CN113242644B - A substrate-integrated half-fin circuit structure suitable for broadband terahertz signals - Google Patents
A substrate-integrated half-fin circuit structure suitable for broadband terahertz signals Download PDFInfo
- Publication number
- CN113242644B CN113242644B CN202110646401.4A CN202110646401A CN113242644B CN 113242644 B CN113242644 B CN 113242644B CN 202110646401 A CN202110646401 A CN 202110646401A CN 113242644 B CN113242644 B CN 113242644B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- conductive
- ridge
- substrate
- support ridge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 abstract description 3
- 238000004891 communication Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
本发明揭示了一种适用于宽带太赫兹信号的基片集成半鳍线电路结构，包括顶层电路板、中间支撑板和底层电路板，所述顶层电路板和中间支撑板之间通过两侧的第一支撑脊和第二支撑脊间隔，所述中间支撑板和底层电路板之间通过两侧的第三支撑脊和第四支撑脊间隔，所述第一支撑脊和第二支撑脊之间、以及第三支撑脊和第四支撑脊间隔之间均具有间隙。本发明基片集成半鳍线电路结构由多张印制电路板压合而成，并形成空腔，在空腔中填充入填充介质，以解决雷达、通信等领域对大带宽、小体积、轻重量、高品质因素的基片集成半鳍线电路结构的需求。
The present invention discloses a substrate-integrated half-fin line circuit structure suitable for broadband terahertz signals, including a top circuit board, an intermediate support plate and a bottom circuit board, wherein the top circuit board and the intermediate support plate are separated by a first support ridge and a second support ridge on both sides, and the intermediate support plate and the bottom circuit board are separated by a third support ridge and a fourth support ridge on both sides, and there are gaps between the first support ridge and the second support ridge, and between the third support ridge and the fourth support ridge. The substrate-integrated half-fin line circuit structure of the present invention is formed by laminating a plurality of printed circuit boards to form a cavity, and a filling medium is filled in the cavity to meet the needs of radar, communication and other fields for substrate-integrated half-fin line circuit structures with large bandwidth, small size, light weight and high quality factor.
Description
Technical Field
The invention relates to the technical field of integrated circuits.
Background
The substrate of broadband terahertz signal has a plurality of printed circuit boards in production, and the printed circuit boards are assembled by adopting simple stacking, and the assembly mode is simple and low in assembly cost, but has poor reliability, low compression resistance and unstable broadband terahertz signal in the actual use process.
Disclosure of Invention
The invention aims to solve the technical problem of realizing a substrate integrated half-fin line circuit structure suitable for broadband terahertz signals.
In order to achieve the purpose, the substrate integrated half fin line circuit structure suitable for broadband terahertz signals comprises a plurality of printed circuit boards, wherein each printed circuit board comprises a top layer circuit board and a bottom layer circuit board, an intermediate support plate is arranged between the top layer circuit board and the bottom layer circuit board, the top layer circuit board and the intermediate support plate are separated by a first support ridge and a second support ridge on two sides, the intermediate support plate and the bottom layer circuit board are separated by a third support ridge and a fourth support ridge on two sides, and gaps are reserved between the first support ridge and the second support ridge and between the third support ridge and the fourth support ridge.
The upper surface and the lower surface of the top layer circuit board and the lower surface of the bottom layer circuit board are respectively provided with a conductive plane, and the conductive planes of the top layer circuit board and the bottom layer circuit board are connected through conductors.
The upper surface and the lower surface of the middle supporting plate are respectively provided with a conductive plane, and the conductive planes on the two sides of the middle supporting plate are respectively composed of two unconnected conductive sheets.
The conductive planes on the two sides of the middle supporting plate are in alternating current short circuit with the conductive planes of the top circuit board, and the conductive planes on the two sides of the middle supporting plate are in alternating current short circuit with the conductive planes of the bottom circuit board.
The conductive planes on the two sides of the middle supporting plate are composed of two large conductive plates and small conductive plates which are not connected, the small conductive plates and the conductive plane of the top circuit board form an electric wall boundary together, and the small conductive plates and the conductive plane of the bottom circuit board form an electric wall boundary together.
The printed circuit boards are all FR-4 materials.
The medium in the gap is air.
The conductive planes are parallel to each other.
The substrate integrated half fin line circuit structure is formed by laminating a plurality of printed circuit boards, a cavity is formed, and a filling medium is filled in the cavity, so that the requirements of the fields of radar, communication and the like on the substrate integrated half fin line circuit structure with large bandwidth, small volume, light weight and high quality factors are met.
Drawings
The contents of each drawing in the specification of the present invention are briefly described as follows:
FIG. 1 is an exploded schematic view of a substrate integrated half-fin circuit structure;
FIG. 2 is a schematic diagram of an assembly of a substrate integrated half-fin circuit structure;
the marks in the figure are 1, a top circuit board, 2, a middle supporting board, 3, a bottom circuit board, 4, a first supporting ridge, 5, a second supporting ridge, 6, a third supporting ridge and 7, a fourth supporting ridge.
Detailed Description
The following detailed description of the embodiments of the invention, such as the shape and construction of the components, the mutual positions and connection relationships between the components, the roles and working principles of the components, the manufacturing process and the operating and using method, etc., is provided to assist those skilled in the art in a more complete, accurate and thorough understanding of the inventive concept and technical solution of the present invention.
The substrate integrated half fin line circuit structure suitable for broadband terahertz signals is shown in fig. 1, and is formed by laminating a plurality of printed circuit boards, wherein the printed circuit boards are made of FR-4 materials, each circuit board comprises a top circuit board 1 and a bottom circuit board 3, the top circuit board 1 and the bottom circuit board 3 are parallel to each other, an intermediate support board 2 parallel to the top circuit board 1 and the bottom circuit board 3 is arranged between the top circuit board 1 and the bottom circuit board 3, and the intermediate support board 2 is used for mounting components for realizing specific functions.
The upper surface of the intermediate support plate 2 is provided on both sides with a first support ridge 4 and a second support ridge 5, and the top circuit board 1 is supported by the first support ridge 4 and the second support ridge 5, and the lower surface of the intermediate support plate 2 is provided on both sides with a third support ridge 6 and a fourth support ridge 7, and the bottom circuit board 3 is supported by the third support ridge 6 and the fourth support ridge 7. And 4, cavity gaps are respectively arranged between the first supporting ridge 4 and the second supporting ridge 5 and between the third supporting ridge 6 and the fourth supporting ridge 7, and filling medium is filled in the cavity gaps to form the semi-fin line circuit structure. The addition of fins offers the advantage of a wider bandwidth compared to conventional SIW, and the parallel upper and lower layers of ridges offers the advantage of easier fabrication than the other structure.
The upper surface and the lower surface of the top layer circuit board 1 and the bottom layer circuit board 3 are respectively provided with a conductive plane, the conductive planes of the top layer circuit board 1 and the bottom layer circuit board 3 in the figure are the outermost periphery of the structure, the small holes on the upper surface are VIAs produced by the PCB process, the conductive planes of the top layer circuit board 1 and the bottom layer circuit board 3 are connected through conductors, the upper surface and the lower surface of the middle supporting board 2 are also provided with conductive planes, and the conductive planes on two sides of the middle supporting board 2 are respectively composed of two unconnected conductive sheets. The conductive planes on the two sides of the middle support plate 2 are in alternating current short circuit with the conductive planes of the top layer circuit board 1 (which means that alternating current signals can pass through the two without obstruction, and no alternating current potential difference exists between the two), the conductive planes on the two sides of the middle support plate 2 are in alternating current short circuit with the conductive planes of the bottom layer circuit board 3, and the electric field direction of the conductive planes of the middle support plate 2 is parallel to the conductive planes of the top layer circuit board 1 and the bottom layer circuit board 3. Preferably, the conductive planes on both sides of the middle support plate 2 are formed by two large conductive plates and small conductive plates which are not connected, the small conductive plates and the conductive plane of the top circuit board 1 form an electric wall boundary together (the electric field direction is the same as the normal direction of the boundary, and the small conductive plates and the conductive plane of the bottom circuit board 3 do not have a specific physical structure).
While the invention has been described above with reference to the accompanying drawings, it will be apparent that the invention is not limited to the above embodiments, but is capable of being modified or applied directly to other applications without modification, as long as various insubstantial modifications of the method concept and technical solution of the invention are adopted, all within the scope of the invention.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110646401.4A CN113242644B (en) | 2021-06-10 | 2021-06-10 | A substrate-integrated half-fin circuit structure suitable for broadband terahertz signals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110646401.4A CN113242644B (en) | 2021-06-10 | 2021-06-10 | A substrate-integrated half-fin circuit structure suitable for broadband terahertz signals |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113242644A CN113242644A (en) | 2021-08-10 |
| CN113242644B true CN113242644B (en) | 2025-02-28 |
Family
ID=77139465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110646401.4A Active CN113242644B (en) | 2021-06-10 | 2021-06-10 | A substrate-integrated half-fin circuit structure suitable for broadband terahertz signals |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113242644B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007149046A1 (en) * | 2006-06-22 | 2007-12-27 | Meds Technologies Pte Ltd | Quasi-planar circuits with air cavities |
| CN215956726U (en) * | 2021-06-10 | 2022-03-04 | 芜湖麦可威电磁科技有限公司 | Substrate-integrated half-fin circuit structure suitable for broadband terahertz signals |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2086143A (en) * | 1980-10-22 | 1982-05-06 | Philips Electronic Associated | Finline circuit configuration |
| JP3169972B2 (en) * | 1991-02-26 | 2001-05-28 | 株式会社東芝 | Waveguide-microstrip line converter |
| CN106848520A (en) * | 2017-02-21 | 2017-06-13 | 电子科技大学 | A kind of waveguide cavity configuration based on the integrated suspended substrate stripline of medium |
-
2021
- 2021-06-10 CN CN202110646401.4A patent/CN113242644B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007149046A1 (en) * | 2006-06-22 | 2007-12-27 | Meds Technologies Pte Ltd | Quasi-planar circuits with air cavities |
| CN215956726U (en) * | 2021-06-10 | 2022-03-04 | 芜湖麦可威电磁科技有限公司 | Substrate-integrated half-fin circuit structure suitable for broadband terahertz signals |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113242644A (en) | 2021-08-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6205032B1 (en) | Low temperature co-fired ceramic with improved registration | |
| TWI466607B (en) | Printed circuit board having buried component and method for manufacturing same | |
| KR100629656B1 (en) | Multi-layer flat antenna manufactured from low cost materials and high conductivity addition process | |
| CN113228410B (en) | Multi-layer filter including low inductance via assembly | |
| CN105578740B (en) | Single-sided rigid-flex board and mobile terminal | |
| JP2004200698A (en) | Monolithic transmission line capacitors | |
| CN113242644B (en) | A substrate-integrated half-fin circuit structure suitable for broadband terahertz signals | |
| CN215956726U (en) | Substrate-integrated half-fin circuit structure suitable for broadband terahertz signals | |
| CN102379016A (en) | Solid electrolytic capacitor | |
| CN106341945B (en) | A flexible circuit board and method of making the same | |
| JPH11251178A (en) | Four-terminal multilayer capacitor | |
| JP4243443B2 (en) | Balun transformer | |
| CN113410053A (en) | Capacitor | |
| CN101361222A (en) | Balance/unbalance conversion element, and method for manufacturing the same | |
| US7049905B2 (en) | High power directional coupler | |
| CN113242645B (en) | A substrate integrated half-fin circuit structure suitable for broadband millimeter wave signals | |
| CN211297147U (en) | Buried Plane Resistor Mixed Ladder Multilayer Circuit Board | |
| CN210093663U (en) | Circuit board | |
| TW200527455A (en) | Method and apparatus of non-symmetrical electrode of build-in capacitor | |
| CN211509467U (en) | PCB (printed circuit board) | |
| CN2641987Y (en) | Multi-layer flexible film circuit board | |
| JPH04223704A (en) | High frequency transmission line | |
| CN105228334B (en) | a kind of printed circuit board | |
| CN209593877U (en) | A kind of Low ESR multilayer circuit board | |
| CN222339664U (en) | Multilayer electronic circuit board and folded multilayer electronic circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |