CN108303635B - Test board for verifying electrical performance of PCB material - Google Patents
Test board for verifying electrical performance of PCB material Download PDFInfo
- Publication number
- CN108303635B CN108303635B CN201711479908.5A CN201711479908A CN108303635B CN 108303635 B CN108303635 B CN 108303635B CN 201711479908 A CN201711479908 A CN 201711479908A CN 108303635 B CN108303635 B CN 108303635B
- Authority
- CN
- China
- Prior art keywords
- layer
- test
- glass fiber
- fiber cloth
- testing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 131
- 239000000463 material Substances 0.000 title claims abstract description 20
- 239000004744 fabric Substances 0.000 claims abstract description 85
- 239000003365 glass fiber Substances 0.000 claims abstract description 64
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 29
- 239000011889 copper foil Substances 0.000 claims description 28
- 239000011295 pitch Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 10
- 239000000835 fiber Substances 0.000 description 9
- 101100421503 Arabidopsis thaliana SIGA gene Proteins 0.000 description 7
- 101100042610 Arabidopsis thaliana SIGB gene Proteins 0.000 description 7
- 239000011152 fibreglass Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 101100042615 Arabidopsis thaliana SIGD gene Proteins 0.000 description 3
- 101100489713 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND1 gene Proteins 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 101100042626 Arabidopsis thaliana SIGF gene Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a test board for verifying the electrical performance of a PCB material, which comprises: a first glass fiber cloth layer is arranged between the test units and two adjacent test units; wherein each test cell comprises: the testing device comprises a grounding layer and a signal layer which are arranged in a stacking mode, wherein the grounding layer is arranged above the signal layer, a second glass fiber cloth layer is arranged between the grounding layer and the signal layer, and at least two testing units with different specifications of glass fiber cloth in the second glass fiber cloth layer are arranged in the plurality of testing units. The test board designed by the routing layer can determine factors influencing the electrical performance of the PCB through testing, so that the PCB is designed according to a test result.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board) materials, in particular to a test board for verifying the electrical performance of a PCB material.
Background
Signals transmitted by a Printed Circuit Board (PCB) tend to be faster, and especially, in the development of a 100G network, a PCB routing needs to realize a transmission rate of 25Gbps (bandwidth transmission rate) or more, and a PCB material medium model cannot be analyzed by a uniform model at this time.
In addition, the PCB is formed by laminating an original plate, a prepreg and copper foil. The original board, also called a copper-clad substrate, generally comprises a copper layer, fully cured resin and glass fiber cloth, wherein the glass fiber cloth is arranged in the middle, the fully cured resin is respectively arranged on the upper surface and the lower surface of the glass fiber cloth, and a copper foil is arranged on the other surface of the fully cured resin. In addition, the prepreg is composed of prepreg resin and glass fibers, wherein the glass fibers are arranged in the middle, the prepreg resin is arranged on the upper surface and the lower surface of the glass fibers, the prepreg can be divided into 106, 1080, 1087, 1035, 2116, 3313 and the like according to the type of the glass fiber cloth, the glass fibers are mixed in the resin in an interweaving way, and the dielectric constant of a PCB material medium is changed due to the gap between the warp and the weft of the glass fibers, which is the influence of the glass fiber effect of the material on the high-speed signal PCB transmission. In addition, the copper foil can be classified into an electroplated copper foil and an expanded copper foil according to the processing mode, and the thickness of the copper foil commonly used for the server board card is 0.5oz (ounce, which is a weight unit in this case, and 1oz is equal to 28.3495 g), 1oz and 2 oz.
In addition, in high-speed signal transmission, the influence of glass fiber effects such as different types of glass fiber cloth and routing angles in the same glass fiber cloth on signals is not negligible, the Skew (Skew distortion) of differential signals caused by the glass fiber effects is reflected to a time domain to be the influence of the eye height and the eye width of an eye pattern, and meanwhile, the influence waveforms of the Skew on the signals are shown in fig. 1a to 1c, and V isdiff＝D+-D-，Vcomm＝(D++D-)/2，VdiffRepresenting a differential voltage, D+Is at a high level, D-At a low level, VcommRepresenting the common mode voltage. However, in the prior art, there is no testing tool for the signal caused by the glass fiber effect, which is different types of glass fiber cloth and the routing angle in the same glass fiber cloth.
An effective solution to the problems in the related art has not been proposed yet.
Disclosure of Invention
In order to solve the problems in the related art, the invention provides a test board for verifying the electrical performance of a PCB material.
The technical scheme of the invention is realized as follows:
the technical scheme adopted by the invention for solving the technical problems is as follows: constructing a test board for verifying the electrical properties of a PCB material, the test board comprising: a first glass fiber cloth layer is arranged between the test units and two adjacent test units; wherein each test cell comprises: the testing device comprises a grounding layer and a signal layer which are arranged in a stacking mode, wherein the grounding layer is arranged above the signal layer, a second glass fiber cloth layer is arranged between the grounding layer and the signal layer, and at least two testing units with different specifications of glass fiber cloth in the second glass fiber cloth layer are arranged in the plurality of testing units.
According to one embodiment of the invention, a test board comprises: the testing device comprises a first testing unit, wherein a first wire and a second wire are arranged on a signal layer in the first testing unit, and an extension line of the first wire is intersected with an extension line of the second wire.
According to one embodiment of the invention, an angle between an extension of the first trace and an extension of the second trace is 45 °.
According to an embodiment of the present invention, the first trace and the second trace each include: many parallel arrangement's straight line is walked, and the both ends of every straight line are walked line and SMA interface connection through the curvilinear figure.
According to one embodiment of the invention, the pitches between two adjacent linear traces are equal.
According to one embodiment of the invention, a test board comprises: the second testing unit and the third testing unit are different in specification, wherein the second glass fiber cloth layer in the second testing unit and the glass fiber cloth layer in the second glass fiber cloth layer in the third testing unit are different in specification.
According to one embodiment of the present invention, the specifications of the glass fiber cloth of the first glass fiber cloth layer disposed adjacent to the signal layer in the second test unit and the first glass fiber cloth layer disposed adjacent to the signal layer in the third test unit are different.
According to one embodiment of the present invention, the material of the signal layer and the material of the ground layer are both copper foils.
According to one embodiment of the invention, a test board comprises: the thickness of the copper foil in the fourth test unit is different from that in the fifth test unit.
The invention has the beneficial technical effects that:
according to the test board designed by the routing layer, factors influencing the electrical performance of the PCB can be determined through testing, and the PCB is designed according to a test result.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIGS. 1a to 1c are schematic diagrams of the effect of skew distortion on a signal in the prior art;
FIG. 2 is a layout diagram of traces in a SIG2 layer according to an embodiment of the invention;
figure 3 is a connection schematic diagram of a trace and an SMA interface according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.
According to an embodiment of the present invention, there is provided a test board for verifying electrical properties of a PCB material.
The technical scheme adopted by the invention for solving the technical problems is as follows: constructing a test board for verifying the electrical properties of a PCB material, the test board comprising: a first glass fiber cloth layer is arranged between the test units and two adjacent test units; wherein each test cell comprises: the testing device comprises a grounding layer and a signal layer which are arranged in a stacking mode, wherein the grounding layer is arranged above the signal layer, a second glass fiber cloth layer is arranged between the grounding layer and the signal layer, and at least two testing units with different specifications of glass fiber cloth in the second glass fiber cloth layer are arranged in the plurality of testing units.
By means of the technical scheme, the test board designed by the routing layer can determine factors influencing the electrical performance of the PCB through testing, and the PCB is designed according to the test result.
According to one embodiment of the invention, a test board comprises: the testing device comprises a first testing unit, wherein a first wire and a second wire are arranged on a signal layer in the first testing unit, and an extension line of the first wire is intersected with an extension line of the second wire.
According to one embodiment of the invention, an angle between an extension of the first trace and an extension of the second trace is 45 °.
According to an embodiment of the present invention, the first trace and the second trace each include: many parallel arrangement's straight line is walked, and the both ends of every straight line are walked line and SMA interface connection through the curvilinear figure.
According to one embodiment of the invention, the pitches between two adjacent linear traces are equal.
According to one embodiment of the invention, a test board comprises: the second testing unit and the third testing unit are different in specification, wherein the second glass fiber cloth layer in the second testing unit and the glass fiber cloth layer in the second glass fiber cloth layer in the third testing unit are different in specification.
According to one embodiment of the present invention, the specifications of the glass fiber cloth of the first glass fiber cloth layer disposed adjacent to the signal layer in the second test unit and the first glass fiber cloth layer disposed adjacent to the signal layer in the third test unit are different.
According to one embodiment of the present invention, the material of the signal layer and the material of the ground layer are both copper foils.
According to one embodiment of the invention, a test board comprises: the thickness of the copper foil in the fourth test unit is different from that in the fifth test unit.
The present invention will be described in detail with reference to specific examples for better describing the technical solutions of the present invention.
The existing test board does not influence the signal integrity of the high-speed PCB routing by the glass fiber effect caused by different glass fiber fabrics at different routing angles under a specific routing interval according to the verification of a fabric density system of different glass fiber fabrics. However, the signal rate of the test board in the present invention is 25Gbps, and the type of the fiber cloth is Megtron6G, the material of the Megtron6G includes 1080, 2116, 1078, 1035 and other types of fiber cloth, meanwhile, the test board in the present invention mainly uses four types of commonly used glass fiber cloth, 1080, 2116, 1078, 1035, and in addition, the test board is designed as routing layer, and the test board is 14 layers, and the thickness of the test board is 2.9mm, and the copper Foil selected for the outermost two layers of the test board is STD (or standard electrolytic copper Foil), and the copper Foil of the inner layer uses RTF copper Foil (Reverse Treated copper Foil), see table 1 below in particular.
TABLE 1
As shown in table 1, the routing layer design of the test board is 14 layers, wherein the routing layer design is generally a layer connecting each other through via holes, buried holes, blind holes, and the test board includes: 7 test units, specifically, the first test unit includes: GND1 (or ground plane 1, where GND denotes a ground plane, and hereinafter, for convenience of description, the same shall not be repeated) and SIG2 (or signal plane 2, where SIG denotes a signal plane, and hereinafter, for convenience of description, the same shall be repeated), the second test unit including: GND3 and SIG4, the third test unit includes: GND5 and SIG6, the fourth test unit includes: GND7 and SIG8, the fifth test unit includes: GND9 and SIG10, the sixth test unit includes: GND11 and SIG12, the seventh test unit includes: GND13 and SIG 14. Wherein a second fiberglass cloth layer is also disposed between the signal layer and the ground layer in each test cell, e.g., according to one embodiment of the present invention, a preprag (or second fiberglass cloth) layer is disposed between GND1 and SIG2 in the first test cell. In addition, a first fiberglass cloth layer is also disposed between each test cell, for example, a Core (or first fiberglass cloth) layer is disposed between the first test cell and the second test cell, or between SIG2 and GND 3. In addition, referring to table 1, it was confirmed that GND1 and SIG2 were both composed of STD of 1/2oz and Plating (plated metal) provided on the outer side of the STD. Meanwhile, X2 in table 1 indicates two glass cloths or core plate types.
The following tests were performed with the designed 14-layer test board, specifically:
1. verifying that different wiring angles are influenced by the distribution of warp and weft of glass fiber cloth
Signal traces (or traces) are disposed in each signal layer, and a test is performed by selecting traces in the SIG2 layer of the first test unit, as shown in fig. 3, in the SIG2 layer, traces 11, 12, 21, and 22 are disposed, and in addition, the four traces are all formed by a plurality of linear traces 31 disposed in parallel, for example, according to an embodiment of the present invention, the four traces are formed by 5 linear traces 31 disposed in parallel, and in addition, for clarity of description, the traces are represented by only one rectangular pattern in fig. 2, and it should be understood that each trace is disposed by a specific shape similar to the trace in fig. 3. In addition, the extension line of the trace 11 and the extension line of the trace 12 intersect, and the extension line of the trace 11 and the extension line of the trace 12 are 45 °, that is, by rotating the trace 11 by 45 °, the trace 21 and the trace 22 are similar and will not be described here.
In addition, as shown in fig. 3, the four wires are all formed by 5 linear wires 31 arranged in parallel, and two ends of each linear wire 31 are connected to the SMA interface 32 through curved wires 33, and the distance between two adjacent linear wires 31 is equal, and it is understood that the geometric size of each wire may be set according to actual requirements, for example, the length of the wire 11 is 3inch, the distance between two adjacent linear wires 31 is 63.843 mils, and the distance from each linear wire 31 to the SMA interface 32 is 200 mils, which is not limited in the present invention.
In addition, as shown in fig. 2 and fig. 3, the trace 11, the trace 12, the trace 21, and the trace 22 are all set according to the following requirements: walk 11, walk line 12, walk line 21, walk line 22 and all include 5 straight line forms and walk line 31, and the impedance of 5 straight line forms of every group walk line 31 is 50ohm (ohm), in addition, according to the fabric density (warp direction x latitudinal direction) calculation of 1080 model cloth, 5 straight line forms the interval between the line 31 and strictly controls 63.843mil, and straight line forms line 31 length and all controls 3inch, and SMA interface 32 is qualified for the next round of competitions the part about each control 500mil and rotatory 20 and is qualified for the next round of competitions, and the curve is walked to the kink. Then, based on the above setting, the SMA interface 32 is connected to a VNA (Vector Network Analyzer) for testing insertion loss, return loss, and impedance.
In addition, by verifying different wiring angles of the same glass fiber cloth, the influence of the glass fiber cloth on the impedance, the loss and the transmission rate of a test line is verified, so that according to the test results of multiple times, the influence of different wiring angles (namely the rotation angle problem of the prepreg in the laminating process) of the same glass fiber cloth on the electrical performance is realized.
2. Verifying different types of glass fiber cloth
In this embodiment, the effect of the type 2116 fabric cloth on the type 1035 fabric cloth can be determined from the two sets by the first fabric cloth layer (Core2116X2) and the second fabric cloth layer (preprg 2116X2) on both sides of SIG4 in the second test unit, and the first fabric cloth layer (Core 1035X2) and the second fabric cloth layer (preprg 1035X2) on both sides of SIG8 in the fourth test unit.
In addition, the effect of the type 2116 fiber cloth on the type 1078 fiber cloth can also be determined from the two groups by the first fiber cloth layer (Core2116X2) and the second fiber cloth layer (prep 2116X2) on both sides of SIG4 in the second test cell and the first fiber layer (Core1078X2) and the second fiber cloth layer (prep 1078X2) on both sides of SIG10 in the fifth test cell.
In addition, the second test unit and the fourth test unit are different only in the model of the fiber cloth, and other setting parameters are the same, so that other interference information is avoided.
In addition, different fabric densities and different gel contents of different types of common glass fiber cloth 2116, 1035 and 1078 have influences on the impedance, loss and transmission rate of the test line, so that the type of the glass fiber cloth meeting the electrical performance is selected by integrating factors such as thickness, process, loss, line width of wiring and the like in the design of the high-speed board card.
3. Verifying the effects of different copper foil thicknesses
On the premise that the glass fiber cloth is 1078 cloth and the copper foil type is RFT copper foil, the influence of 0.5oz copper foil and 1oz copper foil is verified, wherein the thickness of the copper foil of the verified 1078 glass fiber cloth of SIG10 is 0.5oz, and the thickness of the copper foil of the verified 1078 glass fiber cloth of SIG12 is 1 oz.
In addition, on the premise of determining other factors, the influence of the copper foils of 0.5oz and 1oz on the loss of the test wire is obtained, and on the premise that the plate thickness, the power supply and the lamination process meet the requirements, the conclusion is utilized to select the proper copper foil thickness.
In addition, the wire outgoing part of the SMA interface 32 determines the size of the back-drilling layer and the hollowed back-drilling layer of the reverse welding disc through HFSS model simulation optimization, and the impedance reflection of the discontinuous structure at the joint is controlled to be the lowest.
In summary, with the above-mentioned technical solution of the present invention, the test board designed by the routing layer can verify that different routing angles are affected by the warp and weft distribution of the fiberglass cloth, different types of fiberglass cloth, and different thicknesses of the copper foil.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (8)
1. A test board for verifying the electrical properties of a PCB material, comprising: the test device comprises a plurality of test units designed as routing layers, and a first glass fiber cloth layer is arranged between every two adjacent test units;
wherein each of the test units comprises: the testing device comprises a grounding layer and a signal layer which are arranged in a laminated manner, wherein the grounding layer is arranged above the signal layer, a second glass fiber cloth layer is also arranged between the grounding layer and the signal layer, and at least two testing units with different specifications of glass fiber cloth in the second glass fiber cloth layer are arranged in a plurality of testing units;
the test plate comprises: the testing device comprises a first testing unit, wherein a first wire and a second wire are arranged on a signal layer in the first testing unit, and an extension line of the first wire is intersected with an extension line of the second wire.
2. The test board according to claim 1, wherein an angle between an extension of the first trace and an extension of the second trace is 45 °.
3. The test plate of claim 1, wherein the first trace and the second trace each comprise: the linear wires are arranged in parallel, and two ends of each linear wire are connected with the SMA interface through the curved wires.
4. The test plate of claim 3, wherein the pitches between two adjacent linear traces are equal.
5. The test plate of claim 1, wherein the test plate comprises: the second glass fiber cloth layer in the second testing unit and the glass fiber cloth layer in the third testing unit have different specifications.
6. The test board according to claim 5, wherein the specifications of the glass fiber cloth of the first glass fiber cloth layer disposed adjacent to the signal layer in the second test cell and the first glass fiber cloth layer disposed adjacent to the signal layer in the third test cell are different.
7. The test board of claim 1, wherein the material of the signal layer and the material of the ground layer are both copper foil.
8. The test plate of claim 7, wherein the test plate comprises: the thickness of the copper foil in the fourth test unit is different from that of the copper foil in the fifth test unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711479908.5A CN108303635B (en) | 2017-12-29 | 2017-12-29 | Test board for verifying electrical performance of PCB material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711479908.5A CN108303635B (en) | 2017-12-29 | 2017-12-29 | Test board for verifying electrical performance of PCB material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108303635A CN108303635A (en) | 2018-07-20 |
| CN108303635B true CN108303635B (en) | 2020-08-11 |
Family
ID=62868240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711479908.5A Active CN108303635B (en) | 2017-12-29 | 2017-12-29 | Test board for verifying electrical performance of PCB material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108303635B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113064007B (en) * | 2021-03-24 | 2023-02-24 | 山东英信计算机技术有限公司 | A high-speed cable fixture |
| CN114417781B (en) * | 2022-03-31 | 2022-06-17 | 苏州浪潮智能科技有限公司 | PCB wiring crosstalk evaluation method, system, device, equipment and storage medium |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6060954A (en) * | 1997-11-28 | 2000-05-09 | Delta Electronic, Inc. | Oscillator device having inductor formed inside multi-layer circuit board |
| JP2000216586A (en) * | 1999-01-26 | 2000-08-04 | Hitachi Ltd | Multilayer printed circuit board |
| CN101730377A (en) * | 2008-10-29 | 2010-06-09 | 鸿富锦精密工业（深圳）有限公司 | Coupling layer and printed circuit board with same |
| CN103841749A (en) * | 2012-11-23 | 2014-06-04 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| CN103906342A (en) * | 2012-12-28 | 2014-07-02 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| CN204836777U (en) * | 2015-07-01 | 2015-12-02 | 艾威尔电路（深圳）有限公司 | Multilayer high frequency blind hole PCB circuit board |
| CN105636337A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Flexible printed circuit board and mobile terminal |
-
2017
- 2017-12-29 CN CN201711479908.5A patent/CN108303635B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6060954A (en) * | 1997-11-28 | 2000-05-09 | Delta Electronic, Inc. | Oscillator device having inductor formed inside multi-layer circuit board |
| JP2000216586A (en) * | 1999-01-26 | 2000-08-04 | Hitachi Ltd | Multilayer printed circuit board |
| CN101730377A (en) * | 2008-10-29 | 2010-06-09 | 鸿富锦精密工业（深圳）有限公司 | Coupling layer and printed circuit board with same |
| CN103841749A (en) * | 2012-11-23 | 2014-06-04 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| CN103906342A (en) * | 2012-12-28 | 2014-07-02 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| CN204836777U (en) * | 2015-07-01 | 2015-12-02 | 艾威尔电路（深圳）有限公司 | Multilayer high frequency blind hole PCB circuit board |
| CN105636337A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Flexible printed circuit board and mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108303635A (en) | 2018-07-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9596766B2 (en) | Method of manufacturing a circuit board | |
| CN101176389B (en) | Impedance controlled via structure | |
| JP7018015B2 (en) | Circuit board structure and equipment interface board | |
| CN101909401B (en) | Printed circuit board structure | |
| CN108303635B (en) | Test board for verifying electrical performance of PCB material | |
| KR20180065002A (en) | Pcb transmission lines having reduced loss | |
| CN105792525B (en) | A kind of production method of pcb board | |
| US7307492B2 (en) | Design, layout and method of manufacture for a circuit that taps a differential signal | |
| US9526185B2 (en) | Hybrid PCB with multi-unreinforced laminate | |
| CN113709962B (en) | Differential signal transmission multilayer PCB structure | |
| Bucur | Fiber Weave Effect-a performance-limiting factor | |
| CN112911802B (en) | Differential signal line wiring method of twisted pair-like staggered layer structure | |
| US20100175911A1 (en) | High-Speed Two-Layer and Multilayer Circuit Boards | |
| US7282647B2 (en) | Apparatus for improving coupling across plane discontinuities on circuit boards | |
| CN102196657A (en) | Circuit substrate | |
| CN203368918U (en) | Test circuit | |
| CN220067786U (en) | Printed circuit board and communication equipment | |
| CN109711065A (en) | A kind of PCB layout angle optimal value determines method | |
| CN108901128B (en) | Double-sided flexible PCB | |
| CN118741851A (en) | Circuit board and device | |
| Pitner et al. | Mode conversion effects in multi-Gbps telecommunications blade system | |
| CN115484727A (en) | Electronic component carrier board and wiring method thereof | |
| CN108288979A (en) | A kind of high speed signal test system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20181225 Address after: 610213 846, southern section of Tianfu Avenue, Huayang street, Tianfu New District, Chengdu, Sichuan Applicant after: CHINESE CORPORATION DAWNING INFORMATION INDUSTRY CHENGDU CO., LTD. Applicant after: Dawning Information Industry (Beijing) Co., Ltd. Address before: 100193 No. 36 Building, No. 8 Hospital, Wangxi Road, Haidian District, Beijing Applicant before: Dawning Information Industry (Beijing) Co., Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |