CN114001526B - Wafer lifting and drying method and wafer drying device - Google Patents
Wafer lifting and drying method and wafer drying device Download PDFInfo
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- CN114001526B CN114001526B CN202111279331.XA CN202111279331A CN114001526B CN 114001526 B CN114001526 B CN 114001526B CN 202111279331 A CN202111279331 A CN 202111279331A CN 114001526 B CN114001526 B CN 114001526B
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- 238000001035 drying Methods 0.000 title claims abstract description 78
- 230000007246 mechanism Effects 0.000 claims abstract description 127
- 239000007921 spray Substances 0.000 claims abstract description 24
- 238000004140 cleaning Methods 0.000 claims abstract description 16
- 238000011010 flushing procedure Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 20
- 230000008569 process Effects 0.000 claims description 12
- 238000004590 computer program Methods 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 4
- 230000001360 synchronised effect Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 179
- 238000012546 transfer Methods 0.000 description 19
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- 230000005499 meniscus Effects 0.000 description 3
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- 238000012545 processing Methods 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/001—Handling, e.g. loading or unloading arrangements
- F26B25/003—Handling, e.g. loading or unloading arrangements for articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
The invention discloses a wafer lifting and drying method and a wafer drying device, wherein the wafer lifting and drying method comprises the following steps: placing the wafer on a supporting part in a cleaning tank through a flushing spray rod, wherein the supporting part swings laterally to drive the wafer to incline towards a jacking mechanism; the clamping part of the lifting mechanism moves to the lower side of the joint position in advance, and the lifting mechanism opposite to the position of the supporting part pushes the wafer to move upwards; when the center of the wafer passes through the clamping part, the clamping part moves upwards at the same speed as the jacking mechanism after accelerating to move upwards; when the clamping part and the jacking mechanism uniformly move to the intersection position, the clamping part clamps the wafer and continues to move upwards, and the jacking mechanism moves downwards to the initial position after moving upwards along with the clamping part; during the wafer is moved obliquely upward, the drying spray bar sprays drying gas toward the surface of the wafer passing through to complete the lifting drying of the wafer.
Description
Technical Field
The invention belongs to the technical field of wafer post-processing, and particularly relates to a wafer lifting and drying method and a wafer drying device.
Background
Chemical Mechanical Polishing (CMP) is an ultra-precise surface processing technique for obtaining global Planarization in the fabrication of Integrated Circuits (ICs). With the development of integrated circuit manufacturing technology, the control of the defects on the surface of the wafer is more and more strict. During the wafer manufacturing process, the surface of the wafer may absorb contaminants such as particles or organic substances to generate a large number of defects, which require a post-treatment process to remove. Particularly, since a large amount of chemicals and abrasives are used in chemical mechanical polishing to contaminate the wafer surface, a post-treatment process is required to remove contaminants from the wafer surface after polishing, and the post-treatment process generally consists of cleaning and drying to provide a smooth and clean wafer surface.
Common drying techniques are Spin Rinse Drying (SRD) and Marangoni drying (also known as "Marangoni" or "Marangoni"). Drying of wafers based on the marangoni effect has received much attention due to its superior performance in eliminating liquid mark defects, as compared to conventional SRDs. The marangoni effect is an interfacial convection phenomenon caused by a surface tension gradient. The existing drying technology based on the marangoni effect is to blow organic vapor such as IPA containing isopropyl alcohol on a 'meniscus' formed by a wafer-air-liquid when the wafer is taken out of a water bath of deionized water, and induce the marangoni effect to realize backflow of attached liquid, thereby obtaining a fully dried wafer.
During the lifting and drying process, the smooth movement of the wafer during the wafer handover is important. The stable connection of the wafer can effectively avoid the damage of a surface liquid film, and is beneficial to accurately identifying the meniscus so as to fully induce the marangoni effect and ensure the drying effect of the wafer.
In general, when the wafer is transferred, the first transport mechanism stops after the wafer reaches the designated position, and then the second transport mechanism takes away the wafer from the first transport mechanism to complete the transfer. Or the first conveying mechanism conveys the wafer to the designated position and then places the wafer on the wafer positioning mechanism, and then the second conveying mechanism takes the wafer from the wafer positioning mechanism to complete the handover. However, during the wafer lifting and drying process, the liquid film on the surface of the wafer is damaged by the wafer standing still, which is not allowed.
Therefore, how to achieve dynamic handover of a wafer and improve handover efficiency on the premise of ensuring reliability is always an urgent technical problem to be solved by those skilled in the art.
Disclosure of Invention
The present invention aims to solve at least to some extent one of the technical problems existing in the prior art.
Therefore, the embodiment of the invention provides a wafer lifting and drying method, which comprises the following steps:
s1, placing the wafer on a support part in the cleaning tank through a flushing spray rod, and swinging the support part laterally to drive the wafer to incline towards the jacking mechanism;
s2, the clamping part of the lifting mechanism moves to the lower side of the joint position in advance, and the lifting mechanism opposite to the position of the supporting part pushes the wafer to move upwards;
s3, when the center of the wafer passes through the clamping part, the clamping part accelerates to move upwards until the speed of the clamping part is the same as that of the jacking mechanism, and then the clamping part and the jacking mechanism move upwards at the same speed;
s4, when the clamping part and the jacking mechanism uniformly move to the joint position, the clamping part clamps the wafer and continues to move upwards, and the jacking mechanism moves downwards to the initial position after moving upwards along with the clamping part;
and S5, spraying dry gas by the drying spray rod towards the surface of the wafer passing through during the process that the wafer moves obliquely upwards so as to finish the lifting and drying of the wafer.
In a preferred embodiment, when the clamping part is accelerated to the speed of the jacking mechanism, the vertical position of the clamping part is matched with the position of the wafer clamping point.
In a preferred embodiment, after the speeds of the lifting mechanism and the jacking mechanism are synchronized, the clamping part starts to horizontally move towards the wafer; when the jacking mechanism moves to the joint position, the clamping part clamps the wafer.
As a preferred embodiment, the vertical distance between the wafer clamping point and the center of the wafer is 5mm-30 mm.
In addition, the invention also discloses a wafer lifting and drying method, which comprises the following steps:
s10, placing the wafer on a support part in the cleaning tank through a flushing spray rod, and swinging the support part laterally to drive the wafer to incline towards the jacking mechanism;
s20, the clamping part of the lifting mechanism moves to the lower side of the joint position in advance, and the lifting mechanism opposite to the position of the supporting part pushes the wafer to move upwards;
s30, when the wafer center passes through the clamping part, the clamping part moves upwards in an accelerated manner, and meanwhile, the clamping arm of the clamping part moves horizontally towards the wafer;
s40, when the clamping part of the lifting mechanism moves to the joint position, the speed of the clamping part is higher than that of the jacking mechanism, the clamping arm of the clamping part supports the wafer to move upwards, and the jacking mechanism moves downwards to the initial position;
and S50, spraying dry gas by the drying spray rod towards the surface of the wafer passing through during the process that the wafer moves obliquely upwards so as to finish the lifting and drying of the wafer.
In a preferred embodiment, before the wafer is moved to the joint position, the clamping part is moved to a horizontal position corresponding to the clamping state.
In a preferred embodiment, the difference between the speeds of the clamping part and the jacking mechanism is not more than 10% of the speed of the jacking mechanism during wafer handover.
In step S30, after the center of the wafer passes through the clamping portion, the clamping portion is moved horizontally toward the wafer.
Meanwhile, the invention also provides a wafer drying device which executes the steps of the wafer pulling and drying method.
In addition, the invention also discloses a control device which comprises a memory, a processor and a computer program which is stored in the memory and can run on the processor, wherein the processor executes the computer program to realize the steps of the wafer pulling and drying method.
The beneficial effects of the invention include: through the motion control of the jacking mechanism and the lifting mechanism, the stable, efficient and accurate connection of the wafer is realized, the integrity of a water film on the surface of the wafer is ensured, the marangoni effect is efficiently induced, and the drying effect on the surface of the wafer is improved.
Drawings
The advantages of the invention will become clearer and more readily appreciated from the detailed description given with reference to the following drawings, which are given by way of illustration only, and which do not limit the scope of protection of the invention, wherein:
FIG. 1 is a flow chart of a wafer lift drying method according to the present invention;
FIGS. 2-4 are schematic views of the wafer position in the wafer drying apparatus during the handoff process;
FIG. 5 is a graph of displacement versus time for a lift mechanism and a pull mechanism for the dynamic wafer handoff of FIG. 1;
FIG. 6 is a flow chart of another embodiment of a method for pull drying a wafer according to the present invention;
FIG. 7 is a graph of displacement versus time for the lift mechanism and the pull mechanism of FIG. 6 corresponding to dynamic wafer transfer;
FIG. 8 is a displacement versus time plot of another embodiment of the lift mechanism and the pull mechanism of FIG. 6 corresponding to dynamic wafer interface.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the following embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the invention, and are presented to illustrate the concepts of the invention; the description is intended to be illustrative and exemplary and should not be taken to limit the scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other embodiments that are obvious based on the disclosure of the claims and their description, including those that employ any obvious substitutions and modifications to the embodiments described herein.
The drawings in the present specification are schematic views to assist in explaining the concept of the present invention, and schematically show the shapes of respective portions and their mutual relationships. It should be understood that the drawings are not necessarily to scale, the same reference numerals being used to identify the same elements in the drawings in order to clearly show the structure of the elements of the embodiments of the invention.
In the present invention, the Wafer (Wafer) is also called a Substrate (Substrate), and the meaning and the actual function are equivalent.
The invention provides a wafer pulling and drying method, and a flow chart thereof is shown in figure 1. The following describes the steps of wafer lift-drying with reference to the wafer drying apparatus shown in fig. 2 to 4:
s1, placing the wafer on the support 30 in the cleaning tank 60 through the spray rinsing rod 40, and the support 30 swings laterally to drive the wafer to tilt towards the jacking mechanism 10;
specifically, a wafer handling robot (not shown) holds a wafer through a pair of parallel disposed rinse spray bars 40 and places the wafer on a support 30 in a rinse tank 60, as shown in FIG. 2. The cleaning tank 60 contains a liquid for cleaning the wafer, which may be deionized water. The supporting portion 30 is disposed at the bottom of the cleaning tank 60 and has an arch structure; the arch structure is provided with a groove for supporting and positioning a wafer to be placed. The supporting portion 30 is connected to a rotating motor through a rotating shaft, the rotating motor drives the rotating shaft to rotate so as to drive the supporting portion 30 and the wafer thereon to tilt toward the position of the jacking mechanism 10 shown in fig. 3, and the jacking mechanism 10 is located on the inner side of the supporting portion 30. That is, the wafer on the supporting portion 30 is changed from the initial vertical state to the inclined state, so as to satisfy the requirement of the subsequent inclined pulling drying.
S2, the clamping part 21 of the lifting mechanism 20 is moved to the lower side of the joint position in advance, and the lifting mechanism 10 opposite to the position of the supporting part 30 pushes the wafer to move upwards;
in fig. 2, the wafer drying apparatus includes a lift mechanism 10 and a pull mechanism 20. Before the wafer transfer, the gripping portion 21 of the pulling mechanism 20 needs to be moved downward in advance in order to provide a distance for acceleration of the gripping portion 21. Meanwhile, the clamping part 21 moves downwards in advance, so that the moving direction of the clamping part is consistent with the moving direction of the wafer lifted by the lifting mechanism 10, and the drying effect is prevented from being influenced by sudden change of the wafer speed in the wafer handover process.
The lifting mechanism 20 includes a servo slide table disposed obliquely and a clamp portion 21 provided on the servo slide table, and the clamp portion 21 is a pair of clamp arms that can move in the longitudinal direction of the servo slide table. In addition, the clamping arm of the clamping portion 21 is provided with a driving cylinder, and the driving cylinder can drive the clamping arm to move horizontally so as to complete the clamping and separating actions of the clamping portion 21 on the wafer.
Further, the gripping portion 21 of the pulling mechanism 20 needs to be moved to the lower side of the joint position. In the wafer lifting and drying process, the joint position of the wafer needs to be preset according to the drying process so as to ensure the wafer drying effect. In general, the wafer transfer position is set within a range of 150mm above the liquid surface of the cleaning tank 60.
The jacking mechanism 10 is also provided with a linear moving module which drives the jacking mechanism to move on the line. The middle position of the supporting part 30 is provided with a groove 31, and the position of the jacking mechanism 10 at the bottom of the cleaning groove 60 is opposite to the position of the groove 31.
To facilitate wafer transfer control, the movement speed of the lift-off mechanism 10 is first accelerated to V 0 Then at a speed V 0 And moving upwards at a constant speed. Furthermore, the acceleration of the lift mechanism 10 should not be too large to ensure the smooth movement of the wafer.
S3, when the wafer center passes through the clamping part 21, the clamping part 21 accelerates and moves upwards until the speed is the same as that of the jacking mechanism 10, and then both move upwards at the same speed;
specifically, the clamping portion 21 of the lifting mechanism 20 should not be started to accelerate too early, so as to prevent the clamping portion 21 from being located above the delivery position all the time due to too high speed, and the clamping portion 21 and the lifting mechanism 10 cannot be delivered.
FIG. 5 is a graph of displacement versus time for the lift mechanism 20 and the lift mechanism 10 during wafer transfer, where the graph of displacement versus time for the lift mechanism 10 is shown by a dashed line, the graph of displacement versus time for the lift mechanism 20 is shown by a solid line, and P is 1 Indicating the wafer transfer position; the lift mechanism 10 is moved to the lower side of the wafer transfer position in advance and then accelerated upward. When the speed of the lifting mechanism 10 is the same as the speed of the lifting mechanism 20, both are moving upwards.
The lifting mechanism 20 accelerates to V 0 Then, moving uniformly, the slope of the corresponding curves of the lifting mechanism 20 and the jacking mechanism 10 are the same, as shown in fig. 5. I.e., the speed of upward movement of the lift mechanism 20 and the lift mechanism 10 is the same.
Since the relative positions of the clamping portion 21 and the jacking mechanism 10 are fixed after the speeds of the two are the same, when the clamping portion 21 of the pulling mechanism 20 accelerates to the speed of the jacking mechanism 10, the vertical position of the clamping portion 21 needs to correspond to the position of the wafer clamping point, so as to ensure that the clamping portion 21 of the pulling mechanism 20 accurately clamps the wafer.
Furthermore, the vertical distance between the wafer clamping point and the center of the wafer is 5mm-30 mm. The position of the wafer clamping point can be flexibly adjusted according to the wafer drying process.
S4, when the clamping part 21 and the jacking mechanism 10 uniformly move to the joint position, the clamping part 21 clamps the wafer and continues to move upwards, and the jacking mechanism 10 moves upwards along with the clamping part 21 and then moves downwards to the initial position;
specifically, the clamping portion 21 and the jacking mechanism 10 move upward synchronously at a constant speed, and when the two reach the set delivery position P 1 Thereafter, the clamping portion 21 clamps the wafer. I.e. the wafer is at t 1 The wafer handover is completed at a point in time.
S5, the drying spray bar 50 sprays dry gas toward the passing wafer surface during the wafer is moving obliquely upward, so as to complete the lifting drying of the wafer.
In the embodiment shown in fig. 2, the drying spray bars 50 are disposed in parallel and spaced at an upper portion of the cleaning tank 60, the position of the support 30 inclined toward the inside corresponds to the position of the drying spray bars 50, and the wafer on the support 30 can move between the drying spray bars 50. During the process of lifting the wafer from the liquid in the cleaning tank 60, the drying spray bar 50 sprays the drying gas toward the meniscus region attached to the wafer surface, so that the attachments on the wafer surface are peeled from the wafer surface in the direction opposite to the lifting direction by using the marangoni effect, thereby drying the wafer surface.
Fig. 4 is a schematic diagram of the wafer after passing through the drying spray bar 50, and after the drying by marangoni, the attachments and the water film on the surface of the wafer are completely removed, thereby effectively ensuring the cleaning and drying effects of the wafer.
Since the clamping portion 21 of the pulling mechanism 20 may have unstable clamping in the early stage of movement, if the clamping portion 21 does not clamp the wafer, the wafer may drop downward and have sudden speed change. To eliminate the potential for wafer drop, t 1 After the time point, the lift mechanism 10 needs to move upward a distance in synchronization with the clamping portion 21 to avoid sudden speed change of the moving wafer.
Since it takes time for the clamp arm of the clamp portion 21 to move to the clamping point of the wafer, it is necessary to accurately control the start time of the clamp portion 21 in order to improve the wafer transfer efficiency. Specifically, after the speeds of the lifting mechanism 20 and the lifting mechanism 10 are synchronized, the clamping arm of the clamping part 21 starts to move horizontally towards the wafer; when the lifting mechanism 10 moves to the transfer position, the clamping arm of the clamping portion 21 clamps the wafer, so as to eliminate the waiting time in the transfer process and improve the wafer transfer efficiency.
In addition, the invention also provides a wafer lifting and drying method, and a flow chart thereof is shown in fig. 6.
S10, placing the wafer on the support part 30 in the cleaning tank 60 through the washing spray rod 40, and swinging the support part 30 laterally to drive the wafer to incline towards the jacking mechanism 10;
s20, the clamping part 21 of the lifting mechanism 20 moves to the lower side of the joint position in advance, and the lifting mechanism 10 opposite to the position of the support part 30 pushes the wafer to move upwards;
s30, when the center of the wafer passes through the clamp portion 21, the clamp portion 21 is accelerated to move upward while the clamp arm of the clamp portion 21 is moved horizontally toward the wafer;
s40, when the clamping portion 21 of the lifting mechanism 20 moves to the transfer position, the speed of the clamping portion 21 is greater than that of the lifting mechanism 10, the clamping arm of the clamping portion 21 supports the wafer to move upward, and the lifting mechanism 10 moves downward to the initial position;
s50, the drying spray bar 50 sprays dry gas toward the passing wafer surface during the wafer is moving obliquely upward, so as to complete the lifting drying of the wafer.
Compared with the wafer lift-drying method shown in fig. 1, there is a difference in wafer transfer method between the two methods. The wafer transfer method shown in fig. 6 is: by utilizing the speed difference between the clamping portion 21 and the jacking mechanism 10, the clamping portion 21 supports the wafer arranged on the jacking mechanism 10 from the bottom, and dynamic handover is stably and efficiently completed.
At the time of wafer transfer, the moving speed of the clamp portion 21 is slightly higher than the moving speed of the wafer on the lift-up mechanism 10. Preferably, the difference in speed of the gripping part 21 and the jacking mechanism 10 is no more than 20% of the speed of the jacking mechanism 10. The separation of the wafer from the lift-up mechanism 10 is realized by the speed difference between the two.
Furthermore, the clamping arm of the clamping part 21 can start the clamping action in advance, so that the phenomenon that the clamping arm of the clamping part 21 impacts the edge of the wafer due to too fast clamping action is avoided, and the risk of fragments is eliminated. Specifically, in step S30, after the wafer center passes through the clamping portion 21, the clamping arms of the clamping portion 21 can move horizontally toward the wafer, and the pair of clamping arms shown in fig. 2 can move horizontally toward the wafer under the driving of the air cylinder or the electric cylinder. Because the distance between the opposite end surfaces of the clamping arms of the clamping part 21 is smaller than the diameter of the wafer, the clamping part 21 can lift the wafer from the bottom, and the clamping arms of the clamping part 21 are prevented from moving fast to impact the wafer.
When the clamping part 21 acts, the clamping part 21 is positioned below the wafer, so that the impact of the clamping part 21 on the edge of the wafer is effectively avoided, and the risk of fragments in the handover process is eliminated. The gripping part 21 is accelerated upward while the gripping arm of the gripping part 21 is moved horizontally; when the clamp portion 21 is accelerated continuously, the clamp portion 21 catches up with the wafer on the lift mechanism 10 and surmounts the wafer, and then the clamp portion 21 of the lift mechanism 20 supports the wafer, thereby realizing dynamic transfer of the wafer.
Compared with the wafer transfer mode in the wafer lifting and drying method shown in fig. 1, the horizontal movement of the clamping arm of the clamping portion 21 is reserved for a longer time, so that the difficulty in controlling the movement of the clamping arm is reduced, and the clamping portion 21 can be smoothly moved to a set position.
As a preferred embodiment, the vertical distance between the wafer clamping point and the center of the wafer is 5mm-30 mm. The position of the wafer chucking point can be controlled by controlling the horizontal distance of the chucking arm of the chucking portion 21.
In the wafer pulling and drying method shown in fig. 6, the speed of the clamping portion 21 is required to be slightly higher than the speed of the lifting mechanism 10, so that the lifting mechanism 10 can be accelerated and then moved at a constant speed, as shown in fig. 7, wherein the displacement-time curve corresponding to the lifting mechanism 10 is shown by a dotted line, the displacement-time curve corresponding to the lifting mechanism 20 is shown by a solid line, and P is the speed of the lifting mechanism 10 1 Is the wafer hand-off position. After the wafer is handed over, the lift mechanism 10 may continue to move upward or may directly move downward.
In FIG. 7, at t 1 At this point in time, the clamping portion 21 of the pulling mechanism 20 holds the wafer from the bottom, and at this time, the speed of the clamping portion 21 is greater than that of the lifting mechanism 10, and the wafer is separated from the lifting mechanism 10 and is securely held by the holding arm of the clamping portion 21. When the lift-up mechanism 10 reaches the delivery position P 1 Thereafter, it may continue to move upward.
It is understood that after the wafer is handed over, the lift-off mechanism 10 may also be decelerated to move upward and then moved downward to the initial position, as shown in fig. 8, for processing the next wafer; in FIG. 8, the displacement-time curve for the jacking mechanism 10 is shown in dashed lines, while the displacement-time curve for the lifting mechanism 20 is shown in solid lines, P 1 Is the wafer hand-off position.
Meanwhile, the invention also provides a wafer drying device, as shown in fig. 2, the steps of the wafer lifting and drying method are executed, so that reliable, efficient and accurate transfer of wafers is realized, the drying effect of the wafers is effectively ensured, and the production beat of wafer drying is promoted.
In addition, the invention also discloses a control device which comprises a memory, a processor and a computer program which is stored in the memory and can run on the processor, wherein the processor executes the computer program to realize the steps of the wafer pulling and drying method.
The Processor may be a Central Processing Unit (CPU), other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), an off-the-shelf Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic device, discrete hardware component, etc.
The memory may be an internal storage unit of the control device, such as a hard disk or a memory of the control device. The memory may also be an external storage device of the control device, such as a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), and the like provided on the control device. Further, the memory may also include both an internal storage unit of the control device and an external storage device. The memory is used for storing the computer program and other programs and data required by the control device. The memory may also be used to temporarily store data that has been output or is to be output.
In the description of the present specification, reference to the description of "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (7)
1. A method of pull drying a wafer, comprising:
s1, placing the wafer on a support part in the cleaning tank through a flushing spray rod, and swinging the support part laterally to drive the wafer to incline towards the jacking mechanism;
s2, the clamping part of the lifting mechanism moves to the lower side of the joint position in advance, and the lifting mechanism opposite to the position of the supporting part pushes the wafer to move upwards;
s3, when the center of the wafer passes through the clamping part, the clamping part accelerates to move upwards until the speed of the clamping part is the same as that of the jacking mechanism, and then the clamping part and the jacking mechanism move upwards at the same speed; after the speed of the clamping part and the speed of the jacking mechanism are synchronous, the clamping part starts to horizontally move towards the wafer; when the jacking mechanism moves to the connection position, the clamping part clamps the wafer;
s4, when the clamping part and the jacking mechanism uniformly move to the joint position, the clamping part clamps the wafer and continues to move upwards, and the jacking mechanism moves downwards to the initial position after moving upwards along with the clamping part;
and S5, spraying dry gas by the drying spray rod towards the surface of the wafer passing through during the process that the wafer moves obliquely upwards so as to finish the lifting and drying of the wafer.
2. The wafer lift drying method of claim 1, wherein the vertical position of the clamping portion matches the position of the wafer clamping point when the clamping portion is accelerated to the speed of the jacking mechanism.
3. The wafer lift drying method of claim 2, wherein the vertical distance between the wafer clamping point and the wafer center is 5mm-30 mm.
4. A method of pull drying a wafer, comprising:
s10, placing the wafer on a support part in the cleaning tank through a flushing spray rod, and swinging the support part laterally to drive the wafer to incline towards the jacking mechanism;
s20, the clamping part of the lifting mechanism moves to the lower side of the joint position in advance, and the lifting mechanism opposite to the position of the supporting part pushes the wafer to move upwards;
s30, when the wafer center passes through the clamping part, the clamping part moves upwards in an accelerated manner, and meanwhile, the clamping arm of the clamping part moves horizontally towards the wafer; before the wafer moves to the joint position, the clamping part moves to a horizontal position corresponding to the clamping state;
s40, when the clamping part of the lifting mechanism moves to the joint position, the speed of the clamping part is higher than that of the jacking mechanism, the clamping arm of the clamping part supports the wafer to move upwards, and the jacking mechanism moves downwards to the initial position; when the wafer is handed over, the speed difference between the clamping part and the jacking mechanism is not more than 10% of the speed of the jacking mechanism; the clamping part supports the wafer arranged on the jacking mechanism from the bottom by utilizing the speed difference between the clamping part and the jacking mechanism so as to complete dynamic handover;
and S50, spraying dry gas by the drying spray rod towards the surface of the wafer passing through during the process that the wafer moves obliquely upwards so as to finish the lifting and drying of the wafer.
5. The wafer lift drying method of claim 4, wherein in step S30, after the center of the wafer passes through the clamping portion, the clamping portion moves horizontally toward the wafer.
6. A wafer drying apparatus, characterized by performing the steps of the wafer pull drying method of any one of claims 1 to 5.
7. A control device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, the processor implementing the steps of the wafer lift drying method according to any one of claims 1 to 5 when executing the computer program.
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| CN111785663B (en) * | 2020-07-10 | 2023-02-28 | 华海清科股份有限公司 | Wafer post-processing system |
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