CN114334925A - Repair method and display panel after light-emitting chip encapsulation - Google Patents

Abstract

The application provides a light-emitting chip glue-sealed repair method and a display panel, the position of a fault chip on a substrate is detected and obtained, the sealant covering the fault chip is cut and taken out, after a new light-emitting chip is placed back to the position of the fault chip, the cut and taken-out sealant covers the filled light-emitting chip again, so that damage to the sealant is avoided, the risk of failure of the light-emitting chip can be reduced, and the optical consistency of the sealant covering the filled light-emitting chip and the surrounding uncut sealant is ensured.

Description

Repair method and display panel after light-emitting chip encapsulation

technical field

The present application relates to the technical field of display manufacturing, and in particular, to a method for repairing a light-emitting chip after sealing and a display panel.

Background technique

With the gradual maturity of micro & mini light emitting diode (MLED) technology, its main development direction is also divided into two major areas: backlight and direct display. From the perspective of packaging, MLEDs at this stage are also divided into three categories: surface mounted devices (SMD), integrated matrix devices (IMD) and chips on board (COB). In the field of direct display, IMD and COB solutions are widely used in the field of direct display. Due to the short process route and low cost, the COB solution has become the mainstream solution for small-sized direct display.

Since the COB scheme adopts the process of first printing and then encapsulating the whole surface, which makes its fault tolerance rate low, once an error occurs in the sealing process, it is almost impossible to repair it. As the size of the light-emitting chips of direct display products becomes smaller and smaller, there are more and more light-emitting chips on the substrate, and the expansion and contraction of the plastic material during the sealing process also increases the possibility of failure of the light-emitting chips. Greatly increases the cost of the surface mount technology (SMT) segment.

The current post-sealing rework machine on the market is laser rework, which uses a laser to remove the glue material at the position of the bad lamp, and then performs glue injection and curing again. There are two problems with this solution. One is that the vaporization temperature of laser heating will radiate to the surrounding area, causing the surrounding plastic to turn yellow or the light-emitting chip to be damaged. Optical inconsistencies, while also increasing the risk of substrate failure due to reheating of the substrate.

To sum up, there is a problem that the light-emitting chip fails due to high temperature in the process of repairing the existing light-emitting chip after encapsulation. Therefore, it is necessary to provide a repair method after the light-emitting chip is encapsulated to improve this defect.

SUMMARY OF THE INVENTION

The embodiment of the present application provides a method for repairing a light-emitting chip after encapsulation, which is used to solve the problem of the failure of the light-emitting chip due to high temperature during the repairing process of the existing light-emitting chip after encapsulation.

The embodiment of the present application provides a method for repairing a light-emitting chip after encapsulation, wherein a plurality of light-emitting chips and a sealant layer covering the light-emitting chips are arranged on a substrate, and the repair method after encapsulating the light-emitting chip includes:

Identifying the faulty chip in the light-emitting chip, and obtaining the position of the faulty chip on the substrate;

cutting and removing the sealant covering the faulty chip;

removing the faulty chip, and filling a new light-emitting chip at the position of the faulty chip; and

The sealant that has been cut and taken out is placed back at the position where the faulty chip is located, and the filled light-emitting chip is covered.

According to an embodiment of the present application, the step of cutting and taking out the sealant covering the faulty chip includes:

cutting the sealant covering the faulty chip by means of physical cutting; and

The cut sealant is taken out by means of negative pressure adsorption.

According to an embodiment of the present application, the step of cutting the sealant covering the faulty chip by means of physical cutting includes:

Use a cutter to cut the sealant covering the faulty chip along the thickness direction of the sealant layer;

Wherein, the cutter includes a hollow structure in the middle and a blade surface surrounding the hollow structure.

According to an embodiment of the present application, the substrate is provided with a plurality of light-emitting units, each of the light-emitting units includes at least two light-emitting chips of different colors, and the repair method after the light-emitting chips is encapsulated includes:

cutting and removing the sealant covering the light-emitting unit where the faulty chip is located; and

The sealant that has been cut and taken out is placed back where the faulty chip is located, and covers the light-emitting unit where the filled light-emitting chip is located.

According to an embodiment of the present application, the width of the cutter is greater than the width of the light-emitting unit.

According to an embodiment of the present application, a ratio of the width of the tool to the width of the light-emitting unit is greater than or equal to 1.2.

According to an embodiment of the present application, the step of placing the sealant that has been cut and taken out back to the position where the faulty chip is located, and wrapping the filled light-emitting chip includes:

coating an ambient temperature adhesive on the sealant; and

The sealant is placed back at the position of the faulty chip, the filled light-emitting chip is covered, and the sealant is bonded to the light-emitting chip and the surrounding uncut sealant.

According to an embodiment of the present application, the refractive indices of the sealant and the room temperature adhesive are both greater than or equal to 1.5 and less than or equal to 1.7.

According to an embodiment of the present application, the material of the room temperature adhesive includes any one of vinyl acetate, allyl-based, polyurethane-based and acrylate-based materials.

According to the method for repairing a light-emitting chip after encapsulation provided by an embodiment of the present application, an embodiment of the present application further provides a display panel. The display panel is obtained by using the above-mentioned repairing method after encapsulating a light-emitting chip.

Beneficial effects of the embodiments of the present application: The embodiments of the present application provide a method for repairing a light-emitting chip after encapsulation and a display panel. By detecting and obtaining the position of the faulty chip on the substrate, the encapsulant covering the faulty chip is cut and taken out. , after placing the new light-emitting chip back to the location of the faulty chip, the cut and removed sealant is re-wrapped to the filled light-emitting chip, so as to avoid damage to the sealant, thereby reducing the risk of failure of the light-emitting chip. And ensure the optical consistency of the sealant covering the filled light-emitting chip and the surrounding uncut sealant.

Description of drawings

FIG. 1 is a schematic structural diagram of a light-emitting chip provided by an embodiment of the present application after encapsulation;

2 is a flowchart of a method for repairing a light-emitting chip after encapsulation provided by an embodiment of the present application;

3a to 3e are schematic flowcharts of a first method for repairing a light-emitting chip after encapsulation according to an embodiment of the present application; and

4a to 4e are schematic flowcharts of a second method for repairing a light-emitting chip after encapsulation according to an embodiment of the present application.

Detailed ways

The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present application may be practiced. Directional terms mentioned in this application, such as [upper], [lower], [front], [rear], [left], [right], [inner], [outer], [side], etc., are only for reference Additional schema orientation. Therefore, the directional terms used are used to describe and understand the present application, rather than to limit the present application. In the figures, structurally similar elements are denoted by the same reference numerals.

The present application will be further described below with reference to the accompanying drawings and specific embodiments.

An embodiment of the present application provides a method for repairing a light-emitting chip after encapsulation. As shown in FIG. 1 , FIG. 1 is a schematic structural diagram of the light-emitting chip provided by the embodiment of the application after encapsulation. A plurality of light-emitting chips 20 are disposed on the substrate 10 . and a sealant layer 30 covering the light-emitting chip.

The substrate 10 may be an array substrate, and the substrate 10 may include a base substrate and a thin film transistor array layer formed on the base substrate, and a pixel driver for controlling and driving the light-emitting chip 20 to emit light is formed in the thin film transistor array layer. circuit.

The light-emitting chip 20 may be any one of a micro light-emitting diode (microlightemttingdiode, Micro LED) or a mini light-emitting diode (minilightemttingdiode, Mini LED). In the embodiment of the present application, the light-emitting chip 20 is a Micro LED, and the light-emitting chip 20 can be directly bound on the substrate 10 and electrically connected with the pixel driving circuit in the substrate 10 .

The light-emitting chip 20 may include a red light-emitting chip 21 , a green light-emitting chip 22 and a blue light-emitting chip 23 , and the red light-emitting chip 21 , the green light-emitting chip 22 and the blue light-emitting chip 23 may be arranged on the substrate 10 according to a preset pixel arrangement.

After the light-emitting chip 20 is transferred to the substrate 10 , the light-emitting chip 20 may be packaged by the whole-covered sealant layer 30 in the manner of chips on board (COB), so as to prevent the light-emitting chip 20 from being damaged. Water vapor, oxygen, and other external environmental damage.

Referring to FIG. 2 and FIGS. 3a to 3e, FIG. 2 is a flowchart of a method for repairing a light-emitting chip after encapsulation provided by an embodiment of the present application, and FIGS. 3a to 3e are a first light-emitting chip provided by an embodiment of the present application. A schematic flowchart of the repair method after sealing, the repair method after sealing the light-emitting chip includes:

Step S10 : Identify the faulty chip in the light-emitting chip 20 , and obtain the position of the faulty chip on the substrate 10 .

In the embodiment of the present application, the faulty chip refers to the light-emitting chip 20 in which a dead light, a dim light, or a flashing light occurs. The dead light means that the faulty chip does not emit light, and the dim light means that the brightness of the light emitted by the faulty chip is lower than the brightness of the light emitted when the other light-emitting chips 20 are working normally.

In the step S10, the specific operations of identifying the faulty chip in the light-emitting chip 20 and acquiring the position of the faulty chip on the substrate 10 are as follows:

The light-emitting chips 20 on the substrate 10 are lighted up and tested by the detection device. All the light-emitting chips 20 on the substrate 10 except the faulty chip start to work normally, and the location of the faulty chip and the type of the faulty chip are detected and recorded.

For example, in FIG. 3a, only one red light-emitting chip 21 on the substrate 10 is illustrated as a faulty chip. When there is one or more defective chips on the substrate 20 , the defective chips may be any one or more of the red light-emitting chips 21 , the green light-emitting chips 22 and the blue light-emitting chips 23 .

Step S20 : cutting and taking out the sealant covering the faulty chip.

In the step S20, the step of cutting and taking out the sealant covering the faulty chip includes: S201: cutting the sealant 31 covering the faulty chip by physical cutting; and S202 : Take out the cut sealant 31 by means of negative pressure adsorption.

In the step S201, the specific operation of cutting the sealant 31 covering the faulty chip by physical cutting is as follows:

A cutter 40 is used to cut the sealant 31 covering the defective chip along the thickness direction of the sealant layer 30 .

3a and 3b, the cutter 40 includes a hollow structure in the middle and a blade surface surrounding the hollow structure. The hollow structure is used for accommodating the sealant covering the faulty chip, and the blade surface is used for sealing Glue 31 is cut.

In the embodiment shown in FIG. 3a, the cutter 40 only cuts the sealant covering the faulty chip, which requires relatively high precision and thickness of the cutter 40, and the thickness of the blade surface of the cutter 40 needs to be smaller than any two adjacent ones. The distance between the light-emitting chips 20, and the width of the cutter 40 is greater than the width of the light-emitting chips, so as to avoid damage to the faulty chips caused by the cutter 40 when cutting the sealant.

It should be noted that, in the embodiments of the present application, FIG. 3a to FIG. 3e only illustrate the repair process of one faulty chip. In practical applications, multiple cutters 40 can be used to simultaneously package packages covering multiple faulty chips. Glue is cut, and multiple faulty chips are repaired at the same time. For the process of cutting and repairing other faulty chips, reference may be made to FIG. 3a to FIG. 3e, which will not be repeated here.

After the sealant is cut with a cutter, the cut sealant needs to be removed from the substrate 10 . As shown in FIG. 3 a , the sealant can be sucked out from the substrate 10 by the suction tool 50 through negative pressure suction.

The adsorption tool 50 can be communicated with the hollow structure of the cutter 40. After the cutter 40 completes the cutting of the sealant 31, the gas in the hollow structure is extracted by the adsorption tool 50, so that the air pressure in the hollow structure is lower than the atmospheric pressure in the external environment. So that the cut sealant 31 can be sucked by the cutter 40 and the suction tool 50 , so that the cut sealant can be removed from the substrate 10 without destroying the sealant.

The pressure of the adsorption tool 50 when adsorbing the sealant 31 may be between 10 and 100 Pa.

It should be noted that, in the embodiment of the present application, the sealant 31 is cut with a cutter as shown in FIG. 3a, so that the high temperature generated by the laser cutting the sealant can be avoided from causing damage to other normal light-emitting chips, so that the The problem of the failure of the light-emitting chip due to high temperature during the repair process after the light-emitting chip is sealed can be solved, and at the same time, the shape and material of the cut sealant 31 can be guaranteed not to be damaged.

In other embodiments, the cutter for cutting the sealant 31 is not limited to the type shown in FIG. 3a, and the sealant can also be cut by water jet or other physical cutting methods, so that the high temperature will not be generated, and the Damage to the shape and material of the sealant 31 .

Step S30 : removing the faulty chip, and filling the position of the faulty chip with a new light-emitting chip.

In the step S30, the specific operation of removing the faulty chip is as follows:

Scrape off the faulty chip to form the to-be-repaired part; clean the exposed pads on the to-be-repaired part. Specifically, a laser can be used to heat the faulty chip to melt the solder paste on the pads of the substrate 10, and a robotic arm can be used to take out the faulty chip, or the faulty chip can also be taken out from the substrate by means of air blowing, so as to remove the faulty chip from the substrate. A to-be-repaired portion is formed on 10 .

In the step S30, the specific operation of filling a new light-emitting chip at the position where the faulty chip is located is as follows:

The to-be-repaired part is treated with a crystal-replenishing treatment. Specifically, each to-be-repaired part is subjected to single-point crystal-filling processing by a die bonder, and a normal light-emitting chip is placed in the to-be-repaired part. The color of the light emitted by the normal light-emitting chip is the same as the color of the light emitted by the faulty chip.

In the step S30, the specific operation of performing crystal supplementation processing on the to-be-complemented portion is as follows:

Point solder paste on the part to be repaired; specifically, point the solder paste on the pad of the substrate at the part to be repaired through the die bonder, or point other pads on the substrate at the part to be repaired as needed Variety of solders to replace the solder paste function;

Place the normal light-emitting chip in the to-be-repaired part; specifically, the normal light-emitting chip can be placed in the to-be-repaired part through a die bonder;

The solder paste is first melted and then solidified to realize the operation of crystal-refining the part to be repaired, so that the normal light-emitting chip placed in the to-be-repaired part is stably attached to the substrate, so as to achieve the effect of repairing the light-emitting chip; specifically, The melting operation of the solder paste can be realized by high temperature heating such as reflow soldering, laser welding or hot air blowing. After the above operation is stopped, the solder paste is cooled and solidified.

As shown in FIG. 3c , after the faulty chip is removed, the normal red light-emitting chip 21 ′ is moved to the position where the faulty red light-emitting chip 21 is located, and the normal red light-emitting chip 21 ′ is bound to the substrate 10 by the above method. superior.

Step S40 : returning the sealant that has been cut and taken out to the position where the faulty chip is located, and wraps the filled light-emitting chip.

As shown in FIG. 3d to FIG. 3e , in the step S40, the step of placing the cut and removed sealant 31 back to the position where the faulty chip is located, and wrapping the filled light-emitting chip includes:

Step S401: coating the normal temperature adhesive 32 on the sealant 31; and

Step S402: Put the sealant 31 back to the position where the faulty chip is located, cover the filled light-emitting chip, and make the sealant 31 adhere to the light-emitting chip and the surrounding uncut sealant Knot.

The refractive indices of the sealant 31 and the room temperature adhesive 32 are both greater than or equal to 1.5 and less than or equal to 1.7. Preferably, the refractive index of the sealant 31 should be the same or similar to the refractive index of the normal temperature adhesive 32, so that the refraction of light at the interface between the sealant layer 30 and the normal temperature adhesive 32 can be reduced, so as to ensure The light utilization of the display panel. For example, the refractive index of the sealant 31 and the room temperature adhesive 32 may both be 1.5, 1.6 or 1.7, etc., and the refractive index of the sealant 31 and the room temperature adhesive 32 may also be different. , it only needs to be between 1.5 and 1.7, and there is no limit here.

Specifically, in the step S401, the material of the normal temperature adhesive 32 may include any one of vinyl acetate, allyl, polyurethane and acrylate materials. In the embodiment of the present application, the normal temperature adhesive may be a common interface adhesive, and the material of the common interface adhesive is vinyl acetate. In other embodiments, the room temperature adhesive may also be a UV-curable adhesive, the material of which includes at least one of allyl, polyurethane, and acrylate.

It should be noted that, in the embodiment of the present application, the light-emitting chip after being filled is re-wrapped with the cut glue material. Since the shape and material of the cut glue material are not damaged, the normal temperature adhesive is used to seal the light-emitting chip. The cut sealant is bonded to the light-emitting chip and the uncut sealant, which can avoid the thermal expansion caused by the heating of the glue material and the secondary damage to the substrate caused by high temperature, and can also ensure the reworked area of the substrate and other unreworked areas. The optical properties of the regions are consistent.

As shown in FIGS. 4a to 4e , FIGS. 4a to 4e are schematic flowcharts of the second light-emitting chip repair method after encapsulation provided by the embodiment of the present application. It should be noted that the second method provided by the embodiment of the present application The repair method after the light-emitting chip is encapsulated is roughly the same as the repair method after encapsulation of the first light-emitting chip provided in the embodiment of the present application, and the differences are:

As shown in FIG. 4a , the substrate 10 is provided with a plurality of light-emitting units EU, and each of the light-emitting units EU includes at least two light-emitting chips 20 with different colors. For example, the light-emitting unit EU may be composed of a red light-emitting chip 21 , a green light-emitting chip 22 and a blue light-emitting chip 23 . In each of the light-emitting units EU, the red light-emitting chips 21 , the green light-emitting chips 22 and the blue light-emitting chips 23 may be arranged side by side at intervals, or may be distributed in a triangle or other geometric shapes.

In the step S20, the specific operation of cutting and taking out the sealant covering the faulty chip is as follows:

The sealant 31 covering the light-emitting unit EU where the faulty chip is located is cut and taken out.

For example, as shown in FIG. 4a and FIG. 4b, the light-emitting unit EU where the faulty chip is located includes three light-emitting chips, namely a red light-emitting chip 21, a green light-emitting chip 22 and a blue light-emitting chip 23, wherein the red light-emitting chip 21 is the faulty chip . When cutting the sealant 31 covering the faulty chip with a tool, the sealant 31 covering the light-emitting unit EU where the faulty chip is located can be cut off, which can reduce the precision of the tool and the requirements on the thickness of the blade surface, thereby reducing the cutting seal Difficulty of glue.

In the embodiment of the present application, the width of the cutter 40 needs to be larger than the width of the light emitting unit EU.

Further, the ratio of the width of the cutter 40 to the width of the light-emitting unit EU should be greater than or equal to 1.2, so that damage to the normal light-emitting chips 20 in the light-emitting unit EU can be avoided by the cutter 40 during the cutting process. Meanwhile, the thickness of the cutter 40 should be smaller than the distance between the adjacent light-emitting units EU, so as to avoid damage to the light-emitting chips in the adjacent light-emitting units EU by the cutter during the cutting process.

Step S30 : removing the faulty chip, and filling the position of the faulty chip with a new light-emitting chip.

In the step S30, the specific operation of removing the faulty chip is as follows:

Scrape off the faulty chip to form the to-be-repaired part; clean the exposed pads on the to-be-repaired part. Specifically, a laser can be used to heat the faulty chip to melt the solder paste on the pads of the substrate 10, and a robotic arm can be used to take out the faulty chip, or the faulty chip can also be taken out from the substrate by means of air blowing, so as to remove the faulty chip from the substrate. A to-be-repaired portion is formed on 10 .

In the step S30, the specific operation of filling a new light-emitting chip at the position where the faulty chip is located is as follows:

The to-be-repaired part is treated with a crystal-replenishing treatment. Specifically, each to-be-repaired part is subjected to single-point crystal-filling processing by a die bonder, and a normal light-emitting chip is placed in the to-be-repaired part. The color of the light emitted by the normal light-emitting chip is the same as the color of the light emitted by the faulty chip.

In the step S30, the specific operation of performing crystal supplementation processing on the to-be-complemented portion is as follows:

Point solder paste on the part to be repaired; specifically, point the solder paste on the pad of the substrate at the part to be repaired through the die bonder, or point other pads on the substrate at the part to be repaired as needed Variety of solders to replace the solder paste function;

Place the normal light-emitting chip in the to-be-repaired part; specifically, the normal light-emitting chip can be placed in the to-be-repaired part through a die bonder;

The solder paste is first melted and then solidified to realize the operation of crystal-refining the part to be repaired, so that the normal light-emitting chip placed in the to-be-repaired part is stably attached to the substrate, so as to achieve the effect of repairing the light-emitting chip; specifically, The melting operation of the solder paste can be realized by high temperature heating such as reflow soldering, laser welding or hot air blowing. After the above operation is stopped, the solder paste is cooled and solidified.

As shown in FIG. 4c , after the faulty chip is removed, the normal red light-emitting chip 21 ′ is moved to the position where the faulty red light-emitting chip 21 is located, and the normal red light-emitting chip 21 ′ is bound to the substrate 10 by the above method. superior.

As shown in FIG. 4d to FIG. 4e , in the step S40, the cut and removed sealant is placed back at the position of the faulty chip, and the specific operations of covering the filled light-emitting chip are as follows:

The sealant that has been cut and taken out is placed back where the faulty chip is located, and covers the light-emitting unit EU where the filled light-emitting chip is located.

As shown in Figure 4d, the surface of the cut sealant in contact with the light-emitting chip and the surface in contact with the adjacent uncut sealant are coated with room temperature adhesive, and the room temperature adhesive will be used to cut The latter sealant is bonded with the light-emitting chip and the uncut sealant.

According to the method for repairing a light-emitting chip after sealing the light-emitting chip provided by the embodiment of the present application, the embodiment of the present application further provides a display panel, and the display panel is obtained by the repairing method after the sealing of the light-emitting chip provided by the above-mentioned embodiment. The structure of the display panel can be referred to as shown in FIG. 4e, and the display panel is repaired by the repairing method provided in the above-mentioned embodiment, so as to avoid damage to the sealant covering the faulty chip. The normal occurrence of the chip is sealed to ensure the optical consistency of the repaired area and the unrepaired area in the display panel.

The embodiments of the present application provide a method for repairing a light-emitting chip after sealing and a display panel. By detecting and obtaining the position of the faulty chip on the substrate, the sealant covering the faulty chip is cut and taken out, and a new light-emitting chip is placed After returning to the location of the faulty chip, re-cover the filled light-emitting chip with the cut and removed sealant, so as to avoid damage to the sealant, thereby reducing the risk of failure of the light-emitting chip and ensuring the light-emitting after covering and filling. Optical consistency of the die sealant to the surrounding uncut sealant.

To sum up, although the present application discloses the preferred embodiments as above, the above preferred embodiments are not intended to limit the present application. Those of ordinary skill in the art, without departing from the spirit and scope of the present application, can Therefore, the scope of protection of the present application is based on the scope defined by the claims.

Claims (10)

1. A method for repairing light-emitting chips after encapsulation is characterized in that, a plurality of light-emitting chips and a sealant layer covering the light-emitting chips are arranged on the substrate, and the repair method after the encapsulation of the light-emitting chips comprises: Identifying the faulty chip in the light-emitting chip, and obtaining the position of the faulty chip on the substrate; cutting and removing the sealant covering the faulty chip; removing the faulty chip, and filling a new light-emitting chip at the position of the faulty chip; and The sealant that has been cut and taken out is placed back at the position where the faulty chip is located, and the filled light-emitting chip is covered. 2 . The method for repairing light-emitting chips after encapsulation according to claim 1 , wherein the step of cutting and taking out the encapsulant covering the faulty chip comprises: 2 . cutting the sealant covering the faulty chip by means of physical cutting; and The cut sealant is taken out by means of negative pressure adsorption. 3. The method for repairing a light-emitting chip after sealing with glue, wherein the step of cutting the sealing glue covering the faulty chip by physical cutting comprises: Use a cutter to cut the sealant covering the faulty chip along the thickness direction of the sealant layer; Wherein, the cutter includes a hollow structure in the middle and a blade surface surrounding the hollow structure. 4 . The method for repairing a light-emitting chip after encapsulation according to claim 3 , wherein a plurality of light-emitting units are arranged on the substrate, and each light-emitting unit comprises at least two light-emitting units of different colors. 5 . A light-emitting chip, the method for repairing the light-emitting chip after encapsulation includes: cutting and removing the sealant covering the light-emitting unit where the faulty chip is located; and The sealant that has been cut and taken out is placed back where the faulty chip is located, and covers the light-emitting unit where the filled light-emitting chip is located. 5 . The method for repairing a light-emitting chip after encapsulation according to claim 4 , wherein the width of the tool is greater than the width of the light-emitting unit. 6 . 6 . The method for repairing a light-emitting chip after encapsulation according to claim 5 , wherein the ratio of the width of the tool to the width of the light-emitting unit is greater than or equal to 1.2. 7 . 7 . The method for repairing light-emitting chips after encapsulation as claimed in claim 1 , wherein the sealant that has been cut and taken out is placed back to the position where the faulty chip is located, and the filled chip is covered. 8 . The steps of the light-emitting chip include: coating an ambient temperature adhesive on the sealant; and The sealant is placed back at the position of the faulty chip, the filled light-emitting chip is covered, and the sealant is bonded to the light-emitting chip and the surrounding uncut sealant. 8 . The method for repairing a light-emitting chip after encapsulation as claimed in claim 7 , wherein refractive indices of the encapsulant and the normal temperature adhesive are both greater than or equal to 1.5 and less than or equal to 1.7. 9 . 9 . The method for repairing a light-emitting chip after encapsulation as claimed in claim 7 , wherein the material of the normal temperature adhesive comprises any one of vinyl acetate, allyl, polyurethane and acrylate materials. 10 . kind. 10 . A display panel, characterized in that it is obtained by rework after the light-emitting chip encapsulation method according to any one of claims 1 to 9 .

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