CN113840450A - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN113840450A CN113840450A CN202111161998.XA CN202111161998A CN113840450A CN 113840450 A CN113840450 A CN 113840450A CN 202111161998 A CN202111161998 A CN 202111161998A CN 113840450 A CN113840450 A CN 113840450A
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- Prior art keywords
- circuit board
- printed circuit
- area
- layer
- overflow
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The embodiment of the invention discloses a printed circuit board, which is provided with a component area and a first overflow prevention area positioned at the periphery of the component area; the printed circuit board includes: a first stacked structure; the first lamination structure includes: the circuit comprises a circuit layer and a first covering film positioned on one side of the circuit layer; the first side of the first laminated structure extends from the element area to the first overflow-preventing area and is step-shaped; the first side of the first lamination structure is adjacent to the component mounting surface of the component region. The technical scheme provided by the embodiment of the invention can improve the position precision of the defined line, prevent the glue from overflowing, effectively control the glue overflowing range and improve the space utilization rate.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a printed circuit board.
Background
Printed circuit boards are important electronic components in electronic devices, are supports for electronic components, and are carriers for electrical connection of electronic components.
As the volume of electronic equipment decreases, the density of devices soldered on a printed circuit board increases, the size of the devices decreases, the space occupied by the devices on the printed circuit board is limited, and the spacing between the devices is limited. The small-size encapsulation device welded on the printed circuit board needs to be glued at the periphery of the small-size encapsulation device to fix the device, and the risk that the small-size encapsulation device falls off in the transportation process and the installation process is avoided. Since there is a certain glue overflow range in the dispensing process, a definition line needs to be made on the printed circuit board to control the glue overflow range. At present, white silk-screen printing ink is used as a defining line, the process deviation of the white silk-screen printing ink is large, reference value is not provided, and the space utilization rate is low.
Disclosure of Invention
Embodiments of the present invention provide a printed circuit board, so as to improve the position accuracy of a defined line, prevent glue from overflowing, effectively control a glue overflowing range, and improve a space utilization rate.
The embodiment of the invention provides a printed circuit board, which is provided with a component area and a first overflow prevention area positioned at the periphery of the component area; the printed circuit board includes: a first stacked structure; the first lamination structure includes: the circuit comprises a circuit layer and a first covering film positioned on one side of the circuit layer; the first side of the first laminated structure extends from the element area to the first overflow-preventing area and is step-shaped; the first side of the first lamination structure is adjacent to the component mounting surface of the component region.
Furthermore, the first cover film is provided with a window, and the element area is positioned in the window, so that the first side of the first laminated structure extends from the element area to the first anti-overflow area and is in a rising step shape;
the first lamination structure further comprises a first solder resist ink layer, wherein the first solder resist ink layer comprises a middle part and an outer edge part surrounding the middle part; the middle part of the first solder resist ink layer is positioned in the window, and the outer edge part of the first solder resist ink layer covers one side, far away from the circuit layer, of the first cover film surrounding the window; the outer edge part of the first solder resist ink layer covers the first overflow-proof area; the middle part of the first solder resist ink layer is recessed relative to the outer edge part thereof in a direction close to the circuit layer.
Further, the printed circuit board further includes:
the element is positioned on one side of the first solder resist ink layer away from the circuit layer; the element is located in the element region;
the adhesive is positioned on one side of the first solder resist ink layer away from the circuit layer; an adhesive disposed around the element; the first anti-flow-over area is for blocking the flow of adhesive in a direction away from the component.
Further, the color of the first cover film is different from the color of the first solder resist ink layer; the printed circuit board is a flexible printed circuit board.
Further, the line layer is provided with a first line structure and/or a first groove structure in the first anti-overflow area; the circuit layer extends from the element area to the first anti-overflow area in different structures, so that the first side of the first laminated structure extends from the element area to the first anti-overflow area in a step shape.
Further, the printed circuit board further includes:
the element is positioned on one side, far away from the circuit layer, of the first covering film; the element is located in the element region;
the adhesive is positioned on one side, far away from the circuit layer, of the first covering film; an adhesive disposed around the element; the first anti-flow-over area is for blocking the flow of adhesive in a direction away from the component.
Furthermore, the circuit layers in the first laminated structure are multiple layers; the first laminated structure further includes at least one insulating layer; the circuit layers and the insulating layers are alternately stacked along the thickness direction of the printed circuit board; the circuit layer and the insulating layer are positioned on the same side of the first covering film; a circuit layer is arranged between any insulating layer and the first covering film; one or at least two of the line layers are provided with a first line structure in the first anti-overflow area, and/or one or at least two of the line layers are provided with a first groove structure in the first anti-overflow area.
Further, the circuit layer closest to the first cover film is provided with a first line structure and/or a first groove structure in the first overflow prevention area;
the first overflow-preventing area is provided with a first line structure and/or a first groove structure, and the first line structure and/or the first groove structure in all the line layers are spliced into a continuous circle;
along the thickness direction of the printed circuit board, orthographic projections of the first line structures in the first overflow prevention area in at least part of the line layers on the first cover film are partially or completely overlapped; or, in the thickness direction of the printed circuit board, orthographic projections of the first groove structures on the first cover film in the first anti-overflow area in at least part of the line layers are partially or completely overlapped.
Further, the first cover film forms a protrusion due to the first line structure; the first covering film is sunken due to the first groove structure; the printed circuit board is a flexible printed circuit board.
Further, the printed circuit board is provided with a second anti-overflow area which is positioned at the periphery of the first anti-overflow area; the first side of the first laminated structure extends from the first anti-overflow area to the second anti-overflow area and is in a step shape;
the first lamination structure further comprises a second solder resist ink layer, and the second solder resist ink layer is positioned on one side, far away from the circuit layer, of the first covering film; the second solder resist ink layer is located in the second anti-overflow area.
In the technical scheme of the embodiment of the invention, the printed circuit board is provided with a component area, and the printed circuit board is provided with the component area and a first overflow prevention area positioned at the periphery of the component area; the printed circuit board includes: a first stacked structure; the first lamination structure includes: the circuit comprises a circuit layer and a first covering film positioned on one side of the circuit layer; the first side of the first laminated structure extends from the element area to the first overflow-preventing area and is step-shaped; the first side of the first laminated structure is close to the element mounting surface of the element area, so that the accuracy of the defined line can be improved, the glue overflow range can be effectively controlled, and the space utilization rate is improved.
Drawings
Fig. 1 is a schematic top view of a printed circuit board without components soldered thereon according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional view illustrating a printed circuit board without components soldered thereon according to an embodiment of the present invention;
fig. 3 is a schematic top view of a printed circuit board with components soldered thereon according to an embodiment of the present invention;
fig. 4 is a schematic cross-sectional view illustrating a printed circuit board with components soldered thereon according to an embodiment of the present invention;
FIG. 5 is a schematic top view of another PCB without soldering components according to an embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view of another printed circuit board without components soldered thereon according to an embodiment of the present invention;
fig. 7 is a schematic top view illustrating another printed circuit board with components soldered thereon according to an embodiment of the present invention;
fig. 8 is a schematic cross-sectional view illustrating a printed circuit board having components soldered thereon according to another embodiment of the present invention;
FIG. 9 is a schematic top view of another PCB without soldering components according to an embodiment of the present invention;
FIG. 10 is a schematic cross-sectional view of another printed circuit board without components mounted thereon according to an embodiment of the present invention;
fig. 11 is a schematic cross-sectional view illustrating a printed circuit board having components soldered thereon according to another embodiment of the present invention;
FIG. 12 is a schematic cross-sectional view of another printed circuit board without components mounted thereon according to an embodiment of the present invention;
fig. 13 is a schematic cross-sectional view illustrating a printed circuit board having components soldered thereon according to another embodiment of the present invention;
fig. 14 is a schematic cross-sectional view illustrating a printed circuit board having components soldered thereon according to another embodiment of the present invention;
FIG. 15 is a schematic cross-sectional view of another printed circuit board without components mounted thereon according to an embodiment of the present invention;
FIG. 16 is a schematic cross-sectional view illustrating a printed circuit board without components mounted thereon according to another embodiment of the present invention;
FIG. 17 is a schematic top view of another PCB without components being soldered according to an embodiment of the present invention;
FIG. 18 is a cross-sectional view of another printed circuit board without components mounted thereon according to an embodiment of the present invention;
FIG. 19 is a schematic top view of another PCB without components being soldered according to an embodiment of the present invention;
FIG. 20 is a cross-sectional view of another printed circuit board without components mounted thereon according to an embodiment of the present invention;
FIG. 21 is a cross-sectional view of another printed circuit board without components mounted thereon according to an embodiment of the present invention;
FIG. 22 is a cross-sectional view of another printed circuit board without components mounted thereon according to an embodiment of the present invention;
fig. 23 is a schematic cross-sectional view illustrating a printed circuit board without components soldered thereon according to another embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
The embodiment of the invention provides a printed circuit board. Fig. 1 is a schematic top view of a printed circuit board without components soldered thereon according to an embodiment of the present invention. Fig. 2 is a schematic cross-sectional view of a printed circuit board without components soldered thereon according to an embodiment of the present invention. Fig. 2 may be a schematic cross-sectional view taken along a direction A1a2 in fig. 1. Fig. 3 is a schematic top view of a printed circuit board with components soldered thereon according to an embodiment of the present invention. Fig. 4 is a schematic cross-sectional view illustrating a printed circuit board with components soldered thereon according to an embodiment of the present invention. Fig. 4 can be a schematic cross-sectional view taken along a direction A1a2 in fig. 3. The printed circuit board 100 is provided with a component area 1 and a first anti-blooming area 2 located at the periphery of the component area 1. Element region 1 may be used to place element 40. The component 40 may be soldered to the surface of the printed circuit board 100. The printed circuit board 100 includes: a first stacked structure. The first lamination structure includes: a circuit layer 10 and a first coverlay 20 positioned at one side of the circuit layer 10; the first side of the first laminated structure extends from the element area 1 to the first anti-overflow area 2 and is step-shaped; the first side of the first layered structure is close to the component mounting surface of the component area 1.
Optionally, the Printed Circuit board is a Flexible Printed Circuit (FPC for short). The wiring layer 10 may be formed by patterning the conductive layer by etching or the like. The conductive layer may comprise a metal layer or the like, for example the metal layer may comprise at least one of: a copper layer and an aluminum layer. The circuit layer 10 may include a plurality of signal lines (not shown) and a plurality of pads (not shown), the plurality of signal lines and the plurality of pads being electrically connected to each other, the plurality of pads being located in the device region 1. A plurality of pads may be used for soldering with the component 40. The first coverfilm 20 can include at least one of: flexible films such as polyimide films and polyester films. An adhesive 50 such as glue is applied around the soldered component 40 to secure the component 40. The device region 1 may be a flat region. The element region 1 of the first side of the first lamination structure is recessed with respect to the first anti-flow-through area 2 in a direction close to the second side of the first lamination structure or is raised in a direction away from the second side of the first lamination structure. The first and second sides of the first lamination are oppositely disposed. The first side of the first lamination structure has a height difference between at least a partial region of the first anti-blooming region 2 and the element region 1 to form a step, and the height direction is parallel to the thickness direction of the printed circuit board (parallel to the direction Z).
The circuit layer 10 and/or the first cover film 20 of the element region 1 and the first anti-overflow area 2 may be selectively removed and retained, and the removed area and the retained area form a step area with concave-convex variation, so that the first side of the first lamination structure extends from the element region 1 to the first anti-overflow area 2 in a step shape, so as to inhibit the adhesive 50 from flowing in a direction away from the element 40, thereby controlling the overflow glue range. Because the process precision of making line layer 10 and first cover film 20 is higher than the process precision of making white silk screen printing ink layer to can improve the accuracy of defining the mark position, thereby can improve the management and control precision to the gluing scope, improve space utilization.
Alternatively, on the basis of the above-mentioned embodiment, with continued reference to fig. 1 to 4, the first cover film 20 is provided with the window 21, and the element region 1 is located in the window 21, so that the first side of the first laminated structure extends from the element region 1 to the first anti-overflow area 2 in a rising step shape.
The first laminated structure further includes: first solder resist ink layer 30.
First solder resist ink layer 30 includes a middle portion 31 and a peripheral portion 32 surrounding middle portion 31; the middle part 31 of the first solder resist ink layer 30 is located in the window 21, and the outer edge part 32 of the first solder resist ink layer 30 covers the side, away from the circuit layer 10, of the first cover film 20 surrounding the window 21; the outer edge part of the first solder resist ink layer 30 covers the first anti-overflow area 2; intermediate portion 31 of first solder resist ink layer 30 is recessed with respect to outer edge portion 32 thereof in a direction approaching wiring layer 10.
Wherein, the middle portion 31 of the first solder resist ink layer 30 may be provided with a plurality of openings (not shown in the figures) to expose the plurality of pads, i.e. the middle portion 31 of the first solder resist ink layer 30 does not cover the plurality of pads. A portion of the first cover film 20 may be removed by a laser etching process or the like to form a window 21 on the first cover film 20, which is equivalent to a hole penetrating through the first cover film 20, and then the windowing accuracy of the device region is improved by using an ink solder mask. The area of the window 21 is larger than that of the device region 1, which is equivalent to extending the range of the window 21 outward to a certain range along the edge of the pad to be used as a dispensing range. The first solder resist ink layer 30 is stepped at the edge of the window 21 by utilizing the step generated by the height difference between the first cover film 10 and the circuit layer 10 below the window 21, the middle part 31 of the first solder resist ink layer 30 is recessed towards the direction close to the circuit layer 10 relative to the outer edge part 32 thereof, the element 40 and the adhesive 50 can be positioned in the recessed area of the first solder resist ink layer 30, and the outer edge part 32 of the first solder resist ink layer 30 can block the overflow of the adhesive 50 to control the glue overflow range. The edge profile of the first solder resist ink layer 30 is equivalent to a definition mark (i.e. a mark line), and the process precision for manufacturing the first solder resist ink layer 30 is higher than the process precision for manufacturing the white silk-screen ink layer, so that the accuracy of the definition mark position can be improved, the control precision of the spot gluing range can be improved, and the space utilization rate can be improved.
Optionally, on the basis of the above embodiment, with continuing reference to fig. 3 and 4, the printed circuit board further includes: element 40 and adhesive 50.
Wherein, the element 40 is located on the side of the first solder resist ink layer 30 away from the circuit layer 10; the element 40 is located in the element region 1. The adhesive 50 is positioned on the side of the first solder resist ink layer 30 away from the circuit layer 10; adhesive 50 is disposed around element 40; the first anti-overflow area 2 serves to block the adhesive 50 from flowing in a direction away from the element 40.
Among them, the element 40 may be one or more. The element region 1 may be plural or one. The elements 40 and the element regions 1 may correspond one to one. Different elements 40 correspond to different element regions 1. Component 40 may be a small-scale packaged device and component 40 may include a chip. The adhesive 50 may include an insulating glue. The direction Z may be perpendicular to the direction X. The direction X may be perpendicular to the direction Y. The direction Z may be perpendicular to the direction Y. A1a2 may be parallel to direction Y. The shape of element region 1 and the shape of the outline of the outer edge of the orthographic projection of element 40 on first solder resist ink layer 30 may be the same and may be equal in size. Along the thickness direction of printed circuit board 100 (parallel to direction Z), the orthographic projection of adhesive 50 on first solder resist ink layer 30 may be located within the outline of the outer edge of first solder resist ink layer 30.
Optionally, the color of the first cover film 20 is different from the color of the first solder resist ink layer 30. The more obvious the color difference of the first cover film 20 and the first solder resist ink layer 30 is, the more convenient the outline of the defined mark can be identified, and the dispensing range can be identified conveniently. The first cover film 20 may be yellow. First solder resist ink layer 30 may be green.
Alternatively, the wiring layer 10 may be one or more layers. Fig. 2 exemplarily shows a case where the wiring layer 10 is one layer. Fig. 4 exemplarily shows a case where the wiring layer 10 is two layers, which are the wiring layer 10-1 and the wiring layer 10-2, respectively.
Optionally, on the basis of the above embodiment, with continued reference to fig. 4, the printed circuit board 100 further includes at least one insulating layer 60; along the thickness direction (parallel to the direction Z) of the printed circuit board 100, the wiring layers 10 and the insulating layers 60 are alternately stacked; the wiring layer 10 and the insulating layer 60 are located on the same side of the first coverlay 20, and the wiring layer 10 is disposed between any one of the insulating layers 60 and the first coverlay 20. The signal lines in the different circuit layers 10 may be electrically connected to each other through vias (not shown) penetrating through the insulating layer 60.
Optionally, on the basis of the above embodiment, with continued reference to fig. 4, the printed circuit board 100 further includes a second cover film 70. The wiring layer 10 and the insulating layer 60 may be located between the first coverlay 20 and the second coverlay 70. The second cover film 70 can include at least one of: flexible films such as polyimide films and polyester films. A wiring layer 10 is provided between any one of the insulating layers 60 and the second coverlay film 70.
The embodiment of the invention provides a printed circuit board. Fig. 5 is a schematic top view of another printed circuit board without components soldered thereon according to an embodiment of the present invention. Fig. 6 is a schematic cross-sectional view illustrating a printed circuit board without components soldered thereon according to another embodiment of the present invention. Fig. 6 may be a schematic cross-sectional view taken along the direction B1B2 in fig. 5. Fig. 7 is a schematic top view of another printed circuit board with components soldered thereon according to an embodiment of the invention. Fig. 8 is a schematic cross-sectional view illustrating a printed circuit board with components soldered thereon according to another embodiment of the present invention. Fig. 8 can be a schematic cross-sectional view taken along the direction B1B2 in fig. 7. On the basis of the above embodiment, the circuit layer 10 is provided with the first groove structure 12 at the first anti-overflow area 2; the circuit layer 10 extends from the device region 1 to the first anti-overflow area 2 in a different structure, so that the first side of the first stacked structure extends from the device region 1 to the first anti-overflow area 2 in a step shape.
As shown in fig. 5 and 6, the circuit layer 10 of the first anti-overflow area 2 is removed by etching and other processes, the circuit layers 10 on two sides of the first anti-overflow area 2 are remained, so as to form a first groove structure 12 at the position of the first anti-overflow area 2, and the first cover film 20 may be recessed along with the first groove structure 12 of the circuit layer 10, thereby forming a defining mark. The delimiting mark may be a continuous ring of first groove structures 12 around the element region 1, i.e. the delimiting mark is in a solid line shape, or the delimiting mark may be an intermittent ring of first groove structures 12 around the element region 1, i.e. the delimiting mark is in a dashed line shape. The shape of the delimiting mark is the same as or similar to the shape of the element region 1. The first anti-overflow area 2 is located at the periphery of the device area 1, and an area between the first anti-overflow area 2 and the device area 1 may be a dispensing range. Further, the first groove structure 12 may penetrate the line layer 10.
As shown in fig. 8, the first cover film 20 above the first groove structure 12 for forming the mark is recessed, so that a part of the adhesive 50 can be accommodated, and the overflow range of the adhesive 50 is prevented from being too large to control the overflow range. Because the process precision of manufacturing the line layer 10 is higher than that of manufacturing the white silk-screen printing ink layer, the accuracy of defining the marking position can be improved, the control precision of the dispensing range can be improved, and the space utilization rate is improved.
The embodiment of the invention provides a printed circuit board. Fig. 9 is a schematic top view of another printed circuit board without components soldered thereon according to an embodiment of the present invention. Fig. 10 is a schematic cross-sectional view illustrating a printed circuit board without components soldered thereon according to another embodiment of the present invention. Fig. 11 is a schematic cross-sectional view illustrating a printed circuit board with components soldered thereon according to another embodiment of the present invention. On the basis of the above embodiment, the line layer 10 is provided with the first line structure 11 at the first anti-overflow area 2; the circuit layer 10 extends from the device region 1 to the first anti-overflow area 2 in a different structure, so that the first side of the first stacked structure extends from the device region 1 to the first anti-overflow area 2 in a step shape.
As shown in fig. 9 and 10, by etching and other processes, the circuit layer 10 of the first anti-overflow area 2 is retained, the circuit layers 10 on two sides of the first anti-overflow area 2 are removed, so as to form a first line structure 11 at the position of the first anti-overflow area 2, and the first cover film 20 may protrude along with the first line structure 11 disposed in the circuit layer 10, so as to form a defining mark. The position and shape of the delimiting marks in the solution corresponding to fig. 10 are the same or similar to those in the solution corresponding to fig. 6. The delimiting mark may be a continuous ring of the first line structure 11 around the element region 1, i.e. the delimiting mark is in a solid line shape, or the delimiting mark may be an intermittent ring of the first line structure 11 around the element region 1, i.e. the delimiting mark is in a dashed line shape. The shape of the delimiting mark is the same as or similar to the shape of the element region 1. The first anti-overflow area 2 is located at the periphery of the device area 1, and the distance between the first anti-overflow area 2 and the device area 1 may be a dispensing range.
As shown in fig. 11, the first cover film 20 above the first line structure 11 for forming the defined mark is raised, so that the adhesive 50 can be blocked from overflowing to control the overflow. Because the process precision of manufacturing the line layer 10 is higher than that of manufacturing the white silk-screen printing ink layer, the accuracy of defining the marking position can be improved, the control precision of the dispensing range can be improved, and the space utilization rate is improved.
The embodiment of the invention provides a printed circuit board. Fig. 12 is a schematic cross-sectional view illustrating a printed circuit board without components soldered thereon according to another embodiment of the present invention. Fig. 13 is a schematic cross-sectional view illustrating a printed circuit board with components soldered thereon according to another embodiment of the present invention. On the basis of the above embodiment, the circuit layer 10 is provided with the first line structure 11 and the first groove structure 12 in the first anti-overflow area 2; the circuit layer 10 extends from the device region 1 to the first anti-overflow area 2 in a different structure, so that the first side of the first stacked structure extends from the device region 1 to the first anti-overflow area 2 in a step shape.
The first line structure 11 and the first groove structure 12 may be located on the same circuit layer or different circuit layers. Fig. 12 exemplarily shows a case where the first line structure 11 and the second groove structure 12 are located on different line layers, wherein the first line structure 11 is located in the line layer 10-1, the first groove structure 12 is located in the line layer 10-2, and an insulating layer 60 is disposed between the line layer 10-1 and the line layer 10-2. The first line structure 11 and the first groove structure 12 may be spliced into a loop around the component area 1 to form a loop of delimiting marks. The positions and shapes of the delimiting marks in the solution corresponding to fig. 12, the solution corresponding to fig. 10 and the solution corresponding to fig. 6 are the same or similar.
As shown in fig. 13, the first coverlay film 20 may be recessed along with the first groove structure 12 disposed on the circuit layer 10. The insulating layer 60 may be recessed along with the first groove structure 12 disposed on the circuit layer 10. The first cover film 20 above the first groove structure 12 for forming the defined mark is recessed, so that a part of the adhesive 50 can be accommodated, and the overflow range of the adhesive 50 is prevented from being too large to control the overflow range. The first coverlay film 20 may be protruded with the first line structure 11 disposed on the circuit layer 10. The insulating layer 60 may be raised with the first line structure 11 disposed on the circuit layer 10. The first cover film 20 above the first line structure 11 for forming the defined mark is raised, so that the adhesive 50 can be blocked from overflowing to control the overflow range. Because the process precision of manufacturing the line layer 10 is higher than that of manufacturing the white silk-screen printing ink layer, the accuracy of marking position defining can be improved, the control of the dispensing range can be improved, and the space utilization rate is improved.
Optionally, on the basis of the above embodiment, with continuing reference to fig. 8, 11 or 13, the printed circuit board 100 further includes: element 40 and adhesive 50.
Wherein, the component 40 is located on one side of the first coverlay 20 away from the circuit layer 10; the element 40 is located in the element region 1. The adhesive 50 is located on the side of the first coverlay film 20 away from the circuit layer 10; the adhesive 50 is disposed around the element 1; the first anti-overflow area 2 serves to block the adhesive 50 from flowing in a direction away from the element 40.
Wherein the element 40 and the adhesive 50 may be located within a range surrounded by the delimiting mark formed by the first line structure 11 and/or the first groove structure 12. The projection of the adhesive 50 on the line layer 10 in the thickness direction Z of the printed circuit board may be located in the area surrounded by the first line structure 11 and/or the first groove structure 12.
Alternatively, on the basis of the above embodiment, fig. 14 is a schematic cross-sectional structure diagram of another printed circuit board according to an embodiment of the present invention when components are soldered thereon, where the circuit layer 10 in the first stacked structure is a multilayer. Wherein a part of the line layer 10 (e.g. the line layer 10-1 in fig. 14) is provided with a first line structure 11 and/or a first groove structure 12 for forming the delimiting mark 2; another portion of the circuit layer 10 (e.g., the circuit layer 10-2 in fig. 14) is not provided with the first line structure 11 and/or the first groove structure 12 for forming the mark, and the other portion of the circuit layer 10 can be used to form a plurality of signal lines and can be electrically connected to the component 40.
Optionally, on the basis of the above embodiment, with continuing reference to fig. 8, 11, 13 or 14, the first stacked structure further includes at least one insulating layer 60; the wiring layers 10 and the insulating layers 60 are alternately stacked in the thickness direction Z of the printed circuit board 100; the wiring layer 10 and the insulating layer 60 are located on the same side of the first coverlay 20. A wiring layer 10 is provided between any of the insulating layers 60 and the first coverlay film 20.
Optionally, on the basis of the above embodiment, with continued reference to fig. 12, the printed circuit board 100 further includes a second cover film 70. The wiring layer 10 and the insulating layer 60 may be located between the first coverlay 20 and the second coverlay 70. A wiring layer 10 is provided between any one of the insulating layers 60 and the second coverlay film 70. The signal lines in the different circuit layers 10 may be electrically connected to each other through vias (not shown) penetrating through the insulating layer 60.
Alternatively, on the basis of the above embodiment, fig. 15 is a schematic cross-sectional view of another printed circuit board without soldering components according to an embodiment of the present invention, and one or at least two of the circuit layers 10 are provided with the first groove structure 12 in the first anti-overflow area 2. Fig. 15 exemplarily shows a case where at least two layers of the wiring layer 10 are provided with the first groove structure 12 at the first anti-flooding area 2, wherein the wiring layer 10-1 is provided with the first groove structure 12-1 and the wiring layer 10-2 is provided with the first groove structure 12-2.
Optionally, on the basis of the above-described embodiment, one or at least two of the line layers 10 are provided with the first line structures 11 in the first anti-overflow area 2.
Optionally, on the basis of the above embodiment, with reference to fig. 14, the first line structure 11 and/or the first groove structure 12 is/are disposed on the circuit layer 10 closest to the first cover film 20, and compared with the manner in which the first line structure 11 and/or the first groove structure 12 is/are disposed on the circuit layer 10 far from the first cover film 20, so as to form the definition mark, the case that the definition mark is not obvious due to an insignificant protrusion or depression degree of the first cover film 20 after the first line structure 11 and/or the first groove structure 12 are disposed on the circuit layer 10 far from the first cover film 20 through the overlapping influence of the intermediate insulating layer 60 can be avoided.
Optionally, on the basis of the above embodiment, the first line structures 11 and/or the first groove structures 12 in all the line layers 10 provided with the first line structures 11 and/or the first groove structures 12 in the first anti-overflow area 2 are spliced into a continuous circle, which can better prevent glue from overflowing compared to the way that a circle of the first line structures 11 and/or the first groove structures 12 is intermittently provided like a dotted line shape.
Optionally, the first line structures 11 in all the line layers 10 of the first line structure 11 arranged in the first anti-overflow area 2 are spliced into a continuous circle. Optionally, the first groove structures 12 in all the line layers 10 provided with the first groove structures 12 in the first anti-overflow area 2 are spliced into a continuous circle.
Alternatively, on the basis of the above embodiment, fig. 16 is a schematic cross-sectional structure diagram of another printed circuit board without soldering components provided by the embodiment of the present invention, along the thickness direction (parallel to the direction Z) of the printed circuit board 100, the orthographic projections of the first line structures 11 in the first anti-overflow area 2 in at least part of the line layers 10 on the first cover film 20 are partially or completely overlapped, so that the heights of the first line structures 11 of the multi-layer line layers 10 are accumulated, thereby increasing the height of the protrusions of the first cover film 20 above the line structures 11, so that the defined marks are easy to be identified, and the glue overflow can be better prevented. Fig. 16 exemplarily shows a case where the first line structure 11 in the line layer 10-1 is disposed to overlap the first line structure 11 in the line layer 10-2.
Optionally, on the basis of the above embodiment, in the thickness direction of the printed circuit board (parallel to the direction Z), the orthographic projections of the first groove structures 12 in the first anti-overflow area 2 on the first cover film 20 in at least part of the circuit layer 10 are partially or completely overlapped, so that the recessed depths of the first groove structures 12 of the multi-layer circuit layer 10 are accumulated, thereby increasing the recessed depth of the first cover film 20 above the first groove structures 12, so that the defined mark is easy to identify, and the glue overflow can be better prevented.
Alternatively, the first coverlay film 20 is embossed by the first line structure 11. Optionally, the first cover film 20 is recessed due to the first groove structure 12.
Optionally, the printed circuit board 100 is a flexible printed circuit board.
Optionally, the circuit layer 10 provided with the first line structure 11 and/or the second groove structure 12 for forming the defined mark may further include a plurality of signal lines, which may be electrically connected to the element 40.
Alternatively, the circuit layer 10 closest to the first coverlay film 20 may include the first line structure 11 and/or the first groove structure 12 for forming the definition mark, and a plurality of signal lines and a plurality of pads, the plurality of signal lines being electrically connected to the plurality of pads correspondingly, the plurality of pads being located in the element region 1. A plurality of pads may be used for soldering with the component 40. The first cover film 20 may be provided with a window (not shown), and the window may be located in the device region 1, and expose the corresponding pad. The line structure 11 may be a signal line.
Optionally, on the basis of the above embodiment, fig. 17 is a schematic top view illustrating a printed circuit board without components soldered thereon according to another embodiment of the present invention, fig. 18 is a schematic cross-sectional view illustrating a printed circuit board without components soldered thereon according to another embodiment of the present invention, fig. 18 may be a schematic cross-sectional view taken along a direction A1a2 in fig. 17, and the printed circuit board 100 is provided with a second anti-overflow area 3 located at the periphery of the first anti-overflow area 2; the first side of the first lamination structure extends from the first anti-overflow area 2 to the second anti-overflow area 3 and is step-shaped.
Wherein, the first side of the first lamination structure extends from the first anti-overflow area 2 to the second anti-overflow area 3, so that a height change exists to form a step, and the height direction is parallel to the thickness direction of the printed circuit board (parallel to the direction Z). The second anti-flow-over area 3 may serve to further block the flow of adhesive 50 in a direction away from the element 40.
The second anti-overflow area 3 and the circuit layer 10 and/or the first cover film 20 of the first anti-overflow area 2 can be selectively removed and retained, and the removed area and the retained area form a step-shaped area with concave-convex variation, so that the first side of the first lamination structure extends from the first anti-overflow area 2 to the second anti-overflow area 3 in a step shape, so as to inhibit the adhesive 50 from flowing in a direction away from the component 40, thereby controlling the overflow glue range.
Optionally, on the basis of the above embodiment, with continuing reference to fig. 17 and fig. 18, the first stacked structure further includes a second solder resist ink layer 80, where the second solder resist ink layer 80 is located on the side of the first coverlay film 20 away from the circuit layer 10; second solder resist ink layer 80 is located at second anti-overflow area 3.
Second solder resist ink layer 80 and first solder resist ink layer 30 may be disposed in the same layer, i.e., formed simultaneously in the same process.
Fig. 19 is a schematic top view illustrating a structure of another pcb according to an embodiment of the present invention when no component is soldered, fig. 20 is a schematic cross-sectional structure of another pcb according to an embodiment of the present invention when no component is soldered, and fig. 20 can be a schematic cross-sectional structure along a direction B1B2 in fig. 19. Fig. 20 exemplarily shows a case where the first line structure 11 is disposed on the line layer 10 of the first anti-overflow area 2, and the second anti-overflow area 3 is disposed on the second solder resist ink layer 80.
Fig. 21 is a schematic cross-sectional view of another printed circuit board without components soldered thereon according to an embodiment of the present invention, and fig. 21 can be a schematic cross-sectional view taken along direction B1B2 in fig. 19. Fig. 21 exemplarily shows a case where the first groove structure 12 is provided in the wiring layer 10 of the first anti-overflow area 2, and the second anti-overflow area 3 is provided with the second solder resist ink layer 80.
Alternatively, on the basis of the above embodiment, fig. 22 is a schematic cross-sectional view of another printed circuit board without component soldering according to an embodiment of the present invention, wherein the circuit layer 10 in the second anti-overflow area 3 is provided with a second groove structure 14; the line layer 10 has different structures extending from the first anti-overflow area 2 to the second anti-overflow area 3, so that the first side of the first lamination structure extends from the first anti-overflow area 2 to the second anti-overflow area 3 in a step shape.
Alternatively, on the basis of the above embodiment, fig. 23 is a schematic cross-sectional structure diagram of another printed circuit board without soldering components according to an embodiment of the present invention, wherein the second line structure 13 is disposed on the line layer 10 of the second anti-overflow area 3; the line layer 10 has different structures extending from the first anti-overflow area 2 to the second anti-overflow area 3, so that the first side of the first lamination structure extends from the first anti-overflow area 2 to the second anti-overflow area 3 in a step shape.
Optionally, the line layer 10 in the second anti-overflow area 3 is provided with a second line structure 13 and a second groove structure 14; the line layer 10 has different structures extending from the first anti-overflow area 2 to the second anti-overflow area 3, so that the first side of the first lamination structure extends from the first anti-overflow area 2 to the second anti-overflow area 3 in a step shape.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A printed circuit board is characterized in that the printed circuit board is provided with a component area and a first overflow prevention area positioned at the periphery of the component area; the printed circuit board includes: a first stacked structure; the first lamination structure includes: the circuit comprises a circuit layer and a first covering film positioned on one side of the circuit layer; the first side of the first laminated structure extends from the element area to the first anti-overflow area and is step-shaped; the first side of the first lamination structure is close to the element mounting surface of the element region.
2. The printed circuit board of claim 1, wherein the first cover film is provided with a window, and the component area is located in the window, so that the first side of the first lamination structure is stepped to rise from the component area to the first anti-overflow area;
the first laminate structure further comprises a first solder resist ink layer comprising a middle portion and a peripheral portion surrounding the middle portion; the middle part of the first solder resist ink layer is positioned in the window, and the outer edge part of the first solder resist ink layer covers one side, away from the circuit layer, of the first cover film surrounding the window; the outer edge part of the first solder resist ink layer covers the first overflow-proof area; the middle part of the first solder resist ink layer is recessed relative to the outer edge part of the first solder resist ink layer in the direction close to the circuit layer.
3. The printed circuit board of claim 2, further comprising:
the element is positioned on one side, far away from the circuit layer, of the first solder resist ink layer; the element is located within the element region;
the adhesive is positioned on one side of the first solder resist ink layer away from the circuit layer; the adhesive is disposed around the element; the first anti-flow-over area is for blocking the adhesive from flowing in a direction away from the component.
4. The printed circuit board of claim 2, wherein the color of the first coverlay film and the color of the first solder resist ink layer are different; the printed circuit board is a flexible printed circuit board.
5. The printed circuit board of claim 1, wherein the circuit layer is provided with a first line structure and/or a first groove structure at the first anti-flooding zone; the structure of the circuit layer extending from the element area to the first anti-overflow area is different, so that the first side of the first laminated structure extends from the element area to the first anti-overflow area in a step shape.
6. The printed circuit board of claim 5, further comprising:
the element is positioned on one side, far away from the circuit layer, of the first covering film; the element is located within the element region;
the adhesive is positioned on one side, far away from the circuit layer, of the first cover film; the adhesive is disposed around the element; the first anti-flow-over area is for blocking the adhesive from flowing in a direction away from the component.
7. The printed circuit board of claim 6, wherein the wiring layers in the first lamination structure are multiple layers; the first stacked structure further includes at least one insulating layer; the circuit layers and the insulating layers are alternately stacked along the thickness direction of the printed circuit board; the circuit layer and the insulating layer are positioned on the same side of the first covering film; a circuit layer is arranged between any insulating layer and the first covering film; one or at least two of the circuit layers are provided with a first line structure in the first anti-overflow area, and/or one or at least two of the circuit layers are provided with a first groove structure in the first anti-overflow area.
8. The printed circuit board according to claim 7, wherein the circuit layer closest to the first cover film is provided with a first line structure and/or a first groove structure at the first anti-overflow area;
the first overflow-preventing area is provided with first line structures and/or first groove structures, and the first line structures and/or the first groove structures in all the line layers are spliced into a continuous circle;
along the thickness direction of the printed circuit board, orthographic projections of first line structures in at least part of line layers in the first anti-overflow area on the first cover film are partially or completely overlapped; or, along the thickness direction of the printed circuit board, orthographic projections of the first groove structures in the first anti-overflow area on the first cover film in at least part of the circuit layers are partially or completely overlapped.
9. The printed circuit board of claim 5, wherein the first cover film forms a bump due to the first line structure; the first cover film is sunken due to the first groove structure; the printed circuit board is a flexible printed circuit board.
10. The printed circuit board of claim 1, wherein the printed circuit board is provided with a second anti-blooming region located at the periphery of the first anti-blooming region; the first side of the first laminated structure extends from the first anti-overflow area to the second anti-overflow area and is in a step shape;
the first lamination structure further comprises a second solder resist ink layer, and the second solder resist ink layer is positioned on one side, away from the circuit layer, of the first cover film; and the second solder resist ink layer is positioned in the second anti-overflow area.
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| CN202111161998.XA CN113840450B (en) | 2021-09-30 | 2021-09-30 | Printed circuit board with improved heat dissipation |
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| CN202111161998.XA CN113840450B (en) | 2021-09-30 | 2021-09-30 | Printed circuit board with improved heat dissipation |
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| CN113840450B CN113840450B (en) | 2024-01-30 |
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| CN116669363A (en) * | 2022-11-30 | 2023-08-29 | 荣耀终端有限公司 | Circuit board, circuit board tool assembly and terminal equipment |
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| CN113840450B (en) | 2024-01-30 |
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