CN105578740B - Single-sided rigid-flex board and mobile terminal - Google Patents
Single-sided rigid-flex board and mobile terminal Download PDFInfo
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- CN105578740B CN105578740B CN201610105721.8A CN201610105721A CN105578740B CN 105578740 B CN105578740 B CN 105578740B CN 201610105721 A CN201610105721 A CN 201610105721A CN 105578740 B CN105578740 B CN 105578740B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
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Abstract
本发明提供一种单面软硬结合板,包括介质层以及层叠于所述介质层之上的布线层,所述布线层包括多条信号线和多条地线,所述多条信号线和所述多条地线交替配置,所述多条信号线与所述多条地线一一对应,且每条所述信号线均与一条对应的所述地线形成信号回路。本发明通过地线接地从而可以确保信号传递过程中及时形成信号回路,使得电路中的阻抗不会增大、多条信号线间的信号干涉也能相应减弱,从而达到提高信号的传输质量的技术效果。
The present invention provides a single-sided rigid-flex board, comprising a dielectric layer and a wiring layer stacked on the dielectric layer, wherein the wiring layer comprises a plurality of signal lines and a plurality of ground lines, wherein the plurality of signal lines and the plurality of ground lines are alternately arranged, wherein the plurality of signal lines correspond to the plurality of ground lines one by one, and each of the signal lines forms a signal loop with a corresponding ground line. The present invention can ensure that a signal loop is formed in a timely manner during signal transmission by grounding the ground line, so that the impedance in the circuit will not increase, and the signal interference between the plurality of signal lines can be reduced accordingly, thereby achieving the technical effect of improving the transmission quality of the signal.
Description
技术领域technical field
本发明涉及软硬结合板制造领域,更具体地说,本发明涉及一种单面软硬结合板和移动终端。The invention relates to the field of rigid-flex board manufacturing, and more specifically, the invention relates to a single-sided rigid-flex board and a mobile terminal.
背景技术Background technique
软硬结合板是一种兼具刚性PCB的耐久力和柔性PCB的适应力的新型印刷电路板,在所有类型的PCB中,软硬结合是对恶劣应用环境的抵抗力最强的,因此受到各大电子装置生产商的青睐。Rigid-flex board is a new type of printed circuit board that combines the durability of rigid PCB and the adaptability of flexible PCB. Among all types of PCBs, rigid-flex is the most resistant to harsh application environments, so it is subject to Favored by major electronic device manufacturers.
为了降低电子装置的制造成本,在电子装置的制造过程中通常会用到结构简单、造价低廉的单面软硬结合板。但是由于单面软硬结合板中没有参考地层,因而在信号的转输过程中无法及时形成回流,电路的阻抗会增加,造成信号的质量变差。同时,由于电路阻抗的增加,信号无法在短距离路径内实现回流,此时信号会向空间发射能量,信号对空间的辐射也增加了,造成对其他信号的干扰增大,并最终影响到其他信号的正常工作。In order to reduce the manufacturing cost of electronic devices, single-sided rigid-flex boards with simple structure and low cost are usually used in the manufacturing process of electronic devices. However, since there is no reference ground in the single-sided rigid-flex board, the backflow cannot be formed in time during the signal transmission process, and the impedance of the circuit will increase, resulting in poor signal quality. At the same time, due to the increase of circuit impedance, the signal cannot be returned in a short-distance path. At this time, the signal will emit energy into the space, and the radiation of the signal to the space will also increase, resulting in increased interference to other signals and eventually affecting other normal operation of the signal.
发明内容Contents of the invention
本发明的目的在于提供一种单面软硬结合板,该软硬结合板工作过程中信号阻抗小、对其他信号的干扰小。The object of the present invention is to provide a single-sided rigid-flex board, which has small signal impedance and little interference to other signals during the working process of the rigid-flex board.
本发明提供一种移动终端,该移动终端采用上述单面软硬结合板。The present invention provides a mobile terminal, which adopts the above-mentioned single-sided rigid-flex board.
为了实现上述目的,本发明实施方式提供如下技术方案:In order to achieve the above object, the embodiment of the present invention provides the following technical solutions:
本发明提供一种单面软硬结合板,包括介质层以及层叠于所述介质层之上的布线层,所述布线层包括多条信号线和多条地线,所述多条信号线和所述多条地线交替配置,所述多条信号线与所述多条地线一一对应,且每条所述信号线均与一条对应的所述地线形成信号回路。The present invention provides a single-sided rigid-flex board, which includes a dielectric layer and a wiring layer stacked on the dielectric layer, the wiring layer includes a plurality of signal lines and a plurality of ground lines, and the plurality of signal lines and The multiple ground wires are arranged alternately, the multiple signal wires correspond to the multiple ground wires one by one, and each signal wire forms a signal loop with a corresponding ground wire.
其中,所述信号线和所述地线的宽度相同。Wherein, the signal line and the ground line have the same width.
其中,所述信号线和所述地线相互平行设置。Wherein, the signal line and the ground line are arranged parallel to each other.
其中,所述布线层还包括电源线和电源地线,所述电源线与所述电源地线并列设置在所述信号线与所述地线的一侧。Wherein, the wiring layer further includes a power line and a power ground line, and the power line and the power ground line are arranged in parallel on one side of the signal line and the ground line.
其中,所述电源线与所述电源地线的宽度均为L,所述信号线与所述地线的宽度均为H,则有1/4L≤H≤1/3L。Wherein, the width of the power line and the power ground line are both L, and the width of the signal line and the ground line are both H, then 1/4L≤H≤1/3L.
其中,所述电源线和所述电源地线的载流量为10安培每平方毫米。Wherein, the carrying capacity of the power supply wire and the power ground wire is 10 amperes per square millimeter.
其中,所述布线层上涂覆有绝缘油墨。Wherein, the wiring layer is coated with insulating ink.
其中,所述绝缘油墨层上涂覆有屏蔽层。Wherein, the insulating ink layer is coated with a shielding layer.
其中,所述绝缘油墨为绿漆、聚亚酰胺或ABF膜材料。Wherein, the insulating ink is green paint, polyimide or ABF film material.
本发明还提供一种移动终端,包括上述任意一项所述的单面软硬结合板。The present invention also provides a mobile terminal, including the single-sided rigid-flex board described in any one of the above.
本发明实施例具有如下优点或有益效果:Embodiments of the present invention have the following advantages or beneficial effects:
本发明中通过在单面软硬结合板的布线层中设置于多条信号线一一对应的地线,通过地线接地从而可以确保信号传递过程中及时形成信号回路,使得电路中的阻抗不会增大、多条信号线间的信号干涉也能相应减弱,从而达到提高信号的传输质量的技术效果。In the present invention, a plurality of signal wires are provided in the wiring layer of the single-sided rigid-flex board with one-to-one corresponding ground wires, and the ground wires are grounded to ensure that the signal loop is formed in time during the signal transmission process, so that the impedance in the circuit does not change. will increase, and the signal interference between multiple signal lines can also be correspondingly weakened, so as to achieve the technical effect of improving the transmission quality of the signal.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.
图1是本发明单面软硬结合板的俯视结构示意图;Fig. 1 is a top view structural schematic diagram of a single-sided rigid-flex board of the present invention;
图2是图1所示单面软硬结合板的截面示意图。Fig. 2 is a schematic cross-sectional view of the single-sided rigid-flex board shown in Fig. 1 .
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其它实施例,都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
此外,以下各实施例的说明是参考附加的图示,用以例示本发明可用以实施的特定实施例。本发明中所提到的方向用语,例如,“上”、“下”、“前”、“后”、“左”、“右”、“内”、“外”、“侧面”等,仅是参考附加图式的方向,因此,使用的方向用语是为了更好、更清楚地说明及理解本发明,而不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。In addition, the following descriptions of the various embodiments refer to the attached drawings to illustrate specific embodiments in which the present invention can be implemented. The directional terms mentioned in the present invention, for example, "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., only is to refer to the direction of the attached drawings. Therefore, the direction terms used are for better and more clearly explaining and understanding the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, use a specific orientation construction and operation, therefore, should not be construed as limiting the invention.
在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸地连接,或者一体地连接;可以是机械连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Ground connection, or integral connection; can be mechanical connection; can be directly connected, can also be indirectly connected through an intermediary, and can be internal communication between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.
此外,在本发明的描述中,除非另有说明,“多个”的含义是两个或两个以上。若本说明书中出现“工序”的用语,其不仅是指独立的工序,在与其它工序无法明确区别时,只要能实现该工序所预期的作用则也包括在本用语中。另外,本说明书中用“~”表示的数值范围是指将“~”前后记载的数值分别作为最小值及最大值包括在内的范围。在附图中,结构相似或相同的用相同的标号表示。In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more. If the term "process" appears in this specification, it not only refers to an independent process, but also includes in this term as long as it can realize the expected function of the process when it cannot be clearly distinguished from other processes. In addition, the numerical range represented by "-" in this specification means the range which includes the numerical value described before and after "-" as a minimum value and a maximum value, respectively. In the drawings, those with similar or identical structures are denoted by the same reference numerals.
请参阅图1,本发明的单面软硬结合板包括介质层10和布线层20,所述布线层20层叠于所述介质层10之上,所述布线层20包括多条信号线21和多条地线22,所述多条信号线21和所述多条地线22交替配置,每条所述信号线21对应邻近的一条地线22,地线22接地以形成信号回路。Referring to Fig. 1, the single-sided rigid-flex board of the present invention includes a dielectric layer 10 and a wiring layer 20, the wiring layer 20 is stacked on the dielectric layer 10, and the wiring layer 20 includes a plurality of signal lines 21 and A plurality of ground wires 22, the plurality of signal wires 21 and the plurality of ground wires 22 are arranged alternately, each of the signal wires 21 corresponds to an adjacent ground wire 22, and the ground wires 22 are grounded to form a signal loop.
通过交错配置地线22和信号线21,信号线彼此是错开的方式,因此可以降低信号间彼此的干扰。每一条信号线21与邻近的一条地线相对应,可以减小信号回路的长度。经由这样的布线方式,可以妥善安排信号线的位置,而得到良好的阻抗匹配。By interleaving the ground wires 22 and the signal wires 21 , the signal wires are staggered from each other, so the mutual interference between signals can be reduced. Each signal line 21 corresponds to an adjacent ground line, which can reduce the length of the signal loop. Through such a wiring method, the positions of the signal lines can be properly arranged to obtain good impedance matching.
本发明中通过在单面软硬结合板的布线层中设置于多条信号线一一对应的地线,通过地线接地从而可以确保信号传递过程中及时形成信号回路,使得电路中的阻抗不会增大、多条信号线间的信号干涉也能相应减弱,从而达到提高信号的传输质量的技术效果。In the present invention, a plurality of signal wires are provided in the wiring layer of the single-sided rigid-flex board with one-to-one corresponding ground wires, and the ground wires are grounded to ensure that the signal loop is formed in time during the signal transmission process, so that the impedance in the circuit does not change. will increase, and the signal interference between multiple signal lines can also be correspondingly weakened, so as to achieve the technical effect of improving the transmission quality of the signal.
进一步的,所述信号线21和所述地线22的宽度相同。使得信号在整个信号回路中保持稳定传输。同时,也便于单面软硬结合板的加工制造。Further, the signal line 21 and the ground line 22 have the same width. Make the signal keep stable transmission in the whole signal loop. At the same time, it is also convenient for the processing and manufacturing of single-sided rigid-flex boards.
更进一步的,所述信号线21和所述地线22相互平行设置。以保证相对应的信号线21和地线22之间的耦合性能,进一步降低信号回路的整体阻抗值。Furthermore, the signal line 21 and the ground line 22 are arranged parallel to each other. In order to ensure the coupling performance between the corresponding signal line 21 and the ground line 22, the overall impedance value of the signal loop is further reduced.
本发明实施例的单面软硬结合板的布线层20中还包括电源线23和电源地线24,所述电源线23与电源相连接,为单面软硬结合板提供电流。电源线23通过电源地线24形成放电回路。进一步的,所述多条信号线21和所述多条地线22仅位于所述电源线23与所述电源地线24的一侧上。也就是说,所述电源线23和所述电源地线24相邻设置,且所述电源线23和所述电源地线24位于在所述单面软硬结合板的一侧上。如此设置的目的在于,可以降低电源回路与信号回路之间的相互干扰,提高信号的传输质量。The wiring layer 20 of the single-sided rigid-flex board in the embodiment of the present invention also includes a power line 23 and a power ground wire 24, and the power line 23 is connected to a power supply to provide current for the single-sided rigid-flex board. The power line 23 forms a discharge circuit through the power ground line 24 . Further, the plurality of signal lines 21 and the plurality of ground lines 22 are only located on one side of the power line 23 and the power ground line 24 . That is to say, the power line 23 and the power ground line 24 are arranged adjacently, and the power line 23 and the power ground line 24 are located on one side of the single-sided rigid-flex board. The purpose of such setting is to reduce the mutual interference between the power loop and the signal loop, and improve the transmission quality of the signal.
进一步的,所述电源线23与所述电源地线24的宽度相等且均为L,所述信号线21与所述地线22的宽度均为H,则应该满足1/4L≤H≤1/3L。Further, the width of the power line 23 and the power ground line 24 are equal and both are L, and the width of the signal line 21 and the ground line 22 are both H, so it should satisfy 1/4L≤H≤1 /3L.
由于电源线23和电源地线24用于为整个单面软硬结合板提供电流,因此其上的电流大于各信号线21和地线22中的电流。信号线21和地线22中的电流较小,因此可以采用较小的横截面积。对于信号线21和地线22由于其自身的厚度已经很小,因此很难再降低其厚度。本实施例中可以通过减小信号线21和地线22的宽度来减小其横截面积。从而达到缩小单面软硬结合板总体体积的技术效果。同样宽度过小也会造成信号线21和地线22结构强度不够,容易断裂。综合考量上述因素,应保证1/4L≤H≤1/3L。Since the power line 23 and the power ground line 24 are used to provide current for the entire single-sided rigid-flex board, the current on them is greater than the current in each signal line 21 and ground line 22 . The current in the signal line 21 and the ground line 22 is small, so a small cross-sectional area can be used. Since the thickness of the signal line 21 and the ground line 22 is already very small, it is difficult to reduce their thickness. In this embodiment, the cross-sectional area of the signal line 21 and the ground line 22 can be reduced by reducing the width thereof. So as to achieve the technical effect of reducing the overall volume of the single-sided rigid-flex board. Similarly, if the width is too small, the structural strength of the signal line 21 and the ground line 22 will be insufficient and easily broken. Taking the above factors into consideration, it should be ensured that 1/4L≤H≤1/3L.
进一步的,为了保证电源线23和电源地线24传输信号过程中的稳定性,需要对信号层中的电流强度进行限定。本实施例中的电源线23和电源地线24的载流量为10安培每平方毫米(A/mm2)。Further, in order to ensure the stability of the signal transmission process of the power line 23 and the power ground line 24, the current intensity in the signal layer needs to be limited. The current carrying capacity of the power line 23 and the power ground line 24 in this embodiment is 10 amperes per square millimeter (A/mm 2 ).
请结合图2,进一步的,所述布线层20上涂覆有绝缘油墨层30,所述绝缘油墨层30可包括例如绿漆的防焊材料,或可为包括聚亚酰胺(polyimide)或ABF膜(ajinomotobuild-up film)的绝缘材料,其可保护单面软硬结合板内部的线路结构不被氧化或彼此短路。Please refer to FIG. 2, further, the wiring layer 20 is coated with an insulating ink layer 30, and the insulating ink layer 30 may include a solder resist material such as green paint, or may include polyimide (polyimide) or ABF The insulating material of the film (ajinomotobuild-up film), which can protect the circuit structure inside the single-sided rigid-flex board from being oxidized or shorted to each other.
为进一步降低布线层20与外界之间信号的相互干扰,提供信号的传输质量。还可以在所述绝缘油墨层30上涂覆一层屏蔽层40。所述屏蔽层40可以铜浆、银浆等导电材料以印刷、网印的方式形成在该绝缘油墨层30的表面。屏蔽层40亦可以采用铜箔、银箔、铝箔等导电箔材料以压合或贴合的方式形成在该绝缘油墨层30的表面。In order to further reduce the mutual interference of signals between the wiring layer 20 and the outside world, and improve the transmission quality of signals. A shielding layer 40 may also be coated on the insulating ink layer 30 . The shielding layer 40 can be formed on the surface of the insulating ink layer 30 by printing or screen printing with conductive materials such as copper paste and silver paste. The shielding layer 40 can also be formed on the surface of the insulating ink layer 30 by pressing or pasting conductive foil materials such as copper foil, silver foil, and aluminum foil.
本发明还提供一种移动终端,该移动终端中包括上述任意一种软硬结合板。该移动终端可以为手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的电子设备。The present invention also provides a mobile terminal, which includes any one of the above-mentioned rigid-flex boards. The mobile terminal can be any electronic device with a display function such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, and the like.
在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或示例。而且,描述的具体特征、结构、材料或特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples" or "some examples" mean specific features described in connection with the embodiment or example, A structure, material or characteristic is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
以上所述的实施方式,并不构成对该技术方案保护范围的限定。任何在上述实施方式的精神和原则之内所作的修改、等同替换和改进等,均应包含在该技术方案的保护范围之内。The implementation methods described above do not constitute a limitation to the scope of protection of the technical solution. Any modifications, equivalent replacements and improvements made within the spirit and principles of the above implementation methods shall be included in the protection scope of the technical solution.
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CN107845393B (en) * | 2017-10-17 | 2020-07-28 | Oppo广东移动通信有限公司 | DDR signal wiring board, printed circuit board, and electronic device |
CN108566724B (en) * | 2018-06-13 | 2020-12-04 | 晶晨半导体(深圳)有限公司 | Wiring board for DDR memory, printed circuit board, and electronic device |
CN209248493U (en) * | 2018-07-27 | 2019-08-13 | 京东方科技集团股份有限公司 | Function panel and terminal |
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US5912597A (en) * | 1994-03-31 | 1999-06-15 | Canon Kabushiki Kaisha | Printed circuit board |
US6232560B1 (en) * | 1998-12-08 | 2001-05-15 | Hon Hai Precision Ind. Co., Ltd. | Arrangement of printed circuit traces |
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CN203490974U (en) * | 2013-08-23 | 2014-03-19 | 株式会社东芝 | Flexible flat cable and flexible flat cable group |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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