[go: up one dir, main page]

CN114375615A - 软硬结合电路板及其制作方法 - Google Patents

软硬结合电路板及其制作方法 Download PDF

Info

Publication number
CN114375615A
CN114375615A CN202080063699.XA CN202080063699A CN114375615A CN 114375615 A CN114375615 A CN 114375615A CN 202080063699 A CN202080063699 A CN 202080063699A CN 114375615 A CN114375615 A CN 114375615A
Authority
CN
China
Prior art keywords
layer
circuit
circuit substrate
opening
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080063699.XA
Other languages
English (en)
Inventor
李卫祥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avary Holding Shenzhen Co Ltd
Qing Ding Precision Electronics Huaian Co Ltd
Original Assignee
Avary Holding Shenzhen Co Ltd
Qing Ding Precision Electronics Huaian Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avary Holding Shenzhen Co Ltd, Qing Ding Precision Electronics Huaian Co Ltd filed Critical Avary Holding Shenzhen Co Ltd
Publication of CN114375615A publication Critical patent/CN114375615A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

一种软硬结合电路板(100)，包括线路基板(10)、胶粘层(35)以及两外层导电线路层(330)，所述线路基板(10)上开设至少一贯穿所述线路基板(10)的开口(101)，两所述外层导电线路层(330)沿所述开口(101)的贯穿方向分别层叠于所述线路基板(10)的相对两侧，所述胶粘层(35)粘结于所述线路基板(10)和每一所述外层导电线路层(330)之间并填充所述开口(101)。所述软硬结合电路板(100)便于制作。还包括一种软硬结合电路板(100)的制作方法。

Description

PCT国内申请，说明书已公开。

Claims (10)

  1. PCT国内申请，权利要求书已公开。
CN202080063699.XA 2020-04-24 2020-04-24 软硬结合电路板及其制作方法 Pending CN114375615A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/086740 WO2021212480A1 (zh) 2020-04-24 2020-04-24 软硬结合电路板及其制作方法

Publications (1)

Publication Number Publication Date
CN114375615A true CN114375615A (zh) 2022-04-19

Family

ID=78270972

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080063699.XA Pending CN114375615A (zh) 2020-04-24 2020-04-24 软硬结合电路板及其制作方法

Country Status (4)

Country Link
US (1) US20220225511A1 (zh)
CN (1) CN114375615A (zh)
TW (1) TWI778356B (zh)
WO (1) WO2021212480A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240128665A1 (en) * 2022-10-14 2024-04-18 Min Di Consultants Ltd. Flexible connecting structure
CN119485898A (zh) * 2023-08-11 2025-02-18 宏启胜精密电子(秦皇岛)有限公司 可挠式电路板及其制造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101990355A (zh) * 2009-07-30 2011-03-23 欣兴电子股份有限公司 软硬线路板及其工艺
US20120314390A1 (en) * 2010-03-03 2012-12-13 Mutual-Tek Industries Co., Ltd. Multilayer circuit board
CN203482483U (zh) * 2013-08-27 2014-03-12 富葵精密组件(深圳)有限公司 电路板
CN105657971A (zh) * 2014-11-14 2016-06-08 欣兴电子股份有限公司 内埋式元件封装结构及其制作方法
CN108076589A (zh) * 2016-11-18 2018-05-25 同泰电子科技股份有限公司 软硬结合板结构
CN110278657A (zh) * 2018-03-16 2019-09-24 宏启胜精密电子(秦皇岛)有限公司 复合电路板及其制造方法
CN110536567A (zh) * 2018-05-25 2019-12-03 庆鼎精密电子（淮安）有限公司 软硬结合电路板的制作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8497431B2 (en) * 2006-07-21 2013-07-30 Hitachi Chemical Company, Ltd. Circuit connection material, circuit member connecting structure and method of connecting circuit member
TWI445479B (zh) * 2012-03-22 2014-07-11 Zhen Ding Technology Co Ltd 軟硬結合電路板及其製作方法
CN103517585B (zh) * 2012-06-29 2016-05-04 富葵精密组件(深圳)有限公司 软硬结合电路板及其制作方法
JP2014204088A (ja) * 2013-04-09 2014-10-27 株式会社フジクラ 多層配線基板およびその製造方法
CN104582325B (zh) * 2013-10-12 2018-03-27 鹏鼎控股(深圳)股份有限公司 刚挠结合板及其制作方法、电路板模组
WO2020093400A1 (zh) * 2018-11-09 2020-05-14 庆鼎精密电子（淮安）有限公司 软硬结合电路板及其制作方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101990355A (zh) * 2009-07-30 2011-03-23 欣兴电子股份有限公司 软硬线路板及其工艺
US20120314390A1 (en) * 2010-03-03 2012-12-13 Mutual-Tek Industries Co., Ltd. Multilayer circuit board
CN203482483U (zh) * 2013-08-27 2014-03-12 富葵精密组件(深圳)有限公司 电路板
CN105657971A (zh) * 2014-11-14 2016-06-08 欣兴电子股份有限公司 内埋式元件封装结构及其制作方法
CN108076589A (zh) * 2016-11-18 2018-05-25 同泰电子科技股份有限公司 软硬结合板结构
CN110278657A (zh) * 2018-03-16 2019-09-24 宏启胜精密电子(秦皇岛)有限公司 复合电路板及其制造方法
CN110536567A (zh) * 2018-05-25 2019-12-03 庆鼎精密电子（淮安）有限公司 软硬结合电路板的制作方法

Also Published As

Publication number Publication date
TWI778356B (zh) 2022-09-21
WO2021212480A1 (zh) 2021-10-28
TW202142073A (zh) 2021-11-01
US20220225511A1 (en) 2022-07-14

Similar Documents

Publication Publication Date Title
CN109429441A (zh) 软硬结合板及其制作方法
CN103635036A (zh) 柔性多层电路板及其制作方法
CN114375615A (zh) 软硬结合电路板及其制作方法
TW201608949A (zh) 軟硬結合電路板及製造方法
JP2013222960A (ja) 電気回路基板のビアホールの構造
JP2004186235A (ja) 配線板および配線板の製造方法
CN105191512B (zh) 印刷电路板及其制造方法
US9578747B2 (en) Structure of via hole of electrical circuit board
CN104105334A (zh) 印刷电路板及其制造方法
JPH05315758A (ja) 多層フレキシブル回路基板およびその製法
JP2009289789A (ja) 部品内蔵プリント配線板及び部品内蔵プリント配線板の製造方法
US20140299363A1 (en) Structure of via hole of electrical circuit board and manufacturing method thereof
CN207099435U (zh) 软硬结合板
CN104754853B (zh) 具有收音孔的电路板及其制作方法
JP2004214393A (ja) 多層配線基板の製造方法
JP2015005717A (ja) 硬軟性印刷回路基板及びその製造方法
JPS5824958B2 (ja) 多重貫通孔を設けた多層印刷配線板の製造方法
JP2009130198A (ja) フレキシブルプリント配線板、電子機器及びフレキシブルプリント配線板の製造方法
JP2005244004A (ja) 多層フレキシブル配線回路基板
JP2005109299A (ja) 多層配線板およびその製造方法
JP3101047U (ja) 多層フレキシブルプリント配線板
JP2005244024A (ja) フレックスリジッド配線板及びその製造方法
CN119789336A (zh) 一种超薄多层线路板的制作方法及超薄多层线路板
JP2006179679A (ja) フレキシブルプリント配線板及びその製造方法
JP2007311723A (ja) 多層回路基板

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20220419

WD01 Invention patent application deemed withdrawn after publication