CN114050428A - Signal acquisition device and system - Google Patents
Signal acquisition device and system Download PDFInfo
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- CN114050428A CN114050428A CN202111255282.6A CN202111255282A CN114050428A CN 114050428 A CN114050428 A CN 114050428A CN 202111255282 A CN202111255282 A CN 202111255282A CN 114050428 A CN114050428 A CN 114050428A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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Abstract
The present application relates to a signal acquisition apparatus and system. The signal acquisition apparatus includes: the connector is arranged on the first surface of the circuit board, the capacitor is arranged on the second surface of the circuit board, the first end of the capacitor is connected with the output end of the connector, and the second end of the capacitor is connected with the signal output end. The signal acquisition device acquires a target signal from the target equipment through the connector and outputs the target signal to the signal output end through the capacitor. In this scheme, with electric capacity and connector integrated design on the circuit board, do wiring fan-out processing together, reduced the quantity and the length that the signal walked the line, can effectively reduce the signal and walk the loss of line through the signal, reduce the crosstalk between the via hole position signal simultaneously, improved the transmission quality of high-speed signal to, concentrate on the circuit board with the electric capacity and the connector of signal, effectively improve the design density of circuit board.
Description
Technical Field
The present application relates to the field of signal testing technologies, and in particular, to a signal acquisition apparatus and system.
Background
With the increasing transmission rate of digital signals, more and more high-density high-speed connectors are applied to products to meet the transmission rate requirement of 25G or even higher. However, "high density, high speed" connectors occupy limited space on the circuit board and system, and the pitch of the pins in the connector is small, which makes the wiring fan-out on the circuit board a poor condition.
In the prior art, signal wiring in a circuit board is complex in arrangement and large in number, so that signals are seriously attenuated in a transmission process, and the signal transmission quality is influenced.
Disclosure of Invention
In view of the above, it is necessary to provide a signal acquisition apparatus and a signal acquisition system capable of improving signal transmission quality.
In a first aspect, a signal acquisition device is provided, the signal acquisition device comprising a connector, a circuit board, and a capacitor; the connector is arranged on the first surface of the circuit board; the capacitor is arranged on the second surface of the circuit board; the first end of the capacitor is connected with the output end of the connector; the second end of the capacitor is connected with the signal output end;
and the connector is used for acquiring a target signal from the target equipment and outputting the target signal to the signal output end through the capacitor.
In this embodiment, with electric capacity and connector integrated design on the circuit board, do the design of wiring fan-out together, reduced the quantity and the length that the signal was walked the line, can effectively reduce the signal and walk the loss of line through the signal, reduce the crosstalk between the via hole position signal simultaneously, improved the transmission quality of high-speed signal to, concentrate on the circuit board with the electric capacity and the connector of signal, effectively improve the design density of circuit board.
In one optional embodiment, the signal acquisition device further includes a first signal trace and a second signal trace;
the output end of the connector is connected with the first end of the capacitor through a first signal wire;
the second end of the capacitor is connected with the signal output end through a second signal routing.
In this embodiment, the first signal traces and the second signal traces are disposed in the circuit board, so that the number of the signal traces is reduced, the layout design of the signal traces is simplified, the impedance discontinuity of the signal on the transmission link of the signal acquisition device is reduced, and the loss of the signal is reduced.
In one optional embodiment, the signal acquisition device further comprises a first signal hole, a second signal hole and a third signal hole;
the output end of the connector is connected with the first end of the first signal wire through the first signal hole;
the first end of the capacitor is connected with the second end of the first signal wire through the second signal hole;
the second end of the capacitor is connected with the first end of the second signal wire through the third signal hole;
the signal output end is connected with the second end of the second signal wire.
In this embodiment, the first signal hole, the second signal hole and the third signal hole are arranged in the circuit board, so that the number of via holes of a signal in a link layer change of the circuit board is reduced, the impedance discontinuity of the signal on a transmission link of the signal acquisition device is reduced, and the loss of the signal is reduced.
In one optional embodiment, the size and position of the first signal hole, the second signal hole and the third signal hole are determined by material parameters of the circuit board and property parameters of capacitance.
In this embodiment, a simulation experiment is performed based on material parameters of the circuit board and attribute parameters of the capacitor, and sizes and positions of the first signal hole, the second signal hole, and the third signal hole, which meet the requirements of a design manual, are determined, so that the signal acquisition device capable of reducing signal transmission loss is obtained.
In one optional embodiment, the circuit board is provided with the first signal traces and the second signal traces by back drilling.
In this embodiment, the circuit board adopts the back drilling mode to set up first signal and walk the line with the second signal, reduces the length of via hole stub.
In one alternative embodiment, the signal output terminals are embedded in an internal layer of the circuit board.
In this embodiment, the signal output terminal is embedded in the inner layer of the circuit board, so as to reduce the length and number of signal traces.
In one alternative embodiment, the position of the signal output terminal in the inner layer of the circuit board is determined by the material parameters of the circuit board and the property parameters of the capacitance.
In this embodiment, a simulation experiment is performed based on material parameters of the circuit board and attribute parameters of the capacitor, and the position of the signal output terminal on the inner layer of the circuit board, which meets the requirements of a design manual, is determined, so that the signal acquisition device capable of reducing signal transmission loss is obtained.
In one of the alternative embodiments, the circuit board further comprises a plurality of satellite holes; the size, the number and the arrangement position of the accompanying ground holes are determined by the material parameters of the circuit board and the property parameters of the capacitance.
In this embodiment, a simulation experiment is performed based on material parameters of the circuit board and attribute parameters of the capacitor, and the size, number, and arrangement position of the accompanying ground holes that meet the requirements of a design manual are determined, thereby obtaining a signal acquisition apparatus that can reduce signal transmission loss.
In one optional embodiment, the circuit board further comprises an anti-pad hollowed-out area; the size of the anti-pad gouging area is determined by the material parameters of the circuit board and the property parameters of the capacitor.
In this embodiment, a simulation experiment is performed based on material parameters of the circuit board and attribute parameters of the capacitor, and the size of the anti-pad hollowed area meeting the requirements of a design manual is determined, so that the signal acquisition device capable of reducing signal transmission loss is obtained.
In one alternative embodiment, the capacitor is an AC coupling capacitor.
In a second aspect, a signal acquisition system is provided, which includes a target device and the signal acquisition apparatus provided in the first aspect;
and the signal acquisition device is used for acquiring a target signal from the target equipment and outputting the target signal through a signal output end of the signal acquisition device.
In the embodiment, the capacitor and the connector are integrated on the circuit board and are designed for wiring and fanning out together, so that the number and the length of signal routing are reduced, the loss of signals passing through the signal routing can be effectively reduced, meanwhile, the crosstalk among signals at via hole positions is reduced, the transmission quality of high-speed signals is improved, and the design density of the circuit board is effectively improved by concentrating the capacitor and the connector of the signals on the circuit board; in addition, by arranging the limited signal holes on the circuit board, the number of layer-changing via holes of the signal link is reduced, the impedance discontinuity on the whole transmission link of the signal system is reduced, the signal loss is reduced, and the high-speed signal can meet the design requirement of farther distance transmission.
According to the signal acquisition device and the signal acquisition system, the signal acquisition device comprises the connector, the circuit board and the capacitor, wherein the connector is arranged on the first surface of the circuit board, the capacitor is arranged on the second surface of the circuit board, the first end of the capacitor is connected with the output end of the connector, and the second end of the capacitor is connected with the signal output end. The signal acquisition device acquires a target signal from the target equipment through the connector and outputs the target signal to the signal output end through the capacitor. In this scheme, with electric capacity and connector integrated design on the circuit board, do wiring fan-out processing together, reduced the quantity and the length that the signal walked the line, can effectively reduce the signal and walk the loss of line through the signal, reduce the crosstalk between the via hole position signal simultaneously, improved the transmission quality of high-speed signal to, concentrate on the circuit board with the electric capacity and the connector of signal, effectively improve the design density of circuit board.
Drawings
FIG. 1 is a schematic diagram of a signal acquisition device according to an embodiment;
FIG. 2 is a schematic diagram of a signal acquisition device according to an embodiment;
FIG. 3 is a schematic diagram of a signal acquisition device according to an embodiment;
FIG. 4 is a schematic structural diagram of a signal acquisition device according to an embodiment;
FIG. 5 is a schematic diagram of a signal acquisition device according to an embodiment;
fig. 6 is a schematic structural diagram of a signal acquisition system in one embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, a first client may be referred to as a second client, and similarly, a second client may be referred to as a first client, without departing from the scope of the present application. Both the first client and the second client are clients, but they are not the same client.
In one embodiment, as shown in fig. 1, there is provided a signal acquisition device 1 including a connector 11, a circuit board 12, and a capacitor 13; the connector 11 is arranged on a first surface of the circuit board 12; the capacitor 13 is arranged on the second surface of the circuit board 12; a first end of the capacitor 13 is connected with the output end of the connector 11; a second terminal of the capacitor 13 is connected to the signal output terminal 01.
And the connector 11 is used for acquiring a target signal from the target device 2 and outputting the target signal to the signal output end 01 through the capacitor 12.
The target device may be any device for outputting a signal, for example, if the target device deploys a high-speed and high-density system, in this application scenario, the connector may be a high-density and high-speed connector; other connectors suitable for the system corresponding to the current target device can also be adopted. The circuit board can be a Printed Circuit Board (PCB) or other circuit boards. Alternatively, the capacitance may be a coupling capacitance, for example, an AC coupling capacitance, and specifically, the capacitance may be a 0201AC coupling capacitance. Optionally, the signal output end 01 is embedded in an inner layer of the circuit board to reduce the length and number of signal traces. Alternatively, the signal output end 01 may also be disposed on the circuit board in a de-embedded manner, which is not limited in this embodiment.
For example, the connector is a high-density high-speed BGA connector, the circuit board is a PCB board card, and the capacitor is an AC coupling capacitor, the first surface of the signal obtaining device may be a Top surface or a Bottom surface, the second surface may be a Bottom surface or a Top surface, the high-density high-speed BGA connector may be disposed on the first surface of the PCB board card, and the AC coupling capacitor is disposed on the second surface of the PCB board card. The specific position of the high-density high-speed BGA connector can be determined according to expert experience or simulation experiments; the specific location of the AC coupling capacitance may be determined in a similar manner, either from expert experience or from simulation experiments. Optionally, in the case that the circuit board is a test board, the specific location of the high-density high-speed BGA connector and the specific location of the AC coupling capacitor are not limited.
In this embodiment, the input end of the connector is connected to the target device, the output end of the connector is connected to the first end of the capacitor, and the second end of the capacitor is connected to the signal output end of the signal acquisition device. Still take the connector as a high-density high-speed BGA connector, the circuit board as a PCB board card, and the capacitor as an AC coupling capacitor for example, the high-speed signal of the target device is transmitted to the pin of the first end of the AC coupling capacitor through the pin of the high-density high-speed BGA connector and through the signal trace formed by the via in pad design, and then the high-speed signal is transmitted to the signal output end of the PCB inner layer at the second end of the AC coupling capacitor through the signal trace formed by the via in pad design, and finally the high-speed signal is transmitted to the second device or the CPU or other locations through the signal output end.
Illustratively, in a signal testing scenario, the signal acquisition device is connected to a signal output port of a device to be tested (target device) through a connector, so that a test signal is output from the signal output port through the connector and a capacitor by the signal acquisition device, optionally, the test signal may be output to a signal testing device through the signal output port for signal testing, where the signal testing device may be a Vector Network Analyzer (VNA), or may be other signal testing devices. In a signal transmission scenario, the signal acquisition device is connected with a signal output port of a first device (target device) through a connector, so that a test signal is output from a signal output end through the signal acquisition device through the connector and a capacitor, optionally, the test signal can be output to a second device through the signal output end, and thus, signal transmission between the first device and the second device is realized. The application scenario is not limited in this embodiment.
The signal acquisition device comprises a connector, a circuit board and a capacitor, wherein the connector is arranged on the first surface of the circuit board, the capacitor is arranged on the second surface of the circuit board, the first end of the capacitor is connected with the output end of the connector, and the second end of the capacitor is connected with the signal output end. The signal acquisition device acquires a target signal from the target equipment through the connector and outputs the target signal to the signal output end through the capacitor. In this scheme, with electric capacity and connector integrated design on the circuit board, do wiring fan-out processing together, reduced the quantity and the length that the signal walked the line, can effectively reduce the signal and walk the loss of line through the signal, reduce the crosstalk between the via hole position signal simultaneously, improved the transmission quality of high-speed signal to, concentrate on the circuit board with the electric capacity and the connector of signal, effectively improve the design density of circuit board.
In one optional embodiment, as shown in fig. 2, the signal acquiring apparatus 1 further includes a first signal trace 02 and a second signal trace 03;
the output end of the connector 11 is connected with the first end of the capacitor 13 through the first signal wire 02;
the second end of the capacitor 13 is connected to the signal output terminal 01 through the second signal trace 03.
Optionally, the circuit board 12 is provided with the first signal trace 01 and the second signal trace 02 in a back drilling manner, so as to reduce the length of the via stub.
In this embodiment, an input end of the connector is connected to the target device, an output end of the connector is connected to the first end of the capacitor through the first signal trace, and the second end of the capacitor is connected to the signal output end of the signal acquisition device through the second signal trace. Still take the connector as a high-density high-speed BGA connector, the circuit board as a PCB board card, and the capacitor as an AC coupling capacitor for example, the high-speed signal of the target device is transmitted to the pin at the first end of the AC coupling capacitor through the pin of the high-density high-speed BGA connector and through the first signal trace formed by the via in pad design, and then the high-speed signal is transmitted to the signal output end of the PCB inner layer at the second end of the AC coupling capacitor and through the second signal trace formed by the via in pad design, and finally the high-speed signal is transmitted to the second device or the CPU or other positions through the signal output end. The application scenario is not limited in this embodiment.
In this embodiment, the first signal traces and the second signal traces are disposed in the circuit board, so that the number of the signal traces is reduced, the layout design of the signal traces is simplified, the impedance discontinuity of the signal on the transmission link of the signal acquisition device is reduced, and the loss of the signal is reduced.
Further, in one of the optional embodiments, as shown in fig. 3, the signal acquisition device further includes a first signal hole 04, a second signal hole 05, and a third signal hole 06;
the output end of the connector 11 is connected with the first end of the first signal wire 02 through the first signal hole 04;
a first end of the capacitor 13 is connected with a second end of the first signal wire 02 through the second signal hole 05;
the second end of the capacitor 13 is connected with the first end of the second signal trace 03 through the third signal hole 06;
the signal output end 01 is connected to the second end of the second signal trace 03.
In this embodiment, an input end of the connector is connected to the target device, an output end of the connector is connected to a first end of the first signal trace through the first signal hole, a first end of the capacitor is connected to a second end of the first signal trace through the second signal hole, a second end of the capacitor is connected to a first end of the second signal trace through the third signal hole, and a second end of the second signal trace is connected to a signal output end of the signal acquisition device. Still take the connector as a high-density high-speed BGA connector, the circuit board as a PCB board card, and the capacitor as an AC coupling capacitor for example, the high-speed signal of the target device is connected to the first end of the first signal trace through the pin of the high-density high-speed BGA connector and through the first signal hole formed by using via hole via in pad design, and the high-speed signal is transmitted to the pin connected to the first end of the AC coupling capacitor through the second signal hole and the second end of the first signal trace, and then at the second end of the AC coupling capacitor, the third signal hole formed by using via hole via in pad design is connected to the first end of the second signal trace, and the high-speed signal is transmitted to the signal output end of the PCB inner layer through the second signal trace, and finally the high-speed signal is transmitted to the second device or the CPU or other locations through the signal output end. Optionally, as shown in fig. 3, in a design process of the circuit board, the first signal hole 04, the first signal trace 02, and the second signal hole 05 may be regarded as a whole, that is, a via hole via in pad design manner is adopted, a through hole is disposed at a position 04 in the circuit board, a copper clad channel is disposed in the through hole, so as to form a signal transmission channel of 04-02-05, and similarly, a through hole is disposed at a position 06 of the third signal hole, a copper clad channel is also disposed in the through hole, so as to form a signal transmission channel of 06-03-01.
In this embodiment, the first signal hole, the second signal hole and the third signal hole are arranged in the circuit board, so that the number of via holes of a signal in a link layer change of the circuit board is reduced, the impedance discontinuity of the signal on a transmission link of the signal acquisition device is reduced, and the loss of the signal is reduced.
In one of the alternative embodiments, the size and position of the first signal hole 04, the second signal hole 05 and the third signal hole 06 are determined by the material parameters of the circuit board 12 and the property parameters of the capacitor 13.
The circuit board comprises a phenolic aldehyde paper laminated board, an epoxy paper laminated board, a polyester glass felt laminated board, an epoxy glass cloth laminated board and the like according to the material type of the circuit board, and the material parameters of the circuit board comprise material parameters such as dielectric constant DK, dielectric loss DF and the like; the attribute parameters of the capacitor include RLC parameters such as capacitance, resistance, inductance, and the like.
In this embodiment, according to the material parameter of the current circuit board and the attribute parameter of the capacitor, the material parameter of the current circuit board and the attribute parameter of the capacitor are input into a preset simulation model, software simulation design is performed, the sizes and positions of the first signal hole, the second signal hole and the third signal hole are adjusted, then according to a simulation result, the loss and the impedance change of the signal after passing through the connector and the capacitor are checked, requirements in a design manual are compared, for example, a high-speed serial computer expansion bus (PCIE) signal requires impedance of 85 ohms, the smaller the insertion loss is, the better the impedance is, the first signal hole, the second signal hole and the third signal hole which meet the data value condition required by the design manual are screened and determined, and the sizes and positions of the first signal hole, the second signal hole and the third signal hole are determined.
In this embodiment, a simulation experiment is performed based on material parameters of the circuit board and attribute parameters of the capacitor, and sizes and positions of the first signal hole, the second signal hole, and the third signal hole, which meet the requirements of a design manual, are determined, so that the signal acquisition device capable of reducing signal transmission loss is obtained.
In one alternative embodiment, the position of the signal output terminal 01 in the inner layer of the circuit board is determined by the material parameters of the circuit board 12 and the property parameters of the capacitor 13.
In this embodiment, according to the material parameters of the current circuit board and the attribute parameters of the capacitor, the material parameters of the current circuit board and the attribute parameters of the capacitor are input into a preset simulation model, software simulation design is performed, the position of a signal output end in an inner layer of the circuit board is adjusted, then according to a simulation result, loss and impedance change of a signal after passing through the connector and the capacitor are checked, and requirements in a design manual are compared, for example, when a PCIE signal requires 85 ohms for impedance, the smaller the insertion loss is, the better the insertion loss is, and the position of the signal output end in the inner layer of the circuit board, which meets the data value conditions required by the design manual, is screened and determined.
In this embodiment, a simulation experiment is performed based on material parameters of the circuit board and attribute parameters of the capacitor, and the position of the signal output terminal on the inner layer of the circuit board, which meets the requirements of a design manual, is determined, so that the signal acquisition device capable of reducing signal transmission loss is obtained.
In one alternative embodiment, as shown in FIG. 4, the circuit board 12 further includes a plurality of satellite holes 07; the size, number, and arrangement position of the accompanying ground holes 07 are determined by the material parameters of the circuit board 12 and the property parameters of the capacitor 13.
The sizes, the number and the arrangement positions of the accompanying ground holes can be determined according to expert experience, and can also be determined by simulation experiments according to material parameters of the circuit board and attribute parameters of the capacitor.
In this embodiment, according to the material parameters of the current circuit board and the attribute parameters of the capacitor, the material parameters of the current circuit board and the attribute parameters of the capacitor are input into a preset simulation model, software simulation design is performed, the size, the number and the arrangement position of the associated ground holes are adjusted, then, according to a simulation result, the loss and the impedance change of a signal after passing through the connector and the capacitor are checked, and the requirements in a design manual are compared, for example, a PCIE signal requires 85 ohms for impedance, and the smaller the insertion loss is, the better the insertion loss is, and the size, the number and the arrangement position of the associated ground holes which meet the data value conditions required by the design manual are screened and determined.
In this embodiment, a simulation experiment is performed based on material parameters of the circuit board and attribute parameters of the capacitor, and the size, number, and arrangement position of the accompanying ground holes that meet the requirements of a design manual are determined, thereby obtaining a signal acquisition apparatus that can reduce signal transmission loss.
In one alternative embodiment, as shown in fig. 5, the circuit board 12 further includes an anti-pad hollowed-out region U; the size of the anti-pad-void area U is determined by the material parameters of the circuit board 12 and the property parameters of the capacitor 13.
Fig. 5 is a plan view showing arrangement positions of the accompanying ground holes, the signal holes, and the anti-pad hollow regions U, and fig. 5 is a schematic diagram showing positions among the accompanying ground holes, the signal holes, and the anti-pad hollow regions U.
In this embodiment, according to the material parameters of the current circuit board and the attribute parameters of the capacitor, the material parameters of the current circuit board and the attribute parameters of the capacitor are input into a preset simulation model, software simulation design is performed, the size of the anti-pad hollowed area is adjusted, then according to a simulation result, the loss and the impedance change of a signal after passing through the connector and the capacitor are checked, and the requirements in a design manual are compared, for example, a PCIE signal requires 85 ohms impedance, the smaller the insertion loss is, the better the insertion loss is, and the size of the anti-pad hollowed area meeting the data value conditions required by the design manual is screened and determined.
In this embodiment, a simulation experiment is performed based on material parameters of the circuit board and attribute parameters of the capacitor, and the size of the anti-pad hollowed area meeting the requirements of a design manual is determined, so that the signal acquisition device capable of reducing signal transmission loss is obtained.
Optionally, in an embodiment, in the process of designing the signal obtaining apparatus, according to the material parameter of the current circuit board and the attribute parameter of the capacitor, the material parameter of the current circuit board and the attribute parameter of the capacitor are input into a preset simulation model, and in the process of performing software simulation design, parameters such as the size position of the first signal hole, the second signal hole, and the third signal hole, the position of the signal output end in the inner layer of the circuit board, the size number and the arrangement position of the associated ground holes, and the size of the anti-pad hollow area can be adjusted simultaneously, and then according to the simulation result, the loss and the change of impedance of the signal after passing through the connector and the capacitor are checked, and the requirements in the design manual are compared, for example, a PCIE signal requires 85 ohms, and the smaller insertion loss is better, the above parameter values that meet the data value conditions required by the design manual are screened and determined, thereby obtaining a signal acquisition device.
In this embodiment, a simulation experiment is performed based on material parameters of the circuit board and attribute parameters of the capacitor, and parameter values of relevant variables meeting the requirements of a design manual are determined, so that a signal acquisition device capable of reducing signal transmission loss is obtained.
The modules in the signal acquisition device can be wholly or partially realized by software, hardware and a combination thereof. The modules can be embedded in a hardware form or independent from a processor in the computer device, and can also be stored in a memory in the computer device in a software form, so that the processor can call and execute operations corresponding to the modules.
In one embodiment, as shown in fig. 6, a signal acquisition system is provided, which comprises a target device 2 and the signal acquisition apparatus 1 provided in the above first aspect.
The signal acquiring device 1 is used for acquiring a target signal from the target equipment 2 and outputting the target signal through a signal output end 01 of the signal acquiring device 1.
The target device may be any device for outputting a signal, and a high-speed and high-density system may be deployed in the target device, so that the signal acquisition device is used to transmit a high-speed signal.
In this embodiment, for example, in a scenario where the signal acquisition system is used for performing a signal test, the signal acquisition device is connected to a signal output port of the target device through the connector, so that the test signal is output through the signal acquisition device, optionally, the test signal may be output to a signal testing device through a signal output terminal for performing a signal test, where the signal testing device may be a Vector Network Analyzer (VNA), or may be another signal testing device.
In a scenario where the signal acquisition system is used for signal transmission, the signal acquisition device is connected with a signal output port of the target device through the connector, so that the test signal is output through the signal acquisition device, and optionally, the test signal can be output to other devices, thereby realizing signal transmission between the target device and the other devices. The application scenario is not limited in this embodiment.
The signal acquisition system comprises the signal acquisition device and the target device, wherein the signal acquisition device comprises a connector, a circuit board and a capacitor, the connector is arranged on a first surface of the circuit board, the capacitor is arranged on a second surface of the circuit board, a first end of the capacitor is connected with an output end of the connector, and a second end of the capacitor is connected with a signal output end. The signal acquisition device acquires a target signal from the target equipment through the connector and outputs the target signal to the signal output end through the capacitor. In the scheme, the capacitors and the connectors are integrated on the circuit board and are subjected to wiring and fan-out processing together, so that the number and the length of signal routing are reduced, the loss of signals passing through the signal routing can be effectively reduced, the crosstalk among signals at via hole positions is reduced, the transmission quality of high-speed signals is improved, and the capacitors and the connectors of the signals are concentrated on the circuit board, so that the design density of the circuit board is effectively improved; in addition, by arranging the limited signal holes on the circuit board, the number of layer-changing via holes of the signal link is reduced, the impedance discontinuity on the whole transmission link of the signal system is reduced, the signal loss is reduced, and the high-speed signal can meet the design requirement of farther distance transmission.
For specific limitations of the signal acquisition system, reference may be made to the above limitations of the signal acquisition device, which are not described herein again.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, database or other medium used in the embodiments provided herein can include at least one of non-volatile and volatile memory. Non-volatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical storage, or the like. Volatile Memory can include Random Access Memory (RAM) or external cache Memory. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM), among others.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A signal acquisition device, comprising a connector, a circuit board, and a capacitor; the connector is arranged on the first surface of the circuit board; the capacitor is arranged on the second surface of the circuit board; the first end of the capacitor is connected with the output end of the connector; the second end of the capacitor is connected with the signal output end;
the connector is used for acquiring a target signal from target equipment and outputting the target signal to the signal output end through the capacitor.
2. The apparatus of claim 1, wherein the signal acquisition device further comprises a first signal trace and a second signal trace;
the output end of the connector is connected with the first end of the capacitor through the first signal routing;
and the second end of the capacitor is connected with the signal output end through the second signal routing.
3. The apparatus of claim 2, wherein the signal acquisition device further comprises a first signal aperture, a second signal aperture, and a third signal aperture;
the output end of the connector is connected with the first end of the first signal wire through the first signal hole;
the first end of the capacitor is connected with the second end of the first signal wire through the second signal hole;
the second end of the capacitor is connected with the first end of the second signal wire through the third signal hole;
the signal output end is connected with the second end of the second signal routing wire.
4. The apparatus of claim 3, wherein the size and location of the first, second and third signal holes are determined by material parameters of the circuit board and property parameters of the capacitance.
5. The apparatus of claim 2 or 3, wherein the circuit board is configured with the first signal traces and the second signal traces using a back drilling method.
6. The device of any one of claims 1 to 4, wherein the signal output terminal is embedded in an inner layer of the circuit board.
7. The apparatus of claim 6, wherein the position of the signal output terminal on the inner layer of the circuit board is determined by a material parameter of the circuit board and a property parameter of the capacitance.
8. The device of any one of claims 1 to 4, wherein the circuit board further comprises a plurality of satellite holes; the size, the number and the arrangement position of the accompanying ground holes are determined by the material parameters of the circuit board and the property parameters of the capacitor.
9. The device of any one of claims 1 to 4, wherein the circuit board further comprises an anti-pad hollowed-out region; the size of the anti-pad hollowed-out area is determined by the material parameters of the circuit board and the attribute parameters of the capacitor.
10. A signal acquisition system, characterized in that the system comprises a target device and the signal acquisition apparatus of any one of claims 1-9;
the signal acquisition device is used for acquiring a target signal from the target equipment and outputting the target signal through a signal output end of the signal acquisition device.
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| CN202111255282.6A CN114050428A (en) | 2021-10-27 | 2021-10-27 | Signal acquisition device and system |
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| CN202111255282.6A CN114050428A (en) | 2021-10-27 | 2021-10-27 | Signal acquisition device and system |
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