CN113543600A - An incompletely filled staggered microchannel heat exchanger - Google Patents
An incompletely filled staggered microchannel heat exchanger Download PDFInfo
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- CN113543600A CN113543600A CN202110824408.0A CN202110824408A CN113543600A CN 113543600 A CN113543600 A CN 113543600A CN 202110824408 A CN202110824408 A CN 202110824408A CN 113543600 A CN113543600 A CN 113543600A
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- 238000001816 cooling Methods 0.000 claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 230000017525 heat dissipation Effects 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000002826 coolant Substances 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004377 microelectronic Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010364 biochemical engineering Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an incomplete filling staggered micro-channel heat exchanger which comprises a substrate part, wherein a cover plate part is fixedly and hermetically connected to the substrate part, one end of the cover plate part is provided with a cooling working medium inlet, the other end of the cover plate part is provided with a cooling working medium outlet, a plurality of fins are arranged in a micro-channel between the cover plate part and the substrate part in a staggered mode, and the height of each fin is smaller than that of the micro-channel. The incompletely-filled staggered micro-channel heat exchanger provided by the invention has the characteristics of small system pressure drop and high heat exchange efficiency, and can effectively reduce the temperature of equipment and ensure the safe operation of devices.
Description
Technical Field
The invention relates to the field of micro-channel heat exchange devices, in particular to an incomplete filling staggered micro-channel heat exchanger.
Background
In recent years, with the development of manufacturing technology, power electronic chips have been developed in an integrated, miniaturized, and high-frequency manner. For example, 3D-ICs (Three-dimensional stacked Integrated Circuits) are an advanced chip-on-chip packaging technology, which can achieve vertical interconnection between chips, making it possible to break through moore's law. In the 3D-IC, a processor, a memory, and a logic unit in a chip are connected Through a Through Silicon Via (TSV). This technique allows for the integration of a greater number of cores in the same area than conventional two-dimensional integrated circuits. However, the increase in the number of cores also brings about a serious problem of thermal reliability. One is that the working temperature of the chip is increased because the heating power of the unit area is increased, and the performance of the chip is reduced by 5% when the working temperature of the chip exceeds 70 ℃ and is increased by 1 ℃ per liter; secondly, due to the uneven power distribution, the integrated circuit generates local hot spots, which may cause thermal stress inside the chip, resulting in bending and deformation of the chip, and even causing serious problems such as chip cracking.
In the face of the huge heat flux density generated in such a narrow space, it is obvious that the conventional air cooling technology cannot meet the heat dissipation requirement. The current heat dissipation technologies mainly include several emerging heat dissipation technologies such as micro heat pipe cooling, jet impact cooling, spray cooling, thermoelectric cooling, carbon nanotube cooling, and microchannel cooling. Microchannels are favored by researchers because of their small size, high efficiency, low cost, and the like. At present, the micro-channel heat exchanger is considered to be an effective method for solving the heat dissipation problem of micro-devices in the fields of microelectronics, laser, biochemical engineering, aerospace, energy, electric power and the like.
The concept of microchannel heat exchange was proposed by Tuckerman and Pease in the last 80 th century and single phase heat exchange with water achieved 7.9MW/m2The heat dissipation density of (1). However, although the microchannel heat exchanger has a strong heat dissipation capability, the flow pressure drop of the microchannel heat exchanger is large due to the small flow cross section and the large flow velocity, which not only increases the power consumption, but also may even cause accidents due to the breakage of devices caused by the high pressure required for driving the working medium.
Disclosure of Invention
The invention aims to provide an incomplete filling staggered micro-channel heat exchanger, which is used for solving the problems in the prior art, has the characteristics of small system pressure drop and high heat exchange efficiency, and can effectively reduce the temperature of equipment and ensure the safe operation of devices.
In order to achieve the purpose, the invention provides the following scheme:
the invention provides an incomplete filling staggered micro-channel heat exchanger which comprises a substrate part, wherein a cover plate part is fixedly and hermetically connected to the substrate part, one end of the cover plate part is provided with a cooling working medium inlet, the other end of the cover plate part is provided with a cooling working medium outlet, a plurality of fins are arranged in a micro-channel between the cover plate part and the substrate part in a staggered mode, and the height of each fin is smaller than that of the micro-channel.
Optionally, the fins are upper fins and lower fins which are arranged in a vertically staggered manner, the upper fins are fixedly connected with the cover plate part, and the upper fins and the cover plate part are of an integrally formed structure; the lower rib is fixedly connected with the base plate part, and the lower rib and the base plate part can adopt an integrally formed structure.
Optionally, the substrate portion includes a substrate, the upper end surface of the substrate is fixedly provided with a plurality of lower fins, two sides of the substrate are symmetrically provided with two microchannel wall surfaces, the microchannel wall surfaces are perpendicular to the substrate, the height of the microchannel wall surfaces is greater than the height of the lower fins and the upper fins, and the sum of the heights of the upper fins and the lower fins is less than twice the height of the microchannel; and an inlet section and an outlet section which are communicated with the micro-channels are respectively arranged at two ends of the upper end surface of the substrate, and the inlet section and the outlet section are positioned between the two wall surfaces of the micro-channels and are perpendicular to the wall surfaces of the micro-channels.
Optionally, the cover plate portion includes a cover plate, the cover plate includes a top plate, a first side plate, a second side plate, a third side plate and a fourth side plate are fixedly and vertically arranged around the bottom of the top plate, the first side plate is provided with the cooling working medium inlet, the third side plate is provided with the cooling working medium outlet, and the inlet section is located at one end close to the cooling working medium inlet and is communicated with the cooling working medium inlet; the outlet section is positioned at one end close to the cooling working medium outlet and is communicated with the cooling working medium outlet; the bottom of the top plate is fixedly provided with a plurality of upper ribs.
Optionally, the substrate has a rectangular plate-shaped structure.
Optionally, the top plate is a rectangular plate-shaped structure.
Compared with the prior art, the invention has the following technical effects:
the invention adopts the fins which are not completely filled and arranged in a staggered way to strengthen the heat exchange performance; on one hand, when the cooling working medium exchanges heat with the base plate heated by the heating electronic element, if the fins in the microchannel heat exchanger are uniformly arranged, the thicknesses of a thermal boundary layer and a flow boundary layer of the microchannel heat exchanger are gradually increased along the flow direction, so that the heat exchange performance of the system is reduced. When the upper fins and the lower fins in the microchannel heat exchanger are arranged in a staggered manner, the thicknesses of a flow boundary layer and a thermal boundary layer can be reduced, and the heat exchange performance of the system is further enhanced; on the other hand, compared with the traditional complete filling design, the incomplete filling design increases the internal flow cross section area, and further reduces the system pressure drop. Therefore, the microchannel heat exchanger with the novel structure only needs less pumping work while dissipating the same heat. Therefore, the method has wide application prospect and great development potential, and the preliminary calculation result shows that: the pressure drop of the heat exchanger is reduced by 23.6 percent compared with the traditional micro-channel heat exchanger which is completely filled and uniformly distributed while the heat exchange capacity is ensured to be equal.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic partially exploded view of an incompletely filled staggered microchannel heat exchanger according to the present invention;
FIG. 2 is a partial front view of a base plate of the present invention;
FIG. 3 is a side view of a portion of a base plate of the present invention;
FIG. 4 is a partial top view of a substrate according to the present invention;
FIG. 5 is a front elevational view of a cover plate portion of the present invention;
FIG. 6 is a side view of a portion of the cover of the present invention;
FIG. 7 is a partial top plan view of the cover of the present invention;
wherein 100 is an incomplete filling staggered micro-channel heat exchanger, 110 is a substrate part, 120 is a cover plate part, 1 is a substrate, 2 is an inlet section, 3 is a lower fin, 4 is an outlet section, 5 is a heating electronic element, 6 is a cooling working medium inlet, 7 is a cover plate, 701 is a first side plate, 702 is a second side plate, 703 is a third side plate, 704 is a fourth side plate, 705 is a top plate, 8 is a cooling working medium outlet, 9 is an upper fin, and 10 is a micro-channel wall surface.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention aims to provide an incomplete filling staggered micro-channel heat exchanger, which is used for solving the problems in the prior art, has the characteristics of small system pressure drop and high heat exchange efficiency, and can effectively reduce the temperature of equipment and ensure the safe operation of devices.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
At present, the microchannel heat exchanger has a small flow cross section and a large flow velocity, so that the internal large flow resistance is caused, and further, a large system pressure drop is generated, and the safety of microelectronic equipment is seriously threatened. The microchannel heat exchangers proposed today, despite their high heat dissipation capacity, at the same time bring about a large pressure drop. And the structure of the micro-channel heat exchanger is further changed, so that the pressure drop can be reduced, and the high-efficiency heat exchange coefficient can be ensured. In order to continuously improve the performance of the micro-channel heat exchanger and reduce the pump work on the basis of the prior art and meet the requirement of equipment miniaturization, the invention provides the incompletely-filled staggered micro-channel heat exchanger.
Referring to fig. 1 to 7, the incompletely filled staggered microchannel heat exchanger 100 according to the present invention includes a substrate portion 110 and a cover portion 120, the substrate portion 110 is fixedly and hermetically connected with the cover portion 120, one end of the cover portion 120 is provided with a cooling medium inlet 6, the other end is provided with a cooling medium outlet 8, and a plurality of fins are staggered in a microchannel between the cover portion 120 and the substrate portion 110, and the height of the fins is smaller than the height of the microchannel.
Specifically, the fins are upper fins 9 and lower fins 3 which are staggered up and down, the upper fins 9 are fixedly connected with the cover plate portion 120, in this embodiment, the upper fins 9 and the cover plate portion 120 are integrally formed, the lower fins 3 are fixedly connected with the base plate 110, and the lower fins 3 and the base plate 110 are also integrally formed. The substrate part 110 comprises a substrate 1 with a rectangular plate-shaped structure, a plurality of lower fins 3 are fixedly arranged on the upper end face of the substrate 1, two microchannel wall surfaces 10 are symmetrically arranged on two sides of the substrate 1, the microchannel wall surfaces 10 are perpendicular to the substrate 1, the height of the microchannel wall surface 10 is greater than that of the lower fins 3 and the upper fins 9, and the sum of the heights of the upper fins and the lower fins is less than twice of the height of the microchannel; the two ends of the upper end surface of the substrate 1 are respectively provided with an inlet section 2 and an outlet section 4 which are communicated with the micro-channel, and the inlet section 2 and the outlet section 4 are positioned between the two micro-channel wall surfaces 10 and are arranged perpendicular to the micro-channel wall surfaces 10. The cover plate part 120 comprises a cover plate 7 with a rectangular plate-shaped structure, the cover plate 7 comprises a top plate 705, a first side plate 701, a second side plate 702, a third side plate 703 and a fourth side plate 704 are fixedly and vertically arranged on the periphery of the bottom of the top plate 705, the first side plate 701 is provided with a cooling working medium inlet 6, the third side plate 703 is provided with a cooling working medium outlet 8, and the inlet section 2 is positioned at one end close to the cooling working medium inlet 6 and is communicated with the cooling working medium inlet 6; the outlet section 4 is positioned at one end close to the cooling working medium outlet 8 and is communicated with the cooling working medium outlet 8; the bottom of the top plate 705 is fixedly provided with a plurality of upper ribs 9. The cooling medium inlet 6 and the cooling medium outlet 8 are located on the same virtual horizontal centre line, and the virtual horizontal centre line is located between the top plate 705 and the base plate 1.
The invention optimizes the flow and heat transfer characteristics of the microchannel heat exchanger by changing the internal structure of the microchannel heat exchanger, adopts deionized water as a cooling working medium, and the flow direction of the cooling working medium is shown by a white large arrow in figure 1. Cooling working medium flows into the inlet section 3 of the base plate 1 from the cooling working medium inlet 6 of the cover plate 7 through other devices to be divided, and flows into the outlet section 4 of the base plate 1 after passing through the lower fins 3 of the base plate 1 and the upper fins 9 of the cover plate 7, the cooling working medium exchanges heat with the heating electronic element 5 in the microchannel between the cover plate 7 and the base plate 1 during the period, so that the heat dissipation function is realized, and the cooling working medium after heat exchange flows into other cooling devices through the cooling working medium outlet 8 of the cover plate 7 to be cooled; then flows in through other devices through a cooling working medium inlet 6 of a cover plate 7, and the circulation is carried out.
With the accompanying interpretation of terms: the 3D-IC is formed by stacking and integrating electronic components such as a chip and a memory among different layers in a vertical direction, and connecting leads of different components by using a Through Silicon Vias (TSV) technology, so that the overall wiring amount of the chip can be reduced, the power consumption of the chip can be reduced, the chip can have a highly parallel interface, the overall packaging area of the chip can be reduced, the cost can be reduced, and the chip has higher working performance.
Through Silicon Vias (TSV) refer to an interconnection technique that punches holes in a Silicon wafer and fills the Silicon wafer with a connection material.
Moore's law is an empirical conversation of gorden-moore, one of the intel founders, and its core contents are: the number of transistors that can be accommodated on an integrated circuit doubles approximately every 18 months. In other words, the performance of the processor doubles every two years.
The pressure drop due to energy loss when the fluid flows in the pipe. This energy loss is caused by the fluid's interaction and exchange of momentum between the fluid particles as it flows against internal friction and as it overcomes turbulence, as indicated by the pressure difference, i.e. pressure drop, occurring before and after the fluid flow.
In the description of the present invention, it should be noted that the terms "center", "top", "bottom", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The principle and the implementation mode of the invention are explained by applying a specific example, and the description of the embodiment is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (6)
1. An incomplete filling staggered micro-channel heat exchanger is characterized in that: the cooling device comprises a base plate part, wherein a cover plate part is fixedly and hermetically connected to the base plate part, one end of the cover plate part is provided with a cooling working medium inlet, the other end of the cover plate part is provided with a cooling working medium outlet, a plurality of fins are arranged in a micro-channel between the cover plate part and the base plate part in a staggered mode, and the height of each fin is smaller than that of the micro-channel.
2. The incomplete fill staggered microchannel heat exchanger of claim 1, wherein: the fins are upper fins and lower fins which are arranged in a vertically staggered mode, the upper fins are fixedly connected with the cover plate part, and the lower fins are fixedly connected with the base plate part.
3. The incomplete fill staggered microchannel heat exchanger of claim 2, wherein: the base plate part comprises a base plate, a plurality of lower fins are fixedly arranged on the upper end face of the base plate, two microchannel wall surfaces are symmetrically arranged on two sides of the base plate, the microchannel wall surfaces are perpendicular to the base plate, the height of each microchannel wall surface is greater than that of each lower fin and each upper fin, and the sum of the heights of the upper fins and the lower fins is less than twice of the height of each microchannel; and an inlet section and an outlet section which are communicated with the micro-channels are respectively arranged at two ends of the upper end surface of the substrate, and the inlet section and the outlet section are positioned between the two wall surfaces of the micro-channels and are perpendicular to the wall surfaces of the micro-channels.
4. The incomplete fill staggered microchannel heat exchanger of claim 3, wherein: the cover plate part comprises a cover plate, the cover plate comprises a top plate, a first side plate, a second side plate, a third side plate and a fourth side plate are fixedly and vertically arranged on the periphery of the bottom of the top plate, the first side plate is provided with a cooling working medium inlet, the third side plate is provided with a cooling working medium outlet, and the inlet section is positioned at one end close to the cooling working medium inlet and is communicated with the cooling working medium inlet; the outlet section is positioned at one end close to the cooling working medium outlet and is communicated with the cooling working medium outlet; the bottom of the top plate is fixedly provided with a plurality of upper ribs.
5. The incomplete fill staggered microchannel heat exchanger of claim 3, wherein: the substrate is of a rectangular plate-shaped structure.
6. The incomplete fill staggered microchannel heat exchanger of claim 4, wherein: the top plate is of a rectangular plate-shaped structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110824408.0A CN113543600A (en) | 2021-07-21 | 2021-07-21 | An incompletely filled staggered microchannel heat exchanger |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110824408.0A CN113543600A (en) | 2021-07-21 | 2021-07-21 | An incompletely filled staggered microchannel heat exchanger |
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| CN113543600A true CN113543600A (en) | 2021-10-22 |
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| CN202110824408.0A Pending CN113543600A (en) | 2021-07-21 | 2021-07-21 | An incompletely filled staggered microchannel heat exchanger |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115050711A (en) * | 2022-08-15 | 2022-09-13 | 东莞市湃泊科技有限公司 | Heat dissipation substrate based on micro-channel |
| CN115551303A (en) * | 2022-09-28 | 2022-12-30 | 华中科技大学 | Rib matrix microchannel heat sink with top gap |
| US12120851B2 (en) | 2022-04-20 | 2024-10-15 | Microsoft Technology Licensing, Llc | 3-D structured two-phase cooling boilers with nano structured boiling enhancement coating |
| US12189441B2 (en) | 2022-04-20 | 2025-01-07 | Microsoft Technology Licensing, Llc | 3-D structured two-phase microfluidic cooling with nano structured boiling enhancement coating |
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Application publication date: 20211022 |
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