CN114154858A - A Sampling Method to Improve the Performance Testing Efficiency of Ceramic Substrates - Google Patents
A Sampling Method to Improve the Performance Testing Efficiency of Ceramic Substrates Download PDFInfo
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Abstract
A sampling method for improving the performance detection efficiency of a ceramic substrate comprises the following steps: collecting customer quality requirements including total number of contacts on the ceramic substrate, level of rejectable quality, and consumer risk; step 2: the manufacturer sets the detection quality requirements, including acceptable quality level and producer risk; and step 3: formulating a sampling scheme according to the quality requirements of customers and the detection quality requirements of manufacturers, and determining the number of sample contacts and the threshold value of the number of non-conductive contacts required in the sampling scheme; and 4, step 4: and (4) carrying out contact on-off test by using a flying probe machine to obtain the number of non-conductive contacts. The sampling detection scheme can be rapidly formulated according to the requirements of customers, the number of the detected contacts is greatly reduced while the defective rate of finished products delivered to the customers is kept to meet the requirements, the detection time can be effectively saved, the production efficiency is improved, and the economic benefit is very high.
Description
Technical Field
The application relates to a detection technology of a direct copper plating substrate (DPC substrate), in particular to a sampling method for improving the performance detection efficiency of a ceramic substrate.
Background
The direct copper plating ceramic substrate (DPC substrate) is a common packaging substrate in the electronic industry, and is mainly technically characterized in that: depositing a metal seed layer on the surface of the cleaned ceramic substrate by using a vacuum sputtering technology, completing circuit manufacturing by photoetching, developing and etching processes, plating copper in an electroplating/chemical plating mode and the like, and completing circuit manufacturing after removing photoresist. The DPC substrate has the advantages of good heat conduction and heat resistance, good insulating property, high circuit precision and the like, and is commonly used for manufacturing power device packages such as Light Emitting Diodes (LEDs), Lasers (LDs) and the like.
When evaluating the quality of DPC substrates, an important index is the on-off of contacts (vertical vias) on the substrate. Due to the requirement of packaging technology, the contacts on the DPC substrate need to be capable of conducting the front and back sides of the substrate with each other, mainly through punching through holes on the DPC substrate and then filling the through holes with electroplated copper. Due to the process limitation during the electroplating process, defects may be generated during the hole filling process, so that the contacts cannot be conducted (disconnected). In order to improve the quality and efficiency of subsequent packaging, the number of non-conductive contacts on the substrate is required to be not more than a certain proportion, otherwise, the whole substrate is judged to be defective.
At present, DPC substrate manufacturing enterprises adopt a full-inspection method for detecting the on-off of substrate contacts, that is, a flying probe machine is used to detect the on-off of each contact on a substrate one by one (100% detection), and if the proportion of the contacts on the substrate which are not electrified reaches a certain degree, the substrate is determined to be a defective product. The method has long detection time and low detection efficiency, and limits the production efficiency.
The above prior art has the following disadvantages: the contact on-off detection of the traditional DPC substrate adopts a full detection mode, so that the time is too long, and the production efficiency of a production line is limited.
Disclosure of Invention
In order to solve the problem that the detection efficiency is low due to the fact that the existing DPC substrate adopts a full detection mode for the contact on-off performance, the application provides a sampling method for improving the performance detection efficiency of a ceramic substrate. The following technical scheme is adopted:
a sampling method for improving the performance detection efficiency of a ceramic substrate comprises the following specific steps:
step 1: collecting customer quality requirements including total number of contacts on the ceramic substrate, level of rejectable quality, and consumer risk;
step 2: the manufacturer sets the detection quality requirements, including acceptable quality level and producer risk;
and step 3: formulating a sampling scheme according to the quality requirements of customers and the detection quality requirements of manufacturers, and determining the number of sample contacts and the threshold value of the number of non-conductive contacts required in the sampling scheme;
and 4, step 4: using a flying probe machine to carry out contact on-off test to obtain the number of non-conductive contacts;
and 5: and (4) comparing the non-conductive contact number obtained by the test in the step (4) with the non-conductive contact number threshold value obtained in the step (3) to obtain a sampling result of whether the ceramic substrate is qualified or not.
The rejectable quality level in step 1 refers to the customer's criteria for determining whether the ceramic substrate is defective, and the consumer risk refers to the maximum batch defect rate allowed in all the products accepted by the customer.
The acceptable quality level in the step 2 refers to that the contact of the ceramic substrate is not conductive actually in the trial production process of a manufacturer, and the risk of a manufacturer refers to the maximum proportion of accepted qualified finished products which are mistakenly detected as defective products and are determined by the manufacturer according to the cost requirement;
and (4) according to the quality requirement data of the customer and the detection quality requirement data of the manufacturer, making the size of the specific required sample contact point number and the threshold value of the non-conductive contact point number in the sampling scheme. The sample contact number refers to the number of samples required to be extracted in one sampling inspection when the sampling inspection is performed. If the number of the non-conductive contacts in the extracted sample contacts is higher than the threshold value of the number of the non-conductive contacts, the chip substrate is judged to be defective and repaired or scrapped, otherwise, further judgment is needed.
Optionally, in step 2, the size of the number of sample contacts and the threshold of the number of non-conductive contacts required by the sampling scheme are generated by Minitab software, and the specific steps are as follows: and (2) running sample acceptance according to attributes of Minitab software, selecting and creating a sampling plan, inputting the total number of contacts of the customer quality requirement in the step (1) into the batch size, inputting the refusable quality level into the refusable quality level LTPD, inputting the consumer risk into the consumer risk Beta, inputting the acceptable quality level of the quality detection requirement in the step (2) into the acceptable quality level AQL, inputting the producer risk into the producer risk Alpha, and running the software to obtain the number of samples and the acceptance number of the sampling scheme, wherein the number of the samples is the number of the contacts of the samples, and the acceptance number is the threshold value of the number of non-conducting contacts.
By adopting the technical scheme, the corresponding data of the customer quality requirement and the manufacturer detection quality requirement are specifically input to the relevant positions in the created sampling plan interface of the Minitab software according to the attribute sampling acceptance, and the number of samples and the acceptance number of the sampling scheme can be obtained by operating the software, wherein the number of the samples is the size of the number of the sample contacts, and the acceptance number is the threshold value of the number of the non-conducting contacts.
Optionally, the non-conductive contact number threshold is a maximum non-conductive contact number allowed by the flying probe machine to perform the contact on-off test on the sampled contacts, and if the actually tested non-conductive contact number exceeds the non-conductive contact number threshold, the ceramic substrate is determined to be a defective product.
By adopting the technical scheme, the threshold value of the number of the non-conductive contacts is set, when the number of the non-conductive contacts obtained by using a flying probe machine to carry out the contact on-off test is larger than the threshold value of the number of the electric contacts, the substrate is judged to be a defective product, and if the number of the non-conductive contacts obtained by the test is not larger than the threshold value of the number of the electric contacts, further judgment is needed.
Optionally, when the Minitab software is operated to generate the sampling scheme, a sampling characteristic (OC) curve graph and an average total verification number (ATI) comparison table are also generated.
By adopting the technical scheme, the sampling scheme in the step 2 is evaluated through a sampling characteristic (OC) curve graph so as to judge the probability that the batch of products can pass the acceptance check of a customer under the condition that the sampling scheme is adopted and the actual batch of defective products are different.
The generation of a table of total number of Average Tests (ATI) provides a reference for the criteria of the retest protocol.
When the defective rate of the product is the acceptable quality level AQL, if the defective detected according to the definition of the sampling scheme is rechecked and the rechecking mode is full detection, after all the products are checked according to the sampling scheme, the average touch point quantity value required to be detected by each product is the average total checking number (ATI) value, which is called ATI value for short. The increase of ATI value means the extension of detection time, and under the condition of not influencing detection accuracy rate, the detection time is reduced as far as possible to reduce detection cost, so that the selection of a proper rechecking threshold value is an important factor for judging whether the sampling method is proper or not.
Optionally, the following method is specifically adopted in step 5 to determine the sampling result: if the number of the non-conductive contacts obtained by the flying probe machine test is larger than the threshold value of the number of the non-conductive contacts, judging that the ceramic substrate is a defective product; if the number of the non-conductive contacts obtained by the test is less than or equal to the threshold value of the number of the non-conductive contacts, whether the retest is needed is further judged according to an average total inspection number (ATI) comparison table.
By adopting the technical scheme, because the defect points are uniformly distributed on the ceramic substrate, the detection points are extracted without considering the interval and distribution factors, and the points can be randomly selected. In order to simplify the programming of the flying probe machine, a continuous point taking mode is adopted. Specifically, starting from any one of the corner points on the four corners of the substrate, sequentially taking the number of contacts equal to the number of sample contacts for conducting on-off test, if the number of non-conductive contacts in the contacts is larger than the threshold value of the number of non-conductive contacts, determining that the substrate is a defective product and is scrapped or repaired, and if the number of non-conductive contacts obtained through the test is smaller than or equal to the threshold value of the number of non-conductive contacts, further determining whether to need to be rechecked according to an average total inspection number (ATI) comparison table.
Optionally, the specific method for determining whether the retest is needed is: defining the total number of contacts as n, setting the average total inspection number (ATI) as ATI, setting the number of non-conductive contacts in the step 4 as e, setting the threshold value of the number of non-conductive contacts as x, setting ATI to be not less than 35% and not more than 45% n, reading the comparison table of the average total inspection number (ATI), finding out the average total inspection number (ATI) meeting the requirement, setting the number of non-conductive contacts corresponding to the average total inspection number (ATI) as a rechecking threshold value k, and when k is more than e and not more than x, rechecking the ceramic substrate.
By adopting the technical scheme, the probability of missed detection exists inevitably in the spot inspection, when the number of nonconducting signals detected by the aircraft is close to the threshold value of the number of nonconducting outgoing points, if the missed detection exists, the risk of mistakenly detecting defective products as qualified products exists, so the sampling scheme needs to set the rechecking threshold value k, however, the smaller the rechecking threshold value k is, the larger the number of contact points needing to be rechecked is, the larger the corresponding ATI value is, the increased ATI value means the prolongation of the detection time, under the condition of not influencing the detection accuracy rate, the detection time is shortened as far as possible, and the reduction of the detection cost is the original intention of formulating the sampling scheme. Therefore, after comprehensive consideration, the scheme is optimal when the average total inspection number (ATI) is in the interval of 35% to 45% of the total contact number n, the average total inspection number (ATI) meeting the requirement is found by reading the comparison table of the average total inspection number (ATI), the non-conductive contact number corresponding to the average total inspection number (ATI) is set as a rechecking threshold value k, and when k is less than or equal to e and less than or equal to x, the ceramic substrate needs to be rechecked.
Optionally, the retest method is to detect all the contacts of the ceramic substrate, and when the retest contact defective rate is smaller than the quality level that can be rejected, the ceramic substrate is determined to be a qualified product, otherwise, the ceramic substrate is determined to be a defective product.
By adopting the technical scheme, the ceramic substrate meeting the re-inspection condition is continuously re-inspected in a full-inspection mode, the ratio of the number of the non-conductive contacts to the total number of the contacts of the re-inspection is the defective contact rate of the ceramic substrate, when the defective contact rate is less than the quality level which can be rejected, the ceramic substrate is judged to be a qualified product, otherwise, the ceramic substrate is judged to be a defective product.
In summary, the present application includes at least one of the following beneficial technical effects:
the invention provides a sampling method for improving the performance detection efficiency of a ceramic substrate, which can rapidly formulate a sampling detection scheme according to the requirements of customers, and the detection scheme greatly reduces the number of detected contacts while maintaining the defective rate meeting the requirements of finished products delivered to the customers, reduces the possibility of false detection and missed detection as much as possible, can effectively save the detection time, improves the production efficiency and has high economic benefit.
Drawings
FIG. 1 is a schematic flow diagram of the present invention.
FIG. 2 is a schematic diagram of a software parameter setting interface for generating a sampling plan by using Minitab software in step 2 according to the present invention;
FIG. 3 is a graph of spot check characteristics (OC) for one embodiment of the present invention;
FIG. 4 is a schematic diagram of a flying probe machine of the present invention sampling for contact continuity testing;
FIG. 5 is a schematic diagram of a Minitab software parameter setting interface comparing empirical protocols in accordance with the present invention;
FIG. 6 is a graph of spot check characteristics (OC) for a comparative empirical protocol of the present invention;
FIG. 7 is a schematic diagram of a Minitab software parameter set-up interface according to another comparative experience of the present invention;
FIG. 8 is a graph of spot check characteristics (OC) for another comparative empirical mode of the present invention;
Detailed Description
The present application is described in further detail below with reference to figures 1-8.
The embodiment of the application discloses a sampling method for improving the performance detection efficiency of a ceramic substrate.
Referring to fig. 1-8, a sampling method for improving the performance detection efficiency of a ceramic substrate includes the following specific steps:
step 1: collecting customer quality requirements including total number of contacts on the ceramic substrate, level of rejectable quality, and consumer risk;
step 2: the manufacturer sets the detection quality requirements, including acceptable quality level and producer risk;
and step 3: formulating a sampling scheme according to the quality requirements of customers and the detection quality requirements of manufacturers, and determining the number of sample contacts and the threshold value of the number of non-conductive contacts required in the sampling scheme;
and 4, step 4: using a flying probe machine to carry out contact on-off test to obtain the number of non-conductive contacts;
and 5: and (4) comparing the non-conductive contact number obtained by the test in the step (4) with the non-conductive contact number threshold value obtained in the step (3) to obtain a sampling result of whether the ceramic substrate is qualified or not.
The rejectable quality level in step 1 refers to the customer's criteria for determining whether the ceramic substrate is defective, and the consumer risk refers to the maximum batch defect rate allowed in all the products accepted by the customer.
The acceptable quality level in the step 2 refers to that the contact of the ceramic substrate is not conductive actually in the trial production process of a manufacturer, and the risk of a manufacturer refers to the maximum proportion of accepted qualified finished products which are mistakenly detected as defective products and are determined by the manufacturer according to the cost requirement;
and (4) according to the quality requirement data of the customer and the detection quality requirement data of the manufacturer, making the size of the specific required sample contact point number and the threshold value of the non-conductive contact point number in the sampling scheme. The sample contact number refers to the number of samples required to be extracted in one sampling inspection when the sampling inspection is performed. If the number of the non-conductive contacts in the extracted sample contacts is higher than the threshold value of the number of the non-conductive contacts, the chip substrate is judged to be defective and repaired or scrapped, otherwise, further judgment is needed.
In step 2, the contact number size and the non-conductive contact number threshold value of the required sample of the sampling scheme are generated by using Minitab software, and the specific steps are as follows: and (2) running the Minitab software to perform sampling acceptance according to attributes, selecting and creating a sampling plan, inputting the total number of contacts of the customer quality requirement in the step (1) into the batch size, inputting the refusal quality level into the refusal quality level LTPD, inputting the consumer risk into the consumer risk Beta, inputting the acceptable quality level required by the detection quality in the step (2) into the acceptable quality level AQL, inputting the producer risk into the producer risk Alpha, and running the software to obtain the number of samples and the acceptance number of the sampling scheme, wherein the number of the samples is the number of the contacts of the samples, and the acceptance number is the threshold value of the number of the non-conducting contacts.
And inputting corresponding customer quality requirements and manufacturer detection quality requirement data to relevant positions in a sampling plan interface created by the Minitab software according to attribute sampling acceptance, and operating the software to obtain the number of samples and the acceptance number of the sampling scheme, wherein the number of the samples is the size of the number of sample contacts, and the acceptance number is the threshold value of the number of non-conductive contacts.
The non-conductive contact point threshold is the maximum non-conductive contact point allowed by the contact on-off test performed by using a flying probe machine in the sampled contacts, and if the actually tested non-conductive contact point exceeds the non-conductive contact point threshold, the ceramic substrate is determined to be a defective product.
And setting a threshold value of the number of non-conductive contacts, judging that the substrate is a defective product when the number of the non-conductive contacts obtained by using a flying probe machine to perform a contact on-off test is greater than the threshold value of the number of the electrical contacts, and if the number of the non-conductive contacts obtained by the test is not greater than the threshold value of the number of the electrical contacts, further judging.
When the Minitab software is operated to generate a sampling scheme, a sampling characteristic (OC) curve graph and an average total inspection number (ATI) comparison table are also generated.
And (3) evaluating the sampling scheme in the step (2) through a sampling characteristic (OC) graph to judge the probability that the batch of products can be accepted by the customer under the condition that the sampling scheme is adopted and the actual batch of products has different defective rates.
The generation of a table of total number of Average Tests (ATI) provides a reference for the criteria of the retest protocol.
When the defective rate of the product is the acceptable quality level AQL, if the defective detected according to the definition of the sampling scheme is rechecked and the rechecking mode is full detection, after all the products are checked according to the sampling scheme, the average touch point quantity value required to be detected by each product is the average total checking number (ATI) value, which is called ATI value for short. The increase of ATI value means the extension of detection time, and under the condition of not influencing detection accuracy rate, the detection time is reduced as far as possible to reduce detection cost, so that the selection of a proper rechecking threshold value is an important factor for judging whether the sampling method is proper or not.
In step 5, the following method is specifically adopted to judge the sampling result: if the number of the non-conductive contacts obtained by the flying probe machine test is larger than the threshold value of the number of the non-conductive contacts, judging that the ceramic substrate is a defective product; if the number of the non-conductive contacts obtained by the test is less than or equal to the threshold value of the number of the non-conductive contacts, whether the retest is needed is further judged according to an average total inspection number (ATI) comparison table.
Because the defect points are uniformly distributed on the ceramic substrate, the detection points are extracted without considering the interval and distribution factors, and the points can be randomly selected. In order to simplify the programming of the flying probe machine, a continuous point taking mode is adopted. Specifically, starting from any one of the corner points on the four corners of the substrate, sequentially taking the number of contacts equal to the number of sample contacts for conducting on-off test, if the number of non-conductive contacts in the contacts is larger than the threshold value of the number of non-conductive contacts, determining that the substrate is a defective product and is scrapped or repaired, and if the number of non-conductive contacts obtained through the test is smaller than or equal to the threshold value of the number of non-conductive contacts, further determining whether to need to be rechecked according to an average total inspection number (ATI) comparison table.
The specific method for judging whether the retest is needed is as follows: defining the total number of contacts as n, the average total inspection number (ATI) as ATI, the number of non-conductive contacts in step 4 as e, the threshold value of the number of non-conductive contacts as x, setting ATI not less than 35% and not more than 45% n, reading the comparison table of the average total inspection number (ATI), finding out the average total inspection number (ATI) meeting the requirement, setting the number of non-conductive contacts corresponding to the average total inspection number (ATI) as a rechecking threshold value k, and when k is more than e and not more than x, rechecking the ceramic substrate.
Because the probability of missed detection inevitably exists in the spot inspection, when the number of nonconducting signals detected by the aircraft is close to the threshold value of the number of nonconducting outgoing points, if the missed detection exists, the risk of mistakenly detecting defective products as qualified products exists, so the sampling scheme needs to set a rechecking threshold value k, however, the smaller the rechecking threshold value k is, the larger the number of contact points needing to be rechecked is, the larger the corresponding ATI value is, the increase of the ATI value means the extension of the detection time, under the condition of not influencing the detection accuracy, the detection time is shortened as far as possible, and the reduction of the detection cost is the original purpose of formulating the sampling scheme. Therefore, after comprehensive consideration, the scheme is optimal when the average total inspection number (ATI) is in the interval of 35% to 45% of the total contact number n, the average total inspection number (ATI) meeting the requirement is found by reading the comparison table of the average total inspection number (ATI), the non-conductive contact number corresponding to the average total inspection number (ATI) is set as a rechecking threshold value k, and when k is less than or equal to e and less than or equal to x, the ceramic substrate needs to be rechecked.
The rechecking method is to detect all the contacts of the ceramic substrate, when the defective rate of the rechecked contacts is less than the quality level which can be rejected, the ceramic substrate is judged to be qualified, otherwise, the ceramic substrate is judged to be defective.
And continuously rechecking the ceramic substrate meeting the rechecking condition in a full-inspection mode, wherein the ratio of the number of non-conductive contacts to the total number of contacts for rechecking is the defective rate of the contacts of the ceramic substrate, when the defective rate of the contacts is less than the quality level which can be rejected, the ceramic substrate is judged to be a qualified product, otherwise, the ceramic substrate is judged to be a defective product.
The sampling method for improving the performance detection efficiency of the ceramic substrate in the embodiment of the application has the implementation principle that:
the collected customer requirements are: total number of contacts on substrate: 728, a consumer risk of 5%, a rejectable quality level of 5%, a factory-set acceptable quality level of 1% and a producer risk of 2.5%,
run sample acceptance by attribute of Minitab software, choose to create a sampling plan, enter acceptable quality level AQL (in%) in sample acceptance by attribute for acceptable quality level of 1%, enter rejectable quality level LTPD (in%), enter total contact number 728 on ceramic substrate to batch size n, producer risk 2.5% to producer risk Alpha, consumer risk 5% to consumer risk Beta. The Minitab software is run to derive the number of samples 208 and the acceptance number 5, where the number of samples 208 is the number of contacts of the sample to be sampled, the acceptance number 5 is the threshold of the number of non-conductive contacts, the specific input interface is shown in fig. 2, and the generated sampling scheme and the sampling characteristic (OC) graph is shown in fig. 3.
The average total assay number (ATI) generated simultaneously is shown in table 1:
TABLE 1
| Number of non-conductive contacts | Total number of |
| 2 | 387.4 |
| 3 | 289.5 |
| 4 | 238.8 |
| 5 | 217.9 |
Setting 35% n and ATI not more than 45% n, substituting n into 728, obtaining 254.8 and ATI not more than 327.6, reading an average total inspection number (ATI) comparison table, finding that the average total inspection number (ATI) meeting the requirement is 289.5, the number of non-conductive contacts corresponding to the average total inspection number (ATI)289.5 is 3, namely setting a rechecking threshold value k to be 3, and when e is more than 3 and not more than 5, rechecking the ceramic substrate, namely when the number of the non-conductive contacts is detected to be 4 and 5, rechecking the ceramic substrate in a full-inspection mode.
After the sample contact number size 208, the non-conductive contact threshold value 5 and the re-inspection threshold value 3 of the sampling scheme are obtained, the batch of ceramic substrates are detected, the single ceramic substrates to be detected are clamped on the flying probe machine in sequence, the test track of the flying probe machine is set to be from any one corner point on four corners of the ceramic substrates to be detected, the test is performed in sequence, the detection track is shown in figure 4, the test contact number is set to be the sample contact number 208, and the flying probe machine can be started to complete the test.
And (4) performing spot inspection on 208 contact points, and judging the substrate as a defective product if the number of the defect points is more than 5.
After the test is finished, obtaining the number of non-conductive contacts, and if the number of the non-conductive contacts is 0-3, directly judging the ceramic substrate to be a qualified product;
and if the number of the non-conductive contacts is 4 or 5, re-checking the ceramic substrate, wherein the ratio of the number of the re-checked non-conductive contacts to the total number of the contacts is the defective rate of the ceramic substrate, when the defective rate of the contacts is less than 5% of the quality level of refusal, the ceramic substrate is judged to be a qualified product, otherwise, the ceramic substrate is judged to be a defective product.
And obtaining the total defective number of the batch of ceramic substrates after the batch of ceramic substrates is detected, wherein the defective number divided by the total number of the batch of ceramic substrates is the defective rate of the batch of products. And the customer judges whether the batch of products is qualified or not according to the defective rate of the batch of products.
According to the sampling characteristic (OC) graph, it can be seen that, by using the sampling method, when the defective rate of the ceramic substrates of the actual batch reaches 1%, the probability of passing quality inspection acceptance exceeds 95%, and when the defective rate reaches 2%, the probability of passing quality inspection acceptance also reaches 75%, and it is determined that the formulation of the sampling scheme has high feasibility and passing quality inspection acceptance expectation.
The feasibility of the sampling scheme is compared by modifying the scheme as follows:
evaluation sampling protocol calculation by Minitab software, compared to the empirical protocol:
empirical protocol 1: strict sampling is performed, and the quality requirement is improved. In the production practice, the defective rate can be tested by 1% in the point of contact on-off, so that the sampling scheme can be designed according to experience, and when the number of non-conductive contacts in the extracted sample (namely the defective rate) is higher than 1%, the sample is judged to be defective.
The attribute-based sampling acceptance of Minitab software is run, a sampling plan defined by a comparison user is selected, the acceptable contact defect rate of 1% is input into the acceptable quality level in the attribute sampling acceptance, the reject batch defect rate of 5% is input into the reject quality level, the sample number is input into the numerical value 208 generated by the sampling scheme before, the acceptable number is adjusted from 5 to 2, the batch size is still the total contact number 728 of the piece of ceramic substrate, the specific input interface is shown in fig. 5, and the sampling scheme and the sampling inspection characteristic (OC) curve chart is generated as shown in fig. 6.
According to the result of the random inspection characteristic (OC) curve chart, even if the defective rate is 1% indeed, the probability that good products are mistakenly inspected as defective products is 34.5%, namely, a large amount of good products are mistakenly inspected as defective products and waste is caused by adopting the strict scheme.
Empirical protocol 2: and (4) loosely sampling, and judging as a defective product when the number of non-conductive contacts (namely, defective rate) in the sampled sample is higher than 5%.
The attribute-based sampling acceptance of Minitab software is run, a user-defined sampling plan is selected for comparison, the acceptable contact defect rate of 1% is input into the acceptable quality level in the attribute sampling acceptance, the reject batch defect rate of 5% is input into the reject quality level, the sample number is input into the numerical value 208 generated by the sampling scheme before, the acceptable number is adjusted from 5 to 10, the batch size is still the total contact number 728 of the piece of ceramic substrate, the specific input interface is shown in fig. 7, and the sampling scheme and the sampling inspection characteristic (OC) graph is generated as shown in fig. 8.
It can be seen that when the defective rate of the test is 5%, 53.2% of defective products are detected as good products by the sampling scheme, which is far beyond the allowable range of customers, and serious quality problems are caused.
Therefore, the sampling scheme obtained by the inverse derivation of the OC curve requirement parameter has significant advantages compared with the sampling scheme obtained by the traditional empirical mode.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
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