cover and the middle frame of an electronic device in the conventional technology. In conventional technology, the back cover 200a of electronic equipment such as mobile phones is generally directly bonded to the middle frame 20a by dispensing glue 2002. 55 in the figure indicates the structure of the battery and circuit board inside the electronic equipment, and 2001 indicates the back cover 200a. The appearance of the film layer structure. This kind of bonding method between the rear cover 200a and the middle frame 20a is inconvenient to disassemble the rear cover 200a because the two are too tightly bonded. In the maintenance process, it is necessary to use a heat gun and a pulling adsorption device to remove the rear cover 200a. On the other hand, the vibration damping effect between the rear cover 200a and the middle frame 20a is poor. When the electronic device falls, the rear cover 200a vibrates strongly, and the components attached to the rear cover 200a are easily shaken off. , and even vibration dislocation.

In view of the above problems, the embodiment of the present application provides a housing assembly. Please refer to Figure 42 and Figure 43 together. A schematic front view of the structure of the assembly; the housing assembly (also referred to as the housing) includes a middle frame 20 and a cover assembly 10; wherein, the cover assembly 10 can be the cover assembly structure in the foregoing embodiments, and this embodiment only A structure is taken as an example for schematic illustration. In this embodiment, the opposite sides of the electrochromic module 100 are bonded to the transparent cover plate 200 and the middle frame 20 respectively, and the bonding between the transparent cover plate 200 and the middle frame 20 is cancelled, so that the transparent cover The plate 200 is spaced apart from the middle frame 20 to form a buffer gap 202 . Optionally, the water-oxygen barrier unit 170 of the electrochromic module 100 and the middle frame 20 may be bonded by foam glue 1702 , specifically, it may be between the appearance film layer 173 of the water-oxygen barrier unit 170 and the middle frame 20 The space is bonded by foam glue 1702. The foam glue 1702 can play the role of bonding on the one hand, and play the role of cushioning on the other hand.

Optionally, the retraction distance D1 of the electrochromic module 100 relative to the edge of the transparent cover 200 is 0.3-0.6mm, and the foam glue 1702 is pasted under the electrochromic module 100, and its width D2 can be 2-4mm. Wherein, the width D2 of the foam glue 1702 can be designed to be greater than the width T of the glue frame 160 to ensure the reliability of bonding, and the thickness of the foam glue 1702 can be 0.2-0.4mm, which is not specifically limited here. Optionally, the projection of the foam glue 1702 on the transparent cover 200 is at least partially overlapped with the projection of the glue frame 160 on the transparent cover 200 . The purpose of this design is to ensure that the position of the adhesive force of the foam glue 1702 on the electrochromic module 100 is close to the glue frame 160, because the previous embodiments have described the relationship between the glue frame 160 and the substrate and the water and oxygen barrier unit. The adhesive force of 170 is generally stronger than the adhesive force between the sub-layer structures of the color-changing material layer 130 (the pulling force between the color-changing material layers 130 is generally less than 20N); The width of the black border in the embodiment is D1+T) as small as possible, if the projection of the foam glue 1702 and the plastic frame 160 on the transparent cover 200 completely overlaps or one completely covers the other, then one of them The width of is the width of the black border, otherwise the width of the black border is the sum of the widths of the two or the sum of the widths minus the width of the projection overlap. It can be seen from FIG. 43 that the casing assembly can be roughly divided into a reserved area X for the camera, a color-changing area Y, and a black border area Z when viewed from the side of the transparent cover plate 200 .

In the bonding structure of the shell assembly in this embodiment, the electrochromic module 100 can be bonded to the transparent cover 200 to form a cover assembly, and then the cover assembly can be easily assembled on the middle frame; Under the condition of black edge design, the width design of the packaging layer of the electrochromic module can be thicker, which is beneficial to the protection of the electrochromic module; compared with the solution of transparent cover dispensing and middle frame assembly, the battery cover (cover assembly) It can be repaired and has high reuse rate and low repair cost.

Further, the embodiment of the present application also provides an electronic device, please refer to FIG. 44 , which is a block diagram of a partial structure of an embodiment of the electronic device of the present application. The electronic device in this embodiment includes a display module 30 and a casing body assembly; wherein, the display screen module 30 and the cover assembly 10 are respectively arranged on opposite sides of the middle frame 20, that is, the cover assembly 10 in this embodiment is a rear cover structure of an electronic device . The detailed technical features of the structures of other parts of the electronic device are within the comprehension scope of those skilled in the art, and will not be repeated here.

Please refer to Fig. 42 and Fig. 44 in conjunction, when the housing assembly in Fig. 42 is applied in electronic equipment, its reliability needs to be tested, and the structure of the test is based on the housing assembly structure in Fig. 42 (including the transparent Cover plate, electrochromic module, water and oxygen barrier unit) are applied to electronic equipment for illustration. Please refer to the following table (Table 4) for specific sample data. Among them, reliability test conditions: temperature 65 degrees, humidity 95%.

Plastic frame water vapor transmission rate (unit g/m2/day) reliability test 100 1.5 days expiration 50 3 days expire 30 5 days expire 20 More than 7 days will not expire

From the above analysis, it can be seen that only when the water vapor transmission rate of the plastic frame is greater than 20g/m2/day, can the electrochromic module work reliably and stably for a long time.

When the electrochromic module fails, there will be a problem of reverse coloring. The so-called reverse coloring is the failure area (the area corroded by water vapor, generally close to the edge, that is, the position close to the plastic frame) that cannot be colored when it needs to be colored. Shading, where shading occurs when shading is not required, manifests itself as patchy areas with inconsistent discoloration. Please refer to FIG. 50 . FIG. 50 is a schematic structural diagram of a reversely colored color block when the electrochromic module fails. The position marked 888 in the figure represents the reversed color block area.

In addition, please also refer to the following table (Table 5), which is the data table of the electronic equipment test experiment. The test conditions are conventional test conditions in the field of electronic equipment (the mobile phone is used as an example for testing in this embodiment), and are used to test the working reliability of the electrochromic module on the electronic equipment.

project time critical result High temperature and high humidity cycle discoloration test 500 hours OK Xenon Aging Test 200 hours OK Cyclic discoloration test at room temperature 1000 hours OK

It can be seen from the above test results that the packaging structure of the electrochromic module in the embodiment of the present application can also meet the high temperature and high humidity tests of electronic products, and meet the application conditions of electronic products.

Optionally, the embodiment of the present application also provides an electronic device, please refer to FIG. 45 , which is a structural block diagram of another embodiment of the electronic device of the present application. The electronic device includes a control circuit 40 and a cover assembly 10 . Specifically, the control circuit 40 is coupled and connected with the electrochromic module 100 of the cover plate assembly 10 , and the control circuit 40 is used to receive a control instruction, and the control instruction is used to control the electrochromic module 100 to change color.

Optionally, please refer to FIG. 46. FIG. 46 is a structural block diagram of another embodiment of the electronic device of the present application. The difference from the previous embodiment is that the electronic device in this embodiment also includes a signal input device 50, wherein, The signal input device 50 is coupled with the control circuit 40 .

Specifically, the control circuit 40 is used to receive the control instruction input through the signal input device 50, and control the working state of the electrochromic module 100 according to the control instruction; wherein, the electrochromic module The working state of 100 includes controlling and changing its voltage or current signal state to achieve the purpose of controlling the color changing state of the electrochromic module 100 . Wherein, the signal input device 50 may include a touch screen, an operation button, a trigger sensor, etc., and the detailed structure and signal input method are as follows.

Optionally, please refer to FIG. 47. FIG. 47 is a schematic structural diagram of an embodiment of an electronic device, wherein the signal input device 50 may be a touch screen 51, and the control command input by the signal input device 50 may be a touch display The touch operation received by the screen 51 includes at least one of sliding, clicking and long pressing, please refer to Figure 48 and Figure 49, Figure 48 is a schematic diagram of an operating state of the electronic device; Figure 49 is another schematic diagram of the electronic device A schematic diagram of an operating state. Among them, in FIG. 48, it can be shown that the operator (marked 005 in the figure can be represented as the operator’s hand) enters the control command by sliding the touch screen 51; while the state in FIG. 45 can show that the operator clicks or long The input process of the control command is performed according to the graph or specific position on the touch screen 51 .

Further, please continue to refer to FIG. 47 , the signal input device 50 can be an operation key 52, and the control instruction can also be a trigger instruction of the operation key 52, wherein the operation key 52 can be a separate key, or can be a The multiplexing of other function keys of electronic equipment, such as power key, volume key, etc., is defined as different control instructions received by the control circuit 40 according to different key trigger modes, and then the control circuit 40 can implement different functions for the electrochromic module 100. signal control.

Optionally, the control instruction is a usage scenario that requires the electronic device to change color, and specifically may include at least one of image acquisition requirements, flashlight turn-on requirements, automatic timing color changing requirements, and other functional component requirements. Specifically, the image acquisition requirement can be applied when the user has shooting requirements, such as taking pictures, video recording, video calls and other scenarios, electronic device unlocking requirements, payment, encryption, answering calls, or other confirmation requirements. The demand for turning on the flashlight can be when the user has a need to turn on the flashlight. Specifically, the control circuit 40 controls the electrochromic module 100 to change the transparent state. Electronic devices can exhibit a discolored appearance.

Further, please continue to refer to FIG. 47 , the signal input device 50 can be a trigger sensor 53, wherein the trigger sensor 53 can be a proximity sensor, a temperature sensor, an ambient light sensor, etc., and the trigger sensor 53 collects peripheral signals of electronic equipment, and controls The circuit 40 controls the housing assembly to change the appearance color. That is, the change of the appearance color of the shell assembly can enable the user to actively carry out operational control, similar to the control mode through the touch screen and the operation button; it can also automatically control the shell by detecting the environmental signal by the trigger sensor in this embodiment. The way the component changes its skin color.

The electronic device provided by the embodiments of the present application has the appearance effect of color-changing display, and has a very good appearance aesthetic feeling.

The above descriptions are only part of the embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Any equivalent device or equivalent process conversion made by using the description of the present invention and the contents of the accompanying drawings, or directly or indirectly used in other related All technical fields are equally included in the scope of patent protection of the present invention.

Claims (40)

1. An electrochromic module, characterized in that the electrochromic module includes a first substrate, a first conductive layer, a color-changing material layer, a second conductive layer, a second substrate, a plastic frame, a first metal wires and second metal wires; wherein, the first substrate, the first conductive layer, the color-changing material layer, the second conductive layer, and the second substrate are sequentially stacked; the plastic frame Surrounding the side circumference of the color-changing material layer to realize the circumferential sealing of the color-changing material layer; the water vapor transmission rate of the plastic frame is not greater than 20g/m2/day; A water vapor barrier agent is doped in the plastic frame, and the water vapor barrier agent includes micron-sized SiO2 powder or molecular sieve; The first metal wiring is connected to the first conductive layer, and the second metal wiring is connected to the second conductive layer; the first metal wiring is along an edge close to the surface of the first conductive layer position setting, the second metal wiring is set along an edge position close to the surface of the second conductive layer; The outer surfaces of the first metal wiring and the second metal wiring are provided with an insulating protective layer, and the insulating protective layer is used to block the first metal wiring and the second metal wiring from the color-changing material Layer; the first substrate is provided with a wiring connection end adjacent to the first metal wiring and insulated, and the second metal wiring is connected to the wiring connection end through conductive silver paste, so The position of the second conductive layer corresponding to the second metal wire is provided with a through hole, and the conductive silver paste realizes the conduction connection between the wire connection end and the second metal wire through the through hole. 2. The electrochromic module according to claim 1, wherein the width of the plastic frame is greater than 1mm. 3. The electrochromic module according to claim 2, characterized in that, under the conditions of an ambient temperature of 60°C and a relative humidity of 90%, the water vapor transmission rate of the plastic frame is 1-15g/m ² /day. 4. The electrochromic module according to claim 1, wherein the elongation at break of the plastic frame is 2-400%. 5. The electrochromic module according to claim 1, wherein the modulus of the plastic frame is less than 1Gpa. 6. The electrochromic module according to claim 1, wherein the plastic frame is formed by solidification of epoxy-based glue or acrylic-based glue. 7. The electrochromic module according to claim 1, wherein the mass fraction of the water vapor barrier in the plastic frame is 1-10%. 8. The electrochromic module according to claim 1, wherein the plastic frame comprises a first plastic frame and a second plastic frame, and the first plastic frame surrounds the side of the color-changing material layer Around the edge ring, the second plastic frame surrounds the outer periphery of the first plastic frame. 9. The electrochromic module according to claim 8, wherein the water vapor transmission rate of the first plastic frame is lower than the water vapor transmission rate of the second plastic frame. 10 . The electrochromic module according to claim 9 , wherein the adhesiveness of the second plastic frame is higher than that of the first plastic frame. 11 . 11. The electrochromic module according to claim 8, wherein the widths of the first plastic frame and the second plastic frame are both larger than 0.3 mm. 12. The electrochromic module according to any one of claims 8-11, wherein the first plastic frame is formed by solidifying epoxy glue, and the second plastic frame is formed by solidifying acrylic glue . 13 . The electrochromic module according to claim 8 , wherein the plastic frame further comprises a third plastic frame, and the third plastic frame is arranged on the outer periphery of the second plastic frame. 14 . 14. The electrochromic module according to claim 13, wherein the width of the third plastic frame is larger than 0.3 mm. 15. The electrochromic module according to claim 13, wherein the water vapor transmission rate of the third plastic frame is not greater than 5 g/m ² /day. 16. The electrochromic module according to claim 1, characterized in that the electrochromic module further comprises a water-oxygen barrier unit, and the water-oxygen barrier unit is arranged on the second substrate away from the first The surface of the second conductive layer. 17 . The electrochromic module according to claim 16 , wherein the water-oxygen barrier unit comprises a base material and a water-oxygen barrier layer disposed on at least one surface of the base material. 18. The electrochromic module according to claim 17, wherein the water-oxygen barrier layer is a dense metal oxide layer or an inorganic non-metallic layer or a composite layer composed of materials and inorganic materials. 19. The electrochromic module according to claim 18, characterized in that, the base material is provided with a color layer, a nanoimprint layer, a texture layer, a transfer printing layer, etc. at least one of the layers. 20. The electrochromic module according to claim 17, wherein the first substrate, the second substrate and the base material are all made of flexible transparent resin materials. 21. The electrochromic module according to claim 20, wherein the flexible transparent resin material comprises any one of polyethylene terephthalate, polycarbonate and polyimide. 22. The electrochromic module according to claim 19, wherein the plastic frame surrounds the first conductive layer, the color-changing material layer, the second conductive layer and the second conductive layer. The side edge of the substrate surrounds and is bonded to the surface of the first substrate facing the first conductive layer. 23. A cover assembly, characterized in that the cover assembly includes a transparent cover and the electrochromic module according to any one of claims 1-22, the transparent cover and the electrochromic The first substrate of the module is bonded. 24. The cover plate assembly according to claim 23, wherein the transparent cover plate comprises a bottom wall and a side wall integrated with the bottom wall, and the side wall is bent relative to the bottom wall , the electrochromic module is bonded to the bottom wall and the side wall. 25. The cover plate assembly according to claim 24, wherein the bending angle between the side wall and the bottom wall is greater than 30 degrees. 26. The cover plate assembly according to claim 25, wherein the bonding force between the plastic frame and the first substrate or the second substrate is greater than 20N/inch, and the bonding force between the plastic frame and the water-oxygen barrier unit The force is greater than 20N/inch. 27. The cover plate assembly according to claim 23, wherein a shielding layer is provided at the edge of the transparent cover plate, and the shielding layer is at least set corresponding to the plastic frame of the electrochromic module for The shielding of the plastic frame of the electrochromic module is realized. 28. The cover plate assembly according to claim 27, characterized in that, the shielding layer is arranged at least corresponding to the metal wiring of the electrochromic module, so as to implement the metal wiring of the electrochromic module of occlusion. 29. The cover plate assembly according to claim 27, wherein the shielding layer comprises any one of an ink layer, a yellow light treatment layer, and a matte gradient layer. 30. The cover plate assembly according to claim 27, wherein the color of the shielding layer is the same or similar to the color of the electrochromic module in a color development state. 31. A casing assembly, characterized in that the casing assembly includes a middle frame and the cover assembly according to any one of claims 23-30; the opposite sides of the electrochromic module are respectively connected to the The transparent cover plate and the middle frame are bonded together. 32. The casing assembly according to claim 31, wherein the electrochromic module is bonded to the middle frame by foam glue. 33. The housing assembly according to claim 32, wherein the projection of the foam glue on the transparent cover plate at least partially overlaps with the projection of the plastic frame on the transparent cover plate. 34. The housing assembly according to claim 33, wherein the width of the foam glue is greater than the width of the rubber frame. 35. The casing assembly according to claim 31, wherein the transparent cover plate is spaced apart from the middle frame. 36. An electronic device, characterized in that the electronic device comprises a display screen module and the casing assembly according to any one of claims 31-35; the display screen module and the cover plate assembly are respectively arranged on opposite sides of the middle frame. 37. An electronic device, characterized in that the electronic device comprises a control circuit and the housing assembly according to any one of claims 31-35, the control circuit and the electrochromic module of the housing assembly Coupling connection, the control circuit is used to receive a control instruction, and the control instruction is used to control the electrochromic module to change color. 38. The electronic device according to claim 37, wherein the electronic device further comprises a touch screen, and the control command is a touch operation received by the touch screen; the touch operation includes sliding At least one of , click and long press. 39. The electronic device according to claim 37, wherein the electronic device comprises an operation key, and the control instruction is a trigger instruction of the operation key. 40. The electronic device according to claim 37, wherein the electronic device comprises a trigger sensor, and the control instruction is a trigger instruction of the trigger sensor.

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