CN110636186B - Molded photosensitive component and camera module and manufacturing method thereof and electronic device - Google Patents
Molded photosensitive component and camera module and manufacturing method thereof and electronic device Download PDFInfo
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- CN110636186B CN110636186B CN201810651876.0A CN201810651876A CN110636186B CN 110636186 B CN110636186 B CN 110636186B CN 201810651876 A CN201810651876 A CN 201810651876A CN 110636186 B CN110636186 B CN 110636186B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 44
- 238000000465 moulding Methods 0.000 claims abstract description 393
- 230000003287 optical effect Effects 0.000 claims abstract description 59
- 239000012778 molding material Substances 0.000 claims description 52
- 238000000034 method Methods 0.000 claims description 42
- 238000003825 pressing Methods 0.000 claims description 30
- 239000012790 adhesive layer Substances 0.000 claims description 26
- 238000000926 separation method Methods 0.000 claims description 24
- 238000003384 imaging method Methods 0.000 description 21
- 239000000463 material Substances 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 230000004308 accommodation Effects 0.000 description 10
- 238000012986 modification Methods 0.000 description 9
- 230000004048 modification Effects 0.000 description 9
- 239000013039 cover film Substances 0.000 description 8
- 239000007787 solid Substances 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
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- 239000011236 particulate material Substances 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 3
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- 238000010438 heat treatment Methods 0.000 description 2
- 239000011344 liquid material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
Abstract
一模塑感光组件和摄像模组及其制造方法以及电子设备，其中该模塑感光组件，供与一光学镜头组装成该摄像模组，包括一线路板、一感光元件以及一模塑基座。该感光元件导通地连接于该线路板。该模塑基座以模塑的方式被形成于该线路板，并提供一平整的芯片安装面和一平整的镜头安装面，其中该感光元件被对应地安装于该模塑基座的该芯片安装面，并且该模塑基座的该镜头安装面供对应地安装该光学镜头，以使该光学镜头位于该感光元件的感光路径。
A molded photosensitive component and a camera module, a manufacturing method thereof, and an electronic device, wherein the molded photosensitive component is used to be assembled with an optical lens to form the camera module, and includes a circuit board, a photosensitive element, and a molded base. The photosensitive element is conductively connected to the circuit board. The molded base is formed on the circuit board in a molding manner, and provides a flat chip mounting surface and a flat lens mounting surface, wherein the photosensitive element is correspondingly mounted on the chip mounting surface of the molded base, and the lens mounting surface of the molded base is used to correspondingly mount the optical lens, so that the optical lens is located in the light sensing path of the photosensitive element.
Description
Technical Field
The present invention relates to the field of optical imaging, and more particularly, to a molded photosensitive assembly, an imaging module, a method of manufacturing the same, and an electronic apparatus.
Background
In recent years, electronic products, intelligent devices and the like are increasingly developed towards the directions of light weight, thinness and high performance, and the development trend of the electronic products and the intelligent devices is more demanding on the size and imaging capability of a camera module which is one of standard configurations of the electronic products and the intelligent devices.
In the assembly process of the current camera module, the most troublesome and difficult problem is how to find a feasible and effective solution to solve the problems of blurred pixels, poor quality and the like of the camera module caused by deformation of a circuit board on the basis of controlling the assembly cost of the camera module.
Specifically, in the existing assembly process of the camera module, the photosensitive chip and the lens base are generally attached to the circuit board directly, then the lens is mounted on the lens base, and the relative position between the photosensitive chip and the lens needs to be adjusted to ensure that the photosensitive surface of the photosensitive chip is perpendicular to the optical axis of the lens, so that the camera module is ensured to have good imaging quality.
However, in the assembly process of the camera module, the steps of baking and heating are performed for many times, and the deformation amount of the circuit board is large after being heated, that is, the circuit board is easy to warp after being heated, so that the light sensitive surface of the light sensitive chip on the circuit board is not parallel to the mounting surface of the lens base, therefore, the light sensitive surface of the light sensitive chip and the optical axis of the lens are difficult to keep perpendicular to each other, and the imaging quality of the camera module is directly affected.
In addition, as the imaging function of the camera module is stronger, that is, the performance of the lens and the performance of the photosensitive chip are continuously upgraded, the requirement on the vertical precision between the optical axis of the lens and the photosensitive surface of the photosensitive chip is higher, so that once the photosensitive chip or the lens is inclined, the imaging quality of the camera module is seriously affected, and even the whole camera module is scrapped.
Disclosure of Invention
An object of the present invention is to provide a molded photosensitive assembly, an image capturing module, a method of manufacturing the same, and an electronic apparatus, wherein a molded base of the molded photosensitive assembly is capable of stably maintaining a photosensitive surface of a photosensitive element mounted on a chip mounting surface of the molded base and an optical axis of an optical lens mounted on a lens mounting surface of the molded base perpendicular to each other, thereby ensuring good imaging quality of the image capturing module.
Another object of the present invention is to provide a molded photosensitive assembly, an image pickup module, a method of manufacturing the same, and an electronic apparatus, wherein the molded base can prevent the photosensitive element mounted on the chip mounting surface of the molded base from tilting or warping, so as to ensure good imaging quality of the image pickup module.
Another object of the present invention is to provide a molded photosensitive assembly and an image pickup module, and a method of manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, the molded base is integrally formed on a circuit board of the molded photosensitive assembly by a molding process to provide a more flat and stable chip mounting surface and lens mounting surface through the molded base.
Another object of the present invention is to provide a molded photosensitive assembly, a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the molded base can keep the chip mounting surface parallel to the lens mounting surface, so as to ensure good imaging quality of the camera module.
Another object of the present invention is to provide a molded photosensitive assembly, a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the molded base can enhance the deformation resistance of the circuit board, so as to prevent the circuit board from being deformed due to heat.
Another object of the present invention is to provide a molded photosensitive assembly, an image capturing module, a method of manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, the molded base has an integral structure that facilitates keeping the chip mounting surface and the lens mounting surface of the molded base parallel to each other so as to ensure that the photosensitive surface of the photosensitive element mounted on the chip mounting surface and the optical axis of the optical lens mounted on the lens mounting surface are perpendicular to each other.
Another object of the present invention is to provide a molded photosensitive assembly, an image capturing module, a method of manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, the molded base has an integral structure, which is advantageous for keeping the chip mounting surface and the lens mounting surface of the molded base parallel to each other, so as to adjust a relative position between the optical lens and the photosensitive element during assembly, such that an optical axis of the optical lens is perpendicular to a photosensitive surface of the photosensitive element.
Another object of the present invention is to provide a molded photosensitive assembly, an imaging module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, a thickness of a chip mounting portion of the molded base is smaller than a thickness of a lens mounting portion of the molded base, so as to reduce a distance between the photosensitive element and the circuit board, thereby reducing a height of the imaging module.
Another object of the present invention is to provide a molded photosensitive assembly, an imaging module, a method of manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, a connection portion of the molded base can increase a connection strength between the chip mounting portion and the lens mounting portion, thereby enhancing an overall strength and a deformation resistance of the molded base.
Another object of the present invention is to provide a molded photosensitive assembly, an image capturing module, a method of manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, the chip mounting portion and the lens mounting portion are disposed at a distance from each other on the circuit board to form a space between the chip mounting portion and the lens mounting portion, and a set of circuit board connectors of the circuit board corresponds to the space, so that the circuit board connectors are prevented from being covered by the molded base to electrically connect the photosensitive element and the circuit board.
Another object of the present invention is to provide a molded photosensitive assembly, an image capturing module, a method of manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, the chip mounting portion, the lens mounting portion, and the connection portion of the molded base are molded simultaneously in one molding, that is, the molded base is integrally molded in the same mold to ensure good uniformity and parallelism of upper surfaces of the chip mounting portion and the lens mounting portion.
Another object of the present invention is to provide a molded photosensitive assembly, an imaging module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the chip mounting portion of the molded base is provided with at least one separation gap to relieve stress applied to the chip mounting portion of the molded base, so as to prevent the chip mounting portion from being deformed due to thermal deformation of the circuit board.
Another object of the present invention is to provide a molded photosensitive assembly, an image capturing module, a method of manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, the separation gap separates the chip mounting portion into at least two sub-chip mounting portions, so as to disperse stress applied to the chip mounting portion, and prevent the chip mounting portion from being deformed due to concentrated stress.
Another object of the present invention is to provide a molded photosensitive assembly, an image capturing module, a method for manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, the chip mounting portion of the molded base is provided with at least one receiving groove for receiving a fluid adhesive material, so that the chip mounting surface of the molded base can directly support the photosensitive element, so as to ensure a high flatness of the photosensitive surface of the photosensitive element.
Another object of the present invention is to provide a molded photosensitive assembly, an image capturing module, a method for manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, the receiving groove is located at the center of the chip mounting portion, so as to optimize the fixing effect of the adhesive material received in the receiving groove on the photosensitive element, so as to prevent the photosensitive element from being inclined due to uneven stress.
Another object of the present invention is to provide a molded photosensitive assembly, an image capturing module, a method for manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, each of the receiving grooves is configured in a shape of a "back" and the center of the chip mounting portion is still the receiving groove, so that the amount of the adhesive material is reduced while maintaining a good fixing effect.
Another object of the present invention is to provide a molded photosensitive assembly, an image capturing module, a manufacturing method thereof, and an electronic apparatus, wherein in some embodiments of the present invention, each of the accommodating grooves is disposed on the chip mounting portion in a surrounding arrangement, so that the photosensitive element is uniformly adhered, so as to prevent the photosensitive element from being inclined due to uneven stress.
Another object of the present invention is to provide a molded photosensitive assembly, an imaging module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the receiving groove is penetratingly disposed on the chip mounting portion to form a through hole type recess on the chip mounting portion, so that the receiving groove corresponds to a pressing head of a molding mold during molding, so that the pressing head of the molding mold can press the circuit board during molding, thereby preventing the circuit board from being deformed, and improving the flatness of the circuit board and the chip mounting portion.
To achieve at least one of the above and other objects and advantages, the present invention provides a molded photosensitive assembly for assembling with an optical lens into an image capturing module, comprising:
A circuit board;
A photosensitive element, wherein the photosensitive element is conductively connected with the circuit board, and
A molding base, wherein the molding base is formed on the circuit board in a molding manner and provides a flat chip mounting surface and a flat lens mounting surface, wherein the photosensitive element is correspondingly mounted on the chip mounting surface of the molding base, and the lens mounting surface of the molding base is used for correspondingly mounting the optical lens so that the optical lens is positioned on a photosensitive path of the photosensitive element.
In some embodiments of the invention, the die mounting surface and the lens mounting surface provided by the molded base are parallel to each other.
In some embodiments of the present invention, the molding base includes a chip mounting portion having the chip mounting surface and a lens mounting portion having the lens mounting surface, and is provided with a reserved space, wherein the lens mounting portion is located around the chip mounting portion, and the reserved space is located between the chip mounting portion and the lens mounting portion.
In some embodiments of the present invention, the circuit board is provided with a chip molding area, a lens molding area, a non-molding area and at least one group of circuit board connectors, wherein the lens molding area is located around the chip molding area, the non-molding area is located between the chip molding area and the lens molding area, each group of circuit board connectors is disposed on the non-molding area of the circuit board, after the circuit board is molded, the chip mounting portion of the molding base is covered on the chip molding area of the circuit board, the lens mounting portion of the molding base is covered on the lens molding area of the circuit board, and the reserved space of the molding base corresponds to the non-molding area of the circuit board.
In some embodiments of the invention, the molded base further comprises at least one connection portion, wherein each connection portion integrally extends from the lens mounting portion to the chip mounting portion to form the molded base having a unitary structure.
In some embodiments of the present invention, the circuit board is further provided with a connection molding area, wherein the connection molding area is located between the lens molding area and the chip molding area and communicates the lens molding area and the chip molding area, and after the circuit board is molded, the connection portion of the molding base is covered on the connection molding area of the circuit board, so that the lens mounting portion and the chip mounting portion are integrated through the connection portion.
In some embodiments of the invention, the connection portion has a lens connection end and a chip connection end, wherein the lens connection end of the connection portion is integrally connected with the lens mounting portion, and the chip connection end of the connection portion is integrally connected with the chip mounting portion, wherein the connection portion tapers from the lens connection end to the chip connection end.
In some embodiments of the invention, the thickness of the chip mounting portion is less than the thickness of the lens mounting portion.
In some embodiments of the present invention, the chip mounting portion of the molding base includes at least two mutually spaced sub-chip mounting portions, and a separation gap is formed between adjacent sub-chip mounting portions, wherein each of the sub-chip mounting portions is integrally connected to the lens mounting portion by the corresponding connection portion.
In some embodiments of the invention, the separation gap is arranged in a "straight" shape to separate the chip mounting portion into two of the sub-chip mounting portions.
In some embodiments of the invention, the separation gap is arranged in a cross shape to separate the chip mounting portion into four sub-chip mounting portions.
In some embodiments of the invention, the four sub-chip mounting parts are grouped in pairs, and each group of the sub-chip mounting parts is integrally connected to the lens mounting part through the same connecting part.
In some embodiments of the invention, the molded photosensitive assembly further comprises an adhesive layer, wherein the chip mounting portion of the molded base comprises at least one receiving groove, and each of the receiving grooves is recessed downwardly from the chip mounting surface to form a recess for receiving the adhesive layer to fixedly mount the photosensitive element to the chip mounting surface of the chip mounting portion via the adhesive layer.
In some embodiments of the invention, each of the accommodating grooves is provided in the chip mounting part in an array arrangement.
In some embodiments of the invention, each of the accommodating grooves is provided to the chip mounting part in a surrounding arrangement. .
In some embodiments of the present invention, each of the receiving grooves extends downward from the chip mounting surface to the wiring board to form the through-hole type recess to bond the photosensitive element, the chip mounting portion, and the wiring board together through the adhesive layer.
In some embodiments of the present invention, each of the receiving grooves is provided in a "back" shape to divide the chip mounting part into two sub-chip mounting parts by the receiving groove, wherein the two sub-chip mounting parts are integrally connected to form the chip mounting part having an integral structure.
In some embodiments of the invention, the molded photosensitive assembly further comprises a set of electronic components, wherein the electronic components are mounted to the lens molding region of the circuit board at intervals to encase the electronic components by the lens mounting portion of the molding base.
In some embodiments of the present invention, the molded photosensitive assembly further comprises at least one set of leads, wherein the photosensitive element comprises a photosensitive region, a non-photosensitive region, and at least one set of chip connectors, wherein the non-photosensitive region is located around the photosensitive region, and each set of chip connectors is respectively disposed on the non-photosensitive region of the photosensitive element to conductively connect the chip connectors with the corresponding circuit board connectors through the leads.
According to another aspect of the present invention, there is further provided an image capturing module, including:
An optical lens, and
The molded photosensitive assembly, wherein the optical lens is correspondingly mounted on the lens mounting surface of the molded photosensitive assembly, wherein the optical axis of the optical lens is perpendicular to the photosensitive surface of the photosensitive element.
According to another aspect of the present invention, there is further provided an electronic apparatus including:
An electronic equipment body, and
At least one camera module, wherein the camera module is disposed on the electronic device body for obtaining an image, wherein the camera module is the camera module according to claim 20.
According to another aspect of the present invention, there is further provided a method of manufacturing a molded photosensitive assembly, comprising the steps of:
Forming a molded base on a circuit board by a molding process, wherein the molded base provides a flat chip mounting surface and a flat lens mounting surface;
mounting a photosensitive element to the chip mounting surface of the molded base, and
And conductively connecting the photosensitive element and the circuit board to form a molded photosensitive assembly.
In some embodiments of the present invention, the step of forming a molded base on a circuit board by a molding process, wherein the molded base provides a flat chip mounting surface and a flat lens mounting surface, comprises the steps of:
Placing the circuit board on a second die of a forming die;
Closing a first mold and the second mold of the molding mold to form a molding space of the molding mold between the first mold and the second mold, and
And adding a molding material into the molding space of the molding die to integrally form the molding base on the circuit board after the molding material is solidified.
In some embodiments of the present invention, the step of closing a first mold and the second mold of the molding mold to form a molding space of the molding mold between the first mold and the second mold includes the steps of:
Pressing the circuit board on a non-molding area by using a pressing surface of the first die;
correspondingly forming a chip mounting part forming space in a chip molding area of the circuit board;
Correspondingly forming a lens mounting part forming space in a lens molding area of the circuit board, wherein the non-molding area is positioned between the chip molding area and the lens molding area, and
And correspondingly forming a connecting part forming space in a connecting molding area of the circuit board, wherein the connecting part forming space communicates the chip mounting part forming space and the lens mounting part forming space to form the forming space with an integrated structure.
In some embodiments of the present invention, the step of adding a molding material to the molding space of the molding die to integrally form the molding base on the wiring board after the molding material is cured includes the steps of:
forming a lens mounting part coated on the lens molding area of the circuit board in the lens mounting part molding space so that the top surface of the lens mounting part forms the lens mounting surface;
Forming a chip mounting part in the chip mounting part forming space and covering the chip molding area of the circuit board so that the top surface of the chip mounting part forms the chip mounting surface, and
In the connection part forming space, a connection part is formed to cover the connection molding region of the circuit board, wherein the connection part is integrally connected to the chip mounting part and the lens mounting part to form the molding base having an integral structure.
In some embodiments of the invention, the method for manufacturing a molded photosensitive assembly further comprises the steps of:
and pressing a central part of the chip molding area of the circuit board by a pressing head of the first die.
In some embodiments of the invention, the method for manufacturing a molded photosensitive assembly further comprises the steps of:
after the molding material is cured, a receiving groove is formed in the chip mounting portion.
In some embodiments of the invention, the method for manufacturing a molded photosensitive assembly further comprises the steps of:
after the molding material is cured, a separation gap is formed at the chip mounting portion, wherein the separation gap separates the chip mounting portion into at least two mutually spaced sub-chip mounting portions.
In some embodiments of the present invention, the step of adding a molding material to the molding space of the molding die to integrally form the molding base on the wiring board after the molding material is cured includes the steps of:
Pouring the molding material into the molding space of the lens mounting part of the molding space, and
And guiding the molding material to flow into the chip mounting part molding space from the lens mounting part molding space through the connecting part molding space so as to fill the molding space with the molding material.
In some embodiments of the invention, the chip mounting surface and the lens mounting surface are parallel to each other.
In some embodiments of the invention, the method of manufacturing a molded photosensitive assembly, wherein the chip mounting surface is lower than the lens mounting surface.
According to another aspect of the present invention, there is further provided a method for manufacturing an image capturing module, including the steps of:
Forming a molded base on a circuit board by a molding process, wherein the molded base provides a flat chip mounting surface and a flat lens mounting surface;
Mounting a photosensitive element to the chip mounting surface of the molded base;
conductively connecting the photosensitive element and the circuit board to form a molded photosensitive assembly, and
And installing an optical lens on the lens installation surface of the molding base, and enabling an optical axis of the optical lens to be perpendicular to the photosensitive surface of the photosensitive element so as to manufacture an image pickup module.
Further objects and advantages of the present invention will become fully apparent from the following description and the accompanying drawings.
These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the appended claims.
Drawings
Fig. 1 is a schematic perspective view of an image capturing module according to a first preferred embodiment of the present invention.
Fig. 2 is a schematic perspective sectional view of the camera module according to the first preferred embodiment of the present invention.
Fig. 3 is a schematic perspective view of a molded photosensitive component of the camera module according to the first preferred embodiment of the present invention.
Fig. 4A to 4C are schematic views showing steps of manufacturing the molded photosensitive member according to the above-described first preferred embodiment of the present invention.
Fig. 5 is a first variant of the molded photosensitive component according to the first preferred embodiment of the present invention.
Fig. 6A and 6B are views showing a second modification of the molded photosensitive member according to the above-described first preferred embodiment of the present invention.
Fig. 7 is a flowchart illustrating a method for manufacturing the camera module according to the first preferred embodiment of the present invention.
Fig. 8 is a perspective view of a molded photosensitive component according to a second preferred embodiment of the present invention.
Fig. 9 is a first variant of the molded photosensitive component according to the second preferred embodiment of the present invention.
Fig. 10 is a second variant of the molded photosensitive component according to the second preferred embodiment of the present invention.
FIG. 11A is a schematic perspective view of a molded photosensitive component according to a third preferred embodiment of the present invention.
Fig. 11B is a schematic cross-sectional view of the molded photosensitive assembly according to the third preferred embodiment of the present invention.
Fig. 12A and 12B are views showing a first modification of the molded photosensitive member according to the above third preferred embodiment of the present invention.
Fig. 13A to 13C are second modified embodiments of the molded photosensitive component according to the above third preferred embodiment of the present invention.
Fig. 14A and 14B are views showing a third modification of the molded photosensitive member according to the above-described third preferred embodiment of the present invention.
Fig. 15A and 15B are perspective views of an electronic apparatus with the above-described camera module according to the present invention.
Detailed Description
The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the above terms should not be construed as limiting the present invention.
In the present invention, the terms "a" and "an" in the claims and specification should be understood as "one or more", i.e. in one embodiment the number of one element may be one, while in another embodiment the number of the element may be plural. The terms "a" and "an" are not to be construed as unique or singular, and the term "the" and "the" are not to be construed as limiting the amount of the element unless the amount of the element is specifically indicated as being only one in the disclosure of the present invention.
In the description of the present invention, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, unless explicitly specified and limited otherwise, the terms "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected or integrally connected, mechanically connected or electrically connected, or directly connected or indirectly connected through a medium. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Referring to fig. 1 to 7 of the drawings, an image pickup module 1 according to a first preferred embodiment of the present invention is illustrated, wherein the image pickup module 1 includes at least one optical lens 10 and a molded photosensitive member 20. As shown in fig. 1 to 4C, the molded photosensitive assembly 20 includes a circuit board 21, at least one photosensitive element 22, and a molded base 23, wherein each of the photosensitive elements 22 is conductively connected to the circuit board 21, respectively, wherein the molded base 23 is integrally formed with the circuit board 21 in a molded manner, and provides at least one chip mounting surface 2301 and at least one lens mounting surface 2302 having a relatively high flatness, wherein each of the photosensitive elements 22 is mounted on the corresponding chip mounting surface 2301, each of the optical lenses 10 is mounted on the corresponding lens mounting surface 2302, and each of the optical lenses 10 is located in a photosensitive path of the corresponding photosensitive element 22.
It should be understood that the molding base 23 is manufactured and formed through a molding process, that is, a molding material melted into a liquid state by heating is injected into a mold, and is formed into a fixed shape corresponding to the mold after cooling. As shown in fig. 4A to 4C, since the mold used in the molding process has a high flatness, the surface of the mold base 23 formed in the mold also has a high flatness, and therefore, the mold base 23 can provide the chip mounting surface 2301 more flattened so as to mount the photosensitive element 22 to the chip mounting surface 2301 flattened. Meanwhile, since the molded base 23 has higher structural strength with respect to the wiring board and stronger heat resistance, the molded base 23 formed by the molding process and bonded to the wiring board 21 can improve the structural strength of the molded photosensitive assembly 20 and can be prevented from being deformed by heat, and thus the photosensitive element 22 mounted on the chip mounting face 2301 can be effectively prevented from being inclined or warped.
Preferably, as shown in fig. 2 and 4C, each of the chip mounting surfaces 2301 and the corresponding lens mounting surface 2302 are parallel to each other, so that when the photosensitive element 22 and the optical lens 10 are mounted on the molding base 23, it is further helpful to adjust the photosensitive element 22 and the optical lens 10, so as to calibrate the photosensitive surface 220 of each of the photosensitive elements 22 and the optical axis 100 of the corresponding optical lens 10, so that the photosensitive surface 220 of each of the photosensitive elements 22 is perpendicular to the optical axis 100 of the corresponding optical lens 10, thereby further ensuring that the image capturing module 1 has good imaging quality. It should be understood that the shape and size of each of the chip mounting surfaces 2301 may be designed and planned according to the shape and size of the photosensitive element 22, and accordingly, the shape and size of each of the lens mounting surfaces 2302 may be designed and planned according to the lateral shape and size of the barrel of the optical lens 10, and the shapes and sizes of the chip mounting surfaces 2301 and the lens mounting surfaces 2302 may be different for different photosensitive elements 22 and optical lenses 10, and will not be repeated in the present invention.
It should be noted that, although the description of fig. 1 to 7 and the following description take the case that the image capturing module 1 includes only one optical lens 10 and one photosensitive element 22 as an example, it will be understood by those skilled in the art that the image capturing module 1 disclosed in fig. 1 to 7 and the following description is merely an example, and does not limit the content and scope of the present invention, for example, in other examples of the image capturing module, the number of optical lenses 10 may also be more than one, and accordingly, the number of photosensitive elements 22 may also be more than one to form an array image capturing module. In addition, the type of the optical lens 10 can be adjusted according to the requirements of the image capturing module, for example, the optical lens 10 can be implemented as an integrated optical lens, a split optical lens, a bare lens, or an optical lens including a lens barrel, which is not limited in the present invention.
Specifically, as shown in fig. 2 and 4A, the molding base 23 includes a chip mounting portion 231 having the chip mounting surface 2301 and a lens mounting portion 232 having the lens mounting surface 2302, and the lens mounting portion 232 is located around the chip mounting portion 231 such that the lens mounting surface 2302 is located around the chip mounting surface 2301, so that when the photosensitive element 22 is mounted on the lens mounting surface 2302, the optical lens 10 corresponds to a photosensitive path of the photosensitive element 22, that is, the optical axis 100 of the optical lens 10 and the photosensitive surface 220 of the photosensitive element 22 are perpendicular to each other, and the optical axis 100 of the optical lens 10 corresponds to a center of the photosensitive surface 220 of the photosensitive element 22.
More specifically, as shown in fig. 3, the molding base 23 is further provided with a reserved space 233, wherein the reserved space 233 is disposed between the chip mounting portion 231 and the lens mounting portion 232. In other words, the chip mounting part 231 and the lens mounting part 232 of the molding base 23 are arranged at intervals to form the reserved space 233 of the molding base 23 between the chip mounting part 231 and the lens mounting part 232.
It is noted that, as shown in fig. 4A, the circuit board 21 includes a chip molding region 211, a lens molding region 212, and a non-molding region 213, wherein the non-molding region 213 is located between the chip molding region 211 and the lens molding region 212, and the lens molding region 212 is located around the chip molding region 211, so that when molding is performed on the circuit board 21 by a molding process, the chip mounting portion 231 of the molding base 23 is formed at the chip molding region 211 of the circuit board 21 such that the chip mounting portion 231 of the molding base 23 is covered at the chip molding region 211 of the circuit board 21, the lens mounting portion 232 of the molding base 23 is formed at the lens molding region 212 of the circuit board 21 such that the lens mounting portion 232 of the molding base 23 is covered at the lens molding region 212 of the circuit board 21, so that the reserved space 233 of the molding base 23 is formed at the non-molding region 213 of the circuit board 21 such that the non-molding region 213 of the circuit board 23 is not covered by the lens molding base 23. In other words, the chip molding region 211 of the wiring board 21 corresponds to the chip mounting portion 231 of the molding base 23, the lens molding region 212 of the wiring board 21 corresponds to the lens mounting portion 232 of the molding base 23, and the non-molding region 213 of the wiring board 21 corresponds to the reserved space 233 of the molding base 23.
Further, as shown in fig. 2 and 3, the circuit board 21 further includes at least one set of circuit board connectors 214, wherein each set of circuit board connectors 214 is disposed in the non-molding area 213 of the circuit board 21, respectively, so as to prevent the molding base 23 from blocking the electrical connection between the photosensitive element 22 and the circuit board connector 214 due to covering the circuit board connector 214 of the circuit board 21, thereby facilitating conductive connection between the photosensitive element 22 and the circuit board 21.
Accordingly, as shown in fig. 3, the photosensitive element 22 includes a photosensitive region 221, a non-photosensitive region 222, and at least one set of chip connectors 223, wherein the non-photosensitive region 222 is located around the photosensitive region 221, and each set of chip connectors 223 is disposed on the non-photosensitive region 222 of the photosensitive element 22. In other words, the photosensitive region 221 is located at the middle of the photosensitive element 22, the non-photosensitive region 222 is located at the outer periphery of the photosensitive element 22, and the non-photosensitive region 222 is arranged around the photosensitive region 221 such that each set of the chip connectors 223 is located at the outer periphery of the photosensitive element 22.
It is noted that, as shown in fig. 2, the molded photosensitive assembly 20 further includes an adhesive layer 26, wherein the adhesive layer 26 is located between the photosensitive element 22 and the chip mounting surface 2301 of the molded base 23, so that the photosensitive element 22 is fixedly mounted to the chip mounting surface 2301 of the molded base 23 through the adhesive layer 26. It should be appreciated that in mounting the photosensitive element 22 to the chip mounting face 2301, an adhesive material such as glue, solid glue, or the like is first applied to the chip mounting face 2301 of the molded base 23, and then the photosensitive element 22 is stacked on the chip mounting face 2301 to form the adhesive layer 26 between the photosensitive element 22 and the chip mounting face 2301 after the adhesive material is cured.
As shown in fig. 3, the molded photosensitive assembly 20 further includes at least one set of leads 24, wherein each lead of each set of leads 24 has a circuit board connection end 241 and a chip connection end 242, respectively, wherein each lead of each set of leads 24 extends curvedly between the circuit board connection end 241 and the chip connection end 242, respectively, wherein the circuit board connection ends 241 of each set of leads 24 are connected to each set of circuit board connections 214 of the circuit board 21, respectively, and the chip connection ends 242 of each set of leads 24 are connected to each set of chip connections 223 of the photosensitive element 22, respectively, to conductively connect the photosensitive element 22 and the circuit board 21.
It should be noted that the type of the lead 24 may not be limited, and for example, the lead 24 may be a gold wire, that is, after the photosensitive element 22 is attached to the chip mounting surface 2301 of the molding base 23, the lead 24 may be made conductive to the photosensitive element 22 and the wiring board 21 by a wire bonding process. However, in other examples, the lead 24 may be other types of leads, such as silver wires, copper wires, etc., where the lead 24 is capable of conducting the photosensitive element 22 and the wiring board 21.
In one example of the camera module 1 of the present invention, each of the wiring board connectors 214 of the wiring board 21 and each of the chip connectors 223 of the photosensitive element 22 may be lands, respectively, that is, each of the wiring board connectors 214 of the wiring board 21 and each of the chip connectors 223 of the photosensitive element 22 may be disk-shaped, respectively, for connecting the wiring board connectors 241 and the chip connectors 242 of the leads 24 to the wiring board connectors 214 of the wiring board 21 and the chip connectors 223 of the photosensitive element 22, respectively. In another example of the camera module of the present invention, the circuit board connector 214 of the circuit board 21 and the chip connector 223 of the photosensitive element 22 may be respectively spherical, for example, solder paste or other solder material is dispensed on the non-molding region 213 of the circuit board 21 and the non-photosensitive region 222 of the photosensitive element 22 to respectively form the circuit board connector 214 of the circuit board 21 and the chip connector 223 of the photosensitive element 22. However, it will be appreciated by those skilled in the art that the types of the circuit board connectors 214 of the circuit board 21 and the chip connectors 223 of the photosensitive element 22 do not constitute limitations on the type and scope of the camera module of the present invention, i.e., in other examples of the camera module, the circuit board connectors 214 of the circuit board 21 and the chip connectors 223 of the photosensitive element 22 may have other shapes not exemplified above.
It should be noted that, as shown in fig. 2, the molded photosensitive assembly 20 further includes a set of electronic components 25, wherein each of the electronic components 25 may be attached to the lens molding area 212 of the circuit board 21 at intervals by a process such as SMT (Surface Mount Technology), so that after the molding base 23 is molded, the lens mounting portion 232 of the molding base 23 covers each of the electronic components 25 to isolate adjacent electronic components 25 by the lens mounting portion 232. It should be appreciated that, since the lens mounting portion 232 of the molding base 23 wraps each of the electronic components 25, so that no adverse phenomenon of mutual interference occurs between adjacent electronic components 25, the imaging quality of the camera module can be ensured even when the distance between adjacent electronic components 25 is relatively short, and therefore, a larger number of electronic components 25 can be mounted on the circuit board 21 with a smaller area, so that the structure of the molded photosensitive assembly 20 is more compact, which is advantageous for improving the imaging quality of the camera module 1 on the basis of controlling the size of the camera module 1.
It should be noted that, in some other embodiments of the present invention, each electronic component 25 may also be mounted to the non-molding area 213 of the circuit board 21 at intervals, so that after the molding base 23 is formed, each electronic component 25 is located in the reserved space 233 of the molding base 23, so that the electronic component 25 is exposed outside the molding base 23 for subsequent repair and maintenance of the electronic component 25.
Preferably, as shown in fig. 2, the chip mounting surface 2301 of the molding base 23 is lower than the lens mounting surface 2302, that is, the thickness of the chip mounting portion 231 of the molding base 23 is smaller than the thickness of the lens mounting portion 232 of the molding base 23, so that the lens mounting portion 232 can completely cover the electronic component 25 to avoid the height of the electronic component 25 while also providing a flat lens mounting surface 2302 for mounting the optical lens 10. Meanwhile, since the chip mounting portion 231 has a small thickness, the distance between the chip mounting surface 2301 and the wiring board 21 is small, and thus the distance between the photosensitive element 22 mounted on the chip mounting surface 2301 and the wiring board 21 can be shortened, which is advantageous in shortening the length of the lead 24 required to conductively connect the photosensitive element 22 and the wiring board 21, and also in reducing the overall height of the image pickup module 1.
Further, in the first preferred embodiment of the present invention, as shown in fig. 3 and 4A, the molding base 23 further includes at least one connection portion 234, wherein each connection portion 234 integrally extends from the lens mounting portion 232 to the chip mounting portion 231, respectively, so as to integrate the chip mounting portion 231 and the lens mounting portion 232 through the connection portion 234, thereby forming the molding base 23 having an integrated structure, so as to enhance the overall strength and deformation resistance of the molding base 23, and facilitate preventing the molding base 23 from being deformed due to heat or external force, thereby providing a more flat and stable mounting surface. In other words, the circuit board 21 is further provided with a connection molding area 215, and the connection molding area 215 communicates with the chip molding area 211 and the lens molding area 212, respectively, so that when the molding base 23 is formed by a molding process, the chip mounting portion 231, the lens mounting portion 232, and the connection portion 234 of the molding base 23 are integrally formed to the circuit board 21, wherein the connection portion 234 corresponds to the connection molding area 215 of the circuit board 21, and the connection portion 234 integrally bonds the chip mounting portion 231 and the lens mounting portion 232, so that the chip mounting surface 2301 at the chip mounting portion 231 and the lens mounting surface 2302 at the lens mounting portion 232 can be stably kept parallel, in order to prevent the parallelism between the chip mounting surface 2301 and the lens mounting surface 2302 from being reduced due to the chip mounting portion 231 or the lens mounting portion 232 being inclined or slightly deformed, thereby affecting the imaging quality of the imaging module 2301.
It should be noted that, although the connection portions 234 are located between the chip mounting portion 231 and the lens mounting portion 232, that is, the connection portions 234 correspond to the reserved space 233 of the molding base 23, each connection portion 234 avoids the circuit board connection member 214 located in the non-molding region 213 of the circuit board 21, so as to prevent the connection portions 234 from blocking the circuit board connection member 214 from being conductively connected to the chip connection member 223 of the photosensitive element 22 due to covering or shielding the circuit board connection member 214.
Illustratively, as shown in fig. 2 and 3, the circuit board connectors 214 of the circuit board 21 are disposed at both sides of the chip molding region 211, that is, the non-molding region 213 is distributed at both sides of the chip molding region 211, and at this time, the number of the connection parts 234 of the molding base 23 is two, which are symmetrically disposed at both front and rear sides of the chip mounting part 231, respectively, to divide the space 233 of the molding base 23 into left and right parts such that the left and right parts of the space 233 correspond to the respective two parts of the non-molding region 213 of the circuit board 21, respectively, such that the circuit board connectors 214 disposed at the left and right parts of the non-molding region 213 are exposed at the left and right sides of the chip mounting part 231, respectively, so as to be electrically connected in correspondence with the chip connectors 223 of the photosensitive element 22, so as to conduct the photosensitive element 22 and the circuit board 21.
Preferably, as shown in fig. 3, the width of each of the connection portions 234 is smaller than the width of the chip mounting portion 231, so that the area of the non-molding region 213 of the circuit board 21 can be increased accordingly while the occupied space of the connection portions 234 (i.e., the area of the connection molding region 215 of the circuit board 21) is reduced, so as to provide sufficient space for disposing the circuit board connectors 214, so that the circuit board connectors 214 are prevented from being too crowded to contact each other to cause a short-circuit accident. More preferably, the width of the connection portion 234 is not less than 1/10 of the width of the chip mounting portion 231, so as to prevent the connection strength of the connection portion 234 from being too weak due to the too small width of the connection portion 234, thereby reducing the overall strength of the molding base 23.
It should be appreciated that in some other examples of the present invention, the width of each of the connection portions 234 may also be equal to or greater than the width of the chip mounting portion 231 to increase the connection strength between the connection portions 234 and the chip mounting portion 231 and the lens mounting portion 232, respectively, while also increasing the deformation resistance of the connection portions 234 themselves to ensure good parallelism between the chip mounting surface 2301 and the lens mounting surface 2302.
More preferably, in the first preferred embodiment of the present invention, as shown in fig. 3 and 4A, the thickness of the connection portion 234 is equal to the thickness of the chip mounting portion 231. Of course, in some other embodiments of the present invention, the thickness of the connection portion 234 may be greater than the thickness of the chip mounting portion 231, or may be less than the thickness of the chip mounting portion 231.
In the first preferred embodiment of the present invention, as shown in fig. 4A to 4C, the chip mounting portion 231 and the lens mounting portion 232 of the molding base 23 are molded simultaneously in one molding, that is, the wiring board 21 is correspondingly placed in a molding die 400 to be subjected to a molding process by the molding die 400, thereby forming the molding base 23 for covering the chip molding region 211 and the lens molding region 212 of the wiring board 21, so that the chip mounting portion 231 and the lens mounting portion 232 of the molding base 23 have good conformity in upper surfaces thereof to ensure a high parallelism of the chip mounting surface 2301 and the lens mounting surface 2302, contributing to the light-sensitive surface 220 of the light-sensitive element 22 mounted to the chip mounting surface 2301 being perpendicular to the optical axis 100 of the optical lens 10 mounted to the lens mounting surface 2302.
Specifically, as shown in fig. 4B and 4C, the molding die 400 includes a first die 401 and a second die 402, wherein at least one of the first die 401 and the second die 402 can be moved so that the first die 401 and the second die 402 can be subjected to a clamping and drawing operation, and a molding space 403 is formed between the first die 401 and the second die 402, wherein the molding base 23 is formed by the molding material being added to the molding space 403 and after curing.
For example, in one embodiment, the second mold 402 may be fixed, and the first mold 401 may be movable along guide posts with respect to the second mold 402 to be clamped when the first mold 401 is moved toward the second mold 402, and to be extracted when the first mold 401 is moved away from the second mold 402, and the molding space 403 is formed between the first mold 401 and the second mold 402 when the first mold 401 and the second mold 402 are subjected to a clamping operation. In another embodiment, the first mold 401 may be fixed, and the second mold 402 may be movable along guide posts relative to the first mold 401 to close the mold when the second mold 402 is moved toward the first mold 401, and to open the mold when the second mold 402 is moved away from the first mold 401.
Further, as shown in fig. 4C, the molding die 400 further includes a cover film 404, wherein the cover film 404 is overlapped on a press-fit surface 4011 of the first die 401 of the molding die 400, and the cover film 404 corresponds to the non-molding region 213 of the wiring board 21, wherein after the wiring board 21 is placed on the first die 401 and/or the second die 402, the first die 401 and the second die 402 of the molding die 400 are operated to perform a clamping operation so that the wiring board 21 is positioned in the molding space 403 of the molding die 400, wherein the press-fit surface 4011 of the first die 401 presses the non-molding region 213 of the wiring board 21, and the cover film 404 is positioned between the press-fit surface 4011 of the first die 401 and the non-molding region 213 of the wiring board 21, so as to prevent the press-fit surface 4011 of the first die 401 from scratching the non-molding region 214 of the wiring board 21. It should be appreciated that in some other embodiments of the present invention, the molding die 400 may not include the cover film 404, so that the pressing surface 4011 of the first die 401 directly presses the non-molding region 213 of the circuit board 21 when the dies are closed.
Further, as shown in fig. 4C, the cover film 404 is preferably made of a material having a certain elasticity such as plastic, rubber, polymer material, or the like, so that the cover film 404 can also absorb an impact force generated at an instant when the pressing surface 4011 of the first mold 401 contacts the wiring board 21 when the first mold 401 and the second mold 402 are subjected to the mold clamping operation, thereby avoiding damage to the wiring board 21 by the mold clamping of the first mold 401 and the second mold 402.
It should be appreciated that since the circuit board connector 214 located at the non-molding region 213 generally protrudes from the upper surface of the circuit board 21, the pressing surface 4011 of the first mold 401 cannot be tightly pressed against the non-molding region 213 of the circuit board 21, and the cover film 404 can be deformed to prevent a gap from being generated between the pressing surface 4011 of the first mold 401 and the non-molding region 213 of the circuit board 21, so as to prevent the molding material from entering between the pressing surface 4011 of the first mold 401 and the non-molding region 213 of the circuit board 21 to cover the non-molding region 213 of the circuit board 21 during the molding process.
It should be noted that in some other embodiments of the present invention, the molding die 400 further has a receiving groove disposed on the pressing surface 4011 of the first die 401, wherein the receiving groove corresponds to the circuit board connector 214 located in the non-molding region 213, so that when the molding die 400 is in the closed mode, the circuit board connector 214 is received in the receiving groove, so that the pressing surface 4011 of the first die 401 can be tightly pressed against the non-molding region 213 of the circuit board 21, so as to prevent molding material from entering between the pressing surface 4011 and the non-molding region 213 to cover the non-molding region 213 of the circuit board 21.
It should be noted that the fluid-like molding material according to the present invention may be a liquid material or a solid particulate material or a mixture of liquid and solid particulate materials, and it is understood that the molding material, whether implemented as a liquid material or as a solid particulate material or as a mixture of liquid and solid particulate materials, is capable of solidifying to form the molding base 23 after being added to the molding space 403 of the molding die 400. For example, in this particular example of the invention, the molding material in fluid form is embodied as a thermosetting material, such as a liquid, wherein the molding material solidifies after being added to the molding space 403 of the molding die 400 to form the molding base 23. It should be noted that, after the fluid molding material is added into the molding space 403 of the molding die 400, the curing manner of the fluid molding material does not limit the content and scope of the present invention.
Further, the molding space 403 of the molding die 400 corresponds to the chip molding region 211, the lens molding region 212, and the connection molding region 215 of the wiring board 21 to form the chip mounting portion 231 covering the chip molding region 211 of the wiring board 21, and the lens mounting portion 232 covering the lens molding region 212 of the wiring board 21, and the connection portion 234 covering the connection molding region 215 of the wiring board 21 after the molding material added into the molding space 403 is cured, such that the connection portion 234 integrally connects the chip mounting portion 231 and the lens mounting portion 232, and a top surface of the chip mounting portion 231 is defined as the chip mounting surface 2301, and a top surface of the lens mounting portion 232 is defined as the lens mounting surface 2302.
More specifically, as shown in fig. 4B and 4C, the pressing surface 4011 of the first die 401 of the molding die 400 is pressed against the non-molding region 213 of the wiring board 21 during molding, and the non-molding region 213 is located between the lens molding region 212 and the chip molding region 211 of the wiring board 21 so as to flatten the wiring board 21, thereby ensuring flatness of the wiring board 21, that is, flatness of the entire molding base surface during molding. It should be understood that, in order to further flatten the circuit board 21, in the embodiment described later, the first mold 401 further has a pressing head (not shown in the drawings), wherein the pressing head of the first mold 401 corresponds to a center position of the circuit board 21 (i.e., corresponds to a center portion of the chip molding region 211 of the circuit board 21), so that in a clamped state, the pressing head of the first mold 401 is pressed against the center position of the circuit board 21 to ensure the overall flatness of the circuit board 21, thereby ensuring the flatness of the molding base surface.
In addition, as shown in fig. 4A and 4B, the molding space 403 of the molding die 400 includes a chip mounting portion molding space 4031, a lens mounting portion molding space 4032, and two connecting portion molding spaces 4033, wherein in the clamped state, the chip mounting portion molding space 4031 corresponds to the chip molding region 211 of the wiring board 21, the lens mounting portion molding space 4032 corresponds to the lens molding region 212 of the wiring board 21, each of the connecting portion molding spaces 4033 corresponds to the connecting molding region 215 of the wiring board 21, and each of the connecting portion molding spaces 4033 communicates with the chip mounting portion molding space 4031 and the lens mounting portion molding space 4032 such that the connecting portion molding space 4033 forms a communication passage between the chip mounting portion molding space 4031 and the lens mounting portion molding space 4032. Therefore, at the time of injecting the molding material into the molding space 403, the molding material can flow from the lens mount molding space 4032 into the chip mount molding space 4031 through the connecting portion molding space 4033 to fill the molding space 403, and the molding base 23 having an integrated structure is formed after the molding material is cured, that is, the chip mount 231 and the lens mount 232 of the molding base 23 can be made by only one molding to ensure that the chip mount face 2301 and the lens mount face 2302 of the molding base 23 are parallel to each other. It should be understood that, if the chip mounting portion 231 and the lens mounting portion 232 of the molded base 23 are formed by two molding processes, there is inevitably a difference in the degree of press-fit of the circuit board, the press-fit position, and the material of the molding material each time, which results in that the chip mounting surface 2301 and the lens mounting surface 2302 of the molded base 23 cannot be kept parallel to each other, which causes great trouble and inconvenience to the subsequent assembly process.
Further, the first mold 401 of the molding mold 400 is further provided with at least one air vent (not shown) to vent the air in the molding space 403 of the molding mold 400, so as to prevent the molding material from being unable to fill the molding space 403 due to the air in the molding space 403 being unable to vent. In particular, the air vent is provided outside the chip mounting part 231 of the first mold 401 to exhaust the air in the chip mounting part forming space 4031 and the connection part forming space 4033, thereby ensuring that the molding material fills the chip mounting part forming space 4031 and the connection part forming space 4033. Preferably, the air vent is located away from the circuit board connector 214 of the circuit board 21 to prevent the molding material from being flushed out of the air vent to cover the circuit board connector 214.
It is to be noted that since the top surface of the chip mounting portion 231 and the top surface of the lens mounting portion 232 of the molding base 23 each correspond to the inner surface of the first mold 401, that is, the chip mounting face 2301 and the lens mounting face 2302 of the molding base 23 each correspond to the inner surface of the first mold 401, by the flatness and parallelism of the inner surface of the first mold 401, the chip mounting face 2301 and the lens mounting face 2302 of the molding base 23 can be ensured to have high flatness and parallelism for subsequent assembly and calibration.
Fig. 5 shows a first variant of the molded photosensitive assembly 20 according to the first preferred embodiment of the present invention, wherein the molded base 23 of the molded photosensitive assembly 20 comprises only one of the connecting portions 234. Illustratively, as shown in FIG. 5, the connection part 234 integrally connects the chip mounting part 231 and the lens mounting part 232, and the connection part 234 is located at one side (e.g., front side) of the chip mounting part 231 such that the reserved space 233 of the molding base 23 is located at the remaining three sides (e.g., left side, right side, and rear side) of the chip mounting part 231. In other words, the non-molding regions 213 of the wiring board 21 are located at the left, right, and rear sides of the chip mounting part 231.
Fig. 6A and 6B show a second modification of the molded photosensitive assembly 20 according to the first preferred embodiment of the present invention, in which the connection portion 234 of the molded base 23 of the molded photosensitive assembly 20 has a chip connection end 2341 and a lens connection end 2342, wherein the chip connection end 2341 of the connection portion 234 is integrally connected to the chip mounting portion 231, the lens connection end 2342 of the connection portion 234 is integrally connected to the lens mounting portion 232, and the connection portion 234 is tapered to extend from the lens connection end 2342 to the chip connection end 2341 such that a thickness at the lens connection end 2342 of the connection portion 234 is greater than a thickness of the chip connection end 2341 of the connection portion 234, to enhance a connection strength and an anti-deformation capability of the connection portion 234 while preventing the connection portion 234 from protruding from the chip mounting surface 2301, so as to stably maintain good parallelism of the chip 2301 and the lens mounting surface 2.
Further, since the connection portion 234 is tapered to extend from the lens connection end 2342 to the chip connection end 2341, that is, the thickness at the lens connection end 2342 of the connection portion 234 is greater than the thickness of the chip connection end 2341 of the connection portion 234, a portion corresponding to the connection portion 234 in the molding space 403 of the molding die 400 is also tapered so that the molding material injected into the molding space 403 flows from the portion corresponding to the lens mounting portion 232 into the portion corresponding to the chip mounting portion 231, so that the molding material easily fills the entire molding space 403 and is solidified on the circuit board 21 to form the molding base 23.
According to another aspect of the present invention, the present invention further provides a method for manufacturing an image capturing module. Specifically, as shown in fig. 7, the method for manufacturing the camera module 1 includes the steps of:
s1, forming a molding base 23 on a circuit board 21 through a molding process, wherein the molding base 23 provides a flat chip mounting surface 2301 and a lens mounting surface 2302;
S2, mounting a photosensitive element 22 to the chip mounting face 2301 of the molded base 23 with the photosensitive face 220 of the photosensitive element 22 held parallel to the lens mounting face 2302, and
And S3, conductively connecting the photosensitive element 22 and the circuit board 21 to manufacture the molded photosensitive assembly 20.
Preferably, in the step S1, the chip mounting surface 2301 and the lens mounting surface 2302 of the molding base 23 are parallel to each other.
More specifically, the step S1 includes the steps of:
placing the circuit board 21 in a second mold 402 of a molding mold 400;
Closing a first mold 401 and the second mold 402 of the molding mold 400 to form a molding space 403 of the molding mold 400 between the first mold 401 and the second mold 402, and
A molding material is added to the molding space 403 of the molding die 400 to form the molding base 23 of the circuit board 21 after the molding material is cured.
It should be noted that in the step S1, the method further includes the steps of:
pressing the first mold 401 onto a non-molding region 213 of the circuit board 21 via a pressing surface 4011;
correspondingly forming a chip mounting portion molding space 4031 in a chip molding region 211 of the circuit board 21;
Correspondingly forming a lens mounting portion molding space 4032 in a lens molding region 212 of the circuit board 21, wherein the non-molding region 213 is located between the chip molding region 211 and the lens molding region 212, and
A connection molding space 4033 is correspondingly formed in a connection molding region 215 of the circuit board 21, wherein the connection molding space 4033 communicates the chip mounting portion molding space 4031 and the lens mounting portion molding space 4032 to form the molding space 403 having an integral structure.
Preferably, in the step S1, the method further includes the step of:
In the lens mount molding space 4032, a lens mount 232 is formed to cover the lens molding region 212 of the wiring board 21 such that a top surface of the lens mount 232 forms the lens mount face 2302;
In the chip-mounting-portion forming space 4031, a chip mounting portion 231 is formed to cover the chip molding region 211 of the wiring board 21 such that a top surface of the chip mounting portion 231 forms the chip mounting surface 2301, and
In the connection part forming space 4033, a connection part 234 is formed to cover the connection molding region 215 of the wiring board 21, wherein the connection part 234 is integrally connected to the chip mounting part 231 and the lens mounting part 232 to form the molding base 23 having an integral structure.
More preferably, in the step S1, the method further includes the step of:
Pouring the molding material into the lens mounting portion molding space 4032 of the molding space 403, and
The molding material is guided from the lens mount molding space 4032 to flow into the chip mount molding space 4031 through the connecting portion molding space 4033 so that the molding material fills the molding space 403. Further, as shown in fig. 7, the method for manufacturing the camera module 1 further includes the steps of:
S4, mounting an optical lens 10 on the lens mounting surface 2302 of the molding base 23, and making the optical axis of the optical lens 10 perpendicular to the photosensitive surface 220 of the photosensitive element 22 to manufacture the image pickup module 1.
In particular, referring to FIG. 8 of the drawings, a molded photosensitive assembly 20A according to a second preferred embodiment of the present invention is shown. The molded photosensitive assembly 20A according to the second preferred embodiment of the present invention is different from the first preferred embodiment of the present invention in that the chip mounting portion 231A of the molded base 23A of the molded photosensitive assembly 20A includes at least two sub-chip mounting portions 2311A spaced apart from each other and a separation gap 2312A is formed between the adjacent sub-chip mounting portions 2311A to alleviate stress applied to the chip mounting portions 231A by the wiring board 21 through the separation gap 2312A and to disperse stress applied to the chip mounting portions 231A to the at least two sub-chip mounting portions 2311A to reduce stress applied to each of the sub-chip mounting portions 2311A so as to avoid deformation of each of the sub-chip mounting portions 2311A, so that the chip mounting portions 231A of the molded base 23A are not deformed with deformation of the wiring board 21 to ensure that the chip 2301 and the lens mounting surface 2302 remain parallel to each other. Further, each of the sub-chip mounting parts 2311A is integrally connected to the lens mounting part 232 through the corresponding connection part 234, respectively, so that the molding base 23A has an integrated structure, facilitating the formation of the molding base 23A by one molding.
Illustratively, as shown in fig. 8, the separation gap 2312A of the chip mounting part 231A is arranged in a "straight" shape to separate the chip mounting part 231A into front and rear two sub-chip mounting parts 2311A, wherein the circuit board 21 can perform concentrated deformation at the separation gap 2312A to reduce concentrated stress applied to the sub-chip mounting parts 2311A by the circuit board 21, so that the sub-chip mounting parts 2311A are not deformed due to receiving smaller concentrated stress, thereby effectively preventing the chip mounting parts 231A from being deformed due to receiving larger stress.
Further, fig. 9 shows a first modification of the molded photosensitive assembly 20A according to the second preferred embodiment of the present invention, in which the separation gaps 2312A of the chip mounting portions 231A of the molded base 23A of the molded photosensitive assembly 20A are arranged in a "cross" shape to separate the chip mounting portions 232A into four sub-chip mounting portions 2311A, in which the molded base 23A has two of the connection portions 234, in which the sub-chip mounting portions 2311A are grouped in pairs, and each of the sub-chip mounting portions 231A is integrally connected to the lens mounting portions 232 by one of the connection portions 234, respectively, so that the molded base 23A can be ensured to still have an integral structure to maintain the chip mounting surfaces 2301 and the lens mounting surfaces 2 while increasing the volume of the separation gaps 2312A of the molded base 23A to further alleviate the stress applied by the circuit board 21 to the chip mounting portions 231A.
Further, fig. 10 shows a second modification of the molded photosensitive assembly 20A according to the second preferred embodiment of the present invention, in which the molded base 23A of the molded photosensitive assembly 20A has four connection portions 234, wherein each connection portion 234 integrally connects the corresponding sub-chip mounting portion 2311A and the lens mounting portion 232, respectively, to ensure that the molded base 23A has a unitary structure.
It is to be noted that, since the separation gap 2312A of the chip mounting section 231A of the molding base 23A is a gap or a blank space, that is, the separation gap 2312A is not filled with the molding material during molding, and the separation gap 2312A corresponds to the chip molding region 211 of the circuit board 21, the first mold 401 of the molding mold 400 is directly pressed against the chip molding region 211 of the circuit board 21 through the separation gap 2312A during molding, so that the circuit board 21 is stably and smoothly held in the molding mold 400, thereby effectively preventing the circuit board 21 from being inclined or deformed due to uneven stress, so that the molding base 23A with high quality is obtained.
Of course, in some other embodiments of the present invention, the separation gap 2312A may be provided in an "X" shape or a "m" shape to separate the chip mounting part 231A into a plurality of the sub-chip mounting parts 2311A and reduce stress applied to the chip mounting part 231A in other directions by the wiring board 21 through the separation gap 2312A. It should be understood that the shape of the first mold 401 is designed and manufactured according to the shape of the molding base 23A, and that the corresponding first mold 401 is manufactured and used as to what the molding base 23A is, and the shape of the first mold 401 is not limited in the present invention.
It should be noted that, in the second preferred embodiment of the present invention, the other structures of the molded photosensitive assembly 20A are the same as those of the molded photosensitive assembly 20 according to the first preferred embodiment of the present invention except for the above-mentioned structures, and the molded photosensitive assembly 20A also has various modified embodiments similar to or the same as those of the molded photosensitive assembly 20 of the first preferred embodiment, and will not be described again.
Since the adhesive material has a certain fluidity before curing to form the adhesive layer 26, and the adhesive material flows to cause the thickness of the adhesive layer 26 to be uneven, the inclination of the photosurface 220 of the photosensitive element 22 is easily caused, and the parallelism between the photosurface 220 of the photosensitive element 22 and the chip mounting surface 2301 is reduced, so that in order to ensure that the photosurface 220 of the photosensitive element 22 and the chip mounting surface 2301 maintain a good parallel relationship, the invention prevents the photosurface 220 of the photosensitive element 22 from being inclined by providing a receiving groove for receiving the adhesive material to inhibit the flow of the adhesive material.
Specifically, FIGS. 11A and 11B illustrate a molded photosensitive assembly 20B according to a third preferred embodiment of the present invention. The molded photosensitive assembly 20B according to the second preferred embodiment of the present invention is different from the first preferred embodiment of the present invention in that the chip mounting portion 231B of the molded base 23B of the molded photosensitive assembly 20B has at least one receiving groove 2313B, wherein each of the receiving grooves 2313B is recessed downward from the chip mounting surface 2301 to form a recess for receiving the adhesive layer 26 so as to fixedly mount the photosensitive element 22 to the chip mounting portion 231B through the adhesive layer 26 such that the photosensitive element 22 is closely adhered to the chip mounting surface 2301 of the chip mounting portion 231B, so that the photosensitive surface 220 of the photosensitive element 22 is stably maintained in parallel with the chip mounting surface 2301 against tilting of the photosensitive surface 220 of the photosensitive element 22 mounted to the chip mounting surface 2301 due to the flow of the adhesive material forming the adhesive layer 26. In other words, when the photosensitive element 22 is mounted to the chip mounting portion 231B, the adhesive layer 26 adheres the photosensitive element 22 and the chip mounting portion 231B together, and the chip mounting surface 2301 of the chip mounting portion 231B supports the photosensitive element 22, since the chip mounting portion 231B has strong rigidity and flatness, it is possible to ensure that the photosensitive surface 220 of the photosensitive element 22 remains parallel to the chip mounting surface 2301.
It should be noted that although fig. 11A and 11B and the following description take the shape of the cross section of the receiving groove 2313B as an example, the characteristics and advantages of the receiving groove 2313B of the present invention are described, and those skilled in the art will understand that the shape of the receiving groove 2313B disclosed in fig. 11A and 11B and the following description is merely an example, which does not limit the content and scope of the present invention, for example, in other examples of the molded photosensitive assembly 20B of the third preferred embodiment of the present invention, the shape of the cross section of each of the receiving grooves 2313B may be implemented in various shapes such as square, rectangle, trapezoid, triangle, oval, ring, or polygon.
As shown in fig. 11A and 11B, for example, the chip mounting portion 231B is provided with one accommodation groove 2313B, and when the photosensitive element 22 is mounted on the chip mounting surface 2301, the adhesive layer 26 is accommodated in the accommodation groove 2313B of the chip mounting portion 231B, and the photosensitive element 22 is supported on the chip mounting portion 231B having a relatively high rigidity, so that the adhesive layer 26 does not affect the flatness of the photosensitive surface 220 of the photosensitive element 22 to ensure that the photosensitive surface 220 of the photosensitive element 22 remains parallel to the chip mounting surface 2301.
Preferably, as shown in fig. 11B, the receiving groove 2313B is located at the center of the chip mounting part 231B, so that the adhesive layer 26 received in the receiving groove 2313B applies a uniform adhesive force to the photosensitive element 22, so as to prevent the photosensitive element 22 from being warped due to uneven stress.
It is noted that, since the receiving groove 2313B of the chip mounting portion 231A of the molding base 23A is a through-hole type groove, and the receiving groove 2313B corresponds to the central position of the chip molding region 211 of the circuit board 21, that is, the receiving groove 2313B is not filled with the molding material during molding, the first mold 401 of the molding mold 400 is directly pressed against the central position of the chip molding region 211 of the circuit board 21 through the receiving groove 2313B during molding, so that the circuit board 21 is stably and smoothly held in the molding mold 400, thereby effectively preventing the circuit board 21 from being inclined or deformed due to uneven stress, so that the molding base 23A of high quality is obtained.
It should be appreciated that in some other embodiments of the present invention, the chip mounting part 231B is provided with two or more of the receiving grooves 2313B, and all of the receiving grooves 2313B are uniformly arranged in an array to ensure that the adhesive layer 26 received in the receiving grooves 2313B applies uniform adhesive force to the photosensitive element 22.
Fig. 12A and 12B show a first modification of the molded photosensitive assembly 20B according to the third preferred embodiment of the present invention, in which the chip mounting portion 231B of the molded base 23B of the molded photosensitive assembly 20B includes two receiving grooves 2313B, and each of the receiving grooves 2313B is arranged in a concentric ring, that is, two receiving grooves 2313B are arranged in a surrounding manner (one receiving groove 2313B surrounds the other receiving groove 2313B, i.e., a ring-shaped nested structure) to the chip mounting portion 231B so that the chip mounting surface 2301 of the chip mounting portion 231B applies a uniform supporting force to the photosensitive element 22 while the adhesive layer 26 received in the receiving groove 2313B applies a uniform adhesive force to the photosensitive element 22, thereby preventing the photosensitive element 22 from being warped due to uneven stress.
It should be understood that although fig. 12A and 12B and the description of the modified embodiment take the example in which the chip mounting portion 231B includes two receiving grooves 2313B as an example, features and advantages of the chip mounting portion 231B of the present invention are described, those skilled in the art will appreciate that the chip mounting portion 231B disclosed in fig. 12A and 12B and the description of the modified embodiment is merely an example, and does not limit the content and scope of the present invention, for example, in other examples of the molded photosensitive assembly 20B of the first modified embodiment of the third preferred embodiment of the present invention, the number of the receiving grooves 2313B may be more than two to form a circumferential ring of nested grooves.
Fig. 13A to 13C show a second modification of the molded photosensitive assembly 20B according to the third preferred embodiment of the present invention, in which the receiving groove 2313B is recessed downward from the chip mounting face 2301 to the wiring board 21 to form a through-hole type recess for receiving the adhesive layer 26, wherein the adhesive layer 26 adheres the photosensitive element 22, the chip mounting face 231B and the wiring board 21 together when the photosensitive element 22 is mounted on the chip mounting face 231B, so as to fixedly mount the photosensitive element 22 to the chip mounting face 2301. In other words, as shown in fig. 13B, the accommodating groove 2313B is penetratingly provided to the chip mounting part 231B, and an upper opening of the accommodating groove 2313B is located at the chip mounting surface 2301, and a lower opening of the accommodating groove 2313B corresponds to the wiring board 21, so that the adhesive layer 26 accommodated in the accommodating groove 2313B can simultaneously contact the photosensitive element 22, the chip mounting part 231B and the wiring board 21 to adhere the photosensitive element 22, the chip mounting part 231B and the wiring board 21 together.
It should be noted that, since the receiving groove 2313B is implemented as a through-hole type recess, as shown in fig. 13C, a pressing head 4012 of the first mold 401 of the molding mold 400 presses a portion of the chip molding region 211 of the circuit board 21 during molding, so that the pressing head 4012 of the first mold 401 and the pressing surface 4011 cooperate with each other to ensure the overall flatness of the circuit board 21, so as to provide a flat molding base surface for the molding process of the molding base 23, and ensure a good flatness of the chip mounting surface 2301 of the molding base 23.
Preferably, the receiving groove 2313B is located at a central region of the chip mounting part 231B, that is, the receiving groove 2313B corresponds to a central portion of the chip molding region 211 of the circuit board 21, such that the pressing head 4012 of the first die 401 is pressed against the central portion of the chip molding region 211 of the circuit board 21 during molding, and is pressed against an outer side of the chip molding region 211 of the circuit board 21 through the pressing surface 4011 of the first die 401, so that flatness of the circuit board 21 is further ensured. It should be understood that since the indenter 4012 of the first die 401 is pressed against the central portion of the chip molding region 211 during molding and the indenter 4012 is located in the chip mount molding space 4031, the space corresponding to the indenter 4012 in the chip mount molding space 4031 forms the accommodation groove 2313B of the chip mount 231B due to absence of molding material, that is, a chip non-molding region is formed due to non-molding in the central portion of the chip molding region 211 of the wiring board 21 while the molding material is solidified to form the chip mount 231B.
It should be noted that, compared to the first preferred embodiment of the present invention, in this embodiment of the present invention, the method for manufacturing the molded photosensitive assembly 20B further includes the steps of:
By a pressing head 4012 of the first die 401, it is pressed against a central portion of the chip molding region 211 of the wiring board 21 to form a receiving groove 2313B in the chip mounting portion 231B after the molding material is cured. Fig. 14A and 14B show a third variant embodiment of the molded photosensitive assembly 20B according to the third preferred embodiment of the present invention, wherein the chip mounting portion 231B includes two through-hole type receiving grooves 2313B, and each of the receiving grooves 2313B is provided in a "back" shape to divide the chip mounting portion 231B into two sub-chip mounting portions 2311B sleeved in a ring by the two receiving grooves 2313B, wherein the two sub-chip mounting portions 2311B are integrally connected to form the chip mounting portion 231B having an integral structure. In other words, one of the two accommodation grooves 2313B is located at the center of the chip mounting part 231B, the other of the two accommodation grooves 2313B is located around one of the two accommodation grooves 2313B, and one of the sub-chip mounting parts 2311B is formed between the two accommodation grooves 2313B, and the other of the sub-chip mounting parts 2311B is formed at the outer periphery of the other of the accommodation grooves 2313B, wherein the other of the two accommodation grooves 2313B has a "C" shaped structure such that the sub-chip mounting part 2311B located between the two accommodation grooves 2313B is integrally connected with the other sub-chip mounting part 2311B, ensuring that the chip mounting part 231B has an integral structure so as to make the chip mounting part 231B by one molding, thereby ensuring that the chip mounting part 231B provides the flat chip mounting surface 2301.
It should be noted that, in the third preferred embodiment of the present invention, the other structures of the molded photosensitive assembly 20B are the same as those of the molded photosensitive assembly 20 according to the first preferred embodiment of the present invention except for the above-mentioned structures, and the molded photosensitive assembly 20B also has various modified embodiments similar to or the same as those of the molded photosensitive assembly 20 of the first preferred embodiment, and will not be described again.
Referring to fig. 15A and 15B, according to another aspect of the present invention, there is further provided an electronic apparatus, wherein the electronic apparatus includes an electronic apparatus body 500 and at least one camera module 1, wherein each camera module is respectively disposed on the electronic apparatus body 500 for acquiring an image. It should be noted that the type of the electronic device body 500 is not limited, and for example, the electronic device body 500 may be any electronic device capable of being configured with the camera module 1, such as a smart phone, a tablet computer, a notebook computer, an electronic book, a personal digital assistant, a camera, etc. It will be appreciated by those skilled in the art that although the electronic device body 500 is illustrated in fig. 15A and 15B as being implemented as a smart phone, it is not intended to limit the scope and content of the present invention.
Illustratively, as shown in fig. 15A, the camera module 1 is disposed on the electronic device body 500 and faces the front side of the electronic device body 500, so that the camera module 1 is used as a front camera of the electronic device for shooting a space object on the front side of the electronic device body 500.
In addition, as shown in fig. 15B, the camera module 1 is disposed on the electronic device body 500 and faces the rear side of the electronic device body 500, so that the camera module 1 is used as a rear camera of the electronic device for shooting a space object on the rear side of the electronic device body 500.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are by way of example only and are not limiting. The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the examples and embodiments of the invention may be modified or practiced without departing from the principles described.
Claims (29)
1. A molded photosensitive assembly for assembly with an optical lens to form a camera module, comprising:
A circuit board;
A photosensitive element, wherein the photosensitive element is conductively connected with the circuit board, and
A molded base, wherein the molded base is formed on the circuit board in a molded manner and provides a flat chip mounting surface and a flat lens mounting surface, wherein the photosensitive element is correspondingly mounted on the chip mounting surface of the molded base, and the lens mounting surface of the molded base is provided for correspondingly mounting the optical lens so that the optical lens is located in a photosensitive path of the photosensitive element, wherein the molded base comprises a chip mounting portion having the chip mounting surface, a lens mounting portion having the lens mounting surface, and a plurality of connection portions, wherein the connection portions have a lens connecting end and a chip connecting end, wherein the lens connecting end of the connection portions is integrally connected with the chip mounting portion, and the chip connecting end of the connection portions is integrally connected with the chip mounting portion, wherein the connection portions taper from the lens connecting end to the chip connecting end.
2. The molded photosensitive assembly of claim 1, wherein the chip mounting face and the lens mounting face provided by the molded base are parallel to each other.
3. The molded photosensitive assembly of claim 2, wherein the lens mount is located around the chip mount.
4. A molded photosensitive assembly as defined in claim 3, wherein said circuit board is provided with a chip molding area, a lens molding area, a non-molding area and at least one set of circuit board connectors, wherein said lens molding area is located around said chip molding area, said non-molding area is located between said chip molding area and said lens molding area, each set of said circuit board connectors is disposed on said non-molding area of said circuit board, said chip mounting portion of said molded base is wrapped around said chip molding area of said circuit board after molding on said circuit board, and said lens mounting portion of said molded base is wrapped around said lens molding area of said circuit board.
5. The molded photosensitive assembly of claim 4, wherein the circuit board is further provided with a connection molding area, wherein the connection molding area is located between the lens molding area and the chip molding area and communicates the lens molding area and the chip molding area, and the connection portion of the molded base is coated on the connection molding area of the circuit board after molding on the circuit board so as to integrate the lens mounting portion and the chip mounting portion through the connection portion.
6. A molded photosensitive assembly as defined in claim 3, wherein the thickness of said chip mounting portion is less than the thickness of said lens mounting portion.
7. The molded photosensitive assembly of claim 4, wherein a thickness of the chip mounting portion is less than a thickness of the lens mounting portion.
8. The molded photosensitive assembly of claim 5, wherein a thickness of the chip mounting portion is less than a thickness of the lens mounting portion.
9. A molded photosensitive assembly as defined in claim 5, wherein said chip mounting portion of said molded base includes at least two mutually spaced sub-chip mounting portions and a separation gap is formed between adjacent ones of said sub-chip mounting portions, wherein each of said sub-chip mounting portions is integrally connected to said lens mounting portion by a respective one of said connecting portions.
10. A molded photosensitive assembly as defined in claim 9, wherein said separation gap is arranged in a "one-line" configuration to separate said chip mounting portion into two said sub-chip mounting portions.
11. The molded photosensitive assembly of claim 9, wherein said separation gap is arranged in a "cross" shape to separate said chip mounting portion into four said sub-chip mounting portions.
12. The molded photosensitive assembly of claim 11, wherein the four sub-chip mounting portions are grouped in pairs, and each group of the sub-chip mounting portions is integrally connected to the lens mounting portion by the same connecting portion.
13. The molded photosensitive assembly of any of claims 3-5, further comprising an adhesive layer, wherein the chip mounting portion of the molded base comprises at least one receiving groove, and each of the receiving grooves is recessed downwardly from the chip mounting surface to form a recess for receiving the adhesive layer to fixedly mount the photosensitive element to the chip mounting surface of the chip mounting portion via the adhesive layer.
14. The molded photosensitive assembly of claim 13, wherein each of the receiving grooves is disposed in an array arrangement at the chip mounting portion.
15. The molded photosensitive assembly of claim 13, wherein each of the receiving grooves is disposed in a circumferential arrangement at the chip mounting portion.
16. The molded photosensitive assembly of claim 13, wherein each of said receiving slots extends downwardly from said chip mounting face to said circuit board to form a through-hole type of said recess for bonding said photosensitive element, said chip mounting portion and said circuit board together by said adhesive layer.
17. The molded photosensitive assembly of claim 16, wherein each of said receiving slots is arranged in a "back" shape to divide said chip mounting portion into two sub-chip mounting portions by said receiving slots, wherein said two sub-chip mounting portions are integrally connected to form said chip mounting portion having an integral structure.
18. The molded photosensitive assembly of claim 4 or 5, further comprising a set of electronic components, wherein the electronic components are mounted to the lens molding region of the circuit board at intervals to encase the electronic components by the lens mount portion of the molded base.
19. The molded photosensitive assembly of claim 4 or 5, further comprising at least one set of leads, wherein said photosensitive element comprises a photosensitive region, a non-photosensitive region, and at least one set of die connectors, wherein said non-photosensitive region is located around said photosensitive region, and each set of said die connectors is disposed at said non-photosensitive region of said photosensitive element, respectively, to conductively connect said die connectors with corresponding said circuit board connectors via said leads.
20. The molded photosensitive assembly of any of claims 1-5, wherein the chip mounting surface of the molded base is lower than the lens mounting surface.
21. A camera module, its characterized in that includes:
An optical lens, and
The molded photosensitive assembly of any of claims 1-20, wherein the optical lens is correspondingly mounted to the lens mounting surface of the molded photosensitive assembly, wherein an optical axis of the optical lens is perpendicular to a photosensitive surface of the photosensitive element.
22. An electronic device, comprising:
An electronic equipment body, and
At least one camera module, wherein the camera module is disposed on the electronic device body for obtaining an image, wherein the camera module is the camera module according to claim 21.
23. A method of manufacturing a molded photosensitive assembly, comprising the steps of:
Forming a molded base on a circuit board by a molding process, wherein the molded base provides a flat chip mounting surface and a flat lens mounting surface;
mounting a photosensitive element to the chip mounting surface of the molded base, and
Conductively connecting the photosensitive element and the circuit board to form a molded photosensitive assembly,
Wherein the step of forming a molded base on a circuit board by a molding process, wherein the molded base provides a flat chip mounting surface and a flat lens mounting surface, comprises the steps of:
Placing the circuit board on a second die of a forming die;
Closing a first mold and the second mold of the molding mold to form a molding space of the molding mold between the first mold and the second mold, and
Adding a molding material to the molding space of the molding die to integrally form the molding base on the wiring board after the molding material is cured,
Wherein the step of closing a first mold and the second mold of the molding mold to form a molding space of the molding mold between the first mold and the second mold comprises the steps of:
Pressing the circuit board on a non-molding area by using a pressing surface of the first die;
correspondingly forming a chip mounting part forming space in a chip molding area of the circuit board;
Correspondingly forming a lens mounting part forming space in a lens molding area of the circuit board, wherein the non-molding area is positioned between the chip molding area and the lens molding area, and
Correspondingly forming a connecting part forming space in a connecting molding area of the circuit board, wherein the connecting part forming space communicates the chip mounting part forming space and the lens mounting part forming space to form the forming space with an integrated structure,
Wherein the step of adding a molding material to the molding space of the molding die to integrally form the molding base on the wiring board after the molding material is cured, comprises the steps of:
forming a lens mounting part coated on the lens molding area of the circuit board in the lens mounting part molding space so that the top surface of the lens mounting part forms the lens mounting surface;
Forming a chip mounting part in the chip mounting part forming space and covering the chip molding area of the circuit board so that the top surface of the chip mounting part forms the chip mounting surface, and
In the connection part forming space, a plurality of connection parts are formed to cover the connection molding area of the circuit board, wherein the connection parts are integrally connected to the chip mounting part and the lens mounting part to form the molding base having an integrated structure, wherein the connection parts have a lens connection end and a chip connection end, wherein the lens connection end of the connection parts is integrally connected with the lens mounting part, and the chip connection end of the connection parts is integrally connected with the chip mounting part, wherein the connection parts are tapered to extend from the lens connection end to the chip connection end.
24. The method of manufacturing a molded photosensitive assembly of claim 23, further comprising the steps of:
and pressing a central part of the chip molding area of the circuit board by a pressing head of the first die.
25. The method of manufacturing a molded photosensitive assembly of claim 24, further comprising the steps of:
after the molding material is cured, a receiving groove is formed in the chip mounting portion.
26. The method of manufacturing a molded photosensitive assembly of claim 24, further comprising the steps of:
after the molding material is cured, a separation gap is formed at the chip mounting portion, wherein the separation gap separates the chip mounting portion into at least two mutually spaced sub-chip mounting portions.
27. The method of manufacturing a molded photosensitive assembly according to claim 23, wherein said step of adding a molding material to said molding space of said molding die to integrally form said molded base on said wiring board after said molding material is cured, comprises the steps of:
Pouring the molding material into the molding space of the lens mounting part of the molding space, and
And guiding the molding material to flow into the chip mounting part molding space from the lens mounting part molding space through the connecting part molding space so as to fill the molding space with the molding material.
28. The method of manufacturing a molded photosensitive assembly of claim 23, wherein said chip mounting face and said lens mounting face are parallel to each other.
29. The method of manufacturing a molded photosensitive assembly of claim 23, wherein said chip mounting surface is lower than said lens mounting surface.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810651876.0A CN110636186B (en) | 2018-06-22 | 2018-06-22 | Molded photosensitive component and camera module and manufacturing method thereof and electronic device |
| PCT/CN2019/092439 WO2019242771A1 (en) | 2018-06-22 | 2019-06-22 | Molded photosensitive assembly, camera module, and manufacturing method therefor, and electronic device |
| CN201980037485.2A CN112272943B (en) | 2018-06-22 | 2019-06-22 | Molded photosensitive component and camera module, manufacturing method thereof, and electronic device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810651876.0A CN110636186B (en) | 2018-06-22 | 2018-06-22 | Molded photosensitive component and camera module and manufacturing method thereof and electronic device |
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| CN110636186A CN110636186A (en) | 2019-12-31 |
| CN110636186B true CN110636186B (en) | 2024-12-31 |
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| CN201980037485.2A Active CN112272943B (en) | 2018-06-22 | 2019-06-22 | Molded photosensitive component and camera module, manufacturing method thereof, and electronic device |
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| CN113132586B (en) * | 2020-01-10 | 2022-09-09 | 宁波舜宇光电信息有限公司 | Photosensitive chip assembly, camera module and electronic equipment |
| CN113132585B (en) * | 2020-01-10 | 2022-09-09 | 宁波舜宇光电信息有限公司 | Photosensitive chip assembly, mobile terminal, camera module and preparation method thereof |
| CN111902007B (en) * | 2020-09-18 | 2021-11-30 | 宜宾市极米光电有限公司 | Electronic equipment |
| CN118803407B (en) * | 2024-09-13 | 2024-12-17 | 宁波舜宇光电信息有限公司 | Molded base, camera module and electronic equipment |
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Also Published As
| Publication number | Publication date |
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| CN110636186A (en) | 2019-12-31 |
| CN112272943A (en) | 2021-01-26 |
| CN112272943B (en) | 2022-03-22 |
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