CN114173022B - Photosensitive assembly with heat dissipation element and preparation method thereof - Google Patents
Photosensitive assembly with heat dissipation element and preparation method thereof Download PDFInfo
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- CN114173022B CN114173022B CN202010948331.3A CN202010948331A CN114173022B CN 114173022 B CN114173022 B CN 114173022B CN 202010948331 A CN202010948331 A CN 202010948331A CN 114173022 B CN114173022 B CN 114173022B
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Studio Devices (AREA)
Abstract
The application provides a photosensitive assembly with a heat dissipation element, which comprises: the device comprises a circuit board, a photosensitive chip, a packaging body and at least one heat dissipation piece. The circuit board is provided with a first surface and a second surface which are opposite; the photosensitive chip is arranged on the first surface and comprises a substrate connected with the first surface, and a photosensitive area and a non-photosensitive area which are opposite to the substrate; the packaging body is arranged around the photosensitive chip on the first surface and provided with an outer side wall; and the heat dissipation piece is arranged in the packaging body, one end of the heat dissipation piece is contacted with the non-photosensitive area, and the other end of the heat dissipation piece extends to the outer side wall or is exposed outside the outer side wall. The photosensitive component provided by the application can effectively guide out the heat generated in the operation of the photosensitive component in a heat conduction and heat radiation mode through the heat radiation piece which is in direct contact with the heating source, so that the imaging quality of the camera module is improved.
Description
Technical Field
The present application relates to the technical field of optical devices, and more particularly, to a photosensitive assembly having a heat dissipation element, a method for manufacturing the photosensitive assembly having the heat dissipation element, and an image pickup module including the photosensitive assembly.
Background
The photosensitive pixels of the camera module are up to 4000 ten thousand or more, and the area of the photosensitive chip is also enlarged. Therefore, when the high-pixel camera module works, the power of the photosensitive assembly is also increased quickly, and the heat generated by the photosensitive assembly is also increased.
In the existing high-pixel camera module, the internal temperature of the photosensitive assembly rises very fast, but the heat cannot be effectively dissipated, so that a circuit board, a photosensitive chip and other electronic components in the photosensitive assembly deform, the working performance of the photosensitive chip and the electronic components is also affected and reduced, and the imaging quality of the high-pixel camera module is reduced.
Disclosure of Invention
The present application provides a photosensitive assembly, a method of manufacturing the same, and an image capturing module including the photosensitive assembly that at least partially solves or solves at least one of the above-mentioned drawbacks of the prior art.
In one aspect, the present application provides a photosensitive assembly, wherein the photosensitive assembly comprises: a circuit board having a first surface and a second surface opposite to each other; the photosensitive chip is arranged on the first surface and comprises a substrate connected with the first surface, and a photosensitive area and a non-photosensitive area which are opposite to the substrate; a package disposed around the photosensitive chip on the first surface, the package having an outer sidewall; and at least one heat dissipation piece is arranged in the package body, one end of the heat dissipation piece is contacted with the non-photosensitive area, and the other end of the heat dissipation piece extends to the outer side wall or is exposed out of the outer side wall.
According to the embodiment of the application, the non-photosensitive area is provided with a plurality of first welding spots, and at least one part of the plurality of first welding spots is connected with one end of the heat dissipation piece.
According to the embodiment of the application, the first welding point connected with one end of the heat dissipation element in the plurality of first welding points is a welding point with ground connection or a welding point not participating in signal transmission.
According to an embodiment of the present application, one end of the heat sink is adhered to the non-photosensitive area.
According to the embodiment of the application, the non-photosensitive area is connected with the circuit board through the electric connecting piece, and the electric connecting piece and the heat dissipation piece are arranged at intervals inside the packaging body.
According to an embodiment of the application, the heat sink is made of a heat conductive material.
According to an embodiment of the present application, the thermal conductivity λ of the heat sink satisfies: lambda is more than or equal to 50W/(m.k).
According to an embodiment of the application, the heat sink is a wire.
According to an embodiment of the present application, the non-photosensitive region is disposed around the photosensitive region, the photosensitive chip has a plurality of sides connecting the substrate and the non-photosensitive region, the plurality of sides have an opposite side to an inside of the package, and the heat sink is disposed inside the package opposite to the at least one side.
According to an embodiment of the present application, the photosensitive assembly further includes: the second heat dissipation piece is arranged in the packaging body, one end of the second heat dissipation piece is contacted with the circuit board, and the other end of the second heat dissipation piece extends to the outer side wall or is exposed out of the outer side wall.
According to the embodiment of the application, the circuit board is provided with a plurality of second welding spots, and at least one part of the second welding spots is connected with one end of the second heat dissipation piece.
According to an embodiment of the present application, the second solder joint connected to one end of the second heat sink among the plurality of second solder joints is a solder joint having a ground connection or a solder joint not participating in signal transmission.
According to the embodiment of the application, the electric connector and the second heat dissipation element are arranged at intervals inside the package body.
According to an embodiment of the present application, the photosensitive assembly further includes: and the heat dissipation plate is arranged on the second surface of the circuit board, wherein the first surface is provided with a groove for accommodating the photosensitive chip, so that the photosensitive chip is attached to the heat dissipation plate.
In another aspect, the present application further provides a camera module, including: the photosensitive component; and the lens assembly is arranged above the photosensitive assembly.
In still another aspect, the present application provides a method for preparing a photosensitive assembly, including preparing a circuit board assembly including a plurality of circuit boards, wherein the method includes: the photosensitive chips corresponding to the circuit boards are respectively arranged on the first surfaces of the circuit boards, and the photosensitive chips are connected with the circuit boards through electric connectors; a plurality of heat dissipation parts are arranged in the circuit jointed board, wherein one end of each heat dissipation part is arranged on the photosensitive chip, and the other end of each heat dissipation part is arranged on the photosensitive chip adjacent to the photosensitive chip; placing the circuit jointed board provided with the heat dissipation piece in a packaging mould; filling a material for preparing the packaging body into the packaging mould so as to form the packaging body corresponding to each circuit board by curing; and cutting the cured circuit jointed board to obtain a plurality of photosensitive components.
According to an embodiment of the present application, the photosensitive chip includes a photosensitive area and a non-photosensitive area away from the first surface, and connecting the photosensitive chip to each of the circuit boards through an electrical connection includes: a plurality of welding spots are arranged in the non-photosensitive area; and connecting the welding spots of the photosensitive chip with each circuit board through an electric connecting piece.
According to an embodiment of the present application, disposing one end of each of the heat dissipation elements to the photosensitive chip includes: connecting one end of each heat dissipation piece with the welding point of the non-photosensitive area; and spacing the electrical connection member from the heat sink.
According to an embodiment of the present application, disposing one end of each of the heat dissipation elements to the photosensitive chip includes: bonding one end of each heat dissipation element to the non-photosensitive area; and spacing the electrical connection member from the heat sink.
According to an embodiment of the present application, disposing the other end of each of the heat dissipation members on a photosensitive chip adjacent to the photosensitive chip includes: connecting the other end of each heat dissipation piece with the welding point of the adjacent photosensitive chip; and arranging an electric connecting piece connected with the adjacent photosensitive chip at intervals with the heat dissipation piece.
According to an embodiment of the present application, disposing the other end of each of the heat dissipation members on a photosensitive chip adjacent to the photosensitive chip includes: bonding the other end of each heat dissipation piece to a non-photosensitive area of the adjacent photosensitive chip; and arranging an electric connecting piece connected with the adjacent photosensitive chip at intervals with the heat dissipation piece.
The present application also provides a method for preparing a photosensitive assembly, the method comprising: the photosensitive chips corresponding to the circuit boards are respectively arranged on the first surfaces of the circuit boards, and the photosensitive chips are connected with the circuit boards through electric connectors; a plurality of heat dissipation parts are arranged in the circuit jointed board, wherein one end of each heat dissipation part is arranged on the photosensitive chip, and the other end of each heat dissipation part is arranged on the photosensitive chip adjacent to the photosensitive chip; a plurality of heat dissipation parts are arranged in the photosensitive chips at the outermost sides of the circuit jointed boards, wherein one end of each heat dissipation part is arranged on the photosensitive chip at the outermost sides, and the other end of each heat dissipation part is arranged on a circuit board corresponding to the photosensitive chip at the outermost sides; placing the circuit jointed board provided with the heat dissipation piece in a packaging mould; filling a material for preparing the packaging body into the packaging mould so as to form the packaging body corresponding to each circuit board by curing; and cutting the cured circuit jointed board to obtain a plurality of photosensitive components.
According to an embodiment of the present application, the photosensitive chip includes a photosensitive area and a non-photosensitive area far from the first surface, and connecting the photosensitive chip to each of the circuit boards through an electrical connector includes: a plurality of welding spots are arranged in the non-photosensitive area; and connecting the welding spots of the photosensitive chip with each circuit board through an electric connecting piece.
According to an embodiment of the present application, disposing one end of each of the heat dissipation elements to the outermost photosensitive chip includes: connecting one end of each heat dissipation piece with the welding point of the outermost photosensitive chip; and arranging an electric connecting piece connected with the outermost photosensitive chip at intervals with the heat dissipation piece.
According to an embodiment of the present application, disposing one end of each of the heat dissipation elements to the outermost photosensitive chip includes: bonding one end of each heat dissipation piece to a non-photosensitive area of the outermost photosensitive chip; and arranging an electric connecting piece connected with the outermost photosensitive chip at intervals with the heat dissipation piece.
According to an embodiment of the present application, a circuit board for disposing the other end of each heat sink in correspondence with the outermost photosensitive chip includes: connecting the other end of each heat dissipation piece with the welding point of the corresponding circuit board; and arranging an electric connecting piece connected with the outermost photosensitive chip at intervals with the heat dissipation piece.
Still another aspect of the present application provides a photosensitive assembly, including: a circuit board having a first surface and a second surface opposite to each other; the photosensitive chip is attached to the first surface; a package disposed around the photosensitive chip on the first surface, the package having an outer sidewall; and at least one heat dissipation piece is arranged in the package body, one end of the heat dissipation piece contacts the first surface, and the other end of the heat dissipation piece extends to the outer side wall or is exposed out of the outer side wall.
According to the at least one scheme of the photosensitive assembly, the preparation method and the camera module provided by the application, at least one of the following beneficial effects can be achieved:
1. the application provides a photosensitive assembly with a heat dissipation part, wherein the heat dissipation part which is in direct contact with a heating source is arranged in the photosensitive assembly, so that heat generated in the operation of the photosensitive assembly is effectively conducted out in a heat conduction and heat radiation mode, and the imaging quality of a camera module is improved.
2. The application provides a camera module comprising a photosensitive assembly with a heat dissipation piece, which can effectively solve the problem of heat dissipation in the work of a high-pixel camera module by improving the heat dissipation capacity of a photosensitive chip in the photosensitive assembly, the heat dissipation capacity of a packaging body and the heat dissipation capacity of a circuit board.
3. The application provides various methods for efficiently preparing a photosensitive assembly with a heat sink.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the accompanying drawings in which:
FIG. 1 is a schematic cross-sectional view of a photosensitive assembly with a heat sink according to an embodiment of the present application;
FIG. 2 is a top view of a photosensitive assembly with a heat sink according to one embodiment of the present application;
FIG. 3 is a schematic diagram of a conventional photosensitive assembly with a heat dissipation structure;
FIG. 4 is a schematic cross-sectional view of a photosensitive assembly with a second heat sink according to another embodiment of the present application;
FIG. 5 is a schematic cross-sectional view of a photosensitive assembly having a heat sink and a second heat sink according to another embodiment of the present application;
FIG. 6 is a schematic cross-sectional view of a photosensitive assembly with a heat sink according to another embodiment of the present application;
Fig. 7 is a schematic cross-sectional view of an image capturing module with heat dissipation according to an embodiment of the present application;
FIG. 8 is a flow chart of a process for preparing a photosensitive assembly having a heat sink according to an embodiment of the present application;
Fig. 9A to 9E are schematic views illustrating a manufacturing process of a photosensitive assembly having a heat sink according to an embodiment of the present application;
FIG. 10 is a flow chart of a process for preparing a photosensitive assembly having a heat sink according to another embodiment of the present application; and
Fig. 11A to 11E are schematic views illustrating a manufacturing process of a photosensitive assembly with a heat sink according to another embodiment of the present application.
Detailed Description
For a better understanding of the application, various aspects of the application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the application and is not intended to limit the scope of the application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.
It should be noted that in the present specification, the expressions of first, second, third, etc. are only used to distinguish one feature from another feature, and do not represent any limitation on the feature. Accordingly, a first surface discussed below may also be referred to as a second surface without departing from the teachings of the present application. And vice versa.
In the drawings, the thickness, size, and shape of the components have been slightly adjusted for convenience of description. The figures are merely examples and are not drawn to scale. As used herein, the terms "about," "approximately," and the like are used as terms of a table approximation, not as terms of a table degree, and are intended to account for inherent deviations in measured or calculated values that will be recognized by one of ordinary skill in the art.
It will be further understood that terms such as "comprises," "comprising," "includes," "including," "having," "containing," "includes" and/or "including" are open-ended, rather than closed-ended, terms that specify the presence of the stated features, elements, and/or components, but do not preclude the presence or addition of one or more other features, elements, components, and/or groups thereof. Furthermore, when a statement such as "at least one of the following" appears after a list of features listed, it modifies the entire list of features rather than just modifying the individual elements in the list. Furthermore, when describing embodiments of the application, use of "may" means "one or more embodiments of the application. Also, the term "exemplary" is intended to refer to an example or illustration.
Unless otherwise defined, all terms (including engineering and technical terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application pertains. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. In addition, unless explicitly defined or contradicted by context, specific steps included in the imaging module described in the present application are not necessarily limited to the order described, and may be executed in any order or in parallel. The application will be described in detail below with reference to the drawings in connection with embodiments.
Fig. 1 is a schematic cross-sectional view of a photosensitive assembly 1000 having a heat sink 400 according to an embodiment of the present application. Fig. 2 is a top view of a photosensitive assembly 1000 having a heat sink 400 according to an embodiment of the present application.
As shown in fig. 1, the photosensitive assembly 1000 provided by the present application includes: the light-sensitive chip comprises a circuit board 100, a light-sensitive chip 200, a package 300 and a heat sink 400.
In this embodiment, the circuit board 100 includes a first surface 110 and a second surface 120 opposite to each other. The circuit board 100 may alternatively be made of any of a variety of materials such as a flexible printed circuit board RG (Rigid Flex), a flexible printed circuit board FPC (Flex Print Circuit), a rigid printed circuit board PCB (Printed Circuit Board), and a ceramic substrate (without a flexible board).
The photosensitive chip 200 may be disposed on the first surface 110 of the circuit board 100 by, for example, bonding or soldering, and the photosensitive chip 200 includes a substrate 210, a photosensitive region 220, a non-photosensitive region 230, and a side 240. The substrate 210 is typically made of a semiconductor material such as silicon, and may be connected to the first surface 110 of the circuit board 100. The photosensitive region 220 and the non-photosensitive region 230 are located on a surface opposite to the substrate 210, in other words, the photosensitive region 220 and the non-photosensitive region 230 may be disposed away from the first surface 110 of the circuit board 100, wherein the non-photosensitive region 230 may be disposed around a periphery of the photosensitive region 220. The connection substrate 210 and the non-photosensitive region 230 may form a plurality of sides 240 of the photosensitive chip 200.
The non-photosensitive region 230 is a logic circuit region for transmitting the electrical signal after photoelectric conversion of the photosensitive region 220 to the circuit board 100. Both the non-photosensitive region 230 and the circuit board 100 generate a relatively large amount of heat during operation.
The package 300 may be formed, for example, by mold curing, for example, using nylon, LCP (Liquid Crystal Polymer ), PP (Polypropylene), epoxy, and other thermoplastic or thermosetting materials. The package 300 may be disposed around the photosensitive chip 200 on the first surface 110 of the circuit board 100. The package 300 may form a hollow structure with two open ends, and the hollow structure may form a light passing hole of the photosensitive chip 200, that is, the hollow structure may be disposed opposite to the photosensitive region 220 of the photosensitive chip 200, so that light may reach the photosensitive chip 200 through the hollow structure.
The package 300 has opposite inner and outer sidewalls 310 and 320, the inner sidewall 310 is connected to the non-photosensitive region 230 of the photosensitive chip 200, and the region of the photosensitive region 220 and the non-photosensitive region 230 extending outward to the inner sidewall 310 centered on the optical axis (not shown) of the photosensitive assembly 1000 is defined as a hollow structure.
Further, the photosensitive assembly 1000 also includes electronic components (not shown). The electronic components are generally disposed on the circuit board 100 for completing the transmission of the electrical signals. The electronic components may be, for example, resistors, capacitors, driving elements, signal processing elements, memory elements, etc. In an embodiment of the present application, the package 300 may include the above-described electronic components.
The package body 300 integrally encapsulates the sidewall 240 of the photosensitive chip 200, a portion of the non-photosensitive region 230, the electronic component, and the first surface 110 of the circuit board 100, so as to prevent the components from being exposed to external contamination dust and affecting the imaging quality of the camera module; in addition, the integrally packaged structure can also provide supporting and fixing functions for the photosensitive chip 200 and the circuit board 100, so that the structural strength of the circuit board 100 and the photosensitive chip 200 is enhanced, and further, the size of the camera module can be reduced.
The heat sink 400 is made of a heat conductive material, such as various metal materials having high heat conductivity. In the embodiment of the present application, the thermal conductivity λ of the heat sink 400 satisfies λ+.50w/(m·k). Further, considering that the higher the thermal conductivity of the heat sink 400 is, the better, the material of which the thermal conductivity λ is equal to or greater than 100W/(m·k) can be selected to prepare the heat sink 400. The heat sink 400 may be a metal wire having one end contacting one of the non-photosensitive regions 230 of the heat source of the photosensitive assembly 1000 and the other end extending to the outer sidewall 320 or being exposed outside the outer sidewall 320.
The length L of the heat dissipation element 400 satisfies that L is more than or equal to 1mm, and the longer heat dissipation length can improve the heat dissipation capacity of the heat dissipation element 400.
Other structures such as metal strips, metal blocks, etc. may be selected for the heat sink 400, and the present application is not limited thereto, as those skilled in the art will appreciate that the materials and shape structures of the heat sink may be modified to achieve the various results and advantages described herein without departing from the scope of the present application as claimed.
The heat sink 400 is covered by the package 300, in other words, the heat sink 400 is disposed inside the package 300. The package 300 can play a role of supporting the heat sink 400, and in addition, the heat sink 400 is inserted into the package 300, which is beneficial to increasing the heat dissipation capability of the package 300, and the effective heat dissipation area of the photosensitive assembly 1000 can be increased through the larger surface area of the package 300.
Fig. 3 is a schematic diagram of a conventional photosensitive assembly 2000 with a heat dissipation structure.
As shown in fig. 3, in the conventional heat radiation method of the photosensitive assembly 2000, heat is generally indirectly discharged by heat radiation by mounting a heat radiation plate 2200 on the second surface 2120 of the circuit board 2100, for example. Since the substrate 2310 of the photosensitive chip 2300 is made of a semiconductor material such as silicon, the thermal conductivity is generally 10W/(m·k) or less, and the thickness of the substrate 2310 is generally 80 μm to 150 μm, the substrate 2310 of the photosensitive chip 2300 has poor heat conductivity, which blocks a portion of heat transfer. In the prior art, when the camera module works, the heat generated by the photosensitive chip 2300 is large, and only a part of the generated heat can be led out from the radiating plate below, and the other part of the generated heat is still remained in the camera module, and the remained too high temperature can cause adverse effects on other components of the camera module, such as deformation of the components, and each deformed component can affect the performance of the photosensitive chip 2300 and the shooting effect of the camera module.
Referring again to fig. 1, in the embodiment of the present application, the heat sink 400 is in direct contact with the main heat-generating source non-photosensitive region 230 of the photosensitive chip 200, and the heat sink 400 is disposed in the package 300, effectively increasing the heat-dissipating area thereof through a larger surface area of the package 300, and effectively guiding out heat by means of heat conduction and heat radiation. Further, a plurality of heat dissipation members 400 may be further disposed in the photo-sensing chip 200, and the plurality of heat dissipation members 400 may be uniformly disposed in the package 300 opposite to the plurality of sidewalls 240 of the photo-sensing chip 200, i.e., the plurality of heat dissipation members 400 may be effectively in direct contact with the non-photo-sensing regions 230 located at different sides of the photo-sensing chip 200, and effectively conduct heat by means of heat conduction and heat radiation.
Further, the photosensitive assembly 1000 further includes an electrical connector 500. In one embodiment of the present application, the non-photosensitive region 230 may be electrically connected to the circuit board 100 through, for example, a wire bonding process, to achieve electrical connection therebetween. The wire bonding process can be selected from gold wires, silver wires, copper wires and the like. The electrical connector 500 is used for conducting the circuit board 100 and the non-photosensitive region 230.
Referring again to fig. 2, in one embodiment of the present application, the non-photosensitive region 230 may include a plurality of first welding spots, such as welding spot 231 and welding spot 232. The circuit board 100 may also include a plurality of second solder joints, such as solder joint 111. The electrical connector 500 may be connected to, for example, the solder joint 231 at one end of the non-photosensitive region 230, and the other end of the electrical connector 500 may be connected to, for example, the solder joint 111 of the circuit board 100. The package 300 encapsulates the electrical connector 500, and the electrical connector 500 may be an electrical lead or an electrical solder ball.
Among the plurality of first pads of the non-photosensitive region 230, the pad 232 is a pad having a ground connection or a pad not participating in transmission of an electrical signal. In one embodiment of the present application, to prevent the leakage problem of the photosensitive assembly 1000, the end of the heat sink 400 contacting the non-photosensitive area 230 may be selectively connected to the non-photosensitive area 230 by a welding point having a ground connection or a welding point not participating in the transmission of an electrical signal, such as the welding point 232; the other end of the heat sink 400 may extend to the outer sidewall 320 of the package body 300 or be exposed outside the outer sidewall 320. Therefore, the heat generated by the non-photosensitive region 230 can be conducted to the heat sink 400 through the solder joint, so as to conduct the heat out of the camera module.
Further, in one embodiment of the present application, the non-photosensitive region 230 may have a larger surface area than the solder joint with the ground connection or the solder joint not participating in the transmission of the electrical signal, for example, the surface area of the solder joint 232 may be larger than the surface area of the solder joint 231, and a plurality of heat dissipation elements 400 may be connected at the same time.
Alternatively, in one embodiment of the present application, the heat sink 400 may be connected to the non-photosensitive region 230 by other contact means, such as bonding, to facilitate and effectively conduct heat generated by the non-photosensitive region 230. Further, the heat sink 400 in the embodiment of the present application may also directly contact the side of the photo-sensing chip 200, so that heat dissipation may be achieved with the size of the non-photo-sensing region 230 being small. That is, when the non-photosensitive region 230 is smaller, for example, no more first pads for contacting the heat sink 400 can be provided, the heat sink 400 can be directly contacted to the side of the photosensitive chip 200.
Further, in one embodiment of the present application, the first solder joint, such as solder joint 231, of the photo-sensing chip 200 for connecting with the circuit board 100 may be disposed on the side of the substrate 210 without the photo-sensing area 220, and electrically connected directly with the circuit board 100 through a process such as gold-plating ball; and the first solder joint, such as solder joint 232, of the photosensitive chip 200, which is in contact with or fixed to the heat sink 400, is disposed in the non-photosensitive region 230. Alternatively, the heat sink 400 may also be directly contacted or fixed to the sidewall 240 of the photo-sensing chip 200, so that only the photo-sensing region 220 is required to be disposed on the substrate 210 of the photo-sensing chip 200 to effectively control the size of the photo-sensing chip 200.
In one embodiment of the present application, the heat sink 400 and the electrical connector 500 are simultaneously covered by the package 300, that is, the heat sink 400 and the electrical connector 500 are disposed at intervals inside the package 300. The heat dissipation elements 400 can be isolated from the electric connection elements 500 in a spaced mode, so that the occurrence of crosstalk, electric leakage, short circuit and the like of electric signals is avoided; on the other hand, the heat dissipation element 400 is inserted inside the package body, so as to increase the heat dissipation capability of the package body 300, and increase the effective heat dissipation area of the photosensitive assembly 1000 through the larger surface area of the package body 300.
Fig. 4 is a schematic cross-sectional view of a photosensitive assembly 1000 having a second heat sink 600 according to another embodiment of the present application. Fig. 5 is a schematic cross-sectional view of a photosensitive assembly 1000 having a heat sink 400 and a second heat sink 600 according to another embodiment of the present application.
As shown in fig. 4, in an embodiment of the present application, the photosensitive assembly 1000 may further include a second heat sink 600. Likewise, the second heat sink 600 is made of a heat conductive material, such as various metal materials having high heat conductivity. In the embodiment of the present application, the thermal conductivity λ of the second heat sink 600 satisfies λ+.50w/(m·k). Further, considering that the higher the thermal conductivity of the second heat sink 600 is, the better, the material of which the thermal conductivity λ is equal to or greater than 100W/(m·k) may be selected to prepare the second heat sink 600. The heat sink 600 may be a wire or other structure, such as a metal strip, a metal block, etc., and the present application is not limited thereto, and those skilled in the art will appreciate that the materials and shape of the heat sink may be modified to achieve the various results and advantages described herein without departing from the scope of the application as claimed.
The length L of the second heat dissipation element 600 satisfies L being greater than or equal to 1mm, and the longer heat dissipation length can promote the heat dissipation capability of the second heat dissipation element 600.
In one embodiment of the present application, one end of the metal wire may contact one of the circuit boards 100 of the heat source of the photosensitive assembly 1000, and the other end of the metal wire may extend to the outer sidewall 320 or be exposed outside the outer sidewall 320.
Among the second plurality of pads of the circuit board 100, a pad connected to ground or a pad not participating in transmission of an electrical signal is also included. In one embodiment of the present application, in order to prevent the problems such as leakage of the photosensitive assembly 1000, one end of the second heat sink 600 may be selectively connected to a solder joint having a ground connection or a solder joint not participating in the transmission of electrical signals in the circuit board 100; the other end of the second heat sink 600 may extend to the outer sidewall 320 of the package body 300 or be exposed outside the outer sidewall 320.
Further, in one embodiment of the present application, the solder joint of the circuit board 100 having the ground connection or the solder joint not participating in the transmission of the electrical signal may have a larger surface area, and a plurality of second heat sinks 600 may be connected at the same time.
Likewise, the second heat sink 600 is covered by the package 300, in other words, the second heat sink 600 is disposed inside the package 300. The second heat sink 600 and the electrical connector 500 are disposed at a distance inside the package 300. The second heat dissipation element 600 can be isolated from the electrical connection element 500 by the way of interval arrangement, so as to avoid the occurrence of crosstalk, leakage, short circuit and other situations of electrical signals.
The package 300 can play a role of supporting the second heat sink 600, and in addition, the second heat sink 600 is inserted into the package 300, which is beneficial to increasing the heat dissipation capability of the package 300, and the effective heat dissipation area of the photosensitive assembly 1000 can be increased through the larger surface area of the package 300, and meanwhile, the strength of the package 300 can be enhanced due to the existence of the second heat sink 600.
As shown in fig. 5, in one embodiment of the present application, the above two heat dissipation modes may be combined, that is, the photosensitive assembly 1000 includes both the heat dissipation element 400 and the second heat dissipation element 600. In this embodiment, the photosensitive assembly increases the number of heat dissipation elements, and also increases the heat dissipation capacity of the photosensitive chip and the circuit board, thereby improving the heat dissipation capacity of the photosensitive assembly.
Fig. 6 is a schematic cross-sectional view of a photosensitive assembly 1000 having a heat sink 400 according to another embodiment of the present application.
As shown in fig. 6, in one embodiment of the present application, a heat dissipation plate 700 may be further provided in the photosensitive assembly 1000 in combination with the related art. The heat dissipation plate 700 may be disposed on the second surface 120 of the circuit board 100, and the photosensitive chip 200 may be slotted on the first surface 110 of the circuit board 100. The grooved position may correspond to a mounting position of the heat dissipation plate so that the substrate 210 of the photo-sensing chip 200 is attached to the heat dissipation plate 700. The package 300 encapsulates the photosensitive assembly 1000 by wrapping the first surface 110 of the circuit board 100, wrapping a portion of the non-photosensitive region 230 of the photosensitive chip 200, wrapping the side 240 of the photosensitive chip 200, wrapping electronic components such as a capacitor resistor, and the like, and wrapping the heat sink 400, and has a hollow structure, exposing the photosensitive region 220 of the photosensitive chip 200. In this embodiment, the photosensitive assembly 1000 includes both the heat dissipation member 400 and the heat dissipation plate 700, so that the photosensitive assembly 1000 can dissipate heat in multiple directions in multiple ways, thereby improving the heat dissipation capability.
Fig. 7 is a schematic cross-sectional view of an image capturing module with heat dissipation according to an embodiment of the present application.
As shown in fig. 7, in an embodiment of the present application, a functional camera module is further provided, and the camera module may include a photosensitive assembly 1000 with a heat sink 400, a lens assembly 3000, and a filter assembly 4000.
The lens assembly 3000 may include a lens 3100 and a lens carrier. Alternatively, the lens assembly 3000 may further include a lens 3100 and a motor 3200, where the motor 3200 is used to drive the lens 3100 to move or tilt, so as to implement functions of auto-focusing, optical anti-shake, and the like, so as to complete the shooting process of the camera module. The lens 3100 is disposed above the photosensitive chip in the photosensitive assembly 1000.
The filter assembly 4000 is used to filter infrared light. The filter assembly 4000 may be mounted on a surface of the package 300 (as shown in fig. 7), or may be mounted on a surface of the lens carrier or the motor 3200, or other suitable location, which is not limited thereto.
Fig. 8 is a flowchart of a method 5000 of manufacturing a photosensitive assembly having a heat sink 5400 according to an embodiment of the present application. As shown in fig. 8, in an embodiment of the present application, a method 5000 for manufacturing a photosensitive assembly with a heat sink is also provided. The method 5000 mainly comprises:
s5001, arranging the photosensitive chips corresponding to each circuit board on the first surface of each circuit board respectively, and connecting the photosensitive chips with each circuit board through an electric connecting piece.
In step S5001, as shown in fig. 9A, there are a plurality of, for example, 3, circuit boards 5100 on the circuit board. The photosensitive chip 5200 corresponding to each of the wiring boards 5100 may be disposed on the first surface of each of the wiring boards 5100, and each of the wiring boards 5100 and the photosensitive chip 5200 corresponding thereto may be connected through the electrical connection 5500.
Further, a plurality of first pads, for example, 5231 and 5232, are included in the non-photosensitive region of the photosensitive chip 5200, wherein one end of the electrical connector 5500 is connected to the pad 5231 in the photosensitive chip 5200 and the other end of the electrical connector 5500 is connected to the wiring board 5100 as shown in fig. 9A.
S5002, a plurality of heat dissipation parts are arranged in the circuit jointed board, one end of each heat dissipation part is arranged on the photosensitive chip, and the other end of each heat dissipation part is arranged on the photosensitive chip adjacent to the photosensitive chip.
In step S5002, the heat sink may be made of a thermally conductive material such as a metal wire and satisfies the thermal conductivity λ of the heat sink being 50W/(mK). The length L of the heat dissipation piece meets the requirement that L is more than or equal to 1mm, and the longer heat dissipation length can improve the heat dissipation capacity of the heat dissipation piece.
As shown in fig. 9B, a plurality of heat dissipation members 5400 may be provided in the circuit board, wherein one end of the heat dissipation member 5400 may be provided in the photosensitive chip 5200 and the other end of the heat dissipation member 5400 may be provided in the photosensitive chip 5200a adjacent to the photosensitive chip.
Further, the pad 5232 may be a pad with a ground connection or a pad that does not participate in signal transmission. In order to prevent occurrence of leakage or the like, as shown in fig. 9B, one end of the heat sink 5400 is connected to the pad 5232, and the other end of the heat sink 5400 is connected to a pad connected to the ground in the adjacent photo-sensing chip 5200a or a pad 5232a not participating in signal transmission in the same manner.
Alternatively, the heat sink 5400 and the photosensitive chip 5200 may be connected by bonding, and the connection method of the heat sink and the photosensitive chip is not limited in the present application.
And repeating the steps to set a plurality of heat dissipation elements in the circuit jointed board. And a plurality of heat dissipation elements and electric connection elements are arranged at intervals, so that the problems of electric leakage, short circuit, crosstalk and the like caused by contact of the heat dissipation elements and the electric connection elements in the finally formed photosensitive assembly are prevented.
S5003, splicing and placing the circuit board provided with the heat dissipation piece in a packaging mold.
In step S5003, as shown in fig. 9C, the packaging mold includes an upper mold 5010 and a lower mold 5020, and the wiring board provided with the heat sink is placed in the packaging mold composed of the upper mold 5010 and the lower mold 5020.
S5004, filling the material for preparing the package into a packaging mold to cure and form the package corresponding to each circuit board.
In step S5004, the package is integrally molded by passing a package mold as shown in fig. 9D, optionally with, for example, nylon, LCP (Liquid Crystal Polymer ), PP (Polypropylene), epoxy, and other thermoplastic or thermosetting materials, and by, for example, curing.
In step S5004, the encapsulating material is filled in the encapsulating mold, which may generate a large impact force on the circuit board disposed in the encapsulating mold, so that at least one of the electrical connector 5500 and the heat sink 5400 on the circuit board may be deformed. Under the existing process conditions, the electrical connector 5500 can deform less or not under the impact of the packaging material, and the heat sink 5400 needs to further improve the impact resistance and the deformation resistance thereof, so as not to cause at least one of the electrical connector 5500 and the heat sink 5400 to deform due to the deformation of the heat sink 5400 in this step, thereby affecting the imaging quality of the camera module.
Based on the above problems, the present application is studied on the strength of the heat dissipation element to ensure that the strength of the heat dissipation element meets the requirements. The research finds that: when the strength of the material from which the heat sink is made is close to or similar to the strength of the material from which the electrical connector is made, if the cross-sectional area of the heat sink is greater than the cross-sectional area of the electrical connector, the strength of the heat sink is greater than the strength of the electrical connector.
Furthermore, the strength of the packaging body can be improved by selecting a material with higher strength to prepare the heat dissipation piece. The strength of the heat sink and the electrical connector or the strength of the material from which they are made in the present application is understood to be its ability to resist the impact of the encapsulating material.
S5005, cutting the cured circuit jointed board to obtain a plurality of photosensitive components.
In step S5005, as shown in fig. 9E, the circuit board may be cut along the dotted line to obtain a plurality of, for example, 3 photosensitive elements with heat dissipation elements.
Fig. 10 is a flowchart of a method 6000 for manufacturing a photosensitive assembly having heat sinks 6400 and 6600, according to another embodiment of the application. As shown in fig. 10, in an embodiment of the present application, a method 6000 for manufacturing a photosensitive assembly with a heat sink is also provided. The method 6000 mainly comprises the following steps:
S6001, arranging the photosensitive chips corresponding to each circuit board on the first surface of each circuit board respectively, and connecting the photosensitive chips with each circuit board through an electric connecting piece.
In step S6001, as shown in fig. 11A, the circuit board has a plurality of, for example, 3 circuit boards 6100 thereon. The photosensitive chip 6200 corresponding to each wiring board 6100 may be disposed on the first surface of each wiring board 6100, and each wiring board 6100 and the photosensitive chip 6200 corresponding thereto may be connected by an electrical connector 6500.
Further, the non-photosensitive region of the photosensitive chip 6200 includes a plurality of first pads, for example 6231 and 6232, wherein, as shown in fig. 11A, one end of the electrical connector 6500 in the photosensitive chip 6200 is connected to the pad 6231, and the other end of the electrical connector 6500 is connected to the circuit board 6100.
S6002, a plurality of heat dissipation parts are arranged in the circuit jointed board, one end of each heat dissipation part is arranged on the photosensitive chip, and the other end of each heat dissipation part is arranged on the photosensitive chip adjacent to the photosensitive chip.
In step S6002, the heat sink may be made of a thermally conductive material such as a metal wire, and satisfies the thermal conductivity λ of the heat sink being 50W/(mK). The length L of the heat dissipation piece meets the requirement that L is more than or equal to 1mm, and the longer heat dissipation length can improve the heat dissipation capacity of the heat dissipation piece.
As shown in fig. 11B, a plurality of heat sinks 6400 may be provided in a circuit board, wherein one end of heat sink 6400 may be provided in photo-sensing chip 6200 and the other end of heat sink 6400 may be provided in photo-sensing chip 6200a adjacent to the photo-sensing chip.
Further, the pad 6232 may be a pad having a ground connection or a pad that does not participate in signal transmission. To prevent leakage or the like, as shown in fig. 11B, one end of heat sink 6400 is connected to pad 6232, and the other end of heat sink 6400 is connected to a pad connected to ground in adjacent photo-sensing chip 6200a or pad 6232a not participating in signal transmission in the same manner.
Alternatively, the heat sink 6400 and the photosensitive chip 6200 may be connected by bonding, and the connection method of the heat sink and the photosensitive chip is not limited in the present application.
And repeating the steps to set a plurality of heat dissipation elements in the circuit jointed board. And a plurality of heat dissipation elements and electric connection elements are arranged at intervals, so that the problems of electric leakage, short circuit, crosstalk and the like caused by contact of the heat dissipation elements and the electric connection elements in the finally formed photosensitive assembly are prevented.
S6003, arranging a plurality of heat dissipation parts in the outermost photosensitive chips of the circuit jointed boards, wherein one end of each heat dissipation part is arranged on the outermost photosensitive chip, and the other end of each heat dissipation part is arranged on the circuit board corresponding to the outermost photosensitive chip.
In step S6003, as shown in fig. 11B, the photo-sensing chip 6200B is disposed at the outermost side of the circuit board, and in order to make the finally obtained photo-sensing component located at the outermost side of the circuit board have more heat dissipation elements, a second heat dissipation element 6600 is further disposed at the photo-sensing chip 6200B. The second heat sink may be made of a heat conductive material such as a metal wire, and satisfies the thermal conductivity λ of the second heat sink being 50W/(m·k). The length L of the second heat dissipation part meets L being more than or equal to 1mm, and the longer heat dissipation length can improve the heat dissipation capacity of the second heat dissipation part.
As shown in fig. 11B, a plurality of second heat dissipation members 6600 may be provided in the photosensitive chip 6200B, wherein one end of the second heat dissipation member 6600 may be provided in the photosensitive chip 6200B, and the other end of the second heat dissipation member 6600 may be provided in the circuit board 6100B opposite to the photosensitive chip.
Further, the pad 6232b may be a pad having a ground connection or a pad that does not participate in signal transmission. In order to prevent occurrence of leakage or the like, as shown in fig. 11B, one end of the second heat sink 6600 is connected to the pad 6232B, and the other end of the second heat sink 6600 is connected to a pad connected to the ground in the wiring board 6100B or a pad not participating in signal transmission in the same manner.
Alternatively, the second heat dissipation element 6600 and the photosensitive chip 6200 may be connected by bonding, and the connection method of the heat dissipation element and the photosensitive chip is not limited in the present application.
And repeating the steps to set a plurality of second heat dissipation parts in the photosensitive chip at the outermost side of the circuit jointed board. And a plurality of second heat dissipation elements and electric connection elements are arranged at intervals, so that the problems of electric leakage, short circuit, crosstalk and the like caused by contact of the second heat dissipation elements and the electric connection elements in the finally formed photosensitive assembly are prevented.
S6004, placing the circuit jointed board provided with the heat dissipation piece in a packaging mold.
In step S6004, as shown in fig. 11C, the package mold includes an upper mold 6010 and a lower mold 6020, and the wiring board provided with the heat sink is placed in the package mold composed of the upper mold 6010 and the lower mold 6020.
S6005, filling the material for preparing the package into the package mold to cure and form the package corresponding to each wiring board.
In step S6005, the package may be integrally molded by passing a package mold as shown in fig. 9D, for example, with nylon, LCP (Liquid Crystal Polymer ), PP (Polypropylene), epoxy, and other thermoplastic or thermosetting materials, and by curing, for example.
S6006, cutting the cured circuit jointed board to obtain a plurality of photosensitive assemblies.
In step S6006, as shown in fig. 11E, the circuit board may be cut along the dotted line to obtain a plurality of, for example, 3 photosensitive elements with heat dissipation elements.
The above description is only illustrative of the embodiments of the application and of the technical principles applied. It will be appreciated by those skilled in the art that the scope of the application is not limited to the specific combination of the above technical features, but also encompasses other technical solutions which may be formed by any combination of the above technical features or their equivalents without departing from the technical concept. Such as the above-mentioned features and the technical features disclosed in the present application (but not limited to) having similar functions are replaced with each other.
Claims (25)
1. A photosensitive assembly, comprising:
a circuit board having a first surface and a second surface opposite to each other;
The photosensitive chip is arranged on the first surface and comprises a substrate connected with the first surface, and a photosensitive area and a non-photosensitive area which are opposite to the substrate;
a package disposed around the photosensitive chip on the first surface, the package having an outer sidewall; and
At least one first heat dissipation piece inserted into the package body to dissipate heat through the surface of the package body, wherein one end of the first heat dissipation piece contacts the non-photosensitive area, and the other end of the first heat dissipation piece extends to the outer side wall or is exposed outside the outer side wall;
The non-photosensitive area surrounds the photosensitive area, the photosensitive chip is provided with a plurality of side surfaces which are connected with the substrate and the non-photosensitive area, the side surfaces are opposite to the inside of the packaging body, and the first heat dissipation piece is arranged inside the packaging body opposite to at least one side surface.
2. The photosensitive assembly of claim 1, wherein the non-photosensitive region has a plurality of first solder joints, at least a portion of the plurality of first solder joints being coupled to one end of the first heat sink.
3. The photosensitive assembly of claim 2, wherein a first solder joint of the plurality of first solder joints connecting one end of the first heat sink is a solder joint having a ground connection or a solder joint not participating in signal transmission.
4. The photosensitive assembly of claim 1, wherein one end of the first heat sink member is bonded to the non-photosensitive region.
5. The photosensitive assembly of claim 2 or 4, wherein the non-photosensitive region is connected to the circuit board by an electrical connector spaced apart from the first heat sink within the package.
6. The photosensitive assembly of claim 1, wherein the first heat sink is made of a thermally conductive material.
7. The photosensitive assembly of claim 6, wherein the thermal conductivity λ of the first heat sink satisfies: lambda is more than or equal to 50W/(m.k).
8. The photosensitive assembly of claim 6 or 7, wherein the first heat sink is a wire.
9. The photosensitive assembly according to claim 1, characterized in that the photosensitive assembly further comprises:
The second heat dissipation piece is inserted into the package body to dissipate heat through the surface of the package body, one end of the second heat dissipation piece is contacted with the circuit board, and the other end of the second heat dissipation piece extends to the outer side wall or is exposed out of the outer side wall.
10. The photosensitive assembly of claim 9, wherein the circuit board has a plurality of second solder joints, at least a portion of the plurality of second solder joints being connected to one end of the second heat sink.
11. The photosensitive assembly of claim 10, wherein a second solder joint of the plurality of second solder joints connecting one end of the second heat sink is a solder joint having a ground connection or a solder joint not participating in signal transmission.
12. The photosensitive assembly of claim 10 or 11, wherein the non-photosensitive region is connected to the circuit board by an electrical connector spaced apart from the second heat sink within the package.
13. The photosensitive assembly according to claim 1, characterized in that the photosensitive assembly further comprises:
And the heat dissipation plate is arranged on the second surface of the circuit board, wherein the first surface is provided with a through hole for accommodating the photosensitive chip, so that the photosensitive chip is attached to the heat dissipation plate.
14. A camera module, comprising:
The photosensitive assembly of any one of claims 1-13; and
The lens assembly is arranged above the photosensitive assembly.
15. A method for preparing a photosensitive assembly, comprising preparing a circuit board assembly comprising a plurality of circuit boards, the method comprising:
The photosensitive chips corresponding to the circuit boards are respectively arranged on the first surfaces of the circuit boards, and the photosensitive chips are connected with the circuit boards through electric connectors;
A plurality of first heat dissipation parts are arranged in the circuit jointed board, wherein one end of each first heat dissipation part is arranged on the photosensitive chip, and the other end of each first heat dissipation part is arranged on the photosensitive chip adjacent to the photosensitive chip;
Placing the circuit jointed board provided with the first heat dissipation piece in a packaging mould;
Filling a material for preparing the packaging body into the packaging mould so as to solidify and form the packaging body corresponding to each circuit board, and inserting the first heat dissipation piece into the packaging body so as to dissipate heat through the surface of the packaging body; and
Cutting the solidified circuit jointed board to obtain a plurality of photosensitive components;
The photosensitive chip comprises a substrate connected with the first surface, a photosensitive area opposite to the substrate and a non-photosensitive area, wherein the non-photosensitive area is arranged around the photosensitive area, the photosensitive chip is provided with a plurality of side faces for connecting the substrate and the non-photosensitive area, the side faces of the photosensitive chip are opposite to the inside of the packaging body, the first radiating piece is arranged in the inside of the packaging body opposite to at least one side face, one end of the first radiating piece contacts with the non-photosensitive area, and the other end of the first radiating piece extends to the outer side wall of the packaging body or is exposed out of the outer side wall of the packaging body.
16. The method of claim 15, wherein connecting the photosensitive chip to each of the circuit boards via electrical connections comprises:
a plurality of welding spots are arranged in the non-photosensitive area; and
And connecting the welding spots of the photosensitive chip with each circuit board through an electric connecting piece.
17. The method of claim 16, wherein disposing one end of each of the first heat sinks to the photosensitive chip comprises:
connecting one end of each first heat dissipation piece with the welding point of the non-photosensitive area; and
And the electric connecting piece and the first radiating piece are arranged at intervals.
18. The method of claim 16, wherein disposing one end of each of the first heat sinks to the photosensitive chip comprises:
Bonding one end of each first heat dissipation element to the non-photosensitive area; and
And the electric connecting piece and the first radiating piece are arranged at intervals.
19. The method of claim 16, wherein disposing the other end of each of the first heat sinks on a photo-sensing die adjacent to the photo-sensing die comprises:
Connecting the other end of each first heat dissipation piece with the welding point of the adjacent photosensitive chip; and
And the electric connecting piece connected with the adjacent photosensitive chip is arranged at intervals with the first radiating piece.
20. The method of claim 16, wherein disposing the other end of each of the first heat sinks on a photo-sensing die adjacent to the photo-sensing die comprises:
Bonding the other end of each first heat dissipation piece to a non-photosensitive area of the adjacent photosensitive chip; and
And the electric connecting piece connected with the adjacent photosensitive chip is arranged at intervals with the first radiating piece.
21. A method for preparing a photosensitive assembly, comprising preparing a circuit board assembly comprising a plurality of circuit boards, the method comprising:
The photosensitive chips corresponding to the circuit boards are respectively arranged on the first surfaces of the circuit boards, and the photosensitive chips are connected with the circuit boards through electric connectors;
A plurality of first heat dissipation parts are arranged in the circuit jointed board, wherein one end of each first heat dissipation part is arranged on the photosensitive chip, and the other end of each first heat dissipation part is arranged on the photosensitive chip adjacent to the photosensitive chip;
A plurality of first heat dissipation parts are arranged in the photosensitive chips at the outermost sides of the circuit jointed boards, wherein one end of each first heat dissipation part is arranged on the photosensitive chip at the outermost sides, and the other end of each first heat dissipation part is arranged on a circuit board corresponding to the photosensitive chip at the outermost sides;
Placing the circuit jointed board provided with the first heat dissipation piece in a packaging mould;
Filling a material for preparing the packaging body into the packaging mould so as to solidify and form the packaging body corresponding to each circuit board, and inserting the first heat dissipation piece into the packaging body so as to dissipate heat through the surface of the packaging body; and
Cutting the solidified circuit jointed board to obtain a plurality of photosensitive components;
The photosensitive chip comprises a substrate connected with the first surface, a photosensitive area opposite to the substrate and a non-photosensitive area, wherein the non-photosensitive area is arranged around the photosensitive area, the photosensitive chip is provided with a plurality of side faces for connecting the substrate and the non-photosensitive area, the side faces of the photosensitive chip are opposite to the inside of the packaging body, the first radiating piece is arranged in the inside of the packaging body opposite to at least one side face, one end of the first radiating piece contacts with the non-photosensitive area, and the other end of the first radiating piece extends to the outer side wall of the packaging body or is exposed out of the outer side wall of the packaging body.
22. The method of claim 21, wherein connecting the photosensitive chip to each of the circuit boards via electrical connections comprises:
a plurality of welding spots are arranged in the non-photosensitive area; and
And connecting the welding spots of the photosensitive chip with each circuit board through an electric connecting piece.
23. The method of claim 22, wherein disposing one end of each of the first heat sinks at the outermost photosensitive chip comprises:
connecting one end of each first heat dissipation piece with the welding point of the outermost photosensitive chip; and
And the electric connecting piece connected with the outermost photosensitive chip is arranged at intervals with the first heat dissipation piece.
24. The method of claim 22, wherein disposing one end of each of the first heat sinks at the outermost photosensitive chip comprises:
Bonding one end of each first heat dissipation piece to a non-photosensitive area of the outermost photosensitive chip; and
And the electric connecting piece connected with the outermost photosensitive chip is arranged at intervals with the first heat dissipation piece.
25. The method of claim 22, wherein disposing the other end of each of the first heat sinks on a circuit board corresponding to the outermost photosensitive chip comprises:
connecting the other end of each first heat dissipation piece with the welding point of the corresponding circuit board; and
And the electric connecting piece connected with the outermost photosensitive chip is arranged at intervals with the first heat dissipation piece.
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| CN202011477844.7A CN114173027B (en) | 2020-09-10 | 2020-09-10 | Photosensitive assembly with heat dissipation element and preparation method thereof |
| CN202010948331.3A CN114173022B (en) | 2020-09-10 | 2020-09-10 | Photosensitive assembly with heat dissipation element and preparation method thereof |
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|---|---|
| CN114173027A (en) | 2022-03-11 |
| CN114173027B (en) | 2024-07-26 |
| CN114173022A (en) | 2022-03-11 |
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