CN114672794A - Metallized aramid fiber honeycomb material, and preparation method and application thereof - Google Patents
Metallized aramid fiber honeycomb material, and preparation method and application thereof Download PDFInfo
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- CN114672794A CN114672794A CN202011568899.9A CN202011568899A CN114672794A CN 114672794 A CN114672794 A CN 114672794A CN 202011568899 A CN202011568899 A CN 202011568899A CN 114672794 A CN114672794 A CN 114672794A
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- honeycomb
- nickel
- aramid fiber
- iron
- aramid
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- 239000000463 material Substances 0.000 title claims abstract description 70
- 229920006231 aramid fiber Polymers 0.000 title claims abstract description 33
- 238000002360 preparation method Methods 0.000 title claims abstract description 29
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 claims abstract description 59
- 230000004913 activation Effects 0.000 claims abstract description 58
- 238000007747 plating Methods 0.000 claims abstract description 58
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 52
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 40
- 230000007797 corrosion Effects 0.000 claims abstract description 34
- 238000005260 corrosion Methods 0.000 claims abstract description 34
- 238000004140 cleaning Methods 0.000 claims abstract description 27
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 26
- 229910052742 iron Inorganic materials 0.000 claims abstract description 20
- 239000000126 substance Substances 0.000 claims abstract description 15
- 239000004760 aramid Substances 0.000 claims description 112
- 229920003235 aromatic polyamide Polymers 0.000 claims description 112
- 239000000243 solution Substances 0.000 claims description 54
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 50
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 35
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 35
- 239000011248 coating agent Substances 0.000 claims description 35
- 238000000576 coating method Methods 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 33
- 239000012670 alkaline solution Substances 0.000 claims description 32
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 26
- 239000011162 core material Substances 0.000 claims description 26
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 20
- XXSPKSHUSWQAIZ-UHFFFAOYSA-L 36026-88-7 Chemical compound [Ni+2].[O-]P=O.[O-]P=O XXSPKSHUSWQAIZ-UHFFFAOYSA-L 0.000 claims description 18
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 claims description 18
- 239000003638 chemical reducing agent Substances 0.000 claims description 17
- 230000008569 process Effects 0.000 claims description 17
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 17
- 238000005406 washing Methods 0.000 claims description 17
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 claims description 16
- 229940078494 nickel acetate Drugs 0.000 claims description 16
- 239000003995 emulsifying agent Substances 0.000 claims description 13
- MQLVWQSVRZVNIP-UHFFFAOYSA-L ferrous ammonium sulfate hexahydrate Chemical compound [NH4+].[NH4+].O.O.O.O.O.O.[Fe+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O MQLVWQSVRZVNIP-UHFFFAOYSA-L 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000012279 sodium borohydride Substances 0.000 claims description 12
- 229910000033 sodium borohydride Inorganic materials 0.000 claims description 12
- 239000003054 catalyst Substances 0.000 claims description 11
- 238000007772 electroless plating Methods 0.000 claims description 11
- 150000002815 nickel Chemical class 0.000 claims description 11
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 claims description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 9
- 239000011574 phosphorus Substances 0.000 claims description 9
- 229910052698 phosphorus Inorganic materials 0.000 claims description 9
- 239000011775 sodium fluoride Substances 0.000 claims description 9
- 235000013024 sodium fluoride Nutrition 0.000 claims description 9
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 claims description 8
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims description 8
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 6
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 6
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 6
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims description 5
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 4
- 239000003513 alkali Substances 0.000 claims description 4
- 229910000085 borane Inorganic materials 0.000 claims description 4
- 239000008103 glucose Substances 0.000 claims description 4
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 4
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 4
- 238000002791 soaking Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 3
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims description 3
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 229960002089 ferrous chloride Drugs 0.000 claims description 3
- 230000008595 infiltration Effects 0.000 claims description 3
- 238000001764 infiltration Methods 0.000 claims description 3
- NMCUIPGRVMDVDB-UHFFFAOYSA-L iron dichloride Chemical compound Cl[Fe]Cl NMCUIPGRVMDVDB-UHFFFAOYSA-L 0.000 claims description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims description 3
- 235000019260 propionic acid Nutrition 0.000 claims description 3
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 3
- 238000009210 therapy by ultrasound Methods 0.000 claims description 3
- 239000004471 Glycine Substances 0.000 claims description 2
- 239000012535 impurity Substances 0.000 abstract description 20
- 230000035699 permeability Effects 0.000 abstract description 11
- 239000002245 particle Substances 0.000 abstract description 9
- 239000004519 grease Substances 0.000 abstract description 8
- 238000001465 metallisation Methods 0.000 abstract description 7
- 239000002480 mineral oil Substances 0.000 abstract description 6
- 235000010446 mineral oil Nutrition 0.000 abstract description 6
- 239000000428 dust Substances 0.000 abstract description 5
- 239000011148 porous material Substances 0.000 abstract description 5
- 239000007787 solid Substances 0.000 abstract description 5
- 230000006835 compression Effects 0.000 abstract description 3
- 238000007906 compression Methods 0.000 abstract description 3
- 241000264877 Hippospongia communis Species 0.000 description 147
- 238000001994 activation Methods 0.000 description 53
- 238000005530 etching Methods 0.000 description 23
- 239000008367 deionised water Substances 0.000 description 19
- 229910021641 deionized water Inorganic materials 0.000 description 19
- 238000012360 testing method Methods 0.000 description 16
- 230000000694 effects Effects 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 239000000203 mixture Substances 0.000 description 9
- 239000010410 layer Substances 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 229910000859 α-Fe Inorganic materials 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 229910021389 graphene Inorganic materials 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 230000005672 electromagnetic field Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 230000004580 weight loss Effects 0.000 description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229960002449 glycine Drugs 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QTQYYEMULPAVQO-UHFFFAOYSA-N [B].NCC(O)=O Chemical compound [B].NCC(O)=O QTQYYEMULPAVQO-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 235000013905 glycine and its sodium salt Nutrition 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- LHLROOPJPUYVKD-UHFFFAOYSA-N iron phosphanylidynenickel Chemical compound [Fe].[Ni]#P LHLROOPJPUYVKD-UHFFFAOYSA-N 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000006262 metallic foam Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002940 palladium Chemical class 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000011158 quantitative evaluation Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Description
技术领域technical field
本发明涉及电磁屏蔽技术领域,具体而言,涉及一种金属化芳纶蜂窝材料、其制备方法 和应用。The present invention relates to the technical field of electromagnetic shielding, in particular, to a metallized aramid honeycomb material, a preparation method and application thereof.
背景技术Background technique
随着研究技术的不断发展与提高,各种类型的屏蔽材料相继被开发和应用,目前主要使 用的电磁屏蔽材料根据透气性可分为不透气类与透气类。而对于有通风口的机箱等仪器设备, 需要通风透气的同时又需要屏蔽电磁波,则需选用透气性电磁屏蔽材料。现阶段普遍使用的 透气性电磁屏蔽材料主要有金属网和波导窗;而屏蔽性能优良、轻质且透气的泡沫金属是近 年来人们开发的一类新型电磁屏蔽材料。它不仅具有金属材料良好的导电性或磁性,而且由 于其内部存在多孔结构使得电磁波在其孔隙内部可发生多次反射损耗,从而使其相比于二维 金属网具有更高的电磁波屏蔽能力,甚至可以达到波导窗的屏蔽效果。With the continuous development and improvement of research technology, various types of shielding materials have been developed and applied one after another. At present, the electromagnetic shielding materials mainly used can be divided into air-tight and air-permeable according to the air permeability. For equipment such as chassis with vents, which need to be ventilated and shielded from electromagnetic waves at the same time, a breathable electromagnetic shielding material needs to be used. The air permeable electromagnetic shielding materials commonly used at this stage are mainly metal meshes and waveguide windows; and the metal foam with excellent shielding performance, light weight and air permeability is a new type of electromagnetic shielding material developed in recent years. It not only has good electrical conductivity or magnetic properties of metal materials, but also has multiple reflection losses of electromagnetic waves in its pores due to the porous structure inside, so that it has higher electromagnetic wave shielding ability than two-dimensional metal meshes. Even the shielding effect of the waveguide window can be achieved.
电磁屏蔽是指将电磁污染源至指定区域之间的电磁波传播路径阻断,从而降低或消除污 染源对指定区域内的敏感设备、器件或人体产生的不良影响。根据屏蔽的工作原理不同,可 将其分为静电屏蔽、磁屏蔽和电磁屏蔽三大类。其中,静电屏蔽与磁屏蔽只是电磁屏蔽的两 种特殊类型。Electromagnetic shielding refers to blocking the electromagnetic wave propagation path between the electromagnetic pollution source and the designated area, so as to reduce or eliminate the adverse effect of the pollution source on the sensitive equipment, devices or human body in the designated area. According to the different working principles of shielding, it can be divided into three categories: electrostatic shielding, magnetic shielding and electromagnetic shielding. Among them, electrostatic shielding and magnetic shielding are only two special types of electromagnetic shielding.
各类屏蔽材料对外场电磁波的屏蔽能力及效果通常用屏蔽效能(SE),SE的单位用分贝 (dB)表示,利用Schelkunoff公式计算电磁材料的屏蔽效能:The shielding ability and effect of various shielding materials to external electromagnetic waves are usually expressed in shielding effectiveness (SE), and the unit of SE is expressed in decibels (dB). The Schelkunoff formula is used to calculate the shielding effectiveness of electromagnetic materials:
SE=SER+SEA+SEM。SE = SE R +SE A +SE M .
式中SER为反射损耗,SEA为吸收损耗,SEM为多次反射损耗。其中反射损耗是由屏蔽材 料与空间介质的阻抗不匹配引起的,是材料中带电粒子与电磁场相互作用的结果;吸收损耗 是由磁偶极子或电偶极子与电磁场相互作用而产生热损耗引起的;而多次反射损耗则是由屏 蔽体内部的不均匀性产生的。where SE R is the reflection loss, SE A is the absorption loss, and SEM is the multiple reflection loss. The reflection loss is caused by the impedance mismatch between the shielding material and the space medium, and is the result of the interaction of charged particles in the material with the electromagnetic field; the absorption loss is caused by the interaction of magnetic dipoles or electric dipoles with the electromagnetic field. The multiple reflection loss is caused by the inhomogeneity inside the shield.
芳纶纸蜂窝芯材作为一种特殊的复合材料结构,拥有比强度高、减震好、绝热佳等特点, 其连续多孔的结构也可以使电磁波在蜂窝芯材层内多次吸收、反射和散射,而且纸蜂窝价格 低廉,经济效益高。鉴于蜂窝芯材上述优点,蜂窝芯材不仅广泛应用于民用、建筑等领域, 在航空、航天领域也占有重要地位。Aramid paper honeycomb core material, as a special composite material structure, has the characteristics of high specific strength, good shock absorption, and good heat insulation. scattering, and the paper honeycomb is cheap and economical. In view of the above advantages of honeycomb core material, honeycomb core material is not only widely used in civil, construction and other fields, but also occupies an important position in aviation and aerospace fields.
另外,由于蜂窝具有较高的比刚度、相对密度较低等优点,蜂窝夹层结构设计性强,加 工成型简单,已被越来越广泛的应用在航空航天以及轨道交通等领域。考虑到蜂窝夹芯结构 在飞机舱内主体结构中的大面积使用,合理的开发具有电磁屏蔽功能的蜂窝芯材,可以有效 保护航空飞行舱内精密仪器及乘坐人员免受电磁干扰,实现航空芯材的结构、功能一体化设 计,整体提高蜂窝芯材的空间利用率,从而实现芯材材料智能轻量化设计与功能集成式整合 性应用目的。随着电子科学、尖端技术的高速发展,具有屏蔽性能的蜂窝夹芯复合材料在现 代化电子对抗技术中的应用已不限于国防飞机、舰船装备领域,而拓展到通讯基站、车载、 室内雷达罩等民用技术中。In addition, due to the advantages of high specific stiffness and low relative density, honeycomb sandwich structure has strong design and simple processing and molding, and has been widely used in aerospace and rail transportation fields. Considering the large-area use of the honeycomb sandwich structure in the main structure of the aircraft cabin, the reasonable development of the honeycomb core material with electromagnetic shielding function can effectively protect the precision instruments and passengers in the aviation cabin from electromagnetic interference, and realize the aviation core. The integrated design of the structure and function of the core material improves the space utilization rate of the honeycomb core material as a whole, so as to realize the intelligent lightweight design of the core material and the integrated application purpose of the function integration. With the rapid development of electronic science and cutting-edge technology, the application of honeycomb sandwich composite materials with shielding properties in modern electronic countermeasure technology is not limited to the field of national defense aircraft and ship equipment, but also extended to communication base stations, vehicle-mounted and indoor radomes. and other civil technology.
模仿天然蜂巢的六边形蜂窝结构,由于重量轻且具有高强度和高刚度,而被广泛地用作 夹层结构芯材。当雷达波由透波层进入夹芯结构内部时,夹芯腔体对其进行多次散射与吸收, 最大限度地衰减雷达波能量并由此获得宽频以及高强度屏蔽吸波效果。Hexagonal honeycomb structures, imitating natural honeycombs, are widely used as core materials for sandwich structures due to their light weight and high strength and stiffness. When the radar wave enters the interior of the sandwich structure from the wave-transmitting layer, the sandwich cavity performs multiple scattering and absorption, maximally attenuating the radar wave energy and thus obtaining a broadband and high-strength shielding and absorbing effect.
电磁屏蔽为在空间某个区域内用以减弱由某些发射源引起的电磁场的措施。在绝大多数 情况下,屏蔽体可由铜、铝、钢等金属制成,但对于恒定和较低频磁场,也可采用铁氧体等 材料作为屏蔽体。当电磁波到达屏蔽体表面时,由于空气与金属的交界面上阻抗的不连续, 对入射波产生的反射。这种反射不要求屏蔽材料必须有一定的厚度,只要求交界面上的不连 续;未被表面反射掉而进入屏蔽体的能量,在体内向前传播的过程中,被屏蔽材料所衰减, 也就是所谓的吸收。在屏蔽体内尚未衰减掉的剩余能量,传到材料的另一表面时,遇到金属- 空气阻抗不连续的交界面,会形成再次反射,并重新返回屏蔽体内。这种反射在两个金属的 交界面上可能有多次的反射。总之,电磁屏蔽体对电磁的衰减主要是基于电磁波的反射和电 磁波的吸收。Electromagnetic shielding is a measure used to attenuate electromagnetic fields caused by certain emission sources in a certain area of space. In most cases, the shield can be made of metals such as copper, aluminum, steel, but for constant and lower frequency magnetic fields, materials such as ferrite can also be used as shields. When the electromagnetic wave reaches the surface of the shield, the reflection of the incident wave occurs due to the discontinuity of impedance at the interface between the air and the metal. This kind of reflection does not require the shielding material to have a certain thickness, but only requires discontinuity on the interface; the energy that is not reflected from the surface and enters the shielding body is attenuated by the shielding material during the forward propagation in the body, and also It's called absorption. When the residual energy that has not been attenuated in the shielding body is transmitted to the other surface of the material, it encounters the discontinuous interface of metal-air impedance, which will form a re-reflection and return to the shielding body again. This reflection may have multiple reflections at the interface of the two metals. In a word, the attenuation of electromagnetic shielding body is mainly based on the reflection and absorption of electromagnetic waves.
申请号为201710266357.8的中国专利申请公开了一种电磁屏蔽蜂窝芯材、其制备方法及 植入工装,在本发明每个蜂窝单元的腔体内有1层至5层平行的电磁屏蔽隔膜;植入电磁屏 蔽隔膜的步骤如下:选择蜂窝基体;制造电磁屏蔽隔膜毛坯;植入电磁屏蔽隔膜毛坯。该发 明的植入工装由上部的手柄和下部的植入棒连接组成。受到其工装限制,该发明无法实现工 业化生产及批量化应用。The Chinese patent application with the application number of 201710266357.8 discloses an electromagnetic shielding honeycomb core material, a preparation method thereof and an implantation tooling. In the cavity of each honeycomb unit of the present invention, there are 1 to 5 layers of parallel electromagnetic shielding diaphragms; The steps of the electromagnetic shielding diaphragm are as follows: selecting a honeycomb matrix; manufacturing the electromagnetic shielding diaphragm blank; implanting the electromagnetic shielding diaphragm blank. The implant tool of the invention is composed of the upper handle and the lower implant rod connected. Due to the limitation of its tooling, the invention cannot realize industrial production and batch application.
申请公布号为CN108724822A的中国专利申请公开了一种电磁屏蔽蜂窝芯材的制备方法, 采用制备石墨烯/铁氧体杂化材料,并通过磁力沉积的方式,将石墨烯/铁氧体杂化颗粒均匀附 着在织物载体上,形成石墨烯/铁氧体杂化颗粒电磁屏蔽织物。利用预浸料、胶膜、电磁屏蔽 织物制备电磁屏蔽夹层。最后通过胶接方式,将电磁屏蔽夹层与蜂窝芯材复合成为夹层电磁 屏蔽蜂窝结构。该技术实现了电磁屏蔽蜂窝芯材的低成本设计、制造和技术集成综合利用, 但是操作复杂,单层石墨烯/铁氧体电磁屏蔽蜂窝芯材或多层石墨烯/铁氧体电磁屏蔽蜂窝芯材 无法满足需要通风透气的同时又需要屏蔽电磁波的现代化需求。The Chinese patent application with the application publication number CN108724822A discloses a preparation method of an electromagnetic shielding honeycomb core material. The graphene/ferrite hybrid material is prepared by preparing the graphene/ferrite hybrid material by magnetic deposition. The particles are uniformly attached to the fabric carrier to form the graphene/ferrite hybrid particle electromagnetic shielding fabric. The electromagnetic shielding interlayer is prepared by using prepreg, adhesive film and electromagnetic shielding fabric. Finally, the electromagnetic shielding interlayer and the honeycomb core material are composited into a sandwich electromagnetic shielding honeycomb structure by means of gluing. This technology realizes the comprehensive utilization of low-cost design, manufacture and technology integration of electromagnetic shielding honeycomb core material, but the operation is complicated, single-layer graphene/ferrite electromagnetic shielding honeycomb core material or multi-layer graphene/ferrite electromagnetic shielding honeycomb The core material cannot meet the modern needs of ventilation and electromagnetic wave shielding at the same time.
发明内容SUMMARY OF THE INVENTION
本发明的主要目的在于提供一种金属化芳纶蜂窝材料、其制备方法和应用,以解决现有 技术中的电磁屏蔽蜂窝芯材制备方法复杂的问题。The main purpose of the present invention is to provide a metallized aramid honeycomb material, its preparation method and application, to solve the problem of complicated preparation method of electromagnetic shielding honeycomb core material in the prior art.
为了实现上述目的,根据本发明的一个方面,提供了一种金属化芳纶蜂窝材料的制备方 法,该制备方法包括:步骤S1,对芳纶蜂窝进行清洁,得到清洁芳纶蜂窝;步骤S2,对清洁 芳纶蜂窝进行活化处理,得到活性芳纶蜂窝;步骤S3,将活性芳纶蜂窝置于化学镀铁镍液中 进行化学镀,以在活性芳纶蜂窝内表面形成铁镍镀层。In order to achieve the above object, according to an aspect of the present invention, a preparation method of a metallized aramid honeycomb material is provided, the preparation method comprising: step S1, cleaning the aramid honeycomb to obtain a clean aramid honeycomb; step S2, Activating the clean aramid honeycomb to obtain an active aramid honeycomb; step S3, placing the active aramid honeycomb in an electroless iron-nickel plating solution for electroless plating to form an iron-nickel coating on the inner surface of the active aramid honeycomb.
进一步地,上述步骤S1包括对芳纶蜂窝依次进行碱洗、水洗,得到清洁芳纶蜂窝。Further, the above-mentioned step S1 includes performing alkali washing and water washing on the aramid honeycomb in sequence to obtain a clean aramid honeycomb.
进一步地,上述碱洗所用碱性液包括浓度为10~30g/L的NaOH和1~3g/L的OP乳化剂, 优选碱性过程中进行超声,进一步优选超声功率为50~200W、超声时间为5~30min,优选碱 洗在30~70℃下进行。Further, the alkaline solution used in the above-mentioned alkaline washing includes NaOH with a concentration of 10 to 30 g/L and an OP emulsifier of 1 to 3 g/L. Ultrasound is preferably performed during the alkaline process, and the ultrasonic power is preferably 50 to 200W, and the ultrasonic time is 50 to 200 W. It is 5~30min, preferably alkali washing is carried out at 30~70 ℃.
进一步地,上述步骤S2包括:在活化溶液中对清洁芳纶蜂窝依次进行浸润处理和热处理, 得到活性芳纶蜂窝,活化溶液包括比例为1g:0.5~1.5g:20~40mL的乙酸镍、第一还原剂和水, 优选第一还原剂选自次亚磷酸钠、葡萄糖、甲醛、乙醛和次磷酸钠中的任意一种或多种。Further, the above step S2 includes: sequentially infiltrating and heat-treating the clean aramid honeycomb in an activation solution to obtain an activated aramid honeycomb, and the activation solution includes nickel acetate in a ratio of 1g:0.5-1.5g:20-40mL, the first A reducing agent and water, preferably the first reducing agent is selected from any one or more of sodium hypophosphite, glucose, formaldehyde, acetaldehyde and sodium hypophosphite.
进一步地,上述浸润处理的时间为5~10min,优选热处理的温度为195~205℃、热处理的 时间为30~60min。Further, the above-mentioned soaking treatment time is 5~10min, preferably the temperature of heat treatment is 195~205°C, and the time of heat treatment is 30~60min.
进一步地,上述在进行浸润处理之前,步骤S2还包括对清洁芳纶蜂窝进行表面腐蚀的过 程,优选表面腐蚀的过程包括:采用腐蚀液对清洁芳纶纤维进行腐蚀处理,腐蚀液包括体积 比为1:2~4的双氧水和硫酸,优选地腐蚀处理的时间为3~10min,优选硫酸的质量浓度为 90~99%。Further, before the above-mentioned soaking treatment, step S2 also includes a process of performing surface corrosion on the clean aramid honeycomb. Preferably, the surface corrosion process includes: using an etchant to etch the clean aramid fiber, and the etchant includes a volume ratio of Hydrogen peroxide and sulfuric acid in a ratio of 1:2 to 4, preferably the corrosion treatment time is 3 to 10 minutes, and the mass concentration of the sulfuric acid is preferably 90 to 99%.
进一步地,上述步骤S3中,化学镀铁镍液包括可溶性镍盐、可溶性亚铁盐和第二还原剂, 其中,可溶性镍盐选自硫酸镍、乙酸镍和次亚磷酸镍中的任意一种或多种,可溶性亚铁盐选 自六水合硫酸亚铁铵、四水合氯化亚铁中的任意一种或多种,第二还原剂选自次亚磷酸盐、 硼氢化钠、硼烷、肼中的任意一种或多种;优选地,可溶性镍盐的浓度为0.04~0.09mol/L,可 溶性亚铁盐的浓度为0.01~0.06mol/L,第二还原剂的浓度为0.005~0.01mol/L;优选化学镀铁 镍液的pH值为8.0~11.5,优选地,化学镀的温度为90℃、时间为30~60min,优选化学镀铁 镍液还包括催化剂,催化剂选自丙二酸、丁二酸、氨基乙酸、丙酸、氟化钠中的任意一种或 多种,催化剂的浓度为0.001~0.005mol/L。Further, in the above-mentioned step S3, the electroless iron-nickel plating solution includes a soluble nickel salt, a soluble ferrous salt and a second reducing agent, wherein the soluble nickel salt is selected from any one of nickel sulfate, nickel acetate and nickel hypophosphite. or more, the soluble ferrous salt is selected from any one or more of ammonium ferrous sulfate hexahydrate, ferrous chloride tetrahydrate, and the second reducing agent is selected from hypophosphite, sodium borohydride, borane, Any one or more of hydrazine; preferably, the concentration of the soluble nickel salt is 0.04-0.09mol/L, the concentration of the soluble ferrous salt is 0.01-0.06mol/L, and the concentration of the second reducing agent is 0.005-0.01 mol/L; preferably, the pH value of the electroless iron-nickel plating solution is 8.0 to 11.5, preferably, the temperature of the electroless plating is 90° C. and the time is 30 to 60 minutes, preferably the electroless iron-nickel plating solution also includes a catalyst, and the catalyst is selected from the group consisting of propane two. Any one or more of acid, succinic acid, aminoacetic acid, propionic acid, and sodium fluoride, and the concentration of the catalyst is 0.001-0.005 mol/L.
根据本发明的另一方面,提供了一种金属化芳纶蜂窝材料,该材料采用上述任一种制备 方法制备而成。According to another aspect of the present invention, a metallized aramid honeycomb material is provided, which is prepared by any of the above-mentioned preparation methods.
根据本发明的又一方面,提供了一种金属化芳纶蜂窝材料,该金属化芳纶蜂窝材料包括 芳纶蜂窝基体和铁镍镀层,铁镍镀层设置在芳纶蜂窝基体的内表面和外表面,优选芳纶蜂窝 基体和铁镍镀层的质量比为100~10:1,优选铁镍镀层的厚度为10~30μm,优选铁镍镀层中含 包含磷,优选铁、镍和磷的质量比为0.4~0.9:0.1~0.6:0.05~0.1。According to yet another aspect of the present invention, a metallized aramid honeycomb material is provided, the metallized aramid honeycomb material includes an aramid honeycomb matrix and an iron-nickel coating, and the iron-nickel coating is provided on the inner surface and the outer surface of the aramid honeycomb matrix On the surface, preferably the mass ratio of the aramid honeycomb matrix and the iron-nickel coating is 100-10:1, the thickness of the iron-nickel coating is preferably 10-30 μm, the iron-nickel coating preferably contains phosphorus, and the mass ratio of iron, nickel and phosphorus is preferred It is 0.4~0.9:0.1~0.6:0.05~0.1.
根据本发明的再一方面,提供了一种电磁屏蔽结构,包括电磁屏蔽蜂窝芯材,该电磁屏 蔽蜂窝芯材为上述任一种金属化芳纶蜂窝材料。According to another aspect of the present invention, an electromagnetic shielding structure is provided, comprising an electromagnetic shielding honeycomb core material, and the electromagnetic shielding honeycomb core material is any of the above-mentioned metallized aramid honeycomb materials.
应用本发明的技术方案,首先进行清洁,以去除芳纶蜂窝表面附着的灰尘等固体小颗粒 杂质和孔壁上粘着的矿物质油或油脂等污渍,其次进行活化处理,使芳纶蜂窝表面更易沉积 铁镍镀层。最后进行化学镀,在活性芳纶蜂表面形成均匀的铁镍镀层,实现了芳纶纸蜂窝金 属化。从上述描述中可以看出,本申请金属化芳纶蜂窝材料的制备方法简单,利用清洗、活 化和化学镀,就可以完成芳纶纸蜂窝的金属化,得到耐蚀性能好、透气性好、平面压缩强度 高、屏蔽性能优异的金属化芳纶纸蜂窝材料。Applying the technical solution of the present invention, firstly, cleaning is performed to remove solid small particles of impurities such as dust attached to the surface of the aramid honeycomb and stains such as mineral oil or grease adhered to the pore walls, and then activation treatment is performed to make the surface of the aramid honeycomb easier. Deposit an iron-nickel coating. Finally, chemical plating is performed to form a uniform iron-nickel coating on the surface of the active aramid honeycomb, which realizes the metallization of the aramid paper honeycomb. As can be seen from the above description, the preparation method of the metallized aramid honeycomb material of the present application is simple, and the metallization of the aramid paper honeycomb can be completed by cleaning, activation and chemical plating, and the obtained corrosion resistance, good air permeability, Metallized aramid paper honeycomb material with high plane compressive strength and excellent shielding properties.
具体实施方式Detailed ways
需要说明的是,在不冲突的情况下,本申请中的实施例及实施例中的特征可以相互组合。 下面将结合实施例来详细说明本发明。It should be noted that the embodiments in the present application and the features of the embodiments may be combined with each other in the case of no conflict. The present invention will be described in detail below with reference to the embodiments.
如本申请背景所介绍的,电磁屏蔽蜂窝芯材可以同时满足透气性和屏蔽电磁波的作用。 但是现有技术中部分电磁屏蔽蜂窝芯材由于结构设计的缘故,无法满足透气性的要求。并且 现有技术电磁屏蔽蜂窝芯材的制备方法都过于复杂。为了解决上述问题,本申请提供了一种 金属化芳纶蜂窝材料、其制备方法和应用。As described in the background of this application, the electromagnetic shielding honeycomb core material can satisfy both the functions of air permeability and electromagnetic wave shielding. However, due to the structural design, some electromagnetic shielding honeycomb core materials in the prior art cannot meet the requirements of air permeability. Moreover, the preparation methods of the electromagnetic shielding honeycomb core materials in the prior art are all too complicated. In order to solve the above problems, the present application provides a metallized aramid honeycomb material, its preparation method and application.
在本申请的一种典型的实施方式中,提供了一种金属化芳纶蜂窝材料的制备方法,该制 备方法包括:步骤S1,对芳纶蜂窝进行清洁,得到清洁芳纶蜂窝;步骤S2,对清洁芳纶蜂窝 进行活化处理,得到活性芳纶蜂窝;步骤S3,将活性芳纶蜂窝置于化学镀铁镍液中进行化学 镀,以在活性芳纶蜂窝内表面形成铁镍镀层。In a typical embodiment of the present application, a method for preparing a metallized aramid honeycomb material is provided. The preparation method includes: step S1, cleaning the aramid honeycomb to obtain a clean aramid honeycomb; step S2, Activating the clean aramid honeycomb to obtain an active aramid honeycomb; step S3, placing the active aramid honeycomb in an electroless iron-nickel plating solution for electroless plating to form an iron-nickel coating on the inner surface of the active aramid honeycomb.
本申请的金属化芳纶蜂窝材料的制备方法,首先进行清洁,以去除芳纶蜂窝表面附着的 灰尘等固体小颗粒杂质和孔壁上粘着的矿物质油或油脂等污渍,其次进行活化处理,使芳纶 蜂窝表面更易沉积铁镍镀层。最后进行化学镀,在活性芳纶蜂表面形成均匀的铁镍镀层,实 现了芳纶纸蜂窝金属化。从上述描述中可以看出,本申请金属化芳纶蜂窝材料的制备方法简 单,利用清洗、活化和化学镀,就可以完成芳纶纸蜂窝的金属化,得到耐蚀性能好、透气性 好、平面压缩强度高、屏蔽性能优异的金属化芳纶纸蜂窝材料。For the preparation method of the metallized aramid honeycomb material of the present application, firstly, cleaning is performed to remove solid small particles of impurities such as dust attached to the surface of the aramid fiber honeycomb and stains such as mineral oil or grease adhering to the pore wall, and secondly, an activation treatment is performed, It makes it easier to deposit Fe-Ni coating on the aramid honeycomb surface. Finally, chemical plating is carried out to form a uniform iron-nickel coating on the surface of the active aramid honeycomb, which realizes the metallization of the aramid paper honeycomb. As can be seen from the above description, the preparation method of the metallized aramid honeycomb material of the present application is simple, and the metallization of the aramid paper honeycomb can be completed by cleaning, activation and chemical plating, and the obtained corrosion resistance, good air permeability, Metallized aramid paper honeycomb material with high plane compressive strength and excellent shielding properties.
上述清洁步骤中可以选用现有技术常用的去除小颗粒、油脂的方法。为了对芳纶蜂窝孔 壁上粘着的矿物质油或油脂等污渍起到更好的清洁效果,优选上述步骤S1包括对芳纶蜂窝依 次进行碱洗、水洗,得到清洁芳纶蜂窝。碱洗后再进行水洗,以去除残留的碱液。In the above-mentioned cleaning steps, methods commonly used in the prior art for removing small particles and grease can be selected. In order to play a better cleaning effect on the stains such as mineral oil or grease adhered on the aramid honeycomb hole wall, it is preferable that the above-mentioned step S1 comprises performing alkali washing and water washing on the aramid honeycomb in turn to obtain a clean aramid honeycomb. Wash with water after alkaline washing to remove residual lye.
上述碱洗可以用现有技术中常用于碱洗的碱液,为了针对芳纶蜂窝取得更好的清洗效果, 优选上述碱洗所用碱性液包括浓度为10~30g/L的NaOH和1~3g/L的OP乳化剂,优选碱性过 程中进行超声,进一步优选超声功率为50~200W、超声时间为5~30min,优选碱洗在30~70℃ 下进行。利用10~30g/L的氢氧化钠溶液和1~3g/L的OP乳化剂可以增强去除矿物质油或油脂 的效果,其中乳化剂还能显著降低油脂的表面张力,使其更多地分散在水中。进一步地,进 行优选的超声处理,可以进一步提升去除灰尘等固体小颗粒杂质向水中扩散的效果。The above-mentioned alkaline washing can use the alkaline solution commonly used for alkaline washing in the prior art. In order to obtain a better cleaning effect for the aramid fiber honeycomb, preferably the alkaline solution used in the above-mentioned alkaline washing includes NaOH with a concentration of 10-30 g/L and 1- 3g/L OP emulsifier is preferably ultrasonicated in an alkaline process, more preferably ultrasonic power is 50-200W, ultrasonic time is 5-30min, and alkaline washing is preferably performed at 30-70°C. The use of 10-30g/L sodium hydroxide solution and 1-3g/L OP emulsifier can enhance the removal of mineral oil or grease, and the emulsifier can also significantly reduce the surface tension of grease and make it more dispersed In the water. Further, performing the preferred ultrasonic treatment can further enhance the effect of removing dust and other small solid particles and impurities from diffusing into the water.
芳纶蜂窝的活化处理方法可以以现有技术中纤维的常用活法方法为参考,比如采用银盐 或钯盐等贵金属催化的活化方法,本申请为了节约成本,简化操作步骤,在一种实施例中, 上述步骤S2包括:在活化溶液中对清洁芳纶蜂窝依次进行浸润处理和热处理,得到活性芳纶 蜂窝,上述活化溶液包括比例为1g:0.5~1.5g:20~40mL的乙酸镍、第一还原剂和水。通过上述 活化溶液的处理,可以使活化剂中的镍盐分解为单质镍在芳纶蜂窝表面形成化学镀镍的催化 活性中心,使后续化学镀镍可以得到与芳纶蜂窝牢固结合且光滑均匀的镍磷镀层。The activation treatment method of aramid honeycomb can be referred to the commonly used activation method of fibers in the prior art, such as the activation method catalyzed by precious metals such as silver salt or palladium salt. In order to save costs and simplify the operation steps, the application is implemented in a method. In an example, the above step S2 includes: sequentially infiltrating and heat-treating the clean aramid honeycomb in an activation solution to obtain an activated aramid honeycomb, and the above activation solution comprises nickel acetate, The first reducing agent and water. Through the treatment of the above activation solution, the nickel salt in the activator can be decomposed into elemental nickel to form the catalytic active center of electroless nickel plating on the surface of the aramid honeycomb, so that the subsequent electroless nickel plating can be firmly combined with the aramid honeycomb and smooth and uniform. Nickel-phosphorus coating.
本申请活化溶液中的第一还原剂可以选用现有技术中水溶性还原剂中的任意一种,为了 使芳纶蜂窝表面被均匀地活化,且提升活化的效果,优选上述第一还原剂选自次亚磷酸钠、 葡萄糖、甲醛、乙醛和次磷酸钠中的任意一种或多种。上述还原剂易吸附于基体表面且在常 温水溶液中能保持稳定的小分子化合物,可以较均匀地与芳纶蜂窝发生反应,使后续化学镀 形成的镀层致密、均匀因此抗腐蚀性好。The first reducing agent in the activation solution of the present application can be selected from any of the water-soluble reducing agents in the prior art. Any one or more of sodium hypophosphite, glucose, formaldehyde, acetaldehyde and sodium hypophosphite. The above-mentioned reducing agent is easily adsorbed on the surface of the substrate and can maintain a stable small molecular compound in an aqueous solution at room temperature, and can react with the aramid honeycomb relatively uniformly, so that the coating formed by the subsequent chemical plating is dense and uniform, so the corrosion resistance is good.
为了同时提升活化效果和活化效率,浸润处理的时间为5~10min,优选热处理的温度为 195~205℃、热处理的时间为30~60min。当处理时间低于上述优选时间范围时,活化效果不理 想;当处理时间多于优选时间时,处理效果提升不明显。In order to improve the activation effect and activation efficiency at the same time, the soaking treatment time is 5-10min, preferably the heat-treatment temperature is 195-205℃, and the heat-treatment time is 30-60min. When the treatment time is less than the above-mentioned preferred time range, the activation effect is not ideal; when the treatment time is longer than the preferred time, the improvement of the treatment effect is not obvious.
后续化学镀主要是在芳纶蜂窝的内表面或外表面上化学镀金属层,本申请为了提高所镀 覆金属的附着力,在一种实施例中,在进行浸润处理之前,上述步骤S2还包括对清洁芳纶蜂 窝进行表面腐蚀的过程,也称为表面粗化,优选表面腐蚀的过程包括:采用腐蚀液对清洁芳 纶纤维进行腐蚀处理,腐蚀液包括体积比为1:2~4的双氧水和硫酸,优选地腐蚀处理的时间为 3~10min,优选硫酸的质量浓度为90~99%。通过表面腐蚀处理使芳纶纤维表面粗化,有利于 形成多个表面活性点,使后续化学镀时镀层可以更快形成,且镀层的附着力更强。在上述优 选的参数范围内,尽量减少腐蚀过度或不足的情况出现。Subsequent chemical plating is mainly chemical plating metal layer on the inner surface or outer surface of the aramid honeycomb. In order to improve the adhesion of the plated metal, in an embodiment, before the infiltration treatment is performed, the above step S2 further Including the process of surface corrosion of clean aramid honeycomb, also known as surface roughening, preferably the process of surface corrosion includes: using corrosive liquid to etch clean aramid fiber, and the corrosive liquid includes a volume ratio of 1:2 to 4. Hydrogen peroxide and sulfuric acid, preferably the corrosion treatment time is 3-10 min, and the mass concentration of sulfuric acid is preferably 90-99%. The surface of the aramid fiber is roughened by the surface corrosion treatment, which is conducive to the formation of multiple surface active points, so that the coating can be formed faster in the subsequent electroless plating, and the adhesion of the coating is stronger. Within the above-mentioned preferred parameters, the occurrence of excessive or insufficient corrosion should be minimized.
化学镀形成铁镍金属层的方式可以以现有技术中金属层的化学镀方式为参考,在一种实 施例中,上述步骤S3中,化学镀铁镍液包括可溶性镍盐、可溶性亚铁盐和第二还原剂,其中, 可溶性镍盐选自硫酸镍、乙酸镍和次亚磷酸镍中的任意一种或多种,可溶性亚铁盐选自六水 合硫酸亚铁铵四水合氯化亚铁中的任意一种或多种,第二还原剂选自次亚磷酸盐、硼氢化钠、 硼烷、肼中的任意一种或多种。通过使用上述试剂,可以在芳纶蜂窝表面形成一层致密、均 匀的铁镍镀层,从而制备得到耐蚀性能好、平面压缩强度高、屏蔽性能优异的金属化芳纶纸 蜂窝材料。进一步地,在选用次亚磷酸镍作为镍和次亚磷酸根的来源时在化学镀过程中会发 生磷与镍的共沉积,所以化学镀铁镍镀层是磷呈弥散态的铁镍磷合金镀层,通过控制磷含量 在1%至15%之间,得到的合金镀层致密、无孔,耐蚀性远优于电镀镍。除此以外,使用次亚 磷酸镍避免了引入硫酸根离子,并且可以使碱金属离子的累积量达到最小值,进而避免硫酸 根与金属离子反应产生稳定的盐导致镀层中含有杂质,进而影响镀层的性能。The method of forming the iron-nickel metal layer by electroless plating can be based on the chemical plating method of the metal layer in the prior art. In an embodiment, in the above step S3, the electroless iron-nickel plating solution includes soluble nickel salt and soluble ferrous salt. and the second reducing agent, wherein the soluble nickel salt is selected from any one or more of nickel sulfate, nickel acetate and nickel hypophosphite, and the soluble ferrous salt is selected from ammonium ferrous sulfate hexahydrate and ferrous chloride tetrahydrate Any one or more of the second reducing agent is selected from any one or more of hypophosphite, sodium borohydride, borane and hydrazine. By using the above reagents, a dense and uniform iron-nickel coating can be formed on the surface of the aramid honeycomb, thereby preparing a metallized aramid paper honeycomb material with good corrosion resistance, high plane compressive strength and excellent shielding performance. Further, when selecting nickel hypophosphite as the source of nickel and hypophosphite, the co-deposition of phosphorus and nickel can occur in the electroless plating process, so the electroless iron-nickel coating is an iron-nickel-phosphorus alloy coating in which phosphorus is dispersed. , By controlling the phosphorus content between 1% and 15%, the obtained alloy coating is dense and non-porous, and the corrosion resistance is much better than that of electroplating nickel. In addition, the use of nickel hypophosphite avoids the introduction of sulfate ions, and the cumulative amount of alkali metal ions can be minimized, thereby avoiding the reaction of sulfate and metal ions to generate stable salts, resulting in impurities in the coating, which in turn affects the coating. performance.
本领域技术人员可以根据所使用的可溶性镍盐浓度、可溶性亚铁盐浓度调整所形成的金 属层的厚度和其中的镍铁组成,为了实现更为理想的耐腐蚀性和电磁屏蔽性能,优选可溶性 镍盐的浓度为0.04~0.09mol/L,可溶性亚铁盐的浓度为0.01~0.06mol/L,第二还原剂的浓度为 0.005~0.01mol/L;优选化学镀铁镍液的pH值为8.0~11.5,优选地,化学镀的温度为90℃、时 间为30~60min。通过对试剂浓度、反应条件等优选,可以很好地控制镀层的厚度、组成等参 数,以使制备得到的金属化芳纶蜂窝材料有更好的力学性能和应用性能。Those skilled in the art can adjust the thickness of the formed metal layer and the nickel-iron composition according to the soluble nickel salt concentration and the soluble ferrous salt concentration used. In order to achieve more ideal corrosion resistance and electromagnetic shielding performance, soluble The concentration of nickel salt is 0.04-0.09mol/L, the concentration of soluble ferrous salt is 0.01-0.06mol/L, and the concentration of the second reducing agent is 0.005-0.01mol/L; the pH value of the electroless iron-nickel plating solution is preferably 8.0-11.5, preferably, the temperature of the electroless plating is 90° C. and the time is 30-60 minutes. By optimizing the reagent concentration, reaction conditions, etc., parameters such as the thickness and composition of the coating can be well controlled, so that the prepared metallized aramid honeycomb material has better mechanical properties and application properties.
在一种实施例中,优选化学镀铁镍液还包括催化剂,催化剂选自丙二酸、丁二酸、氨基 乙酸、丙酸、氟化钠中的任意一种或多种,上述催化剂的浓度为0.001~0.005mol/L。上述催化 剂的选用,可以加快化学镀的反应速度。且控制催化剂的浓度,以在不浪费试剂的情况下, 达到较佳催化效果。In an embodiment, it is preferred that the electroless iron-nickel plating solution also includes a catalyst, and the catalyst is selected from any one or more of malonic acid, succinic acid, glycine, propionic acid, and sodium fluoride. The concentration of the above-mentioned catalyst It is 0.001~0.005mol/L. The selection of the above catalyst can speed up the reaction speed of electroless plating. And the concentration of the catalyst is controlled so as to achieve a better catalytic effect without wasting the reagent.
在本申请的另一种典型的实施方式中,提供了一种金属化芳纶蜂窝材料,该金属化芳纶 蜂窝材料采用上述任一种制备方法制备而成。In another typical embodiment of the present application, a metallized aramid honeycomb material is provided, and the metallized aramid honeycomb material is prepared by any of the above-mentioned preparation methods.
利用本申请制备方法得到的金属化芳纶蜂窝材料,可以在芳纶蜂窝表面可控地形成致密 且均匀的金属镀层,得到耐蚀性能好、透气性好、平面压缩强度高、屏蔽性能优异的金属化 芳纶纸蜂窝材料。Using the metallized aramid honeycomb material obtained by the preparation method of the present application, a dense and uniform metal coating can be formed on the surface of the aramid honeycomb in a controllable manner, and a material with good corrosion resistance, good air permeability, high plane compressive strength and excellent shielding performance can be obtained. Metallized aramid paper honeycomb material.
在本申请的又一种典型的实施方式中,提供了一种金属化芳纶蜂窝材料,该金属化芳纶 蜂窝材料包括芳纶蜂窝基体和铁镍镀层,铁镍镀层设置在芳纶蜂窝基体的内表面和外表面, 优选芳纶蜂窝基体和铁镍镀层的质量比为100~10:1,优选铁镍镀层的厚度为10~30μm,优选 铁镍镀层中含包含磷,优选铁、镍和磷的质量比为0.4~0.9:0.1~0.6:0.05~0.1。拥有上述结构的 金属化芳纶蜂窝材料。利用了涡流的屏蔽效应,即当入射高频电磁波时,通过利用金属材料 具有一定的电阻,涡流所产生的焦耳热消耗了入射电磁场的能量,进而达到屏蔽效果。除此 以外,还具有耐蚀性能好、透气性好、平面压缩强度高、屏蔽性能优异的特点。In yet another typical embodiment of the present application, a metallized aramid honeycomb material is provided, the metallized aramid honeycomb material includes an aramid honeycomb matrix and an iron-nickel coating, and the iron-nickel coating is provided on the aramid honeycomb matrix Preferably, the mass ratio of the aramid honeycomb matrix and the iron-nickel coating is 100-10:1, the thickness of the iron-nickel coating is preferably 10-30 μm, and the iron-nickel coating preferably contains phosphorus, preferably iron and nickel. The mass ratio with phosphorus is 0.4-0.9:0.1-0.6:0.05-0.1. Metallized aramid honeycomb material with the above structure. The shielding effect of the eddy current is used, that is, when the high-frequency electromagnetic wave is incident, the Joule heat generated by the eddy current consumes the energy of the incident electromagnetic field by using the metal material to have a certain resistance, thereby achieving the shielding effect. In addition, it also has the characteristics of good corrosion resistance, good air permeability, high plane compressive strength and excellent shielding performance.
在本申请的再一种典型的实施方式中,提供了一种电磁屏蔽结构,包括电磁屏蔽蜂窝芯 材,电磁屏蔽蜂窝芯材为上述任一种金属化芳纶蜂窝材料。上述使用本申请金属化芳纶蜂窝 材料作为电磁屏蔽蜂窝芯材的电磁屏蔽结构具有结构稳定性强,透气性好和屏蔽效果优异等 特点。In yet another typical embodiment of the present application, an electromagnetic shielding structure is provided, comprising an electromagnetic shielding honeycomb core material, and the electromagnetic shielding honeycomb core material is any of the above-mentioned metallized aramid honeycomb materials. The above-mentioned electromagnetic shielding structure using the metallized aramid honeycomb material of the present application as the electromagnetic shielding honeycomb core material has the characteristics of strong structural stability, good air permeability and excellent shielding effect.
以下将结合实施例,进一步说明本申请的有益效果。The beneficial effects of the present application will be further described below with reference to the embodiments.
实施例1:Example 1:
(1)清洁(1) Cleaning
将芳纶纸蜂窝(300mm*300mm*5mm)置于碱性液中,在50℃,超声波功率为120W的条件下处理10min后去除蜂窝内孔壁表面的杂质,再用清水冲洗材料表面,去除残留的碱性液,该碱性液包含:20g/L的NaOH和2g/L的OP乳化剂。Put the aramid paper honeycomb (300mm*300mm*5mm) in the alkaline solution, treat it at 50℃ and the ultrasonic power is 120W for 10min, remove the impurities on the surface of the inner hole wall of the honeycomb, and then rinse the surface of the material with water to remove the impurities. Residual alkaline solution, the alkaline solution contains: 20g/L NaOH and 2g/L OP emulsifier.
(2)微蚀(2) Micro-etching
微蚀使用双氧水和质量分数为98.3%硫酸体积比为1:4配制得到。将水洗干净的芳纶纸蜂 窝放入微蚀液中约5min后取出,水洗,再用去离子水冲洗表面,再用去离子水冲洗表面后烘 干(105℃,1.5h)。Micro-etching is prepared by using hydrogen peroxide and sulfuric acid with a mass fraction of 98.3% and a volume ratio of 1:4. Put the washed aramid paper honeycomb in the micro-etching solution for about 5 minutes, take it out, wash it with water, rinse the surface with deionized water, rinse the surface with deionized water, and dry it (105℃, 1.5h).
(3)活化(3) Activation
采用浓度为乙酸镍(g):次亚磷酸钠(g):水(ml)=1:1:30的活化溶液对微蚀芳纶纸 蜂窝浸润约10min后,在200℃条件下进行热处理60min,再用去离子水清洗除去残留的活化 液。The micro-etched aramid paper honeycomb was soaked for about 10 minutes with an activation solution with a concentration of nickel acetate (g): sodium hypophosphite (g): water (ml) = 1:1:30, and then heat-treated at 200 °C for 60 minutes , and then rinsed with deionized water to remove the residual activation solution.
(4)化学镀铁镍(4) Electroless iron nickel plating
在90℃的碱性溶液中将活化处理后的芳纶纸蜂窝进行化学镀铁镍,其中,化学镀铁镍液 组成及工艺条件:次亚磷酸镍0.06mol/L,六水合硫酸亚铁铵0.04mol/L,硼氢化钠0.005mol/L, 氟化钠0.005mol/L,pH值9.0,温度值90℃,处理时间60min。The activated aramid paper honeycomb was electroless plated with iron and nickel in an alkaline solution at 90°C, wherein the composition and process conditions of the electroless iron and nickel plating solution: nickel hypophosphite 0.06mol/L, ferrous ammonium sulfate hexahydrate 0.04mol/L, sodium borohydride 0.005mol/L, sodium fluoride 0.005mol/L, pH value 9.0, temperature value 90°C, treatment time 60min.
实施例2:Example 2:
(1)清洁(1) Cleaning
将芳纶纸蜂窝(300mm*300mm*15mm)置于碱性液中,在50℃,超声波功率为150W的条件下处理10min后去除蜂窝内孔壁表面的杂质,再用清水冲洗材料表面,去除残留的碱性液,该碱性液包含:30g/L的NaOH和2g/L的OP乳化剂。Put the aramid paper honeycomb (300mm*300mm*15mm) in the alkaline solution, treat it at 50℃ and the ultrasonic power is 150W for 10min to remove the impurities on the surface of the inner hole wall of the honeycomb, and then rinse the surface of the material with water to remove the impurities. Residual alkaline solution, the alkaline solution contains: 30g/L NaOH and 2g/L OP emulsifier.
(2)微蚀(2) Micro-etching
微蚀使用双氧水和质量分数为98.3%硫酸体积比为1:4配制得到。将水洗干净的芳纶纸蜂 窝放入微蚀液中约5min后取出,水洗,再用去离子水冲洗表面,再用去离子水冲洗表面后烘 干(105℃,1.5h)。Micro-etching is prepared by using hydrogen peroxide and sulfuric acid with a mass fraction of 98.3% and a volume ratio of 1:4. Put the washed aramid paper honeycomb in the micro-etching solution for about 5 minutes, take it out, wash it with water, rinse the surface with deionized water, rinse the surface with deionized water, and dry it (105℃, 1.5h).
(3)活化(3) Activation
采用浓度为乙酸镍(g):次亚磷酸钠(g):水(ml)=1:1:30的活化溶液对微蚀芳纶纸 蜂窝浸润约10min后,在200℃条件下进行热处理50min,再用去离子水清洗除去残留的活化 液。The micro-etched aramid paper honeycomb was soaked for about 10 minutes with an activation solution with a concentration of nickel acetate (g): sodium hypophosphite (g): water (ml) = 1:1:30, and then heat-treated at 200 °C for 50 minutes , and then rinsed with deionized water to remove the residual activation solution.
(4)化学镀铁镍(4) Electroless iron nickel plating
在90℃的碱性溶液中将活化处理后的芳纶纸蜂窝进行化学镀铁镍,其中,化学镀铁镍液 组成及工艺条件:次亚磷酸镍0.05mol/L,六水合硫酸亚铁铵0.05mol/L,硼氢化钠0.008mol/L, pH值9.5,温度值90℃,处理时间60min。The activated aramid paper honeycomb was electroless plated with iron and nickel in an alkaline solution at 90°C, wherein the composition and process conditions of the electroless iron-nickel plating solution: nickel hypophosphite 0.05mol/L, ferrous ammonium sulfate hexahydrate 0.05mol/L, sodium borohydride 0.008mol/L, pH value 9.5, temperature value 90℃, treatment time 60min.
实施例3:Example 3:
(1)清洁(1) Cleaning
将芳纶纸蜂窝(300mm*300mm*20mm)置于碱性液中,在50℃,超声波功率为160W的条件下处理10min后去除蜂窝内孔壁表面的杂质,再用清水冲洗材料表面,去除残留的碱性液,该碱性液包含:10g/L的NaOH和1g/L的OP乳化剂。Put the aramid paper honeycomb (300mm*300mm*20mm) in the alkaline solution, treat it at 50℃ and the ultrasonic power is 160W for 10min, remove the impurities on the surface of the inner hole wall of the honeycomb, and then rinse the surface of the material with water to remove the impurities. Residual alkaline solution, the alkaline solution contains: 10g/L NaOH and 1g/L OP emulsifier.
(2)微蚀(2) Micro-etching
微蚀使用双氧水和质量分数为98.3%硫酸体积比为1:4配制得到。将水洗干净的芳纶纸蜂 窝放入微蚀液中约5min后取出,水洗,再用去离子水冲洗表面,再用去离子水冲洗表面后烘 干(105℃,1.5h)。Micro-etching is prepared by using hydrogen peroxide and sulfuric acid with a mass fraction of 98.3% and a volume ratio of 1:4. Put the washed aramid paper honeycomb in the micro-etching solution for about 5 minutes, take it out, wash it with water, rinse the surface with deionized water, rinse the surface with deionized water, and dry it (105℃, 1.5h).
(3)活化(3) Activation
采用浓度为乙酸镍(g):次亚磷酸钠(g):水(ml)=1:1:30的活化溶液对微蚀芳纶纸 蜂窝浸润约10min后,在200℃条件下进行热处理60min,再用去离子水清洗除去残留的活化 液。The micro-etched aramid paper honeycomb was soaked for about 10 minutes with an activation solution with a concentration of nickel acetate (g): sodium hypophosphite (g): water (ml) = 1:1:30, and then heat-treated at 200 °C for 60 minutes , and then rinsed with deionized water to remove the residual activation solution.
(4)化学镀铁镍(4) Electroless iron nickel plating
在90℃的碱性溶液中将活化处理后的芳纶纸蜂窝进行化学镀铁镍,其中,化学镀铁镍液 组成及工艺条件:次亚磷酸镍0.06mol/L,六水合硫酸亚铁铵0.04mol/L,硼氢化钠0.005mol/L, pH值9.0,温度值90℃,60min。The activated aramid paper honeycomb was electroless plated with iron and nickel in an alkaline solution at 90°C, wherein the composition and process conditions of the electroless iron and nickel plating solution: nickel hypophosphite 0.06mol/L, ferrous ammonium sulfate hexahydrate 0.04mol/L, sodium borohydride 0.005mol/L, pH value 9.0, temperature value 90℃, 60min.
实施例4:Example 4:
(1)清洁(1) Cleaning
将芳纶纸蜂窝(300mm*300mm*25mm)置于碱性液中,在50℃,超声波功率为170W的条件下处理10min后去除蜂窝内孔壁表面的杂质,再用清水冲洗材料表面,去除残留的碱性液,该碱性液包含:20g/L的NaOH和1g/L的OP乳化剂。Put the aramid paper honeycomb (300mm*300mm*25mm) in the alkaline solution, treat it at 50℃ and the ultrasonic power is 170W for 10min, remove the impurities on the surface of the inner hole wall of the honeycomb, and then rinse the surface of the material with water to remove the impurities. Residual alkaline solution, the alkaline solution contains: 20g/L NaOH and 1g/L OP emulsifier.
(2)微蚀(2) Micro-etching
微蚀使用双氧水和质量分数为98.3%硫酸体积比为1:4配制得到。将水洗干净的芳纶纸蜂 窝放入微蚀液中约5min后取出,水洗,再用去离子水冲洗表面,再用去离子水冲洗表面后烘 干(105℃,1.5h)。Micro-etching is prepared by using hydrogen peroxide and sulfuric acid with a mass fraction of 98.3% and a volume ratio of 1:4. Put the washed aramid paper honeycomb in the micro-etching solution for about 5 minutes, take it out, wash it with water, rinse the surface with deionized water, rinse the surface with deionized water, and dry it (105℃, 1.5h).
(3)活化(3) Activation
采用浓度为乙酸镍(g):次亚磷酸钠(g):水(ml)=1:1:30的活化溶液对微蚀芳纶纸 蜂窝浸润约10min后,在200℃条件下进行热处理40min,再用去离子水清洗除去残留的活化 液。The micro-etched aramid paper honeycomb was soaked for about 10 minutes with an activation solution with a concentration of nickel acetate (g): sodium hypophosphite (g): water (ml) = 1:1:30, and then heat-treated at 200 °C for 40 minutes , and then rinsed with deionized water to remove the residual activation solution.
(4)化学镀铁镍(4) Electroless iron nickel plating
在90℃的碱性溶液中将活化处理后的芳纶纸蜂窝进行化学镀铁镍,其中,化学镀铁镍液 组成及工艺条件:次亚磷酸镍0.06mol/L,六水合硫酸亚铁铵0.06mol/L,硼氢化钠0.01mol/L, 氟化钠0.005mol/L,pH值10.0,温度值90℃,60min。The activated aramid paper honeycomb was electroless plated with iron and nickel in an alkaline solution at 90°C, wherein the composition and process conditions of the electroless iron and nickel plating solution: nickel hypophosphite 0.06mol/L, ferrous ammonium sulfate hexahydrate 0.06mol/L, sodium borohydride 0.01mol/L, sodium fluoride 0.005mol/L, pH value 10.0, temperature value 90°C, 60min.
实施例5:Example 5:
(1)清洁(1) Cleaning
将芳纶纸蜂窝(300mm*300mm*30mm)置于碱性液中,在50℃,超声波功率为160W的条件下处理10min后去除蜂窝内孔壁表面的杂质,再用清水冲洗材料表面,去除残留的碱性液,该碱性液包含:10g/L的NaOH和1g/L的OP乳化剂。Put the aramid paper honeycomb (300mm*300mm*30mm) in the alkaline solution, treat it at 50℃ and the ultrasonic power is 160W for 10min to remove the impurities on the surface of the inner hole wall of the honeycomb, and then rinse the surface of the material with water to remove the impurities. Residual alkaline solution, the alkaline solution contains: 10g/L NaOH and 1g/L OP emulsifier.
(2)微蚀(2) Micro-etching
微蚀使用双氧水和质量分数为98.3%硫酸体积比为1:4配制得到。将水洗干净的芳纶纸蜂 窝放入微蚀液中约5min后取出,水洗,再用去离子水冲洗表面,再用去离子水冲洗表面后烘 干(105℃,1.5h)。Micro-etching is prepared by using hydrogen peroxide and sulfuric acid with a mass fraction of 98.3% and a volume ratio of 1:4. Put the washed aramid paper honeycomb in the micro-etching solution for about 5 minutes, take it out, wash it with water, rinse the surface with deionized water, rinse the surface with deionized water, and dry it (105℃, 1.5h).
(3)活化(3) Activation
采用浓度为乙酸镍(g):次亚磷酸钠(g):水(ml)=1:1:30的活化溶液对微蚀芳纶纸 蜂窝浸润约10min后,在200℃条件下进行热处理60min,再用去离子水清洗除去残留的活化 液。The micro-etched aramid paper honeycomb was soaked for about 10 minutes with an activation solution with a concentration of nickel acetate (g): sodium hypophosphite (g): water (ml) = 1:1:30, and then heat-treated at 200 °C for 60 minutes , and then rinsed with deionized water to remove the residual activation solution.
(4)化学镀铁镍(4) Electroless iron nickel plating
在90℃的碱性溶液中将活化处理后的芳纶纸蜂窝进行化学镀铁镍,其中,化学镀铁镍液 组成及工艺条件:次亚磷酸镍0.06mol/L,六水合硫酸亚铁铵0.04mol/L,硼氢化钠0.005mol/L, pH值11.5,温度值90℃,60min。The activated aramid paper honeycomb was electroless plated with iron and nickel in an alkaline solution at 90°C, wherein the composition and process conditions of the electroless iron and nickel plating solution: nickel hypophosphite 0.06mol/L, ferrous ammonium sulfate hexahydrate 0.04mol/L, sodium borohydride 0.005mol/L, pH value 11.5, temperature value 90℃, 60min.
实施例6:Example 6:
(1)清洁(1) Cleaning
将芳纶纸蜂窝(300mm*300mm*40mm)置于碱性液中,在50℃,超声波功率为200W的条件下处理10min后去除蜂窝内孔壁表面的杂质,再用清水冲洗材料表面,去除残留的碱性液,该碱性液包含:30g/L的NaOH和2g/L的OP乳化剂。Put the aramid paper honeycomb (300mm*300mm*40mm) in the alkaline solution, treat it at 50℃ and the ultrasonic power is 200W for 10min, remove the impurities on the surface of the inner hole wall of the honeycomb, and then rinse the surface of the material with water to remove the impurities. Residual alkaline solution, the alkaline solution contains: 30g/L NaOH and 2g/L OP emulsifier.
(2)微蚀(2) Micro-etching
微蚀使用双氧水和质量分数为98.3%硫酸体积比为1:4配制得到。将水洗干净的芳纶纸蜂 窝放入微蚀液中约5min后取出,水洗,再用去离子水冲洗表面,再用去离子水冲洗表面后烘 干(105℃,1.5h)。Micro-etching is prepared by using hydrogen peroxide and sulfuric acid with a mass fraction of 98.3% and a volume ratio of 1:4. Put the washed aramid paper honeycomb in the micro-etching solution for about 5 minutes, take it out, wash it with water, rinse the surface with deionized water, rinse the surface with deionized water, and dry it (105℃, 1.5h).
(3)活化(3) Activation
采用浓度为乙酸镍(g):次亚磷酸钠(g):水(ml)=1:1:30的活化溶液对微蚀芳纶纸 蜂窝浸润约10min后,在200℃条件下进行热处理60min,再用去离子水清洗除去残留的活化 液。The micro-etched aramid paper honeycomb was soaked for about 10 minutes with an activation solution with a concentration of nickel acetate (g): sodium hypophosphite (g): water (ml) = 1:1:30, and then heat-treated at 200 °C for 60 minutes , and then rinsed with deionized water to remove the residual activation solution.
(4)化学镀铁镍(4) Electroless iron nickel plating
在90℃的碱性溶液中将活化处理后的芳纶纸蜂窝进行化学镀铁镍,其中,化学镀铁镍液 组成及工艺条件:次亚磷酸镍0.06mol/L,六水合硫酸亚铁铵0.06mol/L,硼氢化钠0.01mol/L, pH值11.0,温度值90℃,60min。The activated aramid paper honeycomb was electroless plated with iron and nickel in an alkaline solution at 90°C, wherein the composition and process conditions of the electroless iron and nickel plating solution: nickel hypophosphite 0.06mol/L, ferrous ammonium sulfate hexahydrate 0.06mol/L, sodium borohydride 0.01mol/L, pH value 11.0, temperature value 90℃, 60min.
实施例7Example 7
与实施例1的区别在于,清洁步骤中OP乳化剂的浓度为3g/L。The difference from Example 1 is that the concentration of OP emulsifier in the cleaning step is 3 g/L.
实施例8Example 8
与实施例1的区别在于,清洁步骤中超声功率为50W。The difference from Example 1 is that the ultrasonic power in the cleaning step is 50W.
实施例9Example 9
与实施例1的区别在于,清洁步骤中超声时间为5min。The difference from Example 1 is that the ultrasonic time in the cleaning step is 5 min.
实施例10Example 10
与实施例1的区别在于,清洁步骤中超声时间为30min。The difference from Example 1 is that the ultrasonic time in the cleaning step is 30 min.
实施例11Example 11
与实施例1的区别在于,清洁步骤中碱洗温度为30℃。The difference from Example 1 is that the alkaline washing temperature in the cleaning step is 30°C.
实施例12Example 12
与实施例1的区别在于,清洁步骤中碱洗温度为70℃。The difference from Example 1 is that the alkaline washing temperature in the cleaning step is 70°C.
实施例13Example 13
与实施例1的区别在于,微蚀步骤中双氧水和硫酸体积比为1:2。The difference from Example 1 is that the volume ratio of hydrogen peroxide and sulfuric acid in the micro-etching step is 1:2.
实施例14Example 14
与实施例1的区别在于,微蚀步骤中微蚀的时间为3min。The difference from Example 1 is that the micro-etching time in the micro-etching step is 3 min.
实施例15Example 15
与实施例1的区别在于,微蚀步骤中微蚀的时间为10min。The difference from Example 1 is that the micro-etching time in the micro-etching step is 10 min.
实施例16Example 16
与实施例1的区别在于,活化步骤中采用浓度为乙酸镍(g):次亚磷酸钠(g):水(ml) =1:0.5:30的活化溶液。The difference from Example 1 is that an activation solution with a concentration of nickel acetate (g):sodium hypophosphite (g):water (ml)=1:0.5:30 is used in the activation step.
实施例17Example 17
与实施例1的区别在于,活化步骤中采用浓度为乙酸镍(g):次亚磷酸钠(g):水(ml) =1:1.5:30的活化溶液。The difference from Example 1 is that an activation solution with a concentration of nickel acetate (g):sodium hypophosphite (g):water (ml)=1:1.5:30 is used in the activation step.
实施例18Example 18
与实施例1的区别在于,活化步骤中用等重量葡萄糖代替次亚磷酸钠。The difference from Example 1 is that the sodium hypophosphite is replaced with an equal weight of glucose in the activation step.
实施例19Example 19
与实施例1的区别在于,活化步骤中用等重量乙醛代替次亚磷酸钠。The difference from Example 1 is that sodium hypophosphite is replaced with an equal weight of acetaldehyde in the activation step.
实施例20Example 20
与实施例1的区别在于,活化处理时浸润5min。The difference from Example 1 is that the immersion was performed for 5 min during the activation treatment.
实施例21Example 21
与实施例1的区别在于,活化处理时热处理温度为205℃。The difference from Example 1 is that the heat treatment temperature during the activation treatment is 205°C.
实施例22Example 22
与实施例1的区别在于,活化处理时热处理温度为195℃。The difference from Example 1 is that the heat treatment temperature during the activation treatment is 195°C.
实施例23Example 23
与实施例1的区别在于,活化处理时热处理时间为30min。The difference from Example 1 is that the heat treatment time during the activation treatment is 30 min.
实施例24Example 24
与实施例1的区别在于,化学镀铁镍步骤中用等浓度硫酸镍代替次亚磷酸镍。The difference from Example 1 is that the nickel hypophosphite is replaced with equal concentration nickel sulfate in the electroless iron-nickel plating step.
实施例25Example 25
与实施例1的区别在于,化学镀铁镍步骤中用等浓度乙酸镍代替次亚磷酸镍。The difference from Example 1 is that in the electroless iron-nickel plating step, nickel acetate of equal concentration is used instead of nickel hypophosphite.
实施例26Example 26
与实施例1的区别在于,化学镀铁镍步骤中次亚磷酸镍的浓度为0.04mol/L。The difference from Example 1 is that the concentration of nickel hypophosphite in the electroless iron-nickel plating step is 0.04 mol/L.
实施例27Example 27
与实施例1的区别在于,化学镀铁镍步骤中次亚磷酸镍的浓度为0.09mol/L。The difference from Example 1 is that the concentration of nickel hypophosphite in the electroless nickel iron plating step is 0.09 mol/L.
实施例28Example 28
与实施例1的区别在于,化学镀铁镍步骤中用等浓度硼烷代替硼氢化钠。The difference from Example 1 is that the same concentration of borane is used instead of sodium borohydride in the electroless iron-nickel plating step.
实施例29Example 29
与实施例1的区别在于,化学镀铁镍步骤中用等浓度次亚磷酸盐代替硼氢化钠。The difference from Example 1 is that the equal concentration of hypophosphite is used instead of sodium borohydride in the electroless iron-nickel plating step.
实施例30Example 30
与实施例1的区别在于,化学镀铁镍步骤中六水合硫酸亚铁铵的浓度为0.01mol/L。The difference from Example 1 is that the concentration of ferrous ammonium sulfate hexahydrate in the electroless nickel-iron plating step is 0.01 mol/L.
实施例31Example 31
与实施例1的区别在于,化学镀处理的时间为30min。The difference from Example 1 is that the electroless plating treatment time is 30 min.
实施例32Example 32
与实施例1的区别在于,化学镀铁镍步骤中氟化钠的浓度0.001mol/L。The difference from Example 1 is that the concentration of sodium fluoride in the electroless iron-nickel plating step is 0.001 mol/L.
实施例33Example 33
与实施例1的区别在于,化学镀铁镍步骤中用等浓度硼氨基乙酸代替氟化钠。The difference from Example 1 is that in the electroless iron-nickel plating step, sodium fluoride is replaced with equal concentration of boron aminoacetic acid.
实施例34Example 34
与实施例1的区别在于,化学镀铁镍步骤中用等浓度丙二酸代替氟化钠。The difference from Example 1 is that sodium fluoride is replaced with equal concentration malonic acid in the electroless iron-nickel plating step.
实施例35Example 35
(1)清洁(1) Cleaning
将芳纶纸蜂窝(300mm*300mm*5mm)置于碱性液中,在50℃,超声波功率为120W的条件下处理10min后去除蜂窝内孔壁表面的杂质,再用清水冲洗材料表面,去除残留的碱性液,该碱性液包含:20g/L的NaOH和2g/L的OP乳化剂。Put the aramid paper honeycomb (300mm*300mm*5mm) in the alkaline solution, treat it at 50℃ and the ultrasonic power is 120W for 10min, remove the impurities on the surface of the inner hole wall of the honeycomb, and then rinse the surface of the material with water to remove the impurities. Residual alkaline solution, the alkaline solution contains: 20g/L NaOH and 2g/L OP emulsifier.
(2)活化(2) Activation
采用浓度为乙酸镍(g):次亚磷酸钠(g):水(ml)=1:1:30的活化溶液对微蚀芳纶纸 蜂窝浸润约10min后,在200℃条件下进行热处理60min,再用去离子水清洗除去残留的活化 液。The micro-etched aramid paper honeycomb was soaked for about 10 minutes with an activation solution with a concentration of nickel acetate (g): sodium hypophosphite (g): water (ml) = 1:1:30, and then heat-treated at 200 °C for 60 minutes , and then rinsed with deionized water to remove the residual activation solution.
(3)化学镀铁镍(3) Electroless iron nickel plating
在90℃的碱性溶液中将活化处理后的芳纶纸蜂窝进行化学镀铁镍,其中,化学镀铁镍液 组成及工艺条件:次亚磷酸镍0.06mol/L,六水合硫酸亚铁铵0.04mol/L,硼氢化钠0.005mol/L, 氟化钠0.005mol/L,pH值9.0,温度值90℃,处理时间60min。The activated aramid paper honeycomb was electroless plated with iron and nickel in an alkaline solution at 90°C, wherein the composition and process conditions of the electroless iron and nickel plating solution: nickel hypophosphite 0.06mol/L, ferrous ammonium sulfate hexahydrate 0.04mol/L, sodium borohydride 0.005mol/L, sodium fluoride 0.005mol/L, pH value 9.0, temperature value 90°C, treatment time 60min.
实施例36Example 36
与实施例1的区别在于,活化步骤中,热处理温度为220℃。The difference from Example 1 is that in the activation step, the heat treatment temperature is 220°C.
实施例37Example 37
与实施例1的区别在于,活化步骤中,热处理温度为180℃。The difference from Example 1 is that in the activation step, the heat treatment temperature is 180°C.
实施例38Example 38
与实施例1的区别在于,活化步骤中,热处理时间为15min。The difference from Example 1 is that in the activation step, the heat treatment time is 15 min.
实施例39Example 39
与实施例1的区别在于,活化步骤中,热处理时间为75min。The difference from Example 1 is that in the activation step, the heat treatment time is 75 min.
实施例40Example 40
与实施例1的区别在于,化学镀铁镍步骤中,次亚磷酸镍的浓度为0.02mol/L。The difference from Example 1 is that in the electroless iron-nickel plating step, the concentration of nickel hypophosphite is 0.02 mol/L.
实施例41Example 41
与实施例1的区别在于,化学镀铁镍步骤中,次亚磷酸镍的浓度为0.13mol/L。The difference from Example 1 is that in the electroless iron-nickel plating step, the concentration of nickel hypophosphite is 0.13 mol/L.
实施例42Example 42
与实施例1的区别在于,化学镀铁镍步骤中,六水合硫酸亚铁铵的浓度为0.09mol/L。The difference from Example 1 is that in the electroless iron-nickel plating step, the concentration of ferrous ammonium sulfate hexahydrate is 0.09 mol/L.
对上述实施例制备得到的金属化芳纶蜂窝材料进行性能测试。The properties of the metallized aramid honeycomb materials prepared in the above examples were tested.
(1)耐蚀性能测试:(1) Corrosion resistance test:
具体测试内容:观察蜂窝孔壁金属层分布情况,之后通过盐雾试验进行耐蚀性能测试。 并观察是否容易脱落、材料的腐蚀产物疏松等情况,例如,通过盐雾试验评价不同材料的耐 蚀性能时,就通常采用失重法。Specific test content: observe the distribution of the metal layer on the honeycomb hole wall, and then conduct the corrosion resistance test through the salt spray test. And observe whether it is easy to fall off and the corrosion products of the material are loose. For example, when evaluating the corrosion resistance of different materials through the salt spray test, the weight loss method is usually used.
重量法是材料耐蚀能力的研究中最为基本,同时也是最为有效可信的定量评价方法。尽 管重量法具有无法研究材料腐蚀机理的缺点,但是通过测量材料在腐蚀前后重量的变化,可 以较为准确、可信的表征材料的耐蚀性能。也正因为如此,它一直在腐蚀研究中广泛使用, 是许多电化学的、物理的、化学的现代分析评价方法鉴定比较的基础。通常可以考虑采用失 重法。Gravimetric method is the most basic and most effective and credible quantitative evaluation method in the study of material corrosion resistance. Although the gravimetric method has the disadvantage of not being able to study the corrosion mechanism of materials, by measuring the change in the weight of the material before and after corrosion, the corrosion resistance of the material can be more accurately and credibly characterized. Because of this, it has been widely used in corrosion research and is the basis for the identification and comparison of many modern electrochemical, physical and chemical analytical evaluation methods. The weight loss method can usually be considered.
通过盐雾试验并结合失重测试来表征材料的耐腐蚀性能。根据ASTMB117的要求,试样 以15-30度的倾角放置,采用5%的NaCl溶液进行雾化喷雾,试验温度35℃。盐雾实验要求 盐雾箱内的容积要足够大,不得将盐雾直接喷射到实验的表面。The corrosion resistance of the material is characterized by the salt spray test combined with the weight loss test. According to the requirements of ASTMB117, the sample is placed at an inclination angle of 15-30 degrees, and 5% NaCl solution is used for atomization and spraying, and the test temperature is 35 °C. Salt spray experiment requirement
(2)压缩强度测试(2) Compressive strength test
以GB/T 1453-2005测试方法为例:Take GB/T 1453-2005 test method as an example:
A.制样:裁切成60mm*60mm*5mm和60mm*60mm*40mm之间的样本蜂窝。A. Sample preparation: cut into sample honeycombs between 60mm*60mm*5mm and 60mm*60mm*40mm.
B.测试设备:万能材料试验机。B. Testing equipment: Universal material testing machine.
C.压缩夹具:应使用一个固定的平压板和一个带有球形座的压板(自动对中)将力引入到 试件中,压板能很好对中,并且不施加偏心载荷,压板表面应超出试件外形。若压板硬度不 足或为了保护压板表面,可以在夹具和相应的压板的每个端面之间插入一块较硬的平板(与 表面平行)。C. Compression fixture: A fixed flat platen and a platen with a spherical seat (automatic centering) should be used to introduce force into the specimen, the platen can be well centered and no eccentric load is applied, and the surface of the platen should exceed Specimen shape. If the platen hardness is insufficient or to protect the platen surface, a stiffer flat plate (parallel to the surface) can be inserted between the clamp and each end face of the corresponding platen.
测试方法:测试平压强度时,调整球形支座,使上垫块与试验机下压片平行,然均匀连 续加载直至破坏,读取破坏载荷,记录破坏形式。推荐加载速度为0.5mm/min。Test method: When testing the flat compressive strength, adjust the spherical support so that the upper pad is parallel to the lower pressing piece of the testing machine, and then load it uniformly and continuously until it fails, read the failure load, and record the failure form. The recommended loading speed is 0.5mm/min.
E.破坏形式:样本蜂窝的均匀破坏是唯一可以接受的破坏形式,局限于一个角或一条边的 压缩破坏是无效的。E. Failure mode: Uniform failure of the sample honeycomb is the only acceptable failure mode, compression failure limited to one corner or one side is ineffective.
F.数据处理:保留小数点后3位,极限强度,P=F/A。式中P未平压强度,MPa;F为破坏前的极限载荷,N;A为试件的横截面积,mm2。F. Data processing: keep 3 decimal places, limit strength, P=F/A. where P is the uncompressed strength, MPa; F is the ultimate load before failure, N; A is the cross-sectional area of the specimen, mm 2 .
(3)屏蔽能效测试(3) Shielding energy efficiency test
根据GJB6190-2008,在10MHz~10GHz范围内电磁兼容试验屏蔽室进行屏蔽材料的屏蔽 效能测试。测试。由于频谱分析仪显示的幅度值(单位:dB),屏蔽室可以直接测量有屏蔽材 料和没有屏蔽材料的接收场强,两者相减即得到屏蔽材料的屏蔽效能。According to GJB6190-2008, the shielding effectiveness of shielding materials is tested in the electromagnetic compatibility test shielding room in the range of 10MHz to 10GHz. test. Due to the amplitude value (unit: dB) displayed by the spectrum analyzer, the shielded room can directly measure the receiving field strength with and without shielding material, and the shielding effectiveness of the shielding material can be obtained by subtracting the two.
上述测试结果记录在表1中。The above test results are recorded in Table 1.
表1Table 1
从以上的描述中,可以看出,本发明上述的实施例实现了如下技术效果:From the above description, it can be seen that the above-mentioned embodiments of the present invention achieve the following technical effects:
本申请的金属化芳纶蜂窝材料的制备方法,首先进行清洁,以去除芳纶蜂窝表面附着的 灰尘等固体小颗粒杂质和孔壁上粘着的矿物质油或油脂等污渍,其次进行活化处理,使芳纶 蜂窝表面更易沉积铁镍镀层。最后进行化学镀,在活性芳纶蜂表面形成均匀的铁镍镀层,实 现了芳纶纸蜂窝金属化。从上述描述中可以看出,本申请金属化芳纶蜂窝材料的制备方法简 单,利用清洗、活化和化学镀,就可以完成芳纶纸蜂窝的金属化,得到耐蚀性能好、透气性 好、平面压缩强度高、屏蔽性能优异的金属化芳纶纸蜂窝材料。For the preparation method of the metallized aramid honeycomb material of the present application, firstly, cleaning is performed to remove solid small particles of impurities such as dust attached to the surface of the aramid fiber honeycomb and stains such as mineral oil or grease adhering to the pore walls, and secondly, an activation treatment is performed, It makes it easier to deposit Fe-Ni coating on the aramid honeycomb surface. Finally, chemical plating is performed to form a uniform iron-nickel coating on the surface of the active aramid honeycomb, which realizes the metallization of the aramid paper honeycomb. It can be seen from the above description that the preparation method of the metallized aramid honeycomb material of the present application is simple, and the metallization of the aramid paper honeycomb can be completed by cleaning, activation and electroless plating, and the result is good corrosion resistance, good air permeability, Metallized aramid paper honeycomb material with high plane compressive strength and excellent shielding properties.
以上所述仅为本发明的优选实施例而已,并不用于限制本发明,对于本领域的技术人员 来说,本发明可以有各种更改和变化。凡在本发明的精神和原则之内,所作的任何修改、等 同替换、改进等,均应包含在本发明的保护范围之内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.
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Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1987004443A1 (en) * | 1986-01-23 | 1987-07-30 | Allied Corporation | Phenolic cyanate-phenolic triazine copolymers |
US4831086A (en) * | 1987-10-05 | 1989-05-16 | Allied-Signal Inc. | Cyanato group containing phenolic resins, phenolic triazines derived therefrom |
CA1327972C (en) * | 1987-10-05 | 1994-03-22 | Sajal Das | Cyanato group containing phenolic resins, phenolic triazines derived therefrom |
WO2002018700A1 (en) * | 1999-07-07 | 2002-03-07 | Shaozhi Liu | A fabric shielding electromagnetic wave and a preparation method |
FR2838800A1 (en) * | 2002-04-17 | 2003-10-24 | Japan Matex Kk | Production of stuffing-box packing from a material comprising fibers laminated to a sheet of expanded graphite with an adhesive |
CN103921450A (en) * | 2014-04-28 | 2014-07-16 | 西北工业大学 | Manufacturing method of wing-body integrated honeycomb sandwiched composite material skin |
CN104404756A (en) * | 2014-11-13 | 2015-03-11 | 南通大学 | Iron nickel conductive sound-insulation electromagnetic shielding fabric preparation method |
KR20150076669A (en) * | 2013-12-27 | 2015-07-07 | 도레이케미칼 주식회사 | Porous polymer conductive sheet and preparation method thereof |
CN104928914A (en) * | 2015-06-26 | 2015-09-23 | 上海大学 | Method for preparing aramid composite conductive fibers with nickel/copper coatings |
KR101660520B1 (en) * | 2015-04-08 | 2016-09-29 | 한국생산기술연구원 | Method of performing continuous electroless plating of copper and nickel and plating layer using the same |
JP2016204798A (en) * | 2015-04-28 | 2016-12-08 | 日本製紙パピリア株式会社 | Organic fiber having fibril |
CN107546476A (en) * | 2016-06-24 | 2018-01-05 | 洛阳尖端技术研究院 | A kind of method for the standing-wave ratio for improving composite antenna |
CN108274830A (en) * | 2017-11-29 | 2018-07-13 | 浙江三元电子科技有限公司 | A kind of light-weighted wallboard of shelter and preparation method thereof with wideband function of shielding |
JP2018132387A (en) * | 2017-02-14 | 2018-08-23 | 日本製紙株式会社 | Radiation shielding material |
CN108997711A (en) * | 2017-06-07 | 2018-12-14 | 洛阳尖端技术研究院 | A kind of suction wave dipping glue and inhale wave honeycomb and preparation method thereof |
CN109514947A (en) * | 2018-12-19 | 2019-03-26 | 航天科工武汉磁电有限责任公司 | Shelter deck board and preparation method thereof |
CN109554916A (en) * | 2017-09-26 | 2019-04-02 | 中蓝晨光化工研究设计院有限公司 | A kind of preparation method of surface metalation aramid fiber |
CN112026272A (en) * | 2020-08-17 | 2020-12-04 | 浙江工业大学 | Novel wave-absorbing material with honeycomb structure and preparation method thereof |
CN112048938A (en) * | 2020-08-26 | 2020-12-08 | 中国航空工业集团公司济南特种结构研究所 | Preparation method of wave-absorbing paper honeycomb |
CN112095351A (en) * | 2020-08-25 | 2020-12-18 | 东华大学 | Frequency band-adjustable integrated multilayer wave-absorbing planar fabric and preparation method thereof |
-
2020
- 2020-12-25 CN CN202011568899.9A patent/CN114672794B/en active Active
Patent Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1987004443A1 (en) * | 1986-01-23 | 1987-07-30 | Allied Corporation | Phenolic cyanate-phenolic triazine copolymers |
US4831086A (en) * | 1987-10-05 | 1989-05-16 | Allied-Signal Inc. | Cyanato group containing phenolic resins, phenolic triazines derived therefrom |
CA1327972C (en) * | 1987-10-05 | 1994-03-22 | Sajal Das | Cyanato group containing phenolic resins, phenolic triazines derived therefrom |
WO2002018700A1 (en) * | 1999-07-07 | 2002-03-07 | Shaozhi Liu | A fabric shielding electromagnetic wave and a preparation method |
FR2838800A1 (en) * | 2002-04-17 | 2003-10-24 | Japan Matex Kk | Production of stuffing-box packing from a material comprising fibers laminated to a sheet of expanded graphite with an adhesive |
KR20150076669A (en) * | 2013-12-27 | 2015-07-07 | 도레이케미칼 주식회사 | Porous polymer conductive sheet and preparation method thereof |
CN103921450A (en) * | 2014-04-28 | 2014-07-16 | 西北工业大学 | Manufacturing method of wing-body integrated honeycomb sandwiched composite material skin |
CN104404756A (en) * | 2014-11-13 | 2015-03-11 | 南通大学 | Iron nickel conductive sound-insulation electromagnetic shielding fabric preparation method |
KR101660520B1 (en) * | 2015-04-08 | 2016-09-29 | 한국생산기술연구원 | Method of performing continuous electroless plating of copper and nickel and plating layer using the same |
JP2016204798A (en) * | 2015-04-28 | 2016-12-08 | 日本製紙パピリア株式会社 | Organic fiber having fibril |
CN104928914A (en) * | 2015-06-26 | 2015-09-23 | 上海大学 | Method for preparing aramid composite conductive fibers with nickel/copper coatings |
CN107546476A (en) * | 2016-06-24 | 2018-01-05 | 洛阳尖端技术研究院 | A kind of method for the standing-wave ratio for improving composite antenna |
JP2018132387A (en) * | 2017-02-14 | 2018-08-23 | 日本製紙株式会社 | Radiation shielding material |
CN108997711A (en) * | 2017-06-07 | 2018-12-14 | 洛阳尖端技术研究院 | A kind of suction wave dipping glue and inhale wave honeycomb and preparation method thereof |
CN109554916A (en) * | 2017-09-26 | 2019-04-02 | 中蓝晨光化工研究设计院有限公司 | A kind of preparation method of surface metalation aramid fiber |
CN108274830A (en) * | 2017-11-29 | 2018-07-13 | 浙江三元电子科技有限公司 | A kind of light-weighted wallboard of shelter and preparation method thereof with wideband function of shielding |
CN109514947A (en) * | 2018-12-19 | 2019-03-26 | 航天科工武汉磁电有限责任公司 | Shelter deck board and preparation method thereof |
CN112026272A (en) * | 2020-08-17 | 2020-12-04 | 浙江工业大学 | Novel wave-absorbing material with honeycomb structure and preparation method thereof |
CN112095351A (en) * | 2020-08-25 | 2020-12-18 | 东华大学 | Frequency band-adjustable integrated multilayer wave-absorbing planar fabric and preparation method thereof |
CN112048938A (en) * | 2020-08-26 | 2020-12-08 | 中国航空工业集团公司济南特种结构研究所 | Preparation method of wave-absorbing paper honeycomb |
Non-Patent Citations (3)
Title |
---|
FENG XIAO等: ""Experimental and numerical investigation on the shock resistance of honeycomb rubber coatings subjected to underwater explosion"", 《JOURNAL OF ENGINEERING FOR THE MARITIME ENVIRONMENT》, 17 June 2015 (2015-06-17), pages 77 - 94 * |
曹阳丽: ""蜂窝夹层复合材料飞机雷达罩可允许损伤研究"", 《中国优秀硕士学位论文全文数据库 工程科技Ⅱ辑》, no. 10, 15 October 2018 (2018-10-15), pages 031 - 70 * |
李兰英等: ""制备高模型对位芳纶热处理工艺研究"", 《高科技纤维与应用》, vol. 39, no. 2, 30 April 2014 (2014-04-30), pages 51 - 56 * |
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