CN114417781B - PCB wiring crosstalk evaluation method, system, device, equipment and storage medium - Google Patents

Abstract

The application relates to the field of printed circuit board design, and discloses a PCB wiring crosstalk evaluation method, a system, a device, equipment and a storage medium. The modeling simulation workload of an engineer is reduced, the influence of the PCB glass fiber effect and the PCB lamination on the crosstalk value between the wires is comprehensively considered, the quick and accurate assessment on the crosstalk between the PCB wires is realized, the risk that the engineer selects a wiring scheme causing the unconventional crosstalk value in the PCB design process can be greatly reduced, and the wiring area planning can be quickly calculated, so that the product development quality is improved.

Description

PCB trace crosstalk evaluation method, system, device, equipment and storage medium

technical field

The present application relates to the field of printed circuit board design, and in particular, to a method, system, device, device and storage medium for evaluating crosstalk of PCB traces.

Background technique

Crosstalk is the coupling between two signal lines, the mutual inductance and mutual capacitance between the signal lines causing noise on the line. The signal on the active line or the aggressive line will cause a part of the noise. The signal is transmitted to the static line with no signal (also known as the victim line, the victim line), which causes the problem of coupling interference. In PCB (Printed Circuit Board, printed circuit board) design and integrated circuit design, crosstalk is a relatively difficult problem. The parameters of the PCB layer, signal line spacing, electrical characteristics of the driving end and the receiving end, and line termination methods are all related to crosstalk. have a certain impact. In response to the development trend of today's electronic products being light, thin, and short, along with the pursuit of higher signal transmission quality, the size of the circuit board is getting smaller and smaller, and the wiring density of each layer is also increasing. Especially when the signal transmission speed continues to increase, the problem of crosstalk becomes more and more. Seriously, how to reduce noise interference has become an important issue for the PCB design team to face.

Usually, signal integrity engineers define routing parameters such as trace distances in accordance with the design guidelines provided by chip manufacturers. However, when the design requirements exceed the design guidelines, the signal integrity engineer must perform modeling and simulation on their own to determine whether the impact of the crosstalk value caused by the trace design on the high-speed signal is within the allowable range. This makes it necessary for engineers to spend a lot of time on modeling and simulation during the design process, which not only results in a large workload for engineers and a longer product development cycle, but also places high demands on engineers' modeling and simulation capabilities. If the engineer does not consider the factors comprehensively in the simulation process and the simulation model is inaccurate, it will further lead to inaccurate simulation results, which will give wrong guidance to the PCB design, and ultimately affect the quality of product development.

How to accurately evaluate the crosstalk result brought by the PCB trace design is a technical problem to be solved by those skilled in the art.

SUMMARY OF THE INVENTION

The purpose of this application is to provide a PCB trace crosstalk evaluation method, system, device, equipment and storage medium, which can be used to accurately evaluate the crosstalk results brought by PCB trace design, reduce the work pressure of PCB engineers, and shorten the time of electronic products. Development cycle, improve the quality of electronic products.

In order to solve the above-mentioned technical problems, the present application provides a method for evaluating PCB trace crosstalk, including:

Receive the input lamination information of the target PCB board laminate, target PCB glass fiber cloth parameters and target wiring parameters;

Generate a target PCB board laminate simulation module based on the lamination information of the target PCB board laminate, and generate a target PCB glass fiber cloth simulation module based on the target PCB glass fiber cloth parameters;

Combined with the target PCB board laminate simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters, build a PCB signal line crosstalk simulation calculation model;

Crosstalk simulation is performed on the PCB signal line crosstalk simulation calculation model to obtain a crosstalk simulation result;

The crosstalk simulation result is output.

Optionally, also include:

Establish a sub-layer database in advance according to the electrical characteristic parameters of PCB materials of different PCB boards;

Receive the input lamination information of the target PCB board lamination, specifically:

receiving an input stack-up requirement for the target PCB board stack-up;

The generation of the target PCB board laminate simulation module based on the laminate information of the target PCB board laminate specifically includes:

selecting a target sub-stack from the sub-stack database according to the stack requirements;

The target PCB board stack simulation module for the target PCB board stack that meets the stack requirements is generated based on the stack-up information of each of the target sub-stacks.

Optionally, generating the target PCB board laminate simulation module for the target PCB board laminate that meets the laminate requirements based on the laminate information of each of the target sub-layers, specifically includes:

When the target sub-layer only includes an inner-layer PCB structure and an outer-layer PCB structure, the single-layer target PCB is generated based on the stack-up information of the inner-layer PCB structure and the stack-up information of the outer-layer PCB structure plate lamination;

When the target sub-stack includes multiple layers of sub-stack structures, multiple layers of the target PCB board stack-up are generated based on each of the sub-stack structures.

Optionally, the target PCB glass fiber cloth parameter is specifically the type of glass fiber cloth.

Optionally, the target wiring parameters specifically include: signal line broken line angle, total signal line length, signal line segment length, number of signal line segments, signal line impedance value, signal frequency points, and signal line spacing.

Optionally, before building the PCB signal line crosstalk simulation calculation model in combination with the target PCB board laminate simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters, the method further includes:

Determine whether the routing design corresponding to the target routing parameters is affected by the PCB glass fiber effect;

If yes, then enter the step of building a PCB signal line crosstalk simulation calculation model in combination with the target PCB board laminate simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters;

If not, output trace design non-compliant information.

Optionally, also include:

Comparing the crosstalk simulation result with the industry standard crosstalk value corresponding to the signal frequency point in the target wiring parameter, the crosstalk evaluation result is obtained;

The crosstalk evaluation result is output.

In order to solve the above technical problems, the present application also provides a PCB trace crosstalk evaluation system, including:

The PCB stack-up module is used to generate the target PCB board stack-up simulation module based on the input stack-up information of the target PCB board stack;

The PCB fiberglass cloth module is used to generate the target PCB fiberglass cloth simulation module based on the input target PCB fiberglass cloth parameters;

The crosstalk simulation calculation module is used to combine the target PCB board laminate simulation module, the target PCB glass fiber cloth simulation module and the input target wiring parameters to build a PCB signal line crosstalk simulation calculation model, and to measure the PCB signal line crosstalk The simulation calculation model performs crosstalk simulation simulation, and obtains and outputs the crosstalk simulation result.

In order to solve the above technical problems, the present application also provides a PCB trace crosstalk evaluation device, including:

The receiving unit is used to receive the input lamination information of the target PCB board laminate, target PCB glass fiber cloth parameters and target wiring parameters;

a first modeling unit, configured to generate a target PCB board laminate simulation module based on the laminate information of the target PCB board laminate;

The second modeling unit is used to generate a target PCB glass fiber cloth simulation module based on the target PCB glass fiber cloth parameters;

The third modeling unit is used for building a simulation calculation model of PCB signal line crosstalk in combination with the target PCB board laminate simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters;

a crosstalk simulation unit for performing crosstalk simulation on the PCB signal line crosstalk simulation calculation model to obtain a crosstalk simulation result;

The first output unit is configured to output the crosstalk simulation result.

In order to solve the above technical problems, the present application also provides a PCB trace crosstalk evaluation device, including:

memory for storing computer programs;

The processor is configured to execute the computer program, and when the computer program is executed by the processor, the steps of the method for evaluating PCB trace crosstalk according to any one of the above are implemented.

In order to solve the above technical problem, the present application also provides a storage medium on which a computer program is stored, and when the computer program is executed by a processor, implements the steps of the method for evaluating PCB trace crosstalk according to any one of the above.

The PCB trace crosstalk evaluation method provided by the present application receives the lamination information of the target PCB board laminate, the target PCB glass fiber cloth parameters and the target wiring parameters input by the user, and generates the target PCB based on the laminate information of the target PCB board laminate The board laminate simulation module generates the target PCB glass fiber cloth simulation module based on the target PCB glass fiber cloth parameters, so as to combine the target PCB board laminate simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters to automatically build the PCB signal line crosstalk The simulation calculation model is performed, and then the crosstalk simulation simulation is performed on the PCB signal line crosstalk simulation calculation model, and the crosstalk simulation result is obtained and output. It not only reduces the modeling and simulation workload of engineers, but also comprehensively considers the influence of PCB glass fiber effect and PCB board laminate on the crosstalk value between traces, and realizes a fast and accurate evaluation of crosstalk between PCB traces, which can greatly Reduce the risk of engineers choosing routing solutions that cause non-compliant crosstalk values in the PCB design process, and can quickly calculate routing area planning to improve product development quality.

The present application also provides a system, device, device and storage medium for evaluating PCB trace crosstalk, which have the above beneficial effects, and are not repeated here.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present application or the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only For some embodiments of the present application, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without any creative effort.

FIG. 1 is a flowchart of a method for evaluating PCB trace crosstalk provided by an embodiment of the present application;

FIG. 2( a ) is a schematic diagram of the inner layer structure of a simulation calculation model for crosstalk of PCB signal lines according to an embodiment of the present application;

FIG. 2(b) is a schematic diagram of the outer layer structure of a simulation calculation model for crosstalk of PCB signal lines provided by an embodiment of the present application;

3 is a schematic plan view of a crosstalk simulation calculation model of a PCB signal line provided by an embodiment of the present application;

FIG. 4( a ) is a schematic diagram of a first example of PCB signal line crosstalk simulation results provided by an embodiment of the present application;

FIG. 4(b) is a schematic diagram of a second example of PCB signal line crosstalk simulation results provided by the embodiment of the present application;

FIG. 4(c) is a schematic diagram of a third example of a simulation result of PCB signal line crosstalk provided by the embodiment of the present application;

FIG. 4(d) is a schematic diagram of a fourth example of PCB signal line crosstalk simulation results provided by the embodiment of the application;

FIG. 5 is a schematic diagram illustrating a differential trace crosstalk evaluation provided by an embodiment of the present application;

FIG. 6 is a schematic diagram of a wiring design provided by an embodiment of the present application;

7 is a schematic structural diagram of a PCB trace crosstalk assessment system provided by an embodiment of the present application;

FIG. 8 is a schematic structural diagram of a PCB trace crosstalk assessment device provided by an embodiment of the present application;

FIG. 9 is a schematic structural diagram of a device for evaluating PCB trace crosstalk provided by an embodiment of the present application.

Detailed ways

The core of this application is to provide a method, system, device, equipment and storage medium for evaluating PCB trace crosstalk, which can be used to accurately evaluate the crosstalk results brought about by PCB trace design, while reducing the work pressure of PCB engineers and shortening the frequency of electronic products. Development cycle, improve the quality of electronic products.

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

Example 1

FIG. 1 is a flowchart of a method for evaluating PCB trace crosstalk provided by an embodiment of the present application.

As shown in FIG. 1 , the PCB trace crosstalk evaluation method provided by the embodiment of the present application includes:

S101: Receive the input lamination information of the target PCB board laminate, target PCB glass fiber cloth parameters, and target wiring parameters.

S102: Generate a target PCB board laminate simulation module based on the lamination information of the target PCB board laminate, and generate a target PCB glass fiber cloth simulation module based on the target PCB glass fiber cloth parameters.

S103: Combine the target PCB board laminate simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters to build a PCB signal line crosstalk simulation calculation model.

S104: Perform crosstalk simulation on the PCB signal line crosstalk simulation calculation model to obtain a crosstalk simulation result.

S105: Output the crosstalk simulation result.

Most of today's PCB substrates are composed of four main components: Copper Foil, Reinforcement, Epoxy, and Fillers. Among them, the copper foil layer is used for conducting electricity, transmitting signals and dissipating heat. The reinforcing material is used to make the PCB rigid and not easily deformed, and to prevent the internal circuit contacts from being detached due to thermal expansion and contraction. The main materials include kraft paper, glass fiber paper and glass fiber cloth. Resin is related to basic physical properties such as water absorption, heat resistance, etc. The main materials include epoxy resin, phenolic resin, polyester resin, polyphenylene ether, hydrocarbon and polytetrafluoroethylene. Filler material is used to enhance the high temperature resistance of PCB soldering.

（DielectricConstant；Dk）的大小和传输线结构。由于传播时间与介电常数开根号成正比，若使用低介电常数的基板材料可以减少讯号的传播延迟，并可降低导线之间的耦合电容值，进而降低讯号之间的串扰。而信号衰减包含导体损耗与介质损耗，其中导体损耗又包含直流电阻损耗、肌肤效应造成的交流电阻损耗，以及导体粗糙度（Roughness）造成的损耗；而介电损耗则表示讯号在材料中的损耗，通常以Loss Tangent或Df （Dissipation Factor）来描述，使用具有低损耗的介质材料可以降低讯号的衰减而提高信号完整性。Among the electrical characteristics parameters of PCB materials, the propagation speed of signals and the attenuation of signals in high-speed circuits are two very important parameters. The propagation delay of a signal depends on the dielectric constant

(DielectricConstant; Dk) size and transmission line structure. Since the propagation time is proportional to the square root of the dielectric constant, using a substrate material with a low dielectric constant can reduce the propagation delay of the signal and reduce the coupling capacitance between the wires, thereby reducing the crosstalk between the signals. The signal attenuation includes conductor loss and dielectric loss, of which conductor loss includes DC resistance loss, AC resistance loss caused by skin effect, and loss caused by conductor roughness; while dielectric loss represents the loss of the signal in the material , usually described by Loss Tangent or Df (Dissipation Factor), the use of dielectric materials with low loss can reduce signal attenuation and improve signal integrity.

Since the selection of PCB materials and the routing method of signal lines are the main factors affecting the value of crosstalk between signal lines, the present application provides an evaluation system that can automatically build a crosstalk simulation calculation model of PCB signal lines and perform crosstalk simulation. The information of the target PCB board stack-up (also called "stack-up"), the target PCB glass fiber cloth parameters and the target wiring parameters, which are necessary to build the PCB signal line crosstalk simulation calculation model, are input into the evaluation system, and the evaluation system automatically executes the construction. Mode and crosstalk simulation calculation work, output crosstalk simulation results for user reference. By applying the PCB trace crosstalk evaluation method provided in the embodiment of the present application, when the user's design requirement exceeds the design guideline of the chip factory, it can help the user to quickly determine the rationality of the current PCB design, and facilitate the user to perform parameter debugging, so as to quickly obtain the ideal value. PCB design scheme.

In the specific implementation, for step S101, each of the lamination information of the target PCB board laminate, the target PCB glass fiber cloth parameters and the target wiring parameters are set in advance according to the parameters required for constructing the PCB signal line crosstalk simulation calculation model. The parameter type provides the user with an input interface for various parameters. The input interface is provided with input boxes or options for inputting the lamination information of the target PCB board laminate, the target PCB glass fiber cloth parameters, and the target wiring parameters.

For step S102 and step S103, in order to build a simulation calculation model of PCB signal line crosstalk, it is necessary to first establish a target PCB board laminate simulation module and a target PCB glass fiber cloth simulation module. The steps of generating the target PCB board laminate simulation module based on the laminate information of the target PCB board laminate and generating the target PCB glass fiber cloth simulation module based on the target PCB glass fiber cloth parameters can be performed at the same time, or can be performed sequentially, and then combined with the target PCB. The board lamination simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters are used to build the PCB signal line crosstalk simulation calculation model.

In order to build a simulation calculation model of PCB signal line crosstalk according to various parameters, a modeling script can be written in advance through the Python program, and the parameters selected by the user can be output through the Python program to create an HFSS simulation project by running the modeling script, and call Python. The program-controlled HFSS simulation software automatically executes the simulation and outputs the simulation calculation model of PCB signal line crosstalk.

For step S104 and step S105, ADS simulation software can be executed, and all simulation data can be collected by AEL program control, and then sent back to the evaluation system described above, and the crosstalk simulation result obtained by integration is output to the user for viewing, so that the user can judge the crosstalk Whether the simulation results conform to the industrial specifications, if so, the PCB traces can be set according to various parameters of the PCB signal line crosstalk simulation calculation model, and if not, the simulation evaluation is performed again.

In practical applications, other programming languages or simulation software may also be used, which are not limited in this embodiment of the present application.

The PCB trace crosstalk evaluation method provided by the embodiment of the present application receives the lamination information of the target PCB board laminate, the target PCB glass fiber cloth parameters, and the target wiring parameters input by the user, and generates a target based on the laminate information of the target PCB board laminate. PCB board laminate simulation module, based on the target PCB glass fiber cloth parameters to generate the target PCB glass fiber cloth simulation module, so as to combine the target PCB board laminate simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters to automatically build PCB signal lines Crosstalk simulation calculation model, and then carry out crosstalk simulation simulation on the PCB signal line crosstalk simulation calculation model, and obtain and output the crosstalk simulation result. It not only reduces the modeling and simulation workload of engineers, but also comprehensively considers the influence of PCB glass fiber effect and PCB board laminate on the crosstalk value between traces, and realizes a fast and accurate evaluation of crosstalk between PCB traces, which can greatly Reduce the risk of engineers choosing routing solutions that cause non-compliant crosstalk values in the PCB design process, and can quickly calculate routing area planning to improve product development quality.

Embodiment 2

Figure 2(a) is a schematic diagram of the inner layer structure of a simulation calculation model for crosstalk of PCB signal lines provided by an embodiment of the present application; Schematic.

On the basis of the above embodiments, in order to be suitable for practical applications, steps S101 to S103 are further described in this embodiment of the present application.

In step S101, the user provides the stack-up information of the target PCB sheet stack, specifically, the user can input the designed stack-up information of the target PCB sheet stack, or a stack database can be pre-established for the user to select the target PCB sheet stack layer, or pre-establish a sub-layer database for users to input the requirements of the layers and automatically filter the sub-layers and generate the target PCB board layers that meet the requirements of the layers.

Then, the PCB trace crosstalk evaluation method provided in the embodiment of the present application may further include:

Establish a sub-layer database in advance according to the electrical characteristic parameters of PCB materials of different PCB boards;

Then in step S101, the input lamination information of the target PCB board lamination is received, specifically:

Receive the input stackup requirements for the target PCB board stackup;

In step S102, a target PCB board laminate simulation module is generated based on the laminate information of the target PCB board laminate, which specifically includes:

Select the target sub-layer from the sub-layer database according to the layer requirements;

Based on the stack-up information of each target sub-layer, a target PCB board stack-up simulation module that meets the stack-up requirements of the target PCB board stack-up is generated.

Different PCB materials have different electrical characteristics of PCB materials. The PCB laminate structure usually includes a copper foil layer (copper), a prepreg layer (PP, Preprg), and a core layer (core). The electrical characteristic parameters of the PCB material involved can specifically include the PP type of the prepreg layer, the Core type of the core layer, the dielectric constant Dk, the dielectric loss Df, etc. These data determine the impedance, line width and line spacing of the PCB traces. In order to facilitate the user to provide the laminate information of the target PCB board laminate, the electrical characteristic parameters corresponding to different PCB materials can be calculated in advance through the corresponding sub-lamination relational expressions to obtain the laminate information of different sub-layers, and then according to The stack information of different sub-stacks establishes sub-stack databases of different sub-stacks, so that when the user provides stack requirements, the evaluation system can automatically select and obtain the target sub-stack from the sub-stack database, and according to the target sub-stack The stack-up information of the layers generates a target PCB board stack-up simulation module for the target PCB board stack-up that meets the stack-up requirements. Lamination requirements can include required thickness, required line width, required line spacing, etc. The evaluation system automatically selects the target PCB board laminate generated by each target sub-layer from the sub-layer database to meet the requirements of each layer.

The form of the sub-layer database can refer to Table 1.

Table 1 Sub-stack database data table

Among them, "oz" is the weight unit of base copper thickness. "RTF" is double-sided roughened copper foil.

It should be noted that Table 1 is only an optional form of enumerating the sub-layer database, and other forms can also be used to represent, and at the same time, it can include more types of boards and selected signal line types.

Optionally, the user can independently select the target sub-layer from the sub-layer database, and the stack-up information of the target PCB sheet stack may specifically include the stack-up material (for example, S7040G) and the stack-up type (Stackup). Type) (such as using a microstrip line).

Further, a target PCB board laminate simulation module for generating a target PCB board laminate that meets the laminate requirements based on the laminate information of each target sub-layer may specifically include:

When the target sub-layer only includes the inner-layer PCB structure and the outer-layer PCB structure, a single-layer target PCB board stack is generated based on the stack-up information of the inner-layer PCB structure and the stack-up information of the outer-layer PCB structure;

When the target sub-stack includes multiple sub-stack structures, a multi-layer target PCB board stack is generated based on each sub-stack structure.

Since high-speed signal lines usually use differential lines, differential lines are usually routed only on a single layer of the PCB. In a few cases, differential lines are routed across layers through vias. Then, the input interface for the stacking information of the target PCB board stacking provided to the user by the embodiment of the present application may include a common interface for selecting the inner-layer PCB structure and the outer-layer PCB structure of the desired single-layer PCB, and selecting multiple The target sub-stack to generate the extended interface of the multi-layer PCB stack-up of the signal line traces.

In order to facilitate the user to input the target PCB glass fiber cloth parameters, the embodiment of the present application may further include pre-establishing a PCB glass fiber cloth database, and listing the optional PCB glass fiber cloth parameters in the PCB glass fiber cloth database on the input interface for the user to select. Because different types (types) of glass fiber cloth correspond to corresponding specifications, that is, glass fiber cloth types (Glass Type) correspond to glass fiber density (Weave Density), glass resin ratio (Glass/Resin Ratio), relative dielectric constant ( RelativePermittivity) and other parameters, the target PCB glass fiber cloth parameters can only be the type of glass fiber cloth. The types of glass fiber cloth commonly used today are 1078, 1080, 1086, 2116, 1506, 7628 and other models.

Then in step S102, the PCB glass fiber cloth parameters may be provided to the user in the form of Table 2 for the user to select the target PCB glass fiber cloth parameters, and a corresponding target PCB glass fiber cloth simulation module is generated based on the target PCB glass fiber cloth parameters.

Table 2 Target PCB glass fiber cloth parameter table

The target wiring parameters to be input by the user in step S101 may specifically include: signal line broken line angle, total signal line length, signal line segment length, number of signal line segments, signal line impedance value, signal frequency point and signal line spacing. For differential signals, the target wiring parameters may specifically include: Differential Trace Angle, Differential Trace Length, Differential TraceSegment Length, and Differential Trace Segment Number), Differential Trace Ohm, Differential Trace Frequecy and Spacing for Pair to Pair.

When testing the crosstalk value of the differential line, the crosstalk simulation calculation model of the PCB signal line is constructed by the conventional method of establishing the crosstalk simulation calculation model of the three pairs of differential traces. Please refer to Figure 2(a) and Figure 2(b) The corresponding parameters are shown in Tables 3 and 4, respectively.

Table 3 Inner layer structure parameter table of PCB signal line crosstalk simulation calculation model

Table 4. Outer structure parameter table of PCB signal line crosstalk simulation calculation model

In Figure 2(a) and Figure 2(b), "TOP_Roughness" is the top roughness, and "BOT_Roughness" is the bottom roughness.

Taking the relevant parameters of the lamination information of the target PCB board laminate shown in Table 3 and Table 4 as an example, combined with the target PCB glass fiber cloth simulation module generated in the previous step, Figure 2(a) and Figure 2(b) are generated. ) of the PCB signal line crosstalk simulation calculation model.

Based on the PCB trace crosstalk evaluation method provided by the embodiment of the present application, the user needs to input the stacking information of the target PCB board laminate, the signal line broken line angle, the total length of the signal line, the length of the signal line segment, the number of signal line segments, and the impedance of the signal line. Value, signal frequency point, signal line spacing and glass fiber cloth type, the evaluation system can automatically build a PCB signal line crosstalk simulation calculation model, and then conduct a crosstalk simulation test on the PCB signal line crosstalk simulation calculation model to obtain a series of simulations. The evaluated simulation data, and then the crosstalk simulation corresponding to the PCB signal line crosstalk simulation calculation model can be obtained according to the crosstalk value calculation formula corresponding to the lamination information of the target PCB board laminate, the target PCB glass fiber cloth parameters, and the target wiring parameters. The result is output to the user for reference.

、

、

、

、

、

）均可以不同，即支持由用户定制各段折线段的走线参数。It should be noted that the PCB trace crosstalk evaluation method provided in the embodiment of the present application is only described by taking the target wiring parameters input by the user as a set of fixed parameters as an example. Crosstalk simulation. In practical applications, engineers often need to choose irregular routing designs according to design requirements, such as the length of each signal line segment (L1, L2, L3, L4, L5, L6 as shown in Figure 3), each The polyline angle of the segment signal line segment (

,

,

,

,

,

) can be different, that is, users can customize the routing parameters of each polyline segment.

Embodiment 3

3 is a schematic plan view of a simulation calculation model for crosstalk of PCB signal lines provided by an embodiment of the present application; Figure 4(c) is a schematic diagram of a third example of PCB signal line crosstalk simulation results provided by the embodiment of the application; Figure 4(d) is a schematic diagram of the implementation of the application Example 4 is a schematic diagram of a simulation result of PCB signal line crosstalk; FIG. 5 is a schematic diagram illustrating an evaluation of differential line crosstalk provided by an embodiment of the present application.

On the basis of the above embodiments, in order to be suitable for practical applications, the embodiment of the present application takes the signal line as a differential line as an example, and performs crosstalk simulation on the crosstalk simulation calculation model of the PCB signal line in step S104 to obtain the specific crosstalk simulation result. Embodiments are further described.

The crosstalk simulation calculation model of the PCB signal line is constructed by the conventional method of establishing the crosstalk simulation calculation model of the three pairs of differential traces. As shown in Figure 3, three pairs of differential traces D1, D2, and D3 are generated, and the distance between the control differential traces is 10 miles, 20 miles, 30 miles, and 40 miles, respectively, carry out four crosstalk simulation evaluations. For other parameters, please refer to Table 5.

Table 5 Differential line crosstalk simulation evaluation parameter table

Based on the input parameters shown in Table 5, the crosstalk simulation results shown in Fig. 4(a), Fig. 4(b), Fig. 4(c), and Fig. 4(d) are obtained respectively. Crosstalk simulation results calculated from crosstalk data.

Referring to Figure 5, the specific calculation process of the crosstalk simulation results shown in Figure 4(a), Figure 4(b), Figure 4(c), and Figure 4(d) is calculated according to the crosstalk data at each end of the differential line. details as follows:

For differential line D1:

；

;

；

;

For differential line D2 there are:

；

;

；

;

For differential line D3 there are:

；

;

；

;

Then under the current input parameters, the far end alien crosstalk (Far End X-Talk) of the differential line is:

；

;

；

;

The Near End X-Talk of the differential line is:

；

;

；

;

Finally, the integrated alien crosstalk (Power Sum Differential Crosstalk, PSXTalk) is obtained as:

。

.

In step S105 , the calculated integrated alien crosstalk waveforms as shown in FIG. 4( a ), FIG. 4( b ), FIG. 4( c ), and FIG. 4( d ) may be output as the crosstalk simulation result.

Further, in order to facilitate the user to intuitively obtain whether the current routing design conforms to industrial specifications, that is, whether the crosstalk value meets the design requirements, the PCB routing crosstalk evaluation method provided in the embodiment of the present application may further include:

Compare the crosstalk simulation result with the industry standard crosstalk value corresponding to the signal frequency point in the target wiring parameters, and obtain the crosstalk evaluation result;

The crosstalk evaluation result is output.

In practical applications, the allowable value of the alien crosstalk of the differential line corresponds to the signal frequency point, and the corresponding industry standard crosstalk value is determined according to the differential line frequency point input in the above steps. If the crosstalk simulation result is greater than the industry standard crosstalk value, output the crosstalk evaluation result of unqualified trace design; if the crosstalk simulation result is less than the industry standard crosstalk value, output the crosstalk evaluation result of qualified trace design.

It should be noted that the PCB trace crosstalk evaluation method provided in the embodiment of the present application is only described in the crosstalk simulation mode of the differential line. For other types of signal lines, the wiring corresponding to the signal line type can be used to generate simulation. method and the corresponding crosstalk value calculation formula.

Embodiment 4

FIG. 6 is a schematic diagram of a wiring design according to an embodiment of the present application.

On the basis of the above-mentioned embodiment, considering the current situation that the signal rate is constantly increasing, the influence of the PCB glass fiber effect on the crosstalk of the high-speed signal is becoming more and more obvious. PCB glass fiber effect means that when the signal line is 0° or 90° along the direction of glass fiber weaving, the characteristic impedance of the individual positive and negative signals on the differential line will be felt in the microscopic medium structure ( characteristics) vary. For example, in a pair of differential lines, the glass fiber cloth area that one signal line passes through is only glass fiber weaving, and the glass fiber cloth area that the other signal line passes through includes epoxy resin in addition to glass fiber weaving, then the former is affected by glass fiber. The dielectric coefficient of the fiber is mainly affected, and the latter is also affected by the dielectric coefficient of the epoxy resin. The dielectric coefficients of the two are completely different, which will cause the characteristic impedance and transfer time delay between a pair of differential lines. mismatch, which in turn affects the eye diagram. To avoid this effect, when designing PCB traces, avoid the situation where the signal line is parallel or perpendicular to the weaving direction of the PCB fiberglass cloth.

Therefore, in the PCB trace crosstalk evaluation method provided by the embodiment of the present application, in step S103: before building the PCB signal line crosstalk simulation calculation model in combination with the target PCB board laminate simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters ,Also includes:

Determine whether the routing design corresponding to the target routing parameters is affected by the PCB glass fiber effect;

If yes, then enter step S103, combine the target PCB board laminate simulation module, target PCB glass fiber cloth simulation module and target wiring parameters, build the step of PCB signal line crosstalk simulation calculation model;

If not, output trace design non-compliant information.

In the specific implementation, please refer to Figure 6, for different signal frequency points, there are different standards to define the angle and length of the signal line, the square root of the sum of the length of the vertical line parallel to the glass fiber braid and the length of the horizontal line , plus the statistical square tolerance method (Root-Sum-Squares) of the total length of the entire line, to define the total length of the entire line at each frequency point.

Among them, the square root of the sum of the length of the glass fiber braided parallel vertical traces and horizontal traces is as follows:

；

;

Among them, H ₁ , H ₂ , H ₃ ...... are the vertical lengths of the signal line segments, and V ₁ , V ₂ , V ₃ ...... are the horizontal lengths of the signal line segments.

The statistical square tolerance of the total length of the entire route is shown in the following formula:

；

;

Wherein, L ₁ , L ₂ , L ₃ , L ₄ , L ₅ , L ₆ . . . are the lengths of the signal line segments.

Refer to Table 6 for the statistical square tolerance of the total length of the maximum full-length trace corresponding to each signal frequency point.

Table 6 Statistical square tolerance table of the total length of the maximum full-section trace corresponding to each signal frequency point

Before building the PCB signal line crosstalk simulation calculation model, calculate the statistical square tolerance of the total length of the entire line corresponding to the target wiring parameters input by the user according to the above formula, and then evaluate whether the statistical square tolerance of the total length of the entire line does not exceed the user input. Statistical square tolerance of the maximum total length of the entire length of the trace corresponding to the signal frequency point of Step; if not, confirm that the routing design corresponding to the target routing parameters will be affected by the PCB glass fiber effect, output the information that the routing design is not compliant, and prompt the user to change the target routing parameters.

It should be noted that the PCB trace crosstalk evaluation method provided in the embodiment of the present application is only described in the crosstalk simulation mode of the differential line. For other types of signal lines, the corresponding evaluation method of PCB glass fiber effect can be used. Or directly evaluate and confirm that all signal line folding angles (that is, the angle between the signal line and the weaving direction of the PCB glass fiber cloth) are not 0° or 90°.

The PCB trace crosstalk evaluation method provided by the embodiment of the present application ensures the rationality of the trace design and improves the simulation success rate by evaluating whether the trace design is affected by the PCB glass fiber effect before building a simulation calculation model of PCB signal trace crosstalk. .

Various embodiments corresponding to the PCB trace crosstalk evaluation method are described in detail above. On this basis, the present application also discloses a PCB trace crosstalk evaluation system, device, equipment and storage medium corresponding to the above method.

Embodiment 5

FIG. 7 is a schematic structural diagram of a PCB trace crosstalk evaluation system provided by an embodiment of the present application.

As shown in FIG. 7 , the PCB trace crosstalk evaluation system provided by the embodiment of the present application includes:

The PCB stacking module 701 is used to generate a target PCB stacking simulation module based on the input stacking information of the target PCB stacking;

The PCB glass fiber cloth module 702 is used to generate a target PCB glass fiber cloth simulation module based on the input target PCB glass fiber cloth parameters;

The crosstalk simulation calculation module 703 is used to combine the target PCB board laminate simulation module, the target PCB glass fiber cloth simulation module and the input target wiring parameters to build a PCB signal line crosstalk simulation calculation model, and perform crosstalk on the PCB signal line crosstalk simulation calculation model. Simulate the simulation, get and output the crosstalk simulation result.

Further, the PCB trace crosstalk evaluation system provided in the embodiment of the present application further includes:

The sub-layer database module is used to establish a sub-layer database in advance according to the electrical characteristic parameters of PCB materials of different PCB boards;

Correspondingly, the PCB stacking module 701 generates a target PCB sheet stacking simulation module based on the input stacking information of the target PCB sheet stacking, which specifically includes:

Select the target sub-stack from the sub-stack database of the sub-stack database module based on the input stack-up requirements for the target PCB board stack;

Based on the stack-up information of each target sub-layer, a target PCB board stack-up simulation module that meets the stack-up requirements of the target PCB board stack-up is generated.

Further, the PCB trace crosstalk evaluation system provided in the embodiment of the present application further includes:

The trace design evaluation module is used to determine the corresponding parameters of the target wiring before building the crosstalk simulation calculation model of the PCB signal line before the crosstalk simulation calculation module 703 combines the target PCB board laminate simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters. Whether the routing design is affected by the PCB glass fiber effect; if so, the crosstalk simulation calculation module 703 will perform the crosstalk simulation of the PCB signal line by combining the target PCB board laminate simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters. Steps to compute the model; if not, output the trace design non-compliance message.

Further, the PCB trace crosstalk evaluation system provided in the embodiment of the present application further includes:

The crosstalk evaluation module is used to compare the crosstalk simulation result with the industry standard crosstalk value corresponding to the signal frequency point in the target wiring parameters, and obtain and output the crosstalk evaluation result.

Since the embodiments of the system part correspond to the embodiments of the method part, for the embodiments of the system part, please refer to the description of the embodiments of the method part, which will not be repeated here.

Embodiment 6

FIG. 8 is a schematic structural diagram of an apparatus for evaluating crosstalk of PCB traces provided by an embodiment of the present application.

As shown in FIG. 8 , the PCB trace crosstalk evaluation device provided by the embodiment of the present application includes:

The receiving unit 801 is used to receive the input lamination information of the target PCB board laminate, target PCB glass fiber cloth parameters and target wiring parameters;

The first modeling unit 802 is configured to generate a target PCB board laminate simulation module based on the laminate information of the target PCB board laminate;

The second modeling unit 803 is configured to generate a target PCB glass fiber cloth simulation module based on the target PCB glass fiber cloth parameters;

The third modeling unit 804 is used for building a simulation calculation model of PCB signal line crosstalk in combination with the target PCB board laminate simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters;

A crosstalk simulation unit 805, configured to perform crosstalk simulation simulation on the PCB signal line crosstalk simulation calculation model to obtain a crosstalk simulation result;

The first output unit 806 is configured to output the crosstalk simulation result.

Further, the PCB trace crosstalk evaluation device provided in the embodiment of the present application may further include:

The sub-layer data unit is used to establish a sub-layer database in advance according to the electrical characteristic parameters of the PCB materials of different PCB boards;

Then the receiving unit 801 receives the input lamination information of the target PCB board lamination, specifically:

Receive the input stackup requirements for the target PCB board stackup;

The first modeling unit 802 generates a target PCB board laminate simulation module based on the laminate information of the target PCB board laminate, which specifically includes:

Select the target sub-layer from the sub-layer database according to the layer requirements;

Based on the stack-up information of each target sub-layer, a target PCB board stack-up simulation module that meets the stack-up requirements of the target PCB board stack-up is generated.

Further, the PCB trace crosstalk evaluation device provided in the embodiment of the present application may further include:

The judgment unit is used for judging the path corresponding to the target wiring parameters before the third modeling unit 804 combines the target PCB board laminate simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters to build the PCB signal line crosstalk simulation calculation model. Whether the line design is affected by the PCB glass fiber effect, if so, enter the third modeling unit 804 to execute the combination of the target PCB board laminate simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters to build a PCB signal line crosstalk simulation calculation the steps of the model; if not, enter the second output unit;

The second output unit is used to output the information that the design of the trace is not compliant.

Further, the PCB trace crosstalk evaluation device provided in the embodiment of the present application may further include:

The comparison unit is used to compare the crosstalk simulation result with the industry standard crosstalk value corresponding to the signal frequency point in the target wiring parameters, and obtain the crosstalk evaluation result;

The third output unit is used for outputting the crosstalk evaluation result.

Since the embodiment of the apparatus part corresponds to the embodiment of the method part, for the embodiment of the apparatus part, please refer to the description of the embodiment of the method part, which will not be repeated here.

Embodiment 7

FIG. 9 is a schematic structural diagram of a device for evaluating PCB trace crosstalk provided by an embodiment of the present application.

As shown in FIG. 9 , the PCB trace crosstalk evaluation device provided in the embodiment of the present application includes:

memory 910 for storing computer programs 911;

The processor 920 is configured to execute the computer program 911. When the computer program 911 is executed by the processor 920, the steps of the PCB trace crosstalk assessment method described in any one of the foregoing embodiments are implemented.

The processor 920 may include one or more processing cores, such as a 3-core processor, an 8-core processor, and the like. The processor 920 may be implemented in at least one hardware form among digital signal processing (DSP), field-programmable gate array (FPGA), and programmable logic array (PLA). The processor 920 may also include a main processor and a coprocessor. The main processor is a processor used to process data in the wake-up state, also called a central processing unit (CPU); the coprocessor is used for processing data in the wake-up state. A low-power processor that processes data in a standby state. In some embodiments, the processor 920 may be integrated with a graphics processing unit (GPU), and the GPU is used for rendering and drawing the content that needs to be displayed on the display screen. In some embodiments, the processor 920 may further include an artificial intelligence (Artificial Intelligence) processor for processing computing operations related to machine learning.

Memory 910 may include one or more storage media, which may be non-transitory. Memory 910 may also include high-speed random access memory, as well as non-volatile memory, such as one or more disk storage devices, flash storage devices. In this embodiment, the memory 910 is at least used to store the following computer program 911, where, after the computer program 911 is loaded and executed by the processor 920, it can implement the relevant steps in the PCB trace crosstalk assessment method disclosed in any of the foregoing embodiments . In addition, the resources stored in the memory 910 may also include an operating system 912 and data 913, etc., and the storage mode may be short-term storage or permanent storage. The operating system 912 may be Windows. The data 913 may include, but is not limited to, the data involved in the above methods.

In some embodiments, the PCB trace crosstalk evaluation device may further include a display screen 930 , a power supply 940 , a communication interface 950 , an input and output interface 960 , a sensor 970 and a communication bus 980 .

Those skilled in the art can understand that the structure shown in FIG. 9 does not constitute a limitation to the PCB trace crosstalk evaluation equipment, and may include more or less components than those shown.

The PCB trace crosstalk evaluation device provided by the embodiment of the present application includes a memory and a processor. When the processor executes a program stored in the memory, the above-mentioned PCB trace crosstalk evaluation method can be implemented, and the effect is the same as above.

Embodiment 8

It should be noted that the above-described system, apparatus, and device embodiments are only illustrative. For example, the division of modules is only a logical function division. In actual implementation, there may be other division methods, such as multiple modules. Or components may be combined or may be integrated into another system, or some features may be omitted, or not implemented. On the other hand, the shown or discussed mutual coupling or direct coupling or communication connection may be through some interfaces, indirect coupling or communication connection of devices or modules, and may be in electrical, mechanical or other forms. Modules described as separate components may or may not be physically separated, and components shown as modules may or may not be physical modules, that is, they may be located in one place, or may be distributed to multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution in this embodiment.

In addition, each functional module in each embodiment of the present application may be integrated into one processing module, or each module may exist physically alone, or two or more modules may be integrated into one module. The above-mentioned integrated modules can be implemented in the form of hardware, and can also be implemented in the form of software function modules.

If the integrated modules are implemented in the form of software functional modules and sold or used as independent products, they may be stored in a storage medium. Based on this understanding, the technical solutions of the present application can be embodied in the form of software products in essence, or the parts that contribute to the prior art, or all or part of the technical solutions, and the computer software products are stored in a storage medium , execute all or part of the steps of the methods described in the various embodiments of the present application.

To this end, an embodiment of the present application further provides a storage medium, where a computer program is stored on the storage medium, and when the computer program is executed by a processor, steps such as a method for evaluating PCB trace crosstalk are implemented.

The storage medium may include: a U disk, a removable hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and other mediums that can store program codes.

The computer program included in the storage medium provided in this embodiment can, when executed by the processor, implement the steps of the above-described method for evaluating PCB trace crosstalk, and the effects are the same as above.

A method, system, device, device and storage medium for evaluating PCB trace crosstalk provided by the present application have been described above in detail. The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same and similar parts between the various embodiments can be referred to each other. As for the system, device, device and storage medium disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple, and for related parts, please refer to the description of the method section. It should be pointed out that for those of ordinary skill in the art, without departing from the principles of the present application, several improvements and modifications can also be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

It should also be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply these entities or operations. There is no such actual relationship or sequence between operations. Moreover, the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article or device that includes a list of elements includes not only those elements, but also includes not explicitly listed or other elements inherent to such a process, method, article or apparatus. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in a process, method, article or apparatus that includes the element.

Claims (9)

1. A PCB trace crosstalk evaluation method is characterized by comprising the following steps:

receiving input lamination information of target PCB lamination, target PCB glass fiber cloth parameters and target wiring parameters;

generating a target PCB laminated simulation module based on the laminated information of the target PCB, and generating a target PCB fiberglass cloth simulation module based on the target PCB fiberglass cloth parameters;

combining the target PCB plate lamination simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters to build a PCB signal line crosstalk simulation calculation model;

carrying out crosstalk simulation on the PCB signal wire crosstalk simulation calculation model to obtain a crosstalk simulation result;

outputting the crosstalk simulation result;

the target PCB glass fiber cloth parameter is the type of the glass fiber cloth specifically;

before the combining the target PCB plate lamination simulation module, the target PCB fiberglass cloth simulation module and the target wiring parameters and building a PCB signal line crosstalk simulation calculation model, the method further comprises the following steps:

judging whether the routing design corresponding to the target routing parameters is influenced by the PCB glass fiber effect; if so, the step of building a PCB signal wire crosstalk simulation calculation model by combining the target PCB plate lamination simulation module, the target PCB fiberglass cloth simulation module and the target wiring parameters is carried out; if not, outputting the information that the routing design is not compliant;

wherein, judge whether the line design that the target wiring parameter corresponds receives the fine effect influence of PCB glass, specifically include:

according to

Calculating the total length statistical square tolerance of the whole-section routing corresponding to the target wiring parameter;

if the total length statistical square tolerance of the full-section wiring is larger than the maximum total length statistical square tolerance of the full-section wiring corresponding to the input signal frequency point, determining that the wiring design corresponding to the target wiring parameter is influenced by the PCB glass fiber effect;

if the total length statistical square tolerance of the full-section wiring is not greater than the maximum total length statistical square tolerance of the full-section wiring corresponding to the input signal frequency point, determining that the wiring design corresponding to the target wiring parameter is not influenced by the PCB glass fiber effect;

wherein,L ₁ 、L ₂ 、L ₃ 、L ₄ 、L ₅ 、L ₆ … … is the length of signal line segment。

2. The PCB trace crosstalk evaluation method of claim 1, further comprising:

establishing a sub-laminated database in advance according to the PCB material electrical characteristic parameters of different PCB plates;

receiving input lamination information of the target PCB lamination, specifically:

receiving input lamination requirements for lamination of the target PCB plate;

the generating of the target PCB lamination simulation module based on the lamination information of the target PCB lamination specifically includes:

selecting a target sub-lamination from the sub-lamination database according to the lamination requirement;

and generating the target PCB lamination simulation module of the target PCB lamination meeting the lamination requirement based on the lamination information of each target sub lamination.

3. The method for evaluating crosstalk between PCB traces according to claim 2, wherein the generating the target PCB board lamination simulation module of the target PCB board lamination that meets the lamination requirement based on the lamination information of each target sub-lamination specifically comprises:

when the target sub-lamination only comprises an inner layer PCB structure and an outer layer PCB structure, generating a single-layer target PCB lamination based on lamination information of the inner layer PCB structure and lamination information of the outer layer PCB structure;

when the target sub-laminate includes a multi-layer sub-laminate structure, generating a multi-layer target PCB board laminate based on each of the sub-laminate structures.

4. The PCB trace crosstalk evaluation method of claim 1, wherein the target routing parameters specifically include: the device comprises a signal line broken line angle, a total signal line length, a signal line segment number, a signal line impedance value, a signal frequency point and a signal line interval.

5. The PCB trace crosstalk evaluation method of claim 1, further comprising:

comparing the crosstalk simulation result with an industrial standard crosstalk value corresponding to the signal frequency point in the target wiring parameter to obtain a crosstalk evaluation result;

and outputting the crosstalk evaluation result.

6. A PCB trace crosstalk evaluation device, comprising:

the receiving unit is used for receiving input lamination information of target PCB lamination, target PCB glass fiber cloth parameters and target wiring parameters;

the first modeling unit is used for generating a target PCB lamination simulation module based on lamination information of the target PCB lamination;

the second modeling unit is used for generating a target PCB glass fiber cloth simulation module based on the target PCB glass fiber cloth parameters;

the third modeling unit is used for building a PCB signal line crosstalk simulation calculation model by combining the target PCB plate lamination simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameters;

the crosstalk simulation unit is used for carrying out crosstalk simulation on the PCB signal wire crosstalk simulation calculation model to obtain a crosstalk simulation result;

the first output unit is used for outputting the crosstalk simulation result;

a judging unit, configured to judge whether a routing design corresponding to a target wiring parameter is affected by a PCB glass fiber effect before the third modeling unit combines the target PCB board lamination simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameter to build a PCB signal line crosstalk simulation calculation model, and if so, enter the third modeling unit to execute the step of combining the target PCB board lamination simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameter to build a PCB signal line crosstalk simulation calculation model; if not, entering a second output unit;

the second output unit is used for outputting information that the wiring design is not compliant;

wherein, judge whether the line design that the target wiring parameter corresponds receives the fine effect influence of PCB glass, specifically include:

according to

Calculating the total length statistical square tolerance of the whole-section routing corresponding to the target wiring parameter;

if the total length statistical square tolerance of the full-section wiring is larger than the maximum total length statistical square tolerance of the full-section wiring corresponding to the input signal frequency point, determining that the wiring design corresponding to the target wiring parameter is influenced by the PCB glass fiber effect;

if the total length statistical square tolerance of the full-section wiring is not greater than the maximum total length statistical square tolerance of the full-section wiring corresponding to the input signal frequency point, determining that the wiring design corresponding to the target wiring parameter is not influenced by the PCB glass fiber effect;

wherein,L ₁ 、L ₂ 、L ₃ 、L ₄ 、L ₅ 、L ₆ … … is the length of signal line segment; the target PCB glass fiber cloth parameters are the types of the glass fiber cloth.

7. A PCB trace crosstalk evaluation system, comprising:

the PCB lamination module is used for generating a target PCB lamination simulation module based on the input lamination information of the target PCB lamination;

the PCB glass fiber cloth module is used for generating a target PCB glass fiber cloth simulation module based on the input target PCB glass fiber cloth parameters;

the crosstalk simulation calculation module is used for combining the target PCB plate lamination simulation module, the target PCB glass fiber cloth simulation module and input target wiring parameters to build a PCB signal wire crosstalk simulation calculation model, and performing crosstalk simulation on the PCB signal wire crosstalk simulation calculation model to obtain and output a crosstalk simulation result;

the wiring design evaluation module is used for judging whether the wiring design corresponding to the target wiring parameter is influenced by the PCB glass fiber effect or not before the crosstalk simulation calculation module is combined with the target PCB laminated simulation module, the target PCB glass fiber cloth simulation module and the target wiring parameter to build a PCB signal wire crosstalk simulation calculation model; if yes, the crosstalk simulation calculation module executes the combination target PCB plate lamination simulation module, the target PCB fiberglass cloth simulation module and the target wiring parameters to build a PCB signal wire crosstalk simulation calculation model; if not, outputting the information that the wiring design is not in compliance;

wherein, judge whether the line design that the target wiring parameter corresponds receives the fine effect influence of PCB glass, specifically include:

according to

Calculating the total length statistical square tolerance of the whole-section routing corresponding to the target wiring parameter;

if the total length statistical square tolerance of the full-section wiring is larger than the maximum total length statistical square tolerance of the full-section wiring corresponding to the input signal frequency point, determining that the wiring design corresponding to the target wiring parameter is influenced by the PCB glass fiber effect;

if the total length statistical square tolerance of the full-section wires is not greater than the maximum total length statistical square tolerance of the full-section wires corresponding to the input signal frequency points, determining that the wire design corresponding to the target wiring parameters is not influenced by the PCB glass fiber effect;

wherein,L ₁ 、L ₂ 、L ₃ 、L ₄ 、L ₅ 、L ₆ … … is the length of signal line segment; the target PCB glass fiber cloth parameters are the types of the glass fiber cloth.

8. A PCB trace crosstalk evaluation device, comprising:

a memory for storing a computer program;

a processor for executing the computer program, wherein the computer program when executed by the processor implements the steps of the PCB trace crosstalk evaluation method according to any one of claims 1 to 5.

9. A storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps of the PCB trace crosstalk evaluation method according to any one of claims 1 to 5.

Images