CN114388317A - Protective element and method of making the same - Google Patents

Abstract

The invention provides a protective element and a manufacturing method thereof, wherein the protective element comprises a body, an inner connecting layer, an outer connecting layer, a heat-generating layer and a low-melting-point alloy layer; the body is made of a single electric insulation material, the inner connecting layer and the outer connecting layer are respectively formed on two opposite lower surfaces and upper surfaces of the body, and the low-melting-point alloy layer is formed on the upper surface of the body and is electrically connected with the inner connecting layer; the heating layer is embedded in the body and is electrically connected with the low-melting-point alloy layer through the internal connecting layer; the outer connecting layer is electrically connected with the low-melting-point alloy layer and the heating layer; when the external connecting layer of the protection element is welded on the power circuit and the power circuit has overcurrent, the heating layer can generate heat and conduct the heat to the upper low-melting-point alloy layer through the body, so as to accelerate the fusing of the low-melting-point alloy layer and interrupt the overcurrent power circuit.

Description

Protective element and method of making the same

technical field

The present invention relates to a protection element, especially a protection element with a low melting point alloy layer.

Background technique

The charging circuit is usually provided with a protection element, so that the protection element can cut off the charging circuit of the charging circuit and protect the charging circuit when abnormal conditions such as overcurrent or overvoltage occur in the charging circuit.

For example, a protection element shown in Figs. 3(A) and 3(B) of the invention patent of China Publication No. CN103988277B "Protection Element, Manufacturing Method of the Protection Element, and Battery Module Loaded with the Protection Element" is mounted on a substrate 11 A concave portion 11a is formed thereon for accommodating a heating element 12, and then a second substrate 13 or a printed insulating member 13a1 (as shown in FIG. 9(B)) is used to cover the concave portion 11a; and then on the second substrate 13 A heating element electrode 15, two electrodes 14a, 14b and a connecting terminal 152 are formed, and then a low melting point alloy 20 is arranged on the heating element electrode 15 and the two electrodes 14a, 14b; wherein the heating element electrode 15 passes through the through hole 151 is electrically connected to the heating element 12 through the second substrate 13 , and the heating element electrode 15 is electrically connected to the connecting terminal 152 . When the protection element is welded on the charging circuit and an overcurrent occurs in the charging circuit, a relatively large current will flow through the low melting point alloy through the two electrodes 14a, 14b, and also through the through hole 151 and the connection terminal 152 through the heat generating body 12, the heater accelerates the melting of the low melting point alloy 16, the two electrodes 14a and 14b are disconnected, and the charging circuit of the charging circuit is cut off to protect the charging circuit.

However, the manufacturing process of the protection element disclosed in the Chinese invention patent is complicated. In particular, the substrate needs to be pre-formed with a concave portion in order to set the heating element, and then cover the second substrate or insulating member. Therefore, it is necessary to further improve it.

SUMMARY OF THE INVENTION

In view of the above-mentioned problem of complicated manufacturing process of the protection element, the main purpose of the present invention is to provide a protection element and a manufacturing method thereof, so as to solve the above-mentioned problems of the prior art.

In order to achieve the above purpose of the invention, the present invention provides a protection element, which comprises:

a body, made of a single electrically insulating material, and comprising a first surface and a second surface;

an internal connection layer formed on the first surface of the body;

a low melting point alloy layer formed on the first surface of the main body and electrically connected to the internal connection layer;

a heating layer embedded in the body and covered by a body made of a single electrical insulating material, and electrically connected to the low melting point alloy layer; and

An external connection layer is formed on the second surface of the main body and is electrically connected with the low melting point alloy layer and the heat generating layer.

The advantages of the present invention are that, by burying the heat generating layer in the body, there is no need to form additional recesses or insulating layers, which effectively reduces the process steps of the prior art and shortens the process time; and when the heat generating layer generates heat, the heat can be accumulated Inside the protection element, the low melting point alloy layer is fused.

In order to achieve the above purpose of the invention, the present invention also provides a manufacturing method of a protection element, which comprises:

(a) providing a first substrate and a second substrate, wherein the first surface of the first substrate includes a plurality of first device regions, and the third surface of the second substrate includes a plurality of second device regions; wherein these The first element regions correspond to the second element regions respectively;

(b) forming an external connection layer in each of the first element regions, forming an inner connection layer in each of the second element regions, forming a plurality of heat-generating layers between the first substrate and the second substrate, each of the heat-generating layers the layers correspond to the first element region and the second element region;

(c) superimposing the fourth surface of the second substrate on the second surface of the first substrate;

(d) sintering the first substrate and the second substrate to form a body of a single electrical insulating material, and the heat generating layers are embedded in the body and covered by the body;

(e) Laminating a plurality of low melting point alloy layers on the inner connection layers of the second element regions respectively, so that each of the low melting point alloy layers passes through the inner connection layer and the corresponding heat generating layer and the corresponding outer connection layer electrical connection; and

(f) cutting along the boundaries of the second element regions to form a plurality of protection elements.

The advantage of the present invention is that by simultaneously forming a plurality of external connection layers on the first substrate, forming a plurality of inner connecting layers on the second substrate, and forming a plurality of heat generating layers between the first substrate and the second substrate , and after sintering, the heat generating layer is embedded in the body, and there is no need to form a concave portion on the first substrate, the process steps are not complicated, the process time can be shortened, and the problem of complicated manufacturing process in the prior art is effectively solved.

The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention.

Description of drawings

Figure 1A: A perspective view of a first embodiment of the protective element of the present invention.

FIG. 1B is a cross-sectional view taken along the line A-A of FIG. 1A .

Fig. 1C: A cross-sectional view taken along the line B-B of Fig. 1A.

Figure 1D: A cross-sectional view of a second embodiment of the protective element of the present invention.

FIG. 2A is an exploded perspective view of a step in the manufacturing method of the protective element of the present invention.

FIG. 2B is a top plan view of the second element region of FIG. 2A .

FIG. 2C is a top plan view of the third element region of FIG. 2A .

Figure 2D: Bottom plan view of the first element region of Figure 2A.

FIG. 3A is a perspective view of another step in the manufacturing method of the protection element of the present invention.

Figure 3B: An exploded cross-sectional view of the A-A secant line of Figure 3A.

FIG. 3C is an exploded cross-sectional view of the A-A secant line of FIG. 3A in another embodiment.

FIG. 4A is a perspective view of another step in the manufacturing method of the protection element of the present invention.

FIG. 4B is a top plan view of the second element region of FIG. 4A .

FIG. 5 is an action schematic diagram of another step in the manufacturing method of the protection element of the present invention.

reference number

1. 1a: Protection element 10: Body

10': body 11: first surface

110: Internal connection layer 111: Third electrode

112: Fourth electrode 113: Second heating electrode

113a: end 114: thermally conductive electrode

12: Second surface 120: External connection layer

120': heat dissipation layer 121: first electrode

121': The first heat sink 122: The second electrode

122': The second heat sink 123: The first heating electrode

123’: Third heat sink 13: Heating layer

131: heating element 131a: end

132: First body electrode 133: Second body electrode

14: The first conductive through hole 14a: The first through hole

14a’: sixth through hole

14b: Second through hole 14c: Fourth through hole

15: The second conductive through hole 15a: The first through hole

15a’: sixth through hole

15b: Second through hole 15c: Fourth through hole

16: The first conductive hole 16b: The third through hole

16c: Fifth through hole 17: Second conductive hole

17a: The first through hole 17c: The fourth through hole

17a’: sixth through hole

18: The third conductive hole 18b: The second through hole

191: Sidewall groove 191a: First sidewall groove

191b: Second side wall groove 191c: Third side wall groove

192: side wall groove 192a: first side wall groove

192b: Second side wall groove 192c: Third side wall groove

193: Sidewall groove 193a: First sidewall groove

193b second side wall groove 193c: third side wall groove

20: Low melting point alloy layer 30: First substrate

30': Fourth substrate 31: First surface

311: First component area 32: Second surface

40: Second substrate 41: Third surface

411: Second component area 42: Fourth surface

50: Third substrate 51: Fifth surface

52: sixth surface 511: third component area

60: upper cover

Detailed ways

Below in conjunction with accompanying drawing, structure principle and working principle of the present invention are described in detail:

First, please refer to FIGS. 1A , 1B and 1C, which are the first embodiment of the protection element 1 of the present invention, which includes a body 10 , an inner connection layer 110 , an outer connection layer 120 , a heating layer 13 and a low Melting point alloy layer 20 .

The body 10 further includes a first surface 11 and a second surface 12 , a plurality of first conductive through holes 14 , a plurality of second conductive through holes 15 , a first conductive hole 16 , a second conductive hole 17 and a The third conductive hole 18 ; in this embodiment, the first conductive through holes 14 and the second conductive through holes 15 penetrate the body 10 and are exposed on the first surface 11 and the second surface 12 . A conductive hole 16 and the third conductive hole 18 are exposed on the first surface 11 , and their depths are shallower than the first conductive through holes 14 and the second conductive through holes 15 , and the second conductive hole 17 is exposed on the first surface 11 . The depth of the second surface 12 is shallower than that of the first conductive through holes 14 and the second conductive through holes 15 , and the second conductive holes 17 are aligned with the third conductive holes 18 and communicated integrally; in this embodiment , the material of the main body 10 is a single electrical insulating material; preferably, the material of the main body 10 is a low temperature co-fired ceramic material, and is in the shape of a rectangle, including two relatively long sides and two relatively short sides.

The above-mentioned interconnecting layer 110 is formed on the first surface 11 ; in this embodiment, please refer to FIG. 1A , FIG. 1B and FIG. 2B , the interconnecting layer 110 includes a third electrode 111 , a fourth electrode 112 , A second heating electrode 113 and a thermally conductive electrode 114; in this embodiment, the third electrode 111 is electrically connected to the first conductive vias 14, the fourth electrode 112 is electrically connected to the second conductive vias 15, and The second heating electrode 113 is electrically connected to the first conductive hole 16, and the thermal conductive electrode 114 is electrically connected to the third conductive hole 18, and are respectively formed on the first surface. 11, the second heating electrode 113 further extends between the third electrode 111 and the fourth electrode 112; in this embodiment, the material of the third electrode 111, the material of the fourth electrode 112 The material of , the material of the second heating electrode 113 and the material of the thermally conductive electrode 114 are metals compatible with the low temperature co-fired ceramic process.

The above-mentioned external connection layer 120 is formed on the second surface 12 ; in this embodiment, please refer to FIG. 1A , FIG. 1B and FIG. 2D , the external connection layer 120 includes a first electrode 121 , a second electrode 122 , A first heating electrode 123; the first electrode 121 corresponds to the third electrode 111, and is electrically connected to the third electrode 111 through the first conductive through hole 14, the second electrode 122 corresponds to the fourth electrode 112, and passes through the The second conductive through hole 15 is electrically connected to the fourth electrode 112, and the first electrode 121 and the second electrode 122 are respectively formed on two opposite long sides of the second surface 12; as shown in FIG. 1C, the first heat generating The electrode 123 is formed on a short side of the second surface 12 to correspond to the thermally conductive electrode 114, and is electrically connected to the thermally conductive electrode 114 through the second conductive hole 17 and the third conductive hole 18; in this embodiment, the first electrode 121. The second electrode 122 and the first heating electrode 123 are the surface adhesive pads of the protection element 1 for soldering to a charging circuit; in this embodiment, the material of the first electrode 121, the material of the second electrode The material of 122 and the material of the first heating electrode 123 are metals compatible with the low temperature co-fired ceramic process.

The heat generating layer 13 is embedded in the main body 10, one end of the heating layer 13 is electrically connected to the first conductive hole 16, and the other end is electrically connected to the second conductive hole 17 and the third conductive hole 18; in this embodiment, as shown in FIG. 1C and FIG. 2C, the heating layer 13 is composed of a heating element 131, a first body electrode 132 and a second body electrode 133; in this embodiment, the first body electrode 132 corresponds to the first heating electrode 123, and is electrically connected to the first heating electrode 123 through the second conductive hole 17, the second body electrode 133 corresponds to the second heating electrode 113, and is electrically connected to the second heating electrode 113 through the first conductive hole 16, The heating element 131 is formed between the first body electrode 132 and the second body electrode 133, and is electrically connected to the first body electrode 132 and the second body electrode 133. One end 131a of the heating body 131 is connected to the second body electrode 131. One end 113a of the heating electrode 113 is flush; in this embodiment, the material of the heating element 131 is a resistive paste, the material of the first body electrode 132 and the material of the second body electrode 133 are compatible with the low temperature co-fired ceramic process Metal.

1A , FIG. 1B and FIG. 4B , the low melting point alloy layer 20 is superimposed and electrically connected to the third electrode 111 , the fourth electrode 112 and the second heating electrode on the first surface 11 of the main body 10 113, so the low melting point alloy layer 20 can be electrically connected to the first electrode 121 through the third electrode 111, and the fourth electrode 112 is electrically connected to the second electrode 122; preferably, the low melting point alloy layer 20 is welded to The third electrode 111, the fourth electrode 112 and the second heating electrode 113, but the method of electrical connection is not limited thereto; preferably, the material of the low melting point alloy layer 20 is a first alloy or a The second alloy, wherein the first alloy is composed of tin, lead, bismuth, copper and silver, and the second alloy is composed of tin, bismuth, copper and silver, but not limited thereto.

From the above description, it can be seen that the protection element 1 is applied to the first electrode 121, the second electrode 122 and the first heating electrode 123 by surface adhesion welding to the charging circuit. When an overcurrent occurs in the charging circuit, the current Through the first electrode 121 , the first conductive through hole 14 , the third electrode 111 , the low melting point alloy layer 20 , the fourth electrode 112 , the second conductive through hole 15 and the second electrode 122 , the The temperature of the low melting point alloy layer 20 increases; in addition, the current also passes from the low melting point alloy layer 20 through the second heating electrode 113 , the first conductive hole 16 , the heating layer 13 , the second conductive hole 17 and The first heating electrode 123 increases the temperature of the heating layer 13 and stores the heat inside the body 10 of the protection element 1 , which can fuse the low-melting alloy more quickly than the low-melting alloy that is generally self-heating and fused. Layer 20.

Please refer to FIG. 1D again, which is a second embodiment of the protection element 1 a of the present invention, which is substantially the same as the first embodiment, but further includes a heat dissipation layer 120 ′, and the heat dissipation layer 120 ′ is embedded in the body 10 at intervals The inner body 10 is covered by a single electrical insulating material, and is located between the heating layer 13 and the outer connection layer 120; in this embodiment, the heat dissipation layer 120' is connected to the inner connection layer 110 and the outer connection layer 120. The layer 120 and the heating layer 13 are electrically connected; the heat dissipation layer 120 ′ is the same as the external connection layer 120 , and includes a pair of first heat sinks 121 ′ corresponding to the first electrodes 121 and a pair of second heat sinks corresponding to the second electrodes 122 122' and a pair of third heat sinks 123' corresponding to the first heating electrode 123; wherein the first conductive through holes 14 pass through the first heat sink 121', and the second conductive through holes 15 pass through the second heat sink 122 ', and the second conductive hole 17 will also pass through the third heat sink 123'; therefore, the heat dissipation layer 120' will pass through the first conductive through hole 14, the second conductive through hole 15 and the second and first conductive holes 123'. The three conductive holes 17 and 18 are electrically connected to the inner connection layer 110 , the outer connection layer 120 and the heat generating layer 13 . In addition, multiple layers of heat dissipation layers 120' may be stacked at intervals according to heat dissipation requirements, and the limit is not limited to one layer.

The above is a description of the structure of the protection element of the present invention, and the detailed fabrication method for completing the protection element is further described below.

First, please refer to FIG. 2A , FIG. 3 , FIG. 4A and FIG. 5 , which are the first embodiment of the manufacturing method of the protection element of the present invention, which includes the following steps (a) to (f).

In step (a), a first substrate 30 and a second substrate 40 are provided, but not limited thereto; in this embodiment, as shown in FIG. 2A , the materials of the first substrate 30 and the second substrate are The material of 40 is a low temperature co-fired ceramic material; the first surface 31 of the first substrate 30 includes a plurality of first element regions 311, and the third surface 41 of the second substrate 40 includes a plurality of second element regions 411; Each of the first device regions 311 corresponds to each of the second device regions 411 respectively; in this embodiment, as shown in FIG. 2D , a plurality of first through holes 14 a are formed in the first device regions 311 of the first substrate 30 . , 15a and 17a and a plurality of first sidewall grooves 191a, 192a and 193a; as shown in FIG. 2B , a plurality of second through holes 14b, 15b and 18b, a third through hole 16b and a plurality of second sidewall grooves 191b, 192b, 193b, and in the first through hole 14a, the first sidewall groove 191a, the first through hole 15a, the first A side wall groove 192a, the first through hole 17a, the first side wall groove 193a, the second through hole 14b, the second side wall groove 191b, the second through hole 15b, the first side wall The wall groove 192b, the second through hole 18b, the second sidewall groove 193b and the third through hole 16b are filled with conductive material; in this embodiment, the conductive material is compatible with the low temperature co-fired ceramic process metal; preferably, the first through holes 14a, 15a, 17a, the second through holes 14b, 15b, 18b and the third through hole 16b are formed by laser punching, and the adjacent first element regions After the boundary between 311 and the adjacent second device region 411 is punched by laser, the first sidewall grooves 191a, 192a, 193a are formed in each of the first device regions 311, and in each of the second device regions 411 The second sidewall grooves 191b, 192b, 193b are formed, but not limited thereto.

In step (b), as shown in FIGS. 2A to 2D , an external connection layer 120 is formed on the first element regions 311 of the first surface 31 of the first substrate 30 , and an external connection layer 120 is formed on the first surface 31 of the second substrate 40 . The second element regions 411 of the three surfaces 41 are formed with an internal connection layer 110 , and a plurality of heat generating layers 13 are formed between the first substrate 30 and the second substrate 40 , and each heat generating layer 13 corresponds to the first element area 311 and the second element area 411 ; in this embodiment, as shown in FIG. 2D , a first electrode 121 and a second electrode are formed on each of the first element areas 311 on the first surface 31 of the first substrate 30 The electrode 122 and a first heating electrode 123 constitute the external connection layer 120, wherein the first electrode 121 and the second electrode 122 are respectively located on two opposite long sides of the first element area 311, and the first heating electrode 123 The first through hole 14a and the first sidewall groove 191a correspond to the first electrode 121, the first through hole 15a and the first sidewall The groove 192a corresponds to the second electrode 122, the first through hole 17a and the first sidewall groove 193a correspond to the first heating electrode 123; preferably, the first electrode 121, the second electrode 122 and the first heating electrode 123 The first heating electrode 123 is formed by printing.

In this embodiment, as shown in FIGS. 2A and 2B , a third electrode 111 and a fourth electrode as shown in FIG. 2B are formed on each of the second element regions 411 of the third surface 41 of the second substrate 40 . 112, a second heating electrode 113, and a heat-conducting electrode 114 to form the internal connection layer 110, wherein the third electrode 111 corresponds to the first electrode 121, the fourth electrode 112 corresponds to the second electrode 122, and are formed respectively on two opposite long sides of the second element area 411; the thermally conductive electrode 114 corresponds to the first heating electrode 123, and is formed with the second heating electrode 113 on the other opposite two short sides of the second element area 411; Meanwhile, the second through hole 14b and the second sidewall groove 191b correspond to the third electrode 111, the second through hole 15b and the first sidewall groove 192b correspond to the fourth electrode 112, and the second through hole 15b and the first sidewall groove 192b correspond to the fourth electrode 112. The hole 18b and the second sidewall groove 193b correspond to the thermally conductive electrode 114 and the first heating electrode 123 of the first element area 311, and the third through hole 16b corresponds to the second heating electrode 113; preferably, the The third electrode 111 , the fourth electrode 112 , the second heating electrode 113 and the heat conducting electrode 114 are formed by printing.

In step (c), as shown in FIG. 2A to FIG. 2D , FIG. 3A and FIG. 3B , the fourth surface 42 of the second substrate 40 is superimposed on the second surface 32 of the first substrate 30 , so that each of the The first through holes 14 a , 15 a , 17 a of the first element regions 311 correspond to the second through holes 14 b , 15 b , 18 b of the second element regions 411 , and the third through holes 14 b of the second element regions 411 The through holes 16b correspond to the heat generating layer 13, and the first sidewall grooves 191a, 192a, and 193a of the first element regions 311 correspond to the second sidewall grooves 191b, 193a of the second element regions 411, respectively. 192b, 193b; in addition, further aligning the boundaries of the second element regions 411 of the second substrate 40, cutting the second substrate 40 downward from the third surface 41 of the second substrate 40 to a depth d1, the The depth d1 is smaller than the thickness of the second substrate 40 .

In step (d), as shown in FIG. 4A , the first substrate 30 and the second substrate 40 are sintered, so that the first substrate 30 and the second substrate 40 form a body 10 ′ made of a single electrical insulating material, and the The heating layers 13 are embedded in the body 10 ′ and covered by the body 10 ′; in this embodiment, please refer to FIG. 1A and FIG. 2B to FIG. 2D , the first through holes 14 a and the second through holes 14 a The through holes 14b constitute a plurality of first conductive through holes 14 that are integrally connected to electrically connect the first electrode 121 and the third electrode 111 , and the first through holes 15a and the second through holes 15b are integrally communicated with each other. A plurality of second conductive through holes 15 are formed to electrically connect the second electrode 122 and the fourth electrode 112. The first through hole 17a and the second through hole 18b and the conductive material filled therein respectively constitute a second through hole 17a and the second through hole 18b. The conductive hole 17 and a third conductive hole 18, as shown in FIG. 1C, the second conductive hole 17 is electrically connected to the first heating electrode 123 and the first body electrode 132 of the heating layer 13, and the third conductive hole 18 is electrically connected The first body electrode 132 of the heat generating layer 13 is connected to the thermally conductive electrode 114 , the third through hole 16 b and the conductive material filled therein constitute the first conductive hole 16 to electrically connect the second body electrode of the heat generating layer 13 133; the first sidewall grooves 191a, 192a, 193a and the second sidewall grooves 191b, 192b, 193b respectively form a plurality of sidewall grooves 191, 192, 193; preferably, further electroplating is possible The first electrodes 121, the second electrodes 122, the third electrodes 111, the fourth electrodes 112, the first heating electrodes 123, the second heating electrodes 113, the thermally conductive electrodes 114 and The sidewall grooves 191, 192, 193, wherein the metal material used for electroplating is tin or gold; the sidewall grooves 191 are electrically connected to the first electrode 121 and the third electrode 111, and the sidewall grooves The groove 192 is electrically connected to the second electrode 122 and the fourth electrode 112 , and the sidewall grooves 193 are electrically connected to the first heating electrode 123 and the thermally conductive electrode 114 .

In step (e), as shown in FIG. 4A , a plurality of low melting point alloy layers 20 are respectively superimposed on the interconnection layer 110 corresponding to the second element region 411 , and then as shown in FIG. The layer 20 is electrically connected to the corresponding heat generating layer 13 and the corresponding external connection layer 120 ; in this embodiment, the low melting point alloy layers 20 are directly connected to the third electrode of the internal connection layer 110 as shown in FIG. 4B 111. The fourth electrode 112 and the second heating electrode 113 are electrically connected; preferably, the low melting point alloy layer 20 is welded to the third electrode 111, the fourth electrode 112 and the second heating electrode 113, but not This is the limit.

In step (f), as shown in FIG. 1A , FIG. 4A and FIG. 5 , cutting along the boundary of the adjacent second element regions 411 to form a plurality of protection elements 1 ; in this embodiment, a plurality of upper covers are 60 respectively cover the second device regions 411 to form a protection device as shown in FIG. 1A . Preferably, since the second substrate 40 has been pre-cut in step (c), the pre-cut grooves can be applied with double rollers to form a plurality of protection elements 1 .

Please refer to FIG. 3C again, which is a second embodiment of the manufacturing method of the protection element of the present invention, which is substantially the same as the first embodiment and includes steps (a) to (f), but this embodiment further includes step (a) A fourth substrate 30 ′ is provided in the above, and the fourth substrate 30 ′ can be the same as the first substrate 30 . The seventh surface of the fourth substrate 30 ′ includes a plurality of fourth element regions, and the fourth element regions correspond to the first substrate 30 . The element area 311 and the second element area 411 ; in this embodiment, a sixth through hole 14 a corresponding to the first through holes 14 a , 15 a and 17 a of the first element area 311 is formed in the fourth element area ', 15a' and 17a' and a plurality of first sidewall grooves (not shown in the figure), and the sixth through holes 14a', 15a' and 17a' are filled with conductive substances; in another implementation In an example, the fourth device region is formed on an eighth surface of the fourth substrate 30'.

In step (b) of this embodiment, a heat dissipation layer 120 ′ corresponding to the external connection layer 120 is formed in each of the fourth element regions; in this embodiment, as shown in FIG. 3C , in each of the fourth element regions A pair of first heat sinks 121' corresponding to the first electrodes 121, a pair of second heat sinks 122' corresponding to the second electrodes 122, and a pair of third heat sinks 123' corresponding to the first heating electrodes 123 are formed, and the The fourth substrate 30 ′ is disposed between the first substrate 30 and the heat generating layers 13 .

In step (c) of this embodiment, as shown in FIG. 3C , the fourth substrate 30 ′ is stacked between the second surface 32 of the first substrate 30 and the heat-generating layer 13 , so that the heat-dissipating layer 120 is formed. ', the sixth through holes 14a', 15a' and 17a' correspond to the first through holes 14a, 15a, 17a of the first element region 311 and the second through holes of the second element region 411, respectively 14b, 15b, 18b.

In step (d) of this embodiment, the sixth through holes 14a', the corresponding first through holes 14a and the second through holes 14b constitute the first conductive through holes penetrating the body 10' The holes 14 , the sixth through holes 15 a ′ and the corresponding first through holes 15 a and the second through holes 15 b constitute the second conductive through holes 15 penetrating the body 10 ′, the sixth through holes 15 ′. The holes 17 a ′ and the corresponding first through holes 17 a and the second through holes 18 b constitute the second conductive holes 17 and the third conductive holes 18 .

In step (e) of this embodiment, each of the heat dissipation layers 120 ′ passes through the first conductive through holes 14 , the second conductive through holes 15 , the second conductive holes 17 and the third conductive holes 18 is electrically connected to the inner connection layer 110 , the heat generating layer 13 and the outer connection layer 120 .

In addition, a plurality of fourth substrates 30' may be stacked between the first substrate 30 and the heat-generating layer 13 according to heat dissipation requirements, but not limited to one.

The above is the description of the manufacturing method of the protection element of the present invention, and the detailed manufacturing method of the heat generating layer 13 in the protection element is further described below.

In the first embodiment of the manufacturing method of the protection element of the present invention, the manufacturing method of the heat generating layer 13 is that in the above step (b), a plurality of heat generating layers 13 are formed on the second surface 32 of the first substrate 30, The heating layer 13 corresponds to the first element area 311 and the second element area 411 ; in this embodiment, the heating layer 13 is formed on the second surface 32 with a heating body 131 and a first body as shown in FIG. 2C . The electrode 132 and a second body electrode 133 are disposed corresponding to the first heating electrode 123 of the first element area 311 and the thermally conductive electrode 114 of the second element area 411 , and the second body electrode 133 The second heating electrode 113 corresponding to the second element area 411 is provided, but not limited thereto; in the second embodiment of the manufacturing method of the protective element of the present invention, the heating layer 13 is the same as the manufacturing method of the protective element of the present invention. In the first embodiment, the heating layer 13 is formed on the fourth surface 42 of the second substrate 40; in this embodiment, the material of the heating element 131 is a resistive paste, the material of the first body electrode 132 and the The material of the second body electrode 133 is a metal compatible with the low temperature co-fired ceramic process; preferably, the heating element 131 , the first body electrode 132 and the second body electrode 133 are formed by printing.

In the third embodiment of the manufacturing method of the protection element of the present invention, as shown in FIG. 2A , the manufacturing method of the heat generating layer 13 further provides a third substrate 50 in the above step (a), the fifth surface 51 of which includes a A plurality of third device regions 511, the third device regions 511 correspond to the first device region 311 and the second device region 411, and a plurality of fourth through holes 14c, 15c, 17c, A fifth through hole 16c and a plurality of third sidewall grooves 191c, 192c, 193c, and the fourth through holes 14c, 15c, 17c and the fifth through hole 16c are filled with conductive material; in the above step ( In b), the third substrate 50 is disposed between the first substrate 30 and the second substrate 40, and a plurality of heat-generating layers 13 are respectively formed in the third element regions 511, and the method for forming the heat-generating layers 13 is the same In the first embodiment of the manufacturing method of the protection element of the present invention, only the fourth through holes 17c correspond to the first body electrode 132, and the fifth through holes 16c correspond to the second body electrode 133; in the above step (c) , the third substrate 50 is stacked between the first substrate 30 and the second substrate 40, wherein the fourth through holes 14c, 15c, 17c of the third element regions 511 correspond to the fourth through holes 14c, 15c, and 17c respectively. The through holes 14a, 15a, 17a, the second through holes 14b, 15b, 18b, the fifth through hole 16c correspond to the third through hole 16b, and the third sidewall grooves 191c, 192c, 193c correspond to the There should be some first sidewall grooves 191a, 192a, 193a and some second sidewall grooves 191b, 192b, 193b; in the above step (d), the fourth through holes 14c, the first through holes 14a and the second through holes 14b constitute the first conductive through holes 14, and electrically connect the first electrode 121 and the third electrode 111, the fourth through holes 15c, the first through holes 15a and the The second through holes 15b constitute the second conductive through holes 15 and electrically connect the second electrode 122 and the fourth electrode 112, the fourth through hole 17c, the first through hole 17a and the second through hole The hole 18b constitutes the second conductive hole 17 and the third conductive hole 18, and electrically connects the first heating electrode 123, the heating layer 13 and the thermal conductive electrode 114, the fifth through hole 16c and the third through hole 16b The first conductive hole 16 is formed, and the second body electrode 133 is electrically connected; in the fourth embodiment of the manufacturing method of the protection element of the present invention, the manufacturing method of the heating layer 13 is different from the manufacturing method of the protection element of the present invention. The third embodiment is substantially the same, except that the sixth surface 52 of the third substrate 50 includes a plurality of third element regions 511 ; in this embodiment, the material of the third substrate 50 is a low temperature co-fired ceramic material.

As can be seen from the above description, the manufacturing method of the protection element of the present invention simultaneously forms a plurality of external connection layers 120 on the first substrate 30, forms a plurality of internal connection layers 110 on the second substrate 40, and forms a plurality of internal connection layers 110 on the first substrate at the same time. A plurality of heat-generating layers 13 are formed between the 30 and the second substrate 40, which shortens the process time, and does not need to form additional recesses, effectively solving the problem of complicated manufacturing process in the prior art.

To sum up, the protection element of the present invention embeds the heating layer in the body of the protection element, and does not need to form additional recesses or insulating layers, which effectively reduces the process steps in the prior art and shortens the process time; the heating layer generates heat When , heat can be accumulated inside the protection element to fuse the low melting point alloy layer; and the manufacturing method of the element protected by the present invention can simultaneously form a plurality of external connection layers on the first substrate, and form a plurality of external connection layers on the second substrate at the same time In the internal connection layer, a plurality of heat generating layers are formed between the first substrate and the second substrate, which shortens the process time, and does not need to form additional recesses, effectively solving the problem of complicated manufacturing process in the prior art.

Of course, the present invention can also have other various embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding Changes and deformations should belong to the protection scope of the appended claims of the present invention.

Claims (25)

1. A protection element, characterized in that, comprising: a body, made of a single electrically insulating material, and comprising a first surface and a second surface; an internal connection layer formed on the first surface of the body; a low melting point alloy layer formed on the first surface of the main body and electrically connected to the internal connection layer; a heating layer, embedded in the body and covered by the body made of a single electrical insulating material, and electrically connected to the low melting point alloy layer; and An external connection layer is formed on the second surface of the main body and is electrically connected with the low melting point alloy layer and the heat generating layer. 2. The protective element of claim 1, wherein: The external connection layer includes a first electrode, a second electrode and a first heating electrode, wherein the first electrode and the second electrode are respectively formed on two opposite sides of the second surface, and the first heating electrode is formed on the other side of the second surface; The internal connection layer includes a third electrode, a fourth electrode and a second heating electrode, wherein the second heating electrode is located between the third electrode and the fourth electrode, and the third electrode passes through at least a first conductive a hole is connected to the first electrode, the fourth electrode is connected to the second electrode through at least one second conductive through hole, and the second heating electrode is connected to the heating layer through a first conductive hole; and The heating layer is connected to the first heating electrode through a second conductive hole. 3 . The protection element according to claim 2 , wherein the first surface of the body further forms a heat-conducting electrode corresponding to the first heat-generating electrode, and is electrically connected to the heat-generating layer through a third conductive hole. 4 . 4 . The protection element of claim 3 , wherein the second conductive hole and the third conductive hole are integrally communicated with each other. 5 . 5 . The protection element according to claim 1 , wherein the material of the heating layer is a resistive paste. 6 . 6 . The protection element according to claim 1 , wherein the material of the body is a low temperature co-fired ceramic material. 7 . 7. The protection element of claim 3, wherein the first electrode, the second electrode, the third electrode, the fourth electrode, the first heating electrode, the second heating electrode and the The material of the thermal conductive electrode is a metal compatible with the low temperature co-fired ceramic process. 8. The protection element according to any one of claims 1 to 4, wherein the material of the low melting point alloy layer is a first alloy or a second alloy, wherein: the first alloy consists of tin, lead, bismuth, copper and silver; and The second alloy consists of tin, bismuth, copper and silver. 9 . The protection element according to claim 1 , further comprising an upper cover covering the first surface of the body. 10 . 10. The protection element according to any one of claims 1 to 4, further comprising at least one heat dissipation layer, embedded in the body at intervals and covered by the body of a single electrical insulating material, and It is located between the heating layer and the outer connecting layer to be electrically connected with the inner connecting layer, the heating layer and the outer connecting layer. 11. A method of manufacturing a protective element, comprising: (a) providing a first substrate and a second substrate, wherein the first surface of the first substrate includes a plurality of first device regions, and the third surface of the second substrate includes a plurality of second device regions; wherein these The first element regions correspond to the second element regions respectively; (b) forming an external connection layer in each of the first element regions, forming an inner connection layer in each of the second element regions, forming a plurality of heat-generating layers between the first substrate and the second substrate, each of the heat-generating layers the layers correspond to the first element region and the second element region; (c) superimposing the fourth surface of the second substrate on the second surface of the first substrate; (d) sintering the first substrate and the second substrate to form a body of a single electrical insulating material, and the heat generating layers are embedded in the body and covered by the body; (e) Laminating a plurality of low melting point alloy layers on the inner connection layers of the second element regions respectively, so that each of the low melting point alloy layers passes through the inner connection layer and the corresponding heat generating layer and the corresponding outer connection layer electrical connection; and (f) cutting along the boundaries of the second element regions to form a plurality of protection elements. 12. The manufacturing method of the protection element according to claim 11, wherein: In the step (a), a plurality of first through holes are formed in each of the first element regions of the first substrate, and a plurality of second through holes and a first through hole are formed in each of the second element regions of the second substrate. three through holes, and the first through holes, the second through holes and the third through holes are filled with conductive substances; In the step (b), a first electrode, a second electrode and a first heating electrode are formed in each of the first element regions on the first surface of the first substrate to form the external connection layer, wherein The first electrode and the second electrode are respectively located on two opposite sides of the first element area, the first heating electrode is disposed on the other side of the first element area, and the first through holes correspond to the first the first electrode, the second electrode and the first heating electrode in the element area; A third electrode, a fourth electrode and a second heating electrode are formed on each of the second element regions on the third surface of the second substrate to form the interconnection layer, wherein the third electrode corresponds to the first electrode , the fourth electrode corresponds to the second electrode, the second heating electrode is located between the third electrode and the fourth electrode, and the second through holes in each of the second element regions correspond to the third electrode, the the fourth electrode and the first heating electrode in the first element area, and the third through hole in each of the second element areas corresponds to the second heating electrode; In the step (c), the first through holes in each of the first device regions correspond to the second through holes in each of the second device regions, and the third through holes further correspond to the heat generating layer; and In the step (d), each of the first through holes and each of the corresponding second through holes constitute a conductive through hole penetrating the body; In the step (e), each of the low-melting alloy layers is directly electrically connected to the third electrode, the fourth electrode and the second heating electrode of the inner connecting layer of the corresponding second element region, and is electrically connected through the The conductive through holes are electrically connected to the first electrode and the second electrode of the external connection layer, and are electrically connected to the heating layer through the conductive material in the third through hole. 13. The manufacturing method of the protection element according to claim 11 or 12, wherein in the step (b), each of the heat generating layers is formed on the second surface of the first substrate or on the second surface of the second substrate fourth surface. 14. The manufacturing method of the protection element according to claim 12, wherein: In the step (a), a third substrate is further provided, wherein the fifth surface or the sixth surface of the third substrate includes a plurality of third element regions, and the third element regions correspond to the first element region and the first element region. two element regions, forming a plurality of fourth through holes and a fifth through hole in each of the third element regions of the third substrate, and filling the fourth through holes and the fifth through holes with conductive substances; In the step (b), the third substrate is located between the first substrate and the second substrate, and each of the heat generating layers is formed on the third element region on the fifth surface or the sixth surface of the third substrate; In the step (c), the third substrate is stacked between the first substrate and the second substrate; wherein the fourth through holes of the third element regions correspond to the first elements respectively The first through holes in each of the second device regions and the second through holes in each of the second device regions, and the fifth through holes in each of the third device regions correspond to the third through holes; and In the step (d), each of the fourth through-holes, the corresponding first through-holes and the corresponding second through-holes constitute a conductive through-hole penetrating through the body, and the five through-holes correspond to the corresponding first through-holes and the corresponding second through-holes. The third through hole forms a conductive hole. 15. The manufacturing method of a protection element according to claim 12 or 14, wherein in the step (b), a thermally conductive electrode is further formed in each of the second element regions of the second substrate, wherein The heat-conducting electrode is arranged corresponding to the first heating electrode. 16. The method for manufacturing a protection device as claimed in claim 11, 12 or 14, wherein in the step (c), the second substrate is further cut along the boundary of the second device region of the second substrate. Two substrates to a depth. 17. The manufacturing method of the protection element according to claim 11, 12 or 14, wherein the material of the heating layer is a resistive paste. 18. The manufacturing method of the protection element according to claim 15, wherein: In this step (b), the first electrodes, the second electrodes, the third electrodes, the fourth electrodes, the first heating electrodes, the second heating electrodes and the thermally conductive electrodes formed by printing; and In this step (d), further electroplating the first electrodes, the second electrodes, the third electrodes, the fourth electrodes, the first heating electrodes, the second heating electrodes and the Thermally conductive electrodes. 19 . The manufacturing method of the protection element as claimed in claim 11 , wherein in the step (f), an upper cover is further covered on the second element regions respectively. 20 . 20. The manufacturing method of the protection element as claimed in claim 18, wherein the metal material used for electroplating is tin or gold. 21. The method for manufacturing a protection element as claimed in claim 11, 12 or 14, wherein the material of the first substrate and the material of the second substrate are a low temperature co-fired ceramic material. 22. The manufacturing method of the protection element as claimed in claim 14, wherein the material of the third substrate is a low temperature co-fired ceramic material. 23. The manufacturing method of the protection element as claimed in claim 15, wherein the first electrode, the second electrode, the third electrode, the fourth electrode, the first heating electrode, the second heating electrode The material of the electrode and the thermally conductive electrode is a metal compatible with the low temperature co-fired ceramic process. 24. The method for manufacturing a protection element as claimed in claim 11, 12 or 14, wherein the low melting point alloy layer is composed of a first alloy or a second alloy, wherein: the first alloy consists of tin, lead, bismuth, copper and silver; and The second alloy consists of tin, bismuth, copper and silver. 25. The manufacturing method of the protection element according to claim 12, wherein: In the step (a), a fourth substrate is further provided, wherein the seventh surface or the eighth surface of the fourth substrate includes a plurality of fourth element regions, and the fourth element regions correspond to the first element region and the first element region. two element regions, forming a plurality of sixth through holes in each of the fourth element regions of the fourth substrate, and filling the sixth through holes with conductive substances; In the step (b), the fourth substrate is located between the first substrate and the heat generating layer, and a heat dissipation layer is formed on the fourth element area on the seventh surface or the eighth surface of the fourth substrate, and the heat dissipation layer is formed. The layer includes a pair of first heat sinks corresponding to the first electrodes, a pair of second heat sinks corresponding to the second electrodes, and a pair of third heat sinks corresponding to the first heating electrodes; In the step (c), the fourth substrate is stacked between the second surface of the first substrate and the heat generating layer; wherein the sixth through holes of the fourth element regions correspond to the first the first through holes in the device region and the second through holes in each of the second device regions; In the step (d), each of the sixth through holes and the corresponding first through holes and the second through holes constitute a conductive through hole passing through the body; and In the step (e), each of the heat dissipation layers is electrically connected to the inner connection layer, the heat generating layer and the outer connection layer through the conductive through holes.

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