CN114267650A - Thermosiphon heat sink - Google Patents
Thermosiphon heat sink Download PDFInfo
- Publication number
- CN114267650A CN114267650A CN202111532382.9A CN202111532382A CN114267650A CN 114267650 A CN114267650 A CN 114267650A CN 202111532382 A CN202111532382 A CN 202111532382A CN 114267650 A CN114267650 A CN 114267650A
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- China
- Prior art keywords
- bottom end
- heat dissipation
- heat
- thermosiphon
- base
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- 239000003507 refrigerant Substances 0.000 claims abstract description 38
- 238000010521 absorption reaction Methods 0.000 claims abstract description 35
- 238000001816 cooling Methods 0.000 claims abstract description 6
- 238000002309 gasification Methods 0.000 claims abstract description 5
- 230000017525 heat dissipation Effects 0.000 claims description 35
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 238000005192 partition Methods 0.000 claims description 6
- 238000009423 ventilation Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 4
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims 1
- 230000000694 effects Effects 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A thermosiphon heat sink includes a base and a heat sink. The base includes a heat absorption chamber to store a refrigerant. At least one surface of the base is used to mount a heat generating component. The radiator comprises a plurality of radiating pipes and radiating fins connected with the radiating pipes. Each cooling tube includes first body, second body and snakelike body, wherein first body includes first bottom, the second body includes the second bottom, just the second bottom downwardly extending surpasses first bottom. The first bottom end is inserted into the top of the heat absorption cavity, so that the refrigerant after heat absorption and gasification flows to the second tube body from the first bottom end. The second bottom end is inserted into the bottom of the heat absorption cavity, so that the refrigerant cooled by heat exchange flows back to the heat absorption cavity from the second bottom end.
Description
Technical Field
The invention relates to a thermosiphon heat dissipation device, belonging to the technical field of heat dissipation devices.
Background
With the development of technology, the heat dissipation requirements of heat generating components (such as chips) are higher and higher. How to design a heat dissipation device with high heat dissipation efficiency is a technical problem faced by those skilled in the art.
Disclosure of Invention
The invention aims to provide a thermosiphon heat dissipation device with high heat dissipation efficiency.
In order to achieve the purpose, the invention adopts the following technical scheme: a thermosiphon heat sink, comprising:
a base including a heat absorption chamber to store a refrigerant, at least one surface of the base to mount a heat generating element; and
a heat sink secured to the base, the heat sink including a plurality of heat pipes and heat fins connected to the plurality of heat pipes, each heat pipe including a first pipe body, a second pipe body, and a serpentine pipe body communicating the first pipe body and the second pipe body, wherein the first pipe body includes a first bottom end, the second pipe body includes a second bottom end, and the second bottom end extends downwardly beyond the first bottom end;
the first bottom end is inserted into the top of the heat absorption cavity, so that the refrigerant after heat absorption and gasification flows to the second tube body from the first bottom end;
the second bottom end is inserted into the bottom of the heat absorption cavity, so that the refrigerant cooled by heat exchange flows back to the heat absorption cavity from the second bottom end.
As a further improved aspect of the present invention, the heat sink includes a ventilation surface for allowing air to pass through the heat dissipating fins, and the base portion includes a mounting surface for mounting the heat generating element, the mounting surface being perpendicular to the ventilation surface.
As a further improved technical scheme of the present invention, the serpentine tube body includes a plurality of horizontal tube bodies arranged at intervals along a vertical direction and a plurality of bent tubes connecting the plurality of horizontal tube bodies in series end to end, and the heat dissipation fin is installed between two adjacent horizontal tube bodies along the vertical direction.
As a further improved technical scheme of the present invention, the first pipe body and the second pipe body both extend in a vertical direction and are parallel to each other; the serpentine tube body is arc-shaped, and the heat dissipation fins, a part of the first tube body and a part of the second tube body are exposed out of the base; the heating element is a chip.
As a further improved technical solution of the present invention, the base is provided with a baffle plate located at a bottom of the first bottom end and vertically spaced from the first bottom end, and the baffle plate faces the first bottom end to prevent the liquid refrigerant from flowing into the radiating pipe from the first bottom end.
As a further improved technical scheme of the invention, the base comprises a plurality of clapboards which are positioned in the heat absorption cavity and are arranged at intervals; the baffle is approximately L-shaped, the baffle comprises a bottom plate and an extending part which extends upwards from one side of the bottom plate, and the extending part is positioned between the first pipe body and the second pipe body of the same radiating pipe.
As a further improved technical solution of the present invention, the base includes a top wall, a bottom wall opposite to the top wall, a first side wall connecting the top wall and the bottom wall, and a cover plate opposite to the first side wall, the heat absorption cavity is located between the top wall, the bottom wall, the first side wall, and the cover plate, and the mounting surface is located on the first side wall and/or the cover plate.
As a further improved technical solution of the present invention, the mounting surface is located on the first sidewall, and the serpentine tube body horizontally protrudes from the first sidewall.
As a further improved technical solution of the present invention, the top wall is provided with an installation groove, the thermosiphon heat dissipation device includes a slot plate installed in the installation groove, and the slot plate is provided with a plurality of slots through which the first bottom end and the second bottom end respectively pass.
As a further improved technical scheme of the invention, the top surface of the slot plate is flush with the top surface of the top wall, and the slot plate and the radiating pipe are fixed by brazing together.
Compared with the prior art, the thermosiphon heat dissipation device self-forming system has the advantages that the first bottom end and the second bottom end with different heights are arranged, so that the refrigerant after heat absorption and gasification and the refrigerant after heat exchange and cooling can flow conveniently; in addition, through the arrangement of the radiator with the snake-shaped pipe body, the heat exchange effect of the refrigerant and air is improved.
Drawings
Fig. 1 is a perspective view of a thermosiphon heat dissipation device and a heat generating element according to the present invention.
Fig. 2 is a perspective view of fig. 1 from another angle.
Fig. 3 is a front view of fig. 2.
Fig. 4 is a left side view of fig. 1.
Fig. 5 is a schematic sectional view taken along line a-a in fig. 1.
Fig. 6 is a partially enlarged view of circled portion B in fig. 5.
Fig. 7 is a partially exploded perspective view of fig. 2.
Fig. 8 is a further exploded perspective view of fig. 7.
Detailed Description
Exemplary embodiments of the present invention will be described in detail below with reference to the accompanying drawings. If several embodiments exist, the features of these embodiments may be combined with each other without conflict. When the description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The statements made in the following exemplary detailed description do not represent all implementations consistent with the present disclosure; rather, they are merely examples of apparatus, products, and/or methods consistent with certain aspects of the invention, as set forth in the claims below.
The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the present invention. As used in the specification and claims of this invention, the singular form of "a", "an", or "the" is intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the use of terms such as "first," "second," and the like, in the description and in the claims of the present invention do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. Unless otherwise indicated, the terms "front," "back," "up," "down," and the like in the description of the invention are used for convenience of description and are not limited to a particular position or spatial orientation. The word "comprise" or "comprises", and the like, is an open-ended expression meaning that an element that precedes "includes" or "comprising" includes "that the element that follows" includes "or" comprises "and its equivalents, that do not preclude the element that precedes" includes "or" comprising "from also including other elements. If the invention is referred to as "a plurality", it means two or more.
Referring to fig. 1 to 8, the present invention discloses a thermosiphon heat dissipation device 100 for mounting a heat generating element 200 to dissipate heat of the heat generating element 200. The heating element 200 is a chip, such as an IGBT chip. The thermosiphon heat sink 100 includes a base 1 and a heat sink 2 connected to the base 1.
Referring to fig. 8, the base 1 includes a heat absorbing chamber 10 for storing a refrigerant, and the heat generating element 200 is mounted on at least one surface of the base 1. Specifically, in the illustrated embodiment of the present invention, the base 1 includes a top wall 11, a bottom wall 12 opposite to the top wall 11, a first side wall 13 connecting the top wall 11 and the bottom wall 12, a cover plate 14 opposite to the first side wall 13, a second side wall 15 connecting the top wall 11 and the bottom wall 12, and a third side wall 16 opposite to the second side wall 15. In the illustrated embodiment of the invention, the base 1 is substantially rectangular parallelepiped, the top wall 11 and the bottom wall 12 are parallel to each other, the first side wall 13 and the cover plate 14 are parallel to each other, and the second side wall 15 and the third side wall 16 are parallel to each other. The heat absorption chamber 10 is enclosed by the top wall 11, the bottom wall 12, the first side wall 13, the second side wall 15, the third side wall 16 and the cover plate 14. The cover plate 14 is welded to the other components of the base 1 to facilitate assembly and maintenance of the thermosiphon heat sink 100.
In the illustrated embodiment of the invention, the top wall 11 is provided with a mounting groove 111. The thermosiphon heat sink 100 includes a groove plate 17 installed in the installation groove 111. The top surface 171 of the slot plate 17 is flush with the top surface 112 of the top wall 11. The slot plate 17 is provided with a number of slots 172.
In the illustrated embodiment of the invention, the base 1 further comprises a plurality of baffles 18 spaced apart and located within the heat absorption chamber 10. The partitions 18 are spaced apart in a first direction D-D. The partition plate 18 divides the heat absorption chamber 10 into a plurality of sub heat absorption chambers 101 which are arranged side by side. As shown in fig. 6, the base 1 further includes a plurality of baffles 19 protruding into the sub heat absorption cavity 101. In the illustrated embodiment of the present invention, the baffle plate 19 is substantially L-shaped, and the baffle plate 19 includes a bottom plate 191 fixed to the corresponding partition plate 18 and an extending portion 192 extending upward from one side of the bottom plate 191. Preferably, the baffle plate 19 is welded and fixed to the partition plate 18 or the baffle plate 19 is integrally formed with the partition plate 18.
The heat sink 2 is fixed to the base 1 by welding. The radiator 2 includes a plurality of radiating pipes 21 and a plurality of radiating fins 22 connected to the plurality of radiating pipes 21. The plurality of radiating pipes 21 are aligned along the first direction D-D. In one embodiment of the present invention, the heat dissipation pipe 21 is a flat pipe, such as a microchannel flat pipe. Each heat dissipating tube 21 comprises a first tube 211, a second tube 212 and a serpentine tube 213 connecting the first tube 211 and the second tube 212, wherein the first tube 211 comprises a first bottom end 2110 and the second tube 212 comprises a second bottom end 2120. The second tube 212 has a length greater than the first tube 211, and the second bottom end 2120 extends downward beyond the first bottom end 2110. In the illustrated embodiment of the present invention, the first tube 211 and the second tube 212 extend in a vertical direction and are parallel to each other. The serpentine tube body 213 includes a plurality of horizontal tube bodies 2131 arranged at intervals in the vertical direction and a plurality of bent tubes 2132 connecting the horizontal tube bodies 2131 in series end to end, and the heat dissipation fins 22 are installed between two adjacent horizontal tube bodies 2131 in the vertical direction. The length of the radiating pipe 21 is increased by providing the serpentine pipe body 213, so as to facilitate the arrangement of more radiating fins 22, thereby enhancing the heat dissipation capability of the heat sink 2. The heat dissipating fins 22, a portion of the first tube 211, and a portion of the second tube 212 are exposed to the outside of the base 1 to facilitate heat exchange with air. In addition, each sub heat absorption cavity 101 corresponds to one heat dissipation pipe 21. By arranging a plurality of relatively independent sub heat absorption chambers 101, the distribution of the refrigerant in the sub heat absorption chambers 101 is improved, so that the situation that part of the sub heat absorption chambers 101 are lack of the refrigerant is avoided.
The heat sink 2 includes a ventilation surface 23 for allowing air to pass through the heat dissipating fins 22, and the base 1 includes a mounting surface 110 for mounting the heat generating element 200, the mounting surface 110 being perpendicular to the ventilation surface 23. The mounting surface 110 is located on the first sidewall 13 and/or the cover plate 14. In the illustrated embodiment of the present invention, the mounting surface 110 is provided on the first side wall 13. The sizes of the heat sink 2, the mounting surface 110 and the air duct may be flexibly set as required.
The first and second bottom ends 2110 and 2120 of the radiating pipe 21 are respectively downwardly passed through the corresponding slots 172 of the slot plate 17. Preferably, the slot plate 17 is fixed to the radiating pipe 21 by brazing.
The first bottom end 2110 is communicated with the top of the heat absorption chamber 10, so that the refrigerant after absorbing heat and gasifying flows from the first bottom end 2110 to the second tube 212; the second bottom end 2120 is communicated with the bottom of the heat absorption chamber 10 to allow the refrigerant cooled by heat exchange to flow back to the heat absorption chamber 10 from the second bottom end 2120 to complete one cycle. In other words, in the illustrated embodiment of the present invention, the first bottom end 2110 is inserted into the top of the heat absorption chamber 10, the second bottom end 2120 is inserted into the bottom of the heat absorption chamber 10, the first bottom end 2110 is an exhaust port, and the second bottom end 2120 is a liquid return port.
The refrigerant flows in the first tube 211 and the refrigerant flows in the second tube 212 with at least components in opposite directions. Referring to fig. 6, in the illustrated embodiment of the present invention, the first pipe 211 is parallel to the second pipe 212, so that the flow direction of the refrigerant in the first pipe 211 is vertically upward, and the flow direction of the refrigerant in the second pipe 212 is vertically downward. Of course, in other embodiments, the first tube 211 and the second tube 212 may have a certain included angle. At this time, the flow direction of the refrigerant in the first pipe 211 is generally from bottom to top, and the flow direction of the refrigerant in the second pipe 212 is generally from top to bottom. In any case, the refrigerant has an upward component in the flow direction in the first tube 211, and the refrigerant has a downward component in the flow direction in the second tube 212.
The baffle 19 is substantially located at the bottom of the first bottom end 2110, and the baffle 19 is opposite to the first bottom end 2110 to prevent the liquid refrigerant from flowing into the radiating pipe 21 from the first bottom end 2110. Specifically, the bottom plate 191 is located at the bottom of the first bottom end 2110 and is vertically spaced from the first bottom end 2110. The extension part 192 is located between the first pipe body 211 and the second pipe body 212 of the same radiating pipe 21. Preferably, the extending portion 192 can contact with the side surface of the first tube 211 facing the second tube 212, so as to provide a certain limiting effect to the first tube 211, reduce the impact on the first tube 211 caused by the refrigerant after heat absorption and gasification when flowing into the first bottom end 2110, and reduce the probability of deformation of the first tube 211.
The working principle of the thermosiphon heat sink 100 of the present invention is as follows: the heat absorption chamber 10 is filled with a refrigerant, and at least one side of the base 1 is mounted with a heating element 200 such as an IGBT chip. When the heat generating element 200 generates heat due to its operation, the heat is transferred to the liquid refrigerant in the heat absorbing chamber 10 through the base 1; the liquid refrigerant absorbs heat to be gasified, and the refrigerant absorbing heat and gasified moves upwards and enters the radiator 2 through the first bottom end 2110; by heat exchange with air through the radiator 2, the temperature of the refrigerant is lowered, and the refrigerant is gradually condensed into a liquid state in the radiator 2 and flows down the passage in the second tube 212 until flowing back to the heat absorption chamber 10 from the second bottom end 2120, thereby completing one cycle.
Compared with the prior art, the thermosiphon heat dissipation device 100 of the present invention is configured to facilitate the flow of the vaporized refrigerant after heat absorption and the refrigerant cooled by heat exchange by providing the first bottom 2110 and the second bottom 2120 with different heights; in addition, by arranging the radiator 2, the heat exchange effect between the refrigerant and the air is improved, and the better heat dissipation effect of the heating element 200 is favorably realized.
The above embodiments are only for illustrating the invention and not for limiting the technical solutions described in the invention, and the understanding of the present invention should be based on the technical personnel in the technical field, and although the present invention has been described in detail by referring to the above embodiments, the technical personnel in the technical field should understand that the technical personnel in the technical field can still make modifications or equivalent substitutions to the present invention, and all the technical solutions and modifications thereof without departing from the spirit and scope of the present invention should be covered in the claims of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111532382.9A CN114267650A (en) | 2021-12-15 | 2021-12-15 | Thermosiphon heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111532382.9A CN114267650A (en) | 2021-12-15 | 2021-12-15 | Thermosiphon heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114267650A true CN114267650A (en) | 2022-04-01 |
Family
ID=80827239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111532382.9A Pending CN114267650A (en) | 2021-12-15 | 2021-12-15 | Thermosiphon heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114267650A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08250633A (en) * | 1995-03-08 | 1996-09-27 | Nippondenso Co Ltd | Boiling cooling equipment |
| KR19990020176U (en) * | 1997-11-24 | 1999-06-15 | 전주범 | Heat dissipation pipe for refrigerator |
| US20020166655A1 (en) * | 2001-05-11 | 2002-11-14 | Hajime Sugito | Cooling device boiling and condensing refrigerant |
| JP2003258475A (en) * | 2002-02-28 | 2003-09-12 | Denso Corp | Boiling cooler |
| CN103337339A (en) * | 2013-06-21 | 2013-10-02 | 曾庆赣 | Heat dissipating method for oil-immersed transformer and radiator thereof |
-
2021
- 2021-12-15 CN CN202111532382.9A patent/CN114267650A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08250633A (en) * | 1995-03-08 | 1996-09-27 | Nippondenso Co Ltd | Boiling cooling equipment |
| KR19990020176U (en) * | 1997-11-24 | 1999-06-15 | 전주범 | Heat dissipation pipe for refrigerator |
| US20020166655A1 (en) * | 2001-05-11 | 2002-11-14 | Hajime Sugito | Cooling device boiling and condensing refrigerant |
| JP2003258475A (en) * | 2002-02-28 | 2003-09-12 | Denso Corp | Boiling cooler |
| CN103337339A (en) * | 2013-06-21 | 2013-10-02 | 曾庆赣 | Heat dissipating method for oil-immersed transformer and radiator thereof |
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