CN114258192B - Circuit board with high reflectivity and manufacturing method thereof - Google Patents
Circuit board with high reflectivity and manufacturing method thereof Download PDFInfo
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- CN114258192B CN114258192B CN202011009995.XA CN202011009995A CN114258192B CN 114258192 B CN114258192 B CN 114258192B CN 202011009995 A CN202011009995 A CN 202011009995A CN 114258192 B CN114258192 B CN 114258192B
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- layer
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- high reflectivity
- circuit board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a circuit board with high reflectivity, which comprises an inner layer circuit board, a substrate with high reflectivity, a first insulating layer, a first circuit layer, a second insulating layer and a second circuit layer. The inner-layer circuit board is provided with a first opening, and the substrate with high reflectivity is fixed in the first opening. The first insulating layer is arranged on one side of the inner-layer circuit board and provided with a second opening corresponding to the first opening, and at least part of the substrate with high reflectivity is exposed from the second opening. The first circuit layer is positioned on one side of the first insulating layer, which is away from the inner circuit board, and comprises a plurality of connecting pads arranged on the substrate with high reflectivity. The second insulating layer is stacked on the other side of the inner-layer circuit board. The second circuit layer is positioned on one side of the second insulating layer, which is away from the inner layer circuit board. The invention also provides a manufacturing method of the circuit board with high reflectivity.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a circuit board with high reflectivity and a manufacturing method thereof.
Background
In the manufacture of mini LED backlight boards, LED lamps are mounted on a mounting area of a circuit board through a surface mounting technology. The higher the reflectivity of the circuit board is, the higher the light-emitting efficiency of the LED lamp is. The reflectivity of the circuit board is generally improved by covering the surface of the circuit board with a solder mask layer with high reflectivity. However, the reflectivity of the dielectric layer for build-up used in the current part-forming area is low, and the effect consistent with the reflectivity of the external solder mask layer cannot be achieved, so that the luminous efficiency and luminous uniformity of the mini LED backlight plate are affected.
Disclosure of Invention
In view of the foregoing, there is a need for a circuit board having high reflectivity and a method of manufacturing the same that can solve the above-described problems.
An embodiment of the invention provides a circuit board with high reflectivity, which comprises an inner layer circuit board, a substrate with high reflectivity, a first insulating layer, a first circuit layer, a second insulating layer and a second circuit layer. The inner-layer circuit board is provided with a first opening, and the substrate with high reflectivity is fixed in the first opening. The first insulating layer is arranged on one side of the inner-layer circuit board and provided with a second opening corresponding to the first opening, and at least part of the substrate with high reflectivity is exposed from the second opening. The first circuit layer is positioned on one side of the first insulating layer, which is away from the inner circuit board, and comprises a plurality of connecting pads arranged on the substrate with high reflectivity. The second insulating layer is stacked on the other side of the inner-layer circuit board. The second circuit layer is positioned on one side of the second insulating layer, which is away from the inner layer circuit board.
An embodiment of the present invention provides a method for manufacturing a circuit board with high reflectivity, including the following steps: providing an inner-layer circuit board, wherein the inner-layer circuit board is provided with a first opening; fixing a substrate with high reflectivity in the first opening, and respectively pressing the first substrate and the second substrate on the opposite surfaces of the inner-layer circuit board to obtain a laminated structure; and forming a first circuit layer and a second circuit layer on opposite surfaces of the laminated structure respectively, wherein the first circuit layer comprises a plurality of connection pads, and the connection pads are positioned on the substrate with high reflectivity.
In the circuit board with high reflectivity provided by the embodiment of the invention, the connecting pad for connecting the light-emitting element is arranged on the substrate with high reflectivity, so that the reflectivity of the connecting pad is improved, and the light-emitting efficiency of the light-emitting element is improved.
Drawings
Fig. 1 is a cross-sectional view of an inner circuit board according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view of the inner circuit board shown in fig. 1 after a first substrate and a second substrate are provided above and below the inner circuit board, respectively.
Fig. 3 is a cross-sectional view of the laminated structure formed by pressing the structures shown in fig. 2 together.
Fig. 4 is a cross-sectional view of the laminated structure shown in fig. 3 after forming conductive holes.
Fig. 5 is a cross-sectional view of the structure shown in fig. 4 after an outer layer of circuitry has been formed thereon.
Fig. 6 is a cross-sectional view of the structure shown in fig. 5 after formation of the connection pads.
Fig. 7 is a cross-sectional view of the structure of fig. 6 after a solder mask layer has been formed thereon.
Description of the main reference signs
Inner layer circuit board 10
Insulating layer 11
Inner circuit layer 13
First opening 131
Substrate 30 with high reflectivity
First substrate 50
A second substrate 60
Laminate structure 70
First insulating layer 51
Glass fiber 512
Epoxy 513
First metal layer 53
Second opening 511
Second insulating layer 61
Second metal layer 63
Plate body 31
Protruding portion 33
Mounting face 331
Fence structure 32
First circuit layer 81
Second circuit layer 83
Line pattern 813
First electroplated layer 82
Second plating layer 84
Conductive hole 74
Connection pad 815
Light-emitting element 200
Solder mask layer 90
Circuit board 100 with high reflectivity
The invention will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without any inventive effort, are within the scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Referring to fig. 1 to 7, an embodiment of the present invention provides a method for manufacturing a circuit board with high reflectivity, which includes the following steps:
in step S1, referring to fig. 1, an inner circuit board 10 is provided.
The inner circuit board 10 includes an insulating layer 11 and two inner circuit layers 13 disposed on two opposite surfaces of the insulating layer 11. A first opening 131 is formed in one of the inner circuit layers 13, and the insulating layer 11 is exposed from the first opening 131.
The material of the insulating layer 11 may be, but is not limited to, a prepreg (Prepreg, PP) including glass fiber and epoxy resin, polyimide, polyethylene terephthalate, or polyethylene naphthalate. In the present embodiment, the insulating layer 11 is made of a prepreg including glass fibers and an epoxy resin.
The material of the inner circuit layer 13 may be, but is not limited to, a metal such as copper, silver, or an alloy thereof. In this embodiment, the material of the inner circuit layer 13 is copper.
In this embodiment, the step S1 specifically includes the following steps:
Providing a double-sided copper-clad plate, wherein the double-sided copper-clad plate comprises an insulating layer 11 and two copper layers arranged on two opposite surfaces of the insulating layer 11;
punching, metallization and image transfer processes are performed on the double-sided copper clad laminate to obtain the inner circuit board 10.
In step S2, referring to fig. 2 and 3, a substrate 30 with high reflectivity is fixed in the first opening 131, and the first substrate 50 and the second substrate 60 are respectively pressed on opposite surfaces of the inner circuit board 10, so as to obtain a laminated structure 70. The substrate 30 having high reflectivity is buried in the laminated structure 70.
The first substrate 50 faces the substrate 30 having high reflectivity. The first substrate 50 includes a first insulating layer 51 and a first metal layer 53 stacked. The first insulating layer 51 is provided with a second opening 511 corresponding to the first opening 131. The first insulating layer 51 covers one inner circuit layer 13, and at least a portion of the substrate 30 having high reflectivity is exposed from the second opening 511. The first metal layer 53 covers the first insulating layer 51 and the substrate 30 having high reflectivity.
The second substrate 60 includes a second insulating layer 61 and a second metal layer 63 stacked. The second insulating layer 61 covers the other inner wiring layer 13 and is connected to the insulating layer 11.
The materials of the first insulating layer 51 and the second insulating layer 61 may be, but not limited to, a prepreg (Prepreg, PP) including glass fibers and epoxy resin, polyimide, polyethylene terephthalate, or polyethylene naphthalate. In the present embodiment, the material of the first insulating layer 51 is a prepreg including glass fibers 512 and an epoxy resin 513. The material of the first metal layer 53 and the second metal layer 63 may be, but is not limited to, copper, silver, or alloys thereof. In this embodiment, the first metal layer 53 and the second metal layer 63 are both made of copper.
The substrate 30 having high reflectivity is substantially inverted T-shaped, and includes a plate body 31 and a protruding portion 33 formed at one side of the plate body 31. The plate body 31 is accommodated in the first opening 131. The size of the plate body 31 is matched with the size of the first opening 131, and the edge of the plate body 31 is in contact with the side wall of the first opening 131. In this embodiment, the thickness of the plate body 31 is the same as the depth of the first opening 131, so that the surface of the plate body 31 facing away from the insulating layer 11 is flush with the surface of the inner circuit layer 13 having the first opening 131 facing away from the insulating layer 11.
The dimensions of the protrusion 33 are matched to the dimensions of the second opening 511, so that the protrusion 33 can pass through the second opening 511 during press fit. The projection 33 includes a mounting face 331 facing away from the plate body 31. The edge of the protruding portion 33 is spaced from the edge of the plate body 31 by a predetermined distance to form a dam structure 32 for preventing the molten epoxy resin from overflowing to the mounting surface 331 of the protruding portion 33 when the first insulating layer 51 is pressed. After lamination, the first insulating layer 51 covers an inner circuit layer 13, and the glass fiber 512 is not in contact with the substrate 30 with high reflectivity, and the epoxy 513 fills the dam structure 32. The surface of the first insulating layer 51 facing away from the inner circuit layer 13 is flush with the mounting surface 331 of the protruding portion 33.
The material of the substrate 30 having high reflectivity may be, but is not limited to, ceramic. In some embodiments, the substrate 30 having high reflectivity has a reflectivity of 92% to 97%.
In step S3, referring to fig. 4 to 6, a first circuit layer 81 and a second circuit layer 83 are respectively formed on opposite surfaces of the laminated structure 70. The first wiring layer 81 includes a plurality of wiring patterns 813 and a plurality of connection pads 815, and the plurality of wiring patterns 813 are located on the first insulating layer 51. The plurality of connection pads 815 are located on the mounting surface 331 and electrically connected to the plurality of circuit patterns 813. The second wiring layer 83 is located on the second insulating layer 61. The connection pads 815 are used to electrically connect electronic components, such as light emitting elements.
In the present embodiment, step S3 specifically includes the following steps S31 to S33.
In step S31, a through hole (not shown) is formed in the laminated structure 70, and the laminated structure 70 is plated to form a first plating layer 82, a second plating layer 84, and a conductive via 74, the conductive via 74 connecting the first plating layer 82, the second plating layer 84, and the two inner wiring layers 13. The first electroplated layer 82 covers a side of the first metal layer 53 facing away from the second metal layer 63, and the second electroplated layer 84 covers a side of the second metal layer 63 facing away from the first metal layer 53. The conductive via 74 is formed by electroplating the via.
The through holes penetrate through two opposite surfaces of the laminated structure 70. The through holes may be formed by, but not limited to, laser or mechanical drilling. The number of the through holes can be set according to actual needs. In this embodiment, the number of the through holes is two, and the two through holes are located at two sides of the substrate 30 having high reflectivity.
The material used for electroplating may be, but is not limited to, copper, silver, or alloys thereof. In this embodiment, the material used for the plating is copper.
In step S32, the first plating layer 82 and the first metal layer 53 are etched to form a plurality of wiring patterns 813, and the second plating layer 84 and the second metal layer 63 are etched to form a second wiring layer 83. The mounting surface 331 is exposed from the plurality of circuit patterns 813.
In step S33, a plurality of connection pads 815 are formed on the mounting surface 331. The plurality of connection pads 815 may be formed using a conventional semi-additive process (MSAP). In this embodiment, the connection pad 815 is made of copper.
In step S4, referring to fig. 7, a solder mask layer 90 is formed on the outer sides of the first circuit layer 81 and the second circuit layer 83, and the mounting surface 331 is exposed from the solder mask layer 90. A plurality of connection pads 815 are provided on the mounting surface 331 for connection to the light emitting element 200.
The solder resist layer 90 covers the exposed surfaces of the plurality of wiring patterns 813, the first insulating layer 51, the second wiring layer 83, and the second insulating layer 61, and fills the conductive holes 74. The solder mask layer 90 may be formed by conventional photolithography techniques using a material having a high reflectivity. In some embodiments, the reflectivity of the solder mask layer 90 is 92% to 95%.
Referring to fig. 7, an embodiment of the present invention provides a circuit board 100 with high reflectivity, which includes an inner circuit board 10, a substrate 30 with high reflectivity, a first insulating layer 51, a first circuit layer 81, a second insulating layer 61 and a second circuit layer 83. The inner circuit board 10 is provided with a first opening 131, and the substrate 30 with high reflectivity is fixed in the first opening 131. The first insulating layer 51 is stacked on one side of the inner circuit board 10. The first insulating layer 51 is provided with a second opening 511 corresponding to the first opening 131, and at least a portion of the substrate 30 having high reflectivity is exposed from the second opening 511. The first circuit layer 81 is located on a side of the first insulating layer 51 facing away from the inner circuit board 10, and includes a plurality of connection pads 815 disposed on the substrate 30 having high reflectivity. The second insulating layer 61 is stacked on the other side of the inner circuit board 10, and the second circuit layer 83 is located on the side of the second insulating layer 61 facing away from the inner circuit board 10.
The inner circuit board 10 includes an insulating layer 11 and two inner circuit layers 13 disposed on two opposite surfaces of the insulating layer 11. A first opening 131 is formed in one of the inner circuit layers 13, and the insulating layer 11 is exposed from the first opening 131.
The material of the insulating layer 11 may be, but is not limited to, a prepreg (Prepreg, PP) including glass fiber and epoxy resin, polyimide, polyethylene terephthalate, or polyethylene naphthalate. In the present embodiment, the insulating layer 11 is made of a prepreg including glass fibers and an epoxy resin.
The material of the inner circuit layer 13 may be, but is not limited to, a metal such as copper, silver, or an alloy thereof. In this embodiment, the material of the inner circuit layer 13 is copper.
The first insulating layer 51 covers one of the inner wiring layers 13. The first insulating layer 51 is provided with a second opening 511. The second insulating layer 61 covers the other inner wiring layer 13 and is connected to the insulating layer 11.
The materials of the first insulating layer 51 and the second insulating layer 61 may be, but not limited to, a prepreg (Prepreg, PP) including glass fibers and epoxy resin, polyimide, polyethylene terephthalate, or polyethylene naphthalate. In this embodiment, the first insulating layer 51 includes glass fibers 512 and an epoxy resin 513.
The substrate 30 having high reflectivity is substantially inverted T-shaped, and includes a plate body 31 and a protruding portion 33 formed at one side of the plate body 31. The plate body 31 is accommodated in the first opening 131. The size of the plate body 31 is matched with the size of the first opening 131, and the edge of the plate body 31 is in contact with the side wall of the first opening 131. In this embodiment, the thickness of the plate body 31 is the same as the depth of the first opening 131, so that the surface of the plate body 31 facing away from the insulating layer 11 is flush with the surface of the inner circuit layer 13 having the first opening 131 facing away from the insulating layer 11.
The dimensions of the protrusion 33 are matched to the dimensions of the second opening 511, so that the protrusion 33 can pass through the second opening 511 during press fit. The projection 33 includes a mounting face 331 facing away from the plate body 31. The edge of the protruding portion 33 is spaced from the edge of the plate body 31 by a predetermined distance to form a dam structure 32 for preventing the molten epoxy resin from overflowing to the mounting surface 331 of the protruding portion 33 when the first insulating layer 51 is laminated. The glass fibers 512 do not contact the substrate 30 having high reflectivity, and the epoxy 513 fills the dam structure 32. The surface of the first insulating layer 51 facing away from the inner circuit layer 13 is flush with the mounting surface 331 of the protruding portion 33.
The material of the substrate 30 having high reflectivity may be, but is not limited to, ceramic. In some embodiments, the substrate 30 having high reflectivity has a reflectivity of 92% to 97%.
The first circuit layer 81 further includes a plurality of circuit patterns 813, the plurality of circuit patterns 813 are located on the first insulating layer 51, and the mounting surface 331 is exposed from the plurality of circuit patterns 813.
The plurality of connection pads 815 are located on the mounting surface 331 and electrically connected to the plurality of circuit patterns 813. In this embodiment, the connection pad 815 is made of copper.
In some embodiments, the circuit board 100 with high reflectivity further includes conductive vias 74, the conductive vias 74 electrically connecting the first plating 82, the second plating 84, and the two inner circuit layers 13.
In some embodiments, the circuit board 100 with high reflectivity further includes a solder mask layer 90. The solder resist layer 90 is disposed outside the first circuit layer 81 and the second circuit layer 83, and the mounting surface 331 is exposed from the solder resist layer 90. A plurality of connection pads 815 are provided on the mounting surface 331 for connection to the light emitting element 200.
The solder resist layer 90 covers the exposed surfaces of the plurality of wiring patterns 813, the first insulating layer 51, the second wiring layer 83, and the second insulating layer 61, and fills the conductive holes 74. The solder mask layer 90 may be formed by conventional photolithography techniques using a material having a high reflectivity. In some embodiments, the reflectivity of the solder mask layer 90 is 92% to 95%.
In the circuit board 100 with high reflectivity provided in the embodiment of the invention, the connection pad 815 for connecting the light emitting element 200 is disposed on the substrate 30 with high reflectivity, so that the reflectivity is improved, and the light emitting efficiency of the light emitting element 200 is improved. And the reflectivity of the substrate 30 having high reflectivity is substantially identical to the reflectivity of the solder resist layer 90, so as to improve the light emitting uniformity of the light emitting element 200.
The foregoing disclosure is merely illustrative of the present invention and is not intended to limit the invention thereto, therefore, equivalent variations of the invention may be made and fall within the scope of the invention.
Claims (9)
1. A circuit board with high reflectivity is characterized by comprising
The inner-layer circuit board is provided with a first opening;
a substrate having a high reflectivity, the substrate having a high reflectivity being fixed in the first opening;
The first insulating layer is stacked on one side of the inner-layer circuit board and provided with a second opening corresponding to the first opening, and at least part of the substrate with high reflectivity is exposed from the second opening;
The first circuit layer is positioned on one side of the first insulating layer, which is away from the inner-layer circuit board, and comprises a plurality of connecting pads arranged on the substrate with high reflectivity;
the second insulating layer is stacked on the other side of the inner-layer circuit board; and
The second circuit layer is positioned at one side of the second insulating layer, which is away from the inner-layer circuit board;
The solder mask layer is arranged on the outer side of the first circuit layer, the substrate with high reflectivity is exposed out of the solder mask layer, the reflectivity of the solder mask layer is 92% -95%, and the reflectivity of the substrate with high reflectivity is 92% -97%.
2. The circuit board with high reflectivity according to claim 1, wherein said substrate with high reflectivity includes a board body and a protruding portion formed at one side of said board body, said board body being received in said first opening, said protruding portion being exposed from said second opening.
3. The circuit board of claim 2, wherein the edge of the protruding portion is spaced a predetermined distance from the edge of the board body to form a dam structure, the first insulating layer comprising glass fibers and epoxy, the epoxy filling the dam structure, the glass fibers not being in contact with the substrate having high reflectivity.
4. The circuit board with high reflectivity as claimed in claim 1, wherein said inner circuit board includes an insulating layer and two inner circuit layers disposed on two opposite surfaces of said insulating layer, wherein a first opening is formed in one of the inner circuit layers, and said insulating layer is exposed from said first opening.
5. The manufacturing method of the circuit board with high reflectivity is characterized by comprising the following steps:
providing an inner-layer circuit board, wherein the inner-layer circuit board is provided with a first opening;
Fixing a substrate with high reflectivity in the first opening, and respectively pressing the first substrate and the second substrate on the opposite surfaces of the inner-layer circuit board to obtain a laminated structure;
Forming a first circuit layer and a second circuit layer on opposite surfaces of the laminated structure respectively, wherein the first circuit layer comprises a plurality of connection pads which are positioned on the substrate with high reflectivity;
and forming a solder mask layer on the outer side of the first circuit layer, wherein the substrate with high reflectivity is exposed out of the solder mask layer, the reflectivity of the solder mask layer is 92-95%, and the reflectivity of the substrate with high reflectivity is 92-97%.
6. The method of manufacturing a circuit board with high reflectance according to claim 5, wherein the first substrate includes a laminated first insulating layer and a first metal layer, the first insulating layer covers one side of the inner layer wiring board and is provided with a second opening corresponding to the first opening, at least part of the substrate with high reflectance is exposed from the second opening, and the first metal layer covers the first insulating layer and the substrate with high reflectance; the second substrate comprises a second insulating layer and a second metal layer which are stacked, and the second insulating layer covers the other side of the inner-layer circuit board.
7. The method of manufacturing a circuit board with high reflectivity according to claim 6, wherein said substrate with high reflectivity includes a board body and a protruding portion formed on one side of said board body, said board body is accommodated in said first opening, and said protruding portion is exposed from said second opening.
8. The method of manufacturing a circuit board with high reflectivity as defined in claim 7, wherein the edge of the protruding portion is spaced apart from the edge of the board body by a predetermined distance to form a dam structure, the first insulating layer includes glass fiber and epoxy resin, the epoxy resin fills the dam structure, and the glass fiber is not in contact with the substrate with high reflectivity.
9. The method of manufacturing a circuit board having a high reflectance according to claim 6, wherein the step of forming a first wiring layer and a second wiring layer on opposite surfaces of the laminated structure, respectively, comprises:
forming a through hole on the laminated structure, and electroplating the laminated structure to form a first electroplated layer, a second electroplated layer and a conductive hole, wherein the conductive hole is connected with the first electroplated layer and the second electroplated layer;
Etching the first electroplated layer and the first metal layer to form a plurality of circuit patterns, and etching the second electroplated layer and the second metal layer to form a second circuit layer, wherein at least part of the substrate with high reflectivity is exposed out of the circuit patterns;
A plurality of connection pads are formed on the exposed substrate having high reflectivity.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011009995.XA CN114258192B (en) | 2020-09-23 | 2020-09-23 | Circuit board with high reflectivity and manufacturing method thereof |
| US17/036,574 US11317506B2 (en) | 2020-06-24 | 2020-09-29 | Circuit board with high light reflectivity and method for manufacturing the same |
| US17/701,865 US11696393B2 (en) | 2020-06-24 | 2022-03-23 | Method for manufacturing circuit board with high light reflectivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011009995.XA CN114258192B (en) | 2020-09-23 | 2020-09-23 | Circuit board with high reflectivity and manufacturing method thereof |
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| CN114258192A CN114258192A (en) | 2022-03-29 |
| CN114258192B true CN114258192B (en) | 2024-10-15 |
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| CN202011009995.XA Active CN114258192B (en) | 2020-06-24 | 2020-09-23 | Circuit board with high reflectivity and manufacturing method thereof |
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| CN (1) | CN114258192B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101006031A (en) * | 2004-08-18 | 2007-07-25 | 株式会社德山 | Ceramic substrate for mounting light-emitting device and method for producing same |
| CN101884257A (en) * | 2007-12-05 | 2010-11-10 | 三菱树脂株式会社 | Multilayer wiring board having cavity section |
| KR20120033039A (en) * | 2010-09-29 | 2012-04-06 | 엘지이노텍 주식회사 | The radiant heat circuit board and the method for manufacturing the same |
| CN103531584A (en) * | 2012-07-06 | 2014-01-22 | Lg伊诺特有限公司 | Light emitting device package |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0824301A3 (en) * | 1996-08-09 | 1999-08-11 | Hitachi, Ltd. | Printed circuit board, IC card, and manufacturing method thereof |
| JP4789671B2 (en) * | 2006-03-28 | 2011-10-12 | 京セラ株式会社 | WIRING BOARD FOR LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE |
| TW200802957A (en) * | 2006-06-16 | 2008-01-01 | Gigno Technology Co Ltd | Light emitting diode module |
| US7687823B2 (en) * | 2006-12-26 | 2010-03-30 | Nichia Corporation | Light-emitting apparatus and method of producing the same |
| TWI427716B (en) * | 2010-06-04 | 2014-02-21 | 矽品精密工業股份有限公司 | Semiconductor package without carrier and method of fabricating the same |
| TWI554047B (en) * | 2011-12-19 | 2016-10-11 | 鴻海精密工業股份有限公司 | Optical-electrical module |
| JP5848976B2 (en) * | 2012-01-25 | 2016-01-27 | 新光電気工業株式会社 | WIRING BOARD, LIGHT EMITTING DEVICE, AND WIRING BOARD MANUFACTURING METHOD |
| KR101557942B1 (en) * | 2014-01-08 | 2015-10-12 | 주식회사 루멘스 | Light emitting device package and its manufacturing method |
-
2020
- 2020-09-23 CN CN202011009995.XA patent/CN114258192B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101006031A (en) * | 2004-08-18 | 2007-07-25 | 株式会社德山 | Ceramic substrate for mounting light-emitting device and method for producing same |
| CN101884257A (en) * | 2007-12-05 | 2010-11-10 | 三菱树脂株式会社 | Multilayer wiring board having cavity section |
| KR20120033039A (en) * | 2010-09-29 | 2012-04-06 | 엘지이노텍 주식회사 | The radiant heat circuit board and the method for manufacturing the same |
| CN103531584A (en) * | 2012-07-06 | 2014-01-22 | Lg伊诺特有限公司 | Light emitting device package |
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| CN114258192A (en) | 2022-03-29 |
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