CN113769995B - Integrated precise constant-temperature constant-humidity gas-liquid output device for gluing semiconductor wafer - Google Patents
Integrated precise constant-temperature constant-humidity gas-liquid output device for gluing semiconductor wafer Download PDFInfo
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- CN113769995B CN113769995B CN202111214974.6A CN202111214974A CN113769995B CN 113769995 B CN113769995 B CN 113769995B CN 202111214974 A CN202111214974 A CN 202111214974A CN 113769995 B CN113769995 B CN 113769995B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
- B05C11/1013—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to flow or pressure of liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1042—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C15/00—Enclosures for apparatus; Booths
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0406—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
- B05D3/0413—Heating with air
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Abstract
The invention discloses an integrated precise constant-temperature and constant-humidity gas-liquid output device for gluing a semiconductor wafer, which comprises a first refrigerator unit, a first condenser unit, a first evaporator unit, a first throttling unit, a first reheater unit, a humidifying unit, a blower unit, an air inlet unit, an air volume adjusting unit, a condensed water discharging unit, a second refrigerator unit, a second condenser unit, a second evaporator unit and a third evaporator unit, a second throttling unit, a second precooler unit, a liquid collector unit, a liquid pumping unit, a storage tank, a liquid heating unit, a first liquid distributor unit and a second liquid distributor unit, a second reheater unit, a system intelligent control unit and the like. The invention is applied to the gluing process for manufacturing the semiconductor wafer, has an integral structure, extremely high intelligent degree and extremely high control precision of output parameters, and completely meets the requirements of the semiconductor wafer production process.
Description
Technical Field
The invention relates to a gas constant temperature and humidity and constant temperature and constant flow liquid output device, in particular to a semiconductor wafer gluing integrated precise constant temperature and humidity gas and liquid output device.
Background
At present, in a semiconductor production process, photoetching is an important process link for transferring integrated circuit patterns, the gluing quality directly influences the photoetching quality, and the gluing process is also very important. In the photolithography process, 20-30 photolithography steps are usually required, and the current technology mainly adopts the photolithography technique using ultraviolet rays (including far ultraviolet rays) as a light source. The photoetching process comprises the steps of manufacturing a mask of a reprinting graph, coating, pre-baking, exposing, developing, post-baking, corroding, removing the photoresist on the surface of the silicon substrate and the like.
The coating of the resist was performed by a spin coater in which the rotation speed and the rotation time were freely set. Firstly, a wafer substrate is absorbed on a sucking disc of a spin coater by a vacuum absorption method, photoresist with certain viscosity is dripped on the surface of the wafer substrate, and then the photoresist is spun at a set rotating speed and time. Due to the action of centrifugal force, the photoresist is uniformly spread on the surface of the wafer substrate, redundant photoresist is thrown off, a photoresist film with a certain thickness is obtained, and the film thickness of the photoresist is controlled by the viscosity of the photoresist and the rotating speed of the thrown photoresist.
The spin coater is arranged in a working chamber of the main equipment, positive pressure air supply is needed in the chamber, and the parameters of cleanliness, temperature, humidity, wind speed and the like of the fed air directly influence the coating quality level of the gluing process and the yield.
In addition, in the coating and pre-drying processes of the wafer substrate, various chemical liquids are not needed, and the temperature and the flow rate of the chemical liquids are directly related to the coating and drying quality level of the wafer substrate.
At present, manufacturers in the same industry also develop various auxiliary devices, the temperature, the humidity, the temperature of the wind speed fluid, the flow and the like entering each working chamber of the main device are processed mostly by discrete devices or only single working chambers can be processed, a factory service end can only be matched with more auxiliary devices to meet the requirements, so that the device integration level is insufficient, the integrated control level is low, the management difficulty of device operation, maintenance, scheduling and the like is increased, and the device intelligent control level is low. Therefore, various large enterprises in the industry are dedicated to developing and improving the technical level of supporting equipment so as to meet the requirements of semiconductor production.
Disclosure of Invention
The purpose of the invention is as follows: the invention aims to provide a semiconductor wafer gluing integrated precise constant-temperature constant-humidity gas-liquid output device with better effect, and particularly aims to realize a plurality of substantial technical effects of an implementation part.
In order to achieve the purpose, the invention adopts the following technical scheme:
the integrated precise constant-temperature constant-humidity gas-liquid output device for gluing the semiconductor wafer is characterized in that the output device is provided with a gas part device and a liquid part device;
the equipment of the gas part comprises an air channel, wherein an air inlet unit 3 is arranged on the air channel, the air inlet unit is an air inlet, an evaporator unit I4 is arranged in the air channel, and a reheater unit I6 is also arranged in the air channel; the end of the air duct includes a blower unit 11;
the first evaporator unit 4 extends out of the pipeline and is connected with the first condenser unit 1 and the first refrigerator unit 5; the condenser unit I1 extends out of a pipeline and is connected with a reheater unit I6; the reheater unit I6 is connected with the refrigerator unit I5 through a pipeline, and the condenser unit I1 is also connected with the refrigerator unit I5 through a pipeline; the air duct is connected with a condensed water discharge unit 22;
the liquid part equipment comprises liquid pipes, the liquid pipes are connected with a first liquid distributor unit 81 and a second liquid distributor unit 82, and liquid heating units 9 are arranged on a plurality of branch pipes of the first liquid distributor unit 81; the liquid branch pipes of the first liquid distributor unit 81 and the second liquid distributor unit 82 are connected into the working chambers of the main equipment; a plurality of pipelines extending out of the working chambers are connected to a liquid collector unit 15, the liquid collector unit 15 extends out of the pipelines and is connected to a precooler unit 14, the precooler unit 14 extends out of the pipelines and is connected to a storage tank 17, a liquid pumping unit 16 is arranged on the pipeline extending out of the storage tank 17, the liquid pumping unit 16 is connected with a second evaporator unit 18 and a third evaporator unit 19, the second evaporator unit 18 extends out of the pipelines and is connected to a first liquid distributor unit 81, the third evaporator unit 19 extends out of the pipelines and is connected to a second reheater unit 21, and a second refrigerator unit 20 is connected between the third evaporator unit 19 and the second reheater unit 21 through pipelines; the pre-cooler unit 14 extends out of the pipeline and is connected with the second condenser unit 12, the second evaporator unit 18 and the third evaporator unit 19 are connected with the pipeline connected with the second condenser unit 12 and then connected with the second reheater unit 21 and the second refrigerator unit 20.
The further technical scheme of the invention is that the air inlet unit 3 sends the air of the equipment layer into the device, after the air is cooled and dehumidified by the evaporator unit I4, the air passes through the reheater unit I6 to be heated, and the air is humidified by the humidification unit 7, and after the temperature and humidity indexes required by the main equipment 200 are reached, the air is sent into the working chamber of the main equipment 200 by the air supply unit through a certain heat insulation pipeline; the wind speed index adjustment of the working chamber of the main device 200 is realized by the air volume adjusting unit 23;
the liquid collector unit 15 collects chemical liquid from the working chambers of the main equipment 200, sends the chemical liquid into the precooler unit 14, cools the chemical liquid by cooling water at a plant service end, enters the storage tank 17, and sends the chemical liquid into the evaporator unit II 18 through the liquid pumping unit 16, after cooling, the chemical liquid is divided into two paths, one path of the chemical liquid is sent to the liquid distributor unit through a certain pipeline and is divided into N branches, after being heated by the liquid heating unit 9, the chemical liquid is respectively sent into the N working chambers of the main equipment 200, the other path of the chemical liquid flows through the reheater unit II 21, and after heating adjustment, the chemical liquid is also sent into the N working chambers of the main equipment 200, and the whole cycle is completed.
The invention further adopts the technical scheme that the method is characterized in that: the system intelligent control unit 102 is connected to the main device 200 via a communication cable, and the main device 200 controls the output apparatus 100.
The further technical scheme of the invention is that the output device comprises a series of temperature, humidity, pressure, flow and liquid level sensors as sensing devices, acquires signals, transmits the signals to the system intelligent control unit 102 through various A/D transmitters, performs logic judgment by a special control software program, sends feedback control signals to each unit, drives each unit to change correspondingly, and enables the temperature, humidity and flow of the air and the chemical liquid produced by the output device 100 to approach the target values set by the N working chambers of the main equipment 200.
The invention further adopts the technical scheme that the intelligent control system is provided with a system intelligent control unit 102, and the output device 100 is cooled by utilizing cooling water of a service end; the refrigerating compressors of the first refrigerating unit 5 and the second refrigerating unit 20 belong to variable-frequency compressors, and high-efficiency Freon refrigerants are selected.
The further technical scheme of the invention is that the condenser unit I1 and the condenser unit II 12 adopt water-cooled condensers, and cooling water at a plant service end is adopted for cooling and heat exchange; the first evaporator unit 4 adopts a fin-tube type heat exchanger, refrigerant flows in the tube, and cooled gas flows outside the tube; the second evaporator unit 18 and the third evaporator unit adopt plate heat exchangers, refrigerant flows on one side, and cooled chemical liquid flows on the other side; the first throttling unit 2 and the second throttling unit 13 adopt electronic expansion valves; the reheater unit I6 heats the gas, a fin-tube type heat exchanger is adopted, refrigerant flows in the tube, and gas flows outside the tube; the second reheater unit 21 heats the chemical liquid and adopts a plate heat exchanger.
The further technical scheme of the invention is that the humidifying unit 7 humidifies the gas, and adopts a resistance heater to heat D.I. water at a plant end to generate steam to humidify the gas; the blower unit 11 conveys the gas to the equipment end through a pipeline, and a variable frequency fan is adopted; the air volume adjusting unit 23 adjusts the air volume discharged to the equipment layer through the air volume adjusting valve to adjust the air volume conveyed to the equipment end, and adopts an electric air volume adjusting valve; the condensed water discharge unit 22 comprises a drainage pump, a water level sensor and a drainage pipeline, and is used for discharging the condensed water generated when the gas is cooled by the first evaporator unit 4 into a main drainage pipeline at a service end of the equipment layer through the drainage pump by a pipeline, and the process is pushed by an output signal of the water level sensor to automatically start and stop drainage;
the precooler unit 14 cools the chemical liquid passing through the precooler unit 14 and the cooling water of the plant service end, so that the parameter entering the output device 100 is maintained within a certain target value range, and the precision requirement of the parameter state after the secondary treatment by the output device 100 is met, and the precooler unit 14 adopts a plate heat exchanger.
The further technical scheme of the invention is that the chemical liquid is heated by a liquid heater unit, so that the temperature of each path of chemical liquid in the N paths reaches the temperature requirements of N working chambers at the 200 end of the main device, the liquid heater unit adopts a resistance type pipeline heater, and N is not less than 4;
the air supply unit can manually adjust the air inlet volume, is provided with a filter which meets the requirements of the cleanliness of gas and the concentration of chemicals at the equipment end, and adopts a replaceable filter;
the evaporator unit I4 is used for cooling and dehumidifying and comprises a refrigerator unit I5, a condenser unit I1, an evaporator unit I4 and a throttling unit I2, so that a complete refrigerating system is formed, the evaporator unit I4 is used for cooling and dehumidifying gas flowing through, and the refrigerating system is used for ensuring that the temperature of the evaporator unit cannot be lower than zero and avoiding the surface of the evaporator unit from being frozen;
the first reheater unit 6 is heated, heat is discharged from part of the first refrigerator unit 5 at high temperature, high-temperature refrigerant gas flows in the first reheater pipe, the gas flowing out of the pipe is heated, the temperature and the precision of the output gas are controlled, and preferably, the temperature precision is controlled to be +/-0.1 ℃;
the refrigerating system comprises a second refrigerator unit 20, a second condenser unit 12, a second evaporator unit 18, a third evaporator unit and a second throttling unit 13; and the second evaporator unit 18 and the third evaporator unit cool the chemical liquid flowing through.
The further technical scheme of the invention is that the chemical liquid is divided into two paths, one path of the chemical liquid is sent to a first liquid separator unit 81 through a certain pipeline, each branch of the N paths is provided with a set of liquid heater unit to adjust the temperature of the chemical liquid output by the path, and an adjusting signal comes from a control program of the main device 200; the flow rate of the chemical liquid in each of the N paths is constant relative to the other path, and the flow rate value is small, preferably, the flow rate is 10-20 l/S.
The further technical scheme of the invention is that the other path of the chemical liquid flows through the second reheater unit 21, after heating adjustment, the heat of the reheater comes from the exhaust of the second refrigerator unit 20 of the other refrigerating system, the chemical liquid is divided into N paths through the second knockout unit 82 and sent into N working chambers of the main equipment 200, and in each of the N paths, the flow value of the chemical liquid is larger, preferably, the flow is 50l/S or more.
Compared with the prior art, the invention adopting the technical scheme has the following beneficial effects: compared with the prior art, the invention has the advantages that,
the method has the advantages that (I) in the semiconductor wafer gluing process, the master equipment intelligently controls the slave equipment, and the work of operators in a production layer is greatly facilitated;
(II) the environmental parameters of the working chamber of the main equipment can be controlled with extremely high precision, the temperature precision reaches +/-0.1 ℃, and the humidity precision reaches +/-0.5% RH and above;
thirdly, parameter environments required by the semiconductor wafer gluing process are creatively integrated into one device, and the special software program is used for realizing the precise control of peculiar parameters and chemical liquid parameters required by the process;
and (IV) the floor area of the semiconductor wafer production layer is greatly saved, and the utilization rate of a factory workshop is effectively improved.
And (V) the implementation of the integral output device greatly saves the energy consumption of the factory.
Drawings
To further illustrate the present invention, further description is provided below with reference to the accompanying drawings:
FIG. 1 is a schematic view of a product of the present invention
FIG. 2 is one of the control logic diagrams of the present invention;
FIG. 3 is a second control logic diagram of the present invention; FIGS. 2 and 3 are an overall view;
FIG. 4 is a system diagram of the present invention;
FIG. 5 is a system diagram of the present invention, i.e., a partial diagram of FIG. 4;
FIG. 6 is a system diagram of the present invention, i.e., a partial diagram of FIG. 4;
FIG. 7 is a system diagram of the present invention, partially labeled FIG. 4;
wherein: 1. condenser unit I, 2, throttling unit I, 3, air inlet unit, 4, evaporator unit I, 5, refrigerator unit I, 6, reheater unit, 7, humidifying unit, 81, liquid distributor unit I, 82, liquid distributor unit II, 9, liquid heating unit, 11, blower unit, 12, condenser unit II, 13, throttling unit II, 14, precooler unit, 15, liquid collector unit, 16, liquid pumping unit, 17, storage tank, 18, evaporator unit II, 19, evaporator unit III, 20, refrigerator unit II, 21, reheater unit II, 22, condensed water discharge unit, 23, air volume adjusting unit, 100, output device, 101, data communication cable, 102, system intelligent control unit, 103, gas pipeline, 104, chemical liquid pipeline, 200, main equipment, 201, first working chamber, 202, second working chamber, refrigerant liquid outlet, data communication cable, 102, system intelligent control unit, 103, gas pipeline, 104, chemical liquid pipeline, 200, main equipment, 201, first working chamber, second working chamber, liquid outlet, 203. a third working chamber, 20N, an nth working chamber, 210, a main device control unit.
Detailed Description
The present invention will be further illustrated with reference to the accompanying drawings and specific embodiments, which are to be understood as merely illustrative of the invention and not as limiting the scope of the invention. In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "top", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the devices or elements referred to must have specific orientations, be constructed and operated in specific orientations, and thus, should not be construed as limiting the present invention. Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The patent provides a plurality of parallel schemes, and different expressions belong to an improved scheme based on a basic scheme or a parallel scheme. Each solution has its own unique features. In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other. The fixing means, which is not described herein, may be any one of screw fixing, bolt fixing, or glue bonding.
The air inlet unit 3 sends the air of the equipment layer into the device 100, the air passes through the first evaporator unit 4, is cooled and dehumidified, then flows through the first reheater unit, is heated, and the air of the humidifying unit 7 is humidified to reach the temperature and humidity indexes required by the main equipment, and then is sent into the working chamber of the main equipment 200 through a certain heat-insulating pipeline 103 by the air supply unit 11; the wind speed index of the working chamber of the main device 200 is adjusted by the wind volume adjusting unit 23.
The liquid collector unit 15 collects the chemical liquids from the working chambers of the main equipment 200, sends the chemical liquids to the precooler unit 14, cools the chemical liquids by cooling water PCW at the plant service end, enters the storage tank 17, sends the chemical liquids to the evaporator unit two 18 and the evaporator unit three 19 through the liquid pumping unit 16, cools the chemical liquids, divides the chemical liquids into two paths, sends the chemical liquids to the liquid distributor unit one 81 through a certain pipeline, divides the chemical liquids into N branches, respectively sends the chemical liquids to the N working chambers of the main equipment after being heated by the liquid heating unit 9, and sends the chemical liquids to the N working chambers of the main equipment after passing through the reheater unit two 21 through the other path of the liquid distributor unit two 82 and also sends the chemical liquids to the N working chambers of the main equipment 200 after being heated and adjusted, thereby completing the whole cycle.
The output device 100 has an integrated structure, and is provided with the system intelligent control unit 102, and the output device 100 is cooled by cooling water PCW of a service end.
Further, the method is characterized in that: the system intelligent control unit 102 is connected 101 with the control unit 210 of the main device 200 through a communication cable, and the main device 200 controls the output device 100.
Further, the method is characterized in that: the system comprises a series of temperature, humidity, pressure, flow and liquid level sensors as sensing devices, acquires signals, transmits the signals to the system intelligent control unit 102 through various A/D transmitters, performs logic judgment by a special control software program 101, sends feedback control signals to each unit, drives each unit to change correspondingly, and enables the temperature, humidity and flow of air and chemical liquid produced by the output device 100 to approach target values set by N working chambers of the main equipment 200.
Furthermore, the first refrigerator unit 5 and the second refrigerator unit 22 are characterized in that: the refrigerating compressor belongs to the variable frequency compressor. Preferably, a highly efficient freon refrigerant is selected.
Further, condenser unit 1, condenser unit two 12, its characterized in that: preferably, a water-cooled condenser is selected, and cooling water PCW at a plant service end is used for cooling and heat exchange.
Further, the evaporator unit i 4, the evaporator unit ii 18, and the evaporator unit iii 19 are characterized in that: preferably, the first evaporator unit 4 is a fin-tube heat exchanger, refrigerant flows in the tubes, and cooled gas flows outside the tubes; preferably, the second evaporator unit 18 and the third evaporator unit 19 are plate heat exchangers, and one side of the plate heat exchangers is filled with refrigerant, and the other side of the plate heat exchangers is filled with cooled chemical liquid.
Furthermore, the first throttling unit 2 and the second throttling unit 13 preferably adopt electronic expansion valves.
Further, the reheater unit one 6 heats the gas, preferably, a fin-tube heat exchanger is used, refrigerant flows in the tube, and gas flows outside the tube.
Further, the second reheater unit 21 heats the chemical liquid CLF, preferably, a plate heat exchanger is used.
Further, the humidifying unit 7 humidifies the gas, preferably, a resistive heater is used for heating d.i. water at a plant end to generate steam to humidify the gas, and the d.i. water level of the water is automatically detected and automatically replenished.
Further, the blower unit 11 preferably employs a variable frequency blower for conveying the gas to the main apparatus 200 through a pipeline.
Further, the air volume adjusting unit 23 adjusts the air volume delivered to the equipment terminal 200 by passing the air through an air volume adjusting valve, and preferably, an electric air volume adjusting valve is used.
Further, the condensed water discharging unit 22 includes a water discharging pump, a water level sensor, and a water discharging pipeline, when the gas is cooled by the first evaporator unit 4, the generated condensed water is discharged to a main water discharging pipeline of a service end of an equipment floor through the water discharging pump via a pipeline, and an output signal of the water level sensor pushes automatic start and stop of the water discharging process.
Further, the chemical liquid is cooled by the precooler unit 14 and the cooling water at the plant service end, so that the parameter entering the output device 100 is maintained within a certain target value range, and the precision requirement of the parameter state after the secondary treatment by the output device 100 is met, preferably, the precooler unit 14 adopts a plate heat exchanger.
Further, the chemical liquid is heated by the liquid heater unit 9, so that the temperature of each of the N chemical liquid paths reaches the temperature requirement of the N working chambers of the main device 200, preferably, the liquid heater unit 14 is a resistance type pipe heater, and N is not less than 4.
Further, the air supply unit 11 may be manually adjusted in the amount of intake air, and includes a filter satisfying the gas cleanliness and chemical concentration of the main equipment 200, and preferably, a replaceable filter is used.
Furthermore, the evaporator unit I4 is cooled and dehumidified, and comprises the refrigerator unit I5, the condenser unit I1, the evaporator unit I4 and the throttling unit I2, so that a complete refrigerating system is formed, the evaporator unit I4 is cooled and dehumidified to refrigerate and dehumidify gas flowing through, and preferentially, the refrigerating system ensures that the temperature of the evaporator unit 4 cannot be lower than zero, so that the icing on the surface of the evaporator unit is avoided.
Further, the reheater unit one 6 is heated, heat is discharged from the refrigerator unit one 5 at a high temperature, a high-temperature refrigerant gas flows through the tube of the reheater 6, the gas flowing through the tube is heated, and the temperature and the accuracy of the outputted gas are controlled, preferably, the temperature accuracy is controlled to be ± 0.1 ℃.
Further, the second evaporator unit 18 and the third evaporator unit 19 are cooled, and comprise a second refrigerator unit 20, a second condenser unit 12, a second evaporator unit 18, a third evaporator unit 19 and a second throttling unit 13 to form another complete refrigerating system, and the second evaporator unit 18 and the third evaporator unit 19 are used for cooling chemical liquid flowing through.
Further, the chemical liquid is divided into two paths, one path of the chemical liquid is sent to each branch of the first 81 and N paths of the liquid distributor unit through a certain pipeline, a set of the liquid heater 9 is configured to adjust the temperature of the chemical liquid output by the path, and an adjustment signal is from the control program of the main device 200; the flow rate of the chemical liquid in each of the N paths is constant relative to the other path and is small, preferably in the range of 10-20 l/S.
Further, another path of the chemical liquid flows through the second reheater unit 21, after heating adjustment, heat is discharged from the second chiller unit 20 of the other refrigeration system, the chemical liquid is sent to the N working chambers of the main apparatus 200 through the second liquid separator unit 82 in N paths, and the flow rate of the chemical liquid in each of the N paths is relatively large, preferably, the flow rate is 50l/S or more.
The working process of the invention is as follows: the first start-up, the main device control unit 210 at the main device 200 end sends out a demand instruction, the output device 100 is started through the communication cable 101 and further through the system intelligent control unit 102, and each functional unit operates cooperatively according to the logic program illustrated in fig. two, so that gas with a certain temperature and a certain humidity and chemical liquid with a certain temperature and a certain flow rate required in the semiconductor wafer gluing process can be provided, and the actual requirements of the semiconductor gluing process are completely met.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are intended to illustrate the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, and the invention is to be limited to the embodiments described above.
Claims (10)
1. The integrated precise constant-temperature constant-humidity gas-liquid output device for gluing the semiconductor wafer is characterized in that the output device is provided with a gas part device and a liquid part device;
the equipment of the gas part comprises an air duct, wherein an air inlet unit (3) is arranged on the air duct, the air inlet unit is an air inlet, a first evaporator unit (4) is arranged in the air duct, and a first reheater unit (6) is also arranged in the air duct; the end part of the air duct comprises a blower unit (11);
the first evaporator unit (4) extends out of the pipeline and is connected with the first condenser unit (1) and the first refrigerator unit (5); the condenser unit I (1) extends out of a pipeline and is connected with the reheater unit I (6); the reheater unit I (6) is connected with the refrigerator unit I (5) through a pipeline, and the condenser unit I (1) is also connected with the refrigerator unit I (5) through a pipeline; the air duct is connected with a condensed water discharge unit (22);
the liquid part equipment comprises a liquid pipe, wherein the liquid pipe is connected with a first liquid distributor unit (81) and a second liquid distributor unit (82), and a liquid heating unit (9) is arranged on a plurality of branch pipes of the first liquid distributor unit (81); a plurality of liquid branch pipes of the first liquid distributor unit (81) and the second liquid distributor unit (82) are connected into a plurality of working chambers of the main equipment; a plurality of pipelines extending out of the working chambers are connected to a liquid collector unit (15), the extending pipeline of the liquid collector unit (15) is connected to a precooler unit (14), the extending pipeline of the precooler unit (14) is connected to a storage tank (17), a liquid pumping unit (16) is arranged on the extending pipeline of the storage tank (17), the liquid pumping unit (16) is connected to a second evaporator unit (18) and a third evaporator unit (19), the extending pipeline of the second evaporator unit (18) is connected to a first liquid distributor unit (81), the extending pipeline of the third evaporator unit (19) is connected to a second reheater unit (21), and the third evaporator unit (19) and the second reheater unit (21) are also connected to a second refrigerator unit (20) through pipelines; the precooler unit (14) extends out of the pipeline and is connected with the second condenser unit (12), the second evaporator unit (18) and the third evaporator unit (19) are connected with the pipeline, are connected into the second condenser unit (12) and then are connected with the second reheater unit (21) and the second refrigerator unit (20).
2. An integrated precision constant temperature and humidity gas and liquid output device for semiconductor wafer coating according to claim 1,
the air inlet unit (3) sends the air of the equipment layer into the device, after being cooled and dehumidified by the evaporator unit I (4), the air passes through the reheater unit I (6) to be heated, and the air is humidified by the humidification unit (7), and after reaching the temperature and humidity indexes required by the main equipment (200), the air is sent into the working chamber of the main equipment (200) through a certain heat preservation pipeline by the air supply unit; the wind speed index adjustment of the working chamber of the main device (200) is realized through an air volume adjusting unit (23);
the liquid collector unit (15) collects chemical liquid from working chambers of the main equipment (200), the chemical liquid is sent into the precooler unit (14), cooled by cooling water at a plant service end and then enters the storage tank (17), the chemical liquid is sent into the evaporator unit II (18) through the liquid pumping unit (16), after cooling, the chemical liquid is divided into two paths, one path of the chemical liquid is sent to the liquid distributor unit through a certain pipeline and then divided into N branches, the chemical liquid is respectively sent into the N working chambers of the main equipment (200) after being heated by the liquid heating unit (9), the other path of the chemical liquid flows through the reheater unit II (21), and after heating adjustment, the chemical liquid is also sent into the N working chambers of the main equipment (200), and the whole cycle is completed.
3. An integrated precision constant temperature and humidity gas and liquid output device for semiconductor wafer glue spreading according to claim 2, wherein: the system intelligent control unit (102) is connected with the main equipment (200) through a communication cable, and the main equipment (200) controls the output device (100).
4. An integrated precise constant-temperature and constant-humidity gas-liquid output device for gluing semiconductor wafers as claimed in claim 2, wherein the output device comprises a series of temperature, humidity, pressure, flow and liquid level sensors as sensing devices, obtains signals, transmits the signals to a system intelligent control unit (102) through various A/D transmitters, performs logic judgment through a special control software program, sends feedback control signals to each unit, and drives each unit to change correspondingly, so that the temperature, humidity and flow of air and chemical liquid output by the output device (100) approach target values set by N working chambers of the main equipment (200).
5. An integrated precise constant temperature and humidity gas and liquid output device for semiconductor wafer gluing according to claim 2, wherein a system intelligent control unit (102) is provided to cool the output device (100) by cooling water at a plant end; the refrigeration compressors of the first refrigerator unit (5) and the second refrigerator unit (20) belong to the variable frequency compressors, and high-efficiency Freon refrigerants are selected.
6. An integrated precise constant-temperature constant-humidity gas-liquid output device for gluing semiconductor wafers as claimed in claim 2, wherein the first condenser unit (1) and the second condenser unit (12) adopt water-cooled condensers, and cooling water at a plant end is adopted for cooling and heat exchange; the first evaporator unit (4) adopts a fin-tube type heat exchanger, refrigerant flows in the tube, and cooled gas flows outside the tube; the second evaporator unit (18) and the third evaporator unit adopt plate heat exchangers, refrigerant flows on one side, and cooled chemical liquid flows on the other side; the first throttling unit (2) and the second throttling unit (13) adopt electronic expansion valves; the reheater unit I (6) heats the gas, a fin-tube type heat exchanger is adopted, refrigerant flows in the tube, and gas flows outside the tube; and a second reheater unit (21) heats the chemical liquid and adopts a plate heat exchanger.
7. An integrated precision constant temperature and humidity gas and liquid output device for semiconductor wafer coating according to claim 2,
the humidifying unit (7) humidifies the gas, and adopts a resistance heater to heat D.I. water at a plant end to generate steam to humidify the gas; the blower unit (11) conveys gas to the equipment end through a pipeline, and a variable frequency fan is adopted; the air volume adjusting unit (23) adjusts the air volume discharged to the equipment layer by the air volume adjusting valve to adjust the air volume conveyed to the equipment end, and adopts an electric air volume adjusting valve; the condensed water discharge unit (22) comprises a drainage pump, a water level sensor and a drainage pipeline, and is used for discharging condensed water generated when gas is cooled by the evaporator unit I (4) into a main drainage pipeline at a service end of the equipment layer through the drainage pump by virtue of the pipeline, and the process is pushed by an output signal of the water level sensor to automatically start and stop drainage;
the precooler unit (14) cools the chemical liquid passing through the precooler unit (14) and the cooling water of the plant service end, so that the parameter entering the output device (100) is maintained within a certain target value range, and the precision of the parameter state after the secondary treatment through the output device (100) is ensured, wherein the precooler unit (14) adopts a plate heat exchanger.
8. An integrated precision constant temperature and humidity gas and liquid output device for semiconductor wafer coating according to claim 2,
the chemical liquid is heated by a liquid heater unit, so that the temperature of each of N paths of chemical liquid reaches the temperature requirement of N working chambers at the end of the main equipment (200), the liquid heater unit adopts a resistance type pipeline heater, and N is not less than 4;
the air supply unit can manually adjust the air inlet volume, is provided with a filter which meets the requirements of the gas cleanliness and the chemical concentration of the equipment end, and adopts a replaceable filter;
the evaporator unit I (4) is cooled and dehumidified, and comprises a refrigerator unit I (5), a condenser unit I (1), an evaporator unit I (4) and a throttling unit I (2), so that a complete refrigerating system is formed, the evaporator unit I (4) is cooled and dehumidified to refrigerate and dehumidify gas flowing through, and the refrigerating system ensures that the temperature of the evaporator unit cannot be lower than zero, so that the surface of the evaporator unit is prevented from being frozen;
heating a reheater unit I (6), wherein heat is partially exhausted at high temperature from a refrigerator unit I (5), high-temperature refrigerant gas flows in the reheater pipe, the gas flowing out of the reheater pipe is heated, the temperature and the precision of the output gas are controlled, and the temperature precision is controlled to be +/-0.1 ℃;
the refrigerating system comprises a second refrigerator unit (20), a second condenser unit (12), a second evaporator unit (18), a third evaporator unit and a second throttling unit (13); and the second evaporator unit (18) and the third evaporator unit cool the chemical liquid flowing through.
9. An integrated precise constant-temperature and constant-humidity gas-liquid output device for semiconductor wafer gluing according to claim 2, wherein the chemical liquid is divided into two paths, one path of the chemical liquid is sent to the first liquid distributor unit (81) through a certain pipeline, each of the N paths is provided with a set of liquid heater unit for adjusting the temperature of the chemical liquid output by the path, and the adjusting signal is from the control program of the main equipment (200); the flow rate of the chemical liquid in each of the N paths is constant relative to the other path, and the flow rate value is smaller and is 10-20 l/S.
10. The integrated precise constant temperature and humidity gas and liquid output device for semiconductor wafer gluing according to claim 9, wherein the other path of the chemical liquid flows through a second reheater unit (21), after heating adjustment, the heat of the reheater comes from the exhaust gas of a second refrigerator unit (20) of the other path of the refrigeration system, the chemical liquid is sent into the N working chambers of the main equipment (200) in N paths through the second liquid distributor unit (82), and the flow rate of the chemical liquid is larger in each of the N paths, and the flow rate is 50l/S or more.
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