[go: up one dir, main page]

CN113652645A - A spin coating equipment - Google Patents

A spin coating equipment Download PDF

Info

Publication number
CN113652645A
CN113652645A CN202110897117.4A CN202110897117A CN113652645A CN 113652645 A CN113652645 A CN 113652645A CN 202110897117 A CN202110897117 A CN 202110897117A CN 113652645 A CN113652645 A CN 113652645A
Authority
CN
China
Prior art keywords
assembly
seal
workpiece
rotating shaft
reaction chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202110897117.4A
Other languages
Chinese (zh)
Other versions
CN113652645B (en
Inventor
侯永刚
王新征
龚炳建
周芸福
刘强
黎微明
李翔
周仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Leadmicro Nano Technology Co Ltd
Original Assignee
Jiangsu Leadmicro Nano Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Leadmicro Nano Technology Co Ltd filed Critical Jiangsu Leadmicro Nano Technology Co Ltd
Priority to CN202110897117.4A priority Critical patent/CN113652645B/en
Publication of CN113652645A publication Critical patent/CN113652645A/en
Application granted granted Critical
Publication of CN113652645B publication Critical patent/CN113652645B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50Substrate holders
    • C23C14/505Substrate holders for rotation of the substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本发明涉及一种旋转镀膜设备,包括:反应组件,包括反应腔体和进气盘,反应腔体具有反应腔,进气盘置于反应腔内,并用于向反应腔输送反应气体;调整组件,包括被构造为可受控移动的调整台;加热台,可转动地连接于调整台上,且位于反应腔内,加热台具有用于承载工件的承载位,且用于对承载于承载位上的工件进行加热;其中,调整台在受控移动的过程中能够带动承载位上的工件靠近或远离进气盘。上述旋转镀膜设备,通过工件在加热的同时也能够进行旋转,使得反应气体能够更加均匀地沉积在工件上。同时,工件与进气盘的距离还能够通过调整台进行调整,使得工件一直能够与进气盘保证一个适合反应的距离,工件沉积成膜的厚度均匀性更好。

Figure 202110897117

The invention relates to a spin coating equipment, comprising: a reaction component, including a reaction cavity and an air inlet plate, the reaction cavity body has a reaction cavity, the air inlet plate is placed in the reaction cavity, and is used for conveying reaction gas to the reaction cavity; an adjustment component , including an adjustment stage configured to be controlled to move; a heating stage, which is rotatably connected to the adjustment stage and located in the reaction chamber, the heating stage has a bearing position for carrying the workpiece, and is used for carrying the workpiece in the bearing position. The workpiece on the bearing position is heated; wherein, the adjustment table can drive the workpiece on the bearing position to approach or move away from the air intake plate during the controlled movement. In the above-mentioned spin coating equipment, the workpiece can also be rotated while being heated, so that the reaction gas can be deposited on the workpiece more uniformly. At the same time, the distance between the workpiece and the air inlet plate can also be adjusted through the adjustment table, so that the workpiece can always ensure a suitable reaction distance from the air inlet plate, and the thickness uniformity of the deposited film on the workpiece is better.

Figure 202110897117

Description

Rotary film coating equipment
Technical Field
The invention relates to the technical field of vapor deposition, in particular to rotary coating equipment.
Background
The PVD (Physical vapor Deposition) technique is a technique of vaporizing a solid or liquid surface material source into gaseous atoms, molecules or partially ionized ions by a Physical method under a vacuum condition, and depositing a thin film with a specific function on a wafer surface by a low-pressure gas (or plasma).
In the existing semiconductor coating equipment, reaction gas enters a cavity through an air inlet homogenizing disc and is uniformly sprayed on the surface of a wafer or flows through the surface of the wafer, so that a required film is formed through reaction deposition. Therefore, the uniformity of the thickness of the deposited film on the wafer is determined by the factors such as the uniformity of the gas inlet and the level of the wafer, which are difficult to adjust, so that the uniformity of the formed film is limited, and the uniformity with higher requirements is difficult to meet.
Disclosure of Invention
Therefore, it is necessary to provide a rotary coating apparatus for solving the problem of poor coating uniformity of the semiconductor coating apparatus.
A spin coating apparatus, comprising:
the reaction assembly comprises a reaction cavity and an air inlet disc, the reaction cavity is provided with a reaction cavity, and the air inlet disc is arranged in the reaction cavity and used for conveying reaction gas to the reaction cavity;
an adjustment assembly including an adjustment stage configured for controlled movement; and
the heating table is rotatably connected to the adjusting table and is positioned in the reaction cavity, and the heating table is provided with a bearing position for bearing a workpiece and is used for heating the workpiece borne on the bearing position;
the adjusting table can drive the workpiece on the bearing position to approach or depart from the air inlet disc in the controlled movement process.
In one embodiment, the adjusting assembly further includes a rotating shaft, one end of the rotating shaft is rotatably connected to the adjusting table, the reaction chamber has a through hole communicated with the reaction chamber, the other end of the rotating shaft penetrates into the reaction chamber through the through hole, and the heating table is connected to one end of the rotating shaft penetrating into the reaction chamber.
In one embodiment, the rotary film coating equipment further comprises a dynamic seal assembly, wherein the dynamic seal assembly is arranged between the adjusting table and the reaction cavity and is distributed around the rotating shaft so as to seal the through hole of the reaction cavity.
In one embodiment, the dynamic seal assembly comprises a rotary seal and a telescopic seal, the rotary seal is arranged on the adjusting table and is provided with a rotary hole for the rotary shaft to penetrate through, and a sealing medium is filled in the rotary hole; the telescopic sealing element is sleeved outside the rotating shaft and is telescopic along the moving direction of the adjusting platform, one end of the telescopic sealing element is arranged around the through hole and is connected with the reaction cavity in a sealing mode, and the other end of the telescopic sealing element is arranged around the rotating hole and is connected with the rotating sealing element in a sealing mode.
In one embodiment, the dynamic seal assembly further comprises a coolant line disposed on the rotary seal for cooling the sealing medium.
In one embodiment, the dynamic seal assembly further comprises a purge line disposed on the rotary seal, and the purge line is used for cleaning the sealing medium attached to the rotary shaft.
In one embodiment, the adjusting assembly further comprises a power source and a transmission assembly, both of which are mounted on the adjusting table, and the transmission assembly is in transmission connection between the power source and the rotating shaft.
In one embodiment, the transmission assembly includes a worm gear and a worm that are engaged with each other, the worm gear being mounted to the rotating shaft, and the worm being mounted to an output shaft of the power source.
In one embodiment, the transmission assembly includes a first bevel gear and a second bevel gear that are engaged with each other, the first bevel gear being mounted to the rotary shaft, and the second bevel gear being mounted to the output shaft of the power source.
The adjusting assembly further comprises an electric slip ring assembly arranged on the adjusting platform, the electric slip ring assembly comprises an electric slip ring, a rotor of the electric slip ring is relatively fixed with the rotating shaft, a stator of the electric slip ring is relatively fixed with the adjusting platform, a rotor wire harness of the electric slip ring is electrically connected with the heating platform, and a stator wire harness of the electric slip ring is used for being electrically connected with an external power supply
According to the rotary coating equipment, the wafer can be heated and rotated at the same time, so that the reaction gas can be more uniformly deposited on the wafer. Meanwhile, the distance between the wafer and the air inlet disc can be adjusted through the adjusting table, so that the wafer and the air inlet disc can always guarantee a proper reaction distance. Compared with the existing coating equipment, the thickness uniformity of the deposited film of the wafer is better.
Drawings
FIG. 1 is a schematic structural diagram of a spin coating apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an adjusting assembly of the rotary coating apparatus of FIG. 1;
FIG. 3 is a schematic structural diagram of the adjustment assembly of FIG. 2 in one embodiment;
fig. 4 is a schematic structural diagram of the adjustment assembly in fig. 2 in another embodiment.
The reaction assembly 10, the reaction cavity 11, the reaction cavity 12 and the air inlet disc 13; a through hole 14;
an adjusting assembly 20, an adjusting table 21, a rotating shaft 22; a power source 23; a worm gear 241; a worm 242; a first bevel gear 251; a second bevel gear 252; an electrical slip ring assembly 26; rotor harness 261, stator harness 262, electric slip ring 263, stator 264, rotor 265; a connecting rod 266; a housing 267; a lifting module 27;
a heating stage 30;
a dynamic seal assembly 40; a rotary seal 41; a spin hole 411, a sealing medium 412; a telescoping seal 42; a coolant line 43; purge line 44.
A workpiece 50.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Referring to fig. 1, an embodiment of the present invention provides a spin coating apparatus, including: a reaction module 10, a conditioning module 20, and a heating stage 30.
The reaction assembly 10 comprises a reaction chamber 11 and an air inlet disc 13, wherein the reaction chamber 11 is provided with a reaction chamber 12 which is used for coating reaction and is in a vacuum state. The gas inlet disc 13 is disposed in the reaction chamber 12 and connected to an external gas source to supply reaction gas for the coating reaction to the reaction chamber 12.
The heating stage 30 is disposed in the reaction chamber 12 and has a carrying position for carrying the workpiece 50. The heating plate can heat the workpiece 50 on the bearing position, so that the heated workpiece 50 and the reaction gas input by the gas inlet plate 13 perform a film coating reaction, and the film coating of the workpiece 50 is realized.
The adjustment assembly 20 includes an adjustment stage 21 configured for controlled movement, and the heating stage 30 is rotatably coupled to the adjustment stage 21 such that the heating stage 30 can both rotate relative to the adjustment stage 21 and move with the adjustment stage 21. The heating stage 30 can approach or move away from the air intake disc 13 during the movement of the adjusting stage 21, so that the workpiece 50 located at the loading position on the heating stage 30 can also approach or move away from the air intake disc 13.
In actual use, the workpiece 50 is placed on the bearing position, and the adjusting table 21 is controlled to move, so that the workpiece 50 on the bearing position gradually approaches the air inlet disc 13 until the air inlet disc 13 and the workpiece 50 are at a distance suitable for reaction deposition. Thereafter, the heating stage 30 heats the workpiece 50, and the gas inlet disk 13 injects the reaction gas so that the reaction gas reacts with the workpiece 50. When the reaction is carried out to a certain stage, the heating table 30 starts to rotate and drives the workpiece 50 on the bearing position to rotate, so that the reaction gas can uniformly contact with the surface of the workpiece 50, and the film formed on the surface of the workpiece 50 due to the coating reaction is ensured to be more uniform.
According to the rotary coating equipment, the workpiece 50 can be heated and rotated at the same time, so that the reaction gas can be more uniformly contacted with the workpiece 50, the coating reaction can be carried out, and a more uniform film can be formed on the surface of the workpiece 50. Meanwhile, the distance between the workpiece 50 and the air inlet disc 13 can be adjusted by the adjusting table 21, so that the workpiece 50 can always ensure a proper reaction distance with the air inlet disc 13. Compared with the existing coating equipment, the thickness uniformity of the deposited film of the workpiece 50 is better. Alternatively, the workpiece 50 may be a wafer to be coated.
In the embodiment of the present invention, the adjusting assembly 20 includes a rotating shaft 22, one end of the rotating shaft 22 is rotatably connected to the adjusting stage 21, and the other end of the rotating shaft 22 is connected to the heating stage 30, so that the adjusting stage 21 drives the heating stage 30 to move through the rotating shaft 22. Specifically, the adjusting stage 21 is located outside the reaction chamber 11, the reaction chamber 11 has a through hole 14 communicating with the reaction chamber 12, and the other end of the rotating shaft 22 penetrates into the reaction chamber 12 through the through hole 14 and is connected to the heating stage 30. Thus, the volume of the reaction chamber 12 can be reduced by disposing the adjustment stage 21 outside the reaction chamber 12. Optionally, the adjusting assembly 20 further includes a lifting module 27, and the adjusting table 21 is mounted at a driving end of the lifting module 27, so that the lifting module 27 drives the adjusting table 21 to move, so as to drive the workpiece 50 on the bearing position to move away from or close to the air intake disc 13 through the rotating shaft 22 and the heating table 30.
Since the reaction chamber 12 must be vacuum-sealed, gas leakage may occur at the position where the rotary shaft 22 passes through the reaction chamber 11, i.e., the through-hole 14. To this end, in some embodiments, the rotary film coating apparatus further includes a dynamic seal assembly 40, and the dynamic seal assembly 40 is disposed between the adjusting stage 21 and the reaction chamber 11 and is arranged around the rotating shaft 22 to seal the through hole 14 of the reaction chamber 11.
Since the movement of the rotary shaft 22 is complicated, including the movement together with the adjustment stage 21 and the rotation thereof, the dynamic seal assembly 40 includes a rotary seal 41 and a telescopic seal 42, and the seal of the reaction chamber 12 when the rotary shaft 22 rotates is ensured by the rotary seal 41, and the seal of the reaction chamber 12 when the rotary shaft 22 moves is ensured by the telescopic seal 42.
Specifically, referring to fig. 2 and 3, the rotary seal 41 is disposed on the adjustment table 21 and has a rotary hole 411, and the rotary shaft 22 is inserted into the rotary hole 411. The telescopic seal 42 is sleeved on the rotating shaft 22, is located between the rotating seal 41 and the telescopic seal 42, and is telescopic along the moving direction of the adjusting table 21. One end of the telescopic sealing member 42 is disposed around the penetrating hole 14 and is hermetically connected to the reaction chamber 11, and the other end of the telescopic sealing member 42 is disposed around the rotating hole 411 and is hermetically connected to the rotary sealing member 41. Since both ends of the telescopic seal member 42 are sealed, a sealed space is formed in the telescopic seal member 42, the sealed space encloses the rotary shaft 22 and the through-hole 14, and the through-hole 14 is sealed by the sealed space. Further, when the rotary shaft 22 moves, the stretchable seal member 42 is also stretched in accordance with the movement of the rotary shaft 22, and the reaction chamber 12 can be sealed even when the rotary shaft 22 moves.
Further, since the rotary shaft 22 is also rotated, a leakage may occur at a position where the rotary shaft 22 is rotated with respect to the rotary seal 41, that is, the rotary hole 411. In order to avoid this problem, a sealing medium 412 is filled in the rotation hole 411 to seal the rotation hole 411. That is, a rotary dynamic seal is formed with the rotary shaft 22 at the rotary hole 411 by the rotary seal 41, and a gap between a side wall of the rotary hole 411 and the rotary shaft 22 is filled with the sealing medium 412, so that the rotary shaft 22 can be sealed while rotating. In this way, the rotary seal 41 engages the telescopic seal 42, thereby sealing the through-hole 14 of the reaction chamber 11.
In one embodiment, the rotary seal 41 is a magnetic fluid seal, that is, the sealing medium 412 is a magnetic fluid, and the telescopic seal 42 is a bellows.
The temperature of the magnetic fluid sealing element can be increased in the using process, the solvent of the magnetic fluid can be evaporated due to overhigh temperature, and the magnetic strength of the magnetic nano-particles in the magnetic fluid can be reduced due to high temperature, so that the sealing effect is influenced. In specific embodiments, the dynamic seal assembly 40 further includes a coolant line 43 disposed on the rotary seal 41, and the coolant line 43 is used for cooling the sealing medium 412. It can be understood that the cooling water circulates in the cooling liquid pipeline 43, and the magnetic fluid is cooled by the cooling water, so that the working temperature of the magnetic fluid in the magnetic fluid sealing element is ensured, and the magnetic fluid is prevented from losing magnetism under a high-temperature state to influence the sealing effect.
Further, the dynamic seal assembly 40 further includes a purge line 44 disposed on the rotary seal 41, and the purge line 44 is used for cleaning the sealing medium 412 attached to the rotary shaft 22. The purge line 44 is tightly attached to the sidewall of the rotating hole 411 and is located at one end of the rotating hole 411 close to the reaction chamber 11. That is, the purge line 44 is close to the outlet of the rotary hole 411 so that the rotary shaft 22 can be purged at the outlet of the rotary hole 411 to clean the magnetic fluid attached to the rotary shaft 22.
In the embodiment of the present invention, the adjusting assembly 20 further includes a power source 23 and a transmission assembly, both of which are mounted on the adjusting table 21, and the transmission assembly is in transmission connection between the power source 23 and the rotating shaft 22. The power of the power source 23 is transmitted to the rotating shaft 22 through the transmission assembly, so as to drive the rotating shaft 22 to rotate, and the rotating shaft 22 drives the heating table 30 to rotate together.
Since an electrical slip ring 263 structure needs to be provided below the rotating shaft 22 to supply power to the heating stage 30, it is selected to place the power source 23 laterally, i.e., the output shaft of the power source 23 intersects the rotating shaft 22. The transmission assembly needs to convert the driving direction of the power source 23 into the rotating direction of the rotary shaft 22. In some embodiments, referring again to fig. 3, the transmission assembly includes a worm gear 241 and a worm 242 that are intermeshed, the worm gear 241 being mounted to the rotatable shaft 22 and the worm 242 being mounted to the output shaft of the power source 23. The driving direction of the side placement power source 23 is converted into the rotating direction of the rotating shaft 22 by the worm gear 241 and the worm 242.
In other embodiments, referring to fig. 4, the transmission assembly may also be a first bevel gear 251 and a second bevel gear 252 engaged with each other, the first bevel gear 251 being mounted on the rotating shaft 22, and the second bevel gear 252 being mounted on the output shaft of the power source 23. In this way, the driving direction of the lateral placement power source 23 can be converted into the rotation direction of the rotary shaft 22 by the bevel gear.
In the embodiment of the present invention, the adjusting assembly 20 further includes an electrical slip ring assembly 26 disposed on the adjusting table 21, the electrical slip ring assembly 26 includes an electrical slip ring 263, a rotor 265 of the electrical slip ring 263 is fixed relative to the rotating shaft 22, and a stator 264 of the electrical slip ring is fixed relative to the adjusting table 21. The heating stage 30 is electrically connected to a rotor beam 261 of an electrical slip ring 263, and a stator beam 262 of the electrical slip ring 263 is electrically connected to an external power source. Thus, when the rotating shaft 22 rotates, the stator 264 and the stator harness 262 on the stator 264 do not rotate along with the rotating shaft 22, the rotor 265 and the rotor harness 261 on the rotor 265 rotate along with the rotating shaft 22, and the rotor 265 is electrically connected to the stator 264 by a carbon brush or the like. At this time, the stator harness 262 transmits the electric power of the external power source to the rotor harness 261 on the rotor 265 through the stator 264 and the rotor 265, and the rotor harness 261 transmits the electric power to the heating stage.
Specifically, the electrical slip ring assembly 26 further includes a connecting rod 266, and the rotor 265 is connected to the rotating shaft 22 through the connecting rod 266 and rotates with the rotating shaft 22.
In particular embodiments, electrical slip ring assembly 26 further includes a protective housing, and connecting rod 266 and electrical slip ring 263 are disposed within the protective housing. The protective housing is connected to the housing 267 of the magnetic fluid seal, integrating the structure of the electrical slip ring 263 inside the magnetic fluid, and the rotor wire harness 261 passes from the inside of the rotating shaft 22 to be connected to the heating stage 30. Therefore, the wiring harness directly penetrates through the magnetic fluid sealing element, the wiring harness does not need to be sealed again, and the number of parts is greatly reduced.
The invention has the following advantages:
the workpiece 50 can be heated and rotated, so that the reaction gas can be more uniformly contacted with the workpiece 50, the coating reaction can be carried out, and a more uniform film can be formed on the surface of the workpiece 50. Meanwhile, the distance between the workpiece 50 and the air inlet disc 13 can be adjusted by the adjusting table 21, so that the workpiece 50 can always ensure a proper reaction distance with the air inlet disc 13. Compared with the existing coating equipment, the thickness uniformity of the deposited film of the workpiece 50 is better. Alternatively, the workpiece 50 may be a wafer to be coated.
One end of the telescopic sealing member 42 is disposed around the through hole 14 and is hermetically connected to the reaction chamber 11, and the other end of the telescopic sealing member 42 is disposed around the rotation hole 411 and is hermetically connected to the rotary sealing member 41, thereby forming a sealed space enclosing the rotation shaft 22 and the through hole 14. When the rotary shaft 22 moves, the telescopic seal 42 is also telescopically engaged with the movement of the rotary shaft 22, so that the reaction chamber 12 can be sealed even when the rotary shaft 22 moves.
A rotary dynamic seal is formed with the rotary shaft 22 at the rotary hole 411 by the rotary seal 41, and a gap between a side wall of the rotary hole 411 and the rotary shaft 22 is filled with a sealing medium 412, so that the rotary shaft 22 can be sealed while rotating. In this way, the rotary seal 41 engages the telescopic seal 42, thereby sealing the through-hole 14 of the reaction chamber 11.
The structure of the electrical slip ring 263 is integrated inside the magnetic fluid, and the rotor wire harness 261 passes through the inside of the rotating shaft 22 to be connected with the heating stage 30. Therefore, the wiring harness directly penetrates through the magnetic fluid sealing element, the wiring harness does not need to be sealed again, and the number of parts is greatly reduced.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1.一种旋转镀膜设备,其特征在于,所述旋转镀膜设备包括:1. A spin coating device, wherein the spin coating device comprises: 反应组件(10),包括反应腔体(11)和进气盘(13),所述反应腔体(11)具有反应腔(12),所述进气盘(13)设置于所述反应腔(12)内,并用于向所述反应腔(12)输送反应气体;A reaction assembly (10) includes a reaction chamber (11) and an air inlet disc (13), the reaction chamber (11) has a reaction chamber (12), and the air inlet disc (13) is arranged in the reaction chamber (12), and used for delivering reaction gas to the reaction chamber (12); 调整组件(20),包括被构造为可受控移动的调整台(21);及an adjustment assembly (20) comprising an adjustment stage (21) configured for controlled movement; and 加热台(30),可转动地连接于所述调整台(21)上,且位于所述反应腔(12)内,所述加热台(30)具有用于承载工件(50)的承载位,且用于对承载于所述承载位上的所述工件(50)进行加热;A heating table (30) is rotatably connected to the adjustment table (21) and is located in the reaction chamber (12), the heating table (30) has a bearing position for bearing the workpiece (50), And for heating the workpiece (50) carried on the bearing position; 其中,所述调整台(21)在受控移动的过程中能够带动所述承载位上的工件(50)靠近或远离所述进气盘(13)。Wherein, the adjustment table (21) can drive the workpiece (50) on the bearing position to approach or move away from the air intake plate (13) during the controlled movement. 2.根据权利要求1所述的旋转镀膜设备,其特征在于,所述调整组件(20)还包括旋转轴(22),所述旋转轴(22)的一端可转动地连接于所述调整台(21),所述反应腔体(11)具有与所述反应腔(12)连通的贯穿孔(14),所述旋转轴(22)的另一端通过所述贯穿孔(14)穿入至所述反应腔(12),所述加热台(30)连接于所述旋转轴(22)穿入至所述反应腔(12)的一端。2 . The spin coating equipment according to claim 1 , wherein the adjustment assembly ( 20 ) further comprises a rotating shaft ( 22 ), and one end of the rotating shaft ( 22 ) is rotatably connected to the adjustment stage. 3 . (21), the reaction chamber (11) has a through hole (14) communicating with the reaction chamber (12), and the other end of the rotating shaft (22) penetrates through the through hole (14) to the In the reaction chamber (12), the heating stage (30) is connected to one end of the rotating shaft (22) which penetrates into the reaction chamber (12). 3.根据权利要求2所述的旋转镀膜设备,其特征在于,所述旋转镀膜设备还包括动密封组件(40),所述动密封组件(40)设置于所述调整台(21)和所述反应腔体(11)之间,并围绕所述旋转轴(22)布设,以密封所述反应腔体(11)的所述贯穿孔(14)。3. The rotary coating device according to claim 2, characterized in that, the rotary coating device further comprises a dynamic seal assembly (40), and the dynamic seal assembly (40) is arranged on the adjustment table (21) and the between the reaction chambers (11) and around the rotation shaft (22) to seal the through holes (14) of the reaction chambers (11). 4.根据权利要求3所述的旋转镀膜设备,其特征在于,所述动密封组件(40)包括旋转密封件(41)和伸缩密封件(42),所述旋转密封件(41)设置于所述调整台(21),且具有供所述旋转轴(22)穿设的旋转孔(411),所述旋转孔(411)内填充有密封介质(412);所述伸缩密封件(42)套设于所述旋转轴(22)外,且沿所述调整台(21)的移动方向可伸缩,所述伸缩密封件(42)的一端围绕所述贯穿孔(14)布设,并密封连接于所述反应腔体(11),所述伸缩密封件(42)的另一端围绕所述旋转孔(411)布设,并密封连接于所述旋转密封件(41)。4. The rotary coating equipment according to claim 3, characterized in that, the dynamic seal assembly (40) comprises a rotary seal (41) and a telescopic seal (42), and the rotary seal (41) is arranged on the The adjustment table (21) has a rotation hole (411) through which the rotation shaft (22) passes, and the rotation hole (411) is filled with a sealing medium (412); the telescopic seal (42) ) is sleeved on the outside of the rotating shaft (22), and is retractable along the moving direction of the adjustment table (21). One end of the telescopic seal (42) is arranged around the through hole (14) and seals Connected to the reaction chamber (11), the other end of the telescopic seal (42) is arranged around the rotation hole (411), and is sealedly connected to the rotation seal (41). 5.根据权利要求4所述的旋转镀膜设备,其特征在于,所述动密封组件(40)还包括设置于所述旋转密封件(41)上的冷却液管路(43),所述冷却液管路(43)用于冷却所述密封介质(412)。5. The spin coating equipment according to claim 4, characterized in that, the dynamic seal assembly (40) further comprises a cooling liquid pipeline (43) arranged on the rotating seal (41), and the cooling The liquid line (43) is used to cool the sealing medium (412). 6.根据权利要求4所述的旋转镀膜设备,其特征在于,所述动密封组件(40)还包括设置于所述旋转密封件(41)上的吹扫管路(44),所述吹扫管路(44)用于清洁所述旋转轴(22)上附着的所述密封介质(412)。6 . The rotary coating equipment according to claim 4 , wherein the dynamic seal assembly ( 40 ) further comprises a purging pipeline ( 44 ) arranged on the rotary seal ( 41 ), the blowing The sweeping line (44) is used to clean the sealing medium (412) attached to the rotating shaft (22). 7.根据权利要求2所述的旋转镀膜设备,其特征在于,所述调整组件(20)还包括均安装于所述调整台(21)的动力源(23)和传动组件,所述传动组件传动连接于所述动力源(23)与所述旋转轴(22)之间。7. The spin coating device according to claim 2, characterized in that, the adjustment assembly (20) further comprises a power source (23) and a transmission assembly both mounted on the adjustment table (21), the transmission assembly The transmission is connected between the power source (23) and the rotating shaft (22). 8.根据权利要求7所述的旋转镀膜设备,其特征在于,所述传动组件包括相互啮合的蜗轮(241)和蜗杆(242),所述蜗轮(241)安装于所述旋转轴(22),所述蜗杆(242)安装于所述动力源(23)的输出轴。8. The spin coating device according to claim 7, characterized in that the transmission assembly comprises a worm gear (241) and a worm (242) that mesh with each other, and the worm gear (241) is mounted on the rotating shaft (22) , the worm (242) is mounted on the output shaft of the power source (23). 9.根据权利要求7所述的旋转镀膜设备,其特征在于,所述传动组件包括相互啮合的第一伞型齿轮(251)和第二伞型齿轮(252),所述第一伞型齿轮(251)安装于所述旋转轴(22),所述第二伞型齿轮(252)安装于所述动力源(23)的输出轴上。9. The spin coating device according to claim 7, wherein the transmission assembly comprises a first bevel gear (251) and a second bevel gear (252) that mesh with each other, the first bevel gear (251) is mounted on the rotating shaft (22), and the second bevel gear (252) is mounted on the output shaft of the power source (23). 10.根据权利要求2所述的旋转镀膜设备,其特征在于,所述调整组件(20)还包括设置在所述调整台(21)上的电滑环组件(26),所述电滑环组件(26)包括电滑环(263),所述电滑环(263)的转子(265)与所述旋转轴(22)相对固定,所述电滑环(263)的定子(264)与所述调整台(21)相对固定,所述电滑环(263)的转子线束(261)与所述加热台(30)电连接,所述电滑环(263)的定子线束(262)用于与外部电源电连接。10. The spin coating equipment according to claim 2, wherein the adjustment assembly (20) further comprises an electric slip ring assembly (26) arranged on the adjustment table (21), the electric slip ring The assembly (26) includes an electric slip ring (263), a rotor (265) of the electric slip ring (263) is relatively fixed to the rotating shaft (22), and a stator (264) of the electric slip ring (263) is connected to the rotating shaft (22). The adjustment table (21) is relatively fixed, the rotor wire harness (261) of the electric slip ring (263) is electrically connected to the heating table (30), and the stator wire harness (262) of the electric slip ring (263) is used for for electrical connection with an external power source.
CN202110897117.4A 2021-08-05 2021-08-05 Rotary film plating equipment Active CN113652645B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110897117.4A CN113652645B (en) 2021-08-05 2021-08-05 Rotary film plating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110897117.4A CN113652645B (en) 2021-08-05 2021-08-05 Rotary film plating equipment

Publications (2)

Publication Number Publication Date
CN113652645A true CN113652645A (en) 2021-11-16
CN113652645B CN113652645B (en) 2023-08-11

Family

ID=78478512

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110897117.4A Active CN113652645B (en) 2021-08-05 2021-08-05 Rotary film plating equipment

Country Status (1)

Country Link
CN (1) CN113652645B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115161612A (en) * 2022-06-18 2022-10-11 安徽纯源镀膜科技有限公司 Film coating objective table
CN115505896A (en) * 2022-10-11 2022-12-23 江苏鹏举半导体设备技术有限公司 Rotary inner wall film coating device
CN116336156A (en) * 2023-05-30 2023-06-27 上海陛通半导体能源科技股份有限公司 Ultrahigh vacuum rotating device

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61124569A (en) * 1984-11-20 1986-06-12 Matsushita Electric Ind Co Ltd Rotary substrate supporting device
US5356476A (en) * 1992-06-15 1994-10-18 Materials Research Corporation Semiconductor wafer processing method and apparatus with heat and gas flow control
US20040173972A1 (en) * 2003-03-06 2004-09-09 Zhixin Li Ferrofluid seal incorporating multiple types of ferrofluid
CN101689500A (en) * 2007-09-12 2010-03-31 东京毅力科创株式会社 Film forming apparatus and film forming method
US20100198550A1 (en) * 2009-01-30 2010-08-05 Ronald Vern Schauer Sensor system for semiconductor manufacturing apparatus
CN102808164A (en) * 2011-05-31 2012-12-05 北京北方微电子基地设备工艺研究中心有限责任公司 Cavity device and substrate process unit with same
CN107723683A (en) * 2017-10-16 2018-02-23 江苏鲁汶仪器有限公司 Chemical vapor deposition filming equipment
US20190390337A1 (en) * 2018-06-25 2019-12-26 Applied Materials, Inc. High temperature rotation module for a processing chamber
CN111364026A (en) * 2020-05-27 2020-07-03 上海陛通半导体能源科技股份有限公司 Reciprocating rotary CVD equipment and application method
CN113088933A (en) * 2020-12-14 2021-07-09 芯三代半导体科技(苏州)有限公司 Rotating device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61124569A (en) * 1984-11-20 1986-06-12 Matsushita Electric Ind Co Ltd Rotary substrate supporting device
US5356476A (en) * 1992-06-15 1994-10-18 Materials Research Corporation Semiconductor wafer processing method and apparatus with heat and gas flow control
US20040173972A1 (en) * 2003-03-06 2004-09-09 Zhixin Li Ferrofluid seal incorporating multiple types of ferrofluid
CN101689500A (en) * 2007-09-12 2010-03-31 东京毅力科创株式会社 Film forming apparatus and film forming method
US20100198550A1 (en) * 2009-01-30 2010-08-05 Ronald Vern Schauer Sensor system for semiconductor manufacturing apparatus
CN102808164A (en) * 2011-05-31 2012-12-05 北京北方微电子基地设备工艺研究中心有限责任公司 Cavity device and substrate process unit with same
CN107723683A (en) * 2017-10-16 2018-02-23 江苏鲁汶仪器有限公司 Chemical vapor deposition filming equipment
US20190390337A1 (en) * 2018-06-25 2019-12-26 Applied Materials, Inc. High temperature rotation module for a processing chamber
CN111364026A (en) * 2020-05-27 2020-07-03 上海陛通半导体能源科技股份有限公司 Reciprocating rotary CVD equipment and application method
CN113088933A (en) * 2020-12-14 2021-07-09 芯三代半导体科技(苏州)有限公司 Rotating device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115161612A (en) * 2022-06-18 2022-10-11 安徽纯源镀膜科技有限公司 Film coating objective table
CN115161612B (en) * 2022-06-18 2023-08-25 安徽纯源镀膜科技有限公司 Coating objective table
CN115505896A (en) * 2022-10-11 2022-12-23 江苏鹏举半导体设备技术有限公司 Rotary inner wall film coating device
CN116336156A (en) * 2023-05-30 2023-06-27 上海陛通半导体能源科技股份有限公司 Ultrahigh vacuum rotating device

Also Published As

Publication number Publication date
CN113652645B (en) 2023-08-11

Similar Documents

Publication Publication Date Title
CN113652645A (en) A spin coating equipment
KR102667399B1 (en) Cryogenically cooled rotatable electrostatic chuck
CN101194040B (en) Rotating substrate support and methods of use
TWI755329B (en) Reciprocating rotary cvd equipment and application method
KR101671158B1 (en) Cvd apparatus for improved film thickness non-uniformity and particle performance
TWI455243B (en) Substrate processing apparatus and method of manufacturing the same
JP6530755B2 (en) Rotatable heated electrostatic chuck
EP2058849A2 (en) Rotating temperature controlled substrate pedestal for film uniformity
JP6034830B2 (en) Planar end block supporting a rotatable sputtering target
KR20200105369A (en) Chemical vapor deposition equipment for coating thin film layer on power shape material
KR100608957B1 (en) Film deposition system and film deposition method using the same
CN112513322B (en) Film forming apparatus
CN109423629B (en) Workpiece driving device and vapor deposition furnace for one-time full-surface deposition of disc-like parts
CN109423627B (en) Disposable full-surface vapor deposition furnace for disc parts
JP4413567B2 (en) Film forming apparatus and film forming method
JPH06306600A (en) Powder coating device with cooling mechanism
JP2004047685A (en) Vacuum processing device and substrate holding device
US20240209508A1 (en) Deposition apparatus and processing method
KR20120140546A (en) Deposition apparatus
CN118854257A (en) Semiconductor process equipment
KR20250066849A (en) Substrate supporting unit and apparatus for treating substrate
KR20230039537A (en) Substrate processing apparatus
KR20240176068A (en) Substrate supporting apparatus and substrate processing appratus
CN116623287A (en) CVD film forming apparatus and CVD film forming method
JPH08158046A (en) Thin film forming device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP02 Change in the address of a patent holder
CP02 Change in the address of a patent holder

Address after: No. 27 Changjiang South Road, Xinwu District, Wuxi City, Jiangsu Province, China

Patentee after: Jiangsu micro nano technology Co.,Ltd.

Address before: 214000 No. 11 Lijiang Road, Xinwu District, Wuxi City, Jiangsu Province

Patentee before: Jiangsu micro nano technology Co.,Ltd.