CN114170925A - Display module and manufacturing method thereof - Google Patents
Display module and manufacturing method thereof Download PDFInfo
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- CN114170925A CN114170925A CN202111483992.4A CN202111483992A CN114170925A CN 114170925 A CN114170925 A CN 114170925A CN 202111483992 A CN202111483992 A CN 202111483992A CN 114170925 A CN114170925 A CN 114170925A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
- H10D86/443—Interconnections, e.g. scanning lines adapted for preventing breakage, peeling or short circuiting
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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Abstract
The application provides a display module and a manufacturing method thereof. According to the manufacturing method of the display module, the adhesive layer covering the first binding terminals is manufactured on the display panel, the adhesive layer is provided with the metal particles, and the melting point of the metal particles is smaller than the melting points of the first binding terminals and the second binding terminals on the binding component. And respectively aligning and hot-pressing the second binding terminals with the first binding terminals to melt a plurality of metal particles between the second binding terminals and the first binding terminals to form metal connecting terminals for connecting the second binding terminals and the first binding terminals. The force of connection between the first binding terminal and the metal connecting terminal and the force of connection between the second binding terminal and the metal connecting terminal are metal bonding forces, so that the drawing force between the chip on film or the flexible circuit board and the first binding terminal can be increased, and the connection stability between the chip on film or the flexible circuit board and the first binding terminal is improved.
Description
Technical Field
The application relates to the technical field of display devices, in particular to a display module and a manufacturing method thereof.
Background
In a conventional glass substrate display device, a Chip On Film (COF) or a Flexible Printed Circuit (FPC) is bonded to a Bonding Pad of a display panel, and a signal is input into the display panel. In the prior art, an Anisotropic Conductive Film (ACF) is usually disposed between a flip chip or a flexible circuit board and a bonding terminal, the flip chip or the flexible circuit board and the bonding terminal are connected by heating and pressing to form a stable physical and electrical connection, and then a peelable blue glue (Tuffy glue) is coated at the connection position to increase the water and oxygen resistance. However, in order to realize an ultra-narrow bezel, the width of the non-display area of the display panel in the prior art is set to be smaller than 300 μm, and the size of the bonding terminal is also reduced accordingly, which causes a problem of insufficient pull-out force between the flip chip film or the flexible circuit board and the bonding terminal.
Disclosure of Invention
The application provides a display module and a manufacturing method thereof, which are used for solving the problem that the drawing force between a flip chip film or a flexible circuit board and a binding terminal in the display module in the prior art is insufficient.
In one aspect, the present application provides a method for manufacturing a display module, including:
providing a display panel, wherein the display panel is provided with a display area and a non-display area surrounding the display area, the display panel comprises a plurality of first binding terminals arranged on the non-display area, and the first binding terminals are made of metal materials;
manufacturing an adhesive layer covering the first binding terminals on the display panel, wherein the adhesive layer is provided with a plurality of metal particles;
providing a binding component, wherein the binding component is a chip on film or a flexible circuit board, the binding component is provided with a plurality of second binding terminals, the second binding terminals are made of metal materials, and the melting point of the metal particles is smaller than the melting points of the first binding terminals and the second binding terminals;
and respectively aligning and hot-pressing the second binding terminals with the first binding terminals to melt the metal particles between the second binding terminals and the first binding terminals, so as to form the metal connecting terminal for connecting the second binding terminals and the first binding terminals.
In some possible implementations, the aligning and hot-pressing the plurality of second binding terminals with the plurality of first binding terminals, respectively, includes:
aligning the plurality of second binding terminals with the plurality of first binding terminals, respectively;
pressing the plurality of second binding terminals with the plurality of first binding terminals respectively, wherein a preset distance is reserved between the second binding terminals and the first binding terminals, so that the plurality of metal particles are located between the second binding terminals and the first binding terminals;
heating the second binding terminal, the first binding terminal, and the metal particles to melt a plurality of the metal particles between the second binding terminal and the first binding terminal.
In some possible implementations, before the heating the second binding terminal, the first binding terminal, and the metal particles, the manufacturing method further includes:
preheating the second binding terminal, the first binding terminal and the metal particles, wherein the preheating temperature is less than a melting point of the metal particles.
In some possible implementations, the material of the metal particles is tin, and the material of the second binding terminal is copper.
In some possible implementations, the material of the first binding terminal is copper.
In some possible implementations, the adhesive layer is filled between two adjacent first binding terminals, between two adjacent metal connecting terminals, and between two adjacent second binding terminals.
On the other hand, this application still provides a display module assembly, includes:
the display panel is provided with a display area and a non-display area surrounding the display area, and comprises a plurality of first binding terminals arranged on the non-display area and an adhesive layer covering the first binding terminals;
the binding component is a chip on film or a flexible circuit board, a plurality of second binding terminals are arranged on the binding component, and the first binding terminals and the second binding terminals are made of metal materials;
have a plurality of metal connecting terminal in the glue film, it is a plurality of metal connecting terminal respectively with a plurality of first binding terminal and a plurality of the terminal connection is bound to the second, just the glue film with first binding terminal metal connecting terminal with the terminal bonding is bound to the second.
In some possible implementations, the metal connection terminal is made of tin, and the second binding terminal is made of copper.
In some possible implementations, the material of the first binding terminal is copper.
In some possible implementations, the adhesive layer is filled between two adjacent first binding terminals, between two adjacent metal connecting terminals, and between two adjacent second binding terminals.
The application provides a manufacturing method of display module assembly, through the glue film that covers a plurality of first terminals of binding of preparation on display panel, have a plurality of metal particles in the glue film, the melting point of metal particle is less than the melting point that binds terminal and second on the part and bind the terminal. And respectively aligning and hot-pressing the second binding terminals with the first binding terminals to melt a plurality of metal particles between the second binding terminals and the first binding terminals to form metal connecting terminals for connecting the second binding terminals and the first binding terminals. Because the first binding terminal, the metal connecting terminal and the second binding terminal are made of metal materials, the force for connecting the first binding terminal and the metal connecting terminal and the force for connecting the second binding terminal and the metal connecting terminal are metal bonding forces, compared with the prior art that the first binding terminal and the second binding terminal are connected through the anisotropic conductive film, the force for connecting the first binding terminal and the anisotropic conductive film and the force for connecting the second binding terminal and the anisotropic conductive film are covalent bonding forces, the metal bonding force of the application is greater than the covalent bonding force, the pulling force between the chip on film or the flexible circuit board and the first binding terminal can be increased, and the connection stability between the chip on film or the flexible circuit board and the first binding terminal can be improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a flowchart illustrating a method for manufacturing a display module according to an embodiment of the present disclosure;
fig. 2 is a schematic view illustrating a manufacturing method of a display module according to an embodiment of the present disclosure;
fig. 3 is a schematic view of a display module according to an embodiment of the present disclosure;
fig. 4 is a cross-sectional view of a display module according to an embodiment of the disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
Referring to fig. 1 to 4, an embodiment of the present application provides a method for manufacturing a display module, including:
step S1, providing a display panel 1, where the display panel 1 has a display area 11 and a non-display area 12 surrounding the display area 11, the display panel 1 includes a plurality of first binding terminals 13 disposed on the non-display area 12, and the first binding terminals 13 are made of a metal material;
step S2, manufacturing an adhesive layer 2 covering the plurality of first binding terminals 13 on the display panel 1, wherein the adhesive layer 2 has a plurality of metal particles 21;
step S3, providing a binding component 3, where the binding component 3 is a chip on film or a flexible circuit board, the binding component 3 has a plurality of second binding terminals 31, the second binding terminals 31 are made of a metal material, and the melting point of the metal particles 21 is smaller than the melting points of the first binding terminals 13 and the second binding terminals 31;
step S4, the plurality of second binding terminals 31 are respectively aligned with the plurality of first binding terminals 13 and hot pressed to melt the plurality of metal particles 21 between the second binding terminals 31 and the first binding terminals 13, so as to form the metal connection terminal 22 connecting the second binding terminals 31 and the first binding terminals 13.
Note that, by forming the adhesive layer 2 covering the plurality of first binding terminals 13 on the display panel 1, the adhesive layer 2 has the plurality of metal particles 21 therein, and the plurality of metal particles 21 can be diffused in the adhesive layer 2, that is, the metal particles 21 have fluidity in the adhesive layer 2. The metal particles 21 are small in size, in a micro-scale or nano-scale, a large amount of positive charges or negative charges are accumulated on the surfaces of the metal particles 21, the plurality of metal particles 21 are easily attracted to each other and are agglomerated, and the second binding terminal 31 and the first binding terminal 13 are also made of metal materials and are also attracted to the metal particles 21, so that the metal particles 21 are easily located between the second binding terminal 31 and the first binding terminal 13, that is, the plurality of metal particles 21 are easily agglomerated between the second binding terminal 31 and the first binding terminal 13. The plurality of second binding terminals 31 are respectively aligned and hot pressed with the plurality of first binding terminals 13, and since the melting point of the metal particles 21 is smaller than the melting points of the first binding terminals 13 and the second binding terminals 31, only the plurality of metal particles 21 between the second binding terminals 31 and the first binding terminals 13 are melted, and the metal connecting terminal 22 connecting the second binding terminals 31 and the first binding terminals 13 is formed. Because the first binding terminal 13, the metal connecting terminal 22 and the second binding terminal 31 are all made of metal materials, the connecting force between the first binding terminal 13 and the metal connecting terminal 22 and the connecting force between the second binding terminal 31 and the metal connecting terminal 22 are all metal bonding forces, compared with the prior art that the first binding terminal 13 and the second binding terminal 31 are connected through an anisotropic conductive film, the connecting force between the first binding terminal 13 and the anisotropic conductive film and the connecting force between the second binding terminal 31 and the anisotropic conductive film are both covalent bonding forces, the metal bonding force of the present application is greater than the covalent bonding forces, the pull-out force between the chip on film or the flexible circuit board and the first binding terminal 13 can be increased, and the connection stability between the chip on film or the flexible circuit board and the first binding terminal 13 can be improved.
In addition, the present application adopts a metal bonding force to connect the first binding terminal 13, the metal connection terminal 22 and the second binding terminal 31, and under the requirement of the same pull-out force, since the metal bonding force of the present application is greater than the covalent bonding force of the prior art, the size of the first binding terminal 13 of the present application can be smaller than the size of the first binding terminal 13 of the prior art, thereby realizing an ultra-narrow bezel of the display panel 1 (for example, setting the width of the non-display region 12 to be less than 300 μm).
In addition, after the plurality of second binding terminals 31 are aligned and thermally pressed with the plurality of first binding terminals 13, respectively, the adhesive layer 2 is squeezed and flows towards the peripheries of the second binding terminals 31 and the first binding terminals 13, so that the adhesive layer 2 adheres the second binding terminals 31, the first binding terminals 13 and the metal connecting terminals 22 from the sides of the second binding terminals 31, the first binding terminals 13 and the metal connecting terminals 22, and the pull force between the chip on film or the flexible printed circuit board and the first binding terminals 13 is further increased. And the glue layer 2 is not conductive, and the plurality of metal particles 21 are easily agglomerated between the second binding terminals 31 and the first binding terminals 13, so that there are few metal particles 21 between two adjacent second binding terminals 31, or between two adjacent first binding terminals 13, or even there are no metal particles 21, and short circuit between two adjacent second binding terminals 31 or two adjacent first binding terminals 13 can be avoided.
In some embodiments, referring to fig. 2, after step S4, because the adhesive layer 2 is squeezed and the adhesive layer 2 has fluidity, the adhesive layer 2 is also filled between two adjacent first binding terminals 13, two adjacent metal connecting terminals 22, and two adjacent second binding terminals 31, so that gaps between two adjacent first binding terminals 13, two adjacent metal connecting terminals 22, and two adjacent second binding terminals 31 are filled with the adhesive layer 2, which can block water and oxygen and improve the waterproof and oxygen-proof capability of the display module, and there is no need to coat a peelable blue glue (i.e., a Tuffy glue) on the first binding terminals 13, the metal connecting terminals 22, and the second binding terminals 31.
In some embodiments, the glue layer 2 may be a super absorbent resin (SAP) glue. Of course, the glue layer 2 may be another type of glue as long as the plurality of metal particles 21 can be diffused in the glue layer 2, and the application is not limited herein.
The embodiment of the application does not do specific restriction to the being suitable for of display module assembly, and it can be any product or part that has display function such as TV set, notebook computer, panel computer, wearable display device (like intelligent bracelet, intelligent wrist-watch etc.), cell-phone, virtual reality equipment, augmented reality equipment, on-vehicle demonstration, advertising light boxes.
In some embodiments, the display panel 1 may be a liquid crystal display panel 1 or an OLED (organic electroluminescent) display panel 1, and the first binding terminal 13 is fabricated on a TFT (thin film transistor) substrate of the display panel 1, the TFT substrate including an active layer, a first metal layer, a second metal layer, an anode, and an interlayer dielectric layer formed therebetween. The first metal layer may include a gate and a first binding terminal 13 spaced apart, i.e., the first binding terminal 13 may be fabricated in the first metal layer, the second metal layer may include a source and a drain connected to the gate, and the anode may be connected to the drain. Alternatively, the first metal layer may include a gate, and the second metal layer may include a source and a drain connected to the gate, and a first binding terminal 13 spaced apart from the source and the drain, i.e., the first binding terminal 13 may be fabricated in the second metal layer. Of course, the first binding terminal 13 may also be fabricated in other metal layers, and the application is not limited herein.
In some embodiments, the binding member 3 further has a flexible substrate, for example, a PI (polyimide) flexible substrate, on which the plurality of second binding terminals 31 are fabricated.
In some embodiments, the step S4 of hot-pressing the plurality of second binding terminals 31 in alignment with the plurality of first binding terminals 13, respectively, includes:
step S41 aligns the plurality of second binding terminals 31 with the plurality of first binding terminals 13, respectively.
That is, each second binding terminal 31 is aligned with one first binding terminal 13 such that the orthographic projection of the second binding terminal 31 on the display panel 1 overlaps the orthographic projection of the first binding terminal 13 on the display panel 1.
Step S42, pressing the plurality of second binding terminals 31 with the plurality of first binding terminals 13 respectively, wherein a preset distance is provided between the second binding terminals 31 and the first binding terminals 13, so that the plurality of metal particles 21 are located between the second binding terminals 31 and the first binding terminals 13.
That is, when the second binding terminal 31 is pressed against the first binding terminal 13, the second binding terminal 31 contacts the adhesive layer 2 and maintains a predetermined distance from the first binding terminal 13, so that a space is formed between the second binding terminal 31 and the first binding terminal 13 to accommodate the agglomerated metal particles 21.
Step S43, the second binding terminal 31, the first binding terminal 13, and the metal particles 21 are heated to melt the plurality of metal particles 21 located between the second binding terminal 31 and the first binding terminal 13.
That is, the agglomerated plurality of metal particles 21 between the second binding terminal 31 and the first binding terminal 13 may be melted into one body to form the metal connection terminal 22 connecting the second binding terminal 31 and the first binding terminal 13.
In this embodiment, the preset pitch in step S42 may be set according to the size of the metal particles 21, for example, when the size (i.e., diameter) of the metal particles 21 is 2 to 3 μm, the preset pitch may be 6 to 8 μm.
The heating manner in step S43 may be infrared light heating or hot plate heating. Of course, other heating methods may be used, and the application is not limited thereto.
The heating temperature in step S43 may be a temperature corresponding to the melting point of the metal particle 21, for example, when the metal particle 21 is tin, the heating temperature may be between 220 and 250 ℃, and the time may be specifically set according to the actual situation, for example, 120 and 150 seconds.
In this embodiment, before the step S43 of heating the second binding terminal 31, the first binding terminal 13, and the metal particle 21, the manufacturing method further includes: the second binding terminal 31, the first binding terminal 13 and the metal particles 21 are preheated, wherein the preheated temperature is less than the melting point of the metal particles 21. The preheating serves to primarily heat the second binding terminals 31, the first binding terminals 13, and the metal particles 21 before the step S43, and the heating time in the step S43 can be reduced, thereby preventing the loss of the display panel 1 due to long-time high-temperature heating. In addition, the glue layer 2 is also heated in the preheating process, so that the flowability of the metal particles 21 in the glue layer 2 is improved, and the plurality of metal particles 21 can be quickly gathered between the second binding terminal 31 and the first binding terminal 13, so that the manufacturing efficiency is improved.
In this embodiment, the preheating mode may be infrared light preheating or hot plate preheating. Of course, other preheating methods may be used, and the present application is not limited thereto. The preheating temperature can be set according to the melting point of the metal particles 21, for example, when the metal particles 21 are tin, the preheating temperature can be between 110 ℃ and 130 ℃, and the time can be specifically set according to the actual situation, for example, 50-60 seconds.
In some embodiments, the material of the metal particles 21 is tin, and the material of the second binding terminal 31 is copper. The metal connection terminal 22 is also tin, the connection force between the second binding terminal 31 and the metal connection terminal 22 is copper-tin (Cu-Sn) bonding force, and the copper-tin bonding force is greater than the covalent bonding force in the prior art, so that the connection stability between the second binding terminal 31 and the metal connection terminal 22 can be improved. And the melting point of tin is much smaller than that of copper so as not to damage the second binding terminal 31 when melting the plurality of metal particles 21.
In this embodiment, the metal particles 21 may be made of metallic tin, or the metal particles 21 may be made of a tin paste, for example, SnBi (tin bismuth) tin paste. Of course, the metal particles 21 may be made of other materials containing tin, as long as the metal connection terminals 22 can be formed by melting the plurality of metal particles 21, and the present application is not limited thereto.
In this embodiment, the material of the first binding terminal 13 is copper. That is, the force of connection between the first binding terminal 13 and the metal connection terminal 22 is also a copper-tin bonding force, which is greater than the covalent bonding force of the prior art, and the connection stability between the first binding terminal 13 and the metal connection terminal 22 can be improved. Moreover, the connecting force between the first binding terminal 13 and the metal connecting terminal 22 and the connecting force between the second binding terminal 31 and the metal connecting terminal 22 are both copper-tin bonding force, so that the first binding terminal 13, the metal connecting terminal 22 and the second binding terminal 31 are connected stably, and the drawing force between the chip on film or the flexible circuit board and the first binding terminal 13 is increased.
In some embodiments, in step S2, the adhesive layer 2 can be made by ink-jet printing or blade coating.
Referring to fig. 1 to 4, based on the above manufacturing method of the display module, an embodiment of the present invention further provides a display module, including:
the display device comprises a display panel 1, wherein the display panel 1 is provided with a display area 11 and a non-display area 12 surrounding the display area 11, and the display panel 1 comprises a plurality of first binding terminals 13 arranged on the non-display area 12 and an adhesive layer 2 covering the first binding terminals 13;
the binding component 3 is a chip on film or a flexible circuit board, the binding component 3 is provided with a plurality of second binding terminals 31, and the first binding terminals 13 and the second binding terminals 31 are made of metal materials;
the adhesive layer 2 has a plurality of metal connection terminals 22 therein, the plurality of metal connection terminals 22 are connected to the plurality of first binding terminals 13 and the plurality of second binding terminals 31, respectively, and the adhesive layer 2 is bonded to the first binding terminals 13, the metal connection terminals 22, and the second binding terminals 31.
The metal connection terminal 22 is formed by melting the plurality of metal particles 21 in the adhesive layer 2. The plurality of metal particles 21 in the glue layer 2 may be diffused in the glue layer 2, i.e. the metal particles 21 have a flow in the glue layer 2. The metal particles 21 are small in size, in a micro-scale or nano-scale, a large amount of positive charges or negative charges are accumulated on the surfaces of the metal particles 21, the plurality of metal particles 21 are easily attracted to each other and are agglomerated, and the second binding terminal 31 and the first binding terminal 13 are also made of metal materials and are also attracted to the metal particles 21, so that the metal particles 21 are easily located between the second binding terminal 31 and the first binding terminal 13, that is, the plurality of metal particles 21 are easily agglomerated between the second binding terminal 31 and the first binding terminal 13. The plurality of second binding terminals 31 are respectively aligned and hot pressed with the plurality of first binding terminals 13, and since the melting point of the metal particles 21 is smaller than the melting points of the first binding terminals 13 and the second binding terminals 31, only the plurality of metal particles 21 between the second binding terminals 31 and the first binding terminals 13 are melted, and the metal connecting terminal 22 connecting the second binding terminals 31 and the first binding terminals 13 is formed. Because the first binding terminal 13, the metal connecting terminal 22 and the second binding terminal 31 are all made of metal materials, the connecting force between the first binding terminal 13 and the metal connecting terminal 22 and the connecting force between the second binding terminal 31 and the metal connecting terminal 22 are all metal bonding forces, compared with the prior art that the first binding terminal 13 and the second binding terminal 31 are connected through an anisotropic conductive film, the connecting force between the first binding terminal 13 and the anisotropic conductive film and the connecting force between the second binding terminal 31 and the anisotropic conductive film are both covalent bonding forces, the metal bonding force of the present application is greater than the covalent bonding forces, the pull-out force between the chip on film or the flexible circuit board and the first binding terminal 13 can be increased, and the connection stability between the chip on film or the flexible circuit board and the first binding terminal 13 can be improved.
In addition, the present application adopts a metal bonding force to connect the first binding terminal 13, the metal connection terminal 22 and the second binding terminal 31, and under the requirement of the same pull-out force, since the metal bonding force of the present application is greater than the covalent bonding force of the prior art, the size of the first binding terminal 13 of the present application can be smaller than the size of the first binding terminal 13 of the prior art, thereby realizing an ultra-narrow bezel of the display panel 1 (for example, setting the width of the non-display region 12 to be less than 300 μm).
In addition, the adhesive layer 2 may bond the second bonding terminal 31, the first bonding terminal 13 and the metal connection terminal 22 from the side surfaces of the second bonding terminal 31, the first bonding terminal 13 and the metal connection terminal 22, so as to further increase the pull-out force between the flip chip film or the flexible circuit board and the first bonding terminal 13.
In some embodiments, the material of the metal connection terminal 22 is tin, and the material of the second binding terminal 31 is copper. The connection force between the second binding terminal 31 and the metal connection terminal 22 is copper-tin (Cu-Sn) bonding force, which is greater than the covalent bonding force in the prior art, and the connection stability between the second binding terminal 31 and the metal connection terminal 22 can be improved. And the melting point of tin is much smaller than that of copper so as not to damage the second binding terminal 31 when melting the plurality of metal particles 21.
In this embodiment, the material of the first binding terminal 13 is copper. That is, the force of connection between the first binding terminal 13 and the metal connection terminal 22 is also a copper-tin bonding force, which is greater than the covalent bonding force of the prior art, and the connection stability between the first binding terminal 13 and the metal connection terminal 22 can be improved. Moreover, the connecting force between the first binding terminal 13 and the metal connecting terminal 22 and the connecting force between the second binding terminal 31 and the metal connecting terminal 22 are both copper-tin bonding force, so that the first binding terminal 13, the metal connecting terminal 22 and the second binding terminal 31 are connected stably, and the drawing force between the chip on film or the flexible circuit board and the first binding terminal 13 is increased.
In some embodiments, referring to fig. 4, the adhesive layer 2 is further filled between two adjacent first binding terminals 13, two adjacent metal connecting terminals 22, and two adjacent second binding terminals 31, so that gaps between two adjacent first binding terminals 13, two adjacent metal connecting terminals 22, and two adjacent second binding terminals 31 are filled with the adhesive layer 2, which can block water and oxygen and improve the waterproof and oxygen-proof capability of the display module, and a peelable blue adhesive (i.e., a Tuffy adhesive) in the prior art is not required to be coated on the first binding terminals 13, the metal connecting terminals 22, and the second binding terminals 31.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments. In a specific implementation, each unit or structure may be implemented as an independent entity, or may be combined arbitrarily to be implemented as one or several entities, and the specific implementation of each unit or structure may refer to the foregoing method embodiment, which is not described herein again.
The display module and the manufacturing method thereof provided by the embodiment of the present application are described in detail above, a specific example is applied in the description to explain the principle and the implementation manner of the embodiment of the present application, and the description of the embodiment is only used to help understand the technical scheme and the core idea of the embodiment of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
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| CN202111483992.4A CN114170925A (en) | 2021-12-07 | 2021-12-07 | Display module and manufacturing method thereof |
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| CN115132100A (en) * | 2022-07-19 | 2022-09-30 | 京东方科技集团股份有限公司 | Display module and display device |
| CN115377043A (en) * | 2022-08-09 | 2022-11-22 | 武汉华星光电半导体显示技术有限公司 | Display module and manufacturing method thereof |
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