CN115799202A - Power module and device - Google Patents

Abstract

The invention discloses a power module and equipment. The power module includes: a substrate, one end of the substrate is provided with a conductive connector and at least one protrusion; a plurality of first pins, the first pins at least pass through the conductive The connector is connected to the substrate and realizes electrical connection, and the surface of the first pin facing the substrate is at least separated from the substrate by the protrusion. Wherein, a plurality of protrusions are arranged on the substrate, and the surface of the first pin facing the substrate abuts against the protrusions, and the protrusions support the first leg, effectively avoiding the contact between the substrate and the first pin. The movement of the position, thereby avoiding the phenomenon of glue overflow.

Description

Power Modules and Devices

technical field

The invention relates to the technical field of semiconductors, in particular to a power module and equipment.

Background technique

In the related art, in the power module (IPM) design, the surface of the DBC is usually a smooth surface. When soldering to the frame, the volume of the solder paste becomes smaller when it is melted in a reflow furnace, and shrinkage tension is formed between the DBC and the frame. It is easy to cause DBC to move towards the frame direction, which will cause serious glue overflow in the subsequent injection molding process.

Contents of the invention

The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the present invention proposes a power module, in which a plurality of protrusions are arranged on the substrate, and the surface of the first pin facing the substrate abuts against the protrusions, and the protrusions support the first leg, effectively The movement of the relative position between the substrate and the first pin is avoided, thereby avoiding glue overflow.

The invention also proposes a device.

The power module according to the embodiment of the first aspect of the present invention includes: a substrate, one end of the substrate is provided with a conductive connector and at least one protrusion; a plurality of first pins, the first pins are at least connected through the conductive connection The component is connected with the substrate and realizes electrical connection, and the side surface of the first pin facing the substrate is at least separated from the substrate by the protrusion.

According to the power module of the embodiment of the present invention, a plurality of protrusions are arranged on the substrate, and the surface of the first pin facing the substrate abuts against the protrusions, and the protrusions support the first leg, effectively preventing the substrate from contacting with the protrusions. The movement of the relative position between the first pins, thereby avoiding the glue overflowing phenomenon.

According to some embodiments of the present invention, a side surface of the protrusion facing the first pin away from the substrate is in contact with the first pin.

According to some embodiments of the present invention, the protrusion is integrally formed with the substrate, and the substrate is electrically connected to the substrate through the conductive connector and the protrusion.

According to some embodiments of the present invention, the substrate includes: an inner copper clad layer, a ceramic layer and an outer copper clad layer, the ceramic layer is sandwiched between the inner copper clad layer and the outer copper clad layer, the The inner copper clad layer is connected to the first pin, and the inner copper clad layer is provided with the protrusion.

According to some embodiments of the present invention, there are a plurality of protrusions, and the plurality of protrusions are arranged in an array on the inner copper clad layer.

According to some embodiments of the present invention, along the thickness direction of the substrate, the thickness of each of the protrusions is D, wherein the D satisfies: 30 μm≦D≦50 μm.

According to some embodiments of the present invention, at least one groove is formed on a surface of the first pin facing the substrate, and at least a part of the conductive connecting member is located in the groove.

According to some embodiments of the present invention, the number of the protrusions is N, wherein the N satisfies: 10≤N≤20.

According to some embodiments of the present invention, the shape of the protrusion is one of cuboid, cylinder, hemisphere and cone.

According to some embodiments of the present invention, each of the first pins includes: a body; a connection portion, one end of the connection portion is connected to the body, and the other end of the connection portion faces along the thickness direction of the substrate. The base plate extends obliquely; a mounting portion, one end of the mounting portion is connected to the other end of the connecting portion, and a surface of the mounting portion facing the base plate abuts against the protrusion.

According to some embodiments of the present invention, the projected area of the mounting portion on the substrate is larger than the projected area of the protrusion on the substrate.

According to some embodiments of the present invention, the conductive connector is solder paste.

According to some embodiments of the present invention, a part of the plurality of first pins is located at one side of the substrate in the width direction, and another part of the plurality of first pins is located at at least one end of the substrate in the length direction .

According to some embodiments of the present invention, the power module further includes: a plurality of second pins, the plurality of second pins are located on the other side of the width direction of the substrate; a plurality of chips, a plurality of the The chip includes at least one driver chip and at least one power chip, the driver chip is located on the second pin and electrically connected to the corresponding second pin, the power chip is located on the substrate and connected to the corresponding The first pin is electrically connected; a plastic package, the plastic package wraps the substrate and the chip, and the free end of each of the first pins and the free end of each of the second pins extend Out of the plastic package, the side of the substrate facing away from the chip is completely wrapped in the plastic package or the side of the substrate facing away from the chip is flush with the plastic package and exposed outside.

The device according to the embodiment of the second aspect of the present invention includes the power module and a controller, and the controller is electrically connected to the power module.

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and comprehensible from the description of the embodiments in conjunction with the following drawings, wherein:

Fig. 1 is a side view of a power module in the prior art;

Fig. 2 is a schematic diagram of a direction of a power module according to an embodiment of the present invention;

Fig. 3 is a schematic diagram of another direction of a power module according to an embodiment of the present invention;

4 is a cross-sectional view of a power module according to an embodiment of the present invention;

5 is a bottom view of a power module according to an embodiment of the present invention;

6 is a top view of a power module according to an embodiment of the present invention;

7 is a partial schematic diagram of a power module according to an embodiment of the present invention;

8 is a schematic diagram of a substrate according to an embodiment of the present invention;

FIG. 9 is a partial schematic diagram of a substrate according to an embodiment of the present invention.

Reference signs:

current technology:

100', power module; 10', substrate; 20', first pin;

This application:

100. Power module;

10. Substrate; 11. Inner copper clad layer; 12. Ceramic layer; 13. Outer copper clad layer; 14. Protrusion;

20. The first pin; 21. The body; 22. The connection part; 23. The installation part; 24. The groove;

30. The second pin;

40. Driver chip;

50. Power chips.

Detailed ways

Embodiments of the present invention are described in detail below, and the embodiments described with reference to the drawings are exemplary, and embodiments of the present invention are described in detail below.

A power module 100 according to an embodiment of the present invention is described below with reference to FIGS. 1-9 , and a device including the power module 100 described above is also proposed.

As shown in FIGS. 1-6 , the power module 100 includes: a substrate 10 and a plurality of first pins 20 . One end of the substrate 10 is provided with a conductive connector and at least one protrusion 14; the first pin 20 is at least connected to the substrate 10 through the conductive connector and is electrically connected, and the side surface of the first pin 20 facing the substrate 10 is connected to the substrate 10 They are at least separated by protrusions 14 . Specifically, one end surface of the substrate 10 is provided with a conductive connector and at least one protrusion 14, that is, the adjacent side surface of the substrate 10 is provided with at least one protrusion 14 and a conductive connector, and the protrusion 14 can effectively connect the first pin One end of 20 is spaced apart from substrate 10 . The protrusion 14 can protrude from the side surface of the substrate 10 adjacent to the first pin 20 toward the direction of the first pin 20, and the conductive connector is a component with conductivity and adhesive properties, which can realize the first pin 20 Simultaneously with the physical connection to the substrate 10 , the first pin 20 can be electrically connected to the substrate 10 .

As shown in FIG. 2 and FIG. 3 , a plurality of first pins 20 may be disposed on one side of the substrate 10 in the width direction, and the plurality of first pins 20 are arranged at intervals along the length direction of the substrate 10 . And, when the substrate 10 is connected to the first pin 20, a conductive connector can be placed between the protrusion 14 and the two faces of one of the first pins 20 opposite to each other, so as to connect the protrusion 14 to one of the first pins 20. A pin 20 is pre-bonded, and at this time, the protrusion 14 can support one of the first pins 20 on the substrate 10, and then the conductive connector is melted through the reflow furnace, and the conductive connector becomes liquid after melting. At this time, At least part of the conductive connection will flow to the periphery of the protrusion 14 , so that the thickness of the conductive connection between the first pin 20 and the substrate 10 will become thinner, and the connection between the first pin 20 and the substrate 10 will be realized after curing. Since the protrusion 14 can limit the movement of the first pin 20 and the substrate 10 towards the direction of the substrate 10, while ensuring the reliability of the connection between the first pin 20 and the substrate 10, the gap between the first pin 20 and the substrate 10 is avoided. Relative displacement occurs between the first pins 20 and the substrate 10 so that the actual distance between the first pin 20 and the substrate 10 is consistent with the designed distance, thereby avoiding glue overflow during the injection molding process.

By setting at least one protrusion 14 and a conductive connector at one end of the substrate 10, and both the conductive connector and the protrusion 14 are located between the surface of the substrate 10 facing the first pin 20 and the first pin 20, the second A pin 20 is electrically connected to the substrate 10 through a conductive connector, thus, compared with the conventional power module 100, the protrusion 14 can support the first pin 20, and connect the first pin 20 and the The distance between the substrates 10 can effectively prevent the relative displacement between the first pins 20 and the substrate 10 , thereby avoiding glue overflow during the injection molding process.

In the prior art, as shown in FIG. 1 , the surface of the power module 100 ′, the substrate 10 ′ is usually a smooth surface. When soldering to the first pin 20 ′, the volume of the solder becomes smaller when it is melted in a reflow furnace. Shrinkage tension will be formed between the substrate 10' and the first lead 20', which will easily cause the substrate 10' to move toward the first lead 20', which will cause serious glue overflow during the subsequent injection molding process. In the embodiment of the present invention, a plurality of protrusions 14 are provided on the substrate 10, and the plurality of protrusions 14 support the first pin 50, and the protrusions 14 make the welding between the substrate 10 and the first pin 20 There is shrinkage tension when the agent is melted, which can effectively avoid the movement of the relative position of the substrate 10 and the first pin 20, thereby avoiding the phenomenon of glue overflow during subsequent packaging.

Thus, a plurality of protrusions 14 are provided on the substrate 10, and the surface of the first pin 20 facing the substrate 10 abuts against the protrusions 14, and the protrusions 14 support the first leg 20, effectively preventing the substrate from The movement of the relative position between 10 and the first pin 20 can avoid glue overflowing.

As shown in FIG. 8 and FIG. 9 , the side of the protrusion 14 away from the side surface of the substrate 10 facing the first pin 20 is in contact with the first pin 20 . Specifically, after the conductive connector becomes liquid, the conductive connector can all flow around the protrusion 14, and at this time, the side surface of the protrusion 14 adjacent to the first pin 20 is in direct contact with the first pin 20, The protrusion 14 still supports the first pin 20 on the substrate 10 . Thus, while the first pin 20 can be electrically connected to the substrate 10 , the protrusion 14 can better support the first pin 20 and prevent the first pin 20 from moving toward the substrate 10 .

Wherein, the protrusion 14 is integrally formed with the substrate 10 , and the first pin 20 is electrically connected to the substrate 10 through the conductive connector and the protrusion 14 . For example, the protrusion 14 can be precisely obtained by etching, stamping, welding and the like. With such arrangement, the assembly steps of the power module 100 can be reduced, thereby improving the assembly efficiency of the power module 100 .

As shown in FIG. 4 , the substrate 10 includes: an inner copper clad layer 11, a ceramic layer 12 and an outer copper clad layer 13, the ceramic layer 12 is interposed between the inner copper clad layer 11 and the outer copper clad layer 13, and the inner copper clad layer 11 is connected to the first pin 20 , and a plurality of protrusions 14 are arranged on the inner clad copper layer 11 . Specifically, the substrate 10 includes a laminated inner copper clad layer 11 , a ceramic layer 12 and an outer copper clad layer 13 . Specifically, the inner copper clad layer 11 has good electrical conductivity, thereby ensuring the effective electrical connection between the first pin 20 and other components and the substrate 10; the edge of the ceramic layer 12 exceeds the inner copper clad layer 11 and the outer copper clad layer 13, the ceramic layer 12 is an insulating layer, and a relatively large creepage distance is maintained between the inner copper layer 11 and the outer copper layer 13; when the power module 100 works to generate heat, the heat can pass through the first copper layer and the The ceramic layer 12 is transferred to the outer copper clad layer 13 , and the outer copper clad layer 13 exchanges heat with the outside to realize heat dissipation of the power module 100 . The substrate 10 has excellent thermal cycle performance, stable shape, good rigidity, high thermal conductivity, high reliability, and is a pollution-free and pollution-free green product.

As shown in FIG. 8 and FIG. 9 , there are multiple protrusions 14 , and the plurality of protrusions 14 are arranged in an array on the inner copper clad layer 11 . Specifically, a plurality of protrusions 14 are arranged in an array on the entire surface of the inner copper clad layer 11 on the substrate 10 , so that the supporting force of the protrusions 14 on the first pin 20 is more balanced. When the first pins 20 are connected to the substrate 10, the distribution of the conductive connectors between the first pins 20 and the substrate 10 is also more uniform, preventing conduction at certain positions between the substrate 10 and the first pins 20. Insufficient connectivity of the connector leads to failure of the connection between the first pin 20 and the substrate 10 .

Wherein, the shape of the protrusion 14 is one of cuboid, cylinder, hemispherical and cone. Since the protrusion 14 has a supporting effect on the first pin 20, the above-mentioned shape of the protrusion 14 can better support the first pin 20, thereby effectively avoiding the movement of the relative position of the first pin 20 and the substrate 10 . Specifically, the protrusion 14 is in the shape of a cuboid, so that the first pin 20 can be firmly connected to the substrate 10 .

Further, along the thickness direction of the substrate 10 , the thickness of each protrusion 14 is D, wherein, D satisfies: 30 μm≦D≦50 μm. Specifically, when D<30 μm, the thickness of the protrusion 14 is too small, so that the gap between the substrate 10 and the first pin 20 is too small, resulting in a small volume of the conductive connector, which will reduce the connection between the substrate 10 and the first lead 20. The reliability of the connection between the pins 20 makes the connection failure between the first pin 20 and the substrate 10 prone to occur. When D>50 μm, the thickness of the protrusion 14 is too large, so that the distance between the first pin 20 and the substrate 10 is too large, which will increase the amount of conductive connectors and increase the cost of the power module 100 . Therefore, by setting the thickness of the protrusion 14 to be 30 μm≤D≤50 μm, not only the amount of conductive connectors used can be reduced, the first pin 20 can be reliably connected to the substrate 10, but also the protrusion 14 can be ensured to the first lead. The feet 20 play a supporting role, preventing the first pins 20 from moving toward the substrate 10 and avoiding glue overflow during the injection molding process.

As shown in FIG. 7 , at least one groove 24 is formed on the surface of the first pin 20 facing the substrate 10 , and at least a part of the conductive connecting member is located in the groove 24 . Specifically, the groove 24 is located on the first pin 20, and the groove 24 is located on the side of the first pin 20 facing the substrate 10. When the conductive connector bonds the substrate 10 and the first pin 20, it will conduct electricity. The connector melts, and now part of the conductive connectors can flow into the groove 24, preventing the conductive connectors from accumulating around the protrusion 14, thereby making the distribution of the conductive connectors around the protrusion 14 more uniform, and increasing the number of conductive connectors and The contact area of the first pin 20 further enhances the connection reliability between the first pin 20 and the substrate 10 .

According to FIG. 9 , the number of protrusions 14 is N, where N satisfies: 0≤N≤20. Specifically, when N>20, the number of protrusions 14 is too large, and the arrangement density of protrusions 14 on the mounting portion 23 is too high, which is not conducive to the processing of protrusions 14; There are few conductive connectors that can be accommodated with the substrate 10 , and the protrusion 14 cannot support the first pin 20 on the substrate 10 well, resulting in an unstable connection between the first pin 20 and the substrate 10 . The number of protrusions 14 is 18, and when the conductive connectors become liquid, the distance between two adjacent protrusions 14 can accommodate an appropriate amount of conductive connectors, which can reliably connect the first pin 20 and the substrate 10 , and facilitate the processing of the protrusion 14.

7, each first pin 20 includes: a body 21; a connecting portion 22, one end of the connecting portion 22 is connected to the body 21, and the other end of the connecting portion 22 extends obliquely toward the substrate 10 along the thickness direction of the substrate 10; The mounting portion 23 , one end of the mounting portion 23 is connected to the other end of the connecting portion 22 , and the surface of the mounting portion 23 facing the substrate 10 abuts against the protrusion 14 . Specifically, each first pin 20 includes a body 21, a connecting portion 22 and a mounting portion 23, the body 21 is used to connect with other devices; one end of the connecting portion 22 is connected to the side of the body 21 adjacent to the substrate 10, The other end of the connecting portion 22 extends obliquely toward the substrate 10 and is connected to the mounting portion 23 ; the mounting portion 23 extends along the length of the substrate 10 , so that the structure of the first pin 20 is simple and easy to process.

Further, the projected area of the mounting portion 23 on the substrate 10 is larger than the projected area of the protrusion 14 on the substrate 10 . specifically. The projected area of the mounting portion 23 on the substrate 10 can be greater than the projected area of the projection 14 on the substrate 10; or, the projected area of the mounting portion 23 on the substrate 10 can be equal to the projected area of the projection 14 on the substrate 10 area; or, the projected area of the mounting portion 23 on the substrate 10 may be smaller than the projected area of the protrusion 14 on the substrate 10 , which is not limited here.

Optionally, the conductive connector is solder paste. As a connecting material, solder paste can not only connect the first pin 20 to the substrate 10 , but also conduct electricity so that the substrate 10 and the first pin 20 are electrically connected, so as to realize the use function of the power module 100 .

A part of the plurality of first pins 20 is located at one side in the width direction of the substrate 10 , and another part of the plurality of first pins 20 is located at at least one end of the substrate 10 in the length direction. As shown in Figures 2-6, there are 10 first pins 20, eight first pins 20 are arranged at intervals along the length direction of the substrate 10, and two first pins 20 are respectively distributed in the length direction of the substrate 10 both ends. Therefore, the distribution of the first pins 20 can better realize the electrical connection with the chip, so as to realize the function of the power module 100 .

Further, the power module 100 also includes a plurality of second pins 30 , a plurality of chips and a plastic package. The plurality of second pins 30 are located on the other side of the substrate 10 in the width direction. The multiple chips include at least one driver chip 40 and at least one power chip 50, the driver chip 40 is located on the second pin 30 and is electrically connected to the corresponding second pin 30, the power chip 50 is located on the substrate 10 and is connected to the corresponding second pin 30. A pin 20 is electrically connected. The plastic package wraps the substrate 10 and the chip, and the free end of each first lead 20 and the free end of each second lead 30 protrude from the plastic package. Specifically, the second pins 30 are located on the other side of the substrate 10 in the width direction and are opposite to the plurality of first pins 20 . The second pin 30 can be electrically connected to the driver chip 40 through gold wires, copper wires or silver wires, and the driver chip 40 can be electrically connected to the gate of the power chip 50 using aluminum wires, gold wires or copper wires to realize the driver chip 40. function. The first pin 20 can be electrically connected to the emitter of the power chip 50 by using an aluminum wire or aluminum foil, so as to realize the function of the power chip 50 . The plastic package is wrapped around the periphery of the substrate 10 to protect the substrate 10 and the chips.

In the manufacturing process of the power module 100, firstly, conductive connectors such as solder paste are printed on the substrate 10, and then the first pins 20 and the second pins 30 are installed on both sides of the substrate 10 in the width direction, and downward Press the first pin 20 and the second pin 30, so that the first pin 20 and the second pin 30 are bonded to the conductive connector. At this time, the first pin 20 is in contact with the protrusion 14, and the solder paste is squeezed out. Press and distribute around the protrusions 14, and then perform reflow soldering in a reflow furnace, the conductive connectors become liquid and flow into the gaps between the protrusions 14 and the grooves 24, and then a plurality of chips are placed on the corresponding corresponding parts of the substrate 10. Position and mount, and finally the whole is plastic-encapsulated, and one end of the first pin 20 and the second pin 30 protrudes from the plastic package.

According to an optional embodiment of the present invention, the side of the substrate 10 away from the chip is completely wrapped in the plastic package. In this way, the entire substrate 10 is encapsulated in the plastic package, the first pins can be flexibly arranged in different positions of the inner copper clad layer 11 , and the substrate 10 can be completely wrapped by the plastic package, which can improve the safety and sealing of the substrate 10 .

According to another optional embodiment of the present invention, the side of the substrate 10 facing away from the chip is flush with the plastic package and exposed outside. In this way, the side of the substrate 10 facing away from the chip is exposed outside, that is, the outer copper layer 13 can expose the plastic package, so that the chip can realize heat dissipation through the outer copper layer 13 . Further, the outer copper clad layer 13 can also be bonded to the heat sink, and the substrate can be dissipated through the heat sink, so that the chip has better heat dissipation performance.

The device according to the embodiment of the second aspect of the present invention includes a power module 100 and a controller, and the controller is electrically connected to the power module 100 .

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial" , "radial", "circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device or Elements must have certain orientations, be constructed and operate in certain orientations, and therefore should not be construed as limitations on the invention.

In the description of this specification, references to the terms "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific examples," or "some examples" are intended to mean that the implementation A specific feature, structure, material, or characteristic described by an embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example.

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes, modifications, substitutions and modifications can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the invention is defined by the claims and their equivalents.

Claims (15)

1. A power module, comprising:

the conductive connector comprises a substrate, wherein one end of the substrate is provided with a conductive connecting piece and at least one bulge;

the first pins are connected with the substrate at least through the conductive connecting piece and are electrically connected, and the surface of one side, facing the substrate, of each first pin is separated from the substrate at least through the protrusions.

2. The power module of claim 1, wherein a side surface of the protrusion facing the first pin away from the substrate is in contact with the first pin.

3. The power module of claim 1, wherein the protrusion is integrally formed with the substrate, and the first pin is electrically connected to the substrate through the conductive connection member and the protrusion.

4. The power module of claim 1, wherein the substrate comprises: the ceramic layer is clamped between the inner copper-clad layer and the outer copper-clad layer, the inner copper-clad layer is connected with the first pins, and the protrusions are arranged on the inner copper-clad layer.

5. The power module of claim 4, wherein the plurality of bumps are arranged in an array on the inner copper-clad layer.

6. The power module according to claim 1, wherein a thickness of each of the protrusions in a thickness direction of the substrate is D, wherein D satisfies: d is more than or equal to 30 mu m and less than or equal to 50 mu m.

7. The power module of claim 1, wherein a surface of a side of the first lead facing the substrate has at least one recess formed therein, at least a portion of the conductive connector being located within the recess.

8. The power module of claim 1, wherein the number of protrusions is N, wherein N satisfies: n is more than or equal to 10 and less than or equal to 20.

9. The power module of claim 1, wherein the shape of the protrusion is one of a rectangular parallelepiped, a cylinder, a hemisphere, and a cone.

10. The power module of claim 1, wherein each of the first pins comprises:

a body;

one end of the connecting part is connected with the body, and the other end of the connecting part extends towards the substrate in an inclined manner along the thickness direction of the substrate;

the installation department, the one end of installation department with connecting portion the other end links to each other, the installation department towards one side surface of base plate with protruding butt.

11. The power module of claim 10, wherein a projected area of the mounting portion on the substrate is larger than a projected area of the protrusion on the substrate.

12. The power module of claim 1, wherein the conductive connection is a solder paste.

13. The power module according to any one of claims 1 to 12, wherein a part of the plurality of first pins is located on one side in a width direction of the substrate, and another part of the plurality of first pins is located on at least one end in a length direction of the substrate.

14. The power module of claim 13, further comprising:

the second pins are positioned on the other side of the width direction of the substrate;

the plurality of chips comprise at least one driving chip and at least one power chip, the driving chip is positioned on the second pins and electrically connected with the corresponding second pins, and the power chip is positioned on the substrate and electrically connected with the corresponding first pins;

the plastic-sealed body, the plastic-sealed body parcel the base plate with the chip, and every the free end of first pin and every the free end of second pin stretches out the plastic-sealed body, the one side that the base plate deviates from the chip is wrapped up in the plastic-sealed body completely or the one side that the base plate deviates from the chip exposes outside with plastic-sealed body parallel and level.

15. An apparatus comprising the power module of any of claims 1-14 and a controller, the controller being electrically connected to the power module.

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