CN113471714A - Ultra-wideband fractal medium resonance wave absorber based on 3D printing and method - Google Patents
Ultra-wideband fractal medium resonance wave absorber based on 3D printing and method Download PDFInfo
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- CN113471714A CN113471714A CN202110820863.3A CN202110820863A CN113471714A CN 113471714 A CN113471714 A CN 113471714A CN 202110820863 A CN202110820863 A CN 202110820863A CN 113471714 A CN113471714 A CN 113471714A
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- 239000006096 absorbing agent Substances 0.000 title claims abstract description 83
- 238000010146 3D printing Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 8
- 238000010521 absorption reaction Methods 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 5
- 230000010287 polarization Effects 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000007639 printing Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 33
- 238000012360 testing method Methods 0.000 description 9
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- 238000005516 engineering process Methods 0.000 description 3
- 239000000976 ink Substances 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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- 239000006260 foam Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000003306 harvesting Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
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- 238000012545 processing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
- H01Q17/007—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems with means for controlling the absorption
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses an ultra wide band fractal medium resonance wave absorber based on 3D printing and a method thereof, which is characterized by comprising the following steps: the dielectric resonator comprises a top dielectric resonant structure, a middle dielectric substrate and a bottom structure; the dielectric resonance structure is in array arrangement of a cube fractal structure; the bottom layer structure is fixed on the lower surface of the middle medium substrate. The manufacturing method of the wave absorber comprises the following steps: the 3D integral printing medium resonance structure and the intermediate medium substrate adopt copper film covering. The wave absorber utilizes a basic mode, a high-order mode and a grating mode of a medium resonance structure, the absorption rate exceeds 90% in an ultra-wide working frequency band, and the wave absorber has high absorption rate at a large incident angle. The invention has simple structure, low cost, wide working wave band and wide angle performance, and can be applied to electromagnetic interference, electromagnetic energy collection, low-cost darkrooms and the like.
Description
Technical Field
The invention relates to the technical field of microwaves, in particular to an ultra wide band fractal medium resonance wave absorber based on 3D printing and a method.
Background
Electromagnetic wave absorbers can effectively absorb incident electromagnetic waves under working frequency, and have been widely paid attention to in academia and industry for a long time. The wave absorber is mainly applied to military defense systems, along with the development of electromagnetic technology, the electromagnetic wave absorber is applied to the technical field of civil use, such as energy harvesting, electromagnetic shielding, biosensors and the like, and part of the electromagnetic wave absorber is also used for solving the problem of electromagnetic radiation pollution. With the demands of low profile, simple manufacturing process, light weight and low cost, broadband absorbers have been extensively studied in microwave systems. In recent years, planar super-surfaces, materials with refractive indices close to zero, emerging graphene, pseudo surface plasmons, and water have also been introduced into the design of low-cost wave absorbers with broad frequency bands.
The prior art discloses an ultra wide band electromagnetic wave absorber using an interlayer broadband super surface, which comprises: high and low frequency super surface, two layers of medium plate; the high-frequency super surface is arranged on the top layer of the upper-layer dielectric substrate, and the low-frequency super surface is arranged on the top layer of the lower dielectric plate. Four high frequency elements are loaded onto one low frequency element with an air gap interposed between the two super-surfaces. The bottom layer is completely covered with copper to block the transmitted electromagnetic waves. The high and low frequency super-surface is realized by a circular sector pattern periodic array with chip resistors. The electromagnetic wave absorber realizes broadband wave absorption through a relatively thin structure.
The prior art discloses a broadband polarization insensitive multilayer microwave absorber for resistive ink. The wave absorber comprises three loss layers, an air layer and a bottom metal layer, wherein the loss layers are composed of different resistance patterns which are periodically arranged, and the patterns are printed on an FR4 thin plate by resistance ink. Periodic resistive inks with specific structures can provide good absorption. The air layer is provided with foam for isolation, and the air isolation function is achieved. The absorber can achieve broadband absorption over a large frequency range by controlling the parameters of the resistive conductive top surface when the susceptance of the grounded dielectric substrate cancels the susceptance of the top surface.
Disclosure of Invention
The invention provides a 3D printing-based ultra-wide band fractal medium resonance wave absorber with low cost, ultra-wide working wave band and wide angle performance and a method thereof, so that the absorption rate in the ultra-wide working wave band exceeds 90%, and the absorber has high absorption rate at large incidence angle under different incidence angles.
In order to achieve the purpose, the technical scheme of the invention is as follows: an ultra wide band fractal medium resonance wave absorber based on 3D printing is characterized in that: at least comprises the following steps: the dielectric resonator comprises a dielectric resonance structure (1), a dielectric substrate (2) and a bottom layer structure (3), wherein the dielectric substrate (2) and the bottom layer structure (3) are parallel to each other and are arranged in an up-down laminated manner; the dielectric resonance structure (1) forms a wave absorber on the upper layers of the dielectric substrate (2) and the bottom layer structure (3);
medium resonance structure (1) constitute by four little square posts that the size is the same and the connector between, four little square posts that the size is the same are according to left and right, upper and lower equidistant forward distribution, intermediate junction body is a square body that is greater than little square post size, intermediate junction body links into an organic whole with four little square body 90 degrees interior angles that the size is the same, make four interior angles of square body merge into four little square body 90 degrees interior angles that the size is the same, make little square post and connector between form integrative symmetrical structure.
The lower surface of the dielectric substrate (2) is arranged on the upper layer of the bottom layer structure (3), and the size and the shape of the bottom layer structure (3) are the same as those of the dielectric substrate (2).
The bottom layer structure (3) is a copper coating.
The sizes of the four small square columns with the same size are 7.3mm multiplied by 7.3 mm.
The size of the middle connector is 16.6mm multiplied by 16.6 mm.
The height of the dielectric resonance structure (1) is 8.48 mm.
The dielectric substrate (2) is 2.86mm high, and the bottom layer structure (3) is copper foil with the thickness of about 0.1 mm.
The dielectric resonance structures (1) are arranged on the dielectric substrate (2) in an array mode, the period is 8 x 8, the dielectric resonance structures are printed into an integral structure through 3D, and the relative dielectric constant is 10.7.
The wave absorber has a symmetrical shape, the absorption coefficient is irrelevant to the polarization angle of incident waves, the wave absorber resonates in a DR mode under the lower frequency of normal incidence, and the wave absorber has three absorption peaks corresponding to two basic magnetic dipole modes and a high-order magnetic dipole mode. In a higher frequency band, the grating mode of the resonator can be excited to generate two absorption peaks, so that the absorption rate exceeds 90% in an ultra-wide working frequency band of 3.1-14.7 GHz.
An ultra-wideband fractal medium resonance wave absorber method based on 3D printing is characterized by comprising the following steps: at least comprises the following steps: the dielectric resonator comprises a dielectric resonance structure (1), a dielectric substrate (2) and a bottom layer structure (3), wherein the dielectric substrate (2) and the bottom layer structure (3) are parallel to each other and are arranged in an up-down laminated manner; the dielectric resonance structure (1) forms a wave absorber on the upper layers of the dielectric substrate (2) and the bottom layer structure (3);
the medium resonance structure (1) is composed of four small square columns with the same size and connectors between the four small square columns, the four small square columns with the same size are distributed in the forward direction at equal intervals from left to right, up to down, and the middle connector is a square body larger than the small square columns in size, the middle connector connects 90-degree inner angles of the four small square bodies with the same size into a whole, the four inner angles of the square body are fused into the 90-degree inner angles of the four small square bodies with the same size, and the small square columns and the connectors between the small square columns form an integral symmetrical structure; adjusting the length of the gap of the wave absorber unit to adjust the two absorption peaks after adjusting the length of the gap of the wave absorber unit by adjusting the two absorption peaks before and after the wave absorber unit is adjusted in the frequency band; adjusting a third absorption peak in the frequency band by adjusting the height of the wave absorber unit; the bandwidth of the wave absorber is changed by adjusting the length, the height and the gap of the wave absorber unit.
The front two absorption peaks and the rear two absorption peaks in the frequency band are adjusted by adjusting the length of the wave absorber unit, and the rear two absorption peaks are adjusted by adjusting the gap length of the wave absorber unit; adjusting a third absorption peak in the frequency band by adjusting the height of the wave absorber unit; the bandwidth of the wave absorber is changed by adjusting the length, the height and the gap of the wave absorber unit.
The invention has the following advantages:
the wave absorber is made of carbon-loaded acrylonitrile-butadiene-styrene (ABS) polymer and is manufactured by adopting a 3D printing technology based on fused deposition modeling. By simultaneously exciting the fundamental mode, the high-order mode and the grating mode of the dielectric resonance structure, the absorption rate exceeds 90% in an ultra-wide working frequency band of 3.1-14.7 GHz. The absorber has high absorption rate under different incidence angles when the incidence angle is large, and has the advantages of low cost, ultra-wide working wave band, wide-angle performance and the like.
Drawings
The invention is further illustrated by the following examples and figures:
fig. 1 is a left side view of a wave absorber unit provided in embodiment 1 of the present invention;
FIG. 2 is a top plan view of a wave absorber unit provided in an embodiment of the present invention;
FIG. 3 is a top view of a top layer of the wave absorber provided in the embodiments of the present invention;
FIG. 4 is a diagram of S parameters of a wave absorber according to an embodiment of the present invention;
fig. 5 is an absorption rate diagram of a wave absorber provided in an embodiment of the present invention. (ii) a
FIG. 6 is a diagram of a transverse electric mode oblique incidence spectrum of the wave absorber according to the embodiment of the present invention;
FIG. 7 is a diagram of an oblique incident spectrum of a transverse magnetic mode of the wave absorber according to the embodiment of the present invention;
fig. 8 is a diagram of incident spectra of electromagnetic waves with different polarizations of the wave absorber provided in the embodiment of the present invention.
In the figure: 1. a dielectric resonant structure; 2. a dielectric substrate; 3. and (5) a bottom layer structure.
Detailed Description
The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
Examples
Example 1
As shown in fig. 1 and fig. 2, an ultra-wideband fractal medium resonance wave absorber based on 3D printing is characterized in that: at least comprises the following steps: the dielectric resonator comprises a dielectric resonance structure 1, a dielectric substrate 2 and a bottom layer structure 3, wherein the dielectric substrate 2 and the bottom layer structure 3 are parallel to each other and are arranged in an up-down laminated manner; the dielectric resonance structure 1 forms a wave absorber on the upper layers of the dielectric substrate 2 and the bottom layer structure 3;
The lower surface of the dielectric substrate 2 is arranged on the upper layer of the bottom structure 3, and the size and the shape of the bottom structure 3 are the same as those of the dielectric substrate 2.
The bottom layer structure 3 is a copper coating.
The sizes of the four small square columns with the same size are 7.3mm multiplied by 7.3 mm.
The size of the middle connector is 16.6mm multiplied by 16.6 mm.
The dielectric resonant structure is 8.48mm high.
The height of the dielectric substrate 2 is 2.86 mm.
The bottom layer structure 3 is a copper foil with the thickness of about 0.1 mm.
As shown in fig. 3, the dielectric resonant structures 1 are arranged in an array on the dielectric substrate 2, the period is 8 × 8, and the dielectric resonant structures are printed by 3D to form an integral structure, and the relative dielectric constant is 10.7.
The areas of the dielectric substrate 2 and the bottom layer structure 3 are 268mm by 268mm2。
The wave absorbing device has a symmetrical shape, and the absorption coefficient is irrelevant to the polarization angle of incident waves. Under normal incidence, the wave absorber resonates in a DR mode at a lower frequency, and has three absorption peaks corresponding to two basic magnetic dipole modes and a high-order magnetic dipole mode. In a higher frequency band, the grating mode of the resonator can be excited to generate two absorption peaks, so that the absorption rate exceeds 90% in an ultra-wide working frequency band of 3.1-14.7 GHz.
Example 2
The invention adjusts the front two absorption peaks and the back two absorption peaks in the frequency band by adjusting the length of the wave absorber unit, and adjusts the back two absorption peaks by adjusting the gap length of the wave absorber unit.
Example 3
The invention adjusts the third absorption peak in the frequency band by adjusting the height of the wave absorber unit.
Example 4
The invention changes the bandwidth of the wave absorber by adjusting the length, height and clearance of the wave absorber unit.
Example 5
The present invention forms further embodiments by combining examples 1-4.
The selection of the specific size is only selected in the embodiment of the present invention, and for those skilled in the art, the size of each part can be appropriately adjusted according to actual needs.
In example 1, the reflection coefficient simulation and test results are shown in fig. 4, and the test results show that the wave absorber has a bandwidth of 130% (3.1-14.7 GHz) at-10-dB, which indicates that the wave absorber realizes broadband operation.
The absorption spectrum simulation and test results of the embodiment are shown in fig. 5, and the test results show that the wave absorber has an absorption rate of over 90% and a bandwidth of 130% (3.1-14.7 GHz), which indicates that the wave absorber realizes broadband operation.
The test results of the oblique incidence angles of different Transverse Electric (TE) modes of the embodiment are shown in fig. 6, and the test results show that the absorption rate does not change greatly at a small angle, the absorption rate at a large angle is reduced, but the total absorption rate is over 80%, which shows that the wave absorber realizes a wide-angle characteristic.
The test results of the oblique incidence angles of different Transverse Magnetic (TM) modes of the embodiment are shown in fig. 7, and the test results show that the absorption rate is reduced at low frequency, increased at higher frequency, and the total absorption rate is more than 80%, which indicates that the wave absorber realizes wide-angle characteristics.
The test results of different polarization incident angles of the embodiment are shown in fig. 8, the wave absorbing device has a symmetrical shape, and the absorption coefficient is irrelevant to the polarization angle of the incident wave, which shows that the wave absorbing device realizes stable characteristics.
Compared with the prior art, the invention has the advantages of simple structure, easy processing and low cost, and has the characteristics of ultra-wide working wave band, covering the whole c wave band (4-8ghz) and x wave band (8-12ghz) and wide angle. Therefore, the method has wide application prospect in the fields of microwave measurement, stealth technology, energy collection and the like.
Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (10)
1. An ultra wide band fractal medium resonance wave absorber based on 3D printing is characterized in that: at least comprises the following steps: the dielectric resonator comprises a dielectric resonance structure (1), a dielectric substrate (2) and a bottom layer structure (3), wherein the dielectric substrate (2) and the bottom layer structure (3) are parallel to each other and are arranged in an up-down laminated manner; the dielectric resonance structure (1) forms a wave absorber on the upper layers of the dielectric substrate (2) and the bottom layer structure (3);
medium resonance structure (1) constitute by four little square posts that the size is the same and the connector between, four little square posts that the size is the same are according to left and right, upper and lower equidistant forward distribution, intermediate junction body is a square body that is greater than little square post size, intermediate junction body links into an organic whole with four little square body 90 degrees interior angles that the size is the same, make four interior angles of square body merge into four little square body 90 degrees interior angles that the size is the same, make little square post and connector between form integrative symmetrical structure.
2. The ultra-wideband fractal medium resonance wave absorber based on 3D printing as claimed in claim 1, wherein: the lower surface of the dielectric substrate (2) is arranged on the upper layer of the bottom layer structure (3), and the size and the shape of the bottom layer structure (3) are the same as those of the dielectric substrate (2).
3. The ultra-wideband fractal medium resonance wave absorber based on 3D printing as claimed in claim 1, wherein: the bottom layer structure (3) is a copper coating.
4. The ultra-wideband fractal medium resonance wave absorber based on 3D printing as claimed in claim 1, wherein: the sizes of the four small square columns with the same size are 7.3mm multiplied by 7.3 mm.
5. The ultra-wideband fractal medium resonance wave absorber based on 3D printing as claimed in claim 1, wherein: the size of the middle connector is 16.6mm multiplied by 16.6 mm.
6. The ultra-wideband fractal medium resonance wave absorber based on 3D printing as claimed in claim 1, wherein: the height of the dielectric resonance structure (1) is 8.48 mm.
7. The ultra-wideband fractal medium resonance wave absorber based on 3D printing as claimed in claim 1, wherein: the dielectric substrate (2) is 2.86mm high, and the bottom layer structure (3) is copper foil with the thickness of about 0.1 mm.
8. The ultra-wideband fractal medium resonance wave absorber based on 3D printing as claimed in claim 1, wherein: the dielectric resonance structures (1) are arranged on the dielectric substrate (2) in an array mode, the period is 8 x 8, the dielectric resonance structures are printed into an integral structure through 3D, and the relative dielectric constant is 10.7.
9. The ultra-wideband fractal medium resonance wave absorber based on 3D printing as claimed in claim 1, wherein: the wave absorber has a symmetrical shape, the absorption coefficient is irrelevant to the polarization angle of incident waves, the wave absorber resonates in a DR mode under the lower frequency under the normal incidence, and the wave absorber has three absorption peaks corresponding to two basic magnetic dipole modes and a high-order magnetic dipole mode;
in a higher frequency band, the grating mode of the resonator can be excited to generate two absorption peaks, so that the absorption rate exceeds 90% in an ultra-wide working frequency band of 3.1-14.7 GHz.
10. An ultra-wideband fractal medium resonance wave absorber method based on 3D printing is characterized by comprising the following steps: at least comprises the following steps: the dielectric resonator comprises a dielectric resonance structure (1), a dielectric substrate (2) and a bottom layer structure (3), wherein the dielectric substrate (2) and the bottom layer structure (3) are parallel to each other and are arranged in an up-down laminated manner; the dielectric resonance structure (1) forms a wave absorber on the upper layers of the dielectric substrate (2) and the bottom layer structure (3);
the medium resonance structure (1) is composed of four small square columns with the same size and connectors between the four small square columns, the four small square columns with the same size are distributed in the forward direction at equal intervals from left to right, up to down, and the middle connector is a square body larger than the small square columns in size, the middle connector connects 90-degree inner angles of the four small square bodies with the same size into a whole, the four inner angles of the square body are fused into the 90-degree inner angles of the four small square bodies with the same size, and the small square columns and the connectors between the small square columns form an integral symmetrical structure; adjusting the length of the gap of the wave absorber unit to adjust the two absorption peaks after adjusting the length of the gap of the wave absorber unit by adjusting the two absorption peaks before and after the wave absorber unit is adjusted in the frequency band; adjusting a third absorption peak in the frequency band by adjusting the height of the wave absorber unit; the bandwidth of the wave absorber is changed by adjusting the length, the height and the gap of the wave absorber unit.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115401913A (en) * | 2022-09-06 | 2022-11-29 | 西安交通大学 | Continuous conductive fiber electromagnetic superstructure and 3D printing method |
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Application publication date: 20211001 |