CN114361119B - A plug-in packaging structure and packaging method thereof - Google Patents
A plug-in packaging structure and packaging method thereof Download PDFInfo
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- CN114361119B CN114361119B CN202210009060.4A CN202210009060A CN114361119B CN 114361119 B CN114361119 B CN 114361119B CN 202210009060 A CN202210009060 A CN 202210009060A CN 114361119 B CN114361119 B CN 114361119B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 103
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- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000003780 insertion Methods 0.000 claims abstract description 7
- 230000037431 insertion Effects 0.000 claims abstract description 7
- 238000003491 array Methods 0.000 claims abstract description 6
- 238000002347 injection Methods 0.000 claims description 38
- 239000007924 injection Substances 0.000 claims description 38
- 239000007788 liquid Substances 0.000 claims description 28
- 239000003292 glue Substances 0.000 claims description 21
- 238000000926 separation method Methods 0.000 claims description 19
- 238000010521 absorption reaction Methods 0.000 claims description 10
- 238000005260 corrosion Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 4
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- -1 polyethylene Polymers 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004020 conductor Substances 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 8
- 238000009434 installation Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
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- 239000011368 organic material Substances 0.000 description 2
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- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
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- 238000002474 experimental method Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
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Abstract
本发明公开了一种插入式封装结构及其封装方法，包括基板和芯片，基板的顶部固定连接有绝缘封装框，且绝缘封装框相对侧的内部均设有导电连接件，基板的两侧阵列设有一组引脚，且引脚与导电连接件相连接，芯片通过键合线设在绝缘封装框的内侧，绝缘封装框的顶部设有框板，框板的中间部固定安装有集热板，且集热板的顶部及底部分别阵列设有上吸热凸起、下吸热凸起；本发明由基板、绝缘封装框、框板、散热盖及防护壳所组成，结构简单，缩小了芯片封装结构的整体尺寸，并节省了封装所需的成本，且框板、散热盖中的构件相配合，可起到良好的散热性能，而防护壳本身为导热材料，不仅可避免其内组件受污染还可以对框板、散热盖的散热起到协助作用。
The present invention discloses an insertion type packaging structure and a packaging method thereof, comprising a substrate and a chip, wherein an insulating packaging frame is fixedly connected to the top of the substrate, and conductive connectors are arranged inside opposite sides of the insulating packaging frame, a group of pins are arranged in arrays on both sides of the substrate, and the pins are connected to the conductive connectors, the chip is arranged on the inner side of the insulating packaging frame through bonding wires, a frame plate is arranged on the top of the insulating packaging frame, a heat collecting plate is fixedly installed on the middle part of the frame plate, and upper heat absorbing protrusions and lower heat absorbing protrusions are arranged in arrays on the top and bottom of the heat collecting plate respectively; the present invention is composed of a substrate, an insulating packaging frame, a frame plate, a heat dissipation cover and a protective shell, has a simple structure, reduces the overall size of the chip packaging structure, and saves the cost required for packaging, and the components in the frame plate and the heat dissipation cover cooperate with each other to achieve good heat dissipation performance, and the protective shell itself is a heat conductive material, which can not only prevent its internal components from being contaminated but also assist the heat dissipation of the frame plate and the heat dissipation cover.
Description
技术领域Technical Field
本申请涉及芯片封装领域，尤其涉及一种插入式封装结构及其封装方法。The present application relates to the field of chip packaging, and in particular to an insertion type packaging structure and a packaging method thereof.
背景技术Background Art
芯片在电子学中是一种将电路(主要包括半导体设备，也包括被动组件等)小型化的方式，并时常制造在半导体晶圆表面上。封装形式则是指安装半导体集成电路芯片用的外壳。它不仅起着安装、固定、密封、保护芯片及增强电热性能等方面的作用，而且还通过芯片上的接点用导线连接到封装外壳的引脚上，这些引脚又通过印刷电路板上的导线与其他器件相连接，从而实现内部芯片与外部电路的连接。In electronics, a chip is a way to miniaturize circuits (mainly semiconductor devices, but also passive components, etc.), and is often manufactured on the surface of a semiconductor wafer. The package form refers to the shell used to install semiconductor integrated circuit chips. It not only plays the role of installing, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance, but also connects the contacts on the chip to the pins of the package shell with wires, and these pins are connected to other devices through wires on the printed circuit board, thereby realizing the connection between the internal chip and the external circuit.
但是，目前随着芯片尺寸的增加，功能区也随之加大，最终导致制造的芯片封装结构尺寸过大，不利于安装和电路设计，且在散热方面也会出现较大问题，以此导致散热性能较差。However, as the chip size increases, the functional area also increases, which ultimately leads to the chip packaging structure being too large, which is not conducive to installation and circuit design, and also has major problems in heat dissipation, resulting in poor heat dissipation performance.
发明内容Summary of the invention
本发明目的是：提供一种插入式封装结构及其封装方法，解决了随着芯片尺寸的增加，功能区也随之加大，最终导致制造的芯片封装结构尺寸过大，不利于安装和电路设计，且在散热方面也会出现较大问题，以此导致散热性能较差的问题。The purpose of the present invention is to provide an inserted packaging structure and a packaging method thereof, which solves the problem that as the chip size increases, the functional area also increases accordingly, which ultimately leads to the manufactured chip packaging structure being too large in size, which is not conducive to installation and circuit design, and also has major problems in heat dissipation, thereby resulting in poor heat dissipation performance.
本发明的技术方案是：一种插入式封装结构及其封装方法，包括基板和芯片，所述基板的顶部固定连接有绝缘封装框，且绝缘封装框相对侧的内部均设有导电连接件，所述基板的两侧阵列设有一组引脚，且引脚与导电连接件相连接，所述芯片通过键合线设在绝缘封装框的内侧，所述绝缘封装框的顶部设有框板，所述框板的中间部固定安装有集热板，且集热板的顶部及底部分别阵列设有上吸热凸起、下吸热凸起，所述框板的顶部设有散热盖，所述散热盖的底部阵列连接有与上吸热凸起相交错的分隔凸起，所述散热盖的顶部设有防护壳，且防护壳的内壁与基板的外壁相贴合。The technical solution of the present invention is: an inserted packaging structure and a packaging method thereof, comprising a substrate and a chip, wherein an insulating packaging frame is fixedly connected to the top of the substrate, and conductive connectors are arranged inside opposite sides of the insulating packaging frame, a group of pins are arranged in arrays on both sides of the substrate, and the pins are connected to the conductive connectors, the chip is arranged on the inner side of the insulating packaging frame through bonding wires, a frame plate is arranged on the top of the insulating packaging frame, a heat collecting plate is fixedly installed on the middle part of the frame plate, and upper heat absorbing protrusions and lower heat absorbing protrusions are arranged in arrays on the top and bottom of the heat collecting plate, respectively, a heat dissipation cover is arranged on the top of the frame plate, and a partition protrusion staggered with the upper heat absorbing protrusion is arranged in an array on the bottom of the heat dissipation cover, a protective shell is arranged on the top of the heat dissipation cover, and the inner wall of the protective shell is in contact with the outer wall of the substrate.
更进一步地，所述引脚位于基板内部的一端与导电连接件相连接，所述芯片连接在绝缘封装框的内侧，所述芯片的顶部对称阵列有键合线，且键合线远离芯片的一端连接在导电连接件的表面。Furthermore, one end of the pin located inside the substrate is connected to the conductive connector, the chip is connected to the inner side of the insulating packaging frame, the top of the chip has a symmetrical array of bonding wires, and the end of the bonding wire away from the chip is connected to the surface of the conductive connector.
更进一步地，所述导电连接件为内部含有金属导电线的聚酰亚胺或氮化硅。Furthermore, the conductive connecting member is polyimide or silicon nitride containing metal conductive wires inside.
更进一步地，所述绝缘封装框正面及背面的中间处均固定连接有注液管，且注液管的内部开设有注液孔，所述绝缘封装框正面及背面的内部均开设有进液孔，且进液孔与注液孔相连通，所述进液孔与注液孔的内壁上均设有防腐层，且防腐层材料选用为聚乙烯。Furthermore, an injection tube is fixedly connected to the middle of the front and back sides of the insulating packaging frame, and an injection hole is opened inside the injection tube. A liquid inlet hole is opened inside the front and back sides of the insulating packaging frame, and the liquid inlet hole is connected to the injection hole. An anti-corrosion layer is provided on the inner walls of the liquid inlet hole and the injection hole, and the anti-corrosion layer material is selected to be polyethylene.
更进一步地，所述框板的正面及背面均固定连接有连接片，所述连接片的底部固定连接有与注液孔相适应的固定凸起，所述注液孔的内部插接有固定凸起。Furthermore, the front and back sides of the frame plate are fixedly connected with connecting pieces, the bottom of the connecting piece is fixedly connected with a fixing protrusion adapted to the injection hole, and the inside of the injection hole is plugged with a fixing protrusion.
更进一步地，所述散热盖的底部对称开设有与连接片相适应的对应口，且对应口的为弧形状，所述连接片位于对应口的内侧。Furthermore, the bottom of the heat dissipation cover is symmetrically provided with corresponding openings adapted to the connection sheet, and the corresponding openings are arc-shaped, and the connection sheet is located at the inner side of the corresponding openings.
更进一步地，所述基板的正面及背面均开设有弧形卡孔，所述防护壳的内壁上对称连接有一组与弧形卡孔相适应的弧形凸起，且弧形凸起卡接在弧形卡孔的内部。Furthermore, arc-shaped clamping holes are provided on the front and back sides of the substrate, and a group of arc-shaped protrusions adapted to the arc-shaped clamping holes are symmetrically connected to the inner wall of the protective shell, and the arc-shaped protrusions are clamped inside the arc-shaped clamping holes.
更进一步地，所述防护壳的两侧均开设有开口，所述开口的长度大于一组引脚之间的间距，且引脚位于开口的内侧；所述分隔凸起之间的间距等于上吸热凸起的宽度，且上吸热凸起之间的间距等于分隔凸起的宽度。Furthermore, openings are provided on both sides of the protective shell, the length of the openings is greater than the spacing between a group of pins, and the pins are located on the inner side of the openings; the spacing between the separation protrusions is equal to the width of the upper heat absorption protrusions, and the spacing between the upper heat absorption protrusions is equal to the width of the separation protrusions.
一种插入式封装结构的封装方法，包括以下步骤：A packaging method for an insertion type packaging structure comprises the following steps:
S1：将基板顶部的防护壳打开，并将散热盖从框板的上方取下，通过连接片底部的固定凸起将框板从绝缘封装框的上方取下，随后将预先焊接有键合线的芯片放在绝缘封装框内侧的中间部；S1: Open the protective shell on the top of the substrate, remove the heat dissipation cover from the top of the frame plate, remove the frame plate from the top of the insulating package frame through the fixing protrusion at the bottom of the connecting piece, and then place the chip pre-soldered with bonding wires in the middle of the inner side of the insulating package frame;
S2：当芯片放置完成时，将芯片上键合线的另一端与导电连接件焊接在一起；S2: When the chip is placed, the other end of the bonding wire on the chip is welded to the conductive connector;
S3：向注液管中的注液孔注入封装胶，并经进液孔进入绝缘封装框的内侧，将框板通过连接片底部的固定凸起置入注液孔内进行安置，使框板与绝缘封装框之间处于密闭；S3: injecting packaging glue into the injection hole in the injection tube and into the inner side of the insulating packaging frame through the liquid inlet hole, placing the frame plate into the injection hole through the fixing protrusion at the bottom of the connecting piece, so that the frame plate and the insulating packaging frame are sealed;
S4：当封装胶均匀流入芯片的表面后，封装胶将芯片、键合线及下吸热凸起包裹住，随后将散热盖底部的分隔凸起与上吸热凸起相互交错，并将散热盖安装在框板的顶部；S4: After the encapsulation glue flows evenly onto the surface of the chip, the encapsulation glue wraps the chip, the bonding wires and the lower heat absorbing protrusions, and then the separation protrusions at the bottom of the heat dissipation cover are interlaced with the upper heat absorbing protrusions, and the heat dissipation cover is installed on the top of the frame plate;
S5：通过防护壳内壁上的弧形凸起卡入弧形卡孔内，使防护壳安装在基板的顶部，并将绝缘封装框、框板及散热盖包裹在其内部。S5: The protective shell is installed on the top of the substrate by inserting the arc-shaped protrusion on the inner wall of the protective shell into the arc-shaped clamping hole, and the insulating packaging frame, the frame plate and the heat dissipation cover are wrapped inside.
更进一步地，所述封装胶包括但不仅限于环氧类、有机硅类或聚氨酯类封装胶。Furthermore, the packaging adhesive includes but is not limited to epoxy, silicone or polyurethane packaging adhesives.
与现有技术相比，本发明的有益效果是：Compared with the prior art, the present invention has the following beneficial effects:
1、本发明由基板、绝缘封装框、框板、散热盖及防护壳所组成，结构简单，缩小了芯片封装结构的整体尺寸，并节省了封装所需的成本，且框板、散热盖中的构件相配合，可起到良好的散热性能，而防护壳本身为导热材料，不仅可避免其内组件受污染还可以对框板、散热盖的散热起到协助作用。1. The present invention is composed of a substrate, an insulating packaging frame, a frame plate, a heat dissipation cover and a protective shell, and has a simple structure, which reduces the overall size of the chip packaging structure and saves the cost required for packaging. The components in the frame plate and the heat dissipation cover cooperate with each other to achieve good heat dissipation performance, and the protective shell itself is a heat-conducting material, which can not only prevent the components inside from being contaminated but also assist the heat dissipation of the frame plate and the heat dissipation cover.
2、本发明框板中设有集热板，且其上下分别设有上吸热凸起、下吸热凸起，而当在芯片表面注入封装胶之后，封装胶与下吸热凸起均匀接触，上吸热凸起则与分隔凸起相交错并贴合，以此集热板可将下吸热凸起吸收的热量收集，并经上吸热凸起带出，而分隔凸起则避免上吸热凸起上热量的延伸，同时散热盖在防护壳的协助下将热量散出，以确保芯片处于较好的工作状态，提高产品的可靠性。2. A heat collecting plate is provided in the frame plate of the present invention, and an upper heat absorbing protrusion and a lower heat absorbing protrusion are provided on the upper and lower parts thereof respectively. After the packaging glue is injected into the surface of the chip, the packaging glue is in uniform contact with the lower heat absorbing protrusion, and the upper heat absorbing protrusion is staggered and fitted with the separation protrusion. In this way, the heat collecting plate can collect the heat absorbed by the lower heat absorbing protrusion and bring it out through the upper heat absorbing protrusion, while the separation protrusion avoids the extension of the heat on the upper heat absorbing protrusion. At the same time, the heat dissipation cover dissipates the heat with the assistance of the protective shell to ensure that the chip is in a good working state and improve the reliability of the product.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
为了更清楚地说明本发明实施例的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. The accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.
图1为本发明的封装结构立体爆炸结构示意图；FIG1 is a schematic diagram of a three-dimensional exploded structure of a packaging structure of the present invention;
图2为本发明的芯片立体安装结构示意图；FIG2 is a schematic diagram of a three-dimensional chip installation structure of the present invention;
图3为本发明的框板立体安装结构示意图；FIG3 is a schematic diagram of a three-dimensional installation structure of a frame plate according to the present invention;
图4为本发明的框板平面侧视结构示意图；FIG4 is a schematic diagram of a side view of the frame plate structure of the present invention;
图5为本发明的散热盖立体安装结构示意图；FIG5 is a schematic diagram of a three-dimensional installation structure of a heat dissipation cover according to the present invention;
图6为本发明的散热盖结立体底部结构示意图；FIG6 is a schematic diagram of the three-dimensional bottom structure of the heat dissipation cover of the present invention;
图7为本发明的封装结构立体结构示意图；FIG7 is a schematic diagram of a three-dimensional structure of a packaging structure of the present invention;
图8为本发明的防护壳立体底部结构示意图；FIG8 is a schematic diagram of the three-dimensional bottom structure of the protective shell of the present invention;
其中：1、基板；2、绝缘封装框；3、芯片；4、框板；5、散热盖；6、防护壳；7、键合线；8、导电连接件；9、注液管；10、进液孔；11、引脚；12、连接片；13、集热板；14、上吸热凸起；15、固定凸起；16、下吸热凸起；17、弧形卡孔；18、分隔凸起；19、对应口；20、开口；21、弧形凸起。Among them: 1. substrate; 2. insulating packaging frame; 3. chip; 4. frame plate; 5. heat dissipation cover; 6. protective shell; 7. bonding wire; 8. conductive connector; 9. injection pipe; 10. liquid inlet hole; 11. pin; 12. connecting piece; 13. heat collecting plate; 14. upper heat absorbing protrusion; 15. fixing protrusion; 16. lower heat absorbing protrusion; 17. arc-shaped card hole; 18. separation protrusion; 19. corresponding port; 20. opening; 21. arc-shaped protrusion.
具体实施方式DETAILED DESCRIPTION
以下结合具体实施例对上述方案做进一步说明。应理解，这些实施例是用于说明本发明而不限于限制本发明的范围。实施例中采用的实施条件可以根据具体的条件做进一步调整，未注明的实施条件通常为常规实验中的条件。The above scheme is further described below in conjunction with specific examples. It should be understood that these examples are used to illustrate the present invention and are not limited to the scope of the present invention. The implementation conditions adopted in the examples can be further adjusted according to specific conditions, and the unremarked implementation conditions are usually the conditions in routine experiments.
实施例1Example 1
如图1所示，一种插入式封装结构，包括基板1和芯片3，基板1的顶部固定连接有绝缘封装框2，且绝缘封装框2相对侧的内部均设有导电连接件8，基板1的两侧阵列设有一组引脚11，且引脚11与导电连接件8相连接，芯片3通过键合线7设在绝缘封装框2的内侧，绝缘封装框2的顶部设有框板4，框板4的中间部固定安装有集热板13，且集热板13的顶部及底部分别阵列设有上吸热凸起14、下吸热凸起16，框板4的顶部设有散热盖5，散热盖5的底部阵列连接有与上吸热凸起14相交错的分隔凸起18，散热盖5的顶部设有防护壳6，且防护壳6的内壁与基板1的外壁相贴合。As shown in FIG1 , an insertion packaging structure includes a substrate 1 and a chip 3. An insulating packaging frame 2 is fixedly connected to the top of the substrate 1, and conductive connectors 8 are provided inside opposite sides of the insulating packaging frame 2. A group of pins 11 are arrayed on both sides of the substrate 1, and the pins 11 are connected to the conductive connector 8. The chip 3 is arranged on the inner side of the insulating packaging frame 2 through bonding wires 7. A frame plate 4 is provided on the top of the insulating packaging frame 2, and a heat collecting plate 13 is fixedly installed on the middle part of the frame plate 4, and an upper heat absorbing protrusion 14 and a lower heat absorbing protrusion 16 are arrayed on the top and bottom of the heat collecting plate 13, respectively. A heat dissipation cover 5 is provided on the top of the frame plate 4, and a partition protrusion 18 staggered with the upper heat absorbing protrusion 14 is arrayed on the bottom of the heat dissipation cover 5. A protective shell 6 is provided on the top of the heat dissipation cover 5, and the inner wall of the protective shell 6 is in contact with the outer wall of the substrate 1.
本实施例中，基板1包括但不仅限于介电材料、有机材料或半导体材料，而有机材料可为具有玻璃纤维的聚丙烯、环氧树脂或氰酸酯，基半导体材料可为硅。In this embodiment, the substrate 1 includes but is not limited to dielectric materials, organic materials or semiconductor materials, and the organic material may be polypropylene with glass fibers, epoxy resin or cyanate ester, and the semiconductor material may be silicon.
本发明由基板1、绝缘封装框2、框板4、散热盖5及防护壳6所组成，结构简单，缩小了芯片3封装结构的整体尺寸，并节省了封装所需的成本，且框板4、散热盖5中的构件相配合，可起到良好的散热性能，而防护壳6本身为导热材料，不仅可避免其内组件受污染还可以对框板4、散热盖5的散热起到协助作用。The present invention is composed of a substrate 1, an insulating packaging frame 2, a frame plate 4, a heat dissipation cover 5 and a protective shell 6, and has a simple structure, reduces the overall size of the chip 3 packaging structure, and saves the cost required for packaging. The components in the frame plate 4 and the heat dissipation cover 5 cooperate with each other to achieve good heat dissipation performance, and the protective shell 6 itself is a heat-conducting material, which can not only prevent the components inside it from being contaminated but also assist the heat dissipation of the frame plate 4 and the heat dissipation cover 5.
实施例2Example 2
如图2所示，引脚11位于基板1内部的一端与导电连接件8相连接，芯片3连接在绝缘封装框2的内侧，芯片3的顶部对称阵列有键合线7，且键合线7远离芯片3的一端连接在导电连接件8的表面；导电连接件8为内部含有金属导电线的聚酰亚胺或氮化硅。As shown in FIG2 , one end of the pin 11 located inside the substrate 1 is connected to the conductive connector 8, the chip 3 is connected to the inner side of the insulating packaging frame 2, the top of the chip 3 has bonding wires 7 in a symmetrical array, and the end of the bonding wires 7 away from the chip 3 is connected to the surface of the conductive connector 8; the conductive connector 8 is polyimide or silicon nitride containing metal conductive wires inside.
本实施例中，因导电连接件8本身是导电材料，从而能够实现键合线7与引脚11之间的连接，而导电连接件8采用内部含有金属导电线的聚酰亚胺或氮化硅，至少漏出两个端点，用于分别与相邻的芯片3上的键合线7导通。In this embodiment, since the conductive connector 8 itself is a conductive material, the connection between the bonding wire 7 and the pin 11 can be achieved, and the conductive connector 8 is made of polyimide or silicon nitride containing a metal conductive wire inside, and at least two endpoints are exposed for respectively connecting to the bonding wire 7 on the adjacent chip 3.
如图3至图4所示，本实施例绝缘封装框2正面及背面的中间处均固定连接有注液管9，且注液管9的内部开设有注液孔，绝缘封装框2正面及背面的内部均开设有进液孔10，且进液孔10与注液孔相连通，进液孔10与注液孔的内壁上均设有防腐层，且防腐层材料选用为聚乙烯。As shown in Figures 3 and 4, in this embodiment, the insulating packaging frame 2 is fixedly connected to the middle of the front and back sides with an injection tube 9, and an injection hole is opened inside the injection tube 9. The insulating packaging frame 2 is provided with a liquid inlet hole 10 inside the front and back sides, and the liquid inlet hole 10 is connected to the injection hole. The inner walls of the liquid inlet hole 10 and the injection hole are provided with an anti-corrosion layer, and the material of the anti-corrosion layer is polyethylene.
本实施例中，因进液孔10与注液孔的内壁上都设有防腐层，可避免封装胶粘附在其外壁上，或对进液孔10与注液孔造成腐蚀，极大地延长了其使用寿命，且降低了生产成本，另外，为了保证芯片3封装结构整体的质量，防腐层的厚度应控制在3～10μm。In this embodiment, since an anti-corrosion layer is provided on the inner walls of the liquid inlet hole 10 and the liquid injection hole, it can prevent the packaging glue from adhering to their outer walls or causing corrosion to the liquid inlet hole 10 and the liquid injection hole, thereby greatly extending their service life and reducing production costs. In addition, in order to ensure the overall quality of the chip 3 packaging structure, the thickness of the anti-corrosion layer should be controlled at 3 to 10 μm.
本实施例框板4的正面及背面均固定连接有连接片12，连接片12的底部固定连接有与注液孔相适应的固定凸起15，注液孔的内部插接有固定凸起15；散热盖5的底部对称开设有与连接片12相适应的对应口19，且对应口19的为弧形状，连接片12位于对应口19的内侧。In this embodiment, the front and back sides of the frame plate 4 are fixedly connected with connecting pieces 12, the bottom of the connecting piece 12 is fixedly connected with a fixing protrusion 15 adapted to the injection hole, and the inside of the injection hole is plugged with the fixing protrusion 15; the bottom of the heat dissipation cover 5 is symmetrically provided with corresponding openings 19 adapted to the connecting piece 12, and the corresponding openings 19 are arc-shaped, and the connecting piece 12 is located on the inner side of the corresponding openings 19.
本实施例中，固定凸起15置入注液孔的内部，不仅可以将框板4安置在绝缘封装框2的顶部，还可以将注液孔封住，以避免封装胶在成形之前造成污染；对应口19位于注液管9的外侧，以避免散热盖5安置在框板4上时，框板4与散热盖5之间出现缝隙，使得分隔凸起18与上吸热凸起14之间不能充分接触，导致芯片3封装结构散热效果降低的问题。In this embodiment, the fixing protrusion 15 is placed inside the injection hole, which can not only place the frame plate 4 on the top of the insulating packaging frame 2, but also seal the injection hole to avoid contamination caused by the packaging glue before forming; the corresponding port 19 is located on the outside of the injection tube 9 to avoid the appearance of a gap between the frame plate 4 and the heat dissipation cover 5 when the heat dissipation cover 5 is placed on the frame plate 4, so that the separation protrusion 18 and the upper heat absorption protrusion 14 cannot be fully contacted, resulting in the problem of reduced heat dissipation effect of the chip 3 packaging structure.
如图5至图8所示，本实施例基板1的正面及背面均开设有弧形卡孔17，防护壳6的内壁上对称连接有一组与弧形卡孔17相适应的弧形凸起21，且弧形凸起21卡接在弧形卡孔17的内部。As shown in Figures 5 to 8, arc-shaped clamping holes 17 are provided on the front and back sides of the substrate 1 of this embodiment, and a group of arc-shaped protrusions 21 adapted to the arc-shaped clamping holes 17 are symmetrically connected to the inner wall of the protective shell 6, and the arc-shaped protrusions 21 are clamped inside the arc-shaped clamping holes 17.
本实施例中，框板4中设有集热板13，且其上下分别设有上吸热凸起14、下吸热凸起16，而当在芯片3表面注入封装胶之后，封装胶与下吸热凸起16均匀接触，上吸热凸起14则与分隔凸起18相交错并贴合，以此集热板13可将下吸热凸起16吸收的热量收集，并经上吸热凸起14带出，而分隔凸起18则避免上吸热凸起14上热量的延伸，同时散热盖5在防护壳6的协助下将热量散出，以确保芯片3处于较好的工作状态，提高产品的可靠性。In this embodiment, a heat collecting plate 13 is provided in the frame plate 4, and an upper heat absorbing protrusion 14 and a lower heat absorbing protrusion 16 are provided on the upper and lower parts thereof respectively. After the packaging glue is injected into the surface of the chip 3, the packaging glue is in uniform contact with the lower heat absorbing protrusion 16, and the upper heat absorbing protrusion 14 is staggered and fitted with the separation protrusion 18. In this way, the heat collecting plate 13 can collect the heat absorbed by the lower heat absorbing protrusion 16 and bring it out through the upper heat absorbing protrusion 14, while the separation protrusion 18 prevents the extension of the heat on the upper heat absorbing protrusion 14. At the same time, the heat dissipation cover 5 dissipates the heat with the assistance of the protective shell 6 to ensure that the chip 3 is in a good working state and improve the reliability of the product.
本实施例防护壳6的两侧均开设有开口20，开口20的长度大于一组引脚11之间的间距，且引脚11位于开口20的内侧；分隔凸起18之间的间距等于上吸热凸起14的宽度，且上吸热凸起14之间的间距等于分隔凸起18的宽度。In this embodiment, openings 20 are provided on both sides of the protective shell 6, the length of the opening 20 is greater than the spacing between a group of pins 11, and the pins 11 are located on the inner side of the opening 20; the spacing between the separation protrusions 18 is equal to the width of the upper heat absorption protrusions 14, and the spacing between the upper heat absorption protrusions 14 is equal to the width of the separation protrusions 18.
本实施例中，防护壳6用于对基板1上组装的构件形成保护，且开口20处可将引脚11漏出，与电路板上的导电线路连接；上吸热凸起14、下吸热凸起16及分隔凸起18的高度应控制在25～40μm，以保证芯片3封装结构整体的厚度，可避免芯片3封装结构尺寸过大的问题。In this embodiment, the protective shell 6 is used to protect the components assembled on the substrate 1, and the opening 20 allows the pin 11 to leak out and connect to the conductive circuit on the circuit board; the height of the upper heat absorption protrusion 14, the lower heat absorption protrusion 16 and the separation protrusion 18 should be controlled at 25 to 40 μm to ensure the overall thickness of the chip 3 packaging structure, thereby avoiding the problem of the chip 3 packaging structure being too large.
实施例3Example 3
本实施例用于进一步限定实施例1、实施例2的一种插入式封装结构的封装方法，包括以下步骤：This embodiment is used to further define a packaging method of an insertion packaging structure of Embodiment 1 and Embodiment 2, comprising the following steps:
S1：将基板1顶部的防护壳6打开，并将散热盖5从框板4的上方取下，通过连接片12底部的固定凸起15将框板4从绝缘封装框2的上方取下，随后将预先焊接有键合线7的芯片3放在绝缘封装框2内侧的中间部；S1: Open the protective shell 6 on the top of the substrate 1, remove the heat dissipation cover 5 from the top of the frame plate 4, remove the frame plate 4 from the top of the insulating packaging frame 2 through the fixing protrusion 15 at the bottom of the connecting piece 12, and then place the chip 3 pre-soldered with the bonding wire 7 in the middle of the inner side of the insulating packaging frame 2;
S2：当芯片3放置完成时，将芯片3上键合线7的另一端与导电连接件8焊接在一起；S2: When the chip 3 is placed, the other end of the bonding wire 7 on the chip 3 is welded to the conductive connection member 8;
S3：向注液管9中的注液孔注入封装胶，并经进液孔10进入绝缘封装框2的内侧，将框板4通过连接片12底部的固定凸起15置入注液孔内进行安置，使框板4与绝缘封装框2之间处于密闭；S3: Inject the packaging glue into the injection hole in the injection tube 9 and enter the inner side of the insulating packaging frame 2 through the liquid inlet hole 10, and place the frame plate 4 into the injection hole through the fixing protrusion 15 at the bottom of the connecting piece 12, so that the frame plate 4 and the insulating packaging frame 2 are sealed;
S4：当封装胶均匀流入芯片3的表面后，封装胶将芯片3、键合线7及下吸热凸起16包裹住，随后将散热盖5底部的分隔凸起18与上吸热凸起14相互交错，并将散热盖5安装在框板4的顶部；S4: After the packaging glue flows evenly onto the surface of the chip 3, the packaging glue wraps the chip 3, the bonding wire 7 and the lower heat absorbing protrusion 16, and then the separation protrusion 18 at the bottom of the heat dissipation cover 5 and the upper heat absorbing protrusion 14 are interlaced with each other, and the heat dissipation cover 5 is installed on the top of the frame plate 4;
S5：通过防护壳6内壁上的弧形凸起21卡入弧形卡孔17内，使防护壳6安装在基板1的顶部，并将绝缘封装框2、框板4及散热盖5包裹在其内部。S5: The arc-shaped protrusion 21 on the inner wall of the protective shell 6 is inserted into the arc-shaped clamping hole 17, so that the protective shell 6 is installed on the top of the substrate 1, and the insulating packaging frame 2, the frame plate 4 and the heat dissipation cover 5 are wrapped therein.
本实施例封装胶包括但不仅限于环氧类、有机硅类或聚氨酯类封装胶。The packaging adhesive in this embodiment includes but is not limited to epoxy, silicone or polyurethane packaging adhesives.
本实施例中，封装胶填充于框板4与绝缘封装框2之间所形成的空间，可增加芯片3与键合线7的连接韧性，及增大下吸热凸起16与其接触的面积，增强该芯片3封装结构的散热性能，进而提高芯片3封装结构的可靠度，以降低芯片3封装结构发生电性短路或漏电流等损坏芯片3的现象。In this embodiment, the packaging glue is filled in the space formed between the frame plate 4 and the insulating packaging frame 2, which can increase the connection toughness between the chip 3 and the bonding wire 7, and increase the contact area of the lower heat absorption protrusion 16 with it, thereby enhancing the heat dissipation performance of the chip 3 packaging structure, and further improving the reliability of the chip 3 packaging structure, so as to reduce the phenomenon of electrical short circuit or leakage current in the chip 3 packaging structure, which may damage the chip 3.
本实施例中，因进液孔10与注液孔的内壁上都设有防腐层，可避免封装胶粘附在其外壁上，或对进液孔10与注液孔造成腐蚀，极大地延长了其使用寿命，且降低了生产成本。In this embodiment, since an anti-corrosion layer is provided on the inner walls of the liquid inlet hole 10 and the liquid injection hole, the packaging glue can be prevented from adhering to the outer wall or corroding the liquid inlet hole 10 and the liquid injection hole, thereby greatly extending their service life and reducing production costs.
本发明中，框板4的中间部设有集热板13，且集热板13上下分别设有上吸热凸起14、下吸热凸起16，而当在芯片3表面注入封装胶之后，封装胶与下吸热凸起16均匀接触，上吸热凸起14则与分隔凸起18相交错并贴合，以此集热板13可将下吸热凸起16吸收的热量收集，并经上吸热凸起14带出，而分隔凸起18则避免上吸热凸起14上热量的延伸，同时散热盖5在防护壳6的协助下将热量散出，以确保芯片3处于较好的工作状态，提高产品的可靠性。In the present invention, a heat collecting plate 13 is provided in the middle part of the frame plate 4, and an upper heat absorbing protrusion 14 and a lower heat absorbing protrusion 16 are provided on the upper and lower parts of the heat collecting plate 13, respectively. After the packaging glue is injected into the surface of the chip 3, the packaging glue is in uniform contact with the lower heat absorbing protrusion 16, and the upper heat absorbing protrusion 14 is staggered and fitted with the separation protrusion 18. In this way, the heat collecting plate 13 can collect the heat absorbed by the lower heat absorbing protrusion 16 and bring it out through the upper heat absorbing protrusion 14, while the separation protrusion 18 prevents the extension of the heat on the upper heat absorbing protrusion 14. At the same time, the heat dissipation cover 5 dissipates the heat with the assistance of the protective shell 6 to ensure that the chip 3 is in a good working state and improve the reliability of the product.
以上仅是本发明的具体应用范例，对本发明的保护范围不构成任何限制。除上述实施例外，本发明还可以有其它实施方式。凡采用等同替换或等效变换形成的技术方案，均落在本发明所要求保护的范围之内。The above are only specific application examples of the present invention, and do not constitute any limitation on the protection scope of the present invention. In addition to the above embodiments, the present invention may also have other implementations. Any technical solution formed by equivalent replacement or equivalent transformation falls within the scope of protection claimed by the present invention.
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Effective date of registration: 20250227 Address after: Room 2444, 1st Floor, Building 7, No. 275 Liantang Road, Xinghuo Development Zone, Fengxian District, Shanghai, 201400 Patentee after: Shanghai Juyan integrated circuit Co.,Ltd. Country or region after: China Address before: 215000 The first floor of Zhongchuang Zhihuigu, Wujiang Science and Technology Innovation Park, Suzhou, Jiangsu Province (No. 229, Yunchuang Road) Patentee before: Suzhou Qinyan Integrated Circuit Co.,Ltd. Country or region before: China |
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