Drawings
The following detailed description, when read in conjunction with the appended drawings, will facilitate a better understanding of aspects of the disclosure. It should be noted that the features in the drawings are not necessarily drawn to scale as may be necessary to illustrate practice. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.
Fig. 1 is a schematic diagram illustrating an inductive device according to some embodiments of the disclosure.
Fig. 2 is a schematic diagram illustrating an inductive device according to some embodiments of the disclosure.
Fig. 3 is a schematic diagram illustrating an inductive device according to some embodiments of the present disclosure.
Fig. 4 is a schematic diagram illustrating an inductive device according to some embodiments of the present disclosure.
Fig. 5 is a schematic diagram illustrating an inductive device according to some embodiments of the present disclosure.
Fig. 6 is a schematic diagram showing experimental data of an inductive device according to an embodiment of the disclosure.
Description of the symbols
1. 2, 3, 4, 5 inductive device
10. 50 splayed inductor structure
111. 112 first coil
121. 122 second coil
130 input terminal
140 central tap end
21. 21', 21 ": first helical coil
22. 22', 22 ": a second helical coil
211. 212, 213, 221, 222, 223 sub-helical coil
31. 32, 33, 34, 35, 36 connecting piece
32 ', 33' connecting piece
41. 42, 43, 44 interlaced part
51 third helical coil
52 fourth helical coil
R1, R2, R3 are imaginary lines
511. 512 first coil
521. 522 second coil
61 first helical coil
62 second helical coil
71. 72 connecting piece
81. 82: interlaced part
L, Q curve
Detailed Description
The following disclosure provides many different embodiments for implementing different features of the disclosure. Embodiments of the elements and arrangements are described below to simplify the present disclosure. Of course, these embodiments are merely exemplary and not intended to be limiting. For example, the terms "first" and "second" are used herein to describe elements, but are used only to distinguish identical or similar elements or operations, and are not used to limit the technical elements, nor the order or sequence of operations. In addition, the present disclosure may repeat reference numerals and/or letters in the various embodiments, and the same technical terms may be used throughout the various embodiments by using the same and/or corresponding reference numerals. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
Referring to fig. 1, a schematic diagram of an inductive device 1 according to some embodiments of the disclosure is shown. As shown in fig. 1, the inductance device 1 includes a figure-of-eight inductance structure 10, a first spiral coil 21 and a second spiral coil 22. The figure-of-eight inductor structure 10 includes two first coils 111 and 112 and two second coils 121 and 122. The first helical coil 21 is disposed inside the first coils 111 and 112. The second helical coil 22 is disposed inside the second coils 121 and 122.
As shown in fig. 1, the first coil 111 is coupled to the second coil 121 through the first connection element 31. The first coil 112 is coupled to the first helical coil 21 via the second connector 32. The first helical coil 21 is coupled to the second coil 122 through the first interleaving part 41. The second coils 121 and 122 are coupled to the second spiral coil 22 through the third connecting element 33 and the fourth connecting element 34, respectively. The first interleaving portion 41 interleaves with the first connector 31 and the second connector 32, respectively.
In some embodiments, the figure-of-eight inductor structure 10, the first interleaved part 41, the first spiral coil 21 and the second spiral coil 22 are located on the first layer. The first connecting member 31, the second connecting member 32, the third connecting member 33 and the fourth connecting member 34 are located on the second layer. The first layer is different from the second layer.
As shown in fig. 1, the first coils 111 and 112 and the second coils 121 and 122 form a substantially replicated projection relationship based on the imaginary line R1. The first helical coil 21 and the second helical coil 22 form an approximate replica projection relationship based on the virtual line R1.
In some embodiments, the input terminal 130 is disposed on a first side of the first coils 111 and 112. The first and second connectors 31 and 32 are disposed on the second sides of the first coils 111 and 112. The first side of the first coils 111 and 112 is opposite to the second side. For example, the first side is an upper side of the first coils 111 and 112, and the second side of the first coils 111 and 112 is a lower side of the first coils 111 and 112.
In some embodiments, the first connecting element 31 is disposed on a first side of the second coils 121 and 122. The third and fourth connectors 33 and 34 are disposed on the second sides of the second coils 121 and 122. For example, the first side of the second coils 121 and 122 is the upper side of the second coils 121 and 122, and the second side of the second coils 121 and 122 is the lower side of the second coils 121 and 122.
In some embodiments, the first helical coil 21 and the second helical coil 22 comprise one or more turns. The embodiment of fig. 1 is illustrated with one turn as an example.
In some embodiments, the input terminal 130, the first connecting element 31, the second connecting element 32, the third connecting element 33 and the fourth connecting element 34 are approximately aligned along a configuration line (not shown) perpendicular to the imaginary line R1, as shown in fig. 1, the first connecting element 31, the second connecting element 32, the third connecting element 33 and the fourth connecting element 34 are configured from top to bottom on a plane instead of being disposed at left and right sides of the first coils 111 and 112 and/or the second coils 121 and 122.
In some embodiments, the inductive device 1 comprises a center tap 140. As shown in fig. 1, the center tap 140 is disposed at the staggered portion of the third connection member 33 and the fourth connection member 34. In some embodiments, the third connecting member 33 and the fourth connecting member 34 are disposed on different layers. The center tap 140 may be provided at the same layer as the third connector 33 or at the fourth connector 34.
Referring to fig. 2, a schematic diagram of an inductive device 2 according to some embodiments of the disclosure is shown. The same reference numerals as those in fig. 1 are used in fig. 2, and the description thereof is the same as that described above, and will not be repeated here.
As shown in fig. 2, the inductor device 2 includes a figure eight inductor structure 10, a first spiral coil 21 'and a second spiral coil 22'. The figure-of-eight inductor structure 10 includes two first coils 111 and 112 and two second coils 121 and 122. The first helical coil 21 'and the second helical coil 22' have more than one turn of helical coils. The first helical coil 21' is disposed inside the first coils 111 and 112. The second helical coil 22' is disposed inside the second coils 121 and 122.
In some embodiments, since the number of turns of the first helical coil 21 ' is more than one, the second connection member 32 partially overlaps above or below the first helical coil 21 ' to connect to an end located at the innermost turn of the first helical coil 21 '.
As shown in fig. 2, the second coil 121 is coupled to the second helical coil 22 'through a third connection member 33'. The second helical coil 22' is coupled to the second coil 122 through the second interleaving portion 42. Similarly, the second helical coil 22 'has more than one turn, and the third connection member 33' may partially overlap above or below the second helical coil 22 'to connect to an end located at the innermost turn of the second helical coil 22'.
In some embodiments, the first helical coil 21 'and the second helical coil 22' comprise one or more turns. The embodiment of fig. 2 is illustrated with a complex number of turns as an example. Therefore, the number of turns of the spiral coil in the splayed inductor structure is increased, and the inductance of the inductor structure 2 is also increased accordingly.
Referring to fig. 3, a schematic diagram of an inductive device 3 according to some embodiments of the disclosure is shown. The same reference numerals as those in fig. 1 and 2 are used in fig. 3, and the description thereof is the same as that described above, and will not be repeated here.
As shown in fig. 3, the inductance device 1 includes a figure eight inductance structure 10, a first spiral coil 21 ', a second spiral coil 22', a third spiral coil 51, and a fourth spiral coil 52. The third helical coil 51 is disposed above or below the first helical coil 21' and partially overlaps. The fourth helical coil 52 is disposed above or below the second helical coil 22' and partially overlaps.
The second connection 32 of the inductive device 2 of fig. 2 is coupled to the first helical coil 21 ', in contrast to the second connection 32' of the inductive device 3 coupled to the third helical coil 51. As shown in fig. 3, the first coil 112 is coupled to the first end of the third spiral coil 51 through the second connection element 32'. In a direction looking down on the inductance device 3, a second end of the third spiral-shaped coil 51 is coupled to the first spiral-shaped coil 21' through a vertical connection (e.g., via).
The third connection 33 'of the inductive device 2 of fig. 2 is coupled to the second helical coil 22', in contrast to the third connection 33 "of the inductive device 3 coupled to the fourth helical coil 52. As shown in fig. 3, the second coil 121 is coupled to the first end of the fourth helical coil 52 through the third connection 33 ". In a direction looking down on the inductance device 3, a second end of the fourth spiral-shaped coil 52 is coupled to the fourth spiral-shaped coil 22' through a vertical connection.
In some embodiments, the figure eight inductor structure 10, the first spiral coil 21 ', the first interleaving part 41, the second spiral coil 22', and the second interleaving part 42 are located on the first layer. The third spiral coil 51, the first connector 31, the second connector 32 ', the fourth spiral coil 52, and the third connector 33' are located on the second layer. Wherein the first layer is different from the second layer.
Referring to fig. 4, a schematic diagram of an inductive device 4 according to some embodiments of the disclosure is shown. As shown in fig. 4, the inductance device 4 includes a figure eight inductance structure 10, a first spiral coil 21 "and a second spiral coil 22". The figure-of-eight inductor structure 10 includes two first coils 111 and 112 and two second coils 121 and 122. The first helical coil 21 "is disposed inside the first coils 111 and 112. The second helical coil 22 ″ is disposed inside the second coils 121 and 122.
The spiral structure of the inductive device 4 is different from the spiral structure of the inductive device 1. As shown in fig. 4, the first helical coil 21 ″ includes sub-helical coils 211, 212, and 213. The sub-helical coil 211 is coupled to the second coil 122 through the first interleaving portion 41. The sub-helical coil 212 is coupled to the first coil 112 through the second connection member 32. The sub-helical coil 213 is coupled to the sub-helical coil 211 through the fifth connection 35 and to the sub-helical coil 212 through the third interleaving section 43. In this embodiment, the third interleaving portion 43 and the fifth connection member 35 are interleaved and coupled on the upper side of the first helical coil 21 ".
As shown in fig. 4, second helical coil 22 "includes sub-helical coils 221, 222, and 213. The sub-helical coil 221 is coupled to the second coil 122 through the second interleaving portion 42. The sub-helical coil 222 is coupled to the second coil 121 through the third connection member 33'. The sub-helical coil 223 is coupled to the sub-helical coil 221 through the sixth connection 36 and to the sub-helical coil 222 through the fourth interleaving portion 44. In this embodiment, the fourth interleaved part 44 and the sixth connecting element 36 are interleaved and coupled on the upper side of the second helical coil 22 ".
As shown in fig. 4, the first coils 111 and 112 and the second coils 121 and 122 form a quasi-replica projection (replica projection) relationship based on the imaginary line R2. The first helical coil 21 "and the second helical coil 22" form an approximate replica projection relationship based on the virtual line R2.
The inductive means 4 comprise an input 130. The input terminal 130 is disposed on the upper side of the first coils 111 and 112. In some embodiments, the input terminal 130, the first connection member 31, the second connection member 32, the third connection member 33', the fifth connection member 35 and the sixth connection member 36 are approximately aligned along a configuration line (not shown) perpendicular to the imaginary line R2.
Referring to fig. 5, a schematic diagram of an inductive device 5 according to some embodiments of the disclosure is shown. As shown in fig. 5, the inductance device 5 includes a figure-of-eight inductance structure 50, a first spiral coil 61 and a second spiral coil 62. The figure-of-eight inductor structure 50 includes two first coils 511 and 512 and two second coils 521 and 522. The first helical coil 61 is disposed inside the first coils 511 and 512. The second spiral coil 62 is disposed inside the second coils 621 and 622.
As shown in fig. 5, the first coil 511 is coupled to the second helical coil 62 through the first interleaving part 81. The first coil 512 is coupled to the first helical coil 61 through the second interleaving portion 82. The first spiral coil 61 is coupled to the second coil 522 through the first connection member 71. The second coil 522 is coupled to the second helical coil 62 through the second connection element 72. The first interleaving parts 11 and 82 are interleaved with the first and second connectors 71 and 72, respectively.
In some embodiments, the figure-of-eight inductor structure 50, the first interleaving portion 81, the second interleaving portion 82, the first spiral coil 61, and the second spiral coil 62 are located on the first layer. The first connection member 71 and the second connection member 72 are located at the second layer. The first layer is different from the second layer.
As shown in fig. 5, the first coils 511 and 512 and the second coils 521 and 522 form a mirror (mirror) relationship based on an imaginary line R3. The first helical coil 21 and the second helical coil 22 are in a mirror-like relationship based on the virtual line R3.
Fig. 6 is a schematic diagram showing experimental data of an inductance device according to an embodiment of the present disclosure. As shown in fig. 6, with the present architecture configuration, the experimental curve of the Q factor is Q, and the experimental curve of the inductance value is L, wherein the values of the curve L (i.e., the inductance value nH) share the values of the curve Q (i.e., the quality factor, as shown by the Y-axis values on the left side of fig. 6). As can be seen from fig. 6, the inductance device using the present invention has a better inductance per unit area. For example, the inductance of the inductor device is about 1.11 at a frequency of 7GHz as shown by curve L and the quality factor is about 17.85 as shown by curve Q in an area of 12um x 8um or 14um x 8 um. Further, as shown by the curve L, the inductance value is about 1.14nH at the frequency of 8GHz, and as shown by the curve Q, the quality factor can reach about 17.77.
As can be seen from the above-described embodiments, capacitance values are generated between the splayed inductor structure and the spiral coil, for example, between the first coil 111 and the left side of the first spiral coil 21 and between the second coil 121 and the left side of the second spiral coil 22 in fig. 1. The inductive device of the present disclosure has a symmetrical structure, with coupling occurring on the left and right sides and the top and bottom sides (if any) of the inductive device. Therefore, the inductance device can have a better inductance value per unit area.
The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they can readily use the foregoing as a basis for designing or modifying other changes in order to carry out the same purposes and/or achieve the same advantages of the embodiments introduced herein without departing from the spirit and scope of the present disclosure. The above description should be understood as an example of the present application, and the protection scope should be subject to the claims.