CN113777473A - Burn-in test system - Google Patents
Burn-in test system Download PDFInfo
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- CN113777473A CN113777473A CN202111124563.8A CN202111124563A CN113777473A CN 113777473 A CN113777473 A CN 113777473A CN 202111124563 A CN202111124563 A CN 202111124563A CN 113777473 A CN113777473 A CN 113777473A
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- 238000012360 testing method Methods 0.000 title claims abstract description 209
- 230000017525 heat dissipation Effects 0.000 claims abstract description 88
- 238000001816 cooling Methods 0.000 claims abstract description 58
- 239000003507 refrigerant Substances 0.000 claims description 24
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 239000000741 silica gel Substances 0.000 claims description 16
- 229910002027 silica gel Inorganic materials 0.000 claims description 16
- 230000013011 mating Effects 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000002826 coolant Substances 0.000 claims 1
- 230000032683 aging Effects 0.000 abstract description 36
- 238000010438 heat treatment Methods 0.000 description 14
- 238000012545 processing Methods 0.000 description 7
- 230000002035 prolonged effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000013100 final test Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
本发明提供了一种老化测试系统。老化测试系统用于对芯片进行老化测试，老化测试系统包括：第一测试板，用于安装芯片；壳体，壳体位于第一测试板的下方且与第一测试板围绕形成容纳腔；第二测试板，第二测试板位于容纳腔内且与第一测试板电连接；散热板，位于容纳腔内且与壳体的内表面之间具有预设间隙，散热板包括第一配合部；降温装置，包括第二配合部和降温结构，降温结构用于对第二配合部进行降温；其中，第二配合部与第一配合部相接触，第一配合部用于将第二测试板上产生的热量传递至第二配合部上。本发明有效地解决了现有技术中老化测试系统内热量过大而影响测试系统的测试精度和使用寿命的问题。
The present invention provides an aging test system. The burn-in test system is used to perform burn-in test on the chip, and the burn-in test system includes: a first test board for mounting the chip; a casing, the casing is located below the first test board and surrounds the first test board to form a accommodating cavity; Two test boards, the second test board is located in the accommodating cavity and is electrically connected with the first test board; the heat dissipation board is located in the accommodating cavity and has a preset gap with the inner surface of the housing, and the heat dissipation board includes a first matching portion; The cooling device includes a second matching part and a cooling structure, and the cooling structure is used for cooling the second matching part; wherein, the second matching part is in contact with the first matching part, and the first matching part is used for cooling the second test board The generated heat is transferred to the second fitting portion. The invention effectively solves the problem in the prior art that the heat in the aging test system is too large and affects the test accuracy and service life of the test system.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to an aging testing system.
Background
At present, in order to ensure the reliability of chip products, after the chips are manufactured, the chips are often tested by using a burn-in test, which is an electrical stress test method using voltage and high temperature to accelerate electrical failures of devices, and simulates the entire service life of the chips, thereby exposing defects in the chips as early as possible. In the prior art, in the process of carrying out aging test on a chip, a circuit component can generate a large amount of heat, the heat can not only influence the test temperature of the chip and reduce the test precision, but also can be accumulated in test equipment to influence the service life of the test equipment.
Disclosure of Invention
The invention mainly aims to provide an aging test system to solve the problem that the test accuracy and the service life of the test system are influenced by overlarge heat in the aging test system in the prior art.
In order to achieve the above object, the present invention provides a burn-in test system for performing a burn-in test on a chip, the burn-in test system comprising: the first test board is used for mounting the chip; the shell is positioned below the first test board and surrounds the first test board to form an accommodating cavity; the second test board is positioned in the accommodating cavity and is electrically connected with the first test board; the heat dissipation plate is positioned in the accommodating cavity, a preset gap is formed between the heat dissipation plate and the inner surface of the shell, and the heat dissipation plate comprises a first matching part; the cooling device comprises a second matching part and a cooling structure, and the cooling structure is used for cooling the second matching part; the second matching part is contacted with the first matching part, and the first matching part is used for transferring heat generated on the second test board to the second matching part.
Further, the second test board includes: a test board body; the connecting part is arranged on the test board body and is used for being connected with the first test board in a clamping mode and/or through the first fastener.
Further, the heat dissipation plate is located below the second test board, and the burn-in test system further includes: and the heat conduction silica gel sheet is arranged on the surface of the second test plate facing the heat dissipation plate, and the heat conduction silica gel sheet is attached to the heat dissipation plate.
Further, there is one second test board; or, the second test panel is a plurality of, and a plurality of second test panels set up along the length direction and/or the width direction interval of first test panel, and heat conduction silica gel piece is a plurality of, and a plurality of heat conduction silica gel pieces set up with a plurality of second test panels one-to-one.
Furthermore, the first matching part and the second matching part are both tooth-shaped parts, and the two tooth-shaped parts are matched; wherein, the dentate part is one of rectangle tooth, trapezoidal tooth and circular arc tooth.
Furthermore, a connecting column is arranged on the inner surface of the shell and is positioned below the second test board so as to support the second test board; the burn-in test system further comprises: the second fastener penetrates through the first test board and the heat dissipation plate and is used for connecting the first test board and the heat dissipation plate; and the third fastener penetrates through the connecting column and the heat dissipation plate and is used for connecting the heat dissipation plate and the shell.
Furthermore, the shell comprises a bottom plate and a surrounding plate arranged on the bottom plate, the connecting column is arranged on the bottom plate, and a preset gap is formed between the heat dissipation plate and the bottom plate; and/or a preset gap is formed between the heat dissipation plate and the inner surface of the enclosing plate.
Further, cooling structure includes first pipeline, is used for the circulation refrigerant in the first pipeline, and cooling structure includes: the second matching part is arranged on the mounting plate, the first pipeline is arranged in the mounting plate, and the mounting plate is used for transmitting the cold energy generated by the refrigerant to the second matching part; and the liquid supply device is communicated with the first pipeline and is used for providing a refrigerant for the first pipeline.
Further, the heat dissipation plate further includes: the first matching part is arranged on the heat dissipation plate body; the second pipeline is arranged in the radiating plate body and used for circulating a refrigerant, and the second pipeline is used for transmitting the cold energy generated by the refrigerant to the radiating plate body; wherein the first pipeline is communicated with the second pipeline.
Further, the cooling structure comprises a cooling fan, and an air outlet of the cooling fan is arranged towards the second matching portion.
Further, the shell is provided with a through hole, and at least part of the first matching part extends out of the shell through the through hole so as to be in contact with the second matching part; or at least part of the second matching part extends into the shell through the through hole so as to be contacted with the first matching part.
Furthermore, the heat dissipation plate also comprises a plurality of cooling fins which are arranged at intervals along the length direction and/or the width direction of the first test board; the first matching part is arranged on at least one radiating fin, and each radiating fin is made of copper materials or aluminum materials.
By applying the technical scheme of the invention, the heat dissipation plate comprises the first matching part, the cooling device comprises the second matching part and a cooling structure, and the cooling structure is used for cooling the second matching part. When the chip needs to be subjected to aging test, the chip is placed on the first test board, power is supplied to the chip through the first test board, the first test board and the chip are placed in a high-temperature environment, and the second test board is used for carrying out final test on the aging of the chip. Like this, at the in-process that the chip carries out aging testing, first cooperation portion is used for surveying the heat transfer that produces on the board to the second cooperation portion with the second, the cooling structure carries out heat exchange with the heat that transmits to the second cooperation portion, survey the board to cool down through second cooperation portion and heating panel, and then solved among the prior art in the aging testing system too big and influence testing system's test accuracy and life's problem, aging testing system's test accuracy has been promoted, aging testing system's life has been prolonged.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 shows an exploded view of an embodiment of a burn-in test system according to the invention.
Wherein the figures include the following reference numerals:
10. a first test board; 20. a housing; 21. a base plate; 22. enclosing plates; 30. a second test board; 31. a test board body; 40. a heat dissipation plate; 41. a first mating portion; 50. a cooling device; 51. a second mating portion; 52. a cooling structure; 521. mounting a plate; 522. a liquid supply device.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
It is noted that, unless otherwise indicated, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
In the present invention, unless stated to the contrary, use of the directional terms "upper and lower" are generally directed to the orientation shown in the drawings, or to the vertical, or gravitational direction; likewise, for ease of understanding and description, "left and right" are generally to the left and right as shown in the drawings; "inner and outer" refer to the inner and outer relative to the profile of the respective member itself, but the above directional terms are not intended to limit the present invention.
In order to solve the problem that the testing precision and the service life of a testing system are affected due to the fact that heat in the aging testing system is too large in the prior art, the application provides the aging testing system.
Example one
As shown in fig. 1, the burn-in test system is used for burn-in testing a chip, and includes a first test board 10, a housing 20, a second test board 30, a heat dissipation board 40, and a cooling device 50. The first test board 10 is used for mounting chips. The housing 20 is located under the first test board 10 and forms a containing cavity around the first test board 10. The second test board 30 is located in the accommodating cavity and electrically connected to the first test board 10. The heat dissipation plate 40 is located in the receiving cavity and has a predetermined gap with the inner surface of the housing 20, and the heat dissipation plate 40 includes a first fitting portion 41. The cooling device 50 includes a second fitting portion 51 and a cooling structure 52, and the cooling structure 52 is used for cooling the second fitting portion 51. The second mating portion 51 is in contact with the first mating portion 41, and the first mating portion 41 is used for transferring heat generated by the second test board 30 to the second mating portion 51.
With the technical solution of this embodiment, the heat dissipation plate 40 includes the first matching portion 41, the temperature reduction device 50 includes the second matching portion 51 and the temperature reduction structure 52, and the temperature reduction structure 52 is used for reducing the temperature of the second matching portion 51. When the chip needs to be subjected to the aging test, the chip is placed on the first test board 10, power is supplied to the chip through the first test board 10, the first test board 10 and the chip are placed in a high-temperature environment, and the second test board 30 is used for carrying out the final test on the aging of the chip. Like this, at the in-process that the chip carries out aging testing, first cooperation portion 41 is used for on the heat transfer that produces to second cooperation portion 51 on the second survey test panel 30, cooling structure 52 carries out heat exchange with the heat that transmits to second cooperation portion 51, in order to survey test panel 30 to cool down through second cooperation portion 51 and heating panel 40, and then solved among the prior art too big and influence test accuracy and the life's of test system problem of heat in the aging testing system, the test accuracy of aging testing system has been promoted, aging testing system's life has been prolonged.
In this embodiment, the cooling structure 52 cools the heat dissipation plate 40, and further cools and cools the second test board 30. Compared with the prior art in which dry gas is used for cooling circuit components, the aging test system in the embodiment has no risk of gas leakage.
As shown in fig. 1, the second test board 30 includes a test board body 31 and a connection portion. Wherein, the connecting portion is disposed on the test board body 31 for being connected with the first test board 10 in a snap-fit manner and/or through a first fastener. Like this, the second test board 30 is used for carrying out final aging testing to the chip, and cooling structure 52 is used for testing the second test board 30 and carries out cooling, and then has prolonged the life that the second tested board 30. Meanwhile, on one hand, the structure of the second test board 30 is simpler, the second test board is easy to process and realize, and the processing cost of the second test board 30 is reduced; on the other hand, the second testing board 30 and the first testing board 10 can be more easily and flexibly assembled and disassembled to meet different use requirements and working conditions.
Optionally, the first fastener is a screw or bolt.
In the present embodiment, the connecting portion is disposed on the test board body 31 for being connected with the first test board 10 by the first fastener. Thus, the first test board 10 and the second test board 30 are connected more tightly by the arrangement, and the structural stability of the burn-in test system is prevented from being influenced by mutual separation of the first test board and the second test board.
In this embodiment, the heat dissipation plate 40 is located below the second testing board 30, and the burn-in testing system further includes a heat conductive silicone sheet. Wherein, the heat conduction silica gel sheet sets up on the second test panel 30 towards the surface of heating panel 40, and the heat conduction silica gel sheet sets up with heating panel 40 laminating mutually. Like this, the heat conduction silica gel piece is located the second and is surveyed between board 30 and the heating panel 40, and the heat conduction that produces on the second is surveyed the board 30 is to the heat conduction silica gel piece, and the heat conduction silica gel piece can be fast with heat conduction to heating panel 40 on, and then survey the board 30 to dispel the heat fast to the second.
Optionally, one second test board 30; or, the second test boards 30 are plural, the plural second test boards 30 are arranged at intervals along the length direction and/or the width direction of the first test board 10, the heat conductive silicone sheets are plural, and the plural heat conductive silicone sheets and the plural second test boards 30 are arranged in a one-to-one correspondence manner. Like this, above-mentioned setting makes the second survey test panel 30 and the number of heat conduction silica gel piece set up more in a flexible way to satisfy different user demand and operating mode, also promoted the second and surveyed the processing flexibility of panel 30 and heat conduction silica gel piece.
In the present embodiment, there are twelve second test boards 30, each two second test boards 30 form a group, the two second test boards 30 are spaced apart along the width direction of the first test board 10, and the groups of second test boards 30 are spaced apart along the length direction of the first test board 10. Twelve heat conduction silica gel sheets are arranged corresponding to the twelve second test boards 30 one by one.
It should be noted that the number of the second testing boards 30 is not limited to this, and can be adjusted according to the working condition and the use requirement. Optionally, the second test plate 30 is two, or three, or four, or five, or more.
In the present embodiment, the first mating portion 41 and the second mating portion 51 are both tooth-shaped portions, and the two tooth-shaped portions are matched. Like this, two dentate looks adaptations, and then increased the area of contact of first cooperation portion 41 and second cooperation portion 51, and then promoted heat sink 50 and surveyed the cooling efficiency of board 30 to the second, realized rapid cooling, further prolonged the second and surveyed the life of board 30.
Optionally, the tooth-shaped portion is one of a rectangular tooth, a trapezoidal tooth, and a circular tooth. Like this, above-mentioned setting makes the shape of dentate more diversified to satisfy different user demand and operating mode, also promoted the processing flexibility of staff to dentate.
In this embodiment, the dentate is the rectangle tooth, and the addendum of a rectangle tooth stretches into the tooth root department of another rectangle tooth and laminates mutually with the tooth root to make two dentate fully contact, increased the area of contact of first cooperation portion 41 and second cooperation portion 51, and then promoted heat sink 50 and surveyed the cooling efficiency of board 30 to the second, realized rapid cooling, further prolonged the life that the board 30 was surveyed to the second.
It should be noted that the rectangular tooth means that the tooth root is a rectangular opening.
As shown in fig. 1, the inner surface of the housing 20 is provided with a connection column, which is located below the second test board 30 for supporting the second test board 30. The weathering test system also includes a second fastener and a third fastener. The second fastener is arranged on the first test board 10 and the heat dissipation plate 40 in a penetrating mode and used for connecting the first test board 10 and the heat dissipation plate 40. The third fastener is inserted through the connection column and the heat dissipation plate 40 to connect the heat dissipation plate 40 and the housing 20. Optionally, the second fastener is a screw or bolt. Optionally, the third fastener is a screw or bolt. Thus, on one hand, the arrangement ensures that a preset gap is formed between the heat dissipation plate 40 and the inner surface of the shell 20, and the preset gap plays a role in heat insulation, so that the heat in the high-temperature environment of the aging test system is prevented from being conducted to the heat dissipation plate 40 through the shell 20 to influence the heat dissipation efficiency of the heat dissipation plate 40; on the other hand, the heat dissipation plate 40, the first test board 10 and the housing 20 are easier and simpler to disassemble, and the disassembling difficulty of the aging test system is reduced.
Specifically, the surface of the heat dissipation plate 40 facing the first test board 10 is connected to the first test board 10 through the second fastener, and the surface of the heat dissipation plate 40 away from the first test board 10 is connected to the housing 20 through the third fastener, so that the heat dissipation plate 40 is more stably assembled with the housing 20 and the first test board 10, and the heat dissipation reliability and the heat dissipation efficiency of the heat dissipation plate 40 on the second test board 30 are prevented from being affected by the shaking or moving of the heat dissipation plate 40 in the housing 20.
Optionally, the spliced pole is the screw post, and the third fastener is worn to establish in the screw post, and the screw post not only is used for supporting heating panel 40 to prevent that heating panel 40 from rocking or removing in casing 20, also is used for supplying the third fastener to wear to establish, so that the dismouting of third fastener is easier, simple and convenient, has reduced the dismouting degree of difficulty.
As shown in fig. 1, the case 20 includes a bottom plate 21 and a surrounding plate 22 disposed on the bottom plate 21, and the connection column is disposed on the bottom plate 21, and a predetermined gap is formed between the heat dissipation plate 40 and the bottom plate 21. Thus, the arrangement ensures that a preset gap is formed between the bottom surface of the heat dissipation plate 40 and the housing 20, thereby preventing the heat in the high-temperature environment of the aging test system from being conducted to the heat dissipation plate 40 through the housing 20 and affecting the heat dissipation efficiency of the heat dissipation plate 40. Meanwhile, the structure of the shell 20 is easier and simpler due to the arrangement, and the processing cost and the processing difficulty of the shell 20 are reduced.
In the present embodiment, a predetermined gap is formed between the heat dissipation plate 40 and the inner surface of the shroud 22. Thus, the arrangement ensures that the outer peripheral surface and the bottom surface of the heat dissipation plate 40 have a preset gap with the housing 20, and further prevents the heat in the high-temperature environment of the aging test system from being conducted to the heat dissipation plate 40 through the housing 20 to affect the heat dissipation efficiency of the heat dissipation plate 40.
As shown in fig. 1, the cooling structure 52 includes a first pipeline, the first pipeline is used for flowing a refrigerant, and the cooling structure 52 includes a mounting plate 521 and a liquid supply device 522. The second matching part 51 is arranged on the mounting plate 521, the first pipeline is arranged in the mounting plate 521, and the mounting plate 521 is used for transmitting cold energy generated by the refrigerant to the second matching part 51. The liquid supply device 522 is communicated with the first pipeline and is used for providing a refrigerant for the first pipeline. In this way, the cooling structure 52 is a water-cooled cooling structure, the liquid supply device 522 provides a refrigerant to the first pipeline, and the refrigerant flows in the first pipeline to exchange heat with the mounting plate 521 and the second matching portion 51 disposed on the mounting plate 521, so as to cool the second test board 30.
Specifically, the first pipe extends along the length direction and the width direction of the mounting plate 521, that is, the first pipe is coiled in the mounting plate 521 to exchange heat with heat generated on the mounting plate 521, so as to cool down the second matching part 51 disposed thereon. Wherein, the refrigerant is water or refrigerant.
In this embodiment, the cooling structure 52 further includes a pump structure, and the pump structure is configured to pump the refrigerant in the liquid supply device 522 into the first pipeline.
In this embodiment, the heat dissipation plate 40 further includes a heat dissipation plate body and a second pipe. Wherein, the first matching part 41 is arranged on the heat radiation plate body. The second pipeline is arranged in the radiating plate body and used for circulating a refrigerant, and the second pipeline is used for transmitting the cold energy generated by the refrigerant to the radiating plate body. Wherein the first pipeline is communicated with the second pipeline. In this way, the heat dissipation plate 40 is a water-cooled heat dissipation plate, and the refrigerant in the heat dissipation plate 40 and the cooling structure 52 is the same refrigerant, so that the usage amount of the refrigerant is reduced, and the heat dissipation plate 40 and the cooling structure 52 are supplied with the liquid by using the same liquid supply device 522.
Specifically, the second pipeline extends along the length direction and the width direction of heating panel body, and the second pipeline coils in the heating panel body promptly to carry out heat exchange with the heat that produces on the heating panel body, and then carry out cooling to the first cooperation portion 41 that sets up above that.
Optionally, the housing 20 has a through hole through which at least a portion of the first fitting portion 41 protrudes outside the housing 20 for contact with the second fitting portion 51; alternatively, at least a portion of the second fitting portion 51 protrudes into the housing 20 through the through hole for contact with the first fitting portion 41. Like this, above-mentioned setting makes first cooperation portion 41 and second cooperation portion 51 set up the position more nimble to satisfy different user demand and operating mode, also promoted staff's processing flexibility.
In the present embodiment, at least a portion of the second fitting portion 51 protrudes into the housing 20 through the through hole for contacting with the first fitting portion 41. Wherein a thermal insulation member is provided between the wall of the through hole and the second fitting portion 51.
In this embodiment, the heat dissipation plate 40 and the cooling device 50 are two independent systems, and the refrigerant in the heat dissipation plate 40 circulates in the closed system, thereby avoiding the risk of liquid leakage.
Example two
The difference between the burn-in test system in the second embodiment and the first embodiment is that: the heat dissipation plate 40 has a different structure.
In this embodiment, the heat dissipation plate 40 further includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are spaced apart along the length direction and/or the width direction of the first test board 10. The first engaging portion 41 is disposed on at least one heat sink, and each heat sink is made of copper or aluminum. Like this, above-mentioned setting makes heating panel 40's structure more nimble to satisfy different user demand and operating mode, also promoted staff's processing flexibility.
Specifically, the heat sink is made of a copper material. It should be noted that the structure of the heat dissipation plate 40 is not limited to this, and may be adjusted according to the working condition and the use requirement. Alternatively, the heat dissipation plate 40 includes a first heat dissipation plate in which the refrigerant circulates in the closed system, and a second heat dissipation plate made of a copper material, and the first heat dissipation plate and the second heat dissipation plate are stacked together and combined.
EXAMPLE III
The difference between the burn-in test system in the third embodiment and the first embodiment is that: the cooling structure 52 is different in structure.
In this embodiment, the cooling structure includes a heat dissipation fan, and an air outlet of the heat dissipation fan is disposed toward the second matching portion. Like this, radiator fan is used for dispelling the heat to second cooperation portion, and then has solved among the prior art problem that the too big test accuracy and the life of influence test system of heat in the aging testing system, has promoted the test accuracy of aging testing system, has prolonged aging testing system's life.
From the above description, it can be seen that the above-described embodiments of the present invention achieve the following technical effects:
the heating panel includes first cooperation portion, and the heat sink includes second cooperation portion and cooling structure, and the cooling structure is used for cooling down second cooperation portion. When the chip needs to be subjected to aging test, the chip is placed on the first test board, power is supplied to the chip through the first test board, the first test board and the chip are placed in a high-temperature environment, and the second test board is used for carrying out final test on the aging of the chip. Like this, at the in-process that the chip carries out aging testing, first cooperation portion is used for surveying the heat transfer that produces on the board to the second cooperation portion with the second, the cooling structure carries out heat exchange with the heat that transmits to the second cooperation portion, survey the board to cool down through second cooperation portion and heating panel, and then solved among the prior art in the aging testing system too big and influence testing system's test accuracy and life's problem, aging testing system's test accuracy has been promoted, aging testing system's life has been prolonged.
It is to be understood that the above-described embodiments are only a few, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular is intended to include the plural unless the context clearly dictates otherwise, and it should be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of features, steps, operations, devices, components, and/or combinations thereof.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (12)
1. A burn-in test system for burn-in testing a chip, the burn-in test system comprising:
a first test board (10) for mounting a chip;
a housing (20), wherein the housing (20) is positioned below the first test board (10) and forms a containing cavity with the first test board (10) in a surrounding manner;
a second test plate (30), said second test plate (30) being located inside said containing cavity and being electrically connected with said first test plate (10);
the heat dissipation plate (40) is positioned in the accommodating cavity, a preset gap is reserved between the heat dissipation plate and the inner surface of the shell (20), and the heat dissipation plate (40) comprises a first matching part (41);
the cooling device (50) comprises a second matching part (51) and a cooling structure (52), wherein the cooling structure (52) is used for cooling the second matching part (51);
the second matching part (51) is in contact with the first matching part (41), and the first matching part (41) is used for transferring heat generated on the second test board (30) to the second matching part (51).
2. The burn-in test system of claim 1, wherein said second test board (30) comprises:
a test board body (31);
the connecting part is arranged on the test board body (31) and used for being clamped with the first test board (10) and/or being connected through a first fastener.
3. The burn-in system of claim 1, wherein said heat dissipation plate (40) is located below said second test plate (30), said burn-in system further comprising:
the heat conduction silica gel sheet is arranged on the surface, facing the heat dissipation plate (40), of the second test plate (30), and the heat conduction silica gel sheet is attached to the heat dissipation plate (40).
4. A burn-in system according to claim 3, characterised in that said second test board (30) is one; or, the second test boards (30) are multiple, the second test boards (30) are arranged at intervals along the length direction and/or the width direction of the first test board (10), the heat conduction silica gel sheets are multiple, and the heat conduction silica gel sheets and the second test boards (30) are arranged in a one-to-one correspondence manner.
5. The weathering test system of claim 1 characterized in that the first and second mating portions (41, 51) are both teeth, the two teeth fitting; wherein, the dentate part is one of rectangle tooth, trapezoidal tooth and circular arc tooth.
6. The burn-in system of claim 1, wherein an attachment post is provided on an inner surface of said housing (20), said attachment post being located below said second test plate (30) for supporting said second test plate (30); the burn-in test system further comprises:
the second fastener penetrates through the first test board (10) and the heat dissipation plate (40) and is used for connecting the first test board (10) and the heat dissipation plate (40);
and the third fastener is arranged on the connecting column and the heat dissipation plate (40) in a penetrating manner and is used for connecting the heat dissipation plate (40) and the shell (20).
7. The burn-in test system according to claim 6, wherein the housing (20) comprises a base plate (21) and a surrounding plate (22) arranged on the base plate (21), the connecting column is arranged on the base plate (21), and the heat dissipation plate (40) and the base plate (21) form the preset gap therebetween; and/or the preset gap is formed between the heat dissipation plate (40) and the inner surface of the enclosing plate (22).
8. The burn-in test system of claim 1, wherein the cooling structure (52) comprises a first pipe for circulating a cooling medium therein, the cooling structure (52) comprising:
the second matching part (51) is arranged on the mounting plate (521), the first pipeline is arranged in the mounting plate (521), and the mounting plate (521) is used for transmitting cold energy generated by the refrigerant to the second matching part (51);
and the liquid supply device (522) is communicated with the first pipeline and is used for providing a refrigerant for the first pipeline.
9. The burn-in test system of claim 8, wherein said heat sink plate (40) further comprises:
a heat sink body on which the first fitting portion (41) is provided;
the second pipeline is arranged in the radiating plate body and used for circulating a refrigerant, and the second pipeline is used for transmitting the cold energy generated by the refrigerant to the radiating plate body; wherein the first and second conduits are in communication.
10. The burn-in test system of claim 1, wherein the cooling structure (52) comprises a heat dissipation fan, and an air outlet of the heat dissipation fan is disposed toward the second fitting portion (51).
11. The burn-in system of claim 1, wherein the housing (20) has a through hole through which at least a portion of the first mating portion (41) protrudes outside the housing (20) for contact with the second mating portion (51); or, at least part of the second fitting portion (51) protrudes into the housing (20) through the through hole for contacting the first fitting portion (41).
12. The burn-in system according to claim 1, wherein the heat dissipation plate (40) further comprises a plurality of heat dissipation fins, the plurality of heat dissipation fins being arranged at intervals in a length direction and/or a width direction of the first test board (10); the first matching part (41) is arranged on at least one radiating fin, and each radiating fin is made of copper materials or aluminum materials.
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| CN202111124563.8A CN113777473A (en) | 2021-09-24 | 2021-09-24 | Burn-in test system |
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| CN202111124563.8A CN113777473A (en) | 2021-09-24 | 2021-09-24 | Burn-in test system |
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