JP2018054499A - Load device and load application method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress an increase in the temperature of a loading device.SOLUTION: The loading device is constituted by a plurality of load resistance units 50, and is connected to an uninterruptible power supply device 10. The load resistance units 50 have a connection cable connected thereto via a unit connector and a wiring box and are supplied with electric power from the uninterruptible power supply device 10. The load resistance units 50 include a plurality of Peltier elements 52 and a heat exchanger on one side and a heat exchanger on the other side, the plurality of Peltier elements 52 being connected in series to each other. The Peltier elements 52 work as a heat transfer element, and have two heat radiating/absorbing parts for radiating heat (or absorbing heat) when a first current flows and absorbing heat (or radiating heat) when a second current in a direction opposite to the first current flows.SELECTED DRAWING: Figure 4

Description

  The technology disclosed in the present application relates to a load device and a load application method.

  There is a load device that performs a load test (operation test) of a power supply device such as an uninterruptible power supply device (see, for example, Patent Document 1).

JP 2012-054385 A

  By the way, as a load apparatus, there exists a lamp (incandescent lamp), for example.

  However, the lamp has a large calorific value, and the temperature tends to rise. Therefore, for example, the air conditioning load of the room where the projector is installed may increase.

  The technique which this application discloses aims at suppressing the temperature rise of a load apparatus as one side surface.

  In the technology disclosed in the present application, the load device includes a heat transfer element that is connected to the load application target and that alternately flows a first current and a second current in a direction opposite to the first current.

  According to the technology disclosed in the present application, as one aspect, an increase in temperature of the load device can be suppressed.

FIG. 1 is a perspective view showing a load device according to an embodiment. FIG. 2 is a perspective view showing a state in which the lid is removed from the housing body of the load device shown in FIG. 1. 3 is a cross-sectional view taken along line 3-3 of FIG. FIG. 4 is a model diagram showing a circuit model of the load resistance unit shown in FIG. FIG. 5A is a perspective view showing the Peltier element shown in FIG. 3. FIG. 5B is a perspective view showing the Peltier element shown in FIG. 3. 6 is a cross-sectional view taken along line 6-6 of FIG. FIG. 7 is a graph showing a waveform of an alternating current supplied to the Peltier element shown in FIG. FIG. 8 is a model diagram illustrating a circuit model of the load device according to the comparative example.

  Hereinafter, an embodiment of the technology disclosed in the present application will be described.

  FIG. 1 shows a load device 20 according to the present embodiment. The load device 20 is, for example, a load test device that performs a load test (aging test) of the uninterruptible power supply 10 (see FIG. 4). The uninterruptible power supply 10 is an example of a load application target.

(Uninterruptible power system)
The uninterruptible power supply 10 has a storage battery (secondary battery) that stores electric power, and is an AC power supply apparatus that outputs the electric power stored in the storage battery as an alternating current. The uninterruptible power supply 10 is electrically connected to an electronic device such as a server, and continuously operates the electronic device by supplying the electric power stored in the storage battery to the electronic device, for example, when a commercial power supply fails. This is a standby power supply device.

  In the load test of the uninterruptible power supply 10, the load apparatus 20 is electrically connected to the uninterruptible power supply 10 and power is supplied to the load apparatus 20 from the uninterruptible power supply. At this time, the load device 20 functions as a resistor (load resistor) that resists electric power supplied from the uninterruptible power supply 10.

(Load device)
As shown in FIG. 2, the load device 20 includes a housing 22, a wiring box 38, a unit connector 40, a plurality of load resistance units 50, a plurality of intake fans 44, and a plurality of exhaust fans 48. Prepare.

(Casing)
As shown in FIG. 1, the housing 22 is made of metal. The housing 22 is formed to have a width and length that can be mounted on a rack (not shown) that houses a server or the like, for example. The height of the housing 22 can be reduced to 3U or less in a 19-inch rack, for example, by adjusting the sizes of an intake fan 44, an exhaust fan 48, one side heat exchanger 60, and the other side heat exchanger 70 described later. It is possible to make it a different size. The housing 22 includes a housing body 24 and a lid body 28.

  Note that the housing 22 may be made of resin or the like. Moreover, the arrow W shown in each figure shows the width direction of the housing | casing 22 (load apparatus 20). An arrow D indicates the depth direction of the housing 22 (load device 20). Furthermore, the arrow H indicates the height direction of the housing 22 (load device 20).

  The housing body 24 is formed in a box shape having an opening 26 (see FIG. 2) on the upper surface. The lid 28 is formed in a plate shape. The lid body 28 is attached to the housing body 24 so that the opening 26 of the housing body 24 can be opened and closed.

  A connection cable 30 and an extension cable 34 are provided on one side surface 24S1 in the depth direction (arrow D direction) of the housing body 24. A plug 32 is provided at one end of the connection cable 30. Plug 32 is inserted into a socket (not shown) provided in uninterruptible power supply 10. Thereby, the uninterruptible power supply 10 is electrically connected to the load device 20. A plurality of load resistance units 50 are connected to the other end of the connection cable 30 via a wiring box 38 and a unit connector 40 described later.

  A socket 36 is provided at the end of the extension cable 34. For example, a plug of an extension cable of another load device (not shown) is inserted into the socket 36. Thereby, the some load apparatus 20 is electrically connected. As a result, the resistance (load) to the uninterruptible power supply 10 is increased according to the number of connected load devices 20. The extension cable 34 can be omitted.

  As shown in FIG. 2, the wiring box 38 and the unit connector 40 are accommodated in the central portion of the housing 22 in consideration of ease of wiring and thermal efficiency. The connection cable 30 described above is connected to the wiring box 38. A unit connector 40 is connected to the wiring box 38.

(Load resistance unit)
The plurality of load resistance units 50 are accommodated on both sides of the wiring box 38 and the unit connector 40, respectively. A connection cable 30 is connected to each load resistance unit 50 via a unit connector 40 and a wiring box 38. Thereby, electric power is supplied to each load resistance unit 50 from the uninterruptible power supply 10 connected to the connection cable 30.

  As shown in FIG. 3, the load resistance unit 50 includes a plurality of Peltier elements 52, one side heat exchanger 60, and the other side heat exchanger 70. The Peltier element 52 is formed in a rectangular plate shape when viewed from the thickness direction (arrow t direction). The Peltier element 52 is arranged with the thickness direction (arrow t direction) as the height direction (arrow H direction) of the housing 22. These Peltier elements 52 are arranged in the width direction and the depth direction of the housing 22. The Peltier element is an example of a heat transfer element.

  FIG. 4 shows an example of a circuit model of the load resistance unit 50. As shown in FIG. 4, a plurality (four in FIG. 4) of Peltier elements 52 are connected in series with each other. When the uninterruptible power supply 10 is connected to the load device 20, an AC voltage is applied from the uninterruptible power supply 10 to each Peltier element 52. Thereby, an alternating current is supplied from the uninterruptible power supply 10 to each Peltier element 52.

  The plurality of Peltier elements 52 are not limited to being connected in series, and may be connected in parallel. The load resistance unit 50 can be provided with at least one Peltier element 52.

  As shown in FIGS. 5A and 5B, the Peltier element 52 has one side heat release surface 52A and the other side heat release surface 52B. One side heat release surface 52A is a surface on one side in the thickness direction (arrow t direction) of Peltier element 52. The other side heat release / absorption surface 52B is the other side in the thickness direction of the Peltier element 52, that is, the surface opposite to the one side heat release / absorption surface 52A.

  A pair of wirings 54 is connected to the Peltier element 52. An alternating current is supplied from the uninterruptible power supply 10 (see FIG. 4) to the Peltier element 52 via the pair of wires 54. That is, the uninterruptible power supply 10 is a supply source that supplies an alternating current to the Peltier element 52.

  Here, as shown in FIG. 5A, when a current in the direction of arrow F1 (hereinafter referred to as “first current F1”) flows through the Peltier element 52, the other side heat dissipation surface 52B is directed to the one side heat dissipation surface 52A. Heat moves. As a result, as shown by arrow Q1, one side heat release surface 52A dissipates heat, and as shown by arrow Q2, the other side heat release surface 52B absorbs heat.

  On the other hand, as shown in FIG. 5B, when a current in the direction of arrow F2, that is, a current in the direction opposite to the first current F1 (hereinafter referred to as “second current F2”) flows in the Peltier element 52, Heat moves from the endothermic surface 52A to the other side endothermic endothermic surface 52B. As a result, as indicated by arrow Q2, one side heat release surface 52A absorbs heat, and as shown by arrow Q1, the other side heat release surface 52B dissipates heat.

(One side heat exchanger)
As shown in FIG. 3, one side heat exchanger 60 is provided on one side heat release surface 52 </ b> A of the Peltier element 52. The one-side heat exchanger 60 is an air-cooled heat sink that cools the one-side heat release / absorption surface 52A. The one-side heat exchanger 60 has a base portion 62 and a plurality of radiating fin portions 64. The base part 62 is formed in a plate shape. The base portion 62 is in surface contact with the one-side heat release / absorption surface 52A so that heat exchange is possible.

  A heat conductive material such as a heat conductive sheet or heat conductive grease is provided between the base portion 62 and the one side heat release surface 52A to enhance the heat exchange efficiency between the base portion 62 and the one side heat release surface 52A. May be.

  The plurality of radiating fin portions 64 extend from the base portion 62 to the side opposite to the Peltier element 52. In addition, the plurality of radiating fin portions 64 are arranged in a predetermined direction (in the direction of arrow W) with an interval therebetween. These radiating fin portions 64 radiate the heat of the one side heat dissipation surface 52 </ b> A transmitted from the base portion 62. Thereby, the one side heat release surface 52A is cooled. The plurality of radiating fin portions 64 are cooled by an intake fan 44 and an exhaust fan 48 described later. The one side heat exchanger 60 is an example of a cooler and one side cooler.

(The other side heat exchanger)
The other side heat exchanger 70 is provided on the other side heat release surface 52 </ b> B of the Peltier element 52. The other side heat exchanger 70 is an air-cooled heat sink that cools the other side heat release surface 52B. The other side heat exchanger 70 holds the plurality of Peltier elements 52 sandwiched between the one side heat exchanger 60.

  Specifically, the other side heat exchanger 70 includes a base portion 72 and a plurality of radiating fin portions 74. The base part 72 is formed in a plate shape. The base portion 72 is in surface contact with the other side heat release / absorption surface 52B so that heat exchange is possible.

  A heat conductive material such as a heat conductive sheet or heat conductive grease is provided between the base portion 72 and the other side heat dissipation surface 52B to enhance the heat exchange efficiency between the base portion 72 and the other side heat dissipation surface 52B. May be.

  The plurality of heat radiating fin portions 74 extend from the base portion 72 to the side opposite to the Peltier element 52. The plurality of radiating fin portions 74 are arranged at intervals in the same direction (arrow W direction) as the radiating fin portions 64 of the one-side heat exchanger 60. These radiating fin portions 74 radiate the heat of the other side heat dissipation surface 52 </ b> B transmitted from the base portion 72. As a result, the other side heat release surface 52B is cooled. The plurality of radiating fin portions 64 are cooled by an intake fan 44 and an exhaust fan 48 described later. The other side heat exchanger 70 is an example of a cooler and the other side cooler.

(Support structure for load resistance unit)
The load resistance unit 50 is supported by the bottom wall portion 24 </ b> L of the housing 22 through a plurality of support columns 80. Specifically, an insulating plate 82 is provided on the bottom wall 24 </ b> L of the housing 22. The insulating plate 82 is formed of, for example, an electrically insulating resin.

  A plurality of fixing holes are formed in the outer peripheral portion of the insulating plate 82. Screws 84 are screwed into the respective fixing holes from the lower surface of the bottom wall portion 24 </ b> L of the housing 22. With these screws 84, the insulating plate 82 is fixed to the bottom wall portion 24 </ b> L of the housing 22. The screw 84 is an example of a fixing member. The insulating plate 82 is an example of an insulator.

  A male screw is formed on the outer peripheral surface of the lower end portion 80 </ b> L of the column 80. The lower end portion 80L of the support column 80 is screwed into a plurality of mounting holes (not shown) formed on the outer peripheral portion of the insulating plate 82. Thereby, the plurality of support columns 80 are attached to the insulating plate 82.

  The support column 80 is formed in a cylindrical shape (cylindrical shape) and is raised from the insulating plate 82. A female screw into which a screw member 86 described later is screwed is formed on the inner peripheral surface of the upper end portion 80U of the column 80. On the upper end portions 80U of these columns 80, the outer peripheral portion of the base portion 62 of the one-side heat exchanger 60 is placed. Further, a base portion 72 of the other side heat exchanger 70 is placed on the base portion 62 of the one side heat exchanger 60 via a plurality of Peltier elements 52.

  A plurality of mounting holes (not shown) are formed in the outer peripheral portion of the base portion 72 of the other side heat exchanger 70. A screw member 86 is inserted into each mounting hole. The screw member 86 is screwed into the upper end portion 80U of the support column 80 through an attachment hole formed in the outer peripheral portion of the base portion 62 of the one side heat exchanger 60.

  As a result, the plurality of Peltier elements 52 are held between the base portion 62 of the one side heat exchanger 60 and the base portion 72 of the other side heat exchanger 70. Further, the load resistance unit 50 is supported by the bottom wall portion 24 </ b> L of the housing 22 through the plurality of support columns 80.

  Here, as described above, the insulating plate 82 is interposed between the plurality of support columns 80 and the bottom wall portion 24 </ b> L of the housing 22. Further, the Peltier element 52, the one side heat exchanger 60, and the other side heat exchanger 70 are not in contact with the housing 22. Thereby, the load resistance unit 50 is supported by the support column 80 in a state of being insulated from the housing 22. In addition, the support | pillar 80 is an example of a support member.

(Intake fan)
As shown in FIG. 6, a plurality of air inlets 42 are formed on the other side surface 24 </ b> S <b> 2 in the depth direction (arrow D direction) of the housing 22. A plurality of intake fans 44 are housed on the side surface 24S2 side of the housing 22. The plurality of intake fans 44 are arranged in the width direction of the housing 22 (the direction of the arrow W in FIG. 2). When these intake fans 44 are operated, cooling air X flowing in the depth direction of the housing 22 is generated, and outside air is supplied into the housing 22 from the air inlet 42 of the housing 22. The cooling air X cools the radiating fin portions 64 and 74 of the one side heat exchanger 60 and the other side heat exchanger 70. The intake fan 44 is an example of a cooler.

(Exhaust fan)
An exhaust port 46 is formed on one side surface 24S1 in the depth direction of the housing 22, that is, the side surface 24S1 opposite to the other side surface 24S2. A plurality of exhaust fans 48 are accommodated on the side surface 24S1 side of the housing 22. The plurality of exhaust fans 48 are arranged in the width direction of the housing 22 (the direction of the arrow W in FIG. 2). When these exhaust fans 48 operate, air is exhausted from the exhaust port 46 to the outside of the housing 22 in the housing 22, and ventilation in the housing 22 is promoted. As a result, the cooling efficiency of the radiation fin portions 64 and 74 of the one side heat exchanger 60 and the other side heat exchanger 70 is enhanced. The exhaust fan 48 is an example of a cooler.

  Next, the operation of this embodiment will be described while describing a load test method (load application method) of the uninterruptible power supply 10.

  First, the operator inserts the plug 32 of the load device 20 into a socket (not shown) of the uninterruptible power supply 10 and electrically connects the load device 20 to the uninterruptible power supply 10. Further, the operator operates a plurality of intake fans 44 and exhaust fans 48 of the load device 20.

  Next, the operator operates the uninterruptible power supply 10. Thereby, an alternating current is supplied from the uninterruptible power supply 10 to the Peltier element 52 of each load resistance unit 50 of the load device 20. That is, the uninterruptible power supply 10 is a supply source that supplies the first current F1 and the second current F2 to the Peltier element 52.

  In this state, the operator measures the output voltage output from the uninterruptible power supply 10 with a voltmeter or the like. Then, the operator confirms whether or not the output voltage of the uninterruptible power supply 10 is stabilized for a predetermined time (for example, 8 hours) from the measurement result of the output voltage of the uninterruptible power supply 10. That is, the operator checks whether or not the uninterruptible power supply 10 is stably movable for a predetermined time or more.

  Here, as shown in FIG. 5A and FIG. 5B, the Peltier element 52 has one side heat release surface 52A and the other side heat release surface 52B. The one side heat release surface 52A is switched between heat release and heat absorption depending on the direction of the current flowing through the Peltier element 52. Similarly, the other side heat dissipation surface 52B is switched between heat dissipation and heat absorption depending on the direction of the current flowing through the Peltier element 52.

  More specifically, as shown in FIG. 5A, when the first current F1 in the direction of the arrow F1 flows to the Peltier element 52, the one side heat release heat absorption surface 52A dissipates heat as shown by the arrow Q1, and the arrow Q2 As shown in FIG. 2, the other side heat release heat absorbing surface 52B absorbs heat. On the other hand, as shown in FIG. 5B, when the second current F2 in the direction of the arrow F2, that is, the direction opposite to the first current F1, flows through the Peltier element 52, one side heat release surface as shown by the arrow Q2. 52A absorbs heat, and the other side heat release surface 52B dissipates heat as indicated by an arrow Q1.

  Further, as described above, an AC current is supplied to the Peltier element 52 from the uninterruptible power supply 10 (see FIG. 4). In this alternating current, for example, as shown in FIG. 7, the direction in which the current flows is alternately changed at a constant period. That is, in the alternating current, the positive / negative of the current is alternately switched at a constant cycle. When the current is positive (+), the first current F1 (see FIG. 5A) flows through the Peltier element 52. When the current is negative (−), the second current F2 (see FIG. 5) flows through the Peltier element 52. 5B) flows. Therefore, in the Peltier element 52, the first current F1 and the second current F2 that are opposite to each other alternately flow at regular intervals.

  Thereby, in the one side heat dissipation surface 52A of the Peltier element 52, heat dissipation and heat absorption are alternately switched with a fixed period. Therefore, compared with the case where the one side heat dissipation surface 52A of the Peltier element 52 is only for heat dissipation, in this embodiment, the temperature rise of the one side heat dissipation surface 52A is suppressed.

  Similarly, on the other side heat dissipation surface 52B of the Peltier element 52, heat absorption and heat dissipation are alternately switched at a constant cycle. Therefore, for example, as compared with the case where the other side heat dissipation surface 52B of the Peltier element 52 only releases heat, in this embodiment, the temperature rise of the other side heat dissipation surface 52B is suppressed.

  As described above, in the load device 20 according to the present embodiment, the first current and the second current that are opposite to each other flow alternately in the Peltier element 52. Thereby, the temperature rise of the one side heat dissipation surface 52A and the other side heat dissipation surface 52B of the Peltier element 52 is suppressed. Therefore, for example, the air conditioning load of the room where the load device 20 is installed can be reduced.

  Moreover, in this embodiment, the alternating current output from the uninterruptible power supply 10 is not converted into a direct current by a converter (inverter) or the like. Therefore, since the number of parts of the load device 20 is reduced, the structure of the load device 20 can be simplified.

  Here, as described above, the one side heat release surface 52A and the other side heat release surface 52B of the Peltier element 52 repeat heat dissipation and heat absorption alternately. At this time, for example, if heat at the time of heat dissipation is gradually stored in the one side heat release surface 52A and the other side heat release surface 52B, the temperature of the one side heat release surface 52A and the other side heat release surface 52B gradually increases. there's a possibility that.

  In particular, in the load test of the uninterruptible power supply 10, a current flows through the Peltier element 52 for a long time (for example, 8 hours or more). For this reason, the temperatures of the one side heat release surface 52A and the other side heat release surface 52B are likely to rise.

  As a countermeasure, one side heat exchanger 60 is provided on one side heat release surface 52A of the present embodiment. Thereby, the heat dissipated from the one side heat dissipation surface 52 </ b> A is radiated from the plurality of radiation fin portions 64 of the one side heat exchanger 60. As a result, the one side heat release surface 52A is cooled.

  Similarly, the other side heat exchanger 70 is provided on the other side heat release surface 52B. Thereby, the heat radiated from the other side heat release surface 52B is radiated from the plurality of radiating fin portions 74 of the other side heat exchanger 70. As a result, the other side heat release surface 52B is cooled.

  Further, the housing 22 of the load device 20 is provided with a plurality of intake fans 44. The cooling air X formed by the intake fan 44 cools the plurality of radiating fin portions 64 and 74 of the one side heat exchanger 60 and the other side heat exchanger 70. Therefore, the cooling efficiency of the one side heat release surface 52A and the other side heat release surface 52B by the one side heat exchanger 60 and the other side heat exchanger 70 is increased.

  The casing 22 of the load device 20 is provided with a plurality of exhaust fans 48. These exhaust fans 48 promote ventilation in the housing 22. Therefore, the cooling efficiency of the one side heat release surface 52A and the other side heat release surface 52B by the one side heat exchanger 60 and the other side heat exchanger 70 is further enhanced.

  In the present embodiment, the one-side heat exchanger 60 is disposed on one side in the thickness direction of the Peltier element 52. The other side heat exchanger 70 is disposed on the other side in the thickness direction of the Peltier element 52. The Peltier element 52 is held between the one side heat exchanger 60 and the other side heat exchanger 70. Thereby, size reduction of the load resistance unit 50 can be achieved. As a result, the load device 20 can be downsized.

  Next, the leakage current leaking from the load resistance unit 50 will be supplemented. FIG. 8 shows a circuit model of the load device 100 according to the comparative example. An insulating plate is not provided on the bottom wall portion 24 </ b> L of the housing 22 of the load device 100.

  As shown in FIG. 8, the Peltier element 52 has not only a resistance (load component) R but also a parasitic (parasitic capacitance) C caused by the physical structure of the Peltier element 52. This parasitic C may cause a leakage current in the Peltier element 52. This leakage current is grounded (frame ground) to the bottom wall portion 24L of the housing 22 via the one side heat exchanger 60, the other side heat exchanger 70, and the support column 80, for example, as indicated by an arrow a. Is done. That is, in the load device 100 according to the comparative example, the leakage current of the Peltier element 52 may flow to the bottom wall portion 24 </ b> L of the housing 22.

  On the other hand, as shown in FIG. 3, the load resistance unit 50 of the present embodiment is supported by the bottom wall portion 24 </ b> L of the housing 22 through the support column 80 in a non-contact state with the housing 22. Further, an insulating plate 82 is provided on the bottom wall portion 24L of the housing 22. The insulating plate 82 is interposed between the bottom wall portion 24 </ b> L of the housing 22 and the support column 80. By this insulating plate 82, the leakage current of the Peltier element 52 is suppressed from flowing to the bottom wall portion 24 </ b> L of the housing 22 through the support column 80.

  Further, as described above, the load resistance unit 50 is supported by the bottom wall portion 24 </ b> L of the housing 22 via the support column 80 in a non-contact state with the housing 22. That is, in the present embodiment, the leakage current path of the Peltier element 52 is limited to the support 80. Therefore, the number of insulators such as the insulating plate 82 is reduced.

  Further, since the Peltier element 52 is a semiconductor and is not a part with a limited lifetime, the necessity for regular maintenance is eliminated. Accordingly, since the replacement work of the Peltier element 52 is eliminated, the maintainability of the load device 20 is improved.

  Next, a modification of the above embodiment will be described.

  The load device 20 may be provided with a converter (inverter) that converts a direct current into an alternating current, for example. In this case, for example, the load device 20 can be used for a load test of the DC power supply device. That is, a direct current output from the direct current power supply device is converted into an alternating current by a converter and flows through the Peltier element 52. Thereby, similarly to the said embodiment, the temperature rise of 52 A of one side heat release surfaces and the other side heat release surface 52B of the Peltier device 52 can be suppressed.

  In addition, the current flowing through the Peltier element 52 is not limited to a sinusoidal waveform alternating current whose magnitude changes at a constant period. In the Peltier element 52, for example, a first current and a second current having a constant size and opposite directions can be alternately flowed.

  Moreover, the timing which interchanges a 1st electric current and a 2nd electric current is not restricted periodically. For example, the temperature of the one side heat release surface 52A and the other side heat release surface 52B of the Peltier element 52 is detected by a temperature sensor or the like. Then, when the temperature of the one side heat dissipation surface 52A of the Peltier element 52 becomes equal to or higher than a predetermined temperature, the current flowing through the Peltier element 52 is switched from the first current to the second current. Further, when the temperature of the other side heat dissipation surface 52B of the Peltier element 52 becomes equal to or higher than a predetermined value, the current flowing through the Peltier element 52 is switched from the second current to the first current. Thereby, the temperature rise of the one side heat release surface 52A and the other side heat release surface 52B can be more efficiently suppressed.

  Moreover, in the said embodiment, the one side heat exchanger 60 and the other side heat exchanger 70 are comprised including an air-cooling type heat sink. However, at least one of the one side heat exchanger and the other side heat exchanger may include, for example, a liquid-cooled heat sink.

  The one side heat release / absorption surface 52A and the other side heat release / absorption surface 52B may be cooled not by the one side heat exchanger 60 and the other side heat exchanger 70 but by a cooler such as a cooling fan. In the case of a cooling fan, a single cooling fan can generate cooling air that cools both the one side heat release surface 52A and the other side heat release surface 52B. In other words, in the load application method according to the above-described embodiment, the first current F1 and the second current opposite to each other are applied to the Peltier element 52 while cooling at least one of the one side heat release surface 52A and the other side heat release surface 52B. The current F2 can flow alternately.

  Further, for example, when the temperature rise of the one side heat release surface 52A and the other side heat release surface 52B is not a problem, the one side heat exchanger 60, the other side heat exchanger 70, the intake fan 44, and the exhaust fan 48 At least one can be omitted.

  Moreover, the shape of the one side heat release / absorption part and the other side heat release / absorption part is not limited to a flat surface such as the one side heat release / absorption surface 52A or the other side heat release / absorption surface 52B, and may be another shape.

  Further, the Peltier element 52 may be disposed between the one side heat exchanger 60 and the other side heat exchanger 70 in a state of being mounted on the substrate.

  Further, the load device 20 is not limited to the power supply device such as the uninterruptible power supply device 10 and can be used for a load test of a load application target such as a breaker or a cable.

  As mentioned above, although one Embodiment of the technique which this application discloses was described, the technique which this application discloses is not limited to said embodiment. In addition, the above embodiment and various modifications may be used in appropriate combination, and it is needless to say that various embodiments can be implemented without departing from the gist of the technology disclosed in the present application.

  In addition, the following additional remarks are disclosed regarding the above embodiment.

(Appendix 1)
A heat transfer element that is connected to the load application target and that alternately flows a first current and a second current in a direction opposite to the first current,
Load device.
(Appendix 2)
The heat transfer element is
A one-side heat-dissipating part that is provided on one side of the heat transfer element, dissipates heat when the first current flows through the heat transfer element, and absorbs heat when the second current flows through the heat transfer element; ,
The other side of the heat transfer element, which dissipates heat when the second current flows through the heat transfer element, and absorbs heat when the first current flows through the heat transfer element; ,
Having
The load device according to appendix 1.
(Appendix 3)
A one-side cooler that is provided in the one-side heat release / absorption section and cools the one-side heat release / absorption section;
The other side cooler which is provided in the other side heat release heat absorption part and cools the other side heat release heat absorption part;
The load device according to Supplementary Note 2, comprising:
(Appendix 4)
The heat transfer element is disposed between the one side cooler and the other side cooler;
The load device according to attachment 3.
(Appendix 5)
The heat transfer element is sandwiched between the one side cooler and the other side cooler,
The load device according to appendix 4.
(Appendix 6)
The one-side cooler includes a one-side heat exchanger that exchanges heat with the one-side heat dissipation / absorption section,
The other-side cooler includes the other-side heat exchanger that exchanges heat with the other-side heat dissipation / absorption section.
The load device according to any one of supplementary notes 3 to 5.
(Appendix 7)
A cooling fan that generates cooling air that cools at least one of the one side heat exchanger and the other side heat exchanger;
The load device according to appendix 6.
(Appendix 8)
A cooler that cools at least one of the one side heat release / absorption part and the other side heat release / absorption part;
The load device according to attachment 2.
(Appendix 9)
The cooler includes a cooling fan that generates cooling air that cools at least one of the one side heat release heat absorption part and the other side heat release heat absorption part.
The load device according to appendix 8.
(Appendix 10)
A housing that houses the heat transfer element;
An insulator for insulating the heat transfer element and the housing;
The load device according to any one of supplementary notes 3 to 7, comprising:
(Appendix 11)
A support member provided on the housing and supporting the heat transfer element;
The insulator is interposed between the housing and the support member;
The load device according to attachment 10.
(Appendix 12)
The support member supports the heat transfer element, the one side cooler, and the other side cooler.
The load device according to appendix 11.
(Appendix 13)
The heat transfer element, the one side cooler, and the other side cooler are supported by the support member in a non-contact state with the housing.
The load device according to appendix 12.
(Appendix 14)
The one side heat dissipation / absorption part is a surface on one side of the heat transfer element,
The other side heat dissipation / absorption part is a surface on the other side of the heat transfer element,
The load device according to any one of appendix 2 to appendix 13.
(Appendix 15)
The load application object includes an AC power supply device serving as a supply source for supplying the first current and the second current to the heat transfer element,
The load device according to any one of supplementary notes 1 to 14.
(Appendix 16)
Power is supplied from the load application object to the heat transfer element, and a first current and a second current in a direction opposite to the first current are alternately supplied to the heat transfer element.
Load application method.
(Appendix 17)
The heat transfer element is
A one-side heat-dissipating part that is provided on one side of the heat transfer element, dissipates heat when the first current flows through the heat transfer element, and absorbs heat when the second current flows through the heat transfer element; ,
The other side of the heat transfer element, which dissipates heat when the second current flows through the heat transfer element, and absorbs heat when the first current flows through the heat transfer element; ,
Have
While cooling at least one of the one side heat release / absorption part and the other side heat release / absorption part, the first current and the second current are alternately passed through the heat transfer element,
The load applying method according to appendix 16.
(Appendix 18)
While the one side heat release / absorption part is cooled by the one side cooler, the first current and the second current are alternately passed through the heat transfer element while the other side heat release / heat absorption part is cooled by the other side cooler. ,
The load applying method according to appendix 17.
(Appendix 19)
The one-side cooler includes a one-side heat exchanger that exchanges heat with the one-side heat dissipation / absorption section,
The other-side cooler includes an other-side heat exchanger that exchanges heat with the other-side heat dissipation / absorption part,
While cooling the one side heat exchanger and the other side heat exchanger with a cooling fan, the first current and the second current are alternately passed through the heat transfer element,
The load applying method according to appendix 18.
(Appendix 20)
The load application object includes an AC power supply device,
Flowing the first current and the second current from the AC power supply device to the heat transfer element;
The load application method according to any one of appendix 16 to appendix 19.

10 Uninterruptible power supply (example of load application object and AC power supply)
20 Load device 22 Case 44 Intake fan (an example of a cooler and a cooling fan)
48 Exhaust fan (example of cooler and cooling fan)
52 Peltier element (an example of heat transfer element)
52A One side heat release surface (an example of one side heat release part)
52B The other side heat release heat absorption surface (an example of the other side heat release heat absorption part)
60 One side heat exchanger (an example of a cooler and one side cooler)
70 Heat exchanger on the other side (an example of a cooler and a cooler on the other side)
80 support (an example of a support member)
82 Insulating plate (an example of an insulator)
F1 First current F2 Second current X Cooling air

Claims (8)

A heat transfer element that is connected to the load application target and that alternately flows a first current and a second current in a direction opposite to the first current,
Load device. The heat transfer element is
A one-side heat-dissipating part that is provided on one side of the heat transfer element, dissipates heat when the first current flows through the heat transfer element, and absorbs heat when the second current flows through the heat transfer element; ,
The other side of the heat transfer element, which dissipates heat when the second current flows through the heat transfer element, and absorbs heat when the first current flows through the heat transfer element; ,
Having
The load device according to claim 1. A one-side cooler that is provided in the one-side heat release / absorption section and cools the one-side heat release / absorption section;
The other side cooler which is provided in the other side heat release heat absorption part and cools the other side heat release heat absorption part;
The load device according to claim 2, comprising: The heat transfer element is sandwiched between the one side cooler and the other side cooler,
The load device according to claim 3. A cooler that cools at least one of the one side heat release / absorption part and the other side heat release / absorption part;
The load device according to claim 2. The load application object includes an AC power supply device serving as a supply source for supplying the first current and the second current to the heat transfer element,
The load device according to any one of claims 1 to 5. Power is supplied from the load application object to the heat transfer element, and a first current and a second current in a direction opposite to the first current are alternately supplied to the heat transfer element.
Load application method. The heat transfer element is
A one-side heat-dissipating part that is provided on one side of the heat transfer element, dissipates heat when the first current flows through the heat transfer element, and absorbs heat when the second current flows through the heat transfer element; ,
The other side of the heat transfer element, which dissipates heat when the second current flows through the heat transfer element, and absorbs heat when the first current flows through the heat transfer element; ,
Have
While cooling at least one of the one side heat release / absorption part and the other side heat release / absorption part, the first current and the second current are alternately passed through the heat transfer element,
The load applying method according to claim 7.