CN114464559A - UV glue-dissolving machine - Google Patents

Abstract

The invention discloses a UV glue-dissolving machine, which relates to the technical field of glue-dissolving machines and comprises an external shell, and a support assembly and a roller assembly which are arranged at four corners of the bottom of the external shell, wherein the external shell comprises a wafer placing box positioned at the upper left side, a basket main box positioned at the upper right side and used for placing a wafer basket, a wafer secondary box positioned at the lower right side and used for lifting the wafer basket, and a glue-dissolving box positioned at the lower left side and used for dissolving glue for wafers, the wafer placing box, the basket main box, the wafer secondary box and the glue-dissolving box are sequentially communicated, a wafer box used for placing wafers is arranged in the wafer placing box, a wafer basket, a mounting frame, an adjusting frame which is arranged on the mounting frame and can adjust the distance for placing the wafer basket, and a mechanical gripper assembly which is arranged on the mounting frame and can horizontally move to the wafer box along the mounting frame to pick up wafers; the invention has the advantages of reasonable design, high integration level, good glue-dissolving effect and high working efficiency.

Description

A UV degumming machine

technical field

The invention relates to the technical field of degumming machines, and more particularly to the technical field of UV degumming machines.

Background technique

In the semiconductor chip production process, before the chip is diced, the wafer should be fixed on the frame with a dicing film. After the dicing process is completed, the fixed film is irradiated with UV light to make the UV film sticky and hardened. , in order to reduce the viscosity of the dicing fixed film, so as to facilitate the smooth production of the subsequent packaging process. When irradiated with ultraviolet rays, the adhesive strength becomes low. Therefore, the wafer or chip is easily peeled off from the adhesive tape after UV irradiation.

The UV debonding machine solves the debonding process of the wafer, glass and ceramic cutting process. The applicable industry is not only limited to the semiconductor packaging industry, but also suitable for semiconductor materials such as optical lenses, LEDs, ICs, semiconductors, integrated circuit boards, mobile hard disks, etc. UV film degumming is used.

The UV degumming machine in the prior art has the defects of low working efficiency, uneven degumming effect and poor heat dissipation. How to solve the above technical problems has become the direction of efforts of those skilled in the art.

SUMMARY OF THE INVENTION

The purpose of the present invention is: in order to solve the above technical problems, the present invention provides a UV degumming machine.

The present invention specifically adopts the following technical solutions in order to achieve the above object:

A UV degumming machine includes an outer casing, support assemblies and roller assemblies arranged at the four corners of the bottom of the outer casing, the outer casing includes a wafer placement box on the upper left side, and a wafer placement basket on the upper right side The main basket case, the wafer sub case located on the lower right side for lifting and lowering the wafer carrier, and the degumming case located on the lower left side for wafer debonding, the wafer placement case, the main basket case, the wafer sub case The box and the de-gluing box are connected in sequence, the wafer placement box is provided with a wafer box for placing wafers, and the basket main box is provided with a wafer carrier, a mounting rack, which is arranged on the mounting rack and can adjust the placement of wafers. The adjustment frame for the distance between the round baskets and the mechanical gripper assembly are arranged on the installation frame and can move horizontally along the installation frame to pick up wafers in the wafer box.

Further, a linear lifting mechanism is arranged in the wafer sub-box, the top of the linear lifting mechanism is connected with the bottom of the adjustment frame, and the linear lifting mechanism is a lifting cylinder.

Further, a partition is arranged in the dissolving box, and a disc-shaped quartz glass is inlaid in the middle of the partition, and wafer baskets A located on both sides of the quartz glass are also arranged on the partition. A pair of adjustment mechanisms A for adjusting the spacing between the wafer baskets A are also arranged on the board, and a UV lamp tube assembly for aligning the quartz glass is arranged below the partition plate.

Further, the adjusting frame mechanism and the adjusting mechanism A are both adjusting cylinders.

Further, a nitrogen nozzle is arranged at the top of the dissolving box, and an exhaust fan for convection of nitrogen is arranged at the bottom of the dispelling box.

Further, a cooling fan is arranged in the dissolving box.

Further, the shape of the wafer box with the opening downward is a U-shaped folded plate, the width of the U-shaped folded plate is adapted to the width of the wafer carrying basket, the wafer placement box is provided with an opening, and the opening is A sealing cover is hingedly arranged, and a transparent observation window and a handle are arranged on the sealing cover.

Further, a control panel is provided on the left side of the main carrying basket, and a plurality of control buttons are provided on the control panel.

Further, a vertical guide plate is arranged on the inner right side wall of the main box of the carrying basket, two guide rails are arranged parallel to each other on the vertical guide plate, a vertical plate is arranged on the right end of the mounting frame, and a vertical plate is arranged on the vertical plate. Two card slots for snapping with two guide rails.

The beneficial effects of the present invention are as follows:

1. The design of the present invention is reasonable. When working, the wafer to be debonded is put into the wafer box of the wafer placement box, and the wafer is moved into the wafer box by the mechanical gripper assembly on the mounting frame to grab the wafer, Place it on the wafer carrying basket on the wafer placement box, lower the mounting frame to the lower wafer sub-box through the linear lifting mechanism, and then send the wafer into the dissolving box through the mechanical gripper assembly, and pass the UV lamp. The tube assembly is debonded, and the wafer is transported through the same mechanical gripper assembly, which can reduce the mechanism of the debonding machine and make the debonding machine occupy a small area. This structure can save the loading and unloading time and improve the work. efficiency, and the degumming effect is stable.

2. There is a nitrogen nozzle at the top of the degumming box, and an exhaust fan is arranged at the bottom of the degumming box, so that the nitrogen in the degumming box can form up and down convection and enhance the degumming effect.

Description of drawings

Fig. 1 is the structural representation of the present invention;

FIG. 2 is a schematic structural diagram of FIG. 1 with the outer casing removed;

Fig. 3 is the front view of Fig. 2;

Fig. 4 is the structural representation of dispelling box;

Reference numerals: 1-wafer sub-box, 1-1-linear lift mechanism, 2-basket main box, 2-1-adjustment frame, 2-2-wafer carrier, 2-3-mechanical gripper assembly, 2 -4-rail, 2-5-mounting frame, 2-6-vertical guide plate, 3-control panel, 4-wafer placement box, 5-dissolving box, 5-1-spacer, 5-2- Wafer Basket A, 5-3-Quartz Glass, 5-4-Nitrogen Nozzle, 5-5-Adjustment Mechanism A, 5-6-UV Lamp Assembly, 5-7-Exhaust Fan, 6-Support Assembly, 7- Roller assembly.

Detailed ways

In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations.

Thus, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

It should be noted that like numerals and letters refer to like items in the following figures, so once an item is defined in one figure, it does not require further definition and explanation in subsequent figures. Furthermore, the terms "first", "second", etc. are only used to differentiate the description and should not be construed to indicate or imply relative importance.

In the description of the embodiments of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "inside", "outside", "upper", etc. is based on the orientation or positional relationship shown in the drawings, or the product of the invention The orientation or positional relationship that is usually placed in use is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood to limit the present invention.

Example 1

As shown in Figures 1 to 4, the present embodiment provides a UV degumming machine, which includes an outer casing, a support assembly 6 and a roller assembly 7 disposed at the four corners of the bottom of the outer casing, and the outer casing includes an upper left side The wafer placement box 4 is located on the upper right side, the main basket box 2 is located on the upper right side for placing the wafer lifting basket, the wafer sub box 1 located on the lower right side for lifting and lowering the wafer lifting basket, and the lower left side for wafer debonding. Glue box 5, the wafer placement box 4, the main basket 2, the wafer sub-box 1 and the de-gluing box 5 are sequentially connected, and the wafer placement box 4 is provided with wafer boxes 4-3 for placing wafers , the main basket 2 is provided with a wafer carrying basket 2-2, a mounting frame 2-5, an adjustment frame 2-1 which is arranged on the mounting frame 2-5 and can adjust the distance of placing the wafer carrying basket 2-2, and is provided with A robotic gripper assembly 2-3 on the mounting frame 2-5 and capable of moving horizontally along the mounting frame 2-5 into the wafer box 4-3 for picking up wafers.

The wafer sub-box 1 is provided with a linear lifting mechanism 1-1, the top of the linear lifting mechanism 1-1 is connected with the bottom of the adjustment frame 2-1, and the linear lifting mechanism 1-1 is a lifting cylinder.

The dissolving box 5 is provided with a partition plate 5-1, the middle of the partition plate 5-1 is inlaid with a disc-shaped quartz glass 5-3, and the partition plate 5-1 is also provided with a partition plate located in the quartz glass 5. -3 Wafer carrying baskets A5-2 on both sides, a pair of adjustment mechanisms A5-5 for adjusting the spacing between wafer carrying baskets A5-2 are also provided on the partition plate 5-1, and a pair of adjustment mechanisms A5-5 are arranged below the partition plate 5-1 There is a UV lamp assembly 5-6 for aligning the quartz glass 5-3.

The adjusting frame mechanism 2-1 and the adjusting mechanism A5-5 are both adjusting cylinders.

In this embodiment, during operation, the wafer to be debonded is put into the wafer box of the wafer placement box, and the wafer is moved into the wafer box by the mechanical gripper assembly on the mounting frame to grab the wafer, and place it in the wafer box. On the wafer carrying basket on the wafer placement box, the mounting frame is lowered into the lower wafer sub-box through the linear lifting mechanism, and the wafer is sent into the dissolving box through the mechanical gripper assembly, and the UV lamp tube assembly is used. The debonding process is carried out, and the wafer handling is realized through the same mechanical gripper assembly, which can reduce the mechanism of the debonding machine and make the debonding machine occupy a small area. This structure can save the loading and unloading time and improve the work efficiency. And the degumming effect is stable.

Example 2

This embodiment is further optimized on the basis of Embodiment 1, specifically:

A nitrogen spray head 5-4 is arranged on the top of the dissolving box 5, and an exhaust fan 5-7 is arranged on the bottom of the dispelling box 5 to make nitrogen gas convection.

A cooling fan is arranged in the dissolving box 5 .

The wafer box 4-3 is a U-shaped folded plate with an opening downward, and the width of the U-shaped folded plate is adapted to the width of the wafer carrying basket 2-2. The wafer placement box 4 is provided with an opening. A sealing cover 4-1 is hingedly arranged at the opening, and a transparent observation window 4-2 and a handle are arranged on the sealing cover 4-1.

A control panel 3 is provided on the left side of the basket main box 2 , and a plurality of control buttons are provided on the control panel 3 .

A vertical guide plate 2-6 is arranged on the inner right side wall of the basket main box 2, and two guide rails 2-7 parallel to each other are arranged on the vertical guide plate 2-6. The right end of the mounting frame 2-5 is arranged with a The vertical plate is provided with two card slots that are connected with the two guide rails 2-7. The design of this structure increases the stability of the lift.

Claims (9)

1. a UV degumming machine, comprising an outer casing and a support assembly (6) and a roller assembly (7) arranged at the four corners of the outer casing bottom, it is characterized in that, the outer casing comprises a crystal at the upper left side. A round storage box (4), a main carrier box (2) for placing the wafer carrier on the upper right side, a wafer sub box (1) for lifting and lowering the wafer carrier on the lower right side, and a wafer carrier on the lower left side for wafers The degumming box (5) for degumming, the wafer placement box (4), the main basket (2), the wafer sub-box (1) and the degumming box (5) are sequentially connected, and the wafer placement box ( 4) A wafer box (4-3) for placing wafers is arranged inside, and the main basket box (2) is provided with a wafer carrier (2-2), a mounting frame (2-5), a An adjustment frame (2-1) on the frame (2-5) and capable of adjusting the distance for placing the wafer carrying basket (2-2), arranged on the mounting frame (2-5) and capable of being horizontally arranged along the mounting frame (2-5) The robotic gripper assembly (2-3) that moves to the wafer box (4-3) to pick up wafers. 2. A kind of UV debonding machine according to claim 1, characterized in that, a linear lifting mechanism (1-1) is provided in the wafer sub-box (1), and the top of the linear lifting mechanism (1-1) is Connected with the bottom of the adjusting frame (2-1), the linear lifting mechanism (1-1) is a lifting cylinder. 3. A kind of UV glue dissolving machine according to claim 1, characterized in that, a partition plate (5-1) is arranged in the glue solution box (5), and the middle part of the partition plate (5-1) is inlaid There is a disc-shaped quartz glass (5-3), and the partition plate (5-1) is also provided with wafer baskets A (5-2) located on both sides of the quartz glass (5-3). The plate (5-1) is also provided with a pair of adjustment mechanisms A (5-5) for adjusting the spacing between the wafer carrying baskets A (5-2), and a pair of adjustment mechanisms A (5-5) for aligning the quartz UV lamp assembly (5-6) of glass (5-3). 4 . The UV degumming machine according to claim 3 , wherein the adjusting frame mechanism ( 2 - 1 ) and the adjusting mechanism A ( 5 - 5 ) are both adjusting cylinders. 5 . 5. A kind of UV glue dissolving machine according to claim 3, is characterized in that, the inner top of described glue solution box (5) is provided with nitrogen nozzle (5-4), the inner bottom of described glue solution box (5) A suction fan (5-7) is provided for convection of nitrogen gas. 6. A kind of UV dissolving machine according to claim 3, characterized in that, a cooling fan is provided in the dissolving box (5). 7. A kind of UV debonding machine according to claim 1, is characterized in that, described wafer box (4-3) is U-shaped folded plate with the shape of opening downward, and the width of U-shaped folded plate is the same as that of crystal. The width of the round basket (2-2) is adapted, the wafer placement box (4) is provided with an opening, and the opening is hingedly provided with a sealing cover (4-1), and the sealing cover (4-1) A transparent observation window (4-2) and a handle are arranged on it. 8. A UV degumming machine according to claim 1, characterized in that, a control panel (3) is provided on the left side of the basket main box (2), and a plurality of control button. 9. A kind of UV degumming machine according to claim 1, characterized in that, a vertical guide plate (2-6) is provided on the inner right side wall of the basket main box (2), and the vertical guide plate (2 -6) Two guide rails (2-7) parallel to each other are arranged on it, a vertical plate is arranged on the right end of the mounting frame (2-5), and the vertical plate is arranged with two guide rails (2-7). two card slots.

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