CN111968965B - A kind of packaging structure and packaging method of high light transmission and high heat dissipation type LED shoe lamp - Google Patents

Abstract

The invention discloses a packaging structure of an LED (light-emitting diode) shoe lamp, which belongs to the technical field of shoe lamp processing, and comprises a transparent substrate and a plurality of PCB (printed circuit boards) arranged on the lower bottom surface of the transparent substrate, wherein the transparent substrate is provided with a plurality of transparent trapezoidal platforms, two ends of each transparent trapezoidal platform are opened, the side wall of each transparent trapezoidal platform is provided with a plurality of through holes at a position which is far from the bottom 1/3, and the surface of the inner wall of the side wall of each transparent trapezoidal platform at a position which is far from the bottom 1/3 is uniformly provided with point-shaped bulges; the invention also discloses an encapsulating method of the LED shoe lamp and an encapsulating structure applying the LED shoe lamp. This packaging structure of LED shoes lamp guarantees that the heat dissipation that LED lamp pearl can be better and can not lead to the fact the influence to the light transmissivity of LED lamp pearl, protection LED lamp pearl that can also be fine, this packaging method of LED shoes lamp is applicable to the encapsulation of LED shoes lamp, and the packaging process is simple, need not to use too much large-scale mechanical equipment, easily operation and energy saving.

Description

A kind of packaging structure and packaging method of high light transmission and high heat dissipation type LED shoe lamp

This case is a divisional application based on an invention patent with the application date of 2018-12-29, the application number of 201811643906.X, and the title of "an LED shoe lamp packaging structure and packaging method" as the parent case.

technical field

The invention belongs to the technical field of shoe lamp processing, and in particular relates to a packaging structure and a packaging method of an LED shoe lamp with high light transmission and high heat dissipation.

Background technique

The packaging of the LED shoe light is similar to that of most LED lights. The LED light is assembled on the substrate with the chip mounted, and then the positive and negative electrodes are welded, and finally the whole is encapsulated by glue. Although this traditional packaging method can effectively protect the LED lights, the strong airtightness of the potting glue will affect the heat dissipation and light transmission of the LED lights, especially the shoe lights, which are mostly installed in the upper. Or in the sole, the light will be blocked and weakened by the shoe material itself. If the light is affected by the potting glue, the luminous effect of the shoe lamp will be greatly reduced. The existing research mainly focuses on the packaging improvement of ordinary LED lamps. For example, the application number is 201010123574X , 201110252496.8 Chinese patent, but because most of the shoe lights are installed on the soles, they are subject to long-term pressure from the human body, which is different from ordinary LED lights. Therefore, there is a need to provide a packaging structure and a packaging method suitable for LED shoe lights.

SUMMARY OF THE INVENTION

In order to overcome the above-mentioned defects of the prior art, the technical problem to be solved by the present invention is to provide a packaging structure and a packaging method for an LED shoe lamp which can improve the light transmittance and heat dissipation of the LED shoe lamp.

In order to solve the above-mentioned technical problems, the technical solution adopted in the present invention is as follows: a packaging structure of an LED shoe lamp with high light transmission and high heat dissipation, comprising a transparent substrate and a plurality of PCB boards arranged on the bottom surface of the transparent substrate. There are a plurality of transparent trapezoidal tables, the number of the transparent trapezoidal tables is the same as the number of PCB boards, the two ends of the transparent trapezoidal table are open, and the narrow end of the transparent trapezoidal table is connected with the upper bottom surface of the transparent substrate. The side wall of the transparent trapezoid table is provided with several through holes at 1/3 of the bottom, and the inner wall of the side wall of the transparent trapezoid table is evenly provided with point-like protrusions on the surface at 1/3 of the bottom;

The PCB board is provided with a positive plate hole and a negative plate hole, and a positive hole and a negative hole are respectively provided on the transparent substrate at the positions corresponding to the positive plate hole and the negative plate hole, and the positive hole and the negative pole are inserted The hole is arranged in the transparent trapezoidal table, and a plug-in slot is arranged between the positive and negative jacks.

The present invention also provides a packaging method for an LED shoe light, using the above-mentioned packaging structure of the high light transmission and high heat dissipation type LED shoe light, comprising the following steps:

Step 1: Pass the positive pin of the LED light bead through the positive jack and the hole of the positive plate, pass the negative pin of the LED light bead through the negative jack and the hole of the negative plate, press down the LED light bead to remove the block at the bottom of the lamp head. The protrusion is embedded in the card slot of the plug-in;

Step 2: Immerse the transparent substrate with the PCB board facing down in the flux, and then take out the immersion tin to form a tin point; cut the positive and negative pins;

Step 3: Divide the transparent substrate into a plurality of strip-shaped light strips;

Step 4: Weld the electronic wire on the tin point of the light strip, wherein more than 70% of the connecting end of the electronic wire and the tin point is wrapped in the tin point; then bend the electronic wire 90°; then solder the electronic wire The light strip is divided into individual LED semi-packages;

Step 5: pour hot-melt glue into the transparent trapezoidal stage of a single LED half-package, and then apply hot-melt glue to the welding place between the electronic wire and the tin point to obtain the LED package; lay the LED package flat on the wax paper, wait for After the hot melt glue is cooled, the LED shoe light is obtained.

The beneficial effect of the present invention is that: the packaging structure of a high light transmission and high heat dissipation type LED shoe lamp provided by the present invention, by arranging a transparent trapezoidal table with a through hole, the LED lamp beads and the transparent substrate can be sealed during the sealing process. It is packaged with the transparent trapezoidal table, and at the same time, the entire LED lamp bead will not be wrapped by hot melt adhesive, so that the LED lamp bead can be better dissipated, and at the same time, it will not affect the light transmittance of the LED lamp bead. The table can also protect the LED lamp beads very well. The inner wall of the side wall of the transparent trapezoid table is evenly provided with point-like protrusions on the surface at 1/3 of the bottom, which increases the contact surface during hot melt adhesive potting, making the LED The combination of the lamp beads, the transparent substrate and the transparent trapezoidal table is more tightly and not easy to fall off; the packaging method of the LED shoe lamp provided by the present invention adopts the packaging structure of the LED shoe lamp with high light transmission and high heat dissipation, and is suitable for the packaging of the LED shoe lamp. The process is simple and fast, does not require excessive large-scale mechanical equipment, is easy to operate and saves energy.

Description of drawings

FIG. 1 is a schematic cross-sectional structural schematic diagram of a side view of a packaging structure of an LED shoe light according to a specific embodiment of the present invention;

Label description: 1. Transparent substrate; 11. Plug-in slot; 2. PCB board; 3. Transparent trapezoidal table; 31. Through hole; 4. Lamp beads; 41. Positive pin; 42. Negative pin.

Detailed ways

In order to describe in detail the technical content, achieved objects and effects of the present invention, the following descriptions are given with reference to the embodiments and the accompanying drawings.

The key idea of the present invention is: a transparent trapezoidal stage is arranged on the transparent substrate, and through holes are opened on the trapezoidal groove to control the contact area between the hot melt adhesive and the LED lamp beads during glue filling.

Please refer to FIG. 1 , a packaging structure of an LED shoe lamp of the present invention includes a transparent substrate and a plurality of PCB boards arranged on the bottom surface of the transparent substrate. The transparent substrate is provided with a plurality of transparent trapezoidal stages, and the The number of transparent trapezoidal tables is the same as the number of PCB boards. Both ends of the transparent trapezoidal table are open, the narrow end of the transparent trapezoidal table is connected to the upper bottom surface of the transparent substrate, and the side wall of the transparent trapezoidal table is 1/3 away from the bottom. There are several through holes at the bottom, and the inner wall of the side wall of the transparent trapezoid table is evenly provided with point-like protrusions on the surface at 1/3 of the bottom; the transparent substrate is made of transparent insulating material;

The PCB board is provided with a positive plate hole and a negative plate hole, and a positive hole and a negative hole are respectively provided on the transparent substrate at the positions corresponding to the positive plate hole and the negative plate hole, and the positive hole and the negative pole are inserted The hole is arranged in the transparent trapezoidal table, and a plug-in slot is arranged between the positive and negative jacks.

A packaging method for an LED shoe lamp, using the packaging structure of the above-mentioned LED shoe lamp, comprising the following steps:

Step 1: Pass the positive pin of the LED light bead through the positive jack and the hole of the positive plate, and pass the negative pin of the LED light bead through the negative jack and the hole of the negative plate, press down the LED light bead to remove the block at the bottom of the lamp head. The protrusion is embedded in the card slot of the plug-in;

Step 2: Immerse the transparent substrate with the PCB board facing down in the flux, and then take out the immersion tin to form a tin point; cut the positive and negative pins;

Step 3: Divide the transparent substrate into a plurality of strip-shaped light strips;

Step 4: Weld the electronic wire on the tin point of the light strip, wherein more than 70% of the connecting end of the electronic wire and the tin point is wrapped in the tin point; then bend the electronic wire 90°; then solder the electronic wire The light strip is divided into individual LED semi-packages;

Step 5; pour hot-melt glue into the transparent trapezoidal stage of a single LED semi-package, after the hot-melt glue fills up 1/3 of the volume of the bottom of the transparent trapezoidal stage, the part flows out from the through hole, and then the hot-melt glue flows out from the through hole between the electronic wire and the tin point. Apply hot-melt adhesive to the welding part to obtain an LED package; place the LED package flat on wax paper, and after the hot-melt adhesive cools, obtain an LED shoe light.

It can be seen from the above description that the beneficial effects of the present invention are: the packaging structure of the LED shoe lamp provided by the present invention, by providing a transparent trapezoidal table with through holes, the LED lamp beads can be sealed with the transparent substrate and the transparent substrate during sealing. The transparent trapezoidal table is packaged together, and at the same time, the entire LED lamp bead will not be wrapped by hot melt adhesive, so that the LED lamp bead can be better dissipated, and at the same time, it will not affect the light transmittance of the LED lamp bead. Transparent trapezoidal table It can also protect the LED lamp beads well. The inner wall of the side wall of the transparent trapezoid table is evenly provided with dot-shaped protrusions on the surface at 1/3 of the bottom, which increases the contact surface of the hot melt adhesive during potting, making the LED lamp The beads are more closely combined with the transparent substrate and the transparent trapezoidal table, and are not easy to fall off; the packaging method of the LED shoe lamp provided by the present invention uses the above-mentioned packaging structure, which is suitable for the packaging of the LED shoe lamp, and the packaging process is simple and does not require the use of excessive large-scale machinery. Equipment that is highly efficient in packaging, easy to operate and saves energy.

Further, the packaging structure of the LED shoe lamp also includes an LED lamp bead, the LED lamp bead includes a positive pin and a negative pin of the lamp cap that are arranged below the lamp cap, and the center of the bottom of the lamp cap is provided with a slot for inserting a slot. Matching block protrusions, the LED lamp beads are arranged in the transparent trapezoidal table, and the height of the LED lamp beads is the same as the height of the transparent trapezoidal table.

It can be seen from the above description that the center of the bottom of the LED lamp bead is provided with a block-shaped protrusion that matches the insertion slot, which can improve the tightness of the LED lamp bead and the transparent substrate during assembly, and facilitate the stable assembly of the LED lamp bead on the transparent substrate. on the substrate to facilitate subsequent packaging operations.

Further, in the tin immersion process in step 2 of the packaging method for the LED shoe light, the temperature of the tin furnace is 280±5° C., and the tin immersion time is less than or equal to 3s.

It can be seen from the above description that the tin immersion time is less than or equal to 3s to avoid damage to electronic components.

Further, the step 4 of the packaging method of the LED shoe light is: welding the electronic wire on the tin point of the lamp strip, then setting a heat shrinkable tube on the outer casing of the electronic wire, and then bending the electronic wire by 90°; The light strip with the electronic wires soldered is divided into individual LED half-packages.

It can be seen from the above description that by arranging a heat shrinkable tube over the electronic wire, the electronic wire can be effectively protected and the service life of the electronic wire can be increased.

Further, in step 5 of the packaging method of the LED shoe light, the thickness of the hot melt adhesive applied to the welding place between the electronic wire and the tin point is less than or equal to 3.2 mm, and the length of the hot melt adhesive is 8-10 mm.

It can be seen from the above description that applying the hot melt adhesive of the above thickness and length can achieve the best protection effect, and it can be cooled and solidified in a short time to ensure the quality of the product, and at the same time, it can avoid excessive waste of pushing glue.

Embodiment one of the present invention is:

An LED shoe lamp packaging structure is characterized in that it includes a transparent substrate, a plurality of PCB boards arranged on the bottom surface of the transparent substrate, and LED lamp beads, a plurality of transparent trapezoidal tables are arranged on the transparent substrate, and the transparent The number of tables is the same as the number of PCB boards. Both ends of the transparent trapezoidal table are open, the narrow end of the transparent trapezoidal table is connected to the upper bottom surface of the transparent substrate, and the side wall of the transparent trapezoidal table is set at 1/3 of the bottom. There are several through holes, and the inner wall of the side wall of the transparent trapezoid table is evenly provided with point-like protrusions on the surface at 1/3 of the bottom;

The PCB board is provided with a positive plate hole and a negative plate hole, and a positive hole and a negative hole are respectively provided on the transparent substrate at the positions corresponding to the positive plate hole and the negative plate hole, and the positive hole and the negative pole are inserted The hole is arranged in the transparent trapezoidal table, and a plug-in slot is arranged between the positive and negative jacks;

The LED lamp bead includes a positive pin and a negative pin of the lamp head that are arranged below the lamp head. The center of the bottom of the lamp head is provided with a protrusion that matches the insertion slot, and the LED lamp bead is arranged in a transparent trapezoidal table, so The height of the LED lamp bead is the same as the height of the transparent trapezoidal table.

Step 1: Pass the positive pin of the LED light bead through the positive jack and the hole of the positive plate, pass the negative pin of the LED light bead through the negative jack and the hole of the negative plate, press down the LED light bead to remove the block at the bottom of the lamp head. The protrusion is embedded in the card slot of the plug-in;

Step 2: Immerse the transparent substrate with the PCB board side down in the flux, and then take out the immersion tin to form a tin point; cut the positive and negative pins; among them, the temperature of the tin furnace is 280 ℃, the immersion time is 2s;

Step 3: Use a stamping splitter to divide the transparent substrate into several strip-shaped light strips;

Step 4: Solder the electronic wire on the tin point of the light strip, then put a heat shrink tube around the electronic wire, and then bend the electronic wire 90°; then divide the light strip with the electronic wire welded into individual LED halves package;

Step 5: Pour hot-melt glue into the transparent trapezoidal table of the single LED half-package, then apply hot-melt glue to the solder joints of the electronic wire and the tin point, and use leak-proof glue with cooling function when pouring and applying the hot-melt glue A hot-melt glue gun is used to obtain an LED package, wherein the thickness of the hot-melt glue applied to the welding part of the electronic wire and the tin point is 3mm, and the length of the hot-melt glue is 8mm; the LED package is placed flat on the wax paper, After the hot melt adhesive is cooled, the LED shoe light is obtained.

Wherein, the stamping type splitter in step 3 includes a stamping machine and a splitting fixture set on the stamping machine, and the stamping machine includes a stamping plate, a workbench and a stamping rod set on the stamping machine;

The plate dividing fixture includes a fixing part and a cutting part, the fixing part includes a lower base plate, the lower base plate is connected with the collection box, and a baffle plate is arranged on the lower base plate, and the baffle plate is composed of a long baffle and a short baffle. The long baffle plate and the short baffle plate are arranged in sequence, and a hollow gap is arranged between the baffle plates; the cutting part includes an upper bottom plate, the upper bottom plate is connected with the stamping plate, and the upper a blade with a downward blade, the blade is composed of a long blade and a short blade, the long blade is arranged opposite to the short baffle, and the short blade is arranged opposite to the long baffle;

When in use, place the transparent substrate on the baffle of the fixing part of the dividing plate jig, hold the punching rod of the punching machine and press it down, the punching plate drives the cutting part of the cutting part of the dividing plate jig to move down, the baffle and the cutting part of the jig move down. After contact, the transparent substrate is cut into strips of light strips.

Wherein, the leak-proof glue hot-melt glue gun with cooling function described in step 5 includes a gun body and a handle, the gun body is arranged on the handle, and a glue outlet is arranged in the gun body, and the The axis of the glue dispensing cylinder coincides with the axis of the gun body; one end of the gun body is provided with a glue dispensing gun head, and the other end is provided with an air exhaust hole; the glue dispensing gun head is provided with a glue dispensing hole; the The gun body is also provided with an air supply device, the air supply device is composed of a casing, a cooling fan, a first air duct and a second air duct, an opening at one end of the first air duct is communicated with the casing, and the other The opening at one end points to the glue outlet; the opening at one end of the second air duct communicates with the casing, and the other end communicates with the side wall of the gun body;

When in use, turn off the power of the hot-melt glue gun after finishing gluing, and start the air supply device; the air generated by the cooling fan is transmitted through the first air duct and then blown to the glue hole, and the hot-melt glue stick on the surface of the glue hole is quickly cooled and solidified ; The wind generated by the cooling fan is also blown into the gap between the gun body and the glue outlet through the second air duct to cool the glue outlet, and then the air flow is discharged from the exhaust hole.

To sum up, the packaging structure of the LED shoe lamp provided by the present invention can encapsulate the LED lamp beads, the transparent substrate and the transparent trapezoidal table together during the sealing process by setting the transparent trapezoidal table with through holes. At the same time, the entire LED lamp bead will not be wrapped by hot melt adhesive, so that the LED lamp bead can be better dissipated, and at the same time, it will not affect the light transmittance of the LED lamp bead. The lamp beads play a protective role. The inner wall of the side wall of the transparent trapezoid table is evenly provided with dot-shaped protrusions on the surface at 1/3 of the bottom, which increases the contact surface during hot melt adhesive potting, so that the LED lamp beads are connected to the transparent substrate and the transparent trapezoid. The combination of the table is tighter and not easy to fall off; by providing a block-shaped protrusion matching the insertion slot in the center of the bottom of the LED lamp head, the tightness of the LED lamp bead and the transparent substrate during assembly can be improved, and the LED lamp bead can be stabilized. It is assembled on a transparent substrate, which is convenient for subsequent packaging operations. The packaging method of the LED shoe light provided by the present invention uses the packaging structure of the LED shoe light and is suitable for the packaging of the LED shoe light.

The above descriptions are only the embodiments of the present invention, and are not intended to limit the scope of the patent of the present invention. Any equivalent transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in the relevant technical fields, are similarly included in the within the scope of patent protection of the present invention.

Claims (5)

1. an encapsulation structure of a high-light-transmitting and high-heat-dissipating LED shoe lamp, characterized in that, comprising a transparent substrate and a plurality of PCB boards arranged on the bottom surface of the transparent substrate, the transparent substrate is made of a transparent insulating material, and the A plurality of transparent trapezoidal tables are arranged on the transparent substrate, the number of the transparent trapezoidal tables is the same as the number of PCB boards, the two ends of the transparent trapezoidal table are open, and the narrow end of the transparent trapezoidal table is connected with the upper bottom surface of the transparent substrate , the side wall of the transparent trapezoidal table is provided with several through holes at 1/3 of the bottom, so that the LED lamp beads will not be wrapped by hot melt glue, and the inner wall of the side wall of the transparent trapezoidal table is 1/3 of the bottom from the bottom. The surface is evenly provided with point-like protrusions; The PCB board is provided with a positive plate hole and a negative plate hole, and a positive hole and a negative hole are respectively provided on the transparent substrate at the positions corresponding to the positive plate hole and the negative plate hole, and the positive hole and the negative pole are inserted The hole is arranged in the transparent trapezoidal table, and a plug-in slot is arranged between the positive and negative jacks. 2 . The package structure of the high light transmission and high heat dissipation type LED shoe lamp according to claim 1 , further comprising an LED lamp bead, and the LED lamp bead comprises a positive pin and a negative pin of the lamp cap which are arranged below the lamp cap. 3 . The center of the bottom of the lamp head is provided with a block-shaped protrusion that matches the insertion slot, the LED lamp beads are arranged in the transparent trapezoidal table, and the height of the LED lamp beads is the same as that of the transparent trapezoidal table. 3. a kind of encapsulation method of high light transmission and high heat dissipation type LED shoe lamp, it is characterized in that, the encapsulation structure of applying the high light transmission high heat dissipation type LED shoe lamp of claim 1 or 2 any one, comprises the following steps: Step 1: Pass the positive pin of the LED light bead through the positive jack and the hole of the positive plate, pass the negative pin of the LED light bead through the negative jack and the hole of the negative plate, press down the LED light bead to remove the block at the bottom of the lamp head. The protrusion is embedded in the card slot of the plug-in; Step 2: Immerse the transparent substrate with the PCB board facing down in the flux, and then take out the immersion tin to form a tin point; cut the positive and negative pins; Step 3: Divide the transparent substrate into several strip-shaped light strips; Step 4: Solder the electronic wire on the tin point of the light strip, and then bend the electronic wire by 90°; then divide the light strip with the electronic wire welded into individual LED semi-packages; Step 5: Pour hot-melt glue into the transparent trapezoidal table of a single LED semi-package, so that the LED lamp beads will not be wrapped by hot-melt glue, and then apply hot-melt glue to the welding place between the electronic wire and the tin point to obtain the LED package; use a leak-proof hot-melt glue gun with cooling function when pouring and applying hot-melt glue; lay the LED package flat on the wax paper, and after the hot-melt glue cools, get the LED shoe light. 4. The packaging method of high light transmission and high heat dissipation type LED shoe lamp according to claim 3, wherein the leak-proof glue hot melt glue gun with cooling function comprises a gun body and a handle, and the gun body It is arranged on the handle, and is characterized in that a glue outlet is arranged in the gun body, and the axis of the glue outlet is coincident with the axis of the gun body; one end of the gun body is provided with a glue outlet head, The other end is provided with an air exhaust hole; the glue discharge gun head is provided with a glue discharge hole; the gun body is also provided with an air supply device, and the air supply device consists of a casing, a cooling fan, a first air duct and a It consists of a second air duct. The opening at one end of the first air duct communicates with the casing, and the opening at the other end points to the glue outlet. The opening at one end of the second air duct communicates with the casing, and the other end communicates with the casing. One end communicates with the side wall of the gun body. 5. The encapsulation method of the high light transmission and high heat dissipation type LED shoe lamp according to any one of claims 3-4, characterized in that, it specifically comprises the following steps: Step 1: Pass the positive pin of the LED light bead through the positive jack and the hole of the positive plate, pass the negative pin of the LED light bead through the negative jack and the hole of the negative plate, press down the LED light bead to remove the block at the bottom of the lamp head. The protrusion is embedded in the card slot of the plug-in; Step 2: Immerse the transparent substrate with the PCB board side down in the flux, and then take out the immersion tin to form a tin point; cut the positive and negative pins; among them, the temperature of the tin furnace is 280 ℃, the immersion time is 2s; Step 3: Divide the transparent substrate into several strip-shaped light strips; Step 4: Weld the electronic wire on the tin point of the light strip, and more than 70% of the connection end of the electronic wire and the tin point is wrapped in the tin point, and then set the heat shrinkable tube on the outer layer of the electronic wire, and then bend the electronic wire 90°; then divide the light strip with the electronic wires soldered into individual LED half-packages; Step 5: Pour hot melt adhesive into the transparent trapezoidal stage of a single LED semi-package, the hot melt glue fills up 1/3 of the bottom of the transparent trapezoidal stage and partially flows out from the through hole, and then fills the hole between the electronic wire and the tin point. Apply hot-melt glue to the welding place to obtain the LED package, and use a leak-proof glue hot-melt glue gun with a cooling function when pouring and applying the hot-melt glue. The thickness is 3mm, and the length of the hot-melt adhesive is 8mm; the LED package is placed flat on the wax paper, and the LED shoe light is obtained after the hot-melt adhesive is cooled.

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