CN105988294B - A kind of submersible photoetching apparatus soaking liquid flow field maintains collision avoidance system - Google Patents
A kind of submersible photoetching apparatus soaking liquid flow field maintains collision avoidance system Download PDFInfo
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- CN105988294B CN105988294B CN201510040998.2A CN201510040998A CN105988294B CN 105988294 B CN105988294 B CN 105988294B CN 201510040998 A CN201510040998 A CN 201510040998A CN 105988294 B CN105988294 B CN 105988294B
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- telescopic device
- flow field
- collision avoidance
- avoidance system
- liquid flow
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- 239000007788 liquid Substances 0.000 title claims abstract description 78
- 238000001259 photo etching Methods 0.000 title claims abstract description 23
- 238000002791 soaking Methods 0.000 title claims abstract description 23
- 239000012530 fluid Substances 0.000 claims abstract description 20
- 238000007789 sealing Methods 0.000 claims abstract description 17
- 230000003287 optical effect Effects 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 230000003139 buffering effect Effects 0.000 claims description 50
- 230000033001 locomotion Effects 0.000 claims description 13
- 238000007654 immersion Methods 0.000 claims description 10
- 238000011084 recovery Methods 0.000 claims description 7
- 238000013459 approach Methods 0.000 claims description 5
- 230000001133 acceleration Effects 0.000 claims description 3
- 239000012190 activator Substances 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 21
- 229910052710 silicon Inorganic materials 0.000 description 21
- 239000010703 silicon Substances 0.000 description 21
- 239000007789 gas Substances 0.000 description 17
- 239000010408 film Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 239000000872 buffer Substances 0.000 description 4
- 238000000671 immersion lithography Methods 0.000 description 4
- 238000001459 lithography Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000011553 magnetic fluid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000000386 athletic effect Effects 0.000 description 1
- 239000007853 buffer solution Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000004540 process dynamic Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The present invention discloses a kind of submersible photoetching apparatus soaking liquid flow field and maintains collision avoidance system, it is characterised in that including：Fluid Supplying apparatus, for providing liquid between projection objective and base station；Substrate, on the base station and is immersed in the liquid；Telescopic device is buffered, which is located between the fluid Supplying apparatus and substrate, is used for realization the sealing of the liquid, can move in the direction of the optical axis.
Description
Technical field
The present invention relates to a kind of integrated circuit equipment manufacturing field, more particularly to a kind of submersible photoetching apparatus soaking liquid flow field to tie up
Hold collision avoidance system.
Background technology
Litho machine is one of the Core equipment for manufacturing super large-scale integration, modern lithographic machine based on optical lithography,
It accurately projects the figure on mask plate using optical system and is exposed on the silicon chip of coated photoresist.It includes one
Laser light source, an optical system, one piece of projection print plate version being made of graphics chip, one light is scribbled to Barebone and one
The silicon chip of quick photoresist
Liquid immersion lithography (Immersion Lithography) equipment is by last between a piece of projection objective and silicon chip
The liquid of certain high index of refraction is filled, relative to the dry lithography machine that intermediate medium is gas, improves the numerical value of projection objective
Aperture (NA), so as to improve the resolution ratio and depth of focus of lithographic equipment.In the Next Generation Lithographies machine having pointed out, liquid immersion lithography
Minimum is changed to existing equipment, there is good inheritance to present dry lithography machine.At present frequently with scheme be local
Liquid, i.e., be limited in the regional area above silicon chip between the lower surface of last a piece of projection objective by immersion method, and protects
Keep steady surely continuous liquid flowing.In stepping-scan-type lithographic equipment, silicon chip carries out the scanning fortune of high speed in exposure process
Dynamic, the liquid in exposure area is taken away flow field by this athletic meeting, so as to cause leakage, the liquid of leakage can shape on a photoresist
Into water mark, exposure quality is influenced.Therefore, in immersion lithography must emphasis solve gap flow field sealing problem.
In current existing solution, patent US6954256B2 is disclosed using hermetic seal, and Dry-gas Sealing Technology is in ring
On the periphery in filling flow field, annular air curtain is formed by applying gases at high pressure, liquid filling body is limited to certain circle
In shape region.
Patent US20070126999 A1 are disclosed using hydraulic seal, and liquid-tight encapsulation technique is to utilize and liquid filling body not phase
Third party's liquid (being typically magnetic fluid or mercury etc.) of appearance, is sealed around filling flow field.
But in these encapsulation schemes, have the following disadvantages:
(1) existing hermetic is applied to around filling fluid using air curtain, but to ensure base station at a high speed
Immersion liquid leakage does not occur under horizontal movement, it is desirable to which it is very near to submerge the distance of head and object lens, base station or silicon chip, wherein wanting
Ask submergence head to be less than 200um with the distance between base station or silicon chip, and miscellaneous part is installed in base station, cause base station
Surface is there are the fluctuating pattern of 0-160um, and base station is moving component, its catenary motion stroke is ± 0.5mm, there is submergence
Head collides with object lens, base station or silicon chip and influences lithography performance, damages the risk of lithographic equipment.
(2) liquid sealing means have very harsh requirement to sealing liquid, while sealing performance requirement is ensured, must also
Palpus guarantee sealing liquid is not mutually dissolved with liquid filling body and photoresist (or Topcoat) and liquid filling body not phase counterdiffusion.
In substrate high speed motions, outside air or sealing liquid are once involved in or dissolve or be diffused into liquid filling body, all can
Negative impact is produced to exposure quality.
The content of the invention
In order to overcome defect existing in the prior art, the present invention provides a kind of submersible photoetching apparatus soaking liquid flow field and remains anti-
Collision system.
In order to realize foregoing invention purpose, the present invention discloses a kind of submersible photoetching apparatus soaking liquid flow field and maintains anticollision system
System, it is characterised in that including：Fluid Supplying apparatus, for providing liquid between projection objective and base station；Substrate, is located at
On the base station and it is immersed in the liquid；Buffer telescopic device, the buffering telescopic device be located at the fluid Supplying apparatus with
Between substrate, the sealing of the liquid is used for realization, can be moved in the direction of the optical axis.
Further, it is close to liquid progress to include flexible rubber film circle for the end of the buffering telescopic device
Envelope, the distance between the flexible rubber film circle and the substrate are maintained in the range of prepsetting gap.
Further, which rotates along the direction vertical with the optical axis of the projection objective.
Further, which includes：Gas supplying passage, for providing a high-speed air-flow；And
Gas-liquid recovery approach, is recycled for gas-liquid.
Further, a measuring device is further included, which is used to measure the buffering telescopic device and the liquid
The preset height of feedway.Further include measuring device, the measuring device be used to measuring the buffering telescopic device with it is described
Relative displacement between fluid Supplying apparatus.
Further, which includes an actuation means, which is used for realization the buffering and stretches
Device moves on Z, Rx, Ry direction.
Further, a buffering telescopic device controller and a base station controller are further included, for controlling this slow
Telescopic device and the base station are rushed with identical speed and acceleration movement, avoids the buffering telescopic device and the base station from occurring
Collision.
Further, a compensation device is further included, for compensating the submergence between the buffering telescopic device and base station
The rigidity k and damped coefficient D of liquid.
Further, the quantity of the actuation means is three, is uniformly distributed in the edge of the buffering telescopic device.
Further, which is micro-actuator, and the micro actuator is piezo-activator, miniature stepping
Motor or voice coil motor.
In gap of the present invention between existing liquid-supplying system and silicon wafer stage, the buffering telescopic device of addition one, this is slow
Rushing telescopic device freely can in the direction of the optical axis move or be rotated around at least one axis perpendicular to optical axis.The structure bottom
End is the flexible rubber film circle of one hydraulically full (magnetic fluid), by the motor adjustment flexible rubber film for buffering telescopic device
Silicon wafer stage predetermined distance thereabove is enclosed, so as to solve existing liquid-supplying system due to submergence head and object lens, base station or silicon chip
Distance it is very near, there is the risk that submergence head and object lens, base station or silicon chip collide, while disclosure satisfy that maintenance immersion liquid
The function in flow field.
Compared with prior art, progress effect of the invention is：
(1) spacing between liquid-supplying system and workbench is improved, so as to avoid liquid-supplying system and work
Platform collides,
(2) fluid Supplying apparatus is fixed, only buffers telescopic device movement, substantially reduces fluid Supplying apparatus
Movement to mainstream field stablize produce interference.At the same time reduce moving loads, reduce because motion produce temperature rise and
The influence produced to exposure.
(3) buffer telescopic device and use Synchronization Control with base station, avoid the response delay for following movement and producing, carry
The high work efficiency of system.
Brief description of the drawings
It can be obtained further by following detailed description of the invention and institute's accompanying drawings on the advantages and spirit of the present invention
Solution.
Fig. 1 is the structure diagram of litho machine common in the art；
Fig. 2 is air seal submergence cell schematics；
Fig. 3 is the structure diagram that submersible photoetching apparatus soaking liquid flow field of the present invention maintains collision avoidance system；
Fig. 4 is the structure that submersible photoetching apparatus soaking liquid flow field of the present invention maintains the flexible sealing device of the buffering of collision avoidance system
Schematic diagram；
Fig. 5 is the vertical view that submersible photoetching apparatus soaking liquid flow field of the present invention maintains the flexible sealing device of the buffering of collision avoidance system
Figure；
Fig. 6 is the control that submersible photoetching apparatus soaking liquid flow field of the present invention maintains the flexible sealing device of the buffering of collision avoidance system
Schematic diagram.
Embodiment
The specific embodiment that the invention will now be described in detail with reference to the accompanying drawings.
It is an object of the invention to provide a kind of apparatus soaking liquid flow field maintaining system of immersed photoetching machine, is supplied in existing liquid
In gap between system and silicon wafer stage, the buffering telescopic device of addition one, which can be freely in optical axis side
Move up or rotated around at least one axis perpendicular to optical axis.
Fig. 1 is the structure diagram of existing litho machine, it discloses an existing litho machine structure.In the litho machine,
Main frame supports a lighting system 20, a projection objective 10 and a silicon wafer stage 40, and being placed with one on silicon wafer stage 40 scribbles photosensitive light
The silicon chip 50 of photoresist.The figure of integrated circuit is by lighting system 20 and projection objective 10 on mask 30, with Imagewise exposure
Mode, is transferred on the silicon chip 50 for scribbling light sensitive photoresist, so as to complete to expose.
Fig. 2 is the schematic diagram of existing Gas sealing technology, by inlet/outlet delivery pipe 13, by projection objective PL with
The liquid 11 with of a relatively high refractive index is full of between silicon wafer stage W, for example water passes through the rearmost part positioned at projection arrangement PL
Under part or surrounding fluid Supplying apparatus 12 formed storing apparatus.By gas, such as air or forming gas, but preferably
It is N2 or other inert gases, forms the air seal, gas passes under pressure through the offer of entrance 15 and arrives fluid Supplying apparatus 12
Gap between substrate, and drawn by first outlet 14.At excess pressure, first outlet 14 at setting gas access 15
Vacuum level and gap geometry, so as to provide the air-flow of inside high-speed to limit liquid.
Fig. 3 maintains collision avoidance system for submersible photoetching apparatus soaking liquid flow field of the present invention, which makes fluid Supplying apparatus 12
Apart from the distance of one Dingyuan of silicon wafer stage, which can completely ensure that the high-velocity scanning campaign of silicon wafer stage will not collide liquid
Feedway 12.It is characterized in that the buffering of addition one telescopic device between the bottom of fluid Supplying apparatus 12 and the surface of base W
17, which is connected with 12 bottom of fluid Supplying apparatus, and buffering telescopic device 17 can pass through external drive
(being not drawn into figure) is moved or is rotated around at least one axis perpendicular to optical axis in the direction of the optical axis.The structure bottom is one soft
Property rubber film circle 18, predetermined height above 18 silicon wafer stage of motor adjustment flexible rubber film circle by buffering telescopic device 17
Degree, first of sealing to immersion liquid is realized by the preset height.
Fig. 4 is the buffering telescopic device enlarged drawing of patent of the present invention, and flexible rubber film circle 18 is protected apart from the distance of substrate
Hold in the distance range of very little, which can meet the tension force of liquid itself to realize the sealing of self,
Buffering telescopic device includes gas feeding path 14 ' and gas-liquid recovery passage 15 ', the gas feeding path 14 ' and
Gas-liquid recovery passage 15 ' is connected with gas supplying passage on fluid Supplying apparatus 14 and gas-liquid recovery approach 15 respectively.Gas
There is provided in small direct draught by gas supplying passage into the gap between buffering telescopic device 17 and substrate, and pass through gas
Liquid recovery approach is drawn the liquid in gas and gap in the form of negative pressure, so that the air-flow of inside high-speed is provided, as
The second of immersion liquid is sealed.
Submersible photoetching apparatus soaking liquid flow field of the present invention maintains collision avoidance system to further comprise measuring device, the measuring device
Directly the relative position amount of measurement buffering telescopic device and fluid Supplying apparatus, the position quantity feed back to the control machine of buffer system
Structure, the preset height of flexible rubber film circle 18 and substrate is adjusted by the control of control mechanism, by making flexible rubber thin
Film circle 18 is servo-actuated finally to realize the dynamic sealing of immersion liquid.
Fig. 5 signals give the top view of buffering telescopic device.Actuator 19 is installed on buffering telescopic device 17, it has
Body position is in the outside of gas supplying passage 14 or in the inner side of gas-liquid recovery approach 15.Buffer telescopic device at least
Including 3 actuators, by the movement of actuator, movement of the buffering telescopic device in Z, Rx, Ry direction is realized.Actuator is micro-
Type actuator, can be piezo-activator or micro-step motor or voice coil motor etc..
Fig. 6 signals give the present invention control principle of buffering telescopic device, by buffering telescopic device position sensor
21 measure the relative shift of buffering telescopic device 17 and fluid Supplying apparatus 12, and the position quantity is as feedback signal to control
Device 24 is to carry out closed-loop control.Measured by base station vertical position sensor 22 between base station 40 and gage frame 26
Position quantity, the position quantity feed back to base station controller 25, and actuator 27 is used to drive base station to transport on Z, Rx, Ry direction
It is dynamic.
Host computer refers to complete machine software control system, and the position quantity in base station Z, Rx, Ry directions is handed down to buffering at the same time
Telescopic device controller 24 and base station controller 25, are synchronized with the movement with control buffering telescopic device with base station.Buffering is flexible
Setup Controller 24, actuator 19 are suitable with the dynamic response characteristic of base station controller 25, actuator 27, ensure that buffering is flexible
Device and base station are with identical speed and acceleration movement.The gap of buffering telescopic device and base station is set to be maintained at default
Fixed value, so as to avoid buffering telescopic device from colliding with base station.
Fig. 6 signals give the damped coefficient D and spring K acted between buffering telescopic device 17 and base station 40.This
Two parameters represent the pressure transmission relation that immersion liquid produces between buffering telescopic device and base station.Submergence can be passed through
The material characteristic of liquid and the geometry computations of buffering telescopic device obtain.By compensation device 23, telescopic device will be buffered
The rigidity k and damped coefficient D of immersion liquid between base station compensate the output to controller 24, so as to reduce immersion liquid
The pressure transmission and raising servo control performance of generation.
The preferred embodiment of the simply present invention described in this specification, above example is only illustrating the present invention
Technical solution rather than limitation of the present invention.All those skilled in the art pass through logic analysis, reasoning under this invention's idea
Or the limited available technical solution of experiment, all should be within the scope of the present invention.
Claims (10)
1. a kind of submersible photoetching apparatus soaking liquid flow field maintains collision avoidance system, it is characterised in that including：
Fluid Supplying apparatus, for providing liquid between projection objective and base station；
Substrate, on the base station and is immersed in the liquid；
Telescopic device is buffered, the buffering telescopic device is used for realization described between the fluid Supplying apparatus and substrate
The sealing of liquid, can move in the direction of the optical axis；
The buffering telescopic device is connected with the fluid Supplying apparatus, is kept between the buffering telescopic device and the substrate
In the range of prepsetting gap.
2. submersible photoetching apparatus soaking liquid flow field as claimed in claim 1 maintains collision avoidance system, it is characterised in that the buffering
The end of telescopic device seals the liquid including flexible rubber film circle, the flexible rubber film circle and the base
The distance between bottom is maintained in the range of prepsetting gap.
3. submersible photoetching apparatus soaking liquid flow field as claimed in claim 1 maintains collision avoidance system, it is characterised in that the buffering
Telescopic device is rotated along the direction vertical with the optical axis of the projection objective.
4. submersible photoetching apparatus soaking liquid flow field as claimed in claim 1 maintains collision avoidance system, it is characterised in that the buffering
Telescopic device includes：Gas supplying passage, for providing a high-speed air-flow；And gas-liquid recovery approach, recycled for gas-liquid.
5. submersible photoetching apparatus soaking liquid flow field as claimed in claim 1 maintains collision avoidance system, it is characterised in that further includes survey
Device is measured, the measuring device is used to measure the relative displacement between the buffering telescopic device and the fluid Supplying apparatus.
6. submersible photoetching apparatus soaking liquid flow field as claimed in claim 1 maintains collision avoidance system, it is characterised in that the buffering
Telescopic device further includes actuation means, and the actuation means are used for realization the buffering telescopic device and are transported on Z, Rx, Ry direction
It is dynamic.
7. submersible photoetching apparatus soaking liquid flow field as claimed in claim 1 maintains collision avoidance system, it is characterised in that further includes slow
Telescopic device controller and base station controller are rushed, for controlling the buffering telescopic device and the base station with identical
Speed and acceleration movement, avoid the buffering telescopic device and the base station from colliding.
8. submersible photoetching apparatus soaking liquid flow field as claimed in claim 7 maintains collision avoidance system, it is characterised in that further includes benefit
Device is repaid, for compensating the rigidity k and damped coefficient D of the immersion liquid between the buffering telescopic device and base station.
9. submersible photoetching apparatus soaking liquid flow field as claimed in claim 6 maintains collision avoidance system, it is characterised in that the actuating
The quantity of device is three, is uniformly distributed in the edge of the buffering telescopic device.
10. submersible photoetching apparatus soaking liquid flow field as claimed in claim 6 maintains collision avoidance system, it is characterised in that the cause
Dynamic device is micro-actuator, and the micro-actuator is piezo-activator, micro-step motor or voice coil motor.
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| CN201510040998.2A CN105988294B (en) | 2015-01-28 | 2015-01-28 | A kind of submersible photoetching apparatus soaking liquid flow field maintains collision avoidance system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510040998.2A CN105988294B (en) | 2015-01-28 | 2015-01-28 | A kind of submersible photoetching apparatus soaking liquid flow field maintains collision avoidance system |
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| CN105988294B true CN105988294B (en) | 2018-05-04 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| NO343819B1 (en) * | 2017-04-07 | 2019-06-11 | Momentum Tech As | Method for vibration damping of and vibration damper assembly for semi-submerged or submerged elongated structure |
| CN108520123B (en) * | 2018-03-28 | 2021-07-16 | 浙江理工大学 | Analysis method of rotor dynamic characteristics of high-power centrifugal pump based on full flow field calculation |
| CN108803256B (en) * | 2018-09-03 | 2024-03-19 | 长春长光智欧科技有限公司 | Immersion head for immersion imaging system |
| CN112781781B (en) * | 2020-12-29 | 2022-04-22 | 浙江启尔机电技术有限公司 | Disturbance force measuring device of immersion control unit |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1550905A (en) * | 2003-05-13 | 2004-12-01 | Asml荷兰有限公司 | Photolithography apparatus and device manufacturing method |
| CN101174101A (en) * | 2006-11-03 | 2008-05-07 | 台湾积体电路制造股份有限公司 | Immersion lithography apparatus and immersion exposure method |
| US7501226B2 (en) * | 2004-06-23 | 2009-03-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Immersion lithography system with wafer sealing mechanisms |
| CN101408731A (en) * | 2008-11-04 | 2009-04-15 | 浙江大学 | Immerge control device for immersed photoetching machine |
-
2015
- 2015-01-28 CN CN201510040998.2A patent/CN105988294B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1550905A (en) * | 2003-05-13 | 2004-12-01 | Asml荷兰有限公司 | Photolithography apparatus and device manufacturing method |
| US7501226B2 (en) * | 2004-06-23 | 2009-03-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Immersion lithography system with wafer sealing mechanisms |
| CN101174101A (en) * | 2006-11-03 | 2008-05-07 | 台湾积体电路制造股份有限公司 | Immersion lithography apparatus and immersion exposure method |
| CN101408731A (en) * | 2008-11-04 | 2009-04-15 | 浙江大学 | Immerge control device for immersed photoetching machine |
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