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CN114280585A - High-frequency broadband multi-beam receiving array and manufacturing method thereof - Google Patents

High-frequency broadband multi-beam receiving array and manufacturing method thereof Download PDF

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Publication number
CN114280585A
CN114280585A CN202111492675.9A CN202111492675A CN114280585A CN 114280585 A CN114280585 A CN 114280585A CN 202111492675 A CN202111492675 A CN 202111492675A CN 114280585 A CN114280585 A CN 114280585A
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matching layer
piezoelectric ceramic
receiving
base
array
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黄水兵
李勤博
赵蔚彬
顾晓红
沈莉
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Haiying Enterprise Group Co Ltd
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Haiying Enterprise Group Co Ltd
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Abstract

The invention relates to a high-frequency broadband multi-beam receiving array and a manufacturing method thereof. The invention comprises the following steps: the receiving element comprises piezoelectric ceramics and a matching layer, wherein the piezoelectric ceramics are thickness polarization ceramics, the matching layer is connected with the negative electrode surface of the piezoelectric ceramics, the width of the matching layer is equal to that of the piezoelectric ceramics, one end of the matching layer in the length direction is flush with the piezoelectric ceramics, and the other end of the matching layer in the length direction is shorter than the piezoelectric ceramics; the receiving element is arranged on the base; the decoupling layer is arranged between two adjacent receiving elements and between the positive electrode surface of the piezoelectric ceramic and the base; the base is installed on the electronic bin, the receiving modules are installed on the electronic bin, and the whole encapsulated polyurethane forms a receiving array. The receiving element of the invention has narrow width, can be conveniently used for a matrix with half-wavelength spacing and smaller spacing, and has the characteristics of high sensitivity and wide beam of a high-frequency broadband; the ceramic is made of thinner ceramic, so that the ceramic is easy to process and polarize, and the production cost is reduced; the receiving array has simple structure, mature and reliable process and convenient connection with other components.

Description

High-frequency broadband multi-beam receiving array and manufacturing method thereof
Technical Field
The invention belongs to the technical field of transducers, and particularly relates to a high-frequency broadband multi-beam receiving array and a manufacturing method thereof.
Background
The underwater acoustic transducer is a core component of sonar detection equipment, bears the mission of signal generation and reception, and plays a significant role in realizing the underwater acoustic detection function and improving the performance. With the development of signal processing technology and hardware technology, more and more data can be processed by a signal processor, so that higher bandwidth and path number requirements are put on a transducer. With the development of underwater acoustic technology, high-frequency broadband multi-beam matrixes are more and more widely applied. Such as anti-frogman sonar, forward looking sonar, etc., all require high frequency broadband multi-beam receiving arrays.
A high-frequency receiving array with the working frequency below 150kHz usually uses a longitudinal array or PZT5 ceramic as a receiving element. The longitudinal array technology is mature, but the bandwidth is stably expanded by using the bending vibration coupling of the front cover plate, the radiation surface of the array is usually large, and the array is not favorable for the arrangement below the spacing half wavelength; PZT5 ceramics are simple in construction, but the use of frequencies below 150kHz requires ceramics with thicknesses of 20mm or more, which is difficult to process and polarize.
The short-distance small target for anti-frogman sonar detection is generally detected at 180 degrees or detected at 360 degrees in an omnidirectional manner, a receiving array is usually a cylindrical array, a transmitting array can select a transmitting beam angle, and a beam scanning technology is applied to realize anti-frogman detection. Anti-frogman sonar generally works in shallow sea areas, so that high-frequency broadband signals are needed to be adopted to suppress reverberation; in order to improve the detection efficiency and the imaging quality, more effective beams are required to be improved in a unit range, namely, the element receiving signals are distributed with a large opening angle and a half-wavelength interval.
Disclosure of Invention
Therefore, the technical problem to be solved by the invention is to overcome the problems that the size of the ceramic polarization direction required by the receiving element for anti-resonance receiving in the existing high-frequency underwater acoustic transducer is thick, the manufacturing is inconvenient, the element width is large, and the half-wavelength spacing arrangement is inconvenient.
In order to solve the above technical problem, the present invention provides a high-frequency broadband multi-beam receiving array, comprising:
the receiving elements comprise piezoelectric ceramics and a matching layer, the piezoelectric ceramics are thickness polarization ceramics, the matching layer is connected with the negative electrode surface of the piezoelectric ceramics, the width of the matching layer is equal to that of the piezoelectric ceramics, one end of the matching layer in the length direction is flush with the piezoelectric ceramics, and the other end of the matching layer in the length direction is shorter than the piezoelectric ceramics;
the receiving element is arranged on the base;
the decoupling layer is arranged between two adjacent receiving elements and between the positive electrode surface of the piezoelectric ceramic and the base;
and the base is arranged on the electronic bin.
In one embodiment of the invention, the length of the piezoelectric ceramic strip is 3 to 5 times the thickness and the thickness is 1.5 to 5 times the width.
In one embodiment of the present invention, the longitudinal acoustic velocity of the matching layer is lower than the longitudinal acoustic velocity of the piezoelectric ceramic.
In one embodiment of the invention, a strip-shaped blind groove is formed in one end of the matching layer, which is opposite to the end connected with the negative electrode surface of the piezoelectric ceramic.
In one embodiment of the invention, the height of the decoupling layer on two sides of the receiving element is 0-5 mm lower than the radiating surface of the matching layer.
In one embodiment of the invention, the part of the piezoelectric ceramic in the length direction, which is exposed out of the positive electrode surface, and the negative electrode surface opposite to the positive electrode surface are provided with welding spots, and the thickness of the matching layer is determined by the following method: and leading out a welding spot on the positive electrode surface and a welding spot on the negative electrode surface of the piezoelectric ceramic through leads and connecting the welding spots to an impedance analyzer for monitoring, and polishing the thickness of the matching layer by using abrasive paper until the anti-resonance frequency meets the preset working frequency to obtain the thickness of the matching layer.
In an embodiment of the invention, the electronic cabin comprises an upper flange and a lower flange, and the upper flange and the lower flange can be provided with a sealing groove and a threaded hole, so that watertight connection at other parts is facilitated.
In one embodiment of the invention, the base material comprises one of glass beads and foamed polyurethane, the base is in a circular arc structure, the base is provided with connecting grooves for connecting piezoelectric ceramics on the outer arc surface of the circular structure, and the distribution structure of the connecting grooves corresponds to the arrangement of the receiving element array.
In one embodiment of the invention, the structure of the array is a circular array.
The invention also provides a manufacturing method of the high-frequency broadband multi-beam receiving array, which comprises the following steps:
step S1: according to the working center frequency f, the sound velocity v in water, the longitudinal sound velocity v1 of the piezoelectric ceramic, the half wavelength lambda/2 in water is equal to v/2f, the width a of the piezoelectric ceramic strip is lambda/2, the range of the width a of the piezoelectric ceramic strip is 3 mm-10 mm, the length b of the piezoelectric ceramic strip meets the requirement of a vertical beam opening angle, and the thickness h is 8 mm-10 mm; the width of the matching layer is the same as the width of the piezoelectric ceramic strip, the length of the matching layer is b range from 2mm to 3mm, the trial-manufacture height h1 is v1/2f-h, and the machining height h1 is determined after trial-manufacture;
step S2: tin is coated on the positive electrode surface and the negative electrode surface of one end of the piezoelectric ceramic within a range of 2mm away from the end point, the piezoelectric ceramic and the matching layer are cleaned by absolute ethyl alcohol, epoxy resin is coated on the negative electrode surface of the piezoelectric ceramic and one surface of the matching layer, the two surfaces are bonded together, the two sides of the piezoelectric ceramic and the two sides of the matching layer are flush in the width direction, one end of the piezoelectric ceramic and one end of the matching layer are flush in the length direction, and the other end of the piezoelectric ceramic is exposed out of a welding point;
step S3: leading out a welding spot on the positive electrode surface and a welding spot on the negative electrode surface of the piezoelectric ceramic through leads and connecting the welding spots to an impedance analyzer for monitoring, and polishing the thickness of the matching layer by using abrasive paper until the anti-resonance frequency meets the preset working frequency to obtain the thickness of the matching layer;
step S4: two sides of a receiving element are pasted with decoupling layers by using double-sided adhesive tapes, a pair of twisted pairs is used for leading out electrodes of the receiving element, and epoxy resin or silicon rubber is coated at welding points for protection;
step S5: processing a positioning groove on a base according to the ceramic size calculated in the step 1, arranging a decoupling layer between the positive electrode surface of the piezoelectric ceramic and the base, bonding the piezoelectric ceramic and the base by using double-sided adhesive tapes, bonding 20 receiving elements on the base groove according to the condition that the matching layer is arranged above, the ceramic is arranged below, and the middle decoupling layer is isolated, and pouring colorless polyurethane on the surface of an integral structure formed by the receiving elements, the decoupling layer and the base to obtain a single receiving module;
step S6: 8 receiving modules are spliced end to form a circular ring shape and are installed on a circular electronic cabin, twisted-pair lines are led out from all receiving element electrodes to directly enter the cabin, polyurethane is integrally encapsulated on the surface of a cylinder, and the high-frequency broadband multi-beam receiving cylindrical array is obtained.
Compared with the prior art, the technical scheme of the invention has the following advantages:
the invention uses the matching layer of high acoustic impedance as the 'front cover plate' of the ceramic strip, provides a receiving element for realizing anti-resonance receiving below 150kHz, has narrow width of the receiving element, can be conveniently used for a basic array with half-wavelength spacing and smaller spacing, and has the characteristics of high-frequency broadband, high sensitivity and wide beam; the invention is made of thinner ceramics, the ceramics are easy to process and polarize, and the production cost is reduced; the invention has simple structure, mature and reliable process and convenient connection with other components.
Drawings
In order that the present disclosure may be more readily and clearly understood, reference is now made to the following detailed description of the embodiments of the present disclosure taken in conjunction with the accompanying drawings, in which
FIG. 1 is a diagram of the receive primitive of the present invention.
Fig. 2 is a schematic diagram of the connection of the solder joint and the wire of the present invention.
Fig. 3 is a schematic diagram of a receiving module of the present invention.
Fig. 4 is a schematic diagram of a high-frequency broadband multi-beam receiving cylindrical array of the present invention.
Fig. 5 is a graph of the reception sensitivity response of the reception cell of the present invention.
The specification reference numbers indicate: 1. a matching layer; 2. piezoelectric ceramics; 3. a base; 4. receiving a primitive; 5. a decoupling layer; 6. a polyurethane; 7. a receiving module; 8. a lower flange; 9. a housing; 10. and an upper flange.
Detailed Description
The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.
Example one
Referring to fig. 1 to 4, the present invention provides a high frequency multi-beam receiving array, including:
the receiving module comprises a plurality of receiving elements 4, a base 3 and a decoupling layer 5, wherein the receiving elements 4 form a receiving module 7, the receiving elements 4 comprise piezoelectric ceramics 2 and a matching layer 1, the piezoelectric ceramics 2 are thickness polarization ceramics, the matching layer 1 is connected with the negative electrode surface of the piezoelectric ceramics 2, the width of the matching layer 1 is equal to that of the piezoelectric ceramics 2, one end of the matching layer 1 in the length direction is flush with the piezoelectric ceramics 2, and the other end of the matching layer 1 in the length direction is shorter than the piezoelectric ceramics 2; the receiving element 4 is arranged on the base 3; the decoupling layer 5 is arranged between two adjacent receiving elements 4 and between the positive electrode surface of the piezoelectric ceramic 2 and the base 3; the receiving module 7 is mounted on the electronics compartment housing 9.
The invention combines the advantages of the longitudinal array and the piezoelectric ceramic 2, uses the matching layer 1 with high acoustic impedance and low acoustic velocity as the 'front cover plate' of the ceramic strip, provides a receiving element 4 with high frequency broadband and wide beam, and manufactures the high frequency broadband multi-beam receiving array by using the receiving element, and the receiving array has the advantages of wide working frequency, wide receiving beam and more effective beams.
Specifically, a strip-shaped blind groove is formed in one end, opposite to the negative electrode surface of the piezoelectric ceramic 2, of the matching layer 1, so that size change caused by temperature change in the length direction can be reduced, and the receiving element 4 is prevented from being damaged due to large stress.
Specifically, the matching layer 1 and the negative electrode surface of the piezoelectric ceramic 2 are bonded through epoxy resin.
Specifically, the length of the piezoelectric ceramic strip is 3-5 times of the thickness, and the thickness is 1.5-5 times of the width.
Specifically, the longitudinal sound velocity of the matching layer is smaller than the longitudinal sound velocity of the piezoelectric ceramic.
Specifically, a strip-shaped blind groove is formed in one end, connected and opposite to the negative electrode surface of the piezoelectric ceramic, of the matching layer.
Specifically, the height of the decoupling layer on the two sides of the receiving element is 0-5 mm lower than the radiating surface of the matching layer.
Specifically, the decoupling layer 5 is adhered to the receiving element 4 through a double-sided adhesive tape, the decoupling layer 5 is made of cork through processing, the beam opening angle in the width direction of the receiving element 4 can be adjusted by adjusting the height, the actual opening angle can reach more than 90 degrees, a pair of twisted pairs are used for leading out electrodes, and the positions of welding points are coated with epoxy resin or silicon rubber for protection.
Specifically, the part of the piezoelectric ceramic 2 exposed out of the positive electrode surface in the length direction and the negative electrode surface opposite to the positive electrode surface are provided with welding spots, and the thickness of the matching layer 1 is determined by the following method: and the welding spot on the positive electrode surface and the welding spot on the negative electrode surface of the piezoelectric ceramic 2 are led out through leads and are connected into an impedance analyzer for monitoring, the thickness of the matching layer 1 is polished by 400-mesh or 800-mesh abrasive paper until the anti-resonance frequency meets the preset working frequency, resonance receiving is realized, higher receiving sensitivity is obtained, and the thickness of the matching layer 1 is obtained.
Specifically, the array structure is a circular array; the base 3 is made of one of glass beads and foamed polyurethane 6, the base 3 is of a circular arc structure, and connecting grooves for connecting the piezoelectric ceramics 2 are distributed on the outer arc surface of the circular structure of the base 3, so that the ceramic bonding is facilitated, and double-sided adhesive tape or epoxy resin bonding can be used; the distribution structure of the connecting grooves corresponds to the array arrangement of the receiving elements 4.
Specifically, colorless polyurethane 6 is filled into the surface of the whole structure formed by the array structure and the base 3 to form a receiving module 7, so that other filling defects such as bubbles can be effectively checked, and the filling risk of the high-frequency broadband multi-beam receiving cylindrical array is reduced.
Specifically, the electronic cabin is of a three-section structure and is fastened and connected by using screws, the shell 9 is made of aluminum alloy without contacting seawater corrosion, and the upper flange 10 and the lower flange 8 are made of stainless steel materials resistant to seawater corrosion; the lower flange 8 is a sealing plate, and the upper flange 9 is provided with a threaded hole and a sealing groove; the radius of the outer arc surface of the shell 9 is consistent with that of the inner arc surface of the base 3, the receiving modules 7 are spliced end to end on the shell, polyurethane is integrally poured on the surface of the shell, the underwater working requirement is met, and a high-frequency broadband multi-beam receiving cylindrical array is obtained
Example two
The embodiment provides a manufacturing method of a high-frequency broadband multi-beam receiving cylindrical array, which comprises the following steps:
step S1: according to the working center frequency f, the sound velocity v in water, the longitudinal sound velocity v1 of the piezoelectric ceramic, the half wavelength lambda/2 in water is equal to v/2f, the width a of the piezoelectric ceramic strip is lambda/2- (3 mm-10 mm), the length b of the piezoelectric ceramic strip meets the requirement of a vertical beam opening angle, and the thickness h is 8 mm-10 mm; the width of the matching layer is the same as that of the piezoelectric ceramic strip, the length of the matching layer is b- (2 mm-3 mm), the trial height h1 is v1/2f-h, and the machining height h1 is determined after trial production;
step S2: tin is coated on the positive electrode surface and the negative electrode surface of one end of the piezoelectric ceramic within a range of 2mm away from the end point, the piezoelectric ceramic and the matching layer are cleaned by absolute ethyl alcohol, epoxy resin is coated on the negative electrode surface of the piezoelectric ceramic and one surface of the matching layer, the two surfaces are bonded together, the two sides of the piezoelectric ceramic and the two sides of the matching layer are flush in the width direction, one end of the piezoelectric ceramic and one end of the matching layer are flush in the length direction, and the other end of the piezoelectric ceramic is exposed out of a welding point;
step S3: leading out a welding spot on the positive electrode surface and a welding spot on the negative electrode surface of the piezoelectric ceramic through leads and connecting the welding spots to an impedance analyzer for monitoring, and polishing the thickness of the matching layer by using abrasive paper until the anti-resonance frequency meets the preset working frequency to obtain the thickness of the matching layer;
step S4: two sides of a receiving element are pasted with decoupling layers by using double-sided adhesive tapes, a pair of twisted pairs is used for leading out electrodes of the receiving element, and epoxy resin or silicon rubber is coated at welding points for protection;
step S5: and (4) machining a positioning groove on the base according to the ceramic size calculated in the step (1). Arranging decoupling layers between the positive electrode surface of the piezoelectric ceramic and the base, bonding the piezoelectric ceramic and the base by using double faced adhesive tapes, bonding 20 receiving elements on the groove of the base according to the condition that the matching layer is arranged above the base and the ceramic is arranged below the base, and isolating the decoupling layers in the middle, and pouring colorless polyurethane on the surface of the integral structure formed by the receiving elements, the decoupling layers and the base to obtain a single receiving module;
step S6: 8 receiving modules are spliced end to form a circular ring shape and are installed on a circular electronic cabin, twisted-pair lines are led out from all receiving element electrodes to directly enter the cabin, polyurethane is integrally encapsulated on the surface of a cylinder, and the high-frequency broadband multi-beam receiving cylindrical array is obtained.
Referring to fig. 1 and fig. 2, for the high-frequency broadband multi-beam receiving cylindrical array receiving element of the present invention, the piezoelectric ceramic is PZT-5 piezoelectric ceramic strips 40mm × 9mm × 3mm, the matching layer is epoxy composite strips 37mm × 5.4mm × 3mm, the sound velocity is 2206m/s, the strip-shaped blind grooves are arranged at positions 12mm and 24mm in the length direction, and the size is 0.3mm wide and 3.5mm deep; using a conductor area of 0.07mm2The twisted pair of the cable leads out a receiving element electrode;
referring to fig. 3, the base is made of foamed polyurethane, the inner radius is R145, the outer radius is R165, the height is 37mm, and 20 grooves with the width of 3mm and the depth of 1.5mm are arranged on the outer radius surface from 1.125 degrees every 2.25 degrees; the decoupling layers on the two sides are 13.2mm high, 40mm long and 1mm thick, the decoupling layer on the bottom surface is 3mm wide, 37mm long and 1mm thick, and the decoupling layers are made of cork; a total of 20 receive primitives make up a receive module.
Referring to fig. 5, as can be seen from the reception sensitivity response graph of the reception cell, the reception sensitivity of the reception cell is high.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the spirit or scope of the invention.

Claims (10)

1. A high frequency broadband multi-beam receive array, comprising:
the receiving elements comprise piezoelectric ceramics and a matching layer, the piezoelectric ceramics are thickness polarization ceramics, the matching layer is connected with the negative electrode surface of the piezoelectric ceramics, the width of the matching layer is equal to that of the piezoelectric ceramics, one end of the matching layer in the length direction is flush with the piezoelectric ceramics, and the other end of the matching layer in the length direction is shorter than the piezoelectric ceramics;
the receiving element is arranged on the base;
the decoupling layer is arranged between two adjacent receiving elements and between the positive electrode surface of the piezoelectric ceramic and the base;
and the base is arranged on the electronic bin.
2. The array of claim 1, wherein the piezo ceramic strips are 3 to 5 times longer in length and 1.5 to 5 times wider in thickness.
3. The array according to claim 1, wherein the matching layer has a lower longitudinal acoustic velocity than the piezoelectric ceramic.
4. The high-frequency broadband multi-beam receiving array according to claim 1, wherein a strip-shaped blind groove is formed in one end of the matching layer, which is opposite to the end where the negative electrode face of the piezoelectric ceramic is connected.
5. The high-frequency broadband multibeam receive array according to claim 1, wherein the height of the decoupling layers on both sides of the receive element is 0mm to 5mm lower than the radiating surface of the matching layer.
6. The high-frequency broadband multibeam receive array according to claim 1, wherein said piezoelectric ceramic has a solder joint on both a portion exposed in a longitudinal direction of said piezoelectric ceramic on a positive electrode side and a negative electrode side opposite thereto, and a thickness of said matching layer is determined by: and leading out a welding spot on the positive electrode surface and a welding spot on the negative electrode surface of the piezoelectric ceramic through leads and connecting the welding spots to an impedance analyzer for monitoring, and polishing the thickness of the matching layer by using abrasive paper until the anti-resonance frequency meets the preset working frequency to obtain the thickness of the matching layer.
7. The high-frequency broadband multi-beam receiving array according to claim 1, wherein the electronic bin comprises an upper flange and a lower flange, and the upper flange and the lower flange are respectively provided with a sealing groove and a threaded hole so as to facilitate watertight connection at other positions.
8. The high-frequency broadband multi-beam receiving array according to claim 1, wherein the base material comprises one of glass beads and foamed polyurethane, the base is of a circular arc structure, the base is provided with connecting grooves for piezoelectric ceramic connection on an outer arc surface of the circular structure, and the distribution structure of the connecting grooves corresponds to the arrangement of the receiving element array.
9. The high frequency broadband multi-beam receive array of claim 8, wherein the array is configured as a circular array.
10. A method for manufacturing a high-frequency broadband multi-beam receiving array is characterized by comprising the following steps:
step S1: according to the working center frequency f, the sound velocity v in water, the longitudinal sound velocity v1 of the piezoelectric ceramic, the half wavelength lambda/2 in water is equal to v/2f, the width a of the piezoelectric ceramic strip is lambda/2, the range of the width a of the piezoelectric ceramic strip is 3 mm-10 mm, the length b of the piezoelectric ceramic strip meets the requirement of a vertical beam opening angle, and the thickness h is 8 mm-10 mm; the width of the matching layer is the same as the width of the piezoelectric ceramic strip, the length of the matching layer is b range from 2mm to 3mm, the trial-manufacture height h1 is v1/2f-h, and the machining height h1 is determined after trial-manufacture;
step S2: tin is coated on the positive electrode surface and the negative electrode surface of one end of the piezoelectric ceramic within a range of 2mm away from the end point, the piezoelectric ceramic and the matching layer are cleaned by absolute ethyl alcohol, epoxy resin is coated on the negative electrode surface of the piezoelectric ceramic and one surface of the matching layer, the two surfaces are bonded together, the two sides of the piezoelectric ceramic and the two sides of the matching layer are flush in the width direction, one end of the piezoelectric ceramic and one end of the matching layer are flush in the length direction, and the other end of the piezoelectric ceramic is exposed out of a welding point;
step S3: leading out a welding spot on the positive electrode surface and a welding spot on the negative electrode surface of the piezoelectric ceramic through leads and connecting the welding spots to an impedance analyzer for monitoring, and polishing the thickness of the matching layer by using abrasive paper until the anti-resonance frequency meets the preset working frequency to obtain the thickness of the matching layer;
step S4: two sides of a receiving element are pasted with decoupling layers by using double-sided adhesive tapes, a pair of twisted pairs is used for leading out electrodes of the receiving element, and epoxy resin or silicon rubber is coated at welding points for protection;
step S5: processing a positioning groove on a base according to the ceramic size calculated in the step 1, arranging a decoupling layer between the positive electrode surface of the piezoelectric ceramic and the base, bonding the piezoelectric ceramic and the base by using double-sided adhesive tapes, bonding 20 receiving elements on the base groove according to the condition that the matching layer is arranged above, the ceramic is arranged below, and the middle decoupling layer is isolated, and pouring colorless polyurethane on the surface of an integral structure formed by the receiving elements, the decoupling layer and the base to obtain a single receiving module;
step S6: 8 receiving modules are spliced end to form a circular ring shape and are installed on a circular electronic cabin, twisted-pair lines are led out from all receiving element electrodes to directly enter the cabin, polyurethane is integrally encapsulated on the surface of a cylinder, and the high-frequency broadband multi-beam receiving cylindrical array is obtained.
CN202111492675.9A 2021-12-08 2021-12-08 High-frequency broadband multi-beam receiving array and manufacturing method thereof Pending CN114280585A (en)

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