CN113138539B - An immersion liquid supply and recovery device for an immersion lithography machine - Google Patents
An immersion liquid supply and recovery device for an immersion lithography machine Download PDFInfo
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- CN113138539B CN113138539B CN202010055886.5A CN202010055886A CN113138539B CN 113138539 B CN113138539 B CN 113138539B CN 202010055886 A CN202010055886 A CN 202010055886A CN 113138539 B CN113138539 B CN 113138539B
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- 238000007654 immersion Methods 0.000 title claims abstract description 95
- 239000007788 liquid Substances 0.000 title claims abstract description 90
- 238000011084 recovery Methods 0.000 title claims abstract description 48
- 238000000671 immersion lithography Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 230000005499 meniscus Effects 0.000 claims abstract description 37
- 238000005086 pumping Methods 0.000 claims description 11
- 238000001459 lithography Methods 0.000 claims description 9
- 230000007423 decrease Effects 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 2
- 238000000605 extraction Methods 0.000 abstract description 25
- 238000007789 sealing Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 238000011144 upstream manufacturing Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
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- 238000011109 contamination Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002101 nanobubble Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000005514 two-phase flow Effects 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
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Abstract
本发明公开了一种用于浸没式光刻机的浸液供给回收装置。所述装置包包括浸液供给通道、浸液回收通道以及抽排开口,相邻的抽排开口之间设置钉扎带;所述钉扎带具有内钉扎带和外钉扎带,分别限制弯液面向内后退和向外前进,可提高浸没流场的密封能力,改善浸液回收通道的振动特性,提高衬底曝光的质量。
The invention discloses an immersion liquid supply and recovery device for an immersion lithography machine. The device package includes an immersion liquid supply channel, an immersion liquid recovery channel and an extraction opening, and a pinning tape is arranged between adjacent extraction openings; the pinning tape has an inner pinning tape and an outer pinning tape, which are respectively limited The meniscus retreats inward and advances outward, which can improve the sealing ability of the immersion flow field, improve the vibration characteristics of the immersion liquid recovery channel, and improve the quality of substrate exposure.
Description
技术领域technical field
本发明涉及光刻机技术领域,具体涉及一种用于浸没式光刻机的浸液供给回收装置。The invention relates to the technical field of lithography machines, in particular to an immersion liquid supply and recovery device for an immersion lithography machine.
背景技术Background technique
光刻机是制造超大规模集成电路的核心装备之一,现代光刻机以光学光刻为主,它利用光学系统把掩膜版上的图形精确地投影并曝光在涂覆光刻胶的衬底上。它包括一个激光光源、一个投影物镜系统、一块由芯片图形组成的投影掩膜版、一个对准系统和一个涂有光敏光刻胶的衬底。The lithography machine is one of the core equipment for the manufacture of ultra-large-scale integrated circuits. The modern lithography machine is mainly based on optical lithography. It uses the optical system to accurately project and expose the pattern on the mask on the photoresist-coated liner. bottom. It includes a laser light source, a projection objective lens system, a projection mask composed of chip patterns, an alignment system and a substrate coated with photosensitive photoresist.
相对于中间介质为气体的干式光刻机,浸没式光刻(Immersion Lithography)设备通过在最后一片投影物镜与衬底之间填充某种高折射率的液体,通过提高该缝隙液体介质的折射率(n)来提高投影物镜的数值孔径(NA),从而提高光刻设备的分辨率和焦深。在现在的主流光刻技术中,浸没式光刻对现有设备改动最小,且对现在的干式光刻机具有良好的继承性,所以受到广泛关注。对于浸没液体的填充,目前广泛采用的方案是局部浸没法,即使用浸液供给回收装置将液体限制在最后一片投影物镜的下表面和衬底上表面之间的局部区域内。保持浸没液体在曝光区域内的光学一致性和透明度,是保障浸没式光刻曝光质量的关键。为此,现有技术方案往往通过注液和回收实现浸没流场的实时更新,将光化学污染物、局部热量、微纳气泡等及时带离核心曝光区域,以确保浸没液体的高度纯净均一。Compared with the dry lithography machine in which the intermediate medium is gas, the immersion lithography (Immersion Lithography) equipment fills a certain high refractive index liquid between the last projection objective lens and the substrate, and improves the refraction of the liquid medium in the gap. ratio (n) to increase the numerical aperture (NA) of the projection objective, thereby increasing the resolution and depth of focus of the lithographic apparatus. Among the current mainstream lithography technologies, immersion lithography has minimal changes to existing equipment, and has good inheritance to current dry lithography machines, so it has received widespread attention. For the filling of the immersion liquid, the widely used solution is partial immersion, that is, the liquid is confined in the local area between the lower surface of the last projection objective and the upper surface of the substrate using the immersion liquid supply and recovery device. Maintaining the optical consistency and transparency of the immersion liquid in the exposure area is the key to ensuring the quality of immersion lithography exposures. For this reason, the existing technical solutions often realize real-time update of the immersion flow field through liquid injection and recovery, and take photochemical pollutants, local heat, micro-nano bubbles, etc. away from the core exposure area in time to ensure high purity and uniformity of the immersion liquid.
如图1所示,浸没式光刻机中浸液供给回收装置2设置于投影物镜系统1和衬底3之间,浸没液体由浸液供给系统5提供动力,经由浸液供给回收装置2注入投影物镜系统1和衬底3之间的空间,并且被浸液回收系统6经由浸液供给回收装置2抽排。浸没液体填充投影物镜系统1和衬底3之间的空间形成浸没流场4。浸没液体的折射率大于空气,相对于干式光刻机,由于浸没流场4的存在,浸没式光刻机中投影物镜系统1和衬底3之间的光路介质折射率提高,携带集成电路图形信息的激光光束穿过投影物镜系统1和浸没流场4后可以在衬底3上形成尺寸更小的集成电路图形。As shown in FIG. 1 , the immersion liquid supply and
如图2和图3所示,浸液供给回收装置2的中心具有允许激光通过的圆形通孔21,圆形通孔21具有适应投影物镜系统1下端面形状的上大下小的圆台形状。浸液供给回收装置2中设置浸液供给通道22和浸液回收通道23,由浸液供给系统5提供的浸没液体流经浸液供给通道22进入浸没流场4,然后经浸液回收通道23被浸液回收系统6抽排。浸液供给回收装置2和衬底3之间存在一个最小厚度在0.1mm至1mm范围的缝隙。为了避免浸没液体从该缝隙向外围环境泄漏,浸液供给系统5在下端面沿圆形通孔21的轴向布置有线度在0.2mm~2mm范围内的抽排开口24,抽排开口24的一端与浸没流场4相通,另一端与抽排腔25相通。抽排腔25是一个圆环形腔体,与多个抽排开口24相通,并与密封抽排通道26相通。浸液回收系统6施加负压,使得浸没流场4中的浸没液体经过抽排开口24汇聚到抽排腔25中,然后经过密封抽排通道26被浸液回收系统6回收。由于浸液回收系统6的抽排作用,浸液液体与外围气体在抽排开口24附近形成了一圈弯液面41。为了避免浸液液体从浸没流场4中泄漏并残留在衬底3上造成污染,以及避免浸没液体向内过度回退造成气泡卷入浸没流场4,需要控制弯液面41的位置和形状稳定。优选地,始终保持弯液面41与抽排开口24接触,保证抽排开口24中始终同时存在液体流和气体流,避免出现振动冲击大的气体流中液滴飞溅或者液体流中气体冒泡的情况,能够改善浸液供给回收装置2的振动特性。As shown in FIG. 2 and FIG. 3 , the center of the immersion liquid supply and
浸没式光刻机的投影物镜系统和浸液供给回收装置是固定的,在对衬底进行曝光的过程中,需要移动衬底使集成电路图案在衬底上完整成形。浸液供给回收装置与衬底之间存在缝隙,浸液供给回收装置朝向衬底的端面上设置有抽排开口,用于将浸没液体约束在浸液供给回收装置端面于衬底之间,不会大面积遗留在衬底上造成污染。浸没式光刻机移动衬底的速度直接影响其产率,是衡量光刻机性能的主要指标。但衬底相对于浸液供给回收装置发生相对运动将导致浸没流场受到定向的牵拉。在衬底高速运动的过程中,这种牵拉运动的影响是明显的,可能导致浸液密封失效,浸液泄漏;可能导致浸液中卷入气泡,影响曝光光路;或者浸液回收通道中的气液两相流流型发生改变,导致其振动特性和热传导特性发生改变,最终影响到曝光质量。The projection objective lens system and the immersion liquid supply and recovery device of the immersion lithography machine are fixed, and in the process of exposing the substrate, the substrate needs to be moved so that the integrated circuit pattern is completely formed on the substrate. There is a gap between the immersion liquid supply and recovery device and the substrate, and the end face of the immersion liquid supply and recovery device facing the substrate is provided with a suction opening, which is used to constrain the immersion liquid between the end face of the immersion liquid supply and recovery device and the substrate. It will leave a large area on the substrate and cause contamination. The speed at which the immersion lithography machine moves the substrate directly affects its yield and is the main indicator for measuring the performance of the lithography machine. However, relative movement of the substrate with respect to the immersion liquid supply and recovery device will result in a directional pull on the immersion flow field. In the process of high-speed movement of the substrate, the influence of this pulling motion is obvious, which may lead to the failure of the immersion liquid seal and the leakage of the immersion liquid; it may cause air bubbles to be involved in the immersion liquid, affecting the exposure light path; or the immersion liquid recovery channel The flow pattern of the gas-liquid two-phase flow changes, resulting in changes in its vibration characteristics and thermal conduction characteristics, which ultimately affect the exposure quality.
发明内容SUMMARY OF THE INVENTION
浸液供给回收装置常常具有多个分立的抽排开口,相邻抽排开口之间的区域对浸没液体的约束能力相对较弱。为了增强对相邻抽排开口之间区域的浸没液体的约束能力,本发明提供了一种用于浸没式光刻机的浸液供给回收装置,通过在相邻两个抽排开口之间设置钉扎带,增加该区域对沿径向向外和向内运动的浸没流场弯液面的约束,从而增强浸液供给回收装置对浸没液体的约束能力,避免浸液泄漏到衬底上或者气泡卷入浸没流场之中。Immersion liquid supply and recovery devices often have a plurality of discrete extraction openings, and the area between adjacent extraction openings is relatively weak in confining the immersion liquid. In order to enhance the confinement ability of the immersion liquid in the area between the adjacent suction openings, the present invention provides an immersion liquid supply and recovery device for an immersion lithography machine, by arranging between two adjacent suction openings Pinning tape, which increases the confinement of the meniscus of the immersion flow field moving radially outward and inward in this area, thereby enhancing the confinement ability of the immersion liquid supply and recovery device to the immersion liquid, avoiding the leakage of the immersion liquid onto the substrate or Air bubbles are involved in the immersion flow field.
本发明采用的技术方案如下:The technical scheme adopted in the present invention is as follows:
本发明包括主体、垂直注液口、抽排腔、注气口、多个抽排开口和钉扎带,多个所述抽排开口位于主体朝向衬底的一面,相邻的抽排开口之间设置钉扎带;所述钉扎带具有内钉扎带和外钉扎带,所述内钉扎带相对于外钉扎带设置于浸液供给回收装置的径向外侧。The present invention includes a main body, a vertical liquid injection port, an extraction cavity, a gas injection port, a plurality of extraction openings, and a pinning band, wherein the plurality of extraction openings are located on the side of the main body facing the substrate, between adjacent extraction openings. A pinning tape is provided; the pinning tape has an inner pinning tape and an outer pinning tape, and the inner pinning tape is arranged on the radially outer side of the immersion liquid supply and recovery device relative to the outer pinning tape.
作为优选,所述内钉扎带是尖锐边缘,并且其径向内侧表面距离衬底的高度大于径向外侧表面距离衬底的高度。Preferably, the inner pinning strip is sharp-edged and the height of the radially inner surface from the substrate is greater than the height of the radially outer surface from the substrate.
作为优选,所述外钉扎带是尖锐边缘,并且其径向内侧表面距离衬底的高度小于径向外侧表面距离衬底的高度。Preferably, the outer pinning band is sharp-edged and the height of the radially inner surface from the substrate is less than the height of the radially outer surface from the substrate.
作为优选,所述内钉扎带是距离衬底的高度沿径向向外减小的表面。Preferably, the inner pinning band is a surface whose height from the substrate decreases radially outward.
作为优选,所述外钉扎带是距离衬底的高度沿径向向外增大的表面。Preferably, the outer pinning band is a surface that increases in height from the substrate radially outward.
作为优选,所述内钉扎带投影于所述抽排开口分布端面是具有负的曲率半径的曲线。Preferably, the projection of the inner pinning band on the distribution end surface of the extraction opening is a curve with a negative radius of curvature.
作为优选,所述外钉扎带投影于所述抽排开口分布端面是具有正的曲率半径的曲线。Preferably, the projection of the outer pinning tape on the distribution end surface of the extraction opening is a curve with a positive radius of curvature.
作为优选,所述钉扎带距离衬底的高度从沿抽排开口近端至远端减小。Preferably, the height of the pinning band from the substrate decreases from the proximal end to the distal end along the extraction opening.
作为优选,所述钉扎带凸出于所述抽排开口分布端面的高度是所述抽排开口分布端面距离衬底高度的十分之一至二分之一。Preferably, the height of the pinning tape protruding from the distribution end surface of the extraction opening is one tenth to one half of the height of the distribution end surface of the extraction opening from the substrate.
本发明具有的有益效果是:The beneficial effects that the present invention has are:
(1)本发明在相邻抽排开口之间设置钉扎带,钉扎带具有至少两个钉扎特征,所述钉扎带具有外钉扎带和内钉扎带;所述外钉扎带对沿径向向外运动的接触线具有钉扎效果,能够阻碍浸没液体向外泄漏;所述内钉扎带对沿径向向内运动的接触线具有钉扎效果,能够阻碍浸没液体向内过度回退造成气泡卷入浸没流场。(1) In the present invention, a pinning tape is provided between adjacent extraction openings, the pinning tape has at least two pinning features, and the pinning tape has an outer pinning tape and an inner pinning tape; the outer pinning tape The tape has a pinning effect on the contact line moving radially outward, which can prevent the immersion liquid from leaking out; the inner pinning tape has a pinning effect on the contact line moving radially inward, and can prevent the immersion liquid from leaking out. Excessive back-back causes air bubbles to become involved in the immersion flow field.
(2)钉扎带约束弯液面使其始终与抽排开口相连,有利于引导浸没液体流入抽排开口;同时避免抽排开口中出现偶然的纯液相流或者纯气相流,改善浸液供给回收装置的振动特性。(2) The pinning tape constrains the meniscus so that it is always connected to the suction opening, which is conducive to guiding the immersion liquid into the suction opening; at the same time, it avoids accidental pure liquid phase flow or pure gas flow in the suction opening, and improves the immersion liquid flow. Vibration characteristics of the feed recovery device.
附图说明Description of drawings
图1为浸液供给回收装置与投影物镜系统以及衬底相装配的简化示意图;Fig. 1 is the simplified schematic diagram that the immersion liquid supply recovery device is assembled with the projection objective lens system and the substrate;
图2为浸液供给回收装置工作原理示意图;Fig. 2 is the schematic diagram of the working principle of the immersion liquid supply and recovery device;
图3为图2的仰视示意图;Fig. 3 is the bottom view schematic diagram of Fig. 2;
图4为本发明的工作原理示意图;4 is a schematic diagram of the working principle of the present invention;
图5为图4的仰视示意图;Fig. 5 is the bottom view schematic diagram of Fig. 4;
图6为钉扎带的三维示意图;6 is a three-dimensional schematic diagram of a pinning tape;
图7为接触线钉扎效应示意图;7 is a schematic diagram of the pinning effect of the contact line;
图8为钉扎带工作原理示意图;Figure 8 is a schematic diagram of the working principle of the pinning tape;
图9为钉扎带的另外两种实施例;Figure 9 shows two other embodiments of the pinning tape;
图10为钉扎带的另一种实施例;Figure 10 is another embodiment of the pinning tape;
图11为钉扎带的另一种实施例;Figure 11 is another embodiment of the pinning tape;
图12为钉扎带的尺寸示意图。Figure 12 is a dimensional schematic view of the pinning tape.
具体实施方式Detailed ways
图4~6示出了本发明涉及的浸液供给回收装置2的一种实施例。为简明计,图4仅示出了浸液供给回收装置2一侧的截面。浸液供给回收装置在抽排开口24的径向内侧设置垂直注液口28,以朝向衬底3的方向供给浸没液体,防止弯液面41回退至圆形通孔21内侧干扰激光光路;在抽排开口24的径向外侧设置注气口29,向浸没流场4的外围提供正压的气流,辅助约束弯液面41。相邻的两个抽排开口24之间设置有钉扎带27,在该实施例中钉扎带27的结构形式凸出于浸液供给回收装置2主体的下端面270的凸台。所有抽排开口24之间的钉扎带27形成了一个间断的环形结构。钉扎带27下端面位于径向内侧的尖锐边缘是内钉扎带271,位于径向外侧的尖锐边缘是外钉扎带272;另外,钉扎带27的垂向尖锐边缘是垂向钉扎带273。4 to 6 show an embodiment of the immersion liquid supply and
图7解释接触线钉扎效应。上游端面201和下游端面202相互成一夹角两个端面的交界线称之为钉扎线200。弯液面41在上游端面201上向前移动,弯液面41与上游端面201的夹角称为前进接触角θa,对于一组固体表面和液体组合,前进接触角θa是定值。当弯液面41到达钉扎线200时,由于弯液面41与下游端面202之间的夹角小于前进接触角θa,接触线410将停止前进,直到弯液面41在驱动力的作用下继续变形使其与下游端面202之间的夹角达到前进接触角θa。当弯液面41与上游端面201之间的接触角在θa到范围内时,接触线410将停留在钉扎线200上,这种现象称之为接触线钉扎效应。相似地,当弯液面41从下游端面202后退至上游端面201的途中,在钉扎线200出也会出现类似现象,不过此时钉扎效应成立的弯液面41与上游端面201之间的接触角范围为θs到其中θs是后退接触角。接触线钉扎效应限制了接触线410的移动,从而对弯液面41的运动产生了阻碍效果。Figure 7 illustrates the contact line pinning effect. The
结合图6和图8解释钉扎带27的工作原理。如图8(a)所示,弯液面41与浸液供给装置2的下端面270形成上接触线411,与衬底表面形成下接触线412。当衬底3以径向向外方向牵拉弯液面41时,上接触线411将会在外钉扎带272处发生钉扎现象,阻碍弯液面41继续前进;如图8(b)所示,当衬底3以相反的径向向内牵拉弯液面41时,上接触线411将会在内钉扎带271处发生钉扎现象,阻碍弯液面41继续后退。实际上,上接触线411后退时在外钉扎带272处也可能发生钉扎现象,但弯液面41是弯曲的,为了避免出现图8(c)所示的弯液面41的曲面先接触到外钉扎带272导致无法形成钉扎现象,需要设置内钉扎带271进一步确保弯液面41后退过程中受到钉扎作用。The working principle of the pinning
图9示出了钉扎带27的另外两种实施例。一种实施例如图9(a)所示,使用倾斜表面替代尖锐边缘对接触线起钉扎作用,内钉扎坡275距离衬底3的高度沿径向向外方向逐渐减小,外钉扎坡276距离衬底3的高度沿径向向外方向逐渐增大。由于弯液面41的表面积增大需要提供额外的驱动力,因此当上接触线411在内钉扎坡275上后退,或者上接触线411在外钉扎坡276上前进时,弯液面41将会受到类似接触线钉扎效应的阻碍效果。另外,内钉扎坡275和外钉扎坡276之间形成一尖锐边缘类型的钉扎棱274,能够对上接触线411起到钉扎效果。图8中的内钉扎带271和外钉扎带272对接触线具有固定的钉扎位置,而图9(a)中的内钉扎坡275和外钉扎坡276对接触线的钉扎位置是一个范围,在阻碍弯液面41移动的同时可以减轻对弯液面41的拉伸,有助于增强弯液面41的稳定性。图9(b)所示的实施例中,设置有内钉扎带271、外钉扎带272、内钉扎坡275以及外钉扎坡276,使用这种方案期望将上接触线411尽量控制在内钉扎带271和外钉扎带272之间,内钉扎坡275和外钉扎坡276分别防止弯液面在后退和前进时被过度拉伸,并且内钉扎坡275的坡度缓于外钉扎坡276,期望进一步减轻弯液面41前进时受到的拉伸作用。FIG. 9 shows two other embodiments of the pinning
如图10(a)所示,内钉扎带271和外钉扎带272可以是一组相互平行的直线或弧线。考虑到两抽排开口24中间的抽排能力较弱,弯液面在沿径向向外运动时会呈现具有正曲率半径的外凸弧线,在沿径向向内运动时会呈现具有负曲率半径的内凹弧线。如图10(b)所示,将内钉扎带271和外钉扎带272分别设计成具有负曲率半径和正曲率半径的曲线,可以适应弯液面的形变,改善弯液面的受力情况,增强其稳定性。As shown in FIG. 10( a ), the inner pinning
如图11(a)所示,内(外)钉扎带271(272)可以设置为所在平面平行于衬底3的平面曲线。考虑到距离抽排开口24远的位置抽排能力弱,可以将内(外)钉扎带271(272)设置为图11(b)所示的距离衬底的高度从沿抽排开口近端至远端减小的曲线形状,减小了流体横向流动的流阻,能够促进浸没液体流动汇聚到抽排开口24附近。As shown in FIG. 11( a ), the inner (outer) pinning tapes 271 ( 272 ) can be arranged in a plane parallel to the plane curve of the
如图12所示,内(外)钉扎带271(272)凸出于下端面270的最大高度h1取为下端面270距离衬底3的高度h2的十分之一至二分之一是较好的设置。若高度h1取值过小,则内(外)钉扎带271(272)对接触线的钉扎容易因为随机扰动而失效;若高度h1取值过大,则内(外)钉扎带271(272)刮碰到衬底3的风险过大。As shown in FIG. 12, the maximum height h1 of the inner (outer) pinning tape 271 (272) protruding from the
上述具体实施方式用来解释说明本发明,而不是对本发明进行限制,在本发明的权利要求的保护范围内,对本发明作出的任何修改和改变,都落入本发明的保护范围。The above-mentioned specific embodiments are used to explain the present invention, rather than to limit the present invention. Within the protection scope of the claims of the present invention, any modifications and changes made to the present invention all fall into the protection scope of the present invention.
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CN101923291A (en) * | 2009-06-16 | 2010-12-22 | Asml荷兰有限公司 | Lithographic equipment, the method for controlling this equipment and use lithographic equipment are made the method for device |
CN102221788A (en) * | 2010-04-15 | 2011-10-19 | Asml荷兰有限公司 | Fluid handling structure, lithographic apparatus and a device manufacturing method |
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