CN114237370A

CN114237370A - Thermosiphon heat sink

Info

Publication number: CN114237370A
Application number: CN202111532363.6A
Authority: CN
Inventors: 不公告发明人
Original assignee: Zhejiang Kuling Information Technology Co ltd
Current assignee: Zhejiang Kuling Information Technology Co ltd
Priority date: 2021-12-15
Filing date: 2021-12-15
Publication date: 2022-03-25
Anticipated expiration: 2041-12-15
Also published as: CN114237370B

Abstract

A thermosiphon heat sink includes a heat sink and a base for mounting a heat generating component. The base includes a heat absorption chamber to store a refrigerant. The radiator comprises a plurality of radiating pipes and radiating fins. The plurality of heat dissipation pipes are arranged at intervals along a first direction, and two adjacent heat dissipation pipes are staggered along a second direction perpendicular to the first direction. Each cooling tube includes first body, second body and intercommunication first body with the top body of second body. Wherein the first tube body includes a first bottom end, the second tube body includes a second bottom end, and the second bottom end extends downward beyond the first bottom end. The first bottom end is inserted into the top of the heat absorption cavity, so that the refrigerant after heat absorption and gasification flows to the second tube body from the first bottom end. The second bottom end is inserted into the bottom of the heat absorption cavity, so that the refrigerant cooled by heat exchange flows back to the heat absorption cavity from the second bottom end.

Description

Thermosiphon heat sink

Technical Field

The invention relates to a thermosiphon heat dissipation device, belonging to the technical field of heat dissipation devices.

Background

With the development of technology, the heat dissipation requirements of heat generating components (such as chips) are higher and higher. How to design a heat dissipation device with high heat dissipation efficiency is a technical problem faced by those skilled in the art.

Disclosure of Invention

The invention aims to provide a thermosiphon heat dissipation device with high heat dissipation efficiency.

In order to achieve the purpose, the invention adopts the following technical scheme: a thermosiphon heat sink, comprising:

a base including a heat absorption chamber to store a refrigerant, at least one surface of the base to mount a heat generating element; and

the radiator is fixed on the base and comprises a plurality of radiating pipes and radiating fins connected with the radiating pipes, the radiating pipes are arranged at intervals along a first direction, two adjacent radiating pipes are staggered along a second direction perpendicular to the first direction, each radiating pipe comprises a first pipe body, a second pipe body and a top pipe body communicated with the first pipe body and the second pipe body, the first pipe body comprises a first main body part and a first bottom end located below the first main body part, the second pipe body comprises a second main body part and a second bottom end located below the second main body part, and the second bottom end extends downwards to exceed the first bottom end;

the first bottom end is inserted into the top of the heat absorption cavity, so that the refrigerant after heat absorption and gasification flows to the second tube body from the first bottom end;

the second bottom end is inserted into the bottom of the heat absorption cavity, so that the refrigerant cooled by heat exchange flows back to the heat absorption cavity from the second bottom end.

As a further improved aspect of the present invention, the heat sink includes a ventilation surface for allowing air to pass through the heat dissipating fins, and the base portion includes a mounting surface for mounting the heat generating element, the mounting surface being perpendicular to the ventilation surface.

As a further improved technical solution of the present invention, the first main body portion is parallel to the second main body portion, each heat dissipation pipe includes an accommodation space between the first main body portion and the second main body portion, and the heat dissipation fins are mounted in the accommodation space.

As a further improved technical solution of the present invention, the top tube body is arc-shaped, and the heat dissipation fin, the first main body portion, and the second main body portion are exposed outside the base portion; the heating element is a chip.

As a further improved technical solution of the present invention, the base is provided with a baffle plate located below the first bottom end and vertically spaced from the first bottom end, the baffle plate facing the first bottom end to prevent the liquid refrigerant from flowing into the radiating pipe from the first bottom end.

As a further improved technical scheme of the invention, the base comprises a plurality of clapboards which are positioned in the heat absorption cavity and are arranged at intervals; the baffle is roughly L-shaped, the baffle includes the bottom plate and from the extension that one side of bottom plate upwards extended, the extension is in on the second direction be located same cooling tube the first bottom with between the second body.

As a further improved technical solution of the present invention, the base includes a top wall, a bottom wall opposite to the top wall, a first side wall connecting the top wall and the bottom wall, and a cover plate opposite to the first side wall, the heat absorption cavity is located between the top wall, the bottom wall, the first side wall, and the cover plate, and the mounting surface is located on the first side wall and/or the cover plate.

As a further improved technical solution of the present invention, the top wall is provided with an installation groove, the thermosiphon heat dissipation device includes a slot plate installed in the installation groove, and the slot plate is provided with a plurality of slots through which the first bottom end and the second bottom end respectively pass.

As a further improved technical solution of the present invention, the first pipe body and/or the second pipe body is provided with a bending portion bending inward, so that a distance between the first main body portion and the second main body portion on the same heat dissipation pipe along the second direction is greater than a distance between the first bottom end and the second bottom end along the second direction.

As a further improved technical scheme of the invention, the top surface of the slot plate is flush with the top surface of the top wall, and the slot plate and the radiating pipe are fixed by brazing together.

Compared with the prior art, the thermosiphon heat dissipation device self-forming system has the advantages that the first bottom end and the second bottom end with different heights are arranged, so that the refrigerant after heat absorption and gasification and the refrigerant after heat exchange and cooling can flow conveniently; through setting up the radiator, improved the heat transfer effect of refrigerant with the air. In addition, by offsetting two adjacent heat dissipation pipes along a second direction perpendicular to the first direction, the arrangement mode can better adapt to a system with a smaller air duct size.

Drawings

Fig. 1 is a perspective view of a thermosiphon heat dissipation device and a heat generating element according to the present invention.

Fig. 2 is a left side view of fig. 1.

Fig. 3 is a rear view of fig. 1.

Fig. 4 is a top view of fig. 1.

Fig. 5 is a partially exploded perspective view of fig. 1.

Fig. 6 is a partial exploded perspective view of the other angle of fig. 5.

Fig. 7 is a further exploded perspective view of fig. 6.

Fig. 8 is a schematic sectional view taken along line B-B in fig. 4.

Fig. 9 is a partially enlarged view of circled portion a in fig. 8.

Detailed Description

Exemplary embodiments of the present invention will be described in detail below with reference to the accompanying drawings. If several embodiments exist, the features of these embodiments may be combined with each other without conflict. When the description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The statements made in the following exemplary detailed description do not represent all implementations consistent with the present disclosure; rather, they are merely examples of apparatus, products, and/or methods consistent with certain aspects of the invention, as set forth in the claims below.

The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the present invention. As used in the specification and claims of this invention, the singular form of "a", "an", or "the" is intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be understood that the use of terms such as "first," "second," and the like, in the description and in the claims of the present invention do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. Unless otherwise indicated, the terms "front," "back," "up," "down," and the like in the description of the invention are used for convenience of description and are not limited to a particular position or spatial orientation. The word "comprise" or "comprises", and the like, is an open-ended expression meaning that an element that precedes "includes" or "comprising" includes "that the element that follows" includes "or" comprises "and its equivalents, that do not preclude the element that precedes" includes "or" comprising "from also including other elements. If the invention is referred to as "a plurality", it means two or more.

Referring to fig. 1 to 9, the present invention discloses a thermosiphon heat dissipation device 100 for mounting a heat generating element 200 to dissipate heat of the heat generating element 200. The heating element 200 is a chip, such as an IGBT chip. The thermosiphon heat sink 100 includes a base 1 and a heat sink 2 connected to the base 1.

Referring to fig. 7, the base 1 includes a heat absorbing chamber 10 for storing a refrigerant, and the heat generating element 200 is mounted on at least one surface of the base 1. Specifically, in the illustrated embodiment of the present invention, the base 1 includes a top wall 11, a bottom wall 12 opposite to the top wall 11, a first side wall 13 connecting the top wall 11 and the bottom wall 12, a cover plate 14 opposite to the first side wall 13, a second side wall 15 connecting the top wall 11 and the bottom wall 12, and a third side wall 16 opposite to the second side wall 15. In the illustrated embodiment of the invention, the base 1 is substantially rectangular parallelepiped, the top wall 11 and the bottom wall 12 are parallel to each other, the first side wall 13 and the cover plate 14 are parallel to each other, and the second side wall 15 and the third side wall 16 are parallel to each other. The heat absorption chamber 10 is enclosed by the top wall 11, the bottom wall 12, the first side wall 13, the second side wall 15, the third side wall 16 and the cover plate 14. The cover plate 14 is welded to the other components of the base 1 to facilitate assembly and maintenance of the thermosiphon heat sink 100.

In the illustrated embodiment of the invention, the top wall 11 is provided with a mounting groove 111. The thermosiphon heat sink 100 includes a groove plate 17 installed in the installation groove 111. The top surface 171 of the slot plate 17 is flush with the top surface 112 of the top wall 11. The slot plate 17 is provided with a number of slots 172.

In the illustrated embodiment of the invention, the base 1 further comprises a plurality of baffles 18 spaced apart and located within the heat absorption chamber 10. The partition plate 18 divides the heat absorption chamber 10 into a plurality of sub heat absorption chambers 101 which are arranged side by side. The base 1 further comprises baffles 19 protruding into the sub heat absorption chamber 101. In the illustrated embodiment of the present invention, the baffle plate 19 is substantially L-shaped, and the baffle plate 19 includes a bottom plate 191 connected to the first side wall 13 and an extension 192 extending upward from one side of the bottom plate 191. Preferably, the baffle plate 19 is welded and fixed to the partition plate 18 or the baffle plate 19 is integrally formed with the partition plate 18.

The heat sink 2 is fixed to the base 1 by welding. The radiator 2 includes a plurality of radiating pipes 21 and a plurality of radiating fins 22 connected to the plurality of radiating pipes 21. The radiating pipes 21 are arranged at intervals along a first direction D-D, wherein two adjacent radiating pipes 21 are staggered along a second direction E-E perpendicular to the first direction D-D. That is, adjacent two of the radiating pipes 21 are not aligned along the first direction D-D. In one embodiment of the present invention, the heat dissipation pipe 21 is a flat pipe, such as a microchannel flat pipe. Each of the heat radiating pipes 21 includes a first pipe body 211, a second pipe body 212, and a top pipe body 213 communicating the first pipe body 211 and the second pipe body 212, wherein the first pipe body 211 includes a first body portion 2111 and a first bottom end 2110 positioned below the first body portion 2111. The second tube 212 includes a second body portion 2121 and a second bottom end 2120 located below the second body portion 2121. The second tube 212 has a length greater than the first tube 211, and the second bottom end 2120 extends downward beyond the first bottom end 2110. The top pipe body 213 is curved to reduce the flow resistance of the refrigerant. The heat dissipating fins 22, the first body portion 2111, and the second body portion 2121 are exposed to the outside of the base 1 to facilitate heat exchange with air. In addition, each sub heat absorption cavity 101 corresponds to one heat dissipation pipe 21. By arranging a plurality of relatively independent sub heat absorption chambers 101, the distribution of the refrigerant in the sub heat absorption chambers 101 is improved, so that the situation that part of the sub heat absorption chambers 101 are lack of the refrigerant is avoided.

In the illustrated embodiment of the invention, the first body portion 2111 is parallel to the second body portion 2121. The first bottom end 2110 is parallel to the second bottom end 2120. Each of the radiating pipes 21 includes an accommodating space 214 between the first body portion 2111 and the second body portion 2121, and the radiating fins 22 are installed in the accommodating space 214. By arranging the heat radiating fins 22, the heat exchange area between the radiator 2 and the air is increased. The first pipe 211 and/or the second pipe 212 are/is provided with a bent portion 215 bent inward, so that a distance between the first main portion 2111 and the second main portion 2121 of the same heat dissipation pipe 21 along the second direction E-E is greater than a distance between the first bottom end 2110 and the second bottom end 2120 along the second direction E-E. This design is advantageous in increasing the receiving space 214, so that the heat dissipation fins 22 with larger heat dissipation area can be installed to further improve the heat dissipation capability.

The heat sink 2 includes a ventilation surface 23 for allowing air to pass through the heat dissipating fins 22, and the base 1 includes a mounting surface 110 for mounting the heat generating element 200, wherein the mounting surface 110 and the ventilation surface 23 are not coplanar. In the illustrated embodiment of the invention, the mounting surface 110 is perpendicular to the ventilation surface 23. The arrangement mode can be well suitable for a system with a small air duct size. The mounting surface 110 is located on the first sidewall 13 and/or the cover plate 14. In the illustrated embodiment of the invention, the mounting surface 110 is provided on the cover plate 14. The sizes of the heat sink 2, the mounting surface 110 and the air duct may be flexibly set as required.

The first and second bottom ends 2110 and 2120 of the radiating pipe 21 are respectively downwardly passed through the corresponding slots 172 of the slot plate 17. Preferably, the slot plate 17 is fixed to the radiating pipe 21 by brazing.

The first bottom end 2110 is communicated with the top of the heat absorption chamber 10, so that the refrigerant after absorbing heat and gasifying flows from the first bottom end 2110 to the second tube 212; the second bottom end 2120 is communicated with the bottom of the heat absorption chamber 10 to allow the refrigerant cooled by heat exchange to flow back to the heat absorption chamber 10 from the second bottom end 2120 to complete one cycle. In other words, in the illustrated embodiment of the present invention, the first bottom end 2110 is inserted into the top of the heat absorption chamber 10, the second bottom end 2120 is inserted into the bottom of the heat absorption chamber 10, the first bottom end 2110 is an exhaust port, and the second bottom end 2120 is a liquid return port.

The refrigerant flows in the first tube 211 and the refrigerant flows in the second tube 212 with at least components in opposite directions. Referring to fig. 9, in the illustrated embodiment of the present invention, the first body portion 2111 is parallel to the second body portion 2121, so the flow direction of the refrigerant in the first body portion 2111 is vertically upward, and the flow direction of the refrigerant in the second body portion 2121 is vertically downward. Of course, in other embodiments, the first body portion 2111 and the second body portion 2121 may have an included angle. At this time, the refrigerant flows in the first body portion 2111 from bottom to top as a whole, and the refrigerant flows in the second body portion 2121 from top to bottom as a whole. In any case, the refrigerant has an upward component in the flow direction in the first tube 211, and the refrigerant has a downward component in the flow direction in the second tube 212.

The baffle 19 is substantially located at the bottom of the first bottom end 2110, and the baffle 19 is opposite to the first bottom end 2110 to prevent the liquid refrigerant from flowing into the radiating pipe 21 from the first bottom end 2110. Specifically, the bottom plate 191 is located below the first bottom end 2110 and is spaced apart from the first bottom end 2110 by a certain distance in a vertical direction. The extension portion 192 is located between the first bottom end 2110 of the same heat radiating pipe 21 and the second pipe body 212 in the second direction E-E. Preferably, the extending portion 192 can contact with the side surface of the first tube 211 facing the second tube 212, so as to provide a certain limiting effect to the first tube 211, reduce the impact on the first tube 211 caused by the refrigerant after heat absorption and gasification when flowing into the first bottom end 2110, and reduce the probability of deformation of the first tube 211.

The working principle of the thermosiphon heat sink 100 of the present invention is as follows: the heat absorption chamber 10 is filled with a refrigerant, and at least one side of the base 1 is mounted with a heating element 200 such as an IGBT chip. When the heat generating element 200 generates heat due to its operation, the heat is transferred to the liquid refrigerant in the heat absorbing chamber 10 through the base 1; the liquid refrigerant absorbs heat to be gasified, and the refrigerant absorbing heat and gasified moves upwards and enters the radiator 2 through the first bottom end 2110; by heat exchange with air through the radiator 2, the temperature of the refrigerant is lowered, and the refrigerant is gradually condensed into a liquid state in the radiator 2 and flows down the passage in the second tube 212 until flowing back to the heat absorption chamber 10 from the second bottom end 2120, thereby completing one cycle.

Compared with the prior art, the thermosiphon heat dissipation device 100 of the present invention is configured to facilitate the flow of the vaporized refrigerant after heat absorption and the refrigerant cooled by heat exchange by providing the first bottom 2110 and the second bottom 2120 with different heights; in addition, by arranging the radiator 2, the heat exchange effect between the refrigerant and the air is improved, and the better heat dissipation effect of the heating element 200 is favorably realized.

The above embodiments are only for illustrating the invention and not for limiting the technical solutions described in the invention, and the understanding of the present invention should be based on the technical personnel in the technical field, and although the present invention has been described in detail by referring to the above embodiments, the technical personnel in the technical field should understand that the technical personnel in the technical field can still make modifications or equivalent substitutions to the present invention, and all the technical solutions and modifications thereof without departing from the spirit and scope of the present invention should be covered in the claims of the present invention.

Claims

1. A thermosiphon heat sink (100), comprising:

a base (1), said base (1) comprising a heat absorption chamber (10) to store a refrigerant, at least one surface of said base (1) being to mount a heat generating element (200); and

a heat sink (2), the heat sink (2) is fixed to the base (1), the heat sink (2) includes a plurality of heat pipes (21) and heat dissipating fins (22) connected to the heat pipes (21), the heat pipes (21) are arranged at intervals along a first direction (D-D), wherein two adjacent heat pipes (21) are dislocated along a second direction (E-E) perpendicular to the first direction (D-D), each heat pipe (21) includes a first pipe body (211), a second pipe body (212) and a top pipe body (213) communicating the first pipe body (211) and the second pipe body (212), wherein the first pipe body (211) includes a first main body portion (2111) and a first bottom end (2110) located below the first main body portion (2111), the second pipe body (212) includes a second main body portion (2121) and a second bottom end (2120) located below the second main body portion (2121) And the second bottom end (2120) extends downwardly beyond the first bottom end (2110);

wherein the first bottom end (2110) is inserted into the top of the heat absorption chamber (10) to allow the refrigerant gasified by absorbing heat to flow from the first bottom end (2110) to the second tube (212);

the second bottom end (2120) is inserted into the bottom of the heat absorption chamber (10) to allow the refrigerant cooled by heat exchange to flow back to the heat absorption chamber (10) from the second bottom end (2120).

2. A thermosiphon heat sink (100) according to claim 1, wherein: the heat sink (2) includes a ventilation surface (23) for allowing air to pass through the heat radiating fins (22), and the base (1) includes a mounting surface (110) for mounting the heat generating element (200), the mounting surface (110) being perpendicular to the ventilation surface (23).

3. A thermosiphon heat sink (100) according to claim 1, wherein: the first body portion (2111) is parallel to the second body portion (2121), each heat dissipation pipe (21) includes an accommodation space (214) between the first body portion (2111) and the second body portion (2121), and the heat dissipation fins (22) are installed in the accommodation space (214).

4. A thermosiphon heat sink (100) according to claim 1, wherein: the top tube body (213) is arc-shaped, and the heat dissipation fins (22), the first main body portion (2111) and the second main body portion (2121) are exposed out of the base (1); the heating element (200) is a chip.

5. A thermosiphon heat sink (100) according to claim 1, wherein: the base (1) is provided with a baffle (19) positioned below the first bottom end (2110) and spaced apart from the first bottom end (2110) in a vertical direction, and the baffle (19) is opposite to the first bottom end (2110) to prevent the refrigerant in a liquid state from flowing into the radiating pipe (21) from the first bottom end (2110).

6. The thermosiphon heat sink (100) of claim 5, wherein: the base part (1) comprises a plurality of clapboards (18) which are positioned in the heat absorption cavity (10) and are arranged at intervals; the baffle plate (19) is substantially L-shaped, the baffle plate (19) comprises a bottom plate (191) and an extending part (192) extending upwards from one side of the bottom plate (191), and the extending part (192) is positioned between the first bottom end (2110) and the second pipe body (212) of the same radiating pipe (21) in the second direction (E-E).

7. A thermosiphon heat sink (100) according to claim 1, wherein: the base (1) comprises a top wall (11), a bottom wall (12) opposite to the top wall (11), a first side wall (13) connecting the top wall (11) and the bottom wall (12), and a cover plate (14) opposite to the first side wall (13), the heat absorption cavity (10) is located between the top wall (11), the bottom wall (12), the first side wall (13) and the cover plate (14), and the mounting surface (110) is located on the first side wall (13) and/or the cover plate (14).

8. The thermosiphon heat sink (100) of claim 7, wherein: the top wall (11) is provided with a mounting groove (111), the thermosiphon heat dissipation device (100) comprises a groove plate (17) mounted in the mounting groove (111), and the groove plate (17) is provided with a plurality of slots (172) for the first bottom end (2110) and the second bottom end (2120) to respectively pass through.

9. A thermosiphon heat sink (100) according to claim 8, wherein: the first pipe body (211) and/or the second pipe body (212) are/is provided with a bending part (215) which is bent inwards, so that the distance between the first main body part (2111) and the second main body part (2121) on the same radiating pipe (21) along the second direction (E-E) is greater than the distance between the first bottom end (2110) and the second bottom end (2120) along the second direction (E-E).

10. A thermosiphon heat sink (100) according to claim 8, wherein: the top surface (171) of the slot plate (17) is flush with the top surface (112) of the top wall (11), and the slot plate (17) and the radiating pipe (21) are fixed by brazing together.