CN113630963B - Methods for improving deformation of ultra-thin plates - Google Patents
Methods for improving deformation of ultra-thin plates Download PDFInfo
- Publication number
- CN113630963B CN113630963B CN202110771429.0A CN202110771429A CN113630963B CN 113630963 B CN113630963 B CN 113630963B CN 202110771429 A CN202110771429 A CN 202110771429A CN 113630963 B CN113630963 B CN 113630963B
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- CN
- China
- Prior art keywords
- horizontal copper
- thin
- thin core
- ultra
- filling electroplating
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Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 78
- 229910052802 copper Inorganic materials 0.000 claims abstract description 78
- 239000010949 copper Substances 0.000 claims abstract description 78
- 238000009713 electroplating Methods 0.000 claims abstract description 54
- 238000007747 plating Methods 0.000 claims abstract description 41
- 238000002360 preparation method Methods 0.000 claims description 23
- 238000005520 cutting process Methods 0.000 claims description 6
- 230000003749 cleanliness Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 4
- 230000008021 deposition Effects 0.000 abstract description 7
- 238000000151 deposition Methods 0.000 description 10
- 239000010410 layer Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a method for improving deformation of an ultra-thin plate, which comprises the steps of selecting a thin core plate and processing the thin core plate in place according to a required size; adjusting the clamping point position, the pulling force direction and the surface of the placing plate of the thin core plate in the horizontal copper plating flash plating to enable the single clamping hole and the small surface to face upwards in the horizontal copper plating flash plating; pulling the thin core plate along the first direction to perform copper deposition flash plating; adjusting the clamping point position, the pulling force direction and the surface of the placing plate of the thin core plate in primary horizontal copper filling electroplating to enable double holes and small surfaces to be upwards in primary horizontal copper filling electroplating; pulling the thin core plate along the first direction to perform primary horizontal copper filling electroplating; adjusting the clamping point position, the pulling force direction and the surface placing time of the thin core plate in the secondary horizontal copper filling electroplating, so that the single clamping hole and the small surface are upward in the secondary horizontal copper filling electroplating; and pulling the thin core plate along a second direction opposite to the first direction to perform secondary horizontal copper filling electroplating. The tension forces at the positions of the electroplating clamping points are complemented, so that the problem of pulling deformation of the thin core plate is solved.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a method for improving deformation of an ultrathin plate.
Background
Currently, circuit boards are classified into three major categories, single-sided boards, double-sided boards, and multi-layer circuit boards, if they are classified by the number of layers. The multi-layer board is a printed board having three or more conductive pattern layers laminated with insulating materials therebetween at a distance, and conductive patterns therebetween being interconnected as required. The multilayer circuit board is a product of electronic information technology which is developed in the directions of high speed, multifunction, large capacity, small volume, thin and light weight. The circuit board is classified into a Flexible Printed Circuit (FPC), a rigid Printed Circuit (PCB), and a flexible-rigid printed circuit (FPCB) according to characteristics.
However, the existing multilayer board has the following defects:
1. In the high-end multi-layer plate structure at the present stage, the middle core layer is designed to be thinner and thinner (the core thickness is 1.6mil-2.5 mil), the number of holes for laser drilling is up to 80-150 ten thousand holes, the thin plate after the laser drilling is required to be subjected to horizontal copper deposition flash plating LB, first horizontal copper filling electroplating CU18-1 and second horizontal copper filling electroplating CU18-2, and the thin core is subjected to multi-time horizontal electroplating line pulling, so that the plate is seriously deformed at the pulling position.
2. The risk of the plate deformation on the pattern blind hole is increased, the blind hole welding ring is enlarged by early test, the CFM windowing process is changed, and the defective rate of the pattern blind hole is higher by the test result, so that a process method for improving the deformation of the ultra-thin plate is required to be found.
Disclosure of Invention
In order to overcome the defects in the prior art, one of the purposes of the invention is to provide a method for improving the deformation of an ultrathin plate, which can solve the problem of serious plate deformation.
One of the purposes of the invention is realized by adopting the following technical scheme:
a method of improving deformation of an ultra-thin sheet, comprising the steps of:
a step of preparing cutting: selecting a thin core plate and processing the thin core plate into place according to the required size;
The preparation method comprises the following steps: adjusting the clamping point position, the pulling force direction and the surface of the placing plate of the thin core plate in the horizontal copper plating flash plating to enable the single clamping hole and the small surface to face upwards in the horizontal copper plating flash plating;
Copper deposition flash plating: pulling the thin core plate along the first direction to perform copper deposition flash plating;
And (3) a secondary preparation step: adjusting the clamping point position, the pulling force direction and the surface of the placing plate of the thin core plate in primary horizontal copper filling electroplating to enable double holes and small surfaces to be upwards in primary horizontal copper filling electroplating;
a primary horizontal copper filling electroplating step: pulling the thin core plate along the first direction to perform horizontal copper plating flash plating;
Three preparation steps: adjusting the clamping point position, the pulling force direction and the surface placing time of the thin core plate in the secondary horizontal copper filling electroplating, so that the single clamping hole and the small surface are upward in the secondary horizontal copper filling electroplating;
And (3) a secondary horizontal copper filling electroplating step: and pulling the thin core plate along a second direction opposite to the first direction to perform secondary horizontal copper filling electroplating.
Further, in the step of preparing for cutting, whether the dimension processing is in place or not is checked, if yes, the next step is executed, and if not, the reworking process is executed.
Further, in the step of preparing for blanking, the surface is cleaned after the processing is completed.
Further, in the step of preparing for cutting, whether the surface finish and the cleanliness of the thin core plate meet the requirements or not is checked, if yes, the next step is executed, and if not, reworking or scrapping is carried out.
Further, in the step of preparing for the blanking, a thin core plate having a thickness of 1.6 to 2.5mil is selected.
Further, in the one-time preparation step, whether the clamping part is a single hole or not and whether the small surface faces upwards or not in the horizontal copper plating flash plating is checked, if so, the next step is executed, and if not, the readjustment is carried out.
Further, in the secondary preparation step, whether the clamping holes are double holes or not and whether the facets are upward or not in the primary horizontal copper filling electroplating is checked, if yes, the next step is executed, and if not, the readjustment is performed.
Further, in the third preparation step, whether the clamping hole is a single hole or not and whether the small surface is upward or not in the secondary horizontal copper filling electroplating is checked, if yes, the next step is executed, and if not, the readjustment is performed.
Further, in the copper-depositing flash plating step, the thin core plate is pulled leftwards to perform copper-depositing flash plating.
Further, in the secondary horizontal copper filling electroplating step, the thin core plate is pulled rightward to perform secondary horizontal copper filling electroplating.
Compared with the prior art, the invention has the beneficial effects that:
Selecting a thin core plate and processing the thin core plate into place according to the required size; adjusting the clamping point position, the pulling force direction and the surface of the placing plate of the thin core plate in the horizontal copper plating flash plating to enable the single clamping hole and the small surface to face upwards in the horizontal copper plating flash plating; pulling the thin core plate along the first direction to perform copper deposition flash plating; adjusting the clamping point position, the pulling force direction and the surface of the placing plate of the thin core plate in primary horizontal copper filling electroplating to enable double holes and small surfaces to be upwards in primary horizontal copper filling electroplating; pulling the thin core plate along the first direction to perform primary horizontal copper filling electroplating; adjusting the clamping point position, the pulling force direction and the surface placing time of the thin core plate in the secondary horizontal copper filling electroplating, so that the single clamping hole and the small surface are upward in the secondary horizontal copper filling electroplating; and pulling the thin core plate along a second direction opposite to the first direction to perform secondary horizontal copper filling electroplating. The tension forces at the positions of the electroplating clamping points are complemented, so that the problem of pulling deformation of the thin core plate is solved. During electroplating, the travelling direction and the travelling times of the plate are regulated, the uniformity of the copper thickness of the plate surface is improved, the copper thickness distribution is consistent and has a strong rule, the grabbing of DES etching parameters is greatly assisted, and the etching yield is effectively improved.
The foregoing description is only an overview of the present invention, and is intended to be implemented in accordance with the teachings of the present invention, as well as the preferred embodiments thereof, together with the following detailed description of the invention, given by way of illustration only, together with the accompanying drawings.
Drawings
FIG. 1 is a flow chart of a preferred embodiment of a method for improving deformation of an ultra-thin sheet according to the present invention;
FIG. 2 is a schematic illustration of pinch point locations;
Fig. 3 is a stacked pattern of multi-layer boards.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and detailed description, wherein it is to be understood that, on the premise of no conflict, the following embodiments or technical features may be arbitrarily combined to form new embodiments.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, a method for improving deformation of an ultra-thin plate comprises the following steps:
a step of preparing cutting: selecting a thin core plate and processing the thin core plate into place according to the required size; preferably, in the step of preparing for cutting, it is checked whether the dimensional processing is in place, if so, the next step is executed, and if not, the reworking process is executed. And cleaning the surface after the machining is finished. And (5) checking whether the surface finish and the cleanliness of the thin core plate meet the requirements, if so, executing the next step, and if not, carrying out reworking or scrapping.
Preferably, in the step of preparing for blanking, a thin core sheet having a thickness of 1.6 to 2.5mil is selected.
The preparation method comprises the following steps: adjusting the clamping point position, the pulling force direction and the surface of the placing plate of the thin core plate in the horizontal copper plating flash plating to enable the single clamping hole and the small surface to face upwards in the horizontal copper plating flash plating; preferably, in the one-time preparation step, whether the clamping part is a single hole or not and whether the small surface faces upwards or not in the horizontal copper plating flash plating is checked, if so, the next step is executed, and if not, the readjustment is performed.
Copper deposition flash plating: pulling the thin core plate along the first direction to perform copper deposition flash plating;
And (3) a secondary preparation step: adjusting the clamping point position, the pulling force direction and the surface of the placing plate of the thin core plate in primary horizontal copper filling electroplating to enable double holes and small surfaces to be upwards in primary horizontal copper filling electroplating; preferably, in the secondary preparation step, it is checked whether the clamping hole is double hole or not and whether the facet faces upward or not in the primary horizontal copper filling electroplating, if so, the next step is executed, and if not, the readjustment is performed.
A primary horizontal copper filling electroplating step: pulling the thin core plate along the first direction to perform primary horizontal copper filling electroplating;
Three preparation steps: adjusting the clamping point position, the pulling force direction and the surface placing time of the thin core plate in the secondary horizontal copper filling electroplating, so that the single clamping hole and the small surface are upward in the secondary horizontal copper filling electroplating; preferably, in the third preparation step, it is checked whether the clamping hole is a single hole or not and whether the facet faces upward or not in the second horizontal copper filling electroplating, if so, the next step is executed, and if not, the readjustment is performed.
And (3) a secondary horizontal copper filling electroplating step: and pulling the thin core plate along a second direction opposite to the first direction to perform secondary horizontal copper filling electroplating. The tension forces at the positions of the electroplating clamping points are complemented, so that the problem of pulling deformation of the thin core plate is solved. During electroplating, the travelling direction and the travelling times of the plate are regulated, the uniformity of the copper thickness of the plate surface is improved, the copper thickness distribution is consistent and has a strong rule, the grabbing of DES etching parameters is greatly assisted, and the etching yield is effectively improved.
Specifically, when the pattern is transferred and exposed, the deformation of the thin core plate is small, and the problem of pattern blind hole breakage caused by plate deformation is reduced.
Specifically, in the copper-depositing flash plating step, the thin core plate is pulled leftwards to perform copper-depositing flash plating, i.e. the first direction is leftwards. In the secondary horizontal copper filling electroplating step, the thin core plate is pulled rightwards to carry out secondary horizontal copper filling electroplating, namely the second direction is rightwards. In the present application, the single hole is a single L hole, the double holes are double L holes, and please refer to fig. 2 specifically, which is a schematic diagram of the location of the clamping point in the present application. Referring to fig. 3, a stacked structure of the multi-layer board according to the present application is shown.
The above embodiments are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, but any insubstantial changes and substitutions made by those skilled in the art on the basis of the present invention are intended to be within the scope of the present invention as claimed.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110771429.0A CN113630963B (en) | 2021-07-08 | 2021-07-08 | Methods for improving deformation of ultra-thin plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110771429.0A CN113630963B (en) | 2021-07-08 | 2021-07-08 | Methods for improving deformation of ultra-thin plates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113630963A CN113630963A (en) | 2021-11-09 |
| CN113630963B true CN113630963B (en) | 2024-11-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110771429.0A Active CN113630963B (en) | 2021-07-08 | 2021-07-08 | Methods for improving deformation of ultra-thin plates |
Country Status (1)
| Country | Link |
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| CN (1) | CN113630963B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101270493A (en) * | 2007-03-23 | 2008-09-24 | 富士胶片株式会社 | Method and apparatus for producing conductive material |
| CN104603332A (en) * | 2012-09-05 | 2015-05-06 | 住友电气工业株式会社 | Aluminum plating apparatus and method for producing aluminum film using same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004353004A (en) * | 2003-05-27 | 2004-12-16 | Ebara Corp | Plating device |
| WO2017170510A1 (en) * | 2016-03-30 | 2017-10-05 | 株式会社ニコン | Plating method, plating device, and sensor device |
| CN112437558B (en) * | 2020-11-16 | 2022-05-17 | 淮安特创科技有限公司 | Blind hole electroplating hole filling method and circuit board |
| CN112492776B (en) * | 2020-12-21 | 2021-05-25 | 惠州市大亚湾科翔科技电路板有限公司 | Method for selective plating of inner blind holes of ultrathin plate |
-
2021
- 2021-07-08 CN CN202110771429.0A patent/CN113630963B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101270493A (en) * | 2007-03-23 | 2008-09-24 | 富士胶片株式会社 | Method and apparatus for producing conductive material |
| CN104603332A (en) * | 2012-09-05 | 2015-05-06 | 住友电气工业株式会社 | Aluminum plating apparatus and method for producing aluminum film using same |
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| Publication number | Publication date |
|---|---|
| CN113630963A (en) | 2021-11-09 |
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