CN113903717B - Miniaturized heat dissipation device applied to power chip and semiconductor device - Google Patents

Abstract

The invention relates to a heat dissipation device of a power chip, in particular to a miniaturized heat dissipation device applied to the power chip and a semiconductor device. The technical problems that the conventional power chip heat dissipation device is large in size and not beneficial to system integration are solved. The heat dissipation device comprises an M5 sealing layer, an M4 shunt layer, an M3 diversion layer, an M2 heat exchange layer and an M1 sealing layer which are arranged in a laminated mode from bottom to top; the M5 sealing layer is seted up coolant liquid feed hole and coolant liquid outlet hole on M1 sealing layer respectively, and the central axis coincidence in coolant liquid feed hole and coolant liquid outlet hole has reduced heat abstractor's volume greatly, simultaneously through the rationally distributed runner, makes chip surface temperature even. The semiconductor device comprises a power chip and a heat dissipation device, wherein the power chip is welded on the surface of the heat dissipation device, and heat generated by the power chip is dissipated by utilizing cooling liquid flowing in the heat dissipation device. The invention greatly reduces the volume of the heat dissipation device, correspondingly reduces the volume of the semiconductor device and is beneficial to the integrated design.

Description

A miniaturized heat dissipation device and semiconductor device applied to a power chip

technical field

The invention relates to a heat dissipation device for a power chip, in particular to a miniaturized heat dissipation device and a semiconductor device applied to the power chip.

Background technique

The heat dissipation device of the power chip is used to dissipate the heat generated when the chip is working. Generally, the chip is directly welded to the heat dissipation device by welding. Therefore, the size of the heat dissipation device directly affects the total installation volume of the power device. The cooling device of the existing power chip generally adopts a structure in which the cooling liquid inlet and the cooling liquid outlet are arranged in a plane parallel arrangement, and the axes of the cooling liquid inlet and the outlet are parallel to each other. For example, Chinese patent CN113300209A discloses a cooling heat sink applied to a high-power semiconductor light source chip. As can be seen from FIG. 1 , the chip 01 is welded on the heat sink 03 by solder 02, and the heat sink 03 includes a bottom-up stack The provided lower sealing laminations, lower cooling laminations, guide laminations, upper cooling laminations and upper sealing laminations. A first water inlet 04 and a first water outlet 05 isolated from each other are set on the lower sealing laminations; the other laminations are provided with structures such as diversion and heat exchange. A water outlet 05 flows out. Because the cooling liquid inlet and outlet are distributed in different positions, such a cooling device has a large volume, which eventually leads to an increase in the total installation volume of the laser, wastes installation space, and is not conducive to system integration.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a miniaturized heat dissipation device for power chips. The cooling liquid inlet and outlet are located at the same position, which greatly reduces the volume of the heat dissipation device. It overcomes the technical problem that the existing power chip heat dissipation device has a large volume and is not conducive to system integration.

The technical solution of the present invention is to provide a miniaturized heat dissipation device applied to a power chip, which is special in that it includes an M5 sealing layer, an M4 shunt layer, an M3 drainage layer, and an M2 heat exchange layer that are stacked from bottom to top. and M1 sealing layer;

The above-mentioned M5 sealing layer, M4 shunt layer, M3 drainage layer, M2 heat exchange layer and M1 sealing layer are provided with mutually penetrating installation holes at corresponding positions;

The above-mentioned M5 sealing layer includes a first area and a second area, and a cooling liquid inlet hole for liquid inlet is provided on the above-mentioned first area;

The above-mentioned M4 distribution layer is provided with a first hollow area and a second hollow area that are connected to each other. The first hollow area corresponds to the position of the coolant inlet hole of the M5 sealing layer and is connected to each other. Each shunt rib extends along the Y direction, and a plurality of shunt ribs are arranged along the X direction. liquid flow channel; one end of the cooling liquid flow channel close to the first hollow area is the cooling liquid inlet, and the end away from the first hollow area is the cooling liquid outlet;

A drainage groove is provided on the above-mentioned M3 drainage layer, the drainage groove extends along the X direction, and the bottom of the above-mentioned drainage groove corresponds to and communicates with the cooling liquid outlet position of each cooling liquid flow channel;

The above-mentioned M2 heat exchange layer is provided with a third hollow area and a fourth hollow area that are connected to each other, and the third hollow area corresponds to the position of the first hollow area of the M4 shunt layer; the fourth hollow area is provided with fins, and the roots of the fins are drained from the M3. The drainage grooves on the layer correspond to each other and communicate with each other;

The M1 sealing layer includes a third area and a fourth area, the third area corresponds to the position of the third hollow area on the M2 heat exchange layer, and the fourth area corresponds to the position of the fourth hollow area on the M2 heat exchange layer; There is a cooling liquid outlet hole communicating with the third hollow area; the cooling liquid outlet hole is coincident with the central axis of the cooling liquid inlet hole; the upper surface of the fourth area is a power chip installation area for installing the power chip;

The cooling liquid enters from the cooling liquid inlet hole and enters the cooling liquid flow channel through the first hollow area to realize diversion; the cooling liquid flowing out of the cooling liquid flow channel flows into the fourth hollow area through the drainage groove, and realizes heat exchange through the fins. It flows out from the coolant outlet hole through the third hollow area to take away the heat.

Further, the M5 sealing layer, the M4 shunt layer, the M3 drainage layer, the M2 heat exchange layer and the M1 sealing layer have the same shape and size.

Further, in order to achieve a more uniform split, the length of the multiple split ribs in the M4 split layer, the length of the split ribs located in the middle area is greater than the length of the split ribs located on both sides, and the above-mentioned length is the split ribs along the Y direction. extension length.

Further, for the multiple distribution ribs of the M4 distribution layer, the distribution ribs in the two sides are symmetrically arranged with respect to the distribution ribs in the most middle area.

Further, there are two installation holes in the M5 sealing layer, which are located on both sides of the cooling liquid inlet hole.

Further, the M5 sealing layer, the M4 shunt layer, the M3 drainage layer, the M2 heat exchange layer and the M1 sealing layer are all rectangular flat plates.

Further, both the cooling liquid outlet hole and the cooling liquid inlet hole are round holes with equal diameters.

Further, the dimensions of the plurality of shunt ribs along the X direction are the same; the dimensions of the baffle plates in the fins along the X direction are the same.

Further, the length A4 of the rectangular plate is 13mm, the diameter of the cooling liquid inlet hole is 6mm, the size A1 of each shunt rib along the X direction is equal to 0.20mm, and the shunt rib located in the most middle area is in the Y direction. The dimension A5 is 6mm, the dimension A2 of the drainage groove along the Y direction is 0.50mm, the dimension A3 of the partition plate in the fin along the X direction is 0.30mm, and the diameter of the mounting hole is 2mm.

Further, the number of the above-mentioned diverting ribs is 9, which are defined as the first diverting rib, the second diverting rib, the third diverting rib, the fourth diverting rib, the fifth diverting rib, and the sixth diverting rib from left to right. Diverter rib, seventh diverter rib, eighth diverter rib, ninth diverter rib; the fifth diverter rib is the diverter rib located in the middlemost area, the fourth diverter rib and the sixth diverter rib are along the The dimensions in the Y direction are equal to 5mm;

The dimensions of the third diverting rib and the seventh diverting rib in the Y direction are equal to 3.5mm; the dimensions of the second diverting rib and the eighth diverting rib in the Y direction are equal to 3 mm; The dimensions of the nine-split rib plates along the Y direction are equal to 1.9mm; the distance between the two adjacent split rib plates is 0.8mm.

The present invention also provides a semiconductor device, which is special in that it includes a laser chip and the above-mentioned heat dissipation structure, and the above-mentioned laser chip is fixed on the upper surface of the fourth region of the sealing layer of the heat dissipation structure M1.

The beneficial effects of the present invention are:

1. Compared with the traditional heat sink, the central axis of the cooling liquid inlet hole and the cooling liquid outlet hole in the cooling device of the present invention are coincident and located at the same position on the plane of the cooling device, which reduces the size of the cooling device and facilitates system integration. Reasonable layout of runners makes the temperature of the chip surface more uniform.

2. The cooling liquid of the present invention enters through the cooling liquid inlet hole, enters the cooling liquid flow channel through the first hollow area, distributes the flow evenly, flows into the M2 heat exchange layer through the drainage of the M3 drainage layer, and exchanges heat with the fins. It flows out from the coolant outlet hole through the third hollow area to take away the heat. The symmetrical distribution ribs in the M4 distribution layer play the role of uniformly dispersing the fluid; the fins in the M2 heat exchange layer play a role in enhancing the heat exchange between the fluid and the solid; at the same time, the symmetrical distribution ribs in the M4 distribution layer and the fins in the M2 heat exchange layer All have the function of mechanical support, so that the layers will not be separated due to excessive internal fluid pressure, or external pressure, and the internal cavity is too large and concave.

Description of drawings

FIG. 1 is an overall schematic diagram of an existing semiconductor device package;

Fig. 2 is the overall schematic diagram of the semiconductor device package of the present invention;

Fig. 3 is a schematic diagram of the explosion structure of the cooling device of the present invention;

4 is a schematic structural diagram of the M5 sealing layer in the heat dissipation device of the present invention;

5 is a schematic structural diagram of the M4 shunt layer in the heat dissipation device of the present invention;

6 is a schematic structural diagram of the M3 drainage layer in the heat dissipation device of the present invention;

7 is a schematic structural diagram of the M2 heat exchange layer in the heat dissipation device of the present invention;

8 is a schematic structural diagram of the M1 sealing layer in the heat dissipation device of the present invention;

The reference numbers in the figure are:

01-chip, 02-solder, 03-heat sink, 04-first water inlet, 05-first water outlet;

1- power chip, 2- heat sink, 3- mounting hole;

25-M5 sealing layer, 24-M4 shunt layer, 23-M3 drainage layer, 22-M2 heat exchange layer, 21-M1 sealing layer;

11- the third area, 12- the fourth area, 111- the cooling liquid outlet;

210-third hollow area, 220-fourth hollow area, 221-fin, 2210-fin root;

31 - drainage groove;

41- First hollow area, 42 - Second hollow area, 421 - Diverter rib, 422 - Coolant flow channel;

51-first area, 52-second area, 53-coolant inlet hole.

Detailed ways

In order to make the above objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are a part of the embodiments of the present invention, not all of them. Example. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention can also be implemented in other ways different from those described herein, and those skilled in the art can do so without departing from the connotation of the present invention. Similar promotion, therefore, the present invention is not limited by the specific embodiments disclosed below.

Second, reference herein to "one embodiment" or "an embodiment" refers to a particular feature, structure, or characteristic that may be included in at least one implementation of the present invention. The appearances of "in other embodiments" in various places in this specification are not all referring to the same embodiment, nor are they separate or selectively mutually exclusive from the other embodiments.

Thirdly, the present invention is described in detail with reference to the schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of explanation, the sectional views showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not be used here. Limit the scope of protection of the present invention. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in the actual production.

Meanwhile, in the description of the present invention, it should be noted that the orientation or positional relationship indicated by "up, down, left, right" in the terminology is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention. The invention and simplified description do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the invention. Furthermore, the terms "first, second, third or fourth" are used for descriptive purposes only and should not be construed to indicate or imply relative importance.

As shown in FIG. 2 , the semiconductor device in this embodiment includes a power chip 1 and a heat dissipation device 2 . The power chip 1 is welded on the surface of the heat dissipation device 2 , and the heat generated by the cooling liquid flowing in the heat dissipation device 2 is used to dissipate the heat generated by the power chip 1 . It can be seen from the orientation shown in FIG. 2 that the cooling liquid inlet hole 53 and the cooling liquid outlet hole 111 of the heat sink in this embodiment are located at the same position, and the central axes of the two are coincident. Two mounting holes 3 are provided on both sides of the cooling liquid outlet hole 111 . Compared with the traditional structure that adopts a plane-parallel layout of the cooling liquid inlet and the cooling liquid outlet (as shown in Figure 1), the present invention greatly reduces the volume of the heat sink, correspondingly reduces the volume of the semiconductor device, and is conducive to integrated design.

As can be seen from FIG. 3 , the heat sink 2 of this embodiment includes an M5 sealing layer 25 , an M4 shunt layer 24 , an M3 drainage layer 23 , an M2 heat exchange layer 22 , an M1 sealing layer 21 , an M5 sealing layer 25 , an M4 sealing layer 21 , an M5 sealing layer 25 and an M4 The shunt layer 24, the M3 drainage layer 23, the M2 heat exchange layer 22 and the M1 sealing layer 21 are stacked sequentially from bottom to top, and they are all rectangular flat plates. Trapezoid etc. The cooling liquid inlet hole 53 is formed on the M5 sealing layer 25 , and the cooling liquid outlet hole 111 is formed on the M1 sealing layer 21 .

It can be seen from FIG. 4 that the M5 sealing layer 25 in this embodiment includes a first area 51 and a second area 52. It should be noted that the M5 sealing layer 25 is divided into the first area 51 and the second area 52 here, only For the convenience of describing the specific position of the cooling liquid inlet hole 53 , there is no obvious dividing line between the first area 51 and the second area 52 . It can be seen from the orientation shown in FIG. 4 that the first area 51 is located below and the second area 52 is located above. The cooling liquid inlet hole 53 is opened on the first area 51 , and the installation hole 3 is opened on the left and right sides of the cooling liquid inlet hole 53 , and is close to the lower left and lower right angles of the M5 sealing layer 25 . In this embodiment, the length direction of the rectangular plate may be defined as the Y direction, and the width direction may be defined as the X direction. The length A4 of each rectangular plate is 13 mm, the diameter of the cooling liquid inlet hole 53 is 6 mm, and the diameter φ of the installation hole 3 is 2 mm.

As can be seen from FIG. 5 , the M4 shunt layer 24 in this embodiment has a first hollow area 41 and a second hollow area 42 that communicate with each other. It should also be noted that the M4 shunt layer 24 is divided into the first hollow area 41 here. The second hollow area 42 is only for the convenience of describing the specific structure of the M4 shunt layer 24 . As can be seen from the orientation shown in FIG. 5 , the first hollow area 41 is located below, the second hollow area 42 is located above, and the first hollow area 41 is adapted to the shape of the coolant inlet hole 53 of the M5 sealing layer 25 . The central axes of the two are coincident, and communicate with each other with the cooling liquid inlet hole 53 of the M5 sealing layer 25 . The second hollow area 42 is provided with a plurality of shunt ribs 421 , each shunt rib 421 extends along the Y direction, and the plurality of shunt ribs 421 are arranged along the X direction. The two regions 52 cooperate to form a plurality of cooling liquid flow channels 422 extending along the Y direction and arranged along the X direction; one end of the cooling liquid flow channel 422 close to the first hollow area 41 is the cooling liquid inlet, which is far away from the first hollow area. One end of 41 is the cooling liquid outlet; for more uniform distribution, the length of the distribution rib 421 located in the middle area in this embodiment is greater than the length of the distribution rib 421 located in the two sides, and the length here is the length of the distribution rib along Y. The extension of the direction. The distribution ribs on both sides are symmetrically arranged with respect to the distribution ribs in the middlemost area. As can be seen from FIG. 5 , there are 9 diverting ribs in this embodiment, which are defined as the first diverting rib, the second diverting rib, the third diverting rib, the fourth diverting rib, the third diverting rib from left to right The fifth rib, the sixth rib, the seventh rib, the eighth rib, and the ninth rib; the fifth rib is the rib located in the middlemost area, and the dimension along the Y direction A5 is equal to 6mm, the dimensions of the fourth and sixth diverting ribs in the Y direction are equal to 5mm; the dimensions of the third and seventh diverting ribs in the Y direction are equal to 3.5mm; The dimensions of the rib plate and the eighth diverting rib along the Y direction are both equal to 3 mm; the dimensions of the first diverting rib and the ninth diverting rib along the Y direction are equal to 1.9 mm. The width of each rib plate 421 and the dimension A1 along the X direction are 0.20mm, and the distance between two adjacent rib plates is 0.8mm.

As can be seen from FIG. 6 , a drainage groove 31 is provided on the M3 drainage layer 23 in this embodiment, the drainage groove 31 extends along the X direction, and the bottom of the drainage groove 31 corresponds to and communicates with the cooling liquid outlet of each cooling liquid flow channel 422; From the orientation shown in FIG. 6 , the drainage groove 31 can also be described as an elongated through hole opened on the upper edge of the M3 drainage layer 23 , and the elongated through hole extends along the X direction. The width of the drainage groove 31, that is, the dimension A2 along the Y direction is 0.50 mm.

As can be seen from FIG. 7 , the M2 heat exchange layer 22 in the present embodiment has a third hollow area 210 and a fourth hollow area 220 that communicate with each other. It should also be noted that the M2 heat exchange layer 22 is divided into third hollow areas here. The area 210 and the fourth hollow area 220 are only for the convenience of describing the specific structure of the M2 heat exchange layer 22 . It can be seen from the orientation shown in FIG. 7 that the third hollow area 210 is located below, and the fourth hollow area 220 is located above. The shape of the third hollow area 210 and the first hollow area 41 of the M4 shunt layer 24 are matched in shape, the position is corresponding, and the central axes of the two coincide; The fins 221 are arranged on the fourth hollow area 220 to match and correspond to the positions. The fin roots 2210 correspond to and communicate with the drainage grooves 31 on the M3 drainage layer 23; is 0.30mm.

It can be seen from FIG. 8 that the M1 sealing layer 21 includes the third area 11 and the fourth area 12 in this embodiment. It should also be noted that the M1 sealing layer 21 is divided into the third area 11 and the fourth area 12 here. Just for the convenience of describing the specific structure of the M1 sealing layer 21 and the specific opening positions of the cooling liquid outlet holes 111 , there is no obvious boundary line between the third area 11 and the fourth area 12 . The third area 11 corresponds to the position of the third hollow area 210 on the M2 heat exchange layer, the fourth area 12 corresponds to the position of the fourth hollow area 220 on the M2 heat exchange layer, and the cooling liquid outlet hole 111 is opened on the third area 11 and It communicates with the third hollow area 210 ; the cooling liquid outlet hole 111 coincides with the central axis of the cooling liquid inlet hole 53 ; the upper surface of the fourth area 12 is the power chip mounting area for installing the power chip.

In this embodiment, the cooling liquid enters from the cooling liquid inlet hole 53 and enters the cooling liquid flow channel 422 through the first hollow area 41 to realize the split flow; the cooling liquid flowing out of the cooling liquid flow channel 422 flows into the fourth hollow area 220 through the drainage groove 31, Heat exchange is achieved through the fins 221 , and the hot fluid flows out from the cooling liquid outlet hole 111 through the third hollow area 210 to take away heat. Because the cooling liquid inlet hole 53 and the cooling liquid outlet hole 111 have the same diameter and the central axis coincides, the volume of the heat sink can be greatly reduced, and the present invention optimizes the distribution of the cooling liquid flow channel 422 and the shape of the fins 221 , so that the surface temperature of the power chip is more uniform.

Claims (11)

1. A miniaturized heat dissipation device applied to a power chip, characterized in that it comprises an M5 sealing layer (25), an M4 shunt layer (24), an M3 drainage layer (23), and an M2 replacement layer that are stacked from bottom to top. Thermal layer (22) and M1 sealing layer (21); Corresponding positions on the M5 sealing layer (25), the M4 shunt layer (24), the M3 drainage layer (23), the M2 heat exchange layer (22) and the M1 sealing layer (21) are provided with mutually penetrating installation holes ( 3); The M5 sealing layer (25) includes a first region (51) and a second region (52), and a cooling liquid inlet hole (53) for liquid inlet is opened on the first region (51); The M4 shunt layer (24) is provided with a first hollow area (41) and a second hollow area (42) that communicate with each other, the first hollow area (41) and the coolant inlet hole (53) of the M5 sealing layer (25). ) in corresponding positions and connected with each other, a plurality of shunt ribs (421) are arranged on the second hollow area (42), each shunt rib (421) extends along the Y direction, and a plurality of shunt ribs (421) are arranged in the X direction cloth, each shunt rib (421) cooperates with the second region (52) of the M5 sealing layer (25) to form a plurality of cooling liquid flow channels (422) extending along the Y direction and arranged along the X direction; the cooling liquid flow One end of the channel (422) close to the first hollow area (41) is the cooling liquid inlet, and the end away from the first hollow area (41) is the cooling liquid outlet; The M3 drainage layer (23) is provided with drainage grooves (31), the drainage grooves (31) extend along the X direction, and the bottom of the drainage grooves (31) is in phase with the cooling liquid outlet position of each cooling liquid flow channel (422). Corresponding and interconnected; The M2 heat exchange layer (22) is provided with a third hollow area (210) and a fourth hollow area (220) that are connected to each other, the third hollow area (210) and the first hollow area (41) of the M4 shunt layer (24). ) corresponding to the positions; the fourth hollow area (220) is provided with fins (221), and the fin roots (2210) correspond to and communicate with the drainage grooves (31) on the M3 drainage layer (23); The M1 sealing layer (21) includes a third area (11) and a fourth area (12), and the third area (11) corresponds to the position of the third hollow area (210) on the M2 heat exchange layer (22). The area (12) corresponds to the position of the fourth hollow area (220) on the M2 heat exchange layer (22); the third area (11) is provided with a cooling liquid outlet hole ( 111); the cooling liquid outlet hole (111) coincides with the central axis of the cooling liquid inlet hole (53); the upper surface of the fourth area (12) is the power chip mounting area for mounting the power chip. 2. The miniaturized heat dissipation device applied to a power chip according to claim 1, characterized in that: the M5 sealing layer (25), the M4 shunt layer (24), the M3 drainage layer (23), and the M2 heat exchange layer (22) and the M1 sealing layer (21) have the same shape and size. 3. The miniaturized heat dissipation device applied to a power chip according to claim 2, wherein: Among the plurality of split ribs (421) of the M4 split layer (24), the length of the split ribs located in the middle area is greater than the length of the split ribs located in the two sides, and the length is the length of the split ribs (421). The extension length in the Y direction. 4. The miniaturized heat dissipation device applied to a power chip according to claim 3, wherein: The plurality of shunt ribs (421) of the M4 shunt layer (24) are arranged symmetrically with respect to the shunt ribs in the middlemost region. 5. The miniaturized heat dissipation device applied to a power chip according to claim 4, characterized in that: there are two mounting holes (3) in the M5 sealing layer (25), which are located in the cooling liquid inlet hole (53) sides. 6. The miniaturized heat dissipation device applied to a power chip according to claim 5, wherein: The M5 sealing layer (25), the M4 diversion layer (24), the M3 drainage layer (23), the M2 heat exchange layer (22) and the M1 sealing layer (21) are all rectangular flat plates. 7. The miniaturized heat dissipation device applied to a power chip according to claim 6, wherein: Both the cooling liquid outlet hole (111) and the cooling liquid inlet hole (53) are round holes with the same diameter. 8. The miniaturized heat dissipation device applied to a power chip according to claim 7, characterized in that: the size of the plurality of shunt ribs (421) along the X direction is the same; the size of the partition plate in the fins (221) along the X direction same. 9. The miniaturized heat dissipation device applied to a power chip according to claim 8, wherein: The length A4 of the rectangular plate is 13mm, the diameter of the coolant inlet hole (53) is 6mm, and the dimension A1 of each shunt rib plate (421) along the X direction is equal to 0.20mm, and the shunt rib located in the most middle area The dimension A5 of the plate along the Y direction is 6mm, the dimension A2 of the drainage groove (31) along the Y direction is 0.50mm, the dimension A3 of the partition plate in the fin (221) along the X direction is 0.30mm, and the diameter of the mounting hole (3) is 2mm. 10 . The miniaturized heat dissipation device applied to a power chip according to claim 9 , wherein the number of said shunt ribs ( 421 ) is 9, which are defined as the first shunt rib and the second rib plate from left to right. 11 . Splitting rib, third splitting stiffener, fourth splitting stiffener, fifth splitting stiffener, sixth splitting stiffener, seventh splitting stiffener, eighth splitting stiffener, ninth splitting stiffener; the fifth splitting stiffener The rib is the diverting rib located in the most middle area, and the dimensions of the fourth diverting rib and the sixth diverting rib in the Y direction are equal to 5mm; The dimensions of the third diverting rib and the seventh diverting rib in the Y direction are equal to 3.5mm; the dimensions of the second diverting rib and the eighth diverting rib in the Y direction are equal to 3 mm; The dimensions of the nine-split rib plates along the Y direction are equal to 1.9mm; the distance between the two adjacent split rib plates is 0.8mm. 11. A semiconductor device, characterized by comprising a power chip and the miniaturized heat dissipation device applied to a power chip according to any one of claims 1-10, wherein the power chip is fixed on the first place of the sealing layer (21) of the heat dissipation device M1. The upper surface of the quad area (12).

Images